106-181F [API]

General Purpose Inductor, 0.18uH, 1%, 1 Element, Iron-Core, SMD, 1611, CHIP;
106-181F
型号: 106-181F
厂家: API Delevan    API Delevan
描述:

General Purpose Inductor, 0.18uH, 1%, 1 Element, Iron-Core, SMD, 1611, CHIP

射频感应器 电感器
文件: 总1页 (文件大小:1072K)
下载:  下载PDF数据表文档文件

106-181G

General Purpose Inductor, 0.18uH, 2%, 1 Element, Iron-Core, SMD, 1611, CHIP

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0 API

106-181J

General Purpose Inductor, 0.18uH, 5%, 1 Element, Iron-Core, SMD, 1611, CHIP

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0 API

106-181K

General Purpose Inductor, 0.18uH, 10%, 1 Element, Iron-Core, SMD, 1611, CHIP

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0 API

106-182F

General Purpose Inductor, 1.8uH, 1%, 1 Element, Iron-Core, SMD, 1611, CHIP

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0 API

106-182H

General Purpose Inductor, 1.8uH, 3%, 1 Element, Iron-Core, SMD, 1611, CHIP

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0 API

106-182J

General Purpose Inductor, 1.8uH, 5%, 1 Element, Iron-Core, SMD, 1611, CHIP

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0 API

106-183F

General Purpose Inductor, 18uH, 1%, 1 Element, Iron-Core, SMD, 1611, CHIP

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0 API

106-183G

General Purpose Inductor, 18uH, 2%, 1 Element, Iron-Core, SMD, 1611, CHIP

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0 API

106-183H

General Purpose Inductor, 18uH, 3%, 1 Element, Iron-Core, SMD, 1611, CHIP

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-
0 API

106-183J

General Purpose Inductor, 18uH, 5%, 1 Element, Iron-Core, SMD, 1611, CHIP

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0 API

106184

ULTRASONIC SENSOR

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42 ETC

106185-0027

MTP* Backplane Interconnect System (BMTP)

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24 MOLEX

106186

ULTRASONIC SENSOR

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-
19 ETC

106186-0013

MTP* Backplane Interconnect System (BMTP)

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-
16 MOLEX

106186-0017

MTP* Backplane Interconnect System (BMTP)

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16 MOLEX