552-2589-000 [AMPHENOL]
Connector Accessory;NAFI + UHD CONNECTORS
Amphenol
STANDARD. RELIABLE. PROVEN.
Printed Circuit Board Technology
NAFI
FEATURES & BENEFITS
Available in 2 through 4 rows - Offers maximum design flexibility
Tested and qualified to MIL-C-28859 and MIL-C-28754 - Confirms the product meets specific performance requirements
Tuning fork and blade contact system - A proven technology for high reliability
Low insertion force (2.25oz/contact) - For easy mating
Rugged machined aluminum frames - Ensures excellent performance in harsh environments
Compliant pin press-fit, through-hole and flex circuit termination styles available - Support a variety of design application requirements
Tuning Fork and Blade
Contact System:
A proven technology for
high reliability.
Originally co-developed with the U.S. Navy, the NAFI Connector product
line includes multi-row, through-hole solder blade connectors and press
fit tuning fork backplane connectors. The highlight of the NAFI backplane
technology is its solderless “Dynamic Retention” gas tight, press-fit tuning
fork contact design. Rugged, metal header bodies are machined and
finished with chromate. Available in two, three, or four rows of contacts,
NAFI Connectors offer a high degree of design flexibility in order to meet
specific density and layout requirements.
Connector patterns containing multiple rows of contacts are easily
produced and can include standard NAFI-style features such as guide
pins and D-shaped polarizing keys. The mating backplane connectors
feature solderless press-fit tuning fork contacts arranged
on a 0.100” x 0.100” grid.
NAFI TECHNICAL REFERENCES
OPERATING CHARACTERISTICS
Temperature Range
-65°C to +125°C
MATERIALS & FINISHES
Current Rating
(individual contact)
3 Amps DC at 25°C
Frame Material
Aluminum Alloy
Frame Finish
Gold Chromate per MIL-C-5541
Brass
Current Rating
(multiple contacts)
1 Amp DC at °C
Module Contact Material
Module Contact Tails
Dielectric Withstanding
Voltage (DWV)
600 V (RMS) at 60 Hz
Pre-tinned using Sn63 (from end of
contact to mounting surface min.)
Insulation Resistance (min.)
Contact Resistance (max.)
10,000 MΩ
30 MΩ
Module Contact Finish
Backplane Contact Material
Backplane Contact Finish
Module Insulator
50µ” min. Gold over 10µ” min. Nickel
Beryllium Copper
Contact-to-Backplane
Retention Force (min.)
3.0 lbs.
50µ” min. Gold over 10µ” min. Nickel
High-temperature Nylon 6-6
Contact Life (durability)
Contact Engagement Force
Contact Normal Force
500 cycles
Backplane Insulator
Module Marking
Polyester, 30% glass-filled (UL 94V-0)
2.25 oz max. average
1.0 N (3.53 oz-f) average
0.053 in.
Includes Amphenol part number, logo and
date code
Contact Wipe Length (min.)
Polarizing Keys and Bushings
Stainless Steel, Passivated
ENVIRONMENTAL CHARACTERISTICS
Salt Spray (corrosion)
Thermal Shock
Humidity
MIL-STD-1344
MIL-STD-1344
MIL-STD-810
MIL-STD-202
MIL-STD-1344
Method 1001, Test Condition B
Method 1003, -55°C to +125°C
Method 507, Procedure 1
Method 213
Physical Shock
Vibration (random)
Method 2005, 10-2000 Hz, 15g Peak
NAFI TWO ROW
X
X
P
.174 (4.42)
.140 (3.56)
.052 [1.32]
2 PL
.015[0.38]-.019[0.48]
DIAMETER TYPICAL
.240 [6.10]
SECTION X-X
ROTATED 90° CCW
.140 [3.56]
.100 [2.54]
N
.200 [5.08]
K EQ SP @ .100[2.54], centered on N
Ø.097 [Ø2.46]
2PL
.142 [3.61]
.580 [14.73]
2 PL
(.037 [0.94])
TO MOUNTING SURFACE
CONTACT
.470 [11.94]
2 PL
Marking located approximately
where shown
M
.100 [2.54]
SEE DETAIL D
.150 [3.81]
DETAIL D
PIN ORIENTATION
(SHOWN IN POSITION A)
.093 [2.36]
DETAIL C
CONTACT ORIENTATION
.286 [7.26]
.050 [1.27]
2 PL
STANDARD
ORIENTATION
SEE DETAIL C
Daughtercard
Connector
No. Contacts Mating Backplane
Connector Kit
K
M
N
P
M1001-12927
M1001-12928
M1001-12929
M1001-12930
60
80
552-2583-000
552-2584-000
552-2585-000
552-2586-000
29
39
49
59
2.930 2.940 2.960
3.930 3.940 3.960
4.930 4.940 4.960
5.930 5.940 5.960
100
120
NAFI THREE ROW
X
X
P
.175 (4.45)
.015[0.38]-.019[0.48]
DIAMETER TYPICAL
.140 (3.56)
.052 [1.32]
2 PL
.340 [8.64]
.240 [6.10]
SECTION X-X
ROTATED 90° CCW
.140 [3.56]
.100 [2.54]
N
K EQ SP @ .100[2.54], centered on N
.200 [5.08]
Ø.097 [Ø2.46] 2 PL
.142 [3.61]
.580 [14.73]
2 PL
(.040 [1.02])
TO MOUNTING SURFACE
CONTACT
.470 [11.94]
2 PL
Marking located approximately
where shown
M
SEE DETAIL D
.150 [3.81]
DETAIL D
PIN ORIENTATION
(SHOWN IN POSITION A)
DETAIL C
CONTACT ORIENTATION
.193 [4.90]
.386 [9.80]
.050 [1.27]
2 PL
STANDARD
ORIENTATION
.100 [2.54]
SEE DETAIL C
Daughtercard
Connector
No. Contacts Mating Backplane
Connector Kit
K
M
N
P
M1001-12931
M1001-12932
M1001-12933
M1001-12934
66
99
552-2587-000
552-2588-000
552-2589-000
552-2590-000
21
32
39
49
2.130 2.140 2.160
3.230 3.240 3.260
3.930 3.940 3.960
4.930 4.940 4.960
120
150
*All dimensions for reference only
NAFI FOUR ROW
P
X
X
.175 (4.45)
.015[0.38]-.019[0.48]
DIAMETER TYPICAL
.140 (3.56)
.440 [11.18]
.052 [1.32]
2 PL
.340 [8.64]
.240 [6.10]
SECTION X-X
ROTATED 90° CCW
.100 [2.54]
N
.140 [3.56]
K EQ SP @ .100[2.54], centered on N
.200 [5.08]
Ø.097 [Ø2.46] 2 PL
.142 [3.61]
.580 [14.73]
2 PL
(.040 [1.02])
TO MOUNTING SURFACE
CONTACT
.470[11.94]
2 PL
Marking located approximately
where shown
.100 [2.54]
.200 [5.08]
.093 [2.35]
M
DETAIL D
PIN ORIENTATION
(SHOWN IN POSITION A)
DETAIL C
CONTACT ORIENTATION
SEE DETAIL D
.150 [3.81]
STANDARD
ORIENTATION
.050 [1.27]
2 PL
.485 [12.32]
.300 [7.62]
SEE DETAIL C
Daughtercard
Connector
No. Contacts Mating Backplane
Connector Kit
K
M
N
P
M1001-12935
M1001-12936
M1001-12937
M1001-12938
100
140
180
200
552-2591-000
552-2592-000
552-2593-000
552-2594-000
24
34
44
49
2.430
3.430
4.430
4.930
2.440
3.440
4.440
4.940
2.460
3.460
4.460
4.960
NAFI BACKPLANE CONNECTOR KITS
.220
.100
.100
.199
2 ROW W/O NAFI VERSION
(BOTTOM VIEW)
2 ROW RIGHT NAFI VERSION
(BOTTOM VIEW)
2 ROW LEFT NAFI VERSION
(BOTTOM VIEW)
3 ROW RIGHT VERSION
(BOTTOM VIEW)
3 ROW LEFT VERSION
3 ROW W/O NAFI VERSION
(BOTTOM VIEW)
(BOTTOM VIEW)
4 ROW RIGHT VERSION
(BOTTOM VIEW)
4 ROW W/O NAFI VERSION
(BOTTOM VIEW)
4 ROW LEFT VERSION
(BOTTOM VIEW)
2 ROW INSULATOR
Backplane No. of
Connector Kit Contacts Daughtercard Connector Kit Contacts Daughtercard Connector Kit Contacts Daughtercard
3 ROW INSULATOR
4 ROW INSULATOR
Mating
Backplane No. of Mating
Backplane No. of
Mating
Connector
Connector
Connector
552-2583-000
552-2584-000
552-2585-000
552-2586-000
60
80
M1001-12927 552-2587-000
M1001-12928 552-2588-000
M1001-12929 552-2589-000
M1001-12930 552-2590-000
66
99
M1001-12931 552-2591-000
M1001-12932 552-2592-000
M1001-12933 552-2593-000
M1001-12934 552-2594-000
100
140
180
200
M1001-12935
M1001-12936
M1001-12937
M1001-12938
100
120
120
150
Amphenol
Printed Circuit Board Technology
Amphenol Printed Circuit Board Technology
Phone: (603) 324-4500
www.amphenol-apcbt.com
New Hampshire Assembly:
18 Celina Ave, Exit 8
Nashua, NH
Panels, Materials, Front End:
91 Northeastern Blvd, Exit 4
Nashua, NH
Mexico Assembly & Connectors:
Optimize Plant 3 & 6
Nogales, Mexico
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552-3511F
Dual Color LED Array, Red/green, Diffused, T-1 3/4, 5mm, ROHS COMPLIANT PACKAGE-6
DIALIGHT
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