AO6404L [AOS]

N-Channel Enhancement Mode Field Effect Transistor; N沟道增强型网络场效晶体管
AO6404L
型号: AO6404L
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

N-Channel Enhancement Mode Field Effect Transistor
N沟道增强型网络场效晶体管

晶体 晶体管
文件: 总4页 (文件大小:112K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AO6404  
N-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features  
The AO6404 uses advanced trench technology to  
provide excellent RDS(ON), low gate charge and  
operation with gate voltages as low as 1.8V while  
retaining a 12V VGS(MAX) rating. It is ESD protected.  
Standard Product AO6404 is Pb-free (meets ROHS  
& Sony 259 specifications). AO6404L is a Green  
Product ordering option. AO6404 and AO6404L are  
electrically identical.  
VDS (V) = 20V  
ID = 8.6A (VGS = 10V)  
RDS(ON) < 17m(VGS = 10V)  
RDS(ON) < 18m(VGS = 4.5V)  
RDS(ON) < 24m(VGS = 2.5V)  
RDS(ON) < 33m(VGS = 1.8V)  
ESD Rating: 2000V HBM  
D
TSOP-6  
Top View  
1
2
3
6
5
4
G
D
D
G
D
D
S
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
VDS  
Drain-Source Voltage  
20  
V
VGS  
Gate-Source Voltage  
Continuous Drain  
Current A  
±12  
8.6  
V
A
TA=25°C  
TA=70°C  
ID  
6.8  
Pulsed Drain Current B  
IDM  
30  
TA=25°C  
TA=70°C  
2
PD  
W
Power Dissipation A  
1.28  
-55 to 150  
TJ, TSTG  
Junction and Storage Temperature Range  
°C  
Thermal Characteristics  
Parameter  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Lead C  
Symbol  
Typ  
45  
Max  
62.5  
110  
50  
Units  
°C/W  
°C/W  
°C/W  
t 10s  
RθJA  
Steady-State  
Steady-State  
70  
RθJL  
33  
Alpha & Omega Semiconductor, Ltd.  
AO6404  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Parameter  
Conditions  
Symbol  
Min  
Typ  
Max  
Units  
STATIC PARAMETERS  
BVDSS  
Drain-Source Breakdown Voltage  
ID=250µA, VGS=0V  
20  
V
V
DS=16V, VGS=0V  
10  
25  
10  
IDSS  
Zero Gate Voltage Drain Current  
µA  
TJ=55°C  
µA  
V
IGSS  
Gate-Body leakage current  
Gate-Source Breakdown Voltage  
Gate Threshold Voltage  
V
V
V
V
V
DS=0V, VGS=±10V  
DS=0V, IG=±250uA  
DS=VGS ID=250µA  
GS=4.5V, VDS=5V  
GS=10V, ID=8.5A  
BVGSO  
VGS(th)  
ID(ON)  
±12  
0.5  
30  
0.75  
1
V
On state drain current  
A
13.4  
16  
17  
20  
18  
24  
33  
mΩ  
TJ=125°C  
mΩ  
mΩ  
mΩ  
S
RDS(ON)  
Static Drain-Source On-Resistance  
V
GS=4.5V, ID=5A  
14.8  
18.8  
25.5  
36  
VGS=2.5V, ID=4A  
V
V
GS=1.8V, ID=3A  
DS=5V, ID=8A  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
IS=1A,VGS=0V  
0.73  
1
V
Maximum Body-Diode Continuous Current  
2.9  
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
1810  
232  
200  
1.6  
pF  
pF  
pF  
VGS=0V, VDS=10V, f=1MHz  
VGS=0V, VDS=0V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
SWITCHING PARAMETERS  
Qg  
Qgs  
Qgd  
tD(on)  
tr  
Total Gate Charge  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
17.9  
1.5  
4.7  
2.5  
7.2  
49  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
V
GS=4.5V, VDS=10V, ID=8.5A  
VGS=10V, VDS=10V, RL=1.2,  
GEN=3Ω  
R
tD(off)  
tf  
10.8  
22  
trr  
IF=8.5A, dI/dt=100A/µs  
IF=8.5A, dI/dt=100A/µs  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
ns  
Qrr  
9.8  
nC  
A: The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The  
value in any given application depends on the user's specific board design. The current rating is based on the t 10s thermal resistance  
rating.  
B: Repetitive rating, pulse width limited by junction temperature.  
C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.  
D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80µs pulses, duty cycle 0.5% max.  
E. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The SOA  
curve provides a single pulse rating.  
Rev2: August 2005  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE  
Alpha & Omega Semiconductor, Ltd.  
AO6404  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
40  
35  
30  
25  
20  
15  
10  
5
30  
25  
20  
15  
10  
5
10  
2.5V  
4.5V  
VDS=5V  
2V  
125°C  
VGS=1.5V  
25°C  
0
0
0
1
2
3
4
5
0
0.5  
1
V
1.5  
GS(Volts)  
Figure 2: Transfer Characteristics  
2
2.5  
V
DS (Volts)  
Fig 1: On-Region Characteristics  
30  
25  
20  
15  
10  
5
1.6  
1.4  
1.2  
1
VGS=4.5V  
VGS=2.5V  
ID=5A  
VGS=1.8V  
VGS=2.5V  
VGS=10V  
VGS=1.8V  
VGS=4.5V  
VGS=10V  
0.8  
0
5
10  
D (A)  
15  
20  
0
25  
50  
75  
100  
125  
150  
175  
I
Temperature (°C)  
Figure 4: On-Resistance vs. Junction  
Temperature  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage  
40  
10  
35  
30  
25  
20  
15  
10  
5
1
125°C  
ID=5A  
125°C  
0.1  
0.01  
25°C  
0.001  
0.0001  
25°C  
0.00001  
0
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
0
2
4
6
8
10  
VSD (Volts)  
VGS (Volts)  
Figure 6: Body-Diode Characteristics  
Figure 5: On-Resistance vs. Gate-Source Voltage  
Alpha & Omega Semiconductor, Ltd.  
AO6404  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
3000  
5
4
3
2
1
0
VDS=10V  
ID=8A  
2500  
2000  
1500  
1000  
500  
Ciss  
Coss  
Crss  
0
0
4
8
12  
16  
20  
0
5
10  
15  
20  
Qg (nC)  
Figure 7: Gate-Charge Characteristics  
V
DS (Volts)  
Figure 8: Capacitance Characteristics  
100.0  
10.0  
1.0  
40  
TJ(Max)=150°C  
TA=25°C  
RDS(ON)  
10µs  
30  
20  
10  
0
100µs  
1ms  
limited  
10ms  
0.1s  
1s  
DC  
TJ(Max)=150°C  
TA=25°C  
0.1  
0.001  
0.01  
0.1  
1
10  
100  
1000  
0.1  
1
10  
100  
Pulse Width (s)  
VDS (Volts)  
Figure 10: Single Pulse Power Rating Junction-to-  
Ambient (Note E)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note E)  
10  
1
D=Ton/(Ton+Toff  
)
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
TJ,PK=TA+PDM.ZθJA.RθJA  
RθJA=62.5°C/W  
PD  
0.1  
Ton  
Toff  
Single Pulse  
0.001  
0.01  
0.00001  
0.0001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance  
Alpha & Omega Semiconductor, Ltd.  

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