AM29F200AT-90DPE [AMD]

2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 5.0 Volt-only, Sectored Flash Memory-Die Revision 1; 2兆位（ 256千×8位/ 128的K× 16位） CMOS 5.0伏只，分扇区闪存裸片修订版1


型号：	AM29F200AT-90DPE
厂家：	AMD
描述：	2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 5.0 Volt-only, Sectored Flash Memory-Die Revision 1 2兆位（ 256千×8位/ 128的K× 16位） CMOS 5.0伏只，分扇区闪存裸片修订版1 闪存
文件：	总8页 (文件大小：120K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SUPPLEMENT

Am29F200A Known Good Die

2 Megabit (256 K x 8-Bit/128 K x 16-Bit)

CMOS 5.0 Volt-only, Sectored Flash Memory—Die Revision 1

DISTINCTIVE CHARACTERISTICS

■ 5.0 V ± 10% for read and write operations

■ Top or bottom boot block configurations

available

— Minimizes system level power requirements

■ Embedded Algorithms

■ High performance

— Embedded Erase algorithm automatically

preprograms and erases the entire chip or any

combination of designated sectors

— 90 or 120 ns access time

■ Low power consumption

— 20 mA typical active read current (byte mode)

— Embedded Program algorithm automatically

writes and verifies data at specified addresses

— 28 mA typical active read current for

(word mode)

■ Minimum 100,000 write/erase cycles guaranteed

■ Compatible with JEDEC standards

— 30 mA typical program/erase current

— 1 µA typical standby current

— Pinout and software compatible with

single-power-supply flash

■ Sector erase architecture

— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and

three 64 Kbyte sectors (byte mode)

— Superior inadvertent write protection

■ Data# Polling and Toggle Bit

— One 8 Kword, two 4 Kword, one 16 Kword, and

three 32 Kword sectors (word mode)

— Detects program or erase cycle completion

■ Ready/Busy# output (RY/BY#)

— Supports full chip erase

— Hardware method for detection of program or

erase cycle completion

— Sector Protection features:

A hardware method of locking a sector to

prevent any program or erase operations within

that sector

■ Erase Suspend/Resume

— Supports reading data from a sector not being

erased

Sectors can be locked via programming

equipment

■ Hardware RESET# pin

Temporary Sector Unprotect feature allows code

changes in previously locked sectors

— Resets internal state machine to the reading

array data

■ Tested to datasheet specifications at

temperature

■ Quality and reliability levels equivalent to

standard packaged components

Publication# 21257 Rev: B Amendment/0

Issue Date: December 1997

1/13/98

S U P P L E M E N T

grammed) before executing the erase operation. Dur-

GENERAL DESCRIPTION

ing erase, the device automatically times the erase

pulse widths and verifies proper cell margin.

The Am29F200A in Known Good Die (KGD) form is a

2 Mbit, 5.0 Volt-only Flash memory. AMD defines KGD

as standard product in die form, tested for functionality

and speed. AMD KGD products have the same reli-

ability and quality as AMD products in packaged form.

The host system can detect whether a program or

erase operation is complete by observing the RY/BY#

pin, or by reading the DQ7 (Data# Polling) and DQ6/

DQ2 (toggle) status bits. After a program or erase

cycle has been completed, the device is ready to read

array data or accept another command.

Am29F200A Features

The Am29F200A is organized as 262,144 bytes of 8

bits each or 131,072 words of 16 bits each. The 8-bit

data appears on DQ0-DQ7; the 16-bit data appears on

DQ0-DQ15. This device is designed to be programmed

The sector erase architecture allows memory sectors

to be erased and reprogrammed without affecting the

data contents of other sectors. The device is fully

erased when shipped from the factory.

in-system with the standard system 5.0 Volt V

sup-

ply. A 12.0 volt V is not required for program or erase

operations.

Hardware data protection measures include a low

V_CCdetector that automatically inhibits write opera-

tions during power transitions. The hardware sector

protection feature disables both program and erase

operations in any combination of the sectors of mem-

ory. This can be achieved via programming equipment.

The standard Am29F200A in KGD form offers an ac-

cess time of 90 or 120 ns, allowing high-speed micro-

processors to operate without wait states. To eliminate

bus contention the device has separate chip enable

(CE#), write enable (WE#), and output enable (OE#)

controls.

The Erase Suspend feature enables the user to put

erase on hold for any period of time to read data from,

or program data to, any sector that is not selected for

erasure. True background erase can thus be achieved.

The device requires only a single 5.0 volt power sup-

ply for both read and write functions. Internally gener-

ated and regulated voltages are provided for the

program and erase operations.

The hardware RESET# pin terminates any operation

in progress and resets the internal state machine to

reading array data. The RESET# pin may be tied to the

system reset circuitry. A system reset would thus also

reset the device, enabling the system microprocessor

to read the boot-up firmware from the Flash memory.

The device is entirely command set compatible with the

JEDEC single-power-supply Flash standard. Com-

mands are written to the command register using stan-

dard microprocessor write timings. Register contents

serve as input to an internal state-machine that con-

trols the erase and programming circuitry. Write cycles

also internally latch addresses and data needed for the

programming and erase operations. Reading data out

of the device is similar to reading from other Flash or

EPROM devices.

The system can place the device into the standby mode.

Power consumption is greatly reduced in this mode.

AMD’s Flash technology combines years of Flash mem-

ory manufacturing experience to produce the highest lev-

els of quality, reliability and cost effectiveness. The device

electrically erases all bits within a sector simulta-

neously via Fowler-Nordheim tunneling. The data is

programmed using hot electron injection.

Device programming occurs by executing the program

command sequence. This initiates the Embedded

Program algorithm—an internal algorithm that auto-

matically times the program pulse widths and verifies

proper cell margin.

ELECTRICAL SPECIFICATIONS

Refer to the Am29F200A data sheet, publication

number 20380, for full electrical specifications on the

Am29F200A.

Device erasure occurs by executing the erase com-

mand sequence. This initiates the Embedded Erase

algorithm—an internal algorithm that automatically

preprograms the array (if it is not already pro-

PRODUCT SELECTOR GUIDE

Family Part Number

Am29F200A KGD

Speed Option (V

= 5.0 V ± 10%)

Max access time, ns (t

-90

-120

120

)

ACC

Max CE# access time, ns (t

)

Max OE# access time, ns (t

)

Am29F200A Known Good Die

1/13/98

S U P P L E M E N T

DIE PHOTOGRAPH

Orientation relative

to top left corner of

Gel-Pak

Orientation relative

to leading edge of

tape and reel

DIE PAD LOCATIONS

1 42 41 40 39 38 37 36 35 34

AMD logo location

16 17 18 19 20 21 22

24 25 26 27

1/13/98

Am29F200A Known Good Die

S U P P L E M E N T

Pad Center (mils)

PAD DESCRIPTION

Pad Center (millimeters)

Pad

Signal

0.0

0.0000

–0.2159

–0.4394

–0.6629

–0.8865

–1.1074

–1.3310

–1.5545

–1.7755

–2.0371

–2.0904

–1.7323

–1.4707

–1.2090

–0.9322

–0.6706

–0.4089

–0.1321

0.6629

1.2751

1.5367

1.7983

2.0599

2.3216

2.3241

2.3139

2.0269

1.7780

1.5570

1.3335

1.1100

0.8865

0.6655

0.4420

0.2184

0.0000

DQ4

DQ12

DQ5

8.5

–1.2

–0.0305

0.0686

–17.3

–26.1

–34.9

–43.6

–52.4

–61.2

–69.9

–80.2

–82.3

–68.2

–57.9

–47.6

–36.7

–26.4

–16.1

–5.2

–1.2

DQ13

DQ6

–1.2

DQ14

DQ7

–1.2

DQ15/A-1

–1.2

2.7

BYTE#

A16

A15

A14

A13

A12

A11

A10

–13.5

–24.1

–128.4

–138.7

–150.0

–138.7

–128.4

–24.1

–13.6

1.8

–0.3429

–0.6121

–3.2614

–3.5230

–3.8100

–3.5230

–3.2614

–0.6121

–0.3454

0.0457

WE#

RESET#

RY/BY#

26.1

50.2

60.5

70.8

81.1

91.4

91.5

CE#

91.5

91.1

OE#

DQ0

DQ8

DQ1

DQ9

DQ2

DQ10

DQ3

DQ11

79.8

–0.7

–0.0178

–0.0305

70.0

–1.2

61.3

–1.2

52.5

–1.2

43.7

–1.2

34.9

–1.2

26.2

–1.2

17.4

–1.2

8.6

–1.2

Note: The coordinates above are relative to the center of pad 1 and can be used to operate wire bonding equipment.

Am29F200A Known Good Die

1/13/98

S U P P L E M E N T

ORDERING INFORMATION

Standard Products

AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is

formed by a combination of the following:

-90

Am29F200A

DIE REVISION

This number refers to the specific AMD manufacturing

process and product technology reflected in this

document. It is entered in the revision field of AMD

standard product nomenclature.

TEMPERATURE RANGE

C = Commercial (0°C to +70°C)

= Industrial (–40°C to +85°C)

E = Extended (–55°C to +125°C)

PACKAGE TYPE AND

MINIMUM ORDER QUANTITY

Waffle Pack

245 die per 5 tray stack

DG = Gel-Pak Die Tray

486 die per 6 tray stack

Surftape™ (Tape and Reel)

2500 per 7-inch reel

DW = Gel-Pak Wafer Tray (sawn wafer on frame)

Call AMD sales office for minimum order

quantity

SPEED OPTION

See Valid Combinations

BOOT CODE SECTOR ARCHITECTURE

T = Top sector

B = Bottom sector

DEVICE NUMBER/DESCRIPTION

Am29F200A Known Good Die

2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS Flash Memory—Die Revision 1

5.0 Volt-only Read, Program, and Erase

Valid Combinations

Valid Combinations list configurations planned to be sup-

ported in volume for this device. Consult the local AMD sales

office to confirm availability of specific valid combinations and

to check on newly released combinations.

Valid Combinations

Am29F200AT-90,

Am29F200AB-90

DPC 1, DPI 1, DPE 1,

DGC 1, DGI 1, DGE 1,

DTC 1, DTI 1, DTE 1,

DWC 1, DWI 1, DWE 1

Am29F200AT-120,

Am29F200AB-120

1/13/98

Am29F200A Known Good Die

S U P P L E M E N T

an off-line quality monitoring program (QMP) further

PRODUCT TEST FLOW

guarantees AMD quality standards are met on Known

Good Die products. These QA procedures also allow

AMD to produce KGD products without requiring or

implementing burn-in.

Figure 1 provides an overview of AMD’s Known Good

Die test flow. For more detailed information, refer to the

Am29F200A product qualification database supple-

ment for KGD. AMD implements quality assurance pro-

cedures throughout the product test flow. In addition,

DC Parameters

Functionality

Programmability

Erasability

Wafer Sort 1

Data Retention

Bake

24 hours at 250°C

DC Parameters

Functionality

Programmability

Erasability

Wafer Sort 2

DC Parameters

Functionality

Programmability

Erasability

Wafer Sort 3

High Temperature

Speed

Incoming Inspection

Wafer Saw

Die Separation

100% Visual Inspection

Die Pack

Packaging for Shipment

Shipment

Figure 1. AMD KGD Product Test Flow

Am29F200A Known Good Die

1/13/98

S U P P L E M E N T

PHYSICAL SPECIFICATIONS

MANUFACTURING INFORMATION

Die dimensions . . . . . . . . . . . . . . 191 mils x 174 mils

. . . . . . . . . . . . . . . . . . . . . . . . . . .4.85 mm x 4.42 mm

Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . FASL

Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SDC

Die Thickness . . . . . . . . . . . . . . . . . . . . . . . . ~20 mils

Manufacturing ID (Top Boot) . . . . . . . . . . . . 98483AK

(Bottom Boot) . . . . . . . .98483ABK

Bond Pad Size . . . . . . . . . . . . . . 4.55 mils x 4.55 mils

. . . . . . . . . . . . . . . . . . . . . . . . . . 115.6 µm x 115.6 µm

Preparation for Shipment . . . . . . . . Penang, Malaysia

Fabrication Process . . . . . . . . . . . . . . . . . . . CS29AF

Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Pad Area Free of Passivation . . . . . . . . . .20.70 mils²

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13,363 µm²

Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42

Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Cu/Si

SPECIAL HANDLING INSTRUCTIONS

Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,

may be grounded (optional)

Processing

Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride

Do not expose KGD products to ultraviolet light or

process them at temperatures greater than 250°C.

Failure to adhere to these handling instructions will

result in irreparable damage to the devices. For best

yield, AMD recommends assembly in a Class 10K

clean room with 30% to 60% relative humidity.

DC OPERATING CONDITIONS

V_CC(Supply Voltage) . . . . . . . . . . . . . . .4.5 V to 5.5 V

Junction Temperature Under Bias . .T_J(max) = 130°C

Storage

Operating Temperature

Commercial . . . . . . . . . . . . . . . . . . . 0°C to +70°C

Industrial . . . . . . . . . . . . . . . . . . . –40°C to +85°C

Extended . . . . . . . . . . . . . . . . . . –55°C to +125°C

Store at a maximum temperature of 30°C in a nitrogen-

purged cabinet or vacuum-sealed bag. Observe all

standard ESD handling procedures.

1/13/98

Am29F200A Known Good Die

S U P P L E M E N T

THIS WARRANTY IS EXPRESSED IN LIEU OF ALL

TERMS AND CONDITIONS OF SALE FOR

AMD NON-VOLATILE MEMORY DIE

OTHER WARRANTIES, EXPRESSED OR IMPLIED,

INCLUDING THE IMPLIED WARRANTY OF FITNESS

FOR A PARTICULAR PURPOSE, THE IMPLIED

WARRANTY OF MERCHANTABILITY AND OF ALL

OTHER OBLIGATIONS OR LIABILITIES ON AMD’S

PART, AND IT NEITHER ASSUMES NOR AUTHO-

RIZES ANY OTHER PERSON TO ASSUME FOR

AMD ANY OTHER LIABILITIES. THE FOREGOING

CONSTITUTES THE BUYERS SOLE AND EXCLU-

SIVE REMEDY FOR THE FURNISHING OF DEFEC-

TIVE OR NON CONFORMING ARTICLES AND AMD

SHALL NOT IN ANY EVENT BE LIABLE FOR

DAMAGES BY REASON OF FAILURE OF ANY

PRODUCT TO FUNCTION PROPERLY OR FOR ANY

SPECIAL, INDIRECT, CONSEQUENTIAL, INCI-

DENTAL OR EXEMPLARY DAMAGES, INCLUDING

BUT NOT LIMITED TO, LOSS OF PROFITS, LOSS

OF USE OR COST OF LABOR BY REASON OF THE

FACT THAT SUCH ARTICLES SHALL HAVE BEEN

DEFECTIVE OR NON CONFORMING.

All transactions relating to AMD Products under this

agreement shall be subject to AMD’s standard terms

and conditions of sale, or any revisions thereof, which

revisions AMD reserves the right to make at any time

and from time to time. In the event of conflict between

the provisions of AMD’s standard terms and conditions

of sale and this agreement, the terms of this agreement

shall be controlling.

AMD warrants articles of its manufacture against

defective materials or workmanship for a period of

ninety (90) days from date of shipment. This warranty

does not extend beyond AMD’s customer, and does

not extend to die which has been affixed onto a board

or substrate of any kind. The liability of AMD under this

warranty is limited, at AMD’s option, solely to repair or

to replacement with equivalent articles, or to make an

appropriate credit adjustment not to exceed the original

sales price, for articles returned to AMD, provided that:

(a) The Buyer promptly notifies AMD in writing of each

and every defect or nonconformity in any article for

which Buyer wishes to make a warranty claim against

AMD; (b) Buyer obtains authorization from AMD to

return the article; (c) the article is returned to AMD,

transportation charges paid by AMD, F.O.B. AMD’s fac-

tory; and (d) AMD’s examination of such article dis-

closes to its satisfaction that such alleged defect or

nonconformity actually exists and was not caused by

negligence, misuse, improper installation, accident or

unauthorized repair or alteration by an entity other than

AMD. The aforementioned provisions do not extend

the original warranty period of any article which has

either been repaired or replaced by AMD.

Buyer agrees that it will make no warranty representa-

tions to its customers which exceed those given by

AMD to Buyer unless and until Buyer shall agree to

indemnify AMD in writing for any claims which exceed

AMD’s warranty. Buyer assumes all responsibility for

successful die prep, die attach and wire bonding pro-

cesses. Due to the unprotected nature of the AMD

Products which are the subject hereof, AMD assumes

no responsibility for environmental effects on die.

AMD products are not designed or authorized for use

as components in life support appliances, devices or

systems where malfunction of a product can reason-

ably be expected to result in a personal injury. Buyer’s

use of AMD products for use in life support applications

is at Buyer’s own risk and Buyer agrees to fully indem-

nify AMD for any damages resulting in such use or

sale.

REVISION SUMMARY FOR AM29F200A

KNOWN GOOD DIE

Formatted to match current template. Updated Distinc-

tive Characteristics and General Description sections

using the current main data sheet.

Trademarks

AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.

Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

Am29F200A Known Good Die

1/13/98

AM29F200AT-90DPE [AMD]

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