APL5901-13KC [ANPEC]
Low IQ, Low Dropout 900mA Fixed Voltage Regulator; 低IQ ，低压降900毫安固定电压稳压器
| 型号： | APL5901-13KC |
| 厂家： | 
ANPEC ELECTRONICS COROPRATION |
| 描述： | Low IQ, Low Dropout 900mA Fixed Voltage Regulator |
| 文件： | 总21页 (文件大小：1388K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
APL5901/2
Low IQ, Low Dropout 900mA Fixed Voltage Regulator
Features
Design with an internal P-channel MOSFET pass
transistor, the APL5901/2 maintains a low supply
·
·
·
·
·
·
·
Low Noise : 50mVRMS (100Hz to 100kHz)
current, independent of the load current and dropout
voltage. Other features include reverse current
protection, thermal-shutdown protection, current limit
protection toensure specified output current and con-
trolled short-circuit current. The APL5901/2 regulator
comeinaminiatureSOT-89,SOT-89-5, SOT-223,SO-
8, TO-252 and TO-252-5 packages.
Low Quiescent Current : 50mA (No load)
LowDropout Voltage : 210mV (@900mA)
Very low Shutdown Current : < 1mA
Fixed Output Voltage : 1.3V ~ 3.4V
Stable with 4.7mF Output Capacitor
Stable with Aluminum , Tantalum or Ceramic
Capacitors .
·
·
Reverse Current Protection
No Protection DiodesNeeded
Pin Configuration
·
·
·
·
·
·
Built in Thermal Protection
APL5901
BP
GND
SHDN
Built in Current Limit Protection
Controlled Short Circuit Current : 200mA
Fast Transient Response
TAB is GND
5
1
4
3
1
2
3
2
Short Setting Time
SOT-89, SOT-89-5, SOT-223, SO-8 ,TO-252
and TO-252-5 Packages
VIN
G N D
VO U T
VIN
VOUT
GND
·
Lead Free Available (RoHS Compliant)
SOT-89-5(TopView)
SOT-89 (Top View)
TAB is GND
Applications
IN
GND
GND
SHDN
1
2
3
4
8
7
6
5
OUT
GND
GND
BYP
·
·
·
Notebook Computer
PDA or Portable Equipments
Noise-Sensitive Instrumentation Systems
1
2
3
VIN GND VOUT
General Description
SO-8 (Top View)
SOT-223 (TopView)
TAB is GND
TheAPL5901/2ismicropower, low noise, low dropout
linear regulator. Operate from 2.7Vto 6V input voltage
and deliver up to 900mA. Typical output noise is just
50mVRMS with the addition of an external 0.1mF bypass
capacitor in BP pin and typical dropout voltage is only
210mV at 900mA loading. Designed for use in bat-
tery-powered system, the low 50mA quiescent cur-
rent makes it an ideal choice.
VOUT
BP
GND
SHDN
VIN
1
2
3
VIN
VOUT
TO-252(TopView)
TO-252-5(TopView)
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright ã ANPEC Electronics Corp.
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Rev. B.2 - May., 2005
APL5901/2
Pin Configuration (Cont.)
APL5902
TAB is VOUT
1
2
3
GND VOUT
VIN
SOT-223 (TopView)
Ordering and Marking Information
Package Code
APL5901/2 -
D : S OT-89
U5 : TO-252-5
Temp. Range
D5 : SOT-89-5
V : SOT-223
U : TO-252
K : SO-8
Lead Free Code
Handling Code
Temp. Range
Package Code
Voltage Code
C : 0 to 70 C
Handling Code
°
TR : Tape & Reel
Voltage Code :
13 : 1.3V ~ 34 : 3.4V
Lead Free Code
L : Lead Free Device
Blank : Original Device
APL5901/2
XXXXX13
XXXXX - Date Code , 13 - 1.3V
APL5901/2 - 13 D/V/K :
APL5901/2 - 13 U :
13
APL5901/2
XXXXX
XXXXX - Date Code , 13 - 1.3V
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte in plate termina-
tion finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations.
ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classifica-
tion at lead-free peak reflow temperature.
Pin Description
PIN
I/O
Description
No.
Name
IN
1
V
I
Supply voltage input.
Ground pins of the circuitry, and all ground pins must be soldered to
PCB with proper power dissipation.
2
GND
3
4
5
SHDN(Note1)
BP(Note1)
I
Shutdown control pin, low = off , high = normal. Don’t leave open.
Bypass signal pin in fixed output type device
Output pin of the regulator.
O
O
OUT
V
Note1 : These pins do not exist in 3-pin package.
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Rev. B.2 - May., 2005
APL5901/2
Absolute Maximum Ratings
Symbol
Parameter
Input Voltage or Out Voltage
Shutdown Control Pin
Rating
Unit
IN
OUT
V , V
6.5
V
SHDN
6.5
V
SOT-89 : 180
SOT-223 : 135
SO-8 : 150
TO-252 : 50
SOT-89 : 38
SOT-223 : 15
SO-8 : 20
TH,JA
R
Thermal Resistance – Junction to Ambient
Thermal Resistance – Junction to Case
°C/W
TH,JC
R
°C/W
TO-252 : 6
PD
TJ
Power Dissipation
Internally Limited
W
Operating Junction Temperature
Control Section
°
C
0 to 125
0 to 150
-65 to +150
260
Power Transistor
STG
T
Storage Temperature Range
Lead Temperature (Soldering, 10 second)
°C
°C
L
T
Electrical Characteristics
Unless otherwise noted these specifications apply over full temperature, VIN=3.6V, CIN=1mF, COUT=4.7mF,
SHDN=VIN, TJ=0 to 125°C. Typical values refer to TJ=25°C.
APL5901/2
Symbol
Parameter
Test Conditions
Unit
Min. Typ. Max.
VIN
Input Voltage
2.7
6
VOUT VOUT +2
1.5
V
%
%
VOUT Output Voltage
ILIMIT Circuit Current Limit
SHORT
VOUT+1.0V< VCC<6.0V, 0mA< IOUT < IMAX VOUT -2
V
IN
V =4.3V
A
I
Short Current
Load Current
VOUT=0V
200
mA
mA
mV
mV
IOUT
900
VOUT+0.5V< VCC<6.0V, I = 1mA
REGLINE Line Regulation
4
1
10
6
Load Regulation
VIN =VOUT+1.0V, 0mA< IOUT < IMAX
REGLOAD
£
OUT
1.3V V <1.5V
1100 1300
900 1050
Dropout Voltage(Note2)
£
OUT
1.5V V <2V
IOUT =900mA
VDROP
mV
dB
£
OUT
2V V <2.5V
500
700
380
£
OUT
2.5V V <3.4V
280
65
£
F 1kHz, 1Vpp at VIN = VOUT+1.0V
PSRR Ripple Rejection
55
No load
50
100
450
m
A
IQ
Quiescent Current
OUT
I
=900mA
370
Shutdown = low
IOUT=0, VCC =6.0V
Shutdown Supply
Current(Note3)
m
A
0.01
1
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Rev. B.2 - May., 2005
APL5901/2
Electrical Characteristics (Cont.)
Unless otherwise noted these specifications apply over full temperature, VIN=3.6V, CIN=1mF, COUT=4.7mF,
SHDN=VIN, TJ=0 to 125°C. Typical values refer to TJ=25°C.
APL5901/2
Symbol
Parameter
Test Conditions
Unit
Min. Typ. Max.
100Hz<f<100kHz, typical load,
50
BP
m
OUT
m
= 1 F
C =0.01 F, C
Noise(Note3)
m
Vrms
100Hz<f<100kHz, typical load,
40
IQ
BP
m
OUT
m
= 1 F
C =0.1 F, C
BP
m
m
C =0.01 F,COUT=1 F, no load
7
Shutdown Recovery
Delay(Note3)
ms
m
m
BP
C =0.1 F,COUT=1 F, no load
70
Over Temperature
Shutdown
Over Temperature
Shutdown Hysteresis
°
°
OTS
150
10
C
Hysteries
C
Output Voltage
Temperature
Coefficient
°
ppm/ C
TC
50
m
F
COUT Output Capacitor
4.2
4.7
0.1
5.2
1
ESR
0.02
Ohm
Shutdown Input
Threshold(Note3)
VOUT+1.0V< VIN <6.0V
0.4
0.7
0.01
0.1
11
1.6
100
0.5
50
V
Shutdown input Bias
IN
ISHDN
VSHDN =V
nA
current(Note3)
Input Reverse Leakage
current
Reverse Protection
Threshold
m
A
OUT
V
IN
-V =0.1V
mV
Note 2 : Dropout voltage definition : VIN-VOUT when VOUT is 2% below the value of VOUT for VIN = VOUT + 0.5V
Note 3 : For 5-pin devices only.
Application Circuit
INPUT
VIN
VOUT
VOUT
2.7V to 6V
APL5901
GND
BP
SHDN
on
COUT
CIN
4.7mF
1mF
off
CBP
0.01mF
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Rev. B.2 - May., 2005
APL5901/2
Typical Characteristics
Current Limit vs. Input Voltage
Ground Pin Current vs. Output Current
APL5901/2-33
APL5901/2-33
3
2.5
2
400
350
300
250
200
150
100
50
1.5
1
0.5
0
0
0
150
300
450
600
750
900
3.5
4
4.5
5
5.5
6
Output Current (mA)
Input Voltage (V)
Ground Pin Current vs. Input Voltage
Input Voltage vs. Output Voltage
APL5901/2-33
APL5901/2-33
3.5
3
350
300
250
200
150
100
50
2.5
2
1.5
1
0.5
0
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage (V)
Input Voltage (V)
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Rev. B.2 - May., 2005
APL5901/2
Typical Characteristics
Output Current vs. Output Voltage
Dropout Voltage vs. Output Current
APL5901/2-33
1200
1100
0
-2
VOUT=1.5V
VOUT=1.8V
1000
900
800
700
600
500
400
300
200
100
0
-4
VIN=0V
-6
VOUT=3.3V
-8
VOUT=2.5V
-10
-12
0
0.5
1
1.5
2
2.5
3
0
150
300
450
600
750
900
Output Current (mA)
Output Voltage (V)
SHDNThreshold Voltage vs. Input Voltage
1
PSRR vs. Frequency
APL5901/2-33
APL5901/2-33
0.9
0.8
0.7
0.6
0.5
0.4
VIN=4V
VIN=0V
IOUT =50mA
COUT=10uF
CBP=0.1uF
VIN=5V
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
Frequency (HZ)
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Rev. B.2 - May., 2005
APL5901/2
Typical Characteristics
Output Noise
Output Noise vs. Bypass Capacitor
APL5901/2-33
APL5901/2-33
100u
500
450
400
350
300
250
200
150
100
50
VIN=4.3V
IOUT =0mA
80u
COUT=10uF
CBP=0.1uF
60u
40u
20u
0
-20u
-40u
-80u
0
-100u
0
4m
6m
8m
10m
2m
0
0.1
0.2
0.3
0.4
Time (s)
Bypass Capacitor (uF)
Load-Transient Response
Line-Transient Response
APL5901/2-33
APL5901/2-33
VOUT
VIN
4V
3V
VIN=VOUT+1V
COUT=4.7mF
VOUT
IOUT=1mA~900mA
Time(10ms/div)
Time(40ms/div)
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Rev. B.2 - May., 2005
APL5901/2
Typical Characteristics
Shutdown Exit Delay
Shutdown Exit Delay
APL5901/2-33
APL5901/2-33
3.3V
3.3V
VOUT
VOUT
CBP=10nF
No Load
CBP=100nF
No Load
0V
0V
0V
4V
4V
vSHDN
vSHDN
0V
Time(1ms/div)
Time(20ms/div)
Region of Stable ESR vs. Load Current
Entering Shutdown
APL5901/2-33
APL5901/2-33
1
3.3V
VOUT=3.3V
VOUT
0.1
COUT=1mF
No Load
0V
0V
stable
4V
0.01
unstable
0.001
0
150
300
450
600
750
900
Time(200ms/div)
Load Current (mA)
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Rev. B.2 - May., 2005
APL5901/2
Typical Characteristics
Output Voltage vs. Temperature
APL5901/2-33
3.35
3.33
3.31
3.29
3.27
3.25
-40
0
40
80
120
Temperature (°C )
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Rev. B.2 - May., 2005
APL5901/2
Application Information
Reverse Current Protection
Capacitor Selection and Regulator
Stability
The APL5901/2 have an internal reverseprotection, it
does not need an external schottky diode to connect
the regulator input and output. If the output voltage is
forced above the input voltage by more than 11mV,
the IC will be shutdown and the ground pin current is
below0.1uA.
The APL5901/2 use at least a 1mF capacitor on the
input, and this capacitor can be Aluminum, Tantalum
or Ceramic capacitor. The input capacitor with larger
value and lower ESR provides better PSRR and line-
transient response. The output capacitor also can use
Aluminum, Tantalum or Ceramic capacitor, and a mini-
mum value of 4.7mF and ESR above 0.02W is
recommended. A larger output capacitor can reduce
noise and improve load-transient response, stability,
and PSRR. Note that some ceramic dielectrics ex-
hibit large capacitance and ESR variation with
temperature. When using this capacitor, a minimum
10uF or more may be required to ensure the stability
at low temperature operation. Use a bypass capaci-
tor at BP pin for low output nvise. Increasing the ca-
pacitance will slightly decrease the output noise, but
increase the start-up time.
Shutdown/Enable
The APL5901/2 have an active high enable function.
Force EN high (>1.6V) enables the regulator, EN low
(<0.4V) disablesthe regulator and enter the shutdown
mode. In shutdown mode, the quiescent current can
reduce below 1uA. The EN pin cannot be floating, a
floating EN pin may cause an indeterminate state on
the output. If it is no use, connect to VIN for normal
operation.
Load-Transient Considerations
Current Limit
TheAPL5901/2load-transient responsegraphsin typi-
cal characteristics show the transient response. A
step change in the load current from 10mA to 900mA
at 10ms will cause a 20mV transient spike. Larger
output capacitor and lower ESR can reduce transient
spike.
The APL5901/2 have a current limit protection. The
ouptut voltage will drop close to zero volt, when load
current reaches the limit, and then the load current
will be limited at 200mA after output voltage is below
0.7V. When the load current back to the value where
limiting started, the output voltage and current will re-
turn to normal value. When output is shorted to
ground, the APL5901/2 will keep short circuit current
at 200mA .
Input-Output (Dropout)Voltage
Theminimum input-outputvoltagedifference(dropout)
determines the lowest usable supply voltage. In bat-
tery-powered systems, this will determine the useful
end-of-life battery voltage. Because the APL5901/2
use a p-channel MOSFET pass transistor, the drop-
out voltage is a function of drain-to-source on-resis-
tance (RDS(ON)) multiplied by the load current.
Copyright ã ANPEC Electronics Corp.
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Rev. B.2 - May., 2005
APL5901/2
Thermal Protection
Thermal protection limitstotal power dissipation inthe
device. When the junction temperature exceeds
TJ=+150℃, the thermal sensor generates a logic sig-
nal to turn off the pass transistor and allows IC to
cool. When the IC’s junction temperature is down by
10℃, the thermal sensor will turn the pass transistor
on again, resulting in a pulsed output during continu-
ousthermal protection. Thermalprotectionisdesigned
to protect the APL5901/2 in the event of fault
conditions. For continuous operation, do not exceed
the absolute maximum junction temperature of
TJ=+150℃.
Operating Region and Power Dis-
sipation
The thermal resistance of the case to circuit board,
and the rate of air flow all control the APL5901/2’s
maximum power dissipation. The power dissipation
across the device is PD = IOUT (VIN-VOUT) and the maxi-
mum power dissipation is:
PDMAX = (TJ-TA) / (θJC + θCA)
where TJ-TA isthetemperaturedifference betweenthe
junction and ambient air, θJC is the thermal resis-
tance of the package, andθCA is the thermal resis-
tance throughthe printed circuit board, copper traces,
and other materials to the ambient air.
TheGNDpinof theAPL5901provideanelectrical con-
nection to ground and channeling heat away. If power
dissipation is large, connect the GND pin to ground
using a large pad or ground plane, can improve the
problem of over heat of IC.
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Rev. B.2 - May., 2005
APL5901/2
Packaging Information
SOP-8 pin ( Reference JEDEC Registration MS-012)
E
H
e1
e2
D
A1
A
1
L
0.004max.
Millimeters
Inches
Dim
Min.
Max.
Min.
Max.
0.069
0.010
0.197
0.157
0.244
0.050
0.020
A
A1
D
1.35
0.10
4.80
3.80
5.80
0.40
0.33
1.75
0.25
5.00
4.00
6.20
1.27
0.51
0.053
0.004
0.189
0.150
0.228
0.016
0.013
E
H
L
e1
e2
f 1
1.27BSC
0.50BSC
8°
8°
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Rev. B.2 - May., 2005
APL5901/2
Packaging Information
SOT-223( ReferenceJEDEC RegistrationSOT-223)
D
A
a
B1
c
H
E
L
K
e
A1
e1
b
B
Dim
Millimeters
Inches
Min.
1.50
0.02
0.60
2.90
0.28
6.30
3.30
Max.
1.80
0.08
0.80
3.10
0.32
6.70
3.70
Min.
0.06
Max.
0.07
A
A1
B
B1
c
0.02
0.11
0.01
0.25
0.13
0.03
0.12
0.01
0.26
0.15
D
E
e
2.3 BSC
4.6 BSC
0.09 BSC
0.18 BSC
e1
H
L
K
a
6.70
0.91
1.50
0°
7.30
1.10
2.00
10°
0.26
0.04
0.06
0°
0.29
0.04
0.08
10°
b
13°
13°
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Rev. B.2 - May., 2005
APL5901/2
Packaging Information
SOT-89 (ReferenceEIAJ ED-7500A Reg stration SC-62)
D
D1
a
E
H
1
2
3
L
C
B1
B
e
e1
A
a
Millimeters
Inches
Dim
Min.
Max.
1.60
0.56
0.48
0.44
4.60
1.83
Min.
0.055
0.016
0.014
0.014
0.173
0.053
Max.
0.063
0.022
0.019
0.017
0.181
0.072
A
B
B1
C
D
D1
e
e1
E
H
L
a
1.40
0.40
0.35
0.35
4.40
1.35
1.50 BSC
3.00 BSC
0.059 BSC
0.118 BSC
2.29
3.75
0.80
2.60
4.25
1.20
10°
0.090
0.148
0.031
0.102
0.167
0.047
10°
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Rev. B.2 - May., 2005
APL5901/2
Packaging Information
SOT-89-5
Millimeters
Inches
Dim
Min.
4.40
4.05
1.50
1.30
2.40
0.80
Max.
4.60
4.25
1.70
1.50
2.60
-
Min.
0.17
0.16
0.06
0.05
0.09
0.03
Max.
0.18
0.17
0.07
0.06
0.1
A
B
C
D
E
F
G
H
I
-
3.00 REF
1.50 REF
0.12 REF
0.06 REF
0.40
1.40
0.35
0.52
1.60
0.41
0.01
0.05
0.01
0.02
0.06
0.02
J
K
L
5 TYP
0.2 TYP
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Rev. B.2 - May., 2005
APL5901/2
Packaging Information
TO-252-5
H
A
B
J
L
S
P
Millimeters
Inches
Dim
Min.
6.40
5.20
6.80
2.20
Max.
6.80
5.50
7.20
2.80
Min.
0.25
0.20
0.26
0.08
Max.
0.26
0.21
0.27
0.11
A
B
C
D
P
S
H
J
1.27 REF
0.05 REF
0.50
2.20
0.45
0
0.90
5.40
0.80
2.40
0.55
0.15
1.50
5.80
0.02
0.08
0.01
0
0.03
0.21
0.03
0.09
0.02
0.006
0.06
0.22
K
L
M
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Rev. B.2 - May., 2005
APL5901/2
Packaging Information
TO-252( Reference JEDEC Registration TO-252)
E
A
b2
C1
L2
D
H
L1
L
b
C
e1
A1
Millimeters
Dim
Inches
Min.
2.18
0.89
0.508
5.207
0.46
0.46
5.334
6.35
3.96
9.398
0.51
0.64
0.89
Max.
2.39
1.27
0.89
5.461
0.58
0.58
6.22
6.73
5.18
10.41
Min.
Max.
0.094
0.050
0.035
0.215
0.023
0.023
0.245
0.265
0.204
0.410
A
A1
b
0.086
0.035
0.020
0.205
0.018
0.018
0.210
0.250
0.156
0.370
0.020
0.025
0.035
b2
C
C1
D
E
e1
H
L
L1
L2
1.02
0.040
0.080
2.032
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Rev. B.2 - May., 2005
APL5901/2
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition (IR/Convection or VPR Reflow)
tp
TP
Critical Zone
TL to TP
Ramp-up
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
°
t 25 C to Peak
Time
Classificatin Reflow Profiles
Profile Feature
Average ramp-up rate
(TL to TP)
Sn-Pb Eutectic Assembly
Pb-Free Assembly
°
°
3 C/second max.
3 C/second max.
Preheat
°
°
150 C
100 C
-
-
-
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (min to max) (ts)
°
°
150 C
200 C
60-120 seconds
60-180 seconds
Time maintained above:
°
°
183 C
217 C
-
Temperature (TL)
Time (tL)
60-150 seconds
60-150 seconds
-
Peak/Classificatioon Temperature (Tp)
See table 1
See table 2
°
Time within 5 C of actual
10-30 seconds
20-40 seconds
Peak Temperature (tp)
Ramp-down Rate
°
°
6 C/second max.
6 C/second max.
6 minutes max.
8 minutes max.
°
Time 25 C to Peak Temperature
Notes: All temperatures refer to topside of the package .Measured on the body surface.
(mm)
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Rev. B.2 - May., 2005
APL5901/2
Classification Reflow Profiles(Cont.)
Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures
Package Thickness
Volume mm3
<350
Volume mm3
350
<2.5 mm
³ 2.5 mm
240 +0/-5°C
225 +0/-5°C
225 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness
Volume mm3
<350
Volume mm3
350-2000
Volume mm3
>2000
<1.6 mm
1.6 mm – 2.5 mm
³ 2.5 mm
260 +0°C*
260 +0°C*
250 +0°C*
260 +0°C*
250 +0°C*
245 +0°C*
260 +0°C*
245 +0°C*
245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and
including the stated classification temperature (this means Peak reflow temperature +0°C.
For example 260°C+0°C) at the rated MSL level.
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B,A102
Description
245 C, 5 SEC
1000 Hrs Bias @125 C
°
°
%
°
168 Hrs, 100 RH, 121 C
TST
ESD
Latch-Up
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
°
°
-65 C~150 C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms, 1tr > 100mA
Carrier Tape & Reel Dimensions
t
D
P
Po
E
F
P1
Bo
W
Ko
Ao
D1
Copyright ã ANPEC Electronics Corp.
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Rev. B.2 - May., 2005
APL5901/2
Carrier Tape & Reel Dimensions(Cont.)
T2
J
C
A
B
T1
Reel Dimensions
A
330 ± 1
F
B
62 +1.5
D
C
12.75+ 0.15
D1
J
T1
12.4 ± 0.2
P1
T2
2 ± 0.2
Ao
W
P
E
Application
2 ± 0.5
Po
12± 0. 3
8± 0.1
Ko
1.75±0.1
Bo
t
SOP- 8
5.5± 1
A
1.55 +0.1 1.55+ 0.25
4.0 ± 0.1
2.0 ± 0.1
T1
6.4 ± 0.1
T2
5.2± 0. 1
2.1± 0.1
P
0.3±0.013
E
B
70 ± 2
D
C
J
W
Application
SOT-89
12 + 0.3
12 - 0.1
178 ±1
13.5 ± 0.15 3 ± 0.15
D1 Po
14 ± 2
1.3 ± 0.3
8 ± 0.1
1.75± 0.1
F
P1
Ao
Bo
Ko
t
5.5 0.05 1.5 0.1
1.5 0.1
4.0 0.1
2.0 0.1
4.8 0.1
4.5 0.1
1.80 0.1 0.3 0.013
±
±
±
±
±
±
±
±
±
A
B
C
J
T1
12.4 +0.2
P1
T2
W
P
E
Application
SOT-223
12.75
0.15
±
330
F
1
62 1.5
±
2
0.6
2
0.2
12 0.3
8
0.1
1.75 0.1
±
±
±
±
±
±
D
D1
Po
Ao
Bo
Ko
t
5.5 0.05 1.5+ 0.1
1.5+ 0.1
C
4.0 0.1 2.0 0.05 6.9 0.1
7.5 0.1
2.1 0.1
0.3 0.05
±
±
±
±
±
±
±
A
B
J
T1
T2
W
P
E
Application
TO-252
16.4 + 0.3
-0.2
16+ 0.3
- 0.1
330
3
100
2
13 0. 5
2
0.5
2.5 0.5
8
0.1
1.75 0.1
±
±
±
±
±
±
±
F
D
D1
Po
P1
Ao
Bo
Ko
2.5 0.1
t
7.5 0.1
1.5 +0.1
1.5 0.25 4.0 0.1
2.0 0.1
6.8 0.1 10.4 0.1
0.3 0.05
±
±
±
±
±
±
±
±
(mm)
Cover Tape Dimensions
Application
SOP- 8
SOT- 89
SOT- 223
TO- 252
Carrier Width
Cover Tape Width
Devices Per Reel
12
12
12
16
9.3
9.3
9.3
2500
1000
2500
2500
13.3
Copyright ã ANPEC Electronics Corp.
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Rev. B.2 - May., 2005
APL5901/2
Customer Service
Anpec Electronics Corp.
Head Office :
5F, No. 2 Li-Hsin Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd.,
Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.
Tel : 886-2-89191368
Fax : 886-2-89191369
Copyright ã ANPEC Electronics Corp.
Rev. B.2 - May., 2005
21
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