CC2530F32RHAR [APLUS]
A True System-on-Chip Solution for 2.4-GHz IEEE 802.15.4 and ZigBee Applications; 真正的系统级芯片解决方案的2.4GHz IEEE 802.15.4和ZigBee应用
| 型号： | CC2530F32RHAR |
| 厂家： | 
APLUS INTERGRATED CIRCUITS |
| 描述： | A True System-on-Chip Solution for 2.4-GHz IEEE 802.15.4 and ZigBee Applications |
| 文件： | 总31页 (文件大小：868K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CC2530F32, CC2530F64, CC2530F128, CC2530F256
www.ti.com .......................................................................................................................................................... SWRS081A–APRIL 2009–REVISED APRIL 2009
A True System-on-Chip Solution for 2.4-GHz IEEE 802.15.4 and ZigBee Applications
1
FEATURES
–
–
–
Accurate Digital RSSI/LQI Support
2345
•
RF/Layout
Battery Monitor and Temperature Sensor
–
–
2.4-GHz IEEE 802.15.4 Compliant RF
Transceiver
12-Bit ADC With Eight Channels and
Configurable Resolution
Excellent Receiver Sensitivity and
Robustness to Interference
–
–
AES Security Coprocessor
Two Powerful USARTs With Support for
Several Serial Protocols
–
–
–
Programmable Output Power Up to 4.5 dBm
Very Few External Components
–
–
21 General-Purpose I/O Pins (19× 4 mA, 2×
20 mA)
Only a Single Crystal Needed for Mesh
Network Systems
Watchdog Timer
–
–
6-mm × 6-mm QFN40 Package
•
Development Tools
Suitable for Systems Targeting Compliance
With Worldwide Radio-Frequency
Regulations: ETSI EN 300 328 and EN 300
440 (Europe), FCC CFR47 Part 15 (US) and
ARIB STD-T-66 (Japan)
–
–
–
CC2530 Development Kit
CC2530 ZigBee® Development Kit
CC2530 RemoTI™ Development Kit for
RF4CE
–
–
–
SmartRF™ Software
•
Low Power
Packet Sniffer
–
–
–
–
–
–
Active-Mode RX (CPU Idle): 24 mA
IAR Embedded Workbench™ Available
Active Mode TX at 1 dBm (CPU Idle): 29 mA
Power Mode 1 (4 µs Wake-Up): 0.2 mA
Power Mode 2 (Sleep Timer Running): 1 µA
Power Mode 3 (External Interrupts): 0.4 µA
Wide Supply-Voltage Range (2 V–3.6 V)
APPLICATIONS
•
•
2.4-GHz IEEE 802.15.4 Systems
RF4CE Remote Control Systems (64-KB Flash
and Higher)
•
•
•
•
•
•
•
ZigBee Systems (256-KB Flash)
Home/Building Automation
Lighting Systems
Industrial Control and Monitoring
Low-Power Wireless Sensor Networks
Consumer Electronics
•
Microcontroller
–
–
–
–
High-Performance and Low-Power 8051
Microcontroller Core With Code Prefetch
32-, 64-, 128-, or 256-KB
In-System-Programmable Flash
8-KB RAM With Retention in All Power
Modes
Health Care
Hardware Debug Support
•
Peripherals
–
–
Powerful Five-Channel DMA
IEEE 802.15.4 MAC Timer, General-Purpose
Timers (One 16-Bit, Two 8-Bit)
–
–
–
IR Generation Circuitry
32-kHz Sleep Timer With Capture
CSMA/CA Hardware Support
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
3
4
5
RemoTI, SmartRF, Z-Stack are trademarks of Texas Instruments.
IAR Embedded Workbench is a trademark of IAR Systems AB.
ZigBee is a registered trademark of the ZigBee Alliance.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated
CC2530F32, CC2530F64, CC2530F128, CC2530F256
SWRS081A–APRIL 2009–REVISED APRIL 2009 .......................................................................................................................................................... www.ti.com
DESCRIPTION
The CC2530 is a true system-on-chip (SoC) solution for IEEE 802.15.4, Zigbee and RF4CE applications. It
enables robust network nodes to be built with very low total bill-of-material costs. The CC2530 combines the
excellent performance of a leading RF transceiver with an industry-standard enhanced 8051 MCU, in-system
programmable flash memory, 8-KB RAM, and many other powerful features. The CC2530 comes in four different
flash versions: CC2530F32/64/128/256, with 32/64/128/256 KB of flash memory, respectively. The CC2530 has
various operating modes, making it highly suited for systems where ultralow power consumption is required.
Short transition times between operating modes further ensure low energy consumption.
Combined with the industry-leading and golden-unit-status ZigBee protocol stack (Z-Stack™) from Texas
Instruments, the CC2530F256 provides a robust and complete ZigBee solution.
Combined with the golden-unit-status RemoTI stack from Texas Instruments, the CC2530F64 and higher provide
a robust and complete ZigBee RF4CE remote-control solution.
VDD (2 V–3.6 V)
WATCHDOG
TIMER
ON-CHIP VOLTAGE
REGULATOR
DIGITAL
ANALOG
MIXED
RESET
DCOUPL
32-MHz
HIGH-SPEED
RC-OSC
POWER ON RESET
BROWN OUT
CRYSTAL OSC
32.768-kHz
32-kHz
RESET_N
SLEEP TIMER
CRYSTAL OSC
RC-OSC
XOSC_Q2
XOSC_Q1
DEBUG
INTERFACE
CLOCK MUX and
CALIBRATION
SLEEP MODE CONTROLLER
P2_4
P2_3
P2_2
P2_1
P2_0
32/64/128/256-KB
FLASH
8051 CPU
CORE
MEMORY
ARBITRATOR
DMA
8-KB SRAM
P1_7
P1_6
P1_5
P1_4
P1_3
P1_2
P1_1
P1_0
IRQ CTRL
FLASH WRITE
AES
ADC
ENCRYPTION
AND
DECRYPTION
AUDIO/DC
8 CHANNELS
RADIO REGISTERS
CSMA/CA STROBE
PROCESSOR
P0_7
P0_6
P0_5
P0_4
P0_3
P0_2
P0_1
P0_0
USART 1
RADIO DATA INTERFACE
USART 2
DEMODULATOR
AGC
MODULATOR
TIMER 1 (16-Bit)
TIMER 2
(IEEE 802.15.4 MAC TIMER)
RECEIVE
CHAIN
TRANSMIT
CHAIN
TIMER 3 (8-Bit)
TIMER 4 (8-Bit)
RF_P
RF_N
B0300-02
2
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Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256
CC2530F32, CC2530F64, CC2530F128, CC2530F256
www.ti.com .......................................................................................................................................................... SWRS081A–APRIL 2009–REVISED APRIL 2009
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS(1)
MIN
–0.3
–0.3
MAX
UNIT
Supply voltage
All supply pins must have the same voltage
3.9
V
VDD + 0.3,
Voltage on any digital pin
V
≤ 3.9
Input RF level
10
dBm
°C
Storage temperature range
–40
125
All pads, according to human-body model, JEDEC STD 22, method
A114
2
kV
V
ESD(2)
According to charged-device model, JEDEC STD 22, method C101
500
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) CAUTION: ESD sensitive device. Precaution should be used when handling the device in order to prevent permanent damage.
RECOMMENDED OPERATING CONDITIONS
MIN
–40
2
MAX UNIT
Operating ambient temperature range, TA
Operating supply voltage
125
3.6
°C
V
ELECTRICAL CHARACTERISTICS
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to
2507 MHz.
PARAMETER
TEST CONDITIONS
MIN
TYP MAX UNIT
Digital regulator on. 16-MHz RCOSC running. No radio,
crystals, or peripherals active.
Medium CPU activity: normal flash access(1), no RAM access
3.4
mA
32-MHz XOSC running. No radio or peripherals active.
Medium CPU activity: normal flash access(1), no RAM access
6.5
8.9 mA
32-MHz XOSC running, radio in RX mode, –50-dBm input
power, no peripherals active, CPU idle
20.5
mA
32-MHz XOSC running, radio in RX mode at -100-dBm input
power (waiting for signal), no peripherals active, CPU idle
24.3 29.6 mA
28.7 mA
33.5 39.6 mA
32-MHz XOSC running, radio in TX mode, 1-dBm output
power, no peripherals active, CPU idle
Icore
Core current consumption
32-MHz XOSC running, radio in TX mode, 4.5-dBm output
power, no peripherals active, CPU idle
Power mode 1. Digital regulator on; 16-MHz RCOSC and
32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD
and sleep timer active; RAM and register retention
0.2
0.3 mA
Power mode 2. Digital regulator off; 16-MHz RCOSC and
32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, and
sleep timer active; RAM and register retention
1
2
1
µA
µA
Power mode 3. Digital regulator off; no clocks; POR active;
RAM and register retention
0.4
(1) Normal flash access means that the code used exceeds the cache storage, so cache misses happen frequently.
Copyright © 2009, Texas Instruments Incorporated
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ELECTRICAL CHARACTERISTICS (continued)
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to
2507 MHz.
PARAMETER
TEST CONDITIONS
MIN
TYP MAX UNIT
Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated)
Timer 1
Timer 2
Timer 3
Timer 4
Sleep timer
ADC
Timer running, 32-MHz XOSC used
Timer running, 32-MHz XOSC used
Timer running, 32-MHz XOSC used
Timer running, 32-MHz XOSC used
Including 32.753-kHz RCOSC
When converting
90
90
60
70
0.6
1.2
1
µA
µA
µA
µA
µA
mA
mA
mA
Iperi
Erase
Flash
Burst write peak current
6
4
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Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256
CC2530F32, CC2530F64, CC2530F128, CC2530F256
www.ti.com .......................................................................................................................................................... SWRS081A–APRIL 2009–REVISED APRIL 2009
GENERAL CHARACTERISTICS
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
WAKE-UP AND TIMING
Digital regulator on, 16-MHz RCOSC and 32-MHz crystal
oscillator off. Start-up of 16-MHz RCOSC
Power mode 1 → active
4
0.1
0.5
µs
ms
ms
Digital regulator off, 16-MHz RCOSC and 32-MHz crystal
oscillator off. Start-up of regulator and 16-MHz RCOSC
Power mode 2 or 3 → active
Initially running on 16-MHz RCOSC, with 32-MHz XOSC
OFF
Active → TX or RX
With 32-MHz XOSC initially on
192
192
µs
µs
RX/TX and TX/RX turnaround
RADIO PART
Programmable in 1-MHz steps, 5 MHz between channels
for compliance with [1]
RF frequency range
2394
2507
MHz
Radio baud rate
Radio chip rate
As defined by [1]
As defined by [1]
250
2
kbps
MChip/s
RF RECEIVE SECTION
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C, VDD = 3 V, and fc = 2440 MHz, unless
otherwise noted.
Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to
2507 MHz.
PARAMETER
Receiver sensitivity
TEST CONDITIONS
PER = 1%, as specified by [1]
[1] requires –85 dBm
MIN TYP MAX
UNIT
–97
–92
dBm
–88
PER = 1%, as specified by [1]
[1] requires –20 dBm
Saturation (maximum input level)
10
dBm
dB
Wanted signal –82 dBm, adjacent modulated channel at
5 MHz, PER = 1 %, as specified by [1].
[1] requires 0 dB
Adjacent-channel rejection, 5-MHz
channel spacing
49
Wanted signal –82 dBm, adjacent modulated channel at
–5 MHz, PER = 1 %, as specified by [1].
[1] requires 0 dB
Adjacent-channel rejection, –5-MHz
channel spacing
49
57
57
dB
dB
dB
dB
dB
Wanted signal –82 dBm, adjacent modulated channel at
10 MHz, PER = 1%, as specified by [1]
[1] requires 30 dB
Alternate-channel rejection, 10-MHz
channel spacing
Wanted signal –82 dBm, adjacent modulated channel at
–10 MHz, PER = 1 %, as specified by [1]
[1] requires 30 dB
Alternate-channel rejection, –10-MHz
channel spacing
Channel rejection
≥ 20 MHz
≤ –20 MHz
Wanted signal at –82 dBm. Undesired signal is an IEEE
802.15.4 modulated channel, stepped through all channels
from 2405 to 2480 MHz. Signal level for PER = 1%.
57
57
Wanted signal at –82 dBm. Undesired signal is 802.15.4
modulated at the same frequency as the desired signal. Signal
level for PER = 1%.
Co-channel rejection
–3
Blocking/desensitization
5 MHz from band edge
10 MHz from band edge
20 MHz from band edge
50 MHz from band edge
–5 MHz from band edge
–10 MHz from band edge
–20 MHz from band edge
–50 MHz from band edge
Wanted signal 3 dB above the sensitivity level, CW jammer,
PER = 1%. Measured according to EN 300 440 class 2.
–33
–33
–32
–31
–35
–35
–34
–34
dBm
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RF RECEIVE SECTION (continued)
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C, VDD = 3 V, and fc = 2440 MHz, unless
otherwise noted.
Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to
2507 MHz.
PARAMETER
TEST CONDITIONS
MIN TYP MAX
UNIT
Spurious emission. Only largest spurious
emission stated within each band.
Conducted measurement with a 50-Ω single-ended load.
Suitable for systems targeting compliance with EN 300 328,
EN 300 440, FCC CFR47 Part 15 and ARIB STD-T-66.
dBm
30 MHz–1000 MHz
1 GHz–12.75 GHz
<
–80
–57
Frequency error tolerance(1)
Symbol rate error tolerance(2)
[1] requires minimum 80 ppm
[1] requires minimum 80 ppm
±150
ppm
ppm
±1000
(1) Difference between center frequency of the received RF signal and local oscillator frequency.
(2) Difference between incoming symbol rate and the internally generated symbol rate
RF TRANSMIT SECTION
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz, unless
otherwise noted.
Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V and fc = 2394 MHz to 2507
MHz.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
dBm
dB
Delivered to a single-ended 50-Ω load through a balun using
maximum-recommended output-power setting
[1] requires minimum –3 dBm
0
–8
4.5
8
10
Nominal output power
Programmable output power
range
32
Spurious emissions
Max recommended output power setting(1)
Measured conducted
according to stated
regulations. Only largest
spurious emission stated
within each band.
25 MHz–1000 MHz (outside restricted bands)
25 MHz–2400 MHz (within FCC restricted bands)
–60
–60
–60
–57
–55
–42
–31
–53
25 MHz–1000 MHz (within ETSI restricted bands)
1800–1900 MHz (ETSI restricted band)
5150–5300 MHz (ETSI restricted band)
At 2 × fc and 3 × fc (FCC restricted band)
At 2 × fc and 3 × fc (ETSI EN 300-440 and EN 300-328)(2)
1 GHz–12.75 GHz (outside restricted bands)
At 2483.5 MHz and above (FCC restricted band)
fc= 2480 MHz(3)
dBm
–42
2%
Measured as defined by [1] using maximum-recommended
output-power setting
[1] requires maximum 35%.
Error vector magnitude (EVM)
Optimum load impedance
Differential impedance as seen from the RF port (RF_P and RF_N)
towards the antenna
69 + j29
Ω
(1) Texas Instruments CC2530 EM reference design is suitable for systems targeting compliance with EN 300 328, EN 300 440, FCC
CFR47 Part 15 and ARIB STD-T-66.
(2) Margins for passing conducted requirements at the third harmonic can be improved by using a simple band-pass filter connected
between matching network and RF connector (1.8 pF in parallel with 1.6 nH); this filter must be connected to a good RF ground.
(3) Margins for passing FCC requirements at 2483.5 MHz and above when transmitting at 2480 MHz can be improved by using a lower
output-power setting or having less than 100% duty cycle.
6
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www.ti.com .......................................................................................................................................................... SWRS081A–APRIL 2009–REVISED APRIL 2009
32-MHz CRYSTAL OSCILLATOR
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
Crystal frequency
TEST CONDITIONS
MIN
TYP
MAX UNIT
32
MHz
Crystal frequency accuracy
requirement(1)
–40
40 ppm
ESR
C0
Equivalent series resistance
Crystal shunt capacitance
Crystal load capacitance
Start-up time
6
1
60
7
Ω
pF
pF
ms
CL
10
16
0.3
The crystal oscillator must be in power down for a
guard time before it is used again. This
requirement is valid for all modes of operation. The
need for power-down guard time can vary with
crystal type and load.
Power-down guard time
3
ms
(1) Including aging and temperature dependency, as specified by [1]
32.768-kHz CRYSTAL OSCILLATOR
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
Crystal frequency
TEST CONDITIONS
MIN
TYP
MAX UNIT
32.768
kHz
Crystal frequency accuracy
requirement(1)
–40
40 ppm
ESR
C0
Equivalent series resistance
Crystal shunt capacitance
Crystal load capacitance
Start-up time
40
0.9
12
130
2
Ω
pF
pF
s
CL
16
0.4
(1) Including aging and temperature dependency, as specified by [1]
32-kHz RC OSCILLATOR
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
Calibrated frequency(1)
TEST CONDITIONS
MIN
TYP
32.753
±0.2%
0.4
MAX UNIT
kHz
Frequency accuracy after calibration
Temperature coefficient(2)
Supply-voltage coefficient(3)
Calibration time(4)
%/°C
%/V
ms
3
2
(1) The calibrated 32-kHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 977.
(2) Frequency drift when temperature changes after calibration
(3) Frequency drift when supply voltage changes after calibration
(4) When the 32-kHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator
is performed while SLEEPCMD.OSC32K_CALDIS is 0.
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16-MHz RC OSCILLATOR
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
Frequency(1)
TEST CONDITIONS
MIN
TYP
16
MAX
UNIT
MHz
Uncalibrated frequency accuracy
Calibrated frequency accuracy
Start-up time
±18%
±0.6%
±1%
10
µs
µs
Initial calibration time(2)
50
(1) The calibrated 16-MHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 2.
(2) When the 16-MHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator
is performed while SLEEPCMD.OSC_PD is set to 0.
RSSI/CCA CHARACTERISTICS
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
100
±4
MAX
UNIT
dB
RSSI range
Absolute uncalibrated RSSI/CCA accuracy
RSSI/CCA offset(1)
dB
73
dB
Step size (LSB value)
1
dB
(1) Real RSSI = Register value – offset
FREQEST CHARACTERISTICS
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
±250
±40
20
MAX
UNIT
kHz
kHz
kHz
kHz
FREQEST range
FREQEST accuracy
FREQEST offset(1)
Step size (LSB value)
7.8
(1) Real FREQEST = Register value – offset
FREQUENCY SYNTHESIZER CHARACTERISTICS
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz, unless
otherwise noted.
PARAMETER
TEST CONDITIONS
At ±1-MHz offset from carrier
MIN
TYP
–110
–117
–122
MAX
UNIT
Phase noise, unmodulated carrier
At ±2-MHz offset from carrier
At ±5-MHz offset from carrier
dBc/Hz
ANALOG TEMPERATURE SENSOR
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
1480
4.5
MAX
UNIT
12-bit ADC
/10°C
Output at 25°C
Temperature coefficient
Voltage coefficient
1
/0.1 V
Measured using integrated ADC using
internal bandgap voltage reference and
maximum resolution
Initial accuracy without calibration
±10
°C
Accuracy using 1-point calibration (entire
temperature range)
±5
°C
Current consumption when enabled (ADC
current not included)
0.5
mA
8
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ADC CHARACTERISTICS
TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
Input voltage
TEST CONDITIONS
VDD is voltage on AVDD5 pin
VDD is voltage on AVDD5 pin
VDD is voltage on AVDD5 pin
Using 4-MHz clock speed
MIN TYP MAX
UNIT
V
0
0
0
VDD
VDD
VDD
External reference voltage
External reference voltage differential
Input resistance, signal
V
V
197
2.97
5.7
kΩ
V
Full-scale signal(1)
Peak-to-peak, defines 0 dBFS
Single-ended input, 7-bit setting
Single-ended input, 9-bit setting
Single-ended input, 10-bit setting
Single-ended input, 12-bit setting
Differential input, 7-bit setting
Differential input, 9-bit setting
Differential input, 10-bit setting
Differential input, 12-bit setting
7-bit setting, both single and differential
Single-ended input, 12-bit setting, –6 dBFS
7.5
9.3
10.8
6.5
ENOB(1)
Effective number of bits
bits
8.3
10.0
11.5
0–20
Useful power bandwidth
Total harmonic distortion
kHz
dB
–75.
2
THD(1)
Differential input, 12-bit setting, –6 dBFS
–86.
6
Single-ended input, 12-bit setting
70.2
79.3
78.8
88.9
Differential input, 12-bit setting
Signal to nonharmonic ratio(1)
dB
Single-ended input, 12-bit setting, –6 dBFS
Differential input, 12-bit setting, –6 dBFS
Differential input, 12-bit setting, 1-kHz sine (0
dBFS), limited by ADC resolution
CMRR
Common-mode rejection ratio
Crosstalk
>84
>84
dB
dB
Single-ended input, 12-bit setting, 1-kHz sine (0
dBFS), limited by ADC resolution
Offset
Midscale
–3
0.68
0.05
0.9
mV
%
Gain error
12-bit setting, mean
DNL(1)
INL(1)
Differential nonlinearity
Integral nonlinearity
LSB
LSB
12-bit setting, maximum
12-bit setting, mean
4.6
12-bit setting, maximum
Single-ended input, 7-bit setting
Single-ended input, 9-bit setting
Single-ended input, 10-bit setting
Single-ended input, 12-bit setting
Differential input, 7-bit setting
Differential input, 9-bit setting
Differential input, 10-bit setting
Differential input, 12-bit setting
7-bit setting
13.3
35.4
46.8
57.5
66.6
40.7
51.6
61.8
70.8
20
SINAD(1)
(–THD+N)
Signal-to-noise-and-distortion
dB
9-bit setting
36
Conversion time
µs
10-bit setting
68
12-bit setting
132
1.2
Power consumption
mA
V
Internal reference voltage
1.15
(1) Measured with 300-Hz sine-wave input and VDD as reference.
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ADC CHARACTERISTICS (continued)
TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN TYP MAX
UNIT
mV/V
Internal reference VDD coefficient
Internal reference temperature coefficient
4
0.4
mV/10°C
CONTROL INPUT AC CHARACTERISTICS
TA = –40°C to 125°C, VDD = 2 V to 3.6 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN TYP
MAX UNIT
System clock, fSYSCLK
tSYSCLK = 1/fSYSCLK
The undivided system clock is 32 MHz when crystal oscillator is used.
The undivided system clock is 16 MHz when calibrated 16-MHz RC
oscillator is used.
16
32
MHz
See item 1, Figure 1. This is the shortest pulse that is recognized as
a complete reset pin request. Note that shorter pulses may be
recognized but might not lead to complete reset of all modules within
the chip.
RESET_N low duration
Interrupt pulse duration
1
µs
See item 2, Figure 1.This is the shortest pulse that is recognized as
an interrupt request.
20
ns
RESET_N
1
2
Px.n
T0299-01
Figure 1. Control Input AC Characteristics
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SPI AC CHARACTERISTICS
TA = –40°C to 125°C, VDD = 2 V to 3.6 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
Master, Rx and Tx
MIN
TYP
MAX
UNIT
t1
SCK period
250
ns
SCK duty cycle
SSN low to SCK
SCK to SSN high
MO early out
MO late out
MI setup
Master
50%
t2
t3
t4
t7
t6
t5
t1
Master
63
63
ns
ns
ns
ns
ns
ns
ns
Master
Master, load = 10 pF
Master, load 10 = pF
Master
7
10
90
10
MI hold
Master
SCK period
Slave, Rx and Tx
Slave
250
SCK duty cycle
SSN low to SCK
SCK to SSN high
MO setup
50%
t2
t3
t6
t5
t5
Slave
63
63
35
10
ns
ns
ns
ns
ns
Slave
Slave
MO hold
Slave
MI late out
Slave, load = 10 pF
Master, Tx only
Master, Rx and Tx
Slave, Rx only
Slave, Rx and Tx
95
8
4
Operating frequency
MHz
8
4
t1
SCK
t2
t3
SSN
MO
(Master Out,
Slave In)
t4
t7
MI
(Master In,
Slave Out)
t5
t6
T0439-01
Figure 2. SPI AC Characteristics
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DEBUG INTERFACE AC CHARACTERISTICS
TA = –40°C to 125°C, VDD = 2 V to 3.6 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
MHz
ns
fclk_dbg
Debug clock frequency (see Figure 3)
Allowed high pulse on clock (see Figure 3)
Allowed low pulse on clock (see Figure 3)
12
t1
t2
35
35
ns
EXT_RESET_N low to first falling edge on
debug clock (see Figure 4)
t3
t4
t5
167
83
ns
ns
ns
Falling edge on clock to EXT_RESET_N high
(see Figure 4)
EXT_RESET_N high to first debug command
(see Figure 4)
83
t6
t7
t8
Debug data setup (see Figure 5)
Debug data hold (see Figure 5)
Clock-to-data delay (see Figure 5)
2
4
ns
ns
ns
Load = 10 pF
30
Time
DEBUG_CLK
P2_2
t1
t2
1/fclk_dbg
T0436-01
Figure 3. Debug Clock – Basic Timing
Time
DEBUG_CLK
P2_2
RESET_N
t3
t4
t5
T0437-01
Figure 4. Data Setup and Hold Timing
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Time
DEBUG_CLK
P2_2
DEBUG_DATA
(to CC2530)
P2_1
DEBUG_DATA
(from CC2530)
P2_1
t6
t7
t8
T0438-01
Figure 5. Debug Enable Timing
TIMER INPUTS AC CHARACTERISTICS
TA = –40°C to 125°C, VDD = 2 V to 3.6 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tSYSCLK
Synchronizers determine the shortest input pulse that can be
Input capture pulse duration recognized. The synchronizers operate at the current system
clock rate (16 or 32 MHz).
1.5
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DC CHARACTERISTICS
TA = 25°C, VDD = 3 V, unless otherwise noted.
PARAMETER
Logic-0 input voltage
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
0.5
Logic-1 input voltage
2.5
–50
–50
V
Logic-0 input current
Input equals 0 V
50
50
nA
nA
kΩ
V
Logic-1 input current
Input equals VDD
I/O-pin pullup and pulldown resistors
Logic-0 output voltage, 4-mA pins
Logic-1 output voltage, 4-mA pins
Logic-0 output voltage, 20-mA pins
Logic-1 output voltage, 20-mA pins
20
Output load 4 mA
Output load 4 mA
Output load 20 mA
Output load 20 mA
0.5
0.5
2.4
2.4
V
V
V
DEVICE INFORMATION
PIN DESCRIPTIONS
The CC2530 pinout is shown in Figure 6 and a short description of the pins follows.
CC2530
RHA Package
(Top View)
31
30
40 39 38 37 36 35 34 33 32
GND
GND
1
2
3
4
5
6
7
8
RBIAS
29
28
27
26
25
24
23
22
21
AVDD4
AVDD1
AVDD2
RF_N
GND
GND
P1_5
P1_4
P1_3
P1_2
P1_1
DVDD2
GND
Ground Pad
RF_P
AVDD3
XOSC_Q2
XOSC_Q1
AVDD5
10
11
12 13 14 15 16 17 18 19 20
P0076-02
NOTE: The exposed ground pad must be connected to a solid ground plane, as this is the ground connection for the chip.
Figure 6. Pinout Top View
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Pin Descriptions
PIN NAME
AVDD1
PIN
28
27
24
29
21
31
40
39
10
—
PIN TYPE
DESCRIPTION
Power (analog) 2-V–3.6-V analog power-supply connection
Power (analog) 2-V–3.6-V analog power-supply connection
Power (analog) 2-V–3.6-V analog power-supply connection
Power (analog) 2-V–3.6-V analog power-supply connection
Power (analog) 2-V–3.6-V analog power-supply connection
Power (analog) 2-V–3.6-V analog power-supply connection
AVDD2
AVDD3
AVDD4
AVDD5
AVDD6
DCOUPL
DVDD1
DVDD2
GND
Power (digital)
Power (digital)
Power (digital)
Ground
1.8-V digital power-supply decoupling. Do not use for supplying external circuits.
2-V–3.6-V digital power-supply connection
2-V–3.6-V digital power-supply connection
The ground pad must be connected to a solid ground plane.
GND
1, 2, 3, 4 Unused pins
Connect to GND
P0_0
19
18
17
16
15
14
13
12
11
9
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Port 0.0
P0_1
Port 0.1
P0_2
Port 0.2
P0_3
Port 0.3
P0_4
Port 0.4
P0_5
Port 0.5
P0_6
Port 0.6
P0_7
Port 0.7
P1_0
Port 1.0 – 20-mA drive capability
P1_1
Port 1.1 – 20-mA drive capability
P1_2
8
Port 1.2
P1_3
7
Port 1.3
P1_4
6
Port 1.4
P1_5
5
Port 1.5
P1_6
38
37
36
35
34
Port 1.6
P1_7
Port 1.7
P2_0
Port 2.0
P2_1
Port 2.1
P2_2
Port 2.2
P2_3/
XOSC32K_Q2
Digital I/O,
Analog I/O
Port 2.3/32.768 kHz XOSC
33
32
P2_4/
XOSC32K_Q1
Digital I/O,
Analog I/O
Port 2.4/32.768 kHz XOSC
RBIAS
30
20
Analog I/O
External precision bias resistor for reference current
Reset, active-low
RESET_N
Digital input
Negative RF input signal to LNA during RX
Negative RF output signal from PA during TX
RF_N
RF_P
26
25
RF I/O
RF I/O
Positive RF input signal to LNA during RX
Positive RF output signal from PA during TX
XOSC_Q1
XOSC_Q2
22
23
Analog I/O
Analog I/O
32-MHz crystal oscillator pin 1 or external-clock input
32-MHz crystal oscillator pin 2
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CIRCUIT DESCRIPTION
DIGITAL
ANALOG
MIXED
VDD (2 V–3.6 V)
WATCHDOG
TIMER
ON-CHIP VOLTAGE
REGULATOR
RESET_N
RESET
DCOUPL
XOSC_Q2
XOSC_Q1
32-MHz
POWER ON RESET
BROWN OUT
CRYSTAL OSC
CLOCK MUX
and
CALIBRATION
P2_4
P2_3
P2_2
P2_1
P2_0
32.768-kHz
SLEEP TIMER
CRYSTAL OSC
HIGH-
32-kHz
SPEED
DEBUG
INTERFACE
POWER MANAGEMENT CONTROLLER
RC-OSC
RC-OSC
P1_7
P1_6
P1_5
P1_4
P1_3
P1_2
P1_1
P1_0
PDATA
XRAM
IRAM
SFR
RAM
8-KB SRAM
8051 CPU
CORE
MEMORY
ARBITRATOR
32/64/128/256-KB
FLASH
FLASH
UNIFIED
DMA
P0_7
P0_6
P0_5
P0_4
P0_3
P0_2
P0_1
P0_0
IRQ CTRL
FLASH CTRL
RADIO REGISTERS
CSMA/CA STROBE PROCESSOR
RADIO DATA INTERFACE
AES
ENCRYPTION
AND
DECRYPTION
ADC
AUDIO/DC
USART 0
AGC
DEMODULATOR
MODULATOR
USART 1
TIMER 1 (16-Bit)
RECEIVE
CHAIN
TRANSMIT
CHAIN
TIMER 2
(IEEE 802.15.4 MAC TIMER)
TIMER 3 (8-Bit)
TIMER 4 (8-Bit)
RF_P
RF_N
B0301-02
Figure 7. CC2530 Block Diagram
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A block diagram of the CC2530 is shown in Figure 7. The modules can be roughly divided into one of three
categories: CPU- and memory-related modules; modules related to peripherals, clocks, and power management;
and radio-related modules. In the following subsections, a short description of each module that appears in
Figure 7 is given.
For more details about the modules and their usage, see the corresponding chapters in the CC253x User's
Guide (SWRU191).
CPU and Memory
The 8051 CPU core used in the CC253x device family is a single-cycle 8051-compatible core. It has three
different memory-access buses (SFR, DATA and CODE/XDATA) with single-cycle access to SFR, DATA, and
the main SRAM. It also includes a debug interface and an 18-input extended interrupt unit.
The interrupt controller services a total of 18 interrupt sources, divided into six interrupt groups, each of which
is associated with one of four interrupt priorities. Any interrupt service request is serviced also when the device is
in idle mode by going back to active mode. Some interrupts can also wake up the device from sleep mode
(power modes 1–3).
The memory arbiter is at the heart of the system, as it connects the CPU and DMA controller with the physical
memories and all peripherals through the SFR bus. The memory arbiter has four memory access points, access
of which can map to one of three physical memories: an 8-KB SRAM, flash memory, and XREG/SFR registers. It
is responsible for performing arbitration and sequencing between simultaneous memory accesses to the same
physical memory.
The 8-KB SRAM maps to the DATA memory space and to parts of the XDATA memory spaces. The 8-KB
SRAM is an ultralow-power SRAM that retains its contents even when the digital part is powered off (power
modes 2 and 3). This is an important feature for low-power applications.
The 32/64/128/256 KB flash block provides in-circuit programmable non-volatile program memory for the
device, and maps into the CODE and XDATA memory spaces. In addition to holding program code and
constants, the non-volatile memory allows the application to save data that must be preserved such that it is
available after restarting the device. Using this feature one can, e.g., use saved network-specific data to avoid
the need for a full start-up and network find-and-join process .
Clocks and Power Management
The digital core and peripherals are powered by a 1.8-V low-dropout voltage regulator. It provides power
management functionality that enables low power operation for long battery life using different power modes.
Five different reset sources exist to reset the device.
Peripherals
The CC2530 includes many different peripherals that allow the application designer to develop advanced
applications.
The debug interface implements a proprietary two-wire serial interface that is used for in-circuit debugging.
Through this debug interface, it is possible to perform an erasure of the entire flash memory, control which
oscillators are enabled, stop and start execution of the user program, execute supplied instructions on the 8051
core, set code breakpoints, and single-step through instructions in the code. Using these techniques, it is
possible to perform in-circuit debugging and external flash programming elegantly.
The device contains flash memory for storage of program code. The flash memory is programmable from the
user software and through the debug interface. The flash controller handles writing and erasing the embedded
flash memory. The flash controller allows page-wise erasure and 4-bytewise programming.
The I/O controller is responsible for all general-purpose I/O pins. The CPU can configure whether peripheral
modules control certain pins or whether they are under software control, and if so, whether each pin is configured
as an input or output and if a pullup or pulldown resistor in the pad is connected. CPU interrupts can be enabled
on each pin individually. Each peripheral that connects to the I/O pins can choose between two different I/O pin
locations to ensure flexibility in various applications.
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A versatile five-channel DMA controller is available in the system, accesses memory using the XDATA memory
space, and thus has access to all physical memories. Each channel (trigger, priority, transfer mode, addressing
mode, source and destination pointers, and transfer count) is configured with DMA descriptors anywhere in
memory. Many of the hardware peripherals (AES core, flash controller, USARTs, timers, ADC interface) achieve
highly efficient operation by using the DMA controller for data transfers between SFR or XREG addresses and
flash/SRAM.
Timer 1 is a 16-bit timer with timer/counter/PWM functionality. It has a programmable prescaler, a 16-bit period
value, and five individually programmable counter/capture channels, each with a 16-bit compare value. Each of
the counter/capture channels can be used as a PWM output or to capture the timing of edges on input signals. It
can also be configured in IR Generation Mode where it counts Timer 3 periods and the output is ANDed with
the output of Timer 3 to generate modulated consumer IR signals with minimal CPU interaction.
The MAC timer (Timer 2) is specially designed for supporting an IEEE 802.15.4 MAC or other time-slotted
protocol in software. The timer has a configurable timer period and an 8-bit overflow counter that can be used to
keep track of the number of periods that have transpired. A 16-bit capture register is also used to record the
exact time at which a start-of-frame delimiter is received/transmitted or the exact time at which transmission
ends, as well as a 16-bit output compare register that can produce various command strobes (start RX, start TX,
etc.) at specific times to the radio modules.
Timer 3 and Timer 4 are 8-bit timers with timer/counter/PWM functionality. They have a programmable
prescaler, an 8-bit period value, and one programmable counter channel with an 8-bit compare value. Each of
the counter channels can be used as a PWM output.
The sleep timer is an ultralow-power timer that counts 32-kHz crystal oscillator or 32-kHz RC oscillator periods.
The sleep timer runs continuously in all operating modes except power mode 3. Typical applications of this timer
are as a real-time counter or as a wake-up timer to get out of power mode 1 or 2.
The ADC supports 7 to 12 bits of resolution in a 30 kHz to 4 kHz bandwidth, respectively. DC and audio
conversions with up to eight input channels (Port 0) are possible. The inputs can be selected as single-ended or
differential. The reference voltage can be internal, AVDD, or a single-ended or differential external signal. The
ADC also has a temperature-sensor input channel. The ADC can automate the process of periodic sampling or
conversion over a sequence of channels.
The random-number generator uses a 16-bit LFSR to generate pseudorandom numbers, which can be read by
the CPU or used directly by the command strobe processor. The random numbers can, e.g., be used to generate
random keys used for security.
The AES encryption/decryption core allows the user to encrypt and decrypt data using the AES algorithm with
128-bit keys. The core is able to support the AES operations required by IEEE 802.15.4 MAC security, the
ZigBee network layer, and the application layer.
A built-in watchdog timer allows the CC2530 to reset itself in case the firmware hangs. When enabled by
software, the watchdog timer must be cleared periodically; otherwise, it resets the device when it times out. It can
alternatively be configured for use as a general 32-kHz timer.
USART 0 and USART 1 are each configurable as either a SPI master/slave or a UART. They provide double
buffering on both RX and TX and hardware flow control and are thus well suited to high-throughput full-duplex
applications. Each has its own high-precision baud-rate generator, thus leaving the ordinary timers free for other
uses.
Radio
The CC2530 features an IEEE 802.15.4-compliant radio transceiver. The RF core controls the analog radio
modules. In addition, it provides an interface between the MCU and the radio which makes it possible to issue
commands, read status, and automate and sequence radio events. The radio also includes a packet-filtering and
address-recognition module.
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TYPICAL CHARACTERISTICS
RX CURRENT (–100 dBm INPUT)
TX CURRENT (TXPOWER = 0xF5)
vs
vs
TEMPERATURE
TEMPERATURE
36
35
34
33
32
28
27
26
25
24
23
22
−40
0
40
80
120
−40
0
40
80
120
T − Temperature − °C
T − Temperature − °C
G002
G001
Figure 8.
Figure 9.
RX CURRENT (–100 dBm INPUT)
TX CURRENT (TXPOWER = 0xF5)
vs
vs
SUPPLY VOLTAGE
SUPPLY VOLTAGE
26.0
25.5
25.0
24.5
24.0
34.4
34.2
34.0
33.8
33.6
2.0
2.4
2.8
3.2
3.6
2.0
2.4
2.8
3.2
3.6
V
CC
− Supply Voltage − V
V
CC
− Supply Voltage − V
G003
G004
Figure 10.
Figure 11.
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TYPICAL CHARACTERISTICS (continued)
INTERFERER REJECTION (802.15.4 INTERFERER)
OUTPUT POWER (TXPOWER = 0xF5)
vs
vs
INTERFERER FREQUENCY (CARRIER AT –82 dBm, 2440
FREQUENCY
MHz)
6.0
5.5
5.0
4.5
4.0
3.5
75
50
25
0
−25
2400
2394
2414
2434
2454
2474
2494
2420
2440
2460
2480
f − Frequency − MHz
Interferer Frequency − MHz
G005
G006
Figure 12.
Figure 13.
SENSITIVITY
vs
TEMPERATURE
OUTPUT POWER (TXPOWER = 0xF5)
vs
TEMPERATURE
−92
−93
−94
−95
−96
−97
−98
−99
8
6
4
2
0
−2
−40
−40
0
40
80
120
0
40
80
120
T − Temperature − °C
T − Temperature − °C
G007
G008
Figure 14.
Figure 15.
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TYPICAL CHARACTERISTICS (continued)
OUTPUT POWER (TXPOWER = 0xF5)
SENSITIVITY
vs
SUPPLY VOLTAGE
vs
SUPPLY VOLTAGE
5.0
4.8
4.6
4.4
4.2
4.0
−94
−95
−96
−97
−98
−99
−100
2.0
2.4
2.8
3.2
3.6
2.0
2.4
2.8
3.2
3.6
V
CC
− Supply Voltage − V
V
CC
− Supply Voltage − V
G009
G010
Figure 16.
Figure 17.
Table 1. Recommended Output Power Settings(1)
TXPOWER Register Setting
Typical Output Power (dBm)
Typical Current Consumption (mA)
0xF5
4.5
2.5
1
34
31
29
28
27
27
26
26
25
25
25
25
25
24
24
23
23
0xE5
0xD5
0xC5
–0.5
–1.5
–3
0xB5
0xA5
0x95
–4
0x85
–6
0x75
–8
0x65
–10
–12
–14
–16
–18
–20
–22
–28
0x55
0x45
0x35
0x25
0x15
0x05
0x05 and TXCTRL = 0x09
(1) Measured on Texas Instruments CC2530 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz, unless otherwise noted.
See [2] for recommended register settings.
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SWRS081A–APRIL 2009–REVISED APRIL 2009 .......................................................................................................................................................... www.ti.com
APPLICATION INFORMATION
Few external components are required for the operation of the CC2530. A typical application circuit is shown in
Figure 18. Typical values and description of external components are shown in Table 2.
2-V to 3.6-V
Optional 32-kHz Crystal
Power Supply
C331
C401
C321
R301
1 GND
2 GND
3 GND
4 GND
5 P1_5
6 P1_4
7 P1_3
8 P1_2
9 P1_1
10 DVDD2
RBIAS 30
AVDD4 29
AVDD1 28
AVDD2 27
RF_N 26
Antenna
(50 W)
L252
C251
C261
C252
L261
C253
CC2530
RF_P 25
DIE ATTACH PAD
AVDD3 24
XOSC_Q2 23
XOSC_Q1 22
AVDD5 21
C262
XTAL1
C221
C231
Power Supply Decoupling Capacitors are Not Shown
Digital I/O Not Connected
S0383-01
Figure 18. CC2530 Application Circuit
Table 2. Overview of External Components (Excluding Supply Decoupling
Capacitors)
Component
C251
C261
L252
Description
Part of the RF matching network
Part of the RF matching network
Part of the RF matching network
Part of the RF matching network
Part of the RF matching network
Part of the RF matching network
Part of the RF matching network
32kHz xtal loading capacitor
Value
18 pF
18 pF
2 nH
L261
2 nH
C262
C252
C253
C331
C321
C231
C221
1 pF
1 pF
2.2 pF
15 pF
15 pF
27 pF
27 pF
32kHz xtal loading capacitor
32MHz xtal loading capacitor
32MHz xtal loading capacitor
22
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CC2530F32, CC2530F64, CC2530F128, CC2530F256
www.ti.com .......................................................................................................................................................... SWRS081A–APRIL 2009–REVISED APRIL 2009
Table 2. Overview of External Components (Excluding Supply Decoupling
Capacitors) (continued)
Component
C401
Description
Value
1 µF
Decoupling capacitor for the internal digital regulator
Resistor used for internal biasing
R301
56 kΩ
Input/Output Matching
When using an unbalanced antenna such as a monopole, a balun should be used to optimize performance. The
balun can be implemented using low-cost discrete inductors and capacitors. The recommended balun shown
consists of C262, L261, C252, and L252.
If a balanced antenna such as a folded dipole is used, the balun can be omitted.
Crystal
An external 32-MHz crystal, XTAL1, with two loading capacitors (C221 and C231) is used for the 32-MHz crystal
oscillator. See the 32-MHz Crystal Oscillator section for details. The load capacitance seen by the 32-MHz
crystal is given by:
1
CL =
+ Cparasitic
1
1
+
C221 C231
(1)
XTAL2 is an optional 32.768-kHz crystal, with two loading capacitors (C321 and C331) used for the 32.768-kHz
crystal oscillator. The 32.768-kHz crystal oscillator is used in applications where both very low sleep-current
consumption and accurate wake-up times are needed. The load capacitance seen by the 32.768-kHz crystal is
given by:
1
CL =
+ Cparasitic
1
1
+
C321 C331
(2)
A series resistor may be used to comply with the ESR requirement.
On-Chip 1.8-V Voltage-Regulator Decoupling
The 1.8-V on-chip voltage regulator supplies the 1.8-V digital logic. This regulator requires a decoupling capacitor
(C401) for stable operation.
Power-Supply Decoupling and Filtering
Proper power-supply decoupling must be used for optimum performance. The placement and size of the
decoupling capacitors and the power supply filtering are very important to achieve the best performance in an
application. TI provides a compact reference design that should be followed very closely.
References
1. IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications
for Low-Rate Wireless Personal Area Networks (LR-WPANs)
http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf
2. CC253x User's Guide – CC253x System-on-Chip Solution for 2.4 GHz IEEE 802.15.4 and ZigBee
Applications (SWRU191)
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Additional Information
Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and
standard-based wireless applications for use in industrial and consumer applications. Our selection includes RF
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Texas Instruments’ Low-Power RF Web site has all our latest products, application and design notes, FAQ
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Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256
PACKAGE OPTION ADDENDUM
www.ti.com
18-May-2009
PACKAGING INFORMATION
Orderable Device
CC2530F128RHAR
CC2530F128RHAT
CC2530F256RHAR
CC2530F256RHAT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
QFN
RHA
40
40
40
40
2500 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
QFN
QFN
QFN
RHA
RHA
RHA
250 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
CC2530F32RHAR
CC2530F32RHAT
CC2530F64RHAR
CC2530F64RHAT
PREVIEW
PREVIEW
PREVIEW
PREVIEW
QFN
QFN
QFN
QFN
RHA
RHA
RHA
RHA
40
40
40
40
2500
250
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
2500
250
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-May-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
CC2530F128RHAR
CC2530F128RHAT
CC2530F256RHAR
CC2530F256RHAT
QFN
QFN
QFN
QFN
RHA
RHA
RHA
RHA
40
40
40
40
2500
250
330.0
330.0
330.0
330.0
16.4
16.4
16.4
16.4
6.3
6.3
6.3
6.3
6.3
6.3
6.3
6.3
1.5
1.5
1.5
1.5
12.0
12.0
12.0
12.0
16.0
16.0
16.0
16.0
Q2
Q2
Q2
Q2
2500
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-May-2009
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CC2530F128RHAR
CC2530F128RHAT
CC2530F256RHAR
CC2530F256RHAT
QFN
QFN
QFN
QFN
RHA
RHA
RHA
RHA
40
40
40
40
2500
250
333.2
333.2
333.2
333.2
345.9
345.9
345.9
345.9
28.6
28.6
28.6
28.6
2500
250
Pack Materials-Page 2
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相关型号：
CC2530F32RHAT
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