A2811A-08ST [ALSC]

Low-Power EMI Reduction IC; 低功耗的降低EMI IC
A2811A-08ST
型号: A2811A-08ST
厂家: ALLIANCE SEMICONDUCTOR CORPORATION    ALLIANCE SEMICONDUCTOR CORPORATION
描述:

Low-Power EMI Reduction IC
低功耗的降低EMI IC

文件: 总8页 (文件大小:376K)
中文:  中文翻译
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October 2003  
rev  
P2811/12/14  
Low-Power EMI Reduction IC  
Features  
Deviation and Spread Option Selections section). These  
combinations include Down Spread, Center Spread and  
percentage deviation range from ±0.625% to -3.50%.  
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FCC approved method of EMI attenuation  
Provides up to 15 dB EMI reduction  
Generates 1X, 2X, and 4X low EMI spread spectrum  
clock of the input frequency  
The P28xx reduces electromagnetic interference (EMI) at  
the clock source, allowing a system wide EMI reduction for  
all the down stream clocks and data dependent signals.  
The P28xx allows significant system cost savings by  
reducing the number of circuit board layers, ferrite beads,  
shielding, and other passive components that are  
traditionally required to pass EMI regulations.  
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1X: P2811, 2X: P2812, 4X: P2814  
Optimized for input frequency range from 10 to 40  
MHz P2811: 10 to 40 MHz P2812: 10 to 40 MHz  
P2814: 10 to 40 MHz  
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Internal loop filter minimizes external components  
and board space  
Selectable spread options: Down Spread and Center  
Spread  
Low inherent cycle-to-cycle jitter  
Eight spread % selections: ±0.625% to –3.5%  
3.3 V operating voltage  
CMOS/TTL compatible inputs and outputs  
Pinout compatible with Cypress CY25811,  
CY25812, and CY25814  
Products available for industrial temperature range  
Available in 8-pin SOIC and TSSOP  
The P28xx modulates the output of a single PLL in order to  
“spread” the bandwidth of a synthesized clock, thereby  
decreasing the peak amplitudes of its harmonics. This  
results in significantly lower system EMI compared to the  
typical narrow band signal produced by oscillators and  
most clock generators. Lowering EMI by increasing a  
signal’s bandwidth is called “spread spectrum clock  
generation”.  
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The P28xx uses the most efficient and optimized  
modulation profile approved by the FCC and is  
implemented by using a proprietary all-digital method.  
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Applications  
Product Description  
The P28xx is targeted towards EMI management for  
memory interfaces in mobile graphic chipsets and high-  
speed digital applications such as PC peripheral devices,  
consumer electronics, and embedded controller systems.  
The P28xx is a versatile spread spectrum frequency  
modulator designed specifically for input clock frequencies  
from 10 to 40 MHz (see Input/Output Frequency Range  
Selections). The P28xx can generate an EMI reduced clock  
from crystal, ceramic resonator, or system clock. The  
P28xx-A and P28xx-B offer various combinations of spread  
options and percentage deviations (see Output Frequency  
Block Diagram  
Alliance Semiconductor  
2575, Augustine Drive Santa Clara, CA Tel: 408.855.4900 Fax: 408.855.4999 www.alsc.com  
Notice: The information in this document is subject to change without notice.  
October 2003  
P2811/12/14  
rev  
Pin Configuration  
Pin Description  
Pin#  
1
2
Pin Name  
Type  
Description  
XIN  
I
Connect to externally generated clock signal or crystal.  
VSS  
D_C  
P
I
Ground Connection. Connect to system ground.  
Digital logic input used to select Down (LOW) or Center (HIGH) Spread  
Options (see Output Frequency Deviation and Spread Option Selections).  
This pin has an internal pull-up resistor.  
Spread Range Selection. Digital logic input used to select frequency  
deviation (see Output Frequency Deviation and Spread Option Selections).  
This pin has an internal pull-up resistor.  
Spread Spectrum clock output (see Input/Output Frequency Range  
Selections and Output Frequency Deviation and Spread Option Selections).  
Frequency Range Selection. Digital logic input used to select input fre-  
quency range (see Input/Output Frequency Range Selections). This pin has  
an internal pull-up resistor.  
3
SRS  
I
4
5
6
ModOut  
FRS  
O
I
VDD  
P
I
Connect to +3.3 V  
7
8
XOUT  
Connect to crystal. No connect if externally generated clock signal is used.  
Input/Output Frequency Range Selections  
Part number  
P2812 (2X)  
Pin 6  
Modulation  
rate  
P2811 (1X)  
P2814 (4X)  
Input  
Output  
(MHz)  
Input  
Output  
Input  
Output  
(MHz)  
FRS  
(MHz)  
(MHz)  
(MHz)  
(MHz)  
Input frequency  
/ 448  
Input frequency  
/ 896  
0
1
10-20  
10-20  
10-20  
20-40  
10-20  
40-80  
20-40  
20-40  
20-40  
40-80  
20-40  
80-160  
Low Power EMI Reduction IC  
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Notice: The information in this document is subject to change without notice.  
October 2003  
P2811/12/14  
rev  
Output Frequency Deviation and Spread Option Selections  
Output frequency deviation and  
Part number  
Pin 3 D_C  
Pin 4 SRS  
spread option  
-2.50% (Down)  
-3.50% (Down)  
+/-1.25% (Center)  
+/-1.75% (Center)  
0
0
1
1
0
1
0
1
P2811/12/14A  
0
0
1
1
0
1
0
1
-1.25% (Down)  
-1.75% (Down)  
+/-0.625% (Center)  
+/-0.875% (Center)  
P2811/12/14B  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
Unit  
V
°C  
°C  
VDD, VIN  
TSTG  
Voltage on any pin with respect to GND  
Storage temperature  
-0.5 to + 7.0  
-65 to +125  
0 to 70  
TA  
Operating temperature  
DC Electrical Characteristics  
3.3 V, 25° C  
Symbol  
VIL  
Parameter  
Input Low Voltage  
Input High Voltage  
Min  
GND – 0.3  
Typ  
Max  
0.8  
VDD + 0.3  
Unit  
V
V
VIH  
Input low Current (inputs  
D_C, SRS, and FRS)  
IIL  
IIH  
-60.00  
-20.00  
1.00  
µA  
µA  
Input High Current  
XOUT Output Low Current  
(@ 0.4V, VDD = 3.3V)  
XOUT Output High Current  
(@ 2.5V, VDD = 3.3V)  
Output Low Voltage  
IXOL  
2.00  
12.00  
mA  
IXOH  
VOL  
VOH  
IDD  
12.00  
0.4  
2.8  
mA  
V
(VDD=3.3V, IOL = 20 mA)  
Output High Voltage  
V
(VDD=3.3V, IOH = 20 mA)  
Static Supply Current  
Standby Mode  
4.5  
mA  
Dynamic Supply Current  
Normal Mode (3.3V and 25  
pF probe loading)  
ICC  
7.1 fIN-min  
13.9 fIN-max  
mA  
VDD  
tON  
Operating Voltage  
3.3  
0.18  
50  
V
mS  
Power Up Time (First locked  
clock cycle after power up)  
ZOUT  
Clock Output Impedance  
Low Power EMI Reduction IC  
3 of 8  
Notice: The information in this document is subject to change without notice.  
October 2003  
rev  
P2811/12/14  
AC Electrical Characteristics  
3.3 V, 25° C  
Symbol  
fIN  
fOUT  
Parameter  
Min  
10  
10  
20  
40  
Typ  
Max  
40  
40  
80  
160  
Unit  
MHz  
MHz  
MHz  
MHz  
Input frequency P2811/12/14  
Output frequency P2811  
Output frequency P2812  
Output frequency P2814  
Output rise time (measured at  
1
tLH  
0.69  
0.66  
ns  
ns  
0.8V to 2.0V)  
Output fall time (measured at  
2.0V to 0.8V)  
1
tHL  
tJC  
tD  
Jitter (cycle to cycle)  
Output duty cycle  
-200  
45  
50  
200  
55  
ps  
%
1. tLH and tHL are measured into a capacitive load of 15 pF  
Low Power EMI Reduction IC  
4 of 8  
Notice: The information in this document is subject to change without notice.  
October 2003  
P2811/12/14  
rev  
Package Information  
Mechanical Package Outline 8-Pin SOIC  
Dimensions in inches  
Dimensions in millimeters  
Symbol  
Min  
Nor  
0.064  
0.007  
0.061  
0.016  
0.006  
0.194  
0.156  
0.050 BSC  
0.236  
0.020  
5°  
Max  
0.071  
0.010  
0.069  
0.020  
0.01  
Min  
1.45  
0.10  
1.35  
0.31  
0.10  
4.72  
3.75  
Nor  
1.63  
Max  
1.80  
0.25  
1.75  
0.51  
0.25  
5.12  
4.15  
A
A1  
A2  
B
0.057  
0.004  
0.053  
0.012  
0.004  
0.186  
0.148  
0.18  
1.55  
0.41  
C
D
E
0.15  
0.202  
0.164  
4.92  
3.95  
e
1.27 BSC  
6.00  
H
L
0.224  
0.012  
0°  
0.248  
0.028  
8°  
5.70  
0.30  
0°  
6.30  
0.70  
8°  
0.50  
a
5°  
Note: Controlling dimensions are millimeters  
SOIC – 0.074 grams unit weight  
Low Power EMI Reduction IC  
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Notice: The information in this document is subject to change without notice.  
October 2003  
rev  
P2811/12/14  
Mechanical Package Outline 8-Pin TSSOP  
Dimensions in inches  
Dimensions in millimeters  
Symbol  
Min  
Nor  
Max  
Min  
Nor  
Max  
1.10  
0.15  
1.05  
0.30  
0.20  
3.10  
4.50  
A
A1  
A2  
B
0.047  
0.006  
0.041  
0.012  
0.008  
0.122  
0.177  
0.002  
0.031  
0.007  
0.004  
0.114  
0.169  
0.05  
0.80  
0.19  
0.09  
2.90  
4.30  
0.039  
1.00  
C
D
E
0.118  
0.173  
3.00  
4.40  
e
0.026 BSC  
0.252  
0.65 BSC  
6.40  
H
L
0.244  
0.018  
0°  
0.260  
0.030  
8°  
6.20  
0.45  
0°  
6.60  
0.75  
8°  
0.024  
0.60  
5°  
5°  
a
Note: Controlling dimensions are millimeters  
TSSOP – 0.034 grams unit weight  
Low Power EMI Reduction IC  
6 of 8  
Notice: The information in this document is subject to change without notice.  
October 2003  
P2811/12/14  
rev  
Ordering Codes  
Part Number  
Marking  
P2811A  
P2812A  
P2814A  
P2811A  
P2812A  
P2814A  
P2811A  
P2812A  
P2814A  
P2811A  
P2812A  
P2814A  
Package Type  
8-pin SOIC, tube  
Qty per reel  
Temperature  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
P2811A-08ST  
P2812A-08ST  
P2814A-08ST  
P2811A-08SR  
P2812A-08SR  
P2814A-08SR  
P2811A-08TT  
P2812A-08TT  
P2814A-08TT  
P2811A-08TR  
P2812A-08TR  
P2814A-08TR  
8-pin SOIC, tube  
8-pin SOIC, tube  
8-pin SOIC, tape reel  
8-pin SOIC, tape reel  
8-pin SOIC, tape reel  
8-pin TSSOP, tube  
8-pin TSSOP, tube  
8-pin TSSOP, tube  
8-pin TSSOP, tape reel  
8-pin TSSOP, tape reel  
8-pin TSSOP, tape reel  
2,500  
2,500  
2,500  
2,500  
2,500  
2,500  
Device Ordering Information  
X 2 8 X X  
X - 0 8 X X  
Package:  
ST – SOIC, TUBE  
SR - SOIC, T/R  
TT – TSSOP, TUBE  
TR - TSSOP, T/R  
Pin Count  
F = Pb FREE  
DEVICE NUMBER  
Flow:  
P = Commercial Temperature Range (0°C to 70°C)  
I = Industrial Temperature Range (-25°C to 85°C)  
A = Automotive Temperature Range (-40°C to 125°C)  
Licensed under US patent Nos 5,488,627 and 5,631,920.  
Preliminary datasheet. Specification subject to change without notice.  
Low Power EMI Reduction IC  
7 of 8  
Notice: The information in this document is subject to change without notice.  
October 2003  
rev  
P2811/12/14  
Alliance Semiconductor Corporation  
2595, Augustine Drive,  
Santa Clara, CA 95054  
Tel# 408-855-4900  
Copyright © Alliance Semiconductor  
All Rights Reserved  
Preliminary Information  
Part Number: P2811/12/14  
Document Version:  
Fax: 408-855-4999  
www.alsc.com  
© Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are  
trademarks or registered trademarks of Alliance. All other brand and product names may be the trademarks of their  
respective companies. Alliance reserves the right to make changes to this document and its products at any time without  
notice. Alliance assumes no responsibility for any errors that may appear in this document. The data contained herein  
represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this  
data at any time, without notice. If the product described herein is under development, significant changes to these  
specifications are possible. The information in this product data sheet is intended to be general descriptive information for  
potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or  
customer. Alliance does not assume any responsibility or liability arising out of the application or use of any product  
described herein, and disclaims any express or implied warranties related to the sale and/or use of Alliance products  
including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual  
property rights, except as express agreed to in Alliance's Terms and Conditions of Sale (which are available from Alliance).  
All sales of Alliance products are made exclusively according to Alliance's Terms and Conditions of Sale. The purchase of  
products from Alliance does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any  
other intellectual property rights of Alliance or third parties. Alliance does not authorize its products for use as critical  
components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant  
injury to the user, and the inclusion of Alliance products in such life-supporting systems implies that the manufacturer  
assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use.  
Low Power EMI Reduction IC  
8 of 8  
Notice: The information in this document is subject to change without notice.  

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