ALN0839AT [ASB]

Internally Matched LNA Module; 内部匹配LNA模块
ALN0839AT
型号: ALN0839AT
厂家: ADVANCED SEMICONDUCTOR BUSINESS INC.    ADVANCED SEMICONDUCTOR BUSINESS INC.
描述:

Internally Matched LNA Module
内部匹配LNA模块

文件: 总3页 (文件大小:416K)
中文:  中文翻译
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plerowTM ALN0839AT  
Internally Matched LNA Module  
Features  
Description  
The plerowTM ALN-series is the compactly designed surface-mount  
module for the use of the LNA with or without the following gain blocks in  
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,  
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-  
cation terminals, CATV and so on. It has an exceptional performance of  
low noise figure, high gain, high OIP3, and low bias current. The stability  
factor is always kept more than unity over the application band in order  
to ensure its unconditionally stable implementation to the application  
system environment. The surface-mount module package including the  
completed matching circuit and other components necessary just in case  
allows very simple and convenient implementation onto the system  
board in mass production level.  
· S21 = 20.2 dB @ 824 MHz  
= 19.8 dB @ 849 MHz  
· NF of 0.60 dB over Frequency  
· Unconditionally Stable  
· Single 5V Supply  
· High OIP3 @ Low Current  
Specifications (in Production)  
Typ. @ T = 25°C, Vs = 5 V, Freq. =836.5 MHz, Zo.sys = 50 ohm  
1-stage Single Type  
Specifications  
Parameter  
Unit  
Min  
824  
19  
Typ  
Max  
849  
Frequency Range  
Gain  
MHz  
dB  
20  
± 0.2  
0.60  
28  
More Information  
Gain Flatness  
dB  
± 0.3  
Noise Figure  
Output IP3 (1)  
S11 / S22 (2)  
dB  
0.65  
Website: www.asb.co.kr  
E-mail: sales@asb.co.kr  
dBm  
dB  
27  
14  
Tel: (82) 42-528-7223  
Fax: (82) 42-528-7222  
-15 / -12  
Output P1dB  
dBm  
msec  
mA  
V
15  
Switching Time (3)  
Supply Current  
Supply Voltage  
Impedance  
40  
5
60  
50  
W
Max. RF Input Power  
Package Type & Size  
Operating temperature is -40°C to +85°C.  
dBm  
mm  
C.W 29 ~ 31 (before fail)  
Surface Mount Type, 10Wx10Lx3.8H  
1) OIP3 is measured with two tones at an output power of +0 dBm / tone separated by 1 MHz.  
2) S11, S22 (max) is the worst value within the frequency band.  
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.  
Outline Drawing (Unit: mm)  
Pin Number  
Function  
RF In  
2
5
6
plerow  
RF Out  
Vs  
ALN0839AT  
ASB Inc.  
Others  
Ground  
(Top View)  
(Bottom View)  
Note: 1. The number and size of ground via holes in  
a circuit board is critical for thermal RF  
grounding considerations.  
Solder Stencil Area  
2. We recommend that the ground via holes be  
placed on the bottom of all ground pins for  
better RF and thermal performance, as  
shown in the drawing at the left side.  
(Side View)  
Ø0.4 plated thru holes to ground plane  
(Recommended Footprint)  
1/3  
www.asb.co.kr  
May 2010  
plerowTM ALN0839AT  
Internally Matched LNA Module  
S-parameters  
Typical Performance  
(Measured)  
824~849 MHz  
+5 V  
Noise Figure  
S-parameters & K Factor  
OIP3  
P1dB  
2/3  
www.asb.co.kr  
May 2010  
plerowTM ALN0839AT  
Internally Matched LNA Module  
Application Circuit  
VS  
+
-
Tantal or MLC (Multi Layer Ceramic)  
Capacitor  
C1  
C2  
OUT  
IN  
ALN  
1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced  
from the DC supply. The capacitance value may be determined by customer’s DC supply status. The ca-  
pacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for  
the best electrical performance.  
2) DC blocking capacitors are always necessarily placed at the input and output port for allowing only the  
RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are includ-  
ed inside the ALN module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just  
in case that the customer wants. The value of C1 & C2 is determined by considering the application fre-  
quency.  
Recommended Soldering Reflow Process  
Evaluation Board Layout  
Vs  
20~40 sec  
260°C  
Ramp-up  
(3˚C/sec)  
OUT  
IN  
Ramp-down  
(6°C/sec)  
200°C  
150°C  
60~180 sec  
Size 25x25mm  
(for ALN-AT, BT, T Series – 10x10mm)  
3/3  
www.asb.co.kr  
May 2010  

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