54601906001LF [AMPHENOL]
Telecom and Datacom Connector, 2 Contact(s), Female, Right Angle, Solder Terminal, Locking, Jack, LEAD FREE;
| 型号： | 54601906001LF |
| 厂家： | 
Amphenol |
| 描述： | Telecom and Datacom Connector, 2 Contact(s), Female, Right Angle, Solder Terminal, Locking, Jack, LEAD FREE PC 连接器 |
| 文件： | 总1页 (文件大小：195K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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8
1.5 0.3
6.5 0.5
LOGO
A
A
A
A
54601 X 06 XXX WP LF
PRODUCT NO.
TELEJACK PCB SERIES
LEAD FREE
WELD AREA
13.20
9.90
CAVITY NO.
NOTE-2
PLATING
B
C
D
E
F
B
B
*SPECIAL CODE
2-0.08µ Au SELECTIVE MIN.
6-0.8µ Au SELECTIVE MIN.
7-Au FLASH SELECTIVE MIN.
8-1.27µ Au SELECTIVE MIN.
9-0.38µ Au SELECTIVE MIN.
WP-WITHOUT PROJECTION
BLANK-WITH PROJECTION
5.08 0.05
1.016TYP
0.1 B
SEE VIEW A
A
CONTACTS LOADED
NO.OF POS
BLANK-CTS. LOADED IN ALL POS.
001-CTS. LOADED IN 3&4 POS.
002-CTS. LOADED IN 2,3,4 &5 POS.
06-6 POL INSULATOR
TECHNICAL SPECIFICATION:
C
Insulation Resistance - 500 M Ohms min.
Dielectric Strength - 1000 V rms , 60 Hz.
Contact Resistance - 20 to 30 m Ohms. max.
Current Rating - 2.0 amp DC
Maximum Total Mating Force - 20 N
Retention Force Between Plug & Jack-22.5 N min.
Durability - 250 mating cycles
1.27
0.254 X Y
6.35
8.89
2.10
7.88
4.06
6.60
MATERIAL
10.16
Housing: THERMOPLASTIC-UL94 V0 BLACK
Contact: 0.46 COPPER ALLOY ROUND WIRE
Y
SECTION A-A
SCALE 4:1
Material:
D
The housing will withstand exposure to 260-265'C for
5 seconds in a wavesoldering application.Use protective
adhesive tape (Kapton or Teflon) or protective metallic devices
on the areas which are directly exposed to wave soldering
as it is used in classical leaded wave soldering.
P.C.B HOLE PATTERN VIEWED FROM TOP
WIRE POSITION NO.
Contact: 0.46mm Copper Alloy
2.54 TYP.
0.76
Plating:
1.91
Active zone: Gold over nickel on contact area
Termination zone : SnPb over Nickel (Leaded vesion)
: Matte Tin over nickel (Lead Free version)
POS.NO.6
POS.NO.5
POS.NO.4
POS.NO.3
POS.NO.2
POS.NO.1
E
1.LF Products meet European Union Directives and other country
Regulations as described in GS-22-008.
X
2.The Housing will withstand exposure to 260' peak temperature for
5 sec in a wave solder applicotion with a 1.6mm Min thick circuit board
Slight deformation of snap pegs may occur at 260-265'c which will not
affect the function of the product.
18.00
3.25 0.10
3.Lead Free or ROHS Directive labelling to be provided as per GS-14-920
for Lead Free version.
*OPTIONAL-NOTE 3
SEE SPECIAL CODE
2.50
10.16
projection
surface
-
tolerance std
mm
IS0 1302
ISO 406
ISO 1101
www.fciconnect.com
NOTES:
SCALE 3:1
TOLERANCES UNLESS OTHERWISE SPECIFIED
0.X
0.3
0.15
0.05
Dr
Eng
Chr
Appr
size
NEBU P.M
NEBU P.M
NEBU PM
2008-05-19
Scale
1. CONTACT WIRE SHOULD NOT TO BE EXPOSED IN THE WELD AREA.
AND WELD FLASH NOT TO EXCEED 0.30 ABOVE -A-
2. ALL WIRES MUST BE CONTAINED IN THE SHELF.
3. OPTIONAL PROJECTION ADDED TO INCREASE OVERALL HEIGHT OF CONNECTOR.
SEE ORDERING INFORMATION.
ANGULAR
rev
E
ecn no
dr
date
A2
0.XX
4:1
LINEAR
2008-05-19
2009-08-19
2009-08-19
F
I08-0023 HVN 2008-05-19
I08-0081 NG 2008-07-02
I09-0169 NPM 2009-08-19
0
2
0.XXX
ECN
I09-0169
F
SUDHIR V
Product family
MODJACK Spec ref
G
Rev.
-
-
-
-
-
-
-
-
-
-
-
-
-
VIEW A
6 POL HOUSING
C-BMJ-0082
-
G
TELEJACK
-
-
catalog no
sheet 1 of 1
- CUSTOMER COPY
REV F - 2006-04-17
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8
STATUS:Released Printed: Aug 21, 2009.
PDM: Rev:G
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