A23L9308L-20 [AMICC]
524,288 X 8 BIT CMOS MASK ROM; 524,288 ×8位CMOS掩膜ROM型号: | A23L9308L-20 |
厂家: | AMIC TECHNOLOGY |
描述: | 524,288 X 8 BIT CMOS MASK ROM |
文件: | 总12页 (文件大小:134K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
A23L9308 Series
Preliminary
524,288 X 8 BIT CMOS MASK ROM
Document Title
524,288 X 8 BIT CMOS MASK ROM
Revision History
Rev. No. History
Issue Date
Remark
0.0
Initial issue
October 2, 2001
Preliminary
PRELIMINARY
(October, 2001, Version 0.0)
AMIC Technology, Inc.
A23L9308 Series
Preliminary
524,288 X 8 BIT CMOS MASK ROM
Features
n524,288 x 8 bit organization
nWide power supply range: +2.7V to +3.6V
nAccess time: 150ns (max.)/3V~3.6V
200ns (max.)/2.7V~3.3V
nCurrent: Operating: 15mA (max.)/3V~3.6V
10mA (max.)/2.7V~3.3V
nMask Programmed for Chip Enable (power-down)
CE/ CE , Output Enable OE/ OE /NC
nThree-state outputs for wired-OR expansion
nFull static operation
nAll inputs and outputs are directly TTL-compatible
nAvailable in 32-pin DIP, 32-pin SOP, 32-pin PLCC
packages or in DICE FORM.
Standby: 25ì A (max.)/3V~3.6V
5ì A (max.)/2.7V~3.3V
General Description
The A23L9308 high-performance Read Only Memory is
configured as 524,288 x 8 bits. It is designed to be
compatible with all microprocessors and similar
applications where high-performance, large-bit storage,
The A23L9308 offers an automatic POWER-DOWN
controlled by the Chip Enable CE/ CE input. When
CE/ CE goes low/high, the device will automatically
POWER-DOWN and remain in a low power STANDBY
and
simple
interfacing
are
important
design
mode as long as CE/ CE remains low/high. A23L9308
considerations. This device is designed for use with
operating voltage from 2.7V to 3.6V.
also offers OE/ OE /NC (Active High or Low or No
Connection), which eliminates bus contention in multiple
bus microprocessor systems.
Pin Configurations
n P-DIP / SOP
n PLCC
VCC
A18
A17
1
2
3
32
31
30
NC
A16
A15
A7
5
29
28
27
26
A14
A13
A8
A12
A7
4
5
6
7
29
28
27
26
A14
A13
A8
A6
A5
6
7
A6
A9
8
9
A4
A3
A5
A4
A3
A9
A11
25
24
A23L9308
8
9
25
24
23
22
A11
A2
A1
10
11
OE/OE/NC
A10
OE/OE/NC
A10
23
22
21
A2
A1
10
11
A0
12
13
CE/CE
O7
CE/CE
O7
O0
A0
O0
O1
12
13
14
15
16
21
20
19
18
17
O6
O5
O4
O3
O2
GND
PRELIMINARY
(October, 2001, Version 0.0)
1
AMIC Technology, Inc.
A23L9308 Series
Block Diagram
ROW
MEMORY CELL
ARRAY
DECODER
DRIVER
524,288 X 8
A0 - A18
ADDRESS
INPUTS
COLUMN
DECODER
DRIVER
COLUMN SELECTOR CIRCUITRY
O0
O1
O2
O3
O4
O5
POWER-DOWN
OR
OUTPUT
ENABLE
CIRCUITRY
CE/CE
OE/OE/NC
O6
O7
PRELIMINARY
(October, 2001, Version 0.0)
2
AMIC Technology, Inc.
A23L9308 Series
Pin Descriptions
Pin No.
Symbol
Description
32L DIP/SOP
32L PLCC
2 - 12, 23,
25 - 31
2 - 12, 23,
25 - 31
A0 - A18
Address Inputs
22
24
22
24
Chip Enable Input (Note 1)
Output Enable (Note 1)
CE/ CE
OE/ OE /NC
O0 - O7
13 - 15,
17 - 21
13 - 15,
17 - 21
Data Outputs
32
16
1
32
16
1
VCC
GND
NC
Power Supply
Ground
No Connection (Note 2)
Notes:
1. This pin is user-definable as active high or active low.
2. NC indicates "No Connection."
Recommended DC Operating Conditions
(TA = 0°C to + 70°C)
Symbol
VCC
GND
VIH
Parameter
Min.
2.7
Max.
Unit
V
Supply Voltage
Ground
3.6
0
0
V
Input High Voltage
Input Low Voltage
0.7* VCC
- 0.5
VCC+0.3
0.8
V
VIL
V
PRELIMINARY (October, 2001, Version 0.0)
3
AMIC Technology, Inc.
A23L9308 Series
Absolute Maximum Ratings*
*Comments
Ambient Operating Temperature . . . . . . . -10°C to + 80°C
Storage Temperature . . . . . . . . . . . . . . -65°C to + 150°C
Supply Voltage to Ground Potential . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to + 7.0V
Output Voltage . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V
Input Voltage . . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . 400mW
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of this
device at these or any other conditions above those
indicated in the operational sections of this specification is
not implied or intended. Exposure to the absolute
maximum rating conditions for extended periods may affect
device reliability.
DC Electrical Characteristics (TA = 0°C to + 70°C, GND = 0V)
3V~3.6V
2.7V~3.3V
Symbol
Parameter
Unit
Conditions
Note
Min.
Max.
Min.
Max.
VOH
VOL
VlH
VlL
Output High Voltage
Output Low Voltage
Input High Voltage
Input Low Voltage
2.15
2.15
V
V
V
V
IOH = -0.4mA (3V)
IOL = 1.6mA (3V)
0.4
0.4
0.7*VCC VCC+0.5 0.7*VCC
VCC+0.5
-0.5
0.6
+5
-0.5
0.6
+5
VCC = max.
VIN = VCC to GND
Input Leakage Current
Output Leakage Current
êlLIú
mA
mA
VCC = max.
VOUT = VCC to GND
+5
+5
1
2
êlLOú
ICC
ISB
Operating Supply Current
15
0.5
25
10
0.3
5
mA
mA
mA
tCYC = min.
Standby Supply Current (TTL)
Standby Supply Current (CMOS)
CE = VIH, CE = VIL
CE = VCC - 0.2V,
CE = 0.2V
ISB1
PRELIMINARY
(October, 2001, Version 0.0)
4
AMIC Technology, Inc.
A23L9308 Series
Capacitance
Symbol
CI
Parameter
Min.
Max.
10
Unit
pF
Test Conditions
Note
Input Capacitance
Output Capacitance
3
TA = 25°C
f = 1.0MHz
CO
10
pF
AC Characteristics (TA = 0°C to +70°C, VCC=3.0V~3.6V for -15, VCC=2.7V~3.3V for -20, GND = 0V)
A23L9308-15
A23L9308-20
Symbol
Parameter
Unit
Note
Min.
Max.
Min.
Max.
tCYC
tAA
Cycle Time
150
200
ns
ns
ns
ns
ns
ns
ns
Address Access Time
150
150
90
200
200
160
tACE
tAOE
tOH
tLZ
Chip Enable Access Time
Output Enable Access Time
Output Hold after Address Change
Output Low Z Delay
10
10
10
10
4, 6
5, 6
tHZ
Output High Z Delay*
70
70
* tHZ is specified from either OE / OE or CE / CE going disabled, whichever occurs first.
Notes:
1. OE/CE = VIL, OE / CE = VIH (Output is unloaded)
2. VIN = VIH/VIL, but OE/CE = VIH, OE / CE = VIL (Output is unloaded)
3. This parameter is periodically sampled and is not 100% tested. All pins, except pins under test, are tied to AC ground.
4. Output LOW impedance delay (tLZ) is measured from CE or OE going active.
5. Output HIGH impedance delay (tHZ) is measured from CE or OE going inactive.
6. This parameter is sampled and not 100% tested.
PRELIMINARY
(October, 2001, Version 0.0)
5
AMIC Technology, Inc.
A23L9308 Series
Timing Waveforms
Propagation Delay from Address (CE/ CE = Active, OE/ OE= Active)
tCYC
ADDRESS
INPUTS
VALID
tAA
tOH
VALID
DATA OUT
Propagation Delay from Chip Enable or Output Enable (Address Valid)
CHIP
ENABLE
VALID
tACE
OUTPUT
ENABLE
VALID
tAOE
tHZ
tLZ
VALID
DATA OUT
tLZ
AC Test Conditions
Applied Voltage
Input Pulse Levels
2.7V~3.6V
0.4V to 2.4V
10 ns
Input Rise and Fall Time
VIN = 1.5V
VOUT = 1.5V
Timing Measurement Reference Level
Output Load
1 TTL gate and CL = 100pF
PRELIMINARY
(October, 2001, Version 0.0)
6
AMIC Technology, Inc.
A23L9308 Series
Function Table
O0 - O7
Mode
CE/ CE
OE/ OE/NC
A
I
A
X
I
Data Out
Hi - Z
Read
Power-down
Output Disable
A
Hi - Z
1. CE/ CE and OE/ OE /NC are mask programmable as either active low, active high, or no connection.
2. "A" means "Active," "I" means "Inactive," and "X" means "Either."
Ordering Information
Part No.
Access Time (ns)
Package
A23L9308-15
A23L9308M-15
A23L9308L-15
A23L9308H-15
A23L9308-20
A23L9308M-20
A23L9308L-20
A23L9308H-20
150
150
150
150
200
200
200
200
32L DIP
32L SOP
32L PLCC
DICE FORM
32L DIP
32L SOP
32L PLCC
DICE FORM
PRELIMINARY
(October, 2001, Version 0.0)
7
AMIC Technology, Inc.
A23L9308 Series
Pad Configurations
8
7
6
5
4
3
2
1
33 32 31 30 29 28 27 26
Y
X
(0,0)
9
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
Pad Location
Coordinate (um)
Coordinate (um)
Pad No.
Pad Name
Pad No.
Pad Name
X
Y
X
Y
1
2
3
4
5
6
VCC
A16
A15
A12
A7
-73.6
1406.3
18
19
20
21
22
23
O3
O4
O5
O6
O7
138.7
261.7
413.2
536.2
687.7
810.7
-1419.7
-1419.7
-1419.7
-1419.7
-1419.7
-1419.2
-259.9
-409.9
-532.9
-682.9
-805.9
1419.2
1419.2
1419.2
1419.2
1419.2
A6
CE/ CE
A10
7
8
A5
A4
-955.9
-1078.9
1419.2
1419.2
24
25
960.7
1083.7
-1419.2
-1419.2
OE/ OE /NC
A11
9
A3
A2
A1
A0
O0
O1
O2
GND
GND
-1079.3
-956.3
-806.3
-683.3
-529.3
-406.3
-254.8
-131.8
-8.8
-1419.7
-1419.2
-1419.2
-1419.2
-1419.7
-1419.7
-1419.7
-1419.7
-1417.7
26
27
28
29
30
31
32
33
1083.3
960.3
810.3
687.3
537.3
414.3
264.3
97.1
1419.2
1419.2
1419.2
1419.2
1419.2
1419.2
1419.2
1417.7
10
11
12
13
14
15
16
17
A9
A8
A13
A14
A17
A18
VCC
PRELIMINARY
(October, 2001, Version 0.0)
8
AMIC Technology, Inc.
A23L9308 Series
Package Information
P-DIP 32L Outline Dimensions
unit: inches/mm
D
32
17
1
16
E
1
Base Plane
Seating Plane
B
E
A
q
e
B1
Dimensions in inches
Dimensions in mm
Symbol
Min
-
Nom
Max
0.210
-
Min
Nom
Max
A
-
-
-
-
-
5.334
-
A1
A2
0.015
0.149
0.381
3.785
0.154
0.159
3.912
4.039
B
-
-
0.018
0.050
-
-
-
-
-
-
0.457
1.270
0.254
-
-
-
B1
C
D
-
0.010
1.650
1.645
1.655 41.783 41.91 42.037
0.547 13.64 13.767 13.894
E
E1
EA
e
0.537
0.590
0.630
-
0.542
0.600
0.650
0.100
0.130
-
0.610 14.986 15.240 15.494
0.670 16.002 16.510 17.018
-
-
2.540
3.302
-
-
L
0.120
0°
0.140
15°
3.048
0°
3.556
15°
q
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
PRELIMINARY
(October, 2001, Version 0.0)
9
AMIC Technology, Inc.
A23L9308 Series
Package Information
SOP (W.B.) 32L Outline Dimensions
unit: inches/mm
32
17
q
L
16
1
b
Detail F
D
LE
e
S
y
See Detail F
Seating Plane
Dimensions in inches
Dimensions in mm
Symbol
Min
Nom
-
Max
0.118
-
Min
Nom
-
Max
A
A1
A2
b
-
-
3.00
-
0.004
0.101
0.014
0.006
-
-
0.10
2.57
0.36
0.15
-
-
0.106
0.016
0.008
0.805
0.445
0.050
0.556
0.031
0.055
-
0.111
0.020
0.012
0.817
0.450
0.056
0.566
0.039
0.063
0.036
0.004
10°
2.69
0.41
0.20
20.45
11.30
1.27
14.12
0.79
1.40
-
2.82
0.51
0.31
20.75
11.43
1.42
14.38
0.99
1.60
0.91
0.10
10°
c
D
E
0.440
0.044
0.546
0.023
0.047
-
11.18
1.12
13.87
0.58
1.19
-
e
HE
L
LE
S
y
-
-
-
-
0°
-
0°
-
q
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
PRELIMINARY
(October, 2001, Version 0.0)
10
AMIC Technology, Inc.
A23L9308 Series
Package Information
PLCC 32L Outline Dimension
unit: inches/mm
HD
D
13
5
14
4
1
32
20
30
29
21
b
e
b
1
GE
y
q
GD
Dimensions in inches
Dimensions in mm
Symbol
Min
-
Nom
-
Max
0.134
-
Min
Nom
-
Max
3.40
A
A1
A2
b1
b
-
0.0185
0.105
0.026
0.016
0.008
0.547
0.447
0.044
0.490
0.390
0.585
0.485
0.075
-
-
0.47
2.67
0.66
0.41
0.20
13.89
11.35
1.12
12.45
9.91
14.86
12.32
1.91
-
-
-
0.110
0.028
0.018
0.010
0.550
0.450
0.050
0.510
0.410
0.590
0.490
0.090
-
0.115
0.032
0.021
0.014
0.553
0.453
0.056
0.530
0.430
0.595
0.495
0.095
0.003
10°
2.80
0.71
0.46
0.254
13.97
11.43
1.27
12.95
10.41
14.99
12.45
2.29
-
2.93
0.81
0.54
0.35
14.05
11.51
1.42
13.46
10.92
15.11
12.57
2.41
0.075
10°
C
D
E
e
GD
GE
HD
HE
L
y
q
0°
-
0°
-
Notes:
1. Dimensions D and E do not include resin fins.
2. Dimensions GD & GE are for PC Board surface mount pad pitch
design reference only.
PRELIMINARY
(October, 2001, Version 0.0)
11
AMIC Technology, Inc.
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