APL5535JCQBI-TRG [ANPEC]
DualChannel 300mALowDropout Linear Regulator;型号: | APL5535JCQBI-TRG |
厂家: | ANPEC ELECTRONICS COROPRATION |
描述: | DualChannel 300mALowDropout Linear Regulator |
文件: | 总16页 (文件大小:199K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
APL5535
Dual Channel 300mA Low Dropout Linear Regulator
Features
General Description
The APL5535 is a dual channel low dropout linear
regulator, which operates from 2V to 5.5V input voltage
·
·
·
·
·
·
·
·
·
·
·
Dual Regulator Outputs
Low Dropout Voltage: Typical 200mV at 300mA
Wide Input Voltage Range: 2V to 5.5V
Low Quiescent Current: Typical 58mA
High PSRR: 70dB at 1kHz
and delivers up to 300mA output current at each channel.
Typical dropout voltage is only 200mV at 300mA.
The APL5535 with low quiescent current, high PSRR, and
low noise is ideal for battery powered system appliances.
Other features include logic-controlled shutdown mode,
over-temperature protection, short-circuit current-limit, and
current-limit protection to ensure specified output current.
Low Shutdown Current: <1mA
Shutdown Function
Output Current-Limit Protection
Short-Circuit Current-Limit Protection
Over-Temperature Protection
Lead Free and Green Devices Available
(RoHS Compliant)
The APL5535 is available in the TDFN
package.
1.5x1.5-6
Pin Configurations
Applications
EN1
IN
VOUT1
VOUT2
GND
1
2
3
6
5
4
·
·
·
Mobile Phone
EN2
GPS Navigation
Blue Tooth Headset
TDFN1.5x1.5-6
(Top View)
Ordering and Marking Information
APL5535
Voltage Code
See Voltage Code Table
Package Code
QB : TDFN1.5x1.5-6
Operating Ambient Temperature Range
I : -40 to 85oC
Handling Code
TR : Tape & Reel
Assembly Material
Assembly Material
Handling Code
Temperature Range
Package Code
Voltage Code
G : Halogen and Lead Free Device
VV - Voltage Code
X - Date Code
5VV
X
APL5535-VVQB:
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant)and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
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Rev. A.2 - Oct, 2015
APL5535
Voltage Code Table
Output Voltage
Output Voltage
VOUT1 (V)
Voltage Code
Voltage Code
VOUT1 (V)
1.30
1.85
1.50
1.80
2.50
2.50
2.80
2.85
2.80
2.80
2.80
3.30
3.30
3.15
VOUT2 (V)
2.80
1.85
1.50
1.20
1.80
3.00
2.85
2.85
1.80
3.30
3.00
2.85
3.30
2.80
VOUT2 (V)
2.80
1.50
2.80
2.60
3.30
2.80
3.30
1.85
1.80
2.80
1.80
3.00
3.00
3.10
7M
bb
1.20
1.85
1.50
1.80
1.80
2.50
2.50
2.85
2.85
2.80
3.00
3.00
3.30
3.30
5M
b9
99
9M
CK
CR
JM
JR
C5
JC
JO
Ud
dd
db
MC
MR
MO
Rd
RR
eM
dC
MM
OC
OO
RO
RP
Available Voltage Version
Code
Voltage
Code
5
7
9
A
C
b
D
E
F
J
K
1.20
c
1.30
L
1.50
M
1.60
d
1.80
N
1.85
O
1.90
P
2.00
e
2.10
Q
2.50
R
2.60
Voltage
2.65
2.70
2.80
2.85
2.90
3.00
3.10
3.15
3.20
3.30
Absolute Maximum Ratings (Note 1)
Symbol
Parameter
Rating
Unit
V
VIN
VIN Input Voltage (VIN to GND)
-0.3 ~ 7
-0.3 ~ 7
150
VEN1, VEN2 EN1, EN2 to GND Voltage
V
TJ
Maximum Junction Temperature
Storage Temperature
oC
oC
oC
TSTG
TSDR
-65 ~ 150
260
Maximum Lead Soldering Temperature, 10 Seconds
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under
"recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Thermal Characteristics
Symbol
Parameter
Typical Value
Unit
Junction-to-Ambient Resistance in Free Air (Note 2)
oC/W
qJA
TDFN1.5x1.5-6
165
Note 2: qJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
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APL5535
Recommended Operating Conditions (Note 3)
Symbol
Parameter
Range
2 ~ 5.5
Unit
V
VIN
VIN Input Voltage (VIN to GND)
VEN1, VEN2 EN1, EN2 to GND Voltage
0 ~ 5.5
V
IOUT
TA
VOUT Output Current
Ambient Temperature
Junction Temperature
0 ~ 300
-40 ~ 85
-40 ~ 125
mA
oC
oC
TJ
Note 3: Refer to the typical application circuit
Electrical Characteristics
o
Unless otherwise specified, these specifications apply over VIN=VOUT+1V, VEN1= VEN2=5V and TA= -40 to 85 C. Typical values are
at TA=25oC.
APL5535
Symbol
Parameter
Test Conditions
Unit
Min.
Typ.
Max.
UNDER-VOLTAGE LOCKOUT (UVLO) AND SUPPLY CURRENT
VIN UVLO Threshold Voltage
VIN UVLO Hysteresis
V rising, TA= -40 to 85 oC
-
-
-
-
1.8
0.1
58
-
-
-
V
V
IN
No load, VEN1= VEN2=5V
No load, VEN1= VEN2=0V
90
1
mA
mA
IQ
VIN Supply Current
OUTPUT VOLTAGE (REGULATOR1 AND REGULATOR2)
Output Voltage Accuracy
Line Regulation
IOUT =1mA to 300mA, TA= -40 oC to 85 oC
-3.5
-
-
-
+3.5
0.2
%
IOUT =1mA, VIN=VOUT+0.3V to 5.5V, or
VIN=2.5V to 5.5V
%/V
Load Regulation
Dropout Voltage(Note 4)
IOUT =1mA to 300mA
IOUT =300mA
-
-
-
-
-
-
-
-
-
1
%
VDROP
240
70
330
mV
f=100Hz
-
-
-
-
-
-
f=1kHz
IOUT =50mA, COUT=2.2mF
f=10kHz
70
PSRR
Power Supply Rejection Ratio
dB
60
f=100kHz
IOUT =1mA, BW=10 to 100kHz, COUT=10mF
VEN1= VEN2=0V
35
Output Noise
100
0.7
mVRMS
kW
VOUT Discharge Resistance
ENABLE/DISABLE (EN1 AND EN2)
VIH
VIL
EN Input Logic HIGH
EN Input Logic LOW
EN Input Current
V =2.5V to 5.5V
1.5
-
-
-
0.4
-
V
V
IN
V =2.5V to 5.5V
IN
-
-
VEN1= VEN2=5V
0.2
mA
PROTECTIONS (REGULATOR1 AND REGULATOR2)
ILIMIT
Current Limit Threshold
Short-Circuit Output Current
Over-Temperature Threshold
Over-Temperature Hysteresis
Soft-Start Time
330
450
50
750
mA
mA
°C
°C
ms
ISHORT
-
-
-
-
-
-
-
-
160
40
60
Note 4: The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT + 1V.
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APL5535
Typical Operating Characteristics
Output Voltage vs. Temperature
Output Voltage vs. Temperature
1.9
3.4
VOUT2
VOUT1
1.86
3.36
3.32
1.82
1.78
1.74
1.7
3.28
3.24
3.2
-50 -30 -10 10 30 50 70 90 110 130
Temperature (oC)
-50 -30 -10 10 30 50 70 90 110 130
Temperature (oC)
Dropout Voltage vs. Output Current
Quiescent Current vs. Temperature
300
80
VIN=VEN=4.2V
250
200
150
100
TJ=125oC
75
70
65
60
TJ=25oC
TJ=-40oC
50
0
55
0
50
100
150
200 250
300
-50 -30 -10 10 30 50 70 90 110 130
Temperature (oC)
Output Current (mA)
Noise
PSRR vs. Frequency
50
40
30
20
0
IOUT=50mA
IOUT=50mA
-20
-40
-60
-80
10
0
0
20m
40m
60m
80m 100m
10 20
200
1k
10k
200k
Time (sec)
Frequency (Hz)
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APL5535
Operating Waveforms
Power on
Power off
VIN
VIN
1
1
2
3
VOUT1
VOUT1
2
VOUT2
VOUT2
3
CIN=1mF,COUT=1mF
IOUT1=IOUT2=10mA
CH1:VIN,2V/Div, DC
CH2:VOUT1,1V/Div, DC
CH3:VOUT2,1V/Div, DC
TIME:4ms/Div
CIN=1mF,COUT=1mF
IOUT1=IOUT2=10mA
CH1:VIN,2V/Div, DC
CH2:VOUT1,1V/Div, DC
CH3:VOUT2,1V/Div, DC
TIME:20ms/Div
Enable Response
Disable Response
VEN
VEN
1
1
VOUT1
VOUT1
2
2
3
VOUT2
VOUT2
3
CIN=1mF,COUT=1mF
IOUT1=IOUT2=10mA
CIN=1mF,COUT=1mF
IOUT1=IOUT2=50mA
CH1:VEN,5V/Div, DC
CH2:VOUT1,1V/Div, DC
CH3:VOUT2,1V/Div, DC
TIME:40ms/Div
CH1:VEN,5V/Div, DC
CH2:VOUT1,1V/Div, DC
CH3:VOUT2,1V/Div, DC
TIME:40ms/Div
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APL5535
Operating Waveforms
Line Transient Response
Line Transient Response
VIN
VIN
1
2
3
1
VOUT1
VOUT1
2
VOUT2
VOUT2
3
VIN=3.8V to 4.8V to 3.8V (rise / fall time = 4ms)
CIN=1mF,COUT=1mF
IOUT1=IOUT2=50mA
VIN=3.8V to 4.8V to 3.8V (rise / fall time = 4ms)
CIN=1mF,COUT=1mF
IOUT1=IOUT2=10mA
CH1:VIN,500mV/Div, DC,Offset=3.8V
CH2:VOUT1,20mV/Div, DC,Offset=3.3V
CH3:VOUT2,20mV/Div, DC,Offset=1.8V
TIME:100ms/Div
CH1:VIN,500mV/Div, DC,Offset=3.8V
CH2:VOUT1,20mV/Div, DC,Offset=3.3V
CH3:VOUT2,20mV/Div, DC,Offset=1.8V
TIME:100ms/Div
Line Transient Response
Load Transient Response
VIN
IOUT
1
1
VOUT1
VOUT
2
2
VOUT2
3
VIN=3.8V to 4.8V to 3.8V (rise / fall time = 4ms)
CIN=1mF,COUT=1mF
IOUT1=IOUT2=100mA
IOUT=10mA to 50mA to 10mA (rise / fall time = 1ms)
CIN=1mF,COUT=1mF
CH1:IOUT,50mA/Div, DC
CH1:VIN,500mV/Div, DC,Offset=3.8V
CH2:VOUT1,20mV/Div, DC,Offset=3.3V
CH3:VOUT2,20mV/Div, DC,Offset=1.8V
TIME:100ms/Div
CH2:VOUT,20mV/Div, DC,Offset=3.3V
TIME:40ms/Div
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APL5535
Operating Waveforms
Load Transient Response
Load Transient Response
IOUT
IOUT
1
1
2
VOUT
VOUT
2
IOUT=10mA to 100mA to 10mA (rise / fall time = 1ms)
CIN=1mF,COUT=1mF
CH1:IOUT,50mA/Div, DC
CH2:VOUT,20mV/Div, DC,Offset=3.3V
TIME:40ms/Div
IOUT=10mA to 200mA to 10mA (rise / fall time = 1ms)
CIN=1mF,COUT=1mF
CH1:IOUT,100mA/Div, DC
CH2:VOUT,20mV/Div, DC,Offset=3.3V
TIME:40ms/Div
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APL5535
Pin Description
PIN
FUNCTION
NO.
NAME
Enable Input. Pulling the VEN1/2 above 1.5V enables the respective regulator output;
pulling VEN1/2 below 0.4V disables the respective regulator output.
1, 3
2
EN1, EN2
IN
Input Supply Pin. VIN can range from 2V to 5.5V and should be bypassed with at least
a 1mF capacitor.
4
5
6
GND
OUT2
OUT1
Ground pin of the circuitry. All voltage levels are measured with respect to this pin.
Regulator Outputs. Sources up to 300mA. Bypass with at least a 1mF capacitor to the
GND respectively.
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APL5535
Block Diagram
VIN
Current
Limit1
UVLO and
Shutdown
Control1
EN1
VREF1
Over-
Temperature
Protection
VOUT1
Short Circuit
Current Limit1
GND
Current
Limit2
UVLO and
Shutdown
Control2
EN2
VREF2
Over-
Temperature
Protection
VOUT2
Short Circuit
Current Limit2
Typical Application Circuit
VOUT1
VIN
VIN
VOUT1
1.2V to 3.3V/300mA
2.0V to 5.5V
COUT1
CIN
1mF
1mF
APL5535
VOUT2
ON
EN1
EN2
VOUT2
1.2V to 3.3V/300mA
COUT2
1mF
OFF
GND
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APL5535
Function Description
VIN Under-Voltage Lockout (UVLO)
Over-Temperature Protection
An over-temperature protection circuitry limits the junc-
tion temperature of APL5535. When the junction tempera-
ture exceeds +160oC, the over-temperature protection
circuitry disables the LDO outputs, allowing the device to
cool down. The LDO outputs are enabled again after the
junction temperature cools down by 40oC, resulting in a
pulsed output during continuous thermal overload
conditions. Over-temperature protection is designed to
protect the IC in the event of over temperature conditions.
For reliable operation, the junction temperature cannot
exceed TJ=+125oC
The APL5535 has a built-in under-voltage lockout circuit
to keep the outputs shuting off until internal circuitry is
operating properly. The UVLO circuit has a hysteresis
and a de-glitch feature so that it will typically ignore un-
dershoot transient on the input.
Soft-Start (For Each Channel)
The APL5535 provides an internal soft-start circuitry to
control rise rate of the output voltage and limit the current
surge during start-up. The output voltage starts the soft-
start at approximate 60ms after the VIN is over the UVLO
threshold. The typical soft-start interval is about 60ms.
Current-Limit Protection (For Each Channel)
The APL5535 provides a current-limit protection function.
During current limit, the device limits output current at
current limit threshold. For reliable operation, the device
should not be operated in current limit for extended period.
Short-Circuit Current-Limit Protection (For Each
Channel)
When the output voltage drops below 0.8V, which is
caused by the over load or short circuit, the device limits
the output current down to a safe level. The short circuit
current limit is used to reduce the power dissipation dur-
ing short circuit conditions. If the junction temperature is
over the over-temperature threshold, the device will enter
the thermal shutdown.
Enable/Disable (For Each Channel)
Pulling the VEN1/2 above 1.5V enables the respective LDO
output, and pulling VEN1/2 below 0.4V disables the respec-
tive LDO output. When both the LDO outputs are disabled,
the supply current is reduced to less than 1mA. EN1/2
pins are internally pulled low by resistors. If shutdown
function is not used, connect EN1/2 to VIN for normal
operation. The enable inputs are compatible with both
TTL and CMOS logic levels.
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APL5535
Application Information
Input Capacitor
where (TJ-TA) is the temperature difference between the
junction and ambient air. qJA is the thermal resistance
between Junction and ambient air. Assuming the TA=25oC
and maximum TJ=160oC (typical thermal limit threshold),
the maximum power dissipation is calculated as:
PD(max)=(160-25)/165 = 0.82(W)
The APL5535 requires proper input capacitors to supply
surge current during stepping load transients to prevent
the input rail from dropping. Because the parasitic induc-
tor from the voltage sources or other bulk capacitors to
the VIN limit the slew rate of the surge current, place the
Input capacitors near VIN as close as possible. Input ca-
pacitors should be larger than 1mF and a minimum ce-
ramic capacitor of 1mF is necessary.
For normal operation, do not exceed the maximum junc-
tion temperature rating of TJ = 125oC. The calculated
power dissipation should be less than:
PD =(125-25)/165 = 0.61(W)
Output Capacitor
The GND provides an electrical connection to the ground
and channels heat away. Connect the GND to the ground
by using a large pad or a ground plane.
The APL5535 needs a proper output capacitor to main-
tain circuit stability and improve transient response over
temperature and current. In order to insure the circuit
stability, the proper output capacitor value should be larger
than 1mF. With X5R and X7R dielectrics, 1mF is sufficient
at all operating temperatures. Large output capacitor
value can reduce noise and improve load-transient re-
sponse and PSRR, Figure 1 shows the curves of allow-
able ESR range as the function of load current for various
output capacitor values.
Layout Consideration
Figure 2 illustrates the layout. Below is a checklist for
your layout:
1. Please place the input capacitors close to the VIN.
2. Ceramic capacitors for load must be placed near the
load as close as possible.
3. To place APL5535 and output capacitors near the load
is good for performance.
Region of Stable COUT ESR vs. Output Current
4. Large current paths, the bold lines in figure 2, must
have wide tracks.
10
APL5535-OC
VIN=VEN=4.2V
CIN=COUT=1mF/X7R
VIN
VOUT1
COUT1
1
VIN
VOUT1
Unstable Range
CIN
0.1
Stable Range
APL5535
VOUT2
COUT2
ON
EN1
EN2
VOUT2
0.01
Stable by Simulation Verify
OFF
GND
0.001
0
50
100
Output Current (mA)
Figure1. Stable COUT ESR Range
150
200
250
300
Figure2. Large Current Paths
Operation Region and Power Dissipation
The APL5535 maximum power dissipation depends on
the thermal resistance and temperature difference be-
tween the die junction and ambient air. The TDFN1.5x
1.5-6 package power dissipation PD across the device is:
PD = (TJ - TA) / qJA
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APL5535
Package Information
TDFN1.5x1.5-6
D
A
Pin 1
A1
A3
NX
aaa c
SEATING PLANE
Pin 1 Corner
e
S
Y
TDFN1.5x1.5-6
M
B
O
MILLIMETERS
INCHES
MIN.
MAX.
0.80
MIN.
MAX.
0.031
0.002
L
A
0.70
0.00
0.028
0.000
0.05
A1
A3
b
0.20 REF
0.008 REF
0.008
0.057
0.057
0.012
0.061
0.061
0.20
1.45
1.45
0.30
1.55
1.55
D
E
e
0.50BSC
0.08
0.020 BSC
0.003
0.016
0.020
0.024
0.028
L
0.40
0.50
0.60
0.70
L1
aaa
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Rev. A.2 - Oct, 2015
APL5535
Carrier Tape & Reel Dimensions
P0
P2
P1
OD0
A
K0
A0
A
OD1
B
B
SECTION A-A
SECTION B-B
d
T1
Application
A
H
T1
C
d
D
W
E1
F
8.4+2.00 13.0+0.50
-0.00 -0.20
178.0±2.00 50 MIN.
1.5 MIN.
D1
20.2 MIN.
8.0±0.30 1.75±0.10
A0 B0
3.5±0.05
K0
TDFN1.5x1.5-6
P0
P1
P2 D0
T
1.5+0.10
-0.00
0.6+0.00
-0.40
4.0±0.10
4.0±0.10
2.0±0.05
1.5 MIN.
1.80±0.20 1.80±0.20 1.00±0.20
(mm)
Devices Per Unit
Package Type
TDFN1.5x1.5-6
Unit
Tape & Reel
Quantity
3000
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Rev. A.2 - Oct, 2015
APL5535
Taping Direction Information
TDFN1.5x1.5-6
USER DIRECTION OF FEED
Classification Profile
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Rev. A.2 - Oct, 2015
APL5535
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Preheat & Soak
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
Temperature min (Tsmin
)
Temperature max (Tsmax
)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
3 °C/second max.
3°C/second max.
Liquidous temperature (TL)
Time at liquidous (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak package body Temperature
(Tp)*
See Classification Temp in table 1
20** seconds
See Classification Temp in table 2
30** seconds
Time (tP)** within 5°C of the specified
classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax
)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Volume mm3
350
Package
Thickness
<2.5 mm
³ 2.5 mm
Volume mm3
<350
235 °C
220 °C
220 °C
220 °C
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
Volume mm3
Volume mm3
350-2000
260 °C
Volume mm3
<350
260 °C
260 °C
250 °C
>2000
260 °C
245 °C
245 °C
1.6 mm – 2.5 mm
³ 2.5 mm
250 °C
245 °C
Reliability Test Program
Test item
SOLDERABILITY
HOLT
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
PCT
TCT
HBM
MM
VMM≧200V
10ms, 1tr≧100mA
Latch-Up
Copyright ã ANPEC Electronics Corp.
15
www.anpec.com.tw
Rev. A.2 - Oct, 2015
APL5535
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright ã ANPEC Electronics Corp.
Rev. A.2 - Oct, 2015
16
www.anpec.com.tw
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