EK54 [APEX]

EVALUATION KIT FOR PA60DK; 评估板PA60DK


型号：	EK54
厂家：	CIRRUS LOGIC
描述：	EVALUATION KIT FOR PA60DK 评估板PA60DK
文件：	总2页 (文件大小：272K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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INTRODUCTION

BEFORE YOU GET STARTED

Fast and easy breadboarding of circuits using the PA60DK

is possible with the EK54 evaluation kit. The EK54 includes

both the universal EVAL36 board and the EVAL46 substrate.

The use of EVAL36 and EVAL46 allows for a large area of

breadboarding space to work with while allowing a surface

mountsubstrateforthePA60DK.ThePA60DKampliﬁermaybe

surfacemounteddirectlytotheEVAL46,athermallyconductive

but electrically isolated substrate. The PA60DK is soldered to

a DUT foil footprint area the size of the heatslug as shown in

Figure 1. The metal substrate is cost effective and can allow

the PA60DK to dissipate power up to the datasheet rating.

•

All Apex ampliﬁers should be handled using ESD precau-

tion.

Review the Apex product datasheet and operating condi-

tions.

Always provide the appropriate heat sinking. Power dis-

sipation must be considered to ensure maximum junction

temperature (T_J) is not exceeded.

•

Alwaysuseadequatepowersupplybypasscapacitors,Apex

recommends at least 10µF per amp of output current.

Do not change connections while the circuit is powered

In case -Vs is disconnected before +Vs, a diode between

-Vs and ground is recommended to avoid damage.

Initially set all power supplies to the minimum operating

levels allowed in the product datasheet.

•

Part#

EVAL36

EVAL46

Description

Universal PC Board

Evaluation substrate, PA60DK

Quantity

•

Check for oscillations up to and above the unity gain band-

width of the ampliﬁer.

TSM-116-01-T-SV Terminal Strip, 16 PIN

SSW-116-01-T-S Socket Strip, 16 PIN

PCE2055CT-ND CAP, 47uF, 50V

OX7R105KWN

*031606

ASSEMBLY

Cap, 200V, 1uF, Ceramic

5V, 10mA, 3.4°C/W

heatsink with fan, AAVID

The PA60DK is a surface mount device and should be

assembled to the EVAL46 substrate using surface mount

processes. Solder paste may be dispensed or screen-printed

on the DUT pads. The heat slug on the back of the PA60DK

providesmaximumheatdissipationcapabilitieswhensoldered

to the foil footprint area. The PA60DK should be reﬂowed

to the substrate using a solder reﬂow furnace. If this is not

available, a heat plate capable of solder reﬂow temperatures

may be used.

* Parts are not supplied. Parts are application dependant.

Suggested part numbers are provided.

Figure 1

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Once the ampliﬁer is mounted on the

top of the substrate, the heat sink fan or

selected heat sink can then be mounted

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to the back of the substrate. A heat sink

is not supplied with the kit, but several

options are available through AAVID

Thermal Product, Inc. High thermal con-

ductive thermal grease should be used

when mounting the heat sink fan or heat

sink to the evaluation board.

Review Figure 2 on next page for other

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possible assembly methods to construct

this evaluation kit.

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APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com

EVALUATION KIT FOR

PA60DK

EK54

Figure 2

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This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All speciﬁcations are subject to change without notice.

2^{APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739}

EK54U REV A JUNE 2003

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