LCC [AMKOR]
Leadless Chip Carrier Package; 无引线芯片载体封装
| 型号： | LCC |
| 厂家： | 
AMKOR TECHNOLOGY |
| 描述： | Leadless Chip Carrier Package |
| 文件： | 总1页 (文件大小：460K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CERAMIC / HERMETIC
data sheet
LCC
The LCC offers a variety of features. From
standard industry, Amkor provides a platform from
prototype-to-production:
Leadless Chip Carrier
Features:
Package (LCC)
Amkor Technology is committed to continuing to
service this long established standard industry
package. This surface mount package consists of a
co-fired ceramic base that has metalized
terminals / pads on the sides and bottom of the
package. An LCC package has terminals / pads on
all four edges of the package. The lid for this
package can be either ceramic "frit sealed" or
metal "solder sealed". This package provides a
hermetic environment for the IC inside.
• Flexible lead / pin counts
• Variety of body sizes
• Hermetic package
• Exceptional thermal and electrical
performance by design
• Multi-layer, ground / power
• Cavity Up / Cavity down configurations
• Cavity package
Applications:
This IC package technology allows application and
design engineers to maximize the performance
characteristics of semiconductors (silicon, GaAs and
S.A.W.). These packages enable end products
(pagers, portable audio/video, disc drives, radio,
IF & RF devices/components, telecom) to be
reduced in size and weight. Semiconductor
families such as operational amplifiers, drivers,
optoelectronics, controllers, logic, analog, memory,
comparators and more using BiCMOS, CMOS or
other silicon/GaAs/S.A.W. technologies are well
addressed by the LCC product family.
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
DS810
Rev Date: 08’02
www.amkor.com
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