AOK29S50 [AOS]
500V 29A a MOS Power Transistor; 500V 29A的MOS功率晶体管
| 型号： | AOK29S50 |
| 厂家： | 
ALPHA & OMEGA SEMICONDUCTORS |
| 描述： | 500V 29A a MOS Power Transistor |
| 文件： | 总6页 (文件大小：244K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AOK29S50
500V 29A
α
MOS TM Power Transistor
General Description
Product Summary
VDS @ Tj,max
IDM
600V
The AOK29S50 has been fabricated using the advanced
αMOSTM high voltage process that is designed to deliver
high levels of performance and robustness in switching
applications.
120A
RDS(ON),max
Qg,typ
0.15Ω
26.6nC
6.3µJ
By providing low RDS(on), Qg and EOSS along with
guaranteed avalanche capability this part can be adopted
quickly into new and existing offline power supply designs.
Eoss @ 400V
100% UIS Tested
100% Rg Tested
For Halogen Free add "L" suffix to part number:
AOK29S50L
Top View
TO-247
D
G
S
S
D
G
AOK29S50
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
AOK29S50
Units
Drain-Source Voltage
Gate-Source Voltage
VDS
500
±30
29
V
V
VGS
TC=25°C
Continuous Drain
Current
ID
TC=100°C
18
A
Pulsed Drain Current C
Avalanche Current C
IDM
IAR
120
7.5
110
608
357
A
mJ
Repetitive avalanche energy C
Single pulsed avalanche energy G
TC=25°C
EAR
EAS
mJ
W
W/ oC
PD
Power Dissipation B
Derate above 25oC
2.9
100
20
MOSFET dv/dt ruggedness
Peak diode recovery dv/dt H
dv/dt
V/ns
°C
Junction and Storage Temperature Range
TJ, TSTG
-55 to 150
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds J
Thermal Characteristics
TL
300
°C
Parameter
Symbol
AOK29S50
Units
Maximum Junction-to-Ambient A,D
RθJA
40
°C/W
Maximum Case-to-sink A
RθCS
RθJC
0.5
°C/W
°C/W
Maximum Junction-to-Case
0.35
Rev 0: March 2012
www.aosmd.com
Page 1 of 6
AOK29S50
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max Units
-
STATIC PARAMETERS
ID=250µA, VGS=0V, TJ=25°C
ID=250µA, VGS=0V, TJ=150°C
VDS=500V, VGS=0V
500
-
600
-
BVDSS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
550
-
1
V
-
IDSS
µA
VDS=400V, TJ=150°C
-
10
-
-
IGSS
VDS=0V, VGS=±30V
Gate-Body leakage current
Gate Threshold Voltage
-
±100
3.9
0.15
0.4
-
nΑ
V
VGS(th)
VDS=5V,ID=250µA
2.6
3.3
0.13
0.34
0.85
-
VGS=10V, ID=14.5A, TJ=25°C
-
-
-
-
-
Ω
Ω
V
RDS(ON)
Static Drain-Source On-Resistance
VGS=10V, ID=14.5A, TJ=150°C
IS=14.5A,VGS=0V, TJ=25°C
VSD
IS
Diode Forward Voltage
Maximum Body-Diode Continuous Current
Maximum Body-Diode Pulsed Current
29
120
A
ISM
-
A
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Output Capacitance
-
-
1312
88
-
-
pF
pF
VGS=0V, VDS=100V, f=1MHz
Coss
Effective output capacitance, energy
related H
Co(er)
Co(tr)
-
-
78
-
-
pF
pF
VGS=0V, VDS=0 to 400V, f=1MHz
Effective output capacitance, time
related I
227
VGS=0V, VDS=100V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
Crss
Rg
Reverse Transfer Capacitance
Gate resistance
-
-
2.5
4.8
-
-
pF
Ω
SWITCHING PARAMETERS
Qg
Qgs
Qgd
tD(on)
tr
Total Gate Charge
Gate Source Charge
Gate Drain Charge
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
-
-
-
-
-
-
-
-
-
-
26.6
6.2
9.2
28
-
-
-
-
-
-
-
-
-
-
nC
nC
nC
ns
ns
ns
ns
VGS=10V, VDS=400V, ID=14.5A
VGS=10V, VDS=400V, ID=14.5A,
39
RG=25Ω
tD(off)
tf
103
40
trr
IF=14.5A,dI/dt=100A/µs,VDS=400V
IF=14.5A,dI/dt=100A/µs,VDS=400V
IF=14.5A,dI/dt=100A/µs,VDS=400V
387
29.6
7.3
Body Diode Reverse Recovery Time
Peak Reverse Recovery Current
ns
A
Irm
Qrr
µC
Body Diode Reverse Recovery Charge
A. The value of R θJA is measured with the device in a still air environment with T A =25°C.
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation
limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C, Ratings are based on low frequency and duty cycles to keep initial TJ
=25°C.
D. The R θJA is the sum of the thermal impedance from junction to case R θJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse ratin g.
G. L=60mH, IAS=4.5A, VDD=150V, Starting TJ=25°C
H. Co(er) is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 80% V(BR)DSS.
I. Co(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% V(BR)DSS.
J. Wavesoldering only allowed at leads.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev 0: March 2012
www.aosmd.com
Page 2 of 6
AOK29S50
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
40
35
30
25
20
15
10
5
55
10V
10V
50
45
40
35
30
25
20
15
10
5
7V
6V
7V
6V
5.5V
5.5V
5V
5V
VGS=4.5V
VGS=4.5V
0
0
0
5
10
VDS (Volts)
15
20
0
5
10
15
20
V
DS (Volts)
Figure 2: On-Region Characteristics@125°C
Figure 1: On-Region Characteristics@25°C
1000
100
10
0.5
0.4
0.3
0.2
0.1
0.0
VDS=20V
125°C
-55°C
VGS=10V
1
25°C
0.1
0.01
0
10
20
30
40
50
60
2
4
6
8
10
ID (A)
VGS(Volts)
Figure 4: On-Resistance vs. Drain Current and
Gate Voltage
Figure 3: Transfer Characteristics
1.2
1.1
1
3
2.5
2
VGS=10V
ID=14.5A
1.5
1
0.9
0.8
0.5
0
-100
-50
0
50
100
150
200
-100
-50
0
50
Temperature (°C)
Figure 5: On-Resistance vs. Junction Temperature
100
150
200
TJ (oC)
Figure 6: Break Down vs. Junction Temperature
Rev 0: March 2012
www.aosmd.com
Page 3 of 6
AOK29S50
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
15
1.0E+02
1.0E+01
1.0E+00
1.0E-01
1.0E-02
1.0E-03
1.0E-04
1.0E-05
125°C
12
9
VDS=480V
ID=14.5A
25°C
6
3
0
0.0
0.2
0.4
0.6
0.8
1.0
0
5
10
15
20
25
30
35
40
VSD (Volts)
Qg (nC)
Figure 7: Body-Diode Characteristics (Note E)
Figure 8: Gate-Charge Characteristics
10000
1000
100
10
Ciss
8
6
4
2
0
Eoss
Coss
Crss
10
1
0
0
100
200
VDS (Volts)
300
400
500
100
200
VDS (Volts)
Figure 9: Capacitance Characteristics
300
400
500
Figure 10: Coss stroed Energy
1000
100
10
10µs
RDS(ON)
limited
100µs
1ms
1
10ms
DC
0.1
TJ(Max)=150°C
TC=25°C
0.01
1
10
100
1000
VDS (Volts)
Figure 11: Maximum Forward Biased Safe
Operating Area for AOK29S50 (Note F)
Rev 0: March 2012
www.aosmd.com
Page 4 of 6
AOK29S50
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
700
600
500
400
300
200
100
0
30
25
20
15
10
5
0
25
50
75
100
125
150
175
0
25
50
75
100
125
150
TCASE (°C)
TCASE (°C)
Figure 12: Avalanche energy
Figure 13: Current De-rating (Note B)
10
D=Ton/T
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
TJ,PK=TC+PDM.ZθJC.RθJC
R
θJC=0.35°C/W
1
0.1
PD
Ton
T
0.01
0.001
Single Pulse
0.0001
0.000001
0.00001
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 14: Normalized Maximum Transient Thermal Impedance for AOK29S50 (Note F)
Rev 0: March 2012
www.aosmd.com
Page 5 of 6
AOK29S50
Gate Charge Test Circuit &Waveform
Vgs
Qg
10V
+
VDC
+
Qgs
Qgd
Vds
VDC
-
-
DUT
Vgs
Vds
Ig
Charge
Resistive Switching Test Circuit & Waveforms
RL
Vds
90%
10%
+
DUT
Vdd
Vgs
VDC
Rg
-
Vgs
Vgs
t d(on)
t
r
t d(off)
t
f
t on
toff
Unclamped Inductive Switching (UIS) Test Circuit& Waveforms
L
2
EAR=1/2LI
AR
BVDSS
Vds
Id
Vds
+
Vgs
Vdd
IAR
Vgs
VDC
Id
Rg
-
DUT
Vgs
Vgs
Diode RecoveryTest Circuit &Waveforms
Qrr =- Idt
Vds +
Vds -
Ig
DUT
Vgs
Isd
trr
L
IF
Isd
dI/dt
+
IRM
Vdd
Vgs
VDC
Vdd
-
Vds
Rev 0: March 2012
www.aosmd.com
Page 6 of 6
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