10056844-110ULF [AMPHENOL]

Board Connector;


型号：	10056844-110ULF
厂家：	Amphenol
描述：	Board Connector
文件：	总4页 (文件大小：231K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BOARD/WIRE-TO-BOARD

CONNECTORS

QUICKIE™ CABLE-TO-BOARD

CONNECTORS FOR

PIN-IN-PASTE PROCESSES

OVERVIEW

Quickie^TMis FCI’s brand for cable-to-board connectors in

2.54mm pitch. The Quickie^TMproduct range includes IDC

Receptacles, IDC Board Connectors, Shrouded Low Profile

Headers and Shrouded Eject Latch Headers.

FCI is adding four new series of Quickie Headers to its product

range, dedicated to Pin-in-Paste soldering processes. This

brochure gives additional information for the correct use of

Quickie PiP connectors in the application process.

QUICKIE™ CABLE-TO-BOARD CONNECTORS

FOR PIN-IN-PASTE PROCESSES

PIN-IN-PASTE

Pin-in-Paste (PiP) technology allows the use of TMT products in SMT manufacturing

processes. The connectors are automatically or manually placed on the board, then

soldered in the same operation as the SMT components. Despite this, the mechanical

strenght of the TMT soldering is maintained – still an important requirement for

connectors nowadays in many industrial or automotive applications.

PART NUMBER

8 - DIGIT

PART NUMBER

PLATING

TOTAL

POSTIONS

OPTION

Shrouded superslim header

10056844

10056845

Vertical

6, 8, 10, 14, 16

20, 26, 30, 34, 40

Right Angle

0.76 µm Gold on mating

area, tin on soldier side

Tube without pick-up cap

Tape with pick-up cap (availability

according to TA-893)

Disclaimer

For more information,

Please note that the above information is subject to change without notice.

please contact: Communications@fci.com

or visit us at www.fci.com

QUICKIE™ CABLE-TO-BOARD CONNECTORS

FOR PIN-IN-PASTE PROCESSES

APPLICATION DESIGN GUIDELINES

For application in a Pin-in-Paste process, FCI recommends

the application design guidelines below.

STENCIL DESIGN

BOARD LAYOUT

The stencil design is crucial for a good solder joint.

It determines the quantity of paste and the position of the

paste print on the board. Each PCB hole has its own stencil

aperture with enough spacing in between in order to have

separate solder deposits.

Please use a hole of 1.00 mm 0.05 mm for an

optimum paste deposit. For automatic pick-and-place,

lean towardsthe upper end of the tolerance.

Refer also to TA-894 for further information.

This prevents solder robbing from one hole to another and

guarantees the correct quantity of solder paste for each hole.

The print position is slightly asymmetrical so as to optimise

the flow of molten solder paste.

PASTE APPLICATION

The quantity of paste for each hole depends on the

soldering process parameters and the degree of hole

filling. For the squeegee, FCI recommends a 45° angle.

You can use a smaller angle for an even greater degree of

hole filling. The squeegee moves in parallel with with the

shorter sides of the stencil apertures.

Disclaimer

Please note that the above information is subject to change without notice.

For more information,

please contact: Communications@fci.com

or visit us at www.fci.com

QUICKIE™ CABLE-TO-BOARD CONNECTORS

FOR PIN-IN-PASTE PROCESSES

CONNECTOR DESIGN

In order to achieve optimum soldering results, FCI launches dedicated Pin-in-Paste connectors

in the basics+ product range. These connectors are fully adapted to Pin-in-Paste processing

in all aspects, including plastic material, housing design, pin length, and packaging.

PLASTIC MATERIALS

MECHANICAL PERFORMANCE

Quickie PiP headers are moulded in high temperature

thermoplastic and are able to withstand temperature

exposure up to 260 °C peak for 10 to 30 seconds in a

convection, infrared or vapour-phase reflow oven.

Standoffs raise the housing body slightly above the PCB

surface and thus allow the molten solder paste to flow

freely from its printed position into the board hole and around

the pin. The standoffs are correctly positioned for

a good solder paste deposit around the pin. Please respect

the stencil design guidelines below in order to avoid paste

deposit around the standoffs.

PIN LENGTH

The connector lead length beyond the bottom of the PCB is

shorter than for traditional TMT products. Thus, the risk of

pushing out the solder paste when inserting the pin into the

PCB hole is very much limited. The solder paste will not stick

on the pin tip or even fall off completely, but stays around the

pin for free flow during soldering. FCI uses a solder tail length

of 2 0.2 mm for Quickie Headers for a standard PCB of 1.6

mm thickness.

SPECIFICATIONS

For combining SMT and TMT components not only in the

soldering process, but also in the assembly process, FCI

proposes a choice of pick-and-place packaging for PIP

connectors. The most common part numbers are available

in tape-on-reel packaging, all others in tube.

TECHNICAL INFORMATION

MATERIALS

MECHANICAL PERFORMANCE

• Housing: High temperature thermoplastic

• Pin retention: 20 N min.

• Colour: Black

RoHS INFORMATION

• This product is RoHS compatible according to the

European Union Directive 2002/95/IEC

• Flammability rating: UL94V-O

• Pin: Phosphor bronze

• Plating: Gold and tin over 1.27µm nickel

SPECIFICATIONS

•

File no. E66906

ELECTRICAL PERFORMANCE

• Current rating: 3A continuous

•

File no. LR46923

• Insulation resistance: 10,000ΩM min.

• Dielectric withstanding voltage: 1,500V

• Product drawing: By 8-digit base part number

• Product specification: BUS-12-055

• Tape-on-Reel specification: TA-893

• Application specification: TA-894

• Reflow profile: TA-842

ENVIRONMENTAL

• Operating temperature range: -65°C to +125°C

• Compatible with IR reflow soldering process

Disclaimer

Please note that the above information is subject to change without notice.

For more information,

please contact: Communications@fci.com

or visit us at www.fci.com

10056844-110ULF [AMPHENOL]

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