A29L004TL-90_技术文档

A29L004 Series

512K X 8 Bit CMOS 3.0 Volt-only,

Boot Sector Flash Memory

Preliminary

Features

nSingle power supply operation

nTypical 100,000 program/erase cycles per sector

n20-year data retention at 125°C

- Reliable operation for the life of the system

nCompatible with JEDEC-standards

- Full voltage range: 2.7 to 3.6 volt read and write

operations for battery-powered applications

- Regulated voltage range: 3.0 to 3.6 volt read and write

operations for compatibility with high performance 3.3

volt microprocessors

- Pinout and software compatible with single-power-

supply Flash memory standard

- Superior inadvertent write protection

nAccess times:

- 70/90 (max.)

nCurrent:

n

Polling and toggle bits

Data

- Provides a software method of detecting completion

of program or erase operations

- 4 mA typical active read current

- 20 mA typical program/erase current

- 200 nA typical CMOS standby

nReady /

pin (RY /

)

BY

BUSY

- Provides a hardware method of detecting completion

of program or erase operations (not available on 32-

pin PLCC & (s)TSOP packages)

- 200 nA Automatic Sleep Mode current

nFlexible sector architecture

- 16 Kbyte/ 8 KbyteX2/ 32 Kbyte/ 64 KbyteX7 sectors

- Any combination of sectors can be erased

- Supports full chip erase

nErase Suspend/Erase Resume

- Suspends a sector erase operation to read data from,

or program data to, a non-erasing sector, then

resumes the erase operation

- Sector protection:

A hardware method of protecting sectors to prevent

any inadvertent program or erase operations within

that sector. Temporary Sector Unprotect feature

allows code changes in previously locked sectors

nUnlock Bypass Program Command

- Reduces overall programming time when issuing

multiple program command sequence

nTop or bottom boot block configurations available

nEmbedded Algorithms

nHardware reset pin (

)

RESET

- Hardware method to reset the device to reading array

data (not available on 32 pin PLCC & (s)TSOP

packages)

nPackage options

- 40-pin TSOP (forward type), 32-pin PLCC or (s)TSOP

(forward type)

- Embedded Erase algorithm will automatically erase

the entire chip or any combination of designated

sectors and verify the erased sectors

- Embedded Program algorithm automatically writes

and verifies data at specified addresses

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AMIC Technology, Corp.

A29L004 Series

Device erasure occurs by executing the proper erase

command sequence. This initiates the Embedded Erase

General Description

The A29L004 is a 4Mbit, 3.0 volt-only Flash memory

organized as 524,288 bytes of 8 bits. The 8 bits of data

appear on I/O0 - I/O7. The A29L004 is offered in 40-pin

TSOP, 32-pin PLCC or (s)TSOP packages. This device is

designed to be programmed in-system with the standard

system 3.0 volt VCC supply. Additional 12.0 volt VPP is not

required for in-system write or erase operations. However,

the A29L004 can also be programmed in standard EPROM

programmers.

The A29L004 has the first toggle bit, I/O6, which indicates

whether an Embedded Program or Erase is in progress, or it

is in the Erase Suspend. Besides the I/O6 toggle bit, the

A29L004 has a second toggle bit, I/O2, to indicate whether

the addressed sector is being selected for erase. The

A29L004 also offers the ability to program in the Erase

Suspend mode. The standard A29L004 offers access times

of 70 and 90ns, allowing high-speed microprocessors to

operate without wait states. To eliminate bus contention the

algorithm

-

an internal algorithm that automatically

preprograms the array (if it is not already programmed)

before executing the erase operation. During erase, the

device automatically times the erase pulse widths and

verifies proper erase margin. The Unlock Bypass mode

facilitates faster programming times by requiring only two

write cycles to program data instead of four.

The host system can detect whether a program or erase

operation is complete by observing the RY /

available on 32-pin PLCC & (s)TSOP), or by reading the I/O7

pin (not

BY

(

Polling) and I/O6 (toggle) status bits. After a program

Data

or erase cycle has been completed, the device is ready to

read array data or accept another command.

The sector erase architecture allows memory sectors to be

erased and reprogrammed without affecting the data

contents of other sectors. The A29L004 is fully erased when

shipped from the factory.

The hardware sector protection feature disables operations

for both program and erase in any combination of the

sectors of memory. This can be achieved via programming

equipment.

The Erase Suspend/Erase Resume feature enables the user

to put erase on hold for any period of time to read data from,

or program data to, any other sector that is not selected for

erasure. True background erase can thus be achieved.

device has separate chip enable (

), write enable (

)

WE

CE

and output enable (

) controls.

OE

The device requires only a single 3.0 volt power supply for

both read and write functions. Internally generated and

regulated voltages are provided for the program and erase

operations.

The A29L004 is entirely software command set compatible

with the JEDEC single-power-supply Flash standard.

Commands are written to the command register using

standard microprocessor write timings. Register contents

serve as input to an internal state-machine that controls the

erase and programming circuitry. Write cycles also internally

latch addresses and data needed for the programming and

erase operations. Reading data out of the device is similar to

reading from other Flash or EPROM devices.

The hardware

pin terminates any operation in

RESET

progress and resets the internal state machine to reading

array data (not available on 32-pin PLCC & (s)TSOP). The

pin may be tied to the system reset circuitry. A

RESET

system reset would thus also reset the device, enabling the

system microprocessor to read the boot-up firmware from the

Flash memory.

The device offers two power-saving features. When

addresses have been stable for a specified amount of time,

the device enters the automatic sleep mode. The system can

also place the device into the standby mode. Power

consumption is greatly reduced in both these modes.

Device programming occurs by writing the proper program

command sequence. This initiates the Embedded Program

algorithm - an internal algorithm that automatically times the

program pulse widths and verifies proper program margin.

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AMIC Technology, Corp.

A29L004 Series

Pin Configurations

n40-pin TSOP

A16

1

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

24

23

22

21

A17

VSS

NC

A15

A14

A13

A12

A11

A9

2

3

4

NC

5

A10

I/O7

I/O6

I/O5

I/O4

VCC

NC

6

7

A8

8

WE

RESET

NC

9

10

11

12

13

14

15

16

17

18

19

20

A29L004W

RY/BY

A18

A7

I/O3

I/O2

I/O1

I/O0

OE

A6

A5

A4

A3

VSS

CE

A2

A1

A0

nPLCC

n32-pin TSOP (8mm X 20mm)

n32-pin sTSOP (8mm X 14mm)

A11

A9

A8

A13

A14

A17

WE

VCC

A18

A16

1

2

3

4

5

6

7

8

9

10

32

31

30

29

28

27

26

25

24

23

OE

A10

CE

I/O7

I/O6

A7

5

29

28

27

26

A14

A13

A8

I/O5

I/O4

I/O3

GND

I/O2

A6

A5

6

7

A29L004V (8mm X 20mm)

A29L004X (8mm X 14mm)

A9

A4

A3

A2

A1

8

A29L004L

A15

A12

A7

11

12

13

22

21

20

I/O1

I/O0

A0

25

24

A11

9

10

11

OE

A6

A5

A4

14

15

16

19

18

17

A1

A2

A3

23

22

21

A10

A0

12

13

CE

I/O7

I/O0

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AMIC Technology, Corp.

A29L004 Series

Block Diagram

RY/BY (N/A 32-pin PLCC, (s)TSOP)

I/O0 - I/O7

VCC

VSS

Sector Switches

Input/Output

Buffers

Erase Voltage

Generator

RESET

(N/A 32-pin PLCC,

(s)TSOP)

State

Control

WE

PGM Voltage

Generator

Command

Register

Chip Enable

Output Enable

Logic

STB

Data Latch

CE

OE

Y-Decoder

Y-Gating

STB

VCC Detector

Timer

A0-A18

X-decoder

Cell Matrix

Pin Descriptions

Pin No.

Description

A0 - A18

Address Inputs

I/O0 - I/O7

Data Inputs/Outputs

Chip Enable

CE

WE

Write Enable

Output Enable

OE

Hardware Reset (N/A 32-pin PLCC, (s)TSOP)

RESET

RY/

Ready/

- Output (N/A 32-pin PLCC, (s)TSOP)

BUSY

BY

VSS

Ground

VCC

NC

Power Supply

Pin not connected internally

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AMIC Technology, Corp.

A29L004 Series

Absolute Maximum Ratings*

*Comments

Storage Temperature Plastic Packages . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0°C to + 70°C

Ambient Temperature with Power Applied . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to + 70°C

Voltage with Respect to Ground

Stresses above those listed under "Absolute Maximum

Ratings" may cause permanent damage to this device.

These are stress ratings only. Functional operation of

this device at these or any other conditions above

those indicated in the operational sections of these

specification is not implied or intended. Exposure to

the absolute maximum rating conditions for extended

periods may affect device reliability.

VCC (Note 1) . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +4.0V

A9,

&

(Note 2) . . . . . . . . . . . . -0.5 to +12.5V

OE RESET

All other pins (Note 1) . . . . . . . . . . . . -0.5V to VCC + 0.5V

Output Short Circuit Current (Note 3) . . . . . . . . . 200mA

Operating Ranges

Notes:

Commercial (C) Devices

1. Minimum DC voltage on input or I/O pins is -0.5V. During

voltage transitions, input or I/O pins may undershoot

VSS to -2.0V for periods of up to 20ns. Maximum DC

voltage on input and I/O pins is VCC +0.5V. During

voltage transitions, input or I/O pins may overshoot to

VCC +2.0V for periods up to 20ns.

Ambient Temperature (TA) . . . . . . . . . . . . . . 0°C to +70°C

VCC Supply Voltages

VCC for all devices . . . . . . . . . . . . . . . . . . +2.7V to +3.6V

Operating ranges define those limits between which the

functionally of the device is guaranteed.

2. Minimum DC input voltage on A9,

and

is

-

OE

RESET

and

0.5V. During voltage transitions, A9,

OE

RESET

may overshoot VSS to -2.0V for periods of up to 20ns.

Maximum DC input voltage on A9 is +12.5V which may

overshoot to 14.0V for periods up to 20ns. (

N/A on 32-pin PLCC & (s)TSOP)

is

RESET

3. No more than one output is shorted at a time. Duration

of the short circuit should not be greater than one

second.

Device Bus Operations

execute the command. The contents of the register serve

as inputs to the internal state machine. The state machine

outputs dictate the function of the device. The appropriate

device bus operations table lists the inputs and control

levels required, and the resulting output. The following

subsections describe each of these operations in further

detail.

This section describes the requirements and use of the

device bus operations, which are initiated through the

internal command register. The command register itself

does not occupy any addressable memory location. The

register is composed of latches that store the commands,

along with the address and data information needed to

Table 1. A29L004 Device Bus Operations

RESET

(N/A 32-pin PLCC, (s)TSOP)

Operation

A0 – A18

I/O0 - I/O7

WE

CE

OE

Read

Write

CMOS Standby

Output Disable

Hardware Reset

Sector Protect

(See Note 2)

Sector Unprotect

(See Note 2)

L

H

X

H

X

H

L

X

H

X

H

AIN

X

DOUT

DIN

High-Z

VCC ± 0.3 V

L

X

H

L

Sector Address,

A6=L, A1=H, A0=L

Sector Address,

A6=H, A1=H, A0=L

L

X

H

X

L

X

VID

DIN

Temporary Sector

Unprotect

AIN

Legend:

L = Logic Low = VIL, H = Logic High = VIH, VID = 12.0 ± 0.5V, X = Don't Care, DIN = Data In, DOUT = Data Out, AIN = Address In

Notes:

1. See the “Sector Protection/Unprotection” section and Temporary Sector Unprotect for more information.

2. This function is not available on 32-pin PLCC & (s)TSOP packages.

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A29L004 Series

Requirements for Reading Array Data

Program and Erase Operation Status

To read array data from the outputs, the system must drive

During an erase or program operation, the system may

check the status of the operation by reading the status bits

on I/O7 - I/O0. Standard read cycle timings and ICC read

specifications apply. Refer to "Write Operation Status" for

more information, and to each AC Characteristics section

for timing diagrams.

the

and

pins to VIL.

is the power control and

CE

OE

CE

selects the device.

is the output control and gates

OE

array data to the output pins.

should remain at VIH all

WE

the time during read operation. The internal state machine

is set for reading array data upon device power-up, or after

a hardware reset. This ensures that no spurious alteration

of the memory content occurs during the power transition.

No command is necessary in this mode to obtain array

data. Standard microprocessor read cycles that assert valid

addresses on the device address inputs produce valid data

on the device data outputs. The device remains enabled for

read access until the command register contents are

altered.

Standby Mode

When the system is not reading or writing to the device, it

can place the device in the standby mode. In this mode,

current consumption is greatly reduced, and the outputs are

placed in the high impedance state, independent of the

input.

OE

The device enters the CMOS standby mode when the

CE

See "Reading Array Data" for more information. Refer to the

AC Read Operations table for timing specifications and to

the Read Operations Timings diagram for the timing

waveforms, lCC1 in the DC Characteristics table represents

the active current specification for reading array data.

&

pins (

only on 32-pin PLCC & (s)TSOP

CE

RESET

packages) are both held at VCC ± 0.3V. (Note that this is a

more restricted voltage range than VIH.) If and

CE

RESET

(N/A on 32-pin PLCC & (s)TSOP packages) are held at VIH,

but not within VCC ± 0.3V, the device will be in the standby

mode, but the standby current will be greater. The device

requires the standard access time (tCE) before it is ready to

read data.

If the device is deselected during erasure or programming,

the device draws active current until the operation is

completed.

Writing Commands/Command Sequences

To write a command or command sequence (which

includes programming data to the device and erasing

sectors of memory), the system must drive

and

to

CE

WE

VIL, and

to VIH. The device features an Unlock Bypass

OE

ICC3 and ICC4 in the DC Characteristics tables represent the

standby current specification.

mode to facilitate faster programming. Once the device

enters the Unlock Bypass mode, only two write cycles are

required to program a byte, instead of four.

Automatic Sleep Mode

The “Byte Program Command Sequence” section has

details on programming data to the device using both

standard and Unlock Bypass command sequence. An

erase operation can erase one sector, multiple sectors, or

the entire device. The Sector Address Tables indicate the

address range that each sector occupies. A "sector

address" consists of the address inputs required to uniquely

select a sector. See the "Command Definitions" section for

The automatic sleep mode minimizes Flash device energy

consumption. The device automatically enables this mode

when addresses remain stable for tACC +30ns. The

automatic sleep mode is independent of the

,

and

CE WE

control signals. Standard address access timings

OE

provide new data when addresses are changed. While in

sleep mode, output data is latched and always available to

the system. ICC4 in the DC Characteristics table represents

the automatic sleep mode current specification.

details on erasing

a sector or the entire chip, or

suspending/resuming the erase operation.

After the system writes the autoselect command sequence,

the device enters the autoselect mode. The system can

then read autoselect codes from the internal register (which

is separate from the memory array) on I/O7 - I/O0. Standard

read cycle timings apply in this mode. Refer to the

"Autoselect Mode" and "Autoselect Command Sequence"

sections for more information.

Output Disable Mode

When the

input is at VIH, output from the device is

OE

disabled. The output pins are placed in the high impedance

state.

ICC2 in the DC Characteristics table represents the active

current specification for the write mode. The "AC

Characteristics" section contains timing specification tables

and timing diagrams for write operations.

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AMIC Technology, Corp.

A29L004 Series

The

pin may be tied to the system reset circuitry. A

RESET

: Hardware Reset Pin (N/A on 32-pin PLCC &

(s)TSOP packages)

RESET

system reset would thus also reset the Flash memory,

enabling the system to read the boot-up firmware from the

Flash memory.

The pin provides a hardware method of resetting

RESET

the device to reading array data. When the system drives

the pin low for at least a period of tRP, the device

If

is asserted during a program or erase operation,

RESET

the RY/

pin remains a “0” (busy) until the internal reset

BY

immediately terminates any operation in progress, tristates

all data output pins, and ignores all read/write attempts for

operation is complete, which requires a time tREADY (during

Embedded Algorithms). The system can thus monitor

the duration of the

pulse. The device also resets

RESET

RY/

to determine whether the reset operation is

BY

complete. If

the internal state machine to reading array data. The

operation that was interrupted should be reinitiated once

the device is ready to accept another command sequence,

to ensure data integrity.

is asserted when a program or erase

RESET

operation is not executing (RY/

operation is completed within a time of tREADY (not during

Embedded Algorithms). The system can read data tRH after

pin is “1”), the reset

BY

Current is reduced for the duration of the

pulse.

RESET

the

pin return to VIH.

RESET

When

is held at VSS ± 0.3V, the device draws

RESET

Refer to the AC Characteristics tables for

parameters and diagram.

RESET

CMOS standby current (ICC4 ). If

RESET

not within VSS ± 0.3V, the standby current will be greater.

is held at VIL but

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AMIC Technology, Corp.

A29L004 Series

Table 2. A29L004 Top Boot Block Sector Address Table

Sector Size

(Kbytes)

Address Range

(in hexadecimal)

00000h - 0FFFFh

10000h - 1FFFFh

20000h - 2FFFFh

30000h - 3FFFFh

40000h - 4FFFFh

50000h - 5FFFFh

60000h - 6FFFFh

70000h - 77FFFh

78000h - 79FFFh

7A000h - 7BFFFh

7C000h - 7FFFFh

Sector

A18

A17

A16

A15

A14

A13

SA0

SA1

SA2

SA3

SA4

SA5

SA6

SA7

SA8

SA9

SA10

0

1

0

1

0

1

0

1

0

1

0

1

0

1

X

0

X

0

X

0

64

32

8

1

0

1

8

1

X

16

Table 3. A29L004 Bottom Boot Block Sector Address Table

Sector Size

(Kbytes)

Address Range

(in hexadecimal)

00000h - 03FFFh

04000h - 05FFFh

06000h - 07FFFh

08000h - 0FFFFh

10000h - 1FFFFh

20000h - 2FFFFh

30000h - 3FFFFh

40000h - 4FFFFh

50000h - 5FFFFh

60000h - 6FFFFh

70000h - 7FFFFh

Sector

A18

A17

A16

A15

A14

A13

SA0

SA1

SA2

SA3

SA4

SA5

SA6

SA7

SA8

SA9

SA10

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

X

0

16

8

0

1

8

1

X

32

64

X

Autoselect Mode

addition, when verifying sector protection, the sector

address must appear on the appropriate highest order

address bits. Refer to the corresponding Sector Address

Tables. The Command Definitions table shows the

remaining address bits that are don't care. When all

necessary bits have been set as required, the

The autoselect mode provides manufacturer and device

identification, and sector protection verification, through

identifier codes output on I/O7 - I/O0. This mode is

primarily intended for programming equipment to

automatically match a device to be programmed with its

corresponding programming algorithm. However, the

autoselect codes can also be accessed in-system

through the command register.

When using programming equipment, the autoselect

mode requires VID (11.5V to 12.5 V) on address pin A9.

Address pins A6, A1, and A0 must be as shown in

Autoselect Codes (High Voltage Method) table. In

programming

equipment

may

then

read

the

corresponding identifier code on I/O7 - I/O0.To access the

autoselect codes in-system, the host system can issue

the autoselect command via the command register, as

shown in the Command Definitions table. This method

does not require VID. See "Command Definitions" for

details on using the autoselect mode.

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AMIC Technology, Corp.

A29L004 Series

Table 4. A29L004 Autoselect Codes (High Voltage Method)

Description

A18 A12

to to

A13 A10

A9

A8

to

A7

X

A6

A5

to

A2

X

A1

A0

I/O7

to

WE

CE

OE

I/O0

37h

Manufacturer ID: AMIC

Device ID: A29L004

L

H

X

VID

L

X

H

34h

(Top Boot Block)

Device ID: A29L004

(Bottom Boot Block)

B5h

7Fh

L

H

X

VID

X

L

X

L

H

Continuation ID

H

01h

(protected)

Sector Protection Verification

L

H

SA

X

VID

X

L

X

H

L

00h

(unprotected)

L=Logic Low= VIL, H=Logic High=VIH, SA=Sector Address, X=Don’t Care.

Note: The autoselect codes may also be accessed in-system via command sequences.

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AMIC Technology, Corp.

A29L004 Series

Sector Protection/Unprotection

Temporary Sector Unprotect (N/A on 32-pin PLCC &

(s)TSOP packages)

The hardware sector protection feature disables both

program and erase operations in any sector. The hardware

sector unprotection feature re-enables both program and

erase operations in previously protected sectors.

It is possible to determine whether a sector is protected or

unprotected. See “Autoselect Mode” for details.

This feature allows temporary unprotection of previous

protected sectors to change data in-system. The Sector

Unprotect mode is activated by setting the

pin to VID.

RESET

During this mode, formerly protected sectors can be

programmed or erased by selecting the sector addresses.

Sector protection / unprotection can be implemented via two

methods. The primary method requires VID on the

Once VID is removed from the

pin, all the previously

RESET

protected sectors are protected again. Figure 1 shows the

algorithm, and the Temporary Sector Unprotect diagram

shows the timing waveforms, for this feature.

pin only (N/A on 32-pin PLCC & (s)TSOP packages),

RESET

and can be implemented either in-system or via programming

equipment. Figure 2 shows the algorithm and the Sector

Protect / Unprotect Timing Diagram illustrates the timing

waveforms for this feature. This method uses standard

microprocessor bus cycle timing. For sector unprotect, all

unprotected sectors must first be protected prior to the first

sector unprotect write cycle. The alternate method must be

implemented using programming equipment. The procedure

requires a high voltage (VID) on address pin A9 and the

control pins.

START

RESET = VID

(Note 1)

The device is shipped with all sectors unprotected.

It is possible to determine whether a sector is protected or

unprotected. See "Autoselect Mode" for details.

Perform Erase or

Program Operations

Hardware Data Protection

The requirement of command unlocking sequence for

programming or erasing provides data protection against

inadvertent writes (refer to the Command Definitions table).

In addition, the following hardware data protection measures

prevent accidental erasure or programming, which might

otherwise be caused by spurious system level signals during

VCC power-up transitions, or from system noise. The device is

powered up to read array data to avoid accidentally writing

data to the array.

RESET = VIH

Temporary Sector

Unprotect

Write Pulse "Glitch" Protection

Completed (Note 2)

Noise pulses of less than 5ns (typical) on

do not initiate a write cycle.

,

or

OE CE

WE

Notes:

Logical Inhibit

1. All protected sectors unprotected.

2. All previously protected sectors are protected once again.

Write cycles are inhibited by holding any one of

=VIL,

OE

CE

= VIH or

= VIH. To initiate a write cycle,

and

CE

WE

Figure 1. Temporary Sector Unprotect Operation

must be a logical zero while

is a logical one.

OE

WE

Power-Up Write Inhibit

If

=

= VIL and

= VIH during power up, the

OE

WE

device does not accept commands on the rising edge of

. The internal state machine is automatically reset to

CE

WE

reading array data on the initial power-up.

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AMIC Technology, Corp.

A29L004 Series

START

Protect all sectors:

The indicated portion of

the sector protect

PLSCNT=1

algorithm must be

performed for all

RESET=V ^ID

Wait 1 us

RESET=V ^ID

Wait 1 us

unprotected sectors prior

to issuing the first sector

unprotect address

No

Temporary Sector

Unprotect Mode

First Write

Cycle=60h?

First Write

Cycle=60h?

Temporary Sector

Unprotect Mode

Yes

Set up sector

address

All sectors

protected?

Sector Protect

Write 60h to sector

address with A6=0,

A1=1, A0=0

Yes

Set up first sector

address

Sector Unprotect:

Write 60h to sector

address with A6=1,

A1=1, A0=0

Wait 150 us

Verify Sector

Protect: Write 40h

to sector address

with A6=0, A1=1,

A0=0

Reset

PLSCNT=1

Increment

PLSCNT

Wait 15 ms

Verify Sector

Unprotect : Write

40h to sector

address with A6=1,

A1=1, A0=0

Read from

sector address

with A6=0,

Increment

PLSCNT

A1=1, A0=0

No

Read from sector

address with A6=1,

A1=1, A0=0

No

PLSCNT

=25?

Data=01h?

Yes

No

Set up

next sector

address

Yes

No

PLSCNT=

1000?

Yes

Data=00h?

Yes

Protect another

sector?

Device failed

Yes

No

Remove V ^ID

from RESET

No

Last sector

verified?

Device failed

Write reset

command

Yes

Remove V ^ID

from RESET

Sector Protect

complete

Sector Protect

Algorithm

Sector Unprotect

Algorithm

Write reset

Command

Sector Unprotect

complete

Figure 2. In-System Sector Protect/Unprotect Algorithms

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AMIC Technology, Corp.

A29L004 Series

Command Definitions

Autoselect Command Sequence

Writing specific address and data commands or sequences

into the command register initiates device operations. The

Command Definitions table defines the valid register

command sequences. Writing incorrect address and data

values or writing them in the improper sequence resets the

device to reading array data.

The autoselect command sequence allows the host system to

access the manufacturer and devices codes, and determine

whether or not a sector is protected. The Command Definitions

table shows the address and data requirements. This method

is an alternative to that shown in the Autoselect Codes (High

Voltage Method) table, which is intended for PROM

programmers and requires VID on address bit A9.

The autoselect command sequence is initiated by writing two

unlock cycles, followed by the autoselect command. The

device then enters the autoselect mode, and the system may

read at any address any number of times, without initiating

another command sequence.

All addresses are latched on the falling edge of

or

,

CE

WE

whichever happens later. All data is latched on the rising edge

of or , whichever happens first. Refer to the

WE

CE

appropriate timing diagrams in the "AC Characteristics"

section.

A read cycle at address XX00h retrieves the manufacturer

code and another read cycle at XX03h retrieves the

continuation code. A read cycle at address XX01h returns the

device code. A read cycle containing a sector address (SA)

and the address 02h in returns 01h if that sector is protected,

or 00h if it is unprotected. Refer to the Sector Address tables

for valid sector addresses.

Reading Array Data

The device is automatically set to reading array data after

device power-up. No commands are required to retrieve data.

The device is also ready to read array data after completing

an Embedded Program or Embedded Erase algorithm. After

the device accepts an Erase Suspend command, the device

enters the Erase Suspend mode. The system can read array

data using the standard read timings, except that if it reads at

an address within erase-suspended sectors, the device

The system must write the reset command to exit the

autoselect mode and return to reading array data.

Byte Program Command Sequence

outputs status data. After completing

a programming

operation in the Erase Suspend mode, the system may once

again read array data with the same exception. See "Erase

Suspend/Erase Resume Commands" for more information on

this mode.

The system must issue the reset command to re-enable the

device for reading array data if I/O5 goes high, or while in the

autoselect mode. See the "Reset Command" section, next.

See also "Requirements for Reading Array Data" in the

"Device Bus Operations" section for more information. The

Read Operations table provides the read parameters, and

Read Operation Timings diagram shows the timing diagram.

Programming is a four-bus-cycle operation. The program

command sequence is initiated by writing two unlock write

cycles, followed by the program set-up command. The

program address and data are written next, which in turn

initiate the Embedded Program algorithm. The system is not

required to provide further controls or timings. The device

automatically provides internally generated program pulses

and verify the programmed cell margin. Table 5 shows the

address and data requirements for the byte program command

sequence.

When the Embedded Program algorithm is complete, the

device then returns to reading array data and addresses are

longer latched. The system can determine the status of the

Reset Command

Writing the reset command to the device resets the device to

reading array data. Address bits are don't care for this

command. The reset command may be written between the

sequence cycles in an erase command sequence before

erasing begins. This resets the device to reading array data.

Once erasure begins, however, the device ignores reset

commands until the operation is complete.

The reset command may be written between the sequence

cycles in a program command sequence before programming

begins. This resets the device to reading array data (also

applies to programming in Erase Suspend mode). Once

programming begins, however, the device ignores reset

commands until the operation is complete.

program operation by using I/O7, I/O6, or RY/

PLCC & (s)TSOP packages). See “Write Operation Status” for

information on these status bits.

(N/A on 32-pin

BY

Any commands written to the device during the Embedded

Program Algorithm are ignored. Note that a hardware reset

immediately terminates the programming operation. The Byte

Program command sequence should be reinitiated once the

device has reset to reading array data, to ensure data integrity.

Programming is allowed in any sequence and across sector

boundaries. A bit cannot be programmed from a “0” back to a

“1”. Attempting to do so may halt the operation and set I/O5 to

“1”, or cause the

Polling algorithm to indicate the

Data

operation was successful. However, a succeeding read will

show that the data is still “0”. Only erase operations can

convert a “0” to a “1”.

The reset command may be written between the sequence

cycles in an autoselect command sequence. Once in the

autoselect mode, the reset command must be written to

return to reading array data (also applies to autoselect during

Erase Suspend).

If I/O5 goes high during a program or erase operation, writing

the reset command returns the device to reading array data

(also applies during Erase Suspend).

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AMIC Technology, Corp.

A29L004 Series

During the unlock bypass mode, only the Unlock Bypass

Program and Unlock Bypass Reset commands are valid. To

exit the unlock bypass mode, the system must issue the two-

cycle unlock bypass reset command sequence. The first cycle

must contain the data 90h; the second cycle the data 00h.

Addresses are don’t care for both cycle. The device returns to

reading array data.

Figure 3 illustrates the algorithm for the program operation.

See the Erase/Program Operations in “AC Characteristics” for

parameters, and to Program Operation Timings for timing

diagrams.

START

Write Program

Command

Sequence

Data Poll

from System

Chip Erase Command Sequence

Embedded

Program

algorithm in

progress

Chip erase is a six-bus-cycle operation. The chip erase

command sequence is initiated by writing two unlock cycles,

followed by a set-up command. Two additional unlock write

cycles are then followed by the chip erase command, which in

turn invokes the Embedded Erase algorithm. The device does

not require the system to preprogram prior to erase. The

Embedded Erase algorithm automatically preprograms and

verifies the entire memory for an all zero data pattern prior to

electrical erase. The system is not required to provide any

controls or timings during these operations. The Command

Definitions table shows the address and data requirements for

the chip erase command sequence.

Verify Data ?

Yes

No

Any commands written to the chip during the Embedded

Erase algorithm are ignored. The system can determine the

status of the erase operation by using I/O7, I/O6, or I/O2. See

"Write Operation Status" for information on these status bits.

When the Embedded Erase algorithm is complete, the device

returns to reading array data and addresses are no longer

latched.

Figure 4 illustrates the algorithm for the erase operation. See

the Erase/Program Operations tables in "AC Characteristics"

for parameters, and to the Chip/Sector Erase Operation

Timings for timing waveforms.

Increment Address

Last Address ?

Yes

Programming

Completed

Note : See the appropriate Command Definitions table for

program command sequence.

Sector Erase Command Sequence

Sector erase is a six-bus-cycle operation. The sector erase

command sequence is initiated by writing two unlock cycles,

followed by a set-up command. Two additional unlock write

cycles are then followed by the address of the sector to be

erased, and the sector erase command. The Command

Definitions table shows the address and data requirements for

the sector erase command sequence.

The device does not require the system to preprogram the

memory prior to erase. The Embedded Erase algorithm

automatically programs and verifies the sector for an all zero

data pattern prior to electrical erase. The system is not

required to provide any controls or timings during these

operations.

After the command sequence is written, a sector erase time-

out of 50ms begins. During the time-out period, additional

sector addresses and sector erase commands may be written.

Loading the sector erase buffer may be done in any

sequence, and the number of sectors may be from one sector

to all sectors. The time between these additional cycles must

be less than 50ms, otherwise the last address and command

might not be accepted, and erasure may begin. It is

recommended that processor interrupts be disabled during

this time to ensure all commands are accepted. The interrupts

Figure 3. Program Operation

Unlock Bypass Command Sequence

The unlock bypass feature allows the system to program

bytes or words to the device faster than using the standard

program command sequence. The unlock bypass command

sequence is initiated by first writing two unlock cycles. This is

followed by a third write cycle containing the unlock bypass

command, 20h. The device then enters the unlock bypass

mode.

A two-cycle unlock bypass program command

sequence is all that is required to program in this mode. The

first cycle in this sequence contains the unlock bypass

program command, A0h; the second cycle contains the

program address and data. Additional data is programmed in

the same manner. This mode dispenses with the initial two

unlock cycles required in the standard program command

sequence, resulting in faster total programming time. Table 5

shows the requirements for the command sequence.

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AMIC Technology, Corp.

A29L004 Series

can be re-enabled after the last Sector Erase command is

written. If the time between additional sector erase commands

can be assumed to be less than 50ms, the system need not

monitor I/O3. Any command other than Sector Erase or Erase

Suspend during the time-out period resets the device to

reading array data. The system must rewrite the command

sequence and any additional sector addresses and

commands.

After an erase-suspended program operation is complete, the

system can once again read array data within non-suspended

sectors. The system can determine the status of the program

operation using the I/O7 or I/O6 status bits, just as in the

standard program operation. See "Write Operation Status" for

more information.

The system may also write the autoselect command

sequence when the device is in the Erase Suspend mode.

The device allows reading autoselect codes even at

addresses within erasing sectors, since the codes are not

stored in the memory array. When the device exits the

autoselect mode, the device reverts to the Erase Suspend

mode, and is ready for another valid operation. See

"Autoselect Command Sequence" for more information.

The system must write the Erase Resume command (address

bits are "don't care") to exit the erase suspend mode and

continue the sector erase operation. Further writes of the

Resume command are ignored. Another Erase Suspend

command can be written after the device has resumed

erasing.

The system can monitor I/O3 to determine if the sector erase

timer has timed out. (See the " I/O3: Sector Erase Timer"

section.) The time-out begins from the rising edge of the final

pulse in the command sequence.

WE

Once the sector erase operation has begun, only the Erase

Suspend command is valid. All other commands are ignored.

When the Embedded Erase algorithm is complete, the device

returns to reading array data and addresses are no longer

latched. The system can determine the status of the erase

operation by using I/O7, I/O6, or I/O2. Refer to "Write

Operation Status" for information on these status bits.

4 illustrates the algorithm for the erase operation. Refer to the

Erase/Program Operations tables in the "AC Characteristics"

section for parameters, and to the Sector Erase Operations

Timing diagram for timing waveforms.

START

Erase Suspend/Erase Resume Commands

The Erase Suspend command allows the system to interrupt

a sector erase operation and then read data from, or program

data to, any sector not selected for erasure. This command is

valid only during the sector erase operation, including the

50ms time-out period during the sector erase command

sequence. The Erase Suspend command is ignored if written

during the chip erase operation or Embedded Program

algorithm. Writing the Erase Suspend command during the

Sector Erase time-out immediately terminates the time-out

period and suspends the erase operation. Addresses are

"don't cares" when writing the Erase Suspend command.

When the Erase Suspend command is written during a sector

erase operation, the device requires a maximum of 20ms to

suspend the erase operation. However, when the Erase

Suspend command is written during the sector erase time-

out, the device immediately terminates the time-out period

and suspends the erase operation.

Write Erase

Command

Sequence

Data Poll

from System

Embedded

Erase

algorithm in

progress

No

Data = FFh ?

Yes

After the erase operation has been suspended, the system

can read array data from or program data to any sector not

selected for erasure. (The device "erase suspends" all sectors

selected for erasure.) Normal read and write timings and

command definitions apply. Reading at any address within

erase-suspended sectors produces status data on I/O7 - I/O0.

The system can use I/O7, or I/O6 and I/O2 together, to

determine if a sector is actively erasing or is erase-

suspended. See "Write Operation Status" for information on

these status bits.

Erasure Completed

Note :

1. See the appropriate Command Definitions table for erase

command sequences.

2. See "I/O3 : Sector Erase Timer" for more information.

Figure 4. Erase Operation

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AMIC Technology, Corp.

A29L004 Series

Table 5. A29L004 Command Definitions

Bus Cycles (Notes 2 - 5)

Third Fourth

Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data

RA RD

Command Sequence

(Note 1)

First

Second

Fifth

Sixth

Read (Note 6)

Reset (Note 7)

Manufacturer ID

1

4

XXX F0

555 AA

2AA 55

555

90 X00

37

34

Device ID,

4

555 AA

90

X01

Top Boot Block

Device ID,

4

555 AA

2AA

55

555

90

X01

X03

B5

7F

Bottom Boot Block

Continuation ID

2AA 55

555 90

Sector Protect Verify

(Note 9)

(SA) XX00

4

555 AA

2AA 55

X02

PA

XX01

PD

Program

4

3

2AA 55

555 A0

555 20

Unlock Bypass

555

AA

Unlock Bypass Program (Note 10)

Unlock Bypass Reset (Note 11)

Chip Erase

2

6

XXX A0

XXX 90

555 AA

PA

PD

00

XXX

2AA 55

555 80

555

AA

2AA 55

555

SA

10

30

Sector Erase

555

AA

555

80

555 AA

Erase Suspend (Note 12)

Erase Resume (Note 13)

1

XXX B0

XXX 30

Legend:

X = Don't care

RA = Address of the memory location to be read.

RD = Data read from location RA during read operation.

PA = Address of the memory location to be programmed. Addresses latch on the falling edge of the

whichever happens later.

or

pulse,

CE

WE

PD = Data to be programmed at location PA. Data latches on the rising edge of

or

pulse, whichever happens first.

CE

WE

SA = Address of the sector to be verified (in autoselect mode) or erased. Address bits A18 - A13 select a unique sector.

Note:

1. See Table 1 for description of bus operations.

2. All values are in hexadecimal.

3. Except when reading array or autoselect data, all bus cycles are write operation.

4. Address bits A18 - A11 are don't cares for unlock and command cycles, unless SA or PA required.

5. No unlock or command cycles required when reading array data.

6. The Reset command is required to return to reading array data when device is in the autoselect mode, or if I/O5 goes high

(while the device is providing status data).

7. The fourth cycle of the autoselect command sequence is a read cycle.

8. The data is 00h for an unprotected sector and 01h for a protected sector. See “Autoselect Command Sequence” for more

information.

9. The Unlock Bypass command is required prior to the Unlock Bypass Program command.

10. The Unlock Bypass Reset command is required to return to reading array data when the device is in the unlock bypass

mode.

11. The system may read and program in non-erasing sectors, or enter the autoselect mode, when in the Erase Suspend mode.

12. The Erase Resume command is valid only during the Erase Suspend mode.

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AMIC Technology, Corp.

A29L004 Series

Write Operation Status

Several bits, I/O2, I/O3, I/O5, I/O6, I/O7, RY/

in the A29L004 to determine the status of a write operation

are provided

BY

START

(RY/ pin is not available on 32-pin PLCC & (s)TSOP

BY

packages). Table 6 and the following subsections describe

the functions of these status bits. I/O7, I/O6 and RY/

each offer a method for determining whether a program or

erase operation is complete or in progress. These three bits

are discussed first.

BY

Read I/O7-I/O0

Address = VA

I/O7:

Polling

Data

Yes

The

Polling bit, I/O7, indicates to the host system

Data

I/O7 = Data ?

No

whether an Embedded Algorithm is in progress or

completed, or whether the device is in Erase Suspend.

Polling is valid after the rising edge of the final

Data

pulse in the program or erase command sequence.

WE

During the Embedded Program algorithm, the device

outputs on I/O7 the complement of the datum programmed

to I/O7. This I/O7 status also applies to programming during

Erase Suspend. When the Embedded Program algorithm is

complete, the device outputs the datum programmed to

I/O7. The system must provide the program address to read

valid status information on I/O7. If a program address falls

No

I/O5 = 1?

Yes

within a protected sector,

Polling on I/O7 is active for

Data

approximately 2ms, then the device returns to reading array

data.

Read I/O7 - I/O0

Address = VA

During the Embedded Erase algorithm,

Polling

Data

produces a "0" on I/O7. When the Embedded Erase

algorithm is complete, or if the device enters the Erase

Suspend mode,

Polling produces a "1" on I/O7.This is

Data

Yes

analogous to the complement/true datum output described

for the Embedded Program algorithm: the erase function

changes all the bits in a sector to "1"; prior to this, the

device outputs the "complement," or "0." The system must

provide an address within any of the sectors selected for

erasure to read valid status information on I/O7.

I/O7 = Data ?

No

After an erase command sequence is written, if all sectors

selected for erasing are protected,

Polling on I/O7 is

Data

FAIL

PASS

active for approximately 100ms, then the device returns to

reading array data. If not all selected sectors are protected,

the Embedded Erase algorithm erases the unprotected

sectors, and ignores the selected sectors that are

protected.

When the system detects I/O7 has changed from the

complement to true data, it can read valid data at I/O7 - I/O0

on the following read cycles. This is because I/O7 may

change asynchronously with I/O0 - I/O6 while Output Enable

Note :

1. VA = Valid address for programming. During a sector

erase operation, a valid address is an address within any

sector selected for erasure. During chip erase, a valid

address is any non-protected sector address.

2. I/O7 should be rechecked even if I/O5 = "1" because

I/O7 may change simultaneously with I/O5.

(

) is asserted low. The

Polling Timings (During

Data

OE

Embedded Algorithms) in the "AC Characteristics" section

illustrates this. Table 6 shows the outputs for Polling

Data

Polling algorithm.

Figure 5. Data Polling Algorithm

on I/O7. Figure 5 shows the

Data

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AMIC Technology, Corp.

A29L004 Series

I/O2: Toggle Bit II

RY/

: Read/

(N/A on 32-pin PLCC & (s)TSOP

Busy

BY

packages)

The "Toggle Bit II" on I/O2, when used with I/O6, indicates

whether a particular sector is actively erasing (that is, the

Embedded Erase algorithm is in progress), or whether that

sector is erase-suspended. Toggle Bit II is valid after the

The RY/

is a dedicated, open-drain output pin that

BY

indicates whether an Embedded algorithm is in progress or

complete. The RY/ status is valid after the rising edge of

BY

pulse in the command sequence. Since

rising edge of the final

I/O2 toggles when the system reads at addresses within

pulse in the command sequence.

WE

the final

WE

those sectors that have been selected for erasure. (The

RY/

is an open-drain output, several RY/

pins can be

BY

system may use either

or

to control the read

CE

OE

tied together in parallel with a pull-up resistor to VCC.

If the output is low (Busy), the device is actively erasing or

programming. (This includes programming in the Erase

Suspend mode.) If the output is high (Ready), the device is

ready to read array data (including during the Erase

Suspend mode), or is in the standby mode.

cycles.) But I/O2 cannot distinguish whether the sector is

actively erasing or is erase-suspended. I/O6, by comparison,

indicates whether the device is actively erasing, or is in

Erase Suspend, but cannot distinguish which sectors are

selected for erasure. Thus, both status bits are required for

sector and mode information. Refer to Table 6 to compare

outputs for I/O2 and I/O6.

Figure 6 shows the toggle bit algorithm in flowchart form,

and the section " I/O2: Toggle Bit II" explains the algorithm.

See also the " I/O6: Toggle Bit I" subsection. Refer to the

Toggle Bit Timings figure for the toggle bit timing diagram.

The I/O2 vs. I/O6 figure shows the differences between I/O2

and I/O6 in graphical form.

Table 6 shows the outputs for RY/

. Refer to “

RESET

BY

Timings”, “Timing Waveforms for Program Operation” and

“Timing Waveforms for Chip/Sector Erase Operation” for

more information.

I/O6: Toggle Bit I

Toggle Bit I on I/O6 indicates whether an Embedded

Program or Erase algorithm is in progress or complete, or

whether the device has entered the Erase Suspend mode.

Toggle Bit I may be read at any address, and is valid after

Reading Toggle Bits I/O6, I/O2

Refer to Figure 6 for the following discussion. Whenever the

system initially begins reading toggle bit status, it must read

I/O7 - I/O0 at least twice in a row to determine whether a

toggle bit is toggling. Typically, a system would note and

store the value of the toggle bit after the first read. After the

second read, the system would compare the new value of

the toggle bit with the first. If the toggle bit is not toggling,

the device has completed the program or erase operation.

The system can read array data on I/O7 - I/O0 on the

following read cycle.

However, if after the initial two read cycles, the system

determines that the toggle bit is still toggling, the system

also should note whether the value of I/O5 is high (see the

section on I/O5). If it is, the system should then determine

again whether the toggle bit is toggling, since the toggle bit

may have stopped toggling just as I/O5 went high. If the

toggle bit is no longer toggling, the device has successfully

completed the program or erase operation. If it is still

toggling, the device did not complete the operation

successfully, and the system must write the reset command

to return to reading array data.

the rising edge of the final

sequence (prior to the program or erase operation), and

during the sector erase time-out.

During an Embedded Program or Erase algorithm operation,

successive read cycles to any address cause I/O6 to toggle.

pulse in the command

WE

(The system may use either

or

to control the read

CE

OE

cycles.) When the operation is complete, I/O6 stops toggling.

After an erase command sequence is written, if all sectors

selected for erasing are protected, I/O6 toggles for

approximately 100ms, then returns to reading array data. If

not all selected sectors are protected, the Embedded Erase

algorithm erases the unprotected sectors, and ignores the

selected sectors that are protected.

The system can use I/O6 and I/O2 together to determine

whether a sector is actively erasing or is erase-suspended.

When the device is actively erasing (that is, the Embedded

Erase algorithm is in progress), I/O6 toggles. When the

device enters the Erase Suspend mode, I/O6 stops toggling.

However, the system must also use I/O2 to determine which

sectors are erasing or erase-suspended. Alternatively, the

The remaining scenario is that the system initially

determines that the toggle bit is toggling and I/O5 has not

gone high. The system may continue to monitor the toggle

bit and I/O5 through successive read cycles, determining the

status as described in the previous paragraph. Alternatively,

it may choose to perform other system tasks. In this case,

the system must start at the beginning of the algorithm when

it returns to determine the status of the operation (top of

Figure 6).

system can use I/O7 (see the subsection on " I/O7 :

Polling").

Data

If a program address falls within a protected sector, I/O6

toggles for approximately 2ms after the program command

sequence is written, then returns to reading array data.

I/O6 also toggles during the erase-suspend-program mode,

and stops toggling once the Embedded Program algorithm

is complete.

The Write Operation Status table shows the outputs for

Toggle Bit I on I/O6. Refer to Figure 6 for the toggle bit

algorithm, and to the Toggle Bit Timings figure in the "AC

Characteristics" section for the timing diagram. The I/O2 vs.

I/O6 figure shows the differences between I/O2 and I/O6 in

graphical form. See also the subsection on " I/O2: Toggle Bit II".

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AMIC Technology, Corp.

A29L004 Series

I/O5: Exceeded Timing Limits

I/O5 indicates whether the program or erase time has

exceeded a specified internal pulse count limit. Under these

conditions I/O5 produces a "1." This is a failure condition

that indicates the program or erase cycle was not

successfully completed.

START

The I/O5 failure condition may appear if the system tries to

program a "1 "to a location that is previously programmed to

"0." Only an erase operation can change a "0" back to a "1."

Under this condition, the device halts the operation, and

when the operation has exceeded the timing limits, I/O5

produces a "1."

Read I/O7-I/O0

(Note 1)

No

Under both these conditions, the system must issue the

reset command to return the device to reading array data.

I/O3: Sector Erase Timer

After writing a sector erase command sequence, the

system may read I/O3 to determine whether or not an erase

operation has begun. (The sector erase timer does not

apply to the chip erase command.) If additional sectors are

selected for erasure, the entire time-out also applies after

each additional sector erase command. When the time-out

is complete, I/O3 switches from "0" to "1." The system may

ignore I/O3 if the system can guarantee that the time

between additional sector erase commands will always be

less than 50ms. See also the "Sector Erase Command

Sequence" section.

Toggle Bit

= Toggle ?

Yes

I/O5 = 1?

Yes

No

After the sector erase command sequence is written, the

Read I/O7 - I/O0

system should read the status on I/O7 (

Polling) or

Data

(Notes 1,2)

Twice

I/O6 (Toggle Bit I) to ensure the device has accepted the

command sequence, and then read I/O3. If I/O3 is "1", the

internally controlled erase cycle has begun; all further

commands (other than Erase Suspend) are ignored until

the erase operation is complete. If I/O3 is "0", the device will

accept additional sector erase commands. To ensure the

command has been accepted, the system software should

check the status of I/O3 prior to and following each

subsequent sector erase command. If I/O3 is high on the

second status check, the last command might not have

been accepted. Table 6 shows the outputs for I/O3.

No

Toggle Bit

= Toggle ?

Yes

Program/Erase

Operation Not

Commplete, Write

Reset Command

Program/Erase

Operation Complete

Notes :

1. Read toggle bit twice to determine whether or not it is

toggling. See text.

2. Recheck toggle bit because it may stop toggling as I/O5

changes to "1". See text.

Figure 6. Toggle Bit Algorithm

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AMIC Technology, Corp.

A29L004 Series

Table 6. Write Operation Status

I/O7

I/O6

I/O5

I/O3

I/O2

RY/

BY

Operation

(Note 1)

(Note 2)

(Note 1)

(N/A on 32-pin PLCC

& (s)TSOP packages)

Standard

Mode

Embedded Program Algorithm

Toggle

No

toggle

0

N/A

No

toggle

0

I/O7

0

Embedded Erase Algorithm

Reading within Erase

0

1

Toggle

0

1

Erase

1

N/A

Toggle

Suspend Suspended Sector

Mode

Reading within Non-Erase

Suspended Sector

Data

I/O7

Data

0

Data

N/A

Data

N/A

1

0

Erase-Suspend-Program

Toggle

Notes:

1. I/O7 and I/O2 require a valid address when reading status information. Refer to the appropriate subsection for further

details.

2. I/O5 switches to “1” when an Embedded Program or Embedded Erase operation has exceeded the maximum timing

limits. See “I/O5: Exceeded Timing Limits” for more information.

Maximum Negative Input Overshoot

20ns

+0.8V

-0.5V

-2.0V

20ns

Maximum Positive Input Overshoot

20ns

VCC+2.0V

VCC+0.5V

2.0V

20ns

PRELIMINARY

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AMIC Technology, Corp.

A29L004 Series

DC Characteristics

CMOS Compatible

Parameter

Parameter Description

Test Description

Min.

Typ.

Max.

Unit

Symbol

ILI

Input Load Current

VIN = VSS to VCC. VCC = VCC Max

VCC = VCC Max, A9 =12.5V

±1.0

mA

ILIT

ILO

A9 Input Load Current

Output Leakage Current

35

VOUT = VSS to VCC. VCC = VCC Max

±1.0

10

4

5 MHz

4

2

= VIL,

= VIH

CE

Byte Mode

OE

1 MHz

5 MHz

1 MHz

VCC Active Read Current

(Notes 1, 2)

ICC1

ICC2

mA

4

2

10

4

= VIL,

CE

Word Mode

= VIH

=VIH

OE

VCC Active Write (Program/Erase)

Current (Notes 2, 3, 4)

20

30

5

mA

= VIL,

= VIH,

CE

OE

ICC3

ICC4

VCC Standby Current (Note 2)

0.2

mA

= VCC ± 0.3V

RESET

VCC Standby Current During Reset

(Note 2) (N/A on 32-pin PLCC &

(s)TSOP packages)

0.2

5

mA

= VSS ± 0.3V

RESET

ICC5

Automatic Sleep Mode

(Note 2, 4, 5)

VIH = VCC ± 0.3V; VIL = VSS ± 0.3V

mA

VIL

VIH

VID

Input Low Level

-0.5

0.8

V

Input High Level

0.7 x VCC

VCC + 0.3

Voltage for Autoselect and

Temporary Unprotect Sector

Output Low Voltage

VCC = 3.3 V

11.5

12.5

0.45

V

VOL

VOH1

VOH2

IOL = 4.0mA, VCC = VCC Min

IOH = -2.0 mA, VCC = VCC Min

IOH = -100 mA, VCC = VCC Min

V

0.85 x VCC

VCC - 0.4

Output High Voltage

Notes:

1. The ICC current listed is typically less than 2 mA/MHz, with

at VIH. Typical VCC is 3.0V.

OE

2. Maximum ICC specifications are tested with VCC = VCC max.

3. ICC active while Embedded Algorithm (program or erase) is in progress.

4. Automatic sleep mode enables the low power mode when addresses remain stable for tACC + 30ns. Typical sleep mode

current is 200nA.

5. Not 100% tested.

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AMIC Technology, Corp.

A29L004 Series

DC Characteristics (continued)

Zero Power Flash

25

20

15

10

5

0

500

1000

1500

2000

2500

3000

3500

4000

Time in ns

Note: Addresses are switching at 1MHz

ICC1 Current vs. Time (Showing Active and Automatic Sleep Currents)

10

8

3.6V

2.7V

6

4

2

0

1

2

3

4

5

Frequency in MHz

Note : T = 25°C

Typical ICC1 vs. Frequency

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AMIC Technology, Corp.

A29L004 Series

AC Characteristics

Read Only Operations

Parameter Symbols

Description

Test Setup

Speed

Unit

JEDEC

Std

-70

-90

Read Cycle Time (Note 1)

Address to Output Delay

tAVAV

tRC

Min.

70

90

ns

tAVQV

tACC

= VIL

Max.

CE

70

90

ns

= VIL

OE

Chip Enable to Output Delay

Output Enable to Output Delay

tELQV

tGLQV

tCE

tOE

Max.

Min.

70

30

0

90

35

0

ns

= VIL

OE

Read

Output Enable Hold

tOEH

Toggle and

Polling

Time (Note 1)

ns

Min.

10

25

10

30

Data

Chip Enable to Output High Z

(Notes 1)

tEHQZ

tGHQZ

tDF

Max.

ns

Output Enable to Output High Z

(Notes 1)

25

0

30

0

Output Hold Time from Addresses,

tAXQX

tOH

Min.

ns

or

, Whichever Occurs First

CE OE

(Note 1)

Notes:

1. Not 100% tested.

2. See Test Conditions and Test Setup for test specifications.

Timing Waveforms for Read Only Operation

tRC

Addresses

CE

Addresses Stable

tACC

tDF

tOE

OE

tOEH

WE

tCE

tOH

High-Z

Output

Output Valid

RESET

RY/BY

0V

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AMIC Technology, Corp.

A29L004 Series

AC Characteristics

Hardware Reset (

, N/A on 32-pin PLCC & (s)TSOP packages)

RESET

Parameter

Description

Test Setup

All Speed Options

Unit

JEDEC

Std

Pin Low (During Embedded

Algorithms) to Read or Write (See Note)

RESET

tREADY

Max

20

ms

Pin Low (Not During Embedded

RESET

Algorithms) to Read or Write (See Note)

tREADY

500

ns

tRP

tRH

Min

500

50

0

ns

ms

Pulse Width

RESET

High Time Before Read (See Note)

Recovery Time

tRB

RY/

BY

tRPD

20

Low to Standby Mode

RESET

Note: Not 100% tested.

Timings

RESET

RY/BY

CE, OE

RESET

tRH

tRP

tReady

Reset Timings NOT during Embedded Algorithms

Reset Timings during Embedded Algorithms

tReady

RY/BY

tRB

CE, OE

RESET

tRP

PRELIMINARY

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AMIC Technology, Corp.

A29L004 Series

Temporary Sector Unprotect (N/A on 32-pin PLCC & (s)TSOP packages)

Parameter

Description

All Speed Options

Unit

ns

JEDEC

Std

tVIDR

VID Rise and Fall Time (See Note)

Min

500

4

Setup Time for Temporary Sector

RESET

Unprotect

tRSP

ms

Note: Not 100% tested.

Temporary Sector Unprotect Timing Diagram

12V

0 or 3V

RESET

tVIDR

Program or Erase Command Sequence

CE

WE

tRSP

RY/BY

PRELIMINARY

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AMIC Technology, Corp.

A29L004 Series

AC Characteristics

Erase and Program Operations

Parameter

Description

Speed

Unit

JEDEC

Std

tWC

tAS

-70

-90

tAVAV

tAVWL

Write Cycle Time (Note 1)

Min.

70

90

ns

Address Setup Time

Address Hold Time

0

tWLAX

tDVWH

tWHDX

tAH

tDS

45

35

45

Data Setup Time

tDH

Data Hold Time

0

tOES

tGHWL

Output Enable Setup Time

Read Recover Time Before Write

tGHWL

(

high to

low)

WE

OE

tELWL

tWHEH

tWLWH

tWHWL

tWHWH1

tCS

tCH

Min.

Typ.

0

ns

ms

Setup Time

Hold Time

CE

tWP

Write Pulse Width

35

tWPH

tWHWH1

Write Pulse Width High

30

5

Byte Programming Operation

(Note 2)

tWHWH2

Sector Erase Operation (Note 2)

Typ.

Min.

0.7

50

sec

tvcs

VCC Set Up Time (Note 1)

ms

tRB

Recovery Time from RY/

BY

(N/A on 32-pin PLCC & (s)TSOP packages)

Program/Erase Valid to RY/ Delay

Min

0

ns

tBUSY

BY

(N/A on 32-pin PLCC & (s)TSOP packages)

90

Notes:

1. Not 100% tested.

2. See the "Erase and Programming Performance" section for more information.

PRELIMINARY

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AMIC Technology, Corp.

A29L004 Series

Timing Waveforms for Program Operation

Program Command Sequence (last two cycles)

Read Status Data (last two cycles)

tWC

tAS

Addresses

CE

PA

555h

PA

tAH

tCH

tWP

OE

tWHWH1

WE

tCS

tWPH

tDS

tDH

Data

A0h

PD

DOUT

Status

tRB

tBUSY

RY/BY

VCC

tVCS

Note :

1. PA = program addrss, PD = program data, Dout is the true data at the program address.

2. Illustration shows device in word mode.

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AMIC Technology, Corp.

A29L004 Series

Timing Waveforms for Chip/Sector Erase Operation

Erase Command Sequence (last two cycles)

Read Status Data

tAS

tWC

SA

VA

Addresses

CE

2AAh

VA

555h for chip erase

tAH

OE

tCH

tWP

WE

tWPH

tDH

tWHWH2

tCS

tDS

In

Progress

Data

55h

30h

10h for chip erase

Complete

tRB

tBUSY

RY/BY

tVCS

VCC

Note :

1. SA = Sector Address (for Sector Erase), VA = Valid Address for reading status data (see "Write Operaion Ststus").

2. Illustratin shows device in word mode.

PRELIMINARY

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AMIC Technology, Corp.

A29L004 Series

Timing Waveforms for

Polling (During Embedded Algorithms)

Data

tRC

Addresses

VA

tACC

tCE

CE

tCH

tOE

OE

tDF

tOEH

WE

tOH

High-Z

Valid Data

I/O7

Complement

Status Data

True

High-Z

I/O0 - I/O6

Valid Data

High-Z

Status Data

tBUSY

RY/BY

Note : VA = Valid Address. Illustation shows first status cycle after command sequence, last status read cycle, and array data

read cycle.

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AMIC Technology, Corp.

A29L004 Series

Timing Waveforms for Toggle Bit (During Embedded Algorithms)

tRC

Addresses

CE

VA

tACC

tCE

tCH

tOE

OE

tDF

tOEH

WE

tOH

I/O6 , I/O2

High-Z

Valid Status

(first read)

Valid Status

Valid Data

tBUSY

(second read)

(stop togging)

RY/BY

Note: VA = Valid Address; not required for I/O6. Illustration shows first two status cycle after command sequence, last status

read cycle, and array data read cycle.

PRELIMINARY

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AMIC Technology, Corp.

A29L004 Series

Timing Waveforms for Sector Protect/Unprotect

VID

VIH

RESET

SA, A6,

A1, A0

Valid*

Status

Sector Protect/Unprotect

Verify

40h

60h

Data

CE

Sector Protect:150us

Sector Unprotect:15ms

1us

WE

OE

Note : For sector protect, A6=0, A1=1, A0=0. For sector unprotect, A6=1, A1=1, A0=0

PRELIMINARY

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AMIC Technology, Corp.

A29L004 Series

Timing Waveforms for I/O2 vs. I/O6

Enter

Erase

Enter Erase

Suspend Program

Erase

Resume

Embedded

Suspend

Erasing

WE

Erase

Suspend

Program

Erase

Erase Suspend

Read

Erase Suspend

Read

Erase

Complete

I/O6

I/O2

I/O2 and I/O6 toggle with OE and CE

Note : Both I/O6 and I/O2 toggle with OE or CE. See the text on I/O6 and I/O2 in the section "Write Operation Status" for

more information.

AC Characteristics

Erase and Program Operations

Alternate

Controlled Writes

CE

Parameter

Description

Speed

Unit

JEDEC

Std

tWC

tAS

-70

-90

tAVAV

tAVEL

tELAX

tDVEH

tEHDX

Write Cycle Time (Note 1)

Min.

70

90

ns

Address Setup Time

Address Hold Time

0

tAH

45

35

45

tDS

Data Setup Time

tDH

Data Hold Time

0

tOES

Output Enable Setup Time

Read Recover Time Before Write

tGHEL

Min.

0

ns

(

High to

Low)

WE

OE

tWLEL

tEHWH

tWS

tWH

Min.

0

ns

Setup Time

WE

Hold Time

WE

CE

tELEH

tEHEL

tCP

tCPH

Min.

Typ.

35

ns

ms

Pulse Width

30

5

Pulse Width High

tWHWH1

Byte Programming Operation (Note 2)

Sector Erase Operation (Note 2)

tWHWH2

Typ.

0.7

sec

Notes:

3. Not 100% tested.

4. See the "Erase and Programming Performance" section for more information.

PRELIMINARY

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AMIC Technology, Corp.

A29L004 Series

Timing Waveforms for Alternate

Controlled Write Operation

CE

PA for program

SA for sector erase

555 for chip erase

555 for program

2AA for erase

Data Polling

PA

Addresses

tWC

tAS

tAH

tWH

WE

OE

t^{WHWH1 or 2}

tCP

tBUSY

tCPH

tDH

CE

tWS

tDS

Data

I/O7

D^OUT

tRH

A0 for program

55 for erase

PD for program

30 for sector erase

10 for chip erase

RESET

RY/BY

Note :

1. PA = Program Address, PD = Program Data, SA = Sector Address, I/O ⁷= Complement of Data Input, D^OUT= Array Data.

2. Figure indicates the last two bus cycles of the command sequence.

Erase and Programming Performance

Parameter

Sector Erase Time

Typ. (Note 1)

Max. (Note 2)

Unit

sec

ms

Comments

1.0

10

35

8

Excludes 00h programming

prior to erasure

Chip Erase Time

Byte Programming Time

300

33

Excludes system-level

overhead (Note 5)

Chip Programming Time (Note 3)

11

sec

Notes:

1. Typical program and erase times assume the following conditions: 25°C, 3.0V VCC, 10,000 cycles. Additionally,

programming typically assumes checkerboard pattern.

2. Under worst case conditions of 90°C, VCC = 2.7V, 100,000 cycles.

3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes

program faster than the maximum byte program time listed. If the maximum byte program time given is exceeded, only

then does the device set I/O5 = 1. See the section on I/O5 for further information.

4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.

5. System-level overhead is the time required to execute the four-bus-cycle command sequence for programming. See

Table 5 for further information on command definitions.

6. The device has a guaranteed minimum erase and program cycle endurance of 10,000 cycles.

PRELIMINARY

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AMIC Technology, Corp.

A29L004 Series

Latch-up Characteristics

Description

Min.

Max.

VCC+1.0V

+100 mA

12.5V

Input Voltage with respect to VSS on all I/O pins

VCC Current

-1.0V

-100 mA

-1.0V

Input voltage with respect to VSS on all pins except I/O pins

(including A9,

and

)

RESET

OE

Includes all pins except VCC. Test conditions: VCC = 3.0V, one pin at time.

TSOP Pin Capacitance

Parameter Symbol

Parameter Description

Input Capacitance

Test Setup

VIN=0

Typ.

6

Max.

7.5

12

Unit

pF

CIN

COUT

CIN2

Output Capacitance

VOUT=0

VIN=0

8.5

7.5

pF

Control Pin Capacitance

9

pF

Notes:

1. Sampled, not 100% tested.

2. Test conditions TA = 25°C, f = 1.0MHz

PLCC Pin Capacitance

Parameter Symbol

Parameter Description

Test Setup

VIN=0

Typ.

Max.

6

Unit

pF

CIN

COUT

CIN2

Input Capacitance

4

8

Output Capacitance

Control Pin Capacitance

VOUT=0

VPP=0

12

pF

12

pF

Notes:

3. Sampled, not 100% tested.

Test conditions TA = 25°C, f = 1.0MHz

Data Retention

Parameter

Test Conditions

150°C

Min

10

Unit

Years

Minimum Pattern Data Retention Time

20

125°C

PRELIMINARY

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AMIC Technology, Corp.

A29L004 Series

Test Conditions

Test Specifications

Test Condition

-70

-90

Unit

Output Load

1 TTL gate

Output Load Capacitance, CL(including jig capacitance)

Input Rise and Fall Times

30

5

100

5

pF

ns

V

Input Pulse Levels

0.0 - 3.0

1.5

0.0 - 3.0

1.5

Input timing measurement reference levels

Output timing measurement reference levels

V

1.5

V

Test Setup

3.3 V

2.7 K

W

Device

Under

Test

Diodes = IN3064 or Equivalent

CL

6.2 KW

PRELIMINARY

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AMIC Technology, Corp.

A29L004 Series

Ordering Information

Top Boot Sector Flash

Active Read

Current

Typ. (mA)

Program/Erase

Current

Standby

Current

Typ. (mA)

Access Time

(ns)

Part No.

Package

Typ. (mA)

A29L004TL-70

A29L004TX-70

32-pin PLCC

32-pin sTSOP

(8mm X 14mm)

70

4

20

0.2

32-pin TSOP

(8mm X 20mm)

A29L004TV-70

A29L004TW-70

A29L004TL-90

40-pin TSOP

32-pin PLCC

32-pin sTSOP

(8mm X 14mm)

A29L004TX-90

90

4

20

0.2

32-pin TSOP

(8mm X 20mm)

A29L004TV-90

A29L004TW-90

40-pin TSOP

Bottom Boot Sector Flash

Active Read

Current

Typ. (mA)

Program/Erase

Current

Standby

Current

Typ. (mA)

Access Time

Part No.

Package

(ns)

Typ. (mA)

A29L004UL-70

A29L004UX-70

32-pin PLCC

32-pin sTSOP

(8mm X 14mm)

70

4

20

0.2

32-pin TSOP

(8mm X 20mm)

A29L004UV-70

A29L004UW-70

A29L004UL-90

40-pin TSOP

32-pin PLCC

32-pin sTSOP

(8mm X 14mm)

A29L004UX-90

90

4

20

0.2

32-pin TSOP

(8mm X 20mm)

A29L004UV-90

A29L004UW-90

40-pin TSOP

PRELIMINARY

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AMIC Technology, Corp.

A29L004 Series

Package Information

TSOP 40L TYPE I (10 X 20mm) Outline Dimensions

unit: inches/mm

A

A2

A1

0.076

C

Pin1

D1

D

Detail "A"

Gage Plane

q

Seating Plane

L

Dimensions in inches

Dimensions in mm

Symbol

Min

-

Nom

Max

0.047

0.006

0.041

Min

Nom

Max

-

A

A1

A2

b

1.20

0.15

1.05

0.27

0.21

-

0.002

0.037

0.05

0.95

0.17

0.10

0.039

1.00

0.0067 0.0087 0.0106

0.22

c

0.004

-

0.0083

-

E

0.394 BSC

0.020 BSC

0.787 BSC

0.724 BSC

0.024

10.00 BSC

0.50 BSC

20.00 BSC

18.40 BSC

0.60

e

D

D1

L

0.020

0.028

0.50

0.70

q

0°

3°

5°

0°

3°

5°

Notes:

1. Dimension D1 and E do not include mold flash.

2. The lead width dimension does not include dambar protrusion.

Total in excess of the lead width dimension at maximum material condition.

Dambar cannot be located on the lower radius of the foot.

PRELIMINARY

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AMIC Technology, Corp.

A29L004 Series

Package Information

PLCC 32L Outline Dimension

unit: inches/mm

HD

D

13

5

14

4

1

32

20

30

29

21

b

e

b

1

GE

y

q

GD

Dimensions in inches

Dimensions in mm

Symbol

Min

-

Nom

-

Max

0.134

-

Min

Nom

-

Max

3.40

A

A1

A2

b1

b

-

0.0185

0.105

0.026

0.016

0.008

0.547

0.447

0.044

0.490

0.390

0.585

0.485

0.075

-

0.47

2.67

0.66

0.41

0.20

13.89

11.35

1.12

12.45

9.91

14.86

12.32

1.91

-

0.110

0.028

0.018

0.010

0.550

0.450

0.050

0.510

0.410

0.590

0.490

0.090

-

0.115

0.032

0.021

0.014

0.553

0.453

0.056

0.530

0.430

0.595

0.495

0.095

0.003

10°

2.80

0.71

0.46

0.254

13.97

11.43

1.27

12.95

10.41

14.99

12.45

2.29

-

2.93

0.81

0.54

0.35

14.05

11.51

1.42

13.46

10.92

15.11

12.57

2.41

0.075

10°

C

D

E

e

GD

GE

HD

HE

L

y

q

0°

-

0°

-

Notes:

1. Dimensions D and E do not include resin fins.

2. Dimensions GD & GE are for PC Board surface mount pad pitch

design reference only.

PRELIMINARY

(October, 2002, Version 0.0)

37

AMIC Technology, Corp.

A29L004 Series

Package Information

TSOP 32L TYPE I (8 X 20mm) Outline Dimensions

unit: inches/mm

D

q

L

LE

Detail "A"

HD

Detail "A"

y

S

b

Dimensions in inches

Dimensions in mm

Symbol

Min

-

Nom

Max

Min

Nom

Max

A

A₁

A₂

b

-

0.047

0.006

0.041

0.011

0.008

0.728

0.319

-

1.20

0.15

1.05

0.27

0.20

18.50

8.10

0.002

0.037

0.007

0.004

0.720

-

0.039

0.009

-

0.05

0.95

0.18

0.11

18.30

-

1.00

0.22

-

c

D

E

0.724

0.315

0.020 BSC

0.787

0.020

0.032

-

18.40

8.00

0.50 BSC

20.00

0.50

0.80

-

e

HD

L

0.779

0.795

0.024

-

19.80

20.20

0.60

-

0.016

0.40

LE

S

-

0.020

0.003

5°

0.50

0.08

5°

y

-

q

0°

Notes:

1. The maximum value of dimension D includes end flash.

2. Dimension E does not include resin fins.

3. Dimension S includes end flash.

PRELIMINARY

(October, 2002, Version 0.0)

38

AMIC Technology, Corp.

A29L004 Series

Package Information

sTSOP 32L TYPE I (8 X 14mm) Outline Dimensions

unit: inches/mm

Pin1

Gage Plane

L

q

D1

Detail "A"

D

Detail "A"

b

e

y

Dimensions in inches

Dimensions in mm

Symbol

Min

-

Nom

Max

Min

Nom

-

Max

-

A

A1

A2

b

0.047

0.006

0.041

1.20

0.15

1.05

0.27

0.21

8.10

-

0.002

0.037

0.05

0.95

0.17

0.10

7.90

-

0.039

1.00

0.22

-

0.0067 0.0087 0.0106

c

0.004

0.311

-

0.0083

0.319

-

E

e

0.315

0.0197

0.551

0.488

0.024

-

8.00

0.50

14.00

12.40

0.60

-

D

D1

L

0.543

0.484

0.020

0.000

0°

0.559

0.492

0.028

0.003

5°

13.80

12.30

0.50

0.00

0°

14.20

12.50

0.70

0.076

5°

y

q

3°

Notes:

1. Dimension E does not include mold flash.

2. Dimension D1 does not include interlead flash.

3. Dimension b does not include dambar protrusion.

PRELIMINARY

(October, 2002, Version 0.0)

39

AMIC Technology, Corp.


型号：	A29L004TL-90
厂家：	AMIC TECHNOLOGY
描述：	512K X 8 Bit CMOS 3.0 Volt-only, Boot Sector Flash Memory 512K ×8位CMOS 3.0伏只，引导扇区闪存闪存
文件：	总39页 (文件大小：370K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

A29L004TL-90 [AMICC]

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