10082202-103,0454-LF [AMPHENOL]

Board Connector, 54 Contact(s), 2 Row(s), Male, Right Angle, Solder Terminal, ROHS COMPLIANT;


型号：	10082202-103,0454-LF
厂家：	Amphenol
描述：	Board Connector, 54 Contact(s), 2 Row(s), Male, Right Angle, Solder Terminal, ROHS COMPLIANT
文件：	总4页 (文件大小：757K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ELECTRONICS

BERGSTIK™

Unshrouded Headers for Pin-in-Paste Processes

BERGSTIKTM UNSHROUDED HEADERS

FOR PIN-IN-PASTE PROCESSES

DESCRIPTION

BergStik™ is FCI’s brand for pin headers

in 2.54 mm (0.100”) pitch. The BergStik

product range includes straight, right angle,

surface mount and stacking headers. Three

new series are now being added, dedicated

to Pin-in-Paste soldering processes.

This brochure gives additional information

for the correct use of BergStik PIP

connectors in the application process.

PIN-IN-PASTE

Pin-in-Paste (PIP) technology allows the

use of TMT products in SMT manufacturing

processes. The connectors are automatically

or manually placed on the board, then

soldered in the same operation as the SMT

components. Despite this, the mechanical

strength of the TMT soldering is maintained

– still an important requirement for connectors

nowadays in many industrial or automotive

applications.

CONNECTOR DESIGN

These connectors meet the requirements of Pin-in-Paste processing in all aspects, including plastic material, housing design and pin length.

PLASTIC MATERIAL: BergStik PIP headers are moulded in high temperature thermoplastic and are able to withstand exposure

to 260°C peak temperature for 30 seconds maximum in a convection, infra-red or vapour phase reflow oven.

HOUSING DESIGN: a special housing has been developed for the double row straight product. A row of higher standoffs has

been placed in the longitudinal center axis, between both rows of pins for a good solder paste deposit around the pin. Please

follow the stencil design guidelines TA-894 and TA-897 below in order to avoid paste deposit under the standoffs.

APPLICATION DESIGN

GUIDELINES

The following application guidelines will

help you to achieve optimum results when

using Bergstik PiP in your process.

STENCIL DESIGN: the stencil design

is crucial for a good solder joint. It

determines the quantity of paste and

the position of the paste print on the

board. Each PCB hole has its own stencil

aperture with enough spacing in between

to allow separate solder deposits. This

prevents solder robbing from one hole

to another and guarantees the correct

quantity of solder paste for each hole.

The print position is slightly asymmetrical

so as to optimise the flow of molten

solder paste.

PASTE APPLICATION: the quantity of

paste for each hole depends on the

soldering process parameters and the

degree of hole filling.

For the squeegee, FCI recommends a

45° angle. You can use a smaller angle

for an even greater degree of hole filling.

The squeegee moves in parallel with the

shorter sides of the stencil apertures.

BOARD LAYOUT: Please use a hole of

1.00 +/– 0.05 mm for an optimum

paste deposit. For automatic pick-and-

place, lean towards the upper end of the

tolerance.

Refer also to TA-894 for further information.

TA - 897

TA - 894

BERGSTIKTM UNSHROUDED HEADERS

FOR PIN-IN-PASTE PROCESSES

PART NUMBER

Pin Style

lenght

Total

Positions

8-Digit Base Part Number

Plating

Packaging

= Standard product = plastic bag

A = Tape reel with pick up cap

(call FCI for availability)

Straight

10076801 = Double Row

Double row = 04 to 72

1 = Gold 0.76 µm (30µ”) or GXT 0.76 µm (30µ”) PdNi

with gold flash on contact area tin on solder side

4 = tin

Pin Style

Mating

5.84

Solder

2.50

OAL

10.8

11.5

6.75

2.50

Pin Style

lenght

Total

Positions

8-Digit Base Part Number

Plating

Packaging

Right angle

10082201 = Single row

10082202 = Double Row

Plastic bag

Single row = 03 to 36

Double row = 03 to 72

1 = Gold 0.76 µm (30µ”) or GXT 0.76 µm (30µ”) PdNi

with gold flash on contact area tin on solder side

4 = tin

Pin Style

Mating

5.84

Solder

3.00

6.75

3.00

TECHNICAL DATA

MATERIALS

Housing: PCT

Colour: Black

Flammability rating: UL 94 V-O

Pins: Copper Alloy

Plating: Selective Gold or GXT or full tin over

1.27µm nickel

ELECTRICAL PERFORMANCE

Insulation resistance: 5000 MΩ min

Dielectric withstanding voltage: 1500 V

MECHANICAL PERFORMANCE

OPERATING TEMPERATURE RANGE

ROHS INFORMATION

Pin retention to housing: 8.8 N min.

-65°C to +130°C

This product is RoHS compliant according

to the European Union Directive 2002/95/IEC

REFERENCE INFORMATION

File no. E66906

File no. LR46923

Product drawing: by 8-digit base part number

Product specification: BUS-12-019

BASICS+ SERVICE PROGRAM

BergStik is a part of the Basics+ product range.

The Basics+ Program is built around 2.54 mm and 2 mm pitch

connectors for board-to-board, wire-to-board and cable-to-

board applications.

Basics+ makes the entire product design-in-process very

simple, with easy-to-use product selection, technical hot-line,

fast sample service, and core range products.

Included are established, proven brands such as BergStik,

Dubox, Quickie, Minitek and BergCon PV.

FCI - Americas : 1 (800) 237 2374 - Europe : 33 1 39 49 21 83 - Asia/Pacific : 65 6549 6666

www.fciconnect.com

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