SPEF120100 [ALPS]
1.5mm-travel Vertical Type;
| 型号： | SPEF120100 |
| 厂家： | 
ALPS ELECTRIC CO.,LTD. |
| 描述： | 1.5mm-travel Vertical Type |
| 文件： | 总4页 (文件大小：996K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1.5mm-travel Vertical Type
SPEF
Surface mountable lead-free soldering push switch
■ Typical Specifications
Items
Specifications
Rating（max.）（/ min.）
（Resistive load）
1A 14.5V DC / 50μA 3V DC
100mΩ max. / 100mΩ max.
3N, 5N
Contact resistance
（Initial / After operating life）
Operating force
30,000 cycles（1A 14.5V DC）
1-pole, 2-position
Operating life（With load）
Poles-position
Product Line
Minimum order unit（pcs.）
Changeover
timing
Travel
Total travel Operating Mounting
Drawing
Operating Terminal type
Reflow
Product No.
（mm）
（mm）
force
method
No.
Japan
Export
660
1,320
SPEF210101
SPEF110100
SPEF210200
SPEF110200
SPEF220100
SPEF120100
SPEF220200
SPEF120200
1
3N
Dip
Latching
1,050
660
4,200
1,320
4,200
1,320
4,200
1,320
4,200
2
1
2
1
2
1
2
1.5
Reflow
5N
3N
5N
Dip
1,050
660
Non shorting
2.7
PC board
Reflow
Dip
1,050
660
−
Alternate
Reflow
Dip
1,050
Packing Specifications
Taping
Unit:mm
Reel size
Number of packages（pcs.）
Tape width
Export package
Product No.
（mm）
measurements（mm）
1 reel
1 case / Japan 1 case / export packing
SPEF210101
SPEF210200
SPEF220100
SPEF220200
165
660
1,320
32
403×403×360
ø380
33.5
Tray
Number of packages（pcs.）
1 case / Japan
Export package
Product No.
measurements（mm）
1 case / export packing
SPEF110100
SPEF110200
SPEF120100
SPEF120200
1,050
4,200
540×360×230
Refer to P.138 for soldering conditions.
132
SPEF／1.5mm-travel Vertical Type
Dimensions
Unit:mm
PC board mounting hole dimensions
（Viewed from the direction A）
No.
Style
Reflow soldering type
Terminal No.1
Terminal No.2
2
1.2
Terminal No.C
1.2
A
1
13.6
9.4
3.5
11.3
9
Full stroke position
Lock position
3.5
2.5
2.5
6.7
ø0.9
ø1.4
6
Dip soldering type
Terminal No.C
Terminal No.1
Terminal No.2
A
9
3.5
2.5
9.4
3.5
2.5
Full stroke position
Lock position
2
1
1
1.2
ø1.4
ø0.9
5.7
6.7
6
9.8
12.2
PC board mounting face
（Viewed from Direction A）
Circuit Diagram
1
C
2
133
Vertical
Series
Photo
SPEF
SPED2
SPED3
SPED4
SPED5
9.4
9
14
13.5
18.2
18
W
D
H
Dimensions
（mm）
16.8
18.3
—
18
6.9
1.5
2.7
1
16.97
—
13.1
—
—
Travel（mm）
4.5
3.8
Total travel（mm）
Number of poles
1
2
1
−40℃ to ＋95℃
●
Operating
−40℃ to ＋85℃
temperature range
Automotive use
Life cycle
●
—
●
●
●
●
Rating（max.）
1A 14.5V DC
2A 14.5V DC
（Resistive load）
Rating（min.）
50μA 3V DC
—
—
—
—
—
—
—
—
（Resistive load）
Operating life
without load
—
Durability
Operating life with load
（at max. rated load）
30,000 cycles 100mΩ max.
100mΩ max.
Initial contact
resistance
Electrical
Insulation
resistance
3MΩ min. 100V DC
3MΩ min. 500V DC
performance
100V AC for 1minute
Voltage proof
Terminal
strength
—
—
—
—
—
90N
—
Wire strength 30N
Mechanical
Operating
90N
98N
—
98N
—
performance
direction
Actuator
strength
Pulling
30N
85℃ 96h
132
—
direction
−40℃ 96h
Cold
Environmental
performance
85℃ 96h (Connector type)
105℃ 192h (Dip type)
105℃ 192h
136
Dry heat
Damp heat
Page
40℃, 90 to 95%RH 96h
134
Push Switches Soldering Conditions ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・138
Push Switches Cautions ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・139
Note
● Indicates applicability to all products in the series.
115
Push Switches Soldering Conditions
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA (K) or CC (T) at soldering portion (copper foil surface).
A heat resisting tape should be used for fixed measurement.
3. Temperature profile
300
A max.
B
200
D
E
100
Room
temperature
Time (s)
Pre-heating
F max.
C
A（℃）
3s max.
Series（Reflow type）
B（℃）
230
C（s）
40
D（℃）
180
E（℃）
150
F（s）
120
SPEG
SPEJ
SPEF
SPEH
260
Notes
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's
ꢀ temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc.
The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
Reference for Hand Soldering
Series
Soldering temperature
3 5 0±10 ℃
Soldering time
3+1/0s
SPPJ3, SPPJ2, SPUN, SPPH4, SPPH1
SPED2, SPED4
SPEJ
3 5 0±10 ℃
3±0.5s
3 5 0±10 ℃
4s max.
3s max.
3s max.
3+1/0s
SPEG, SPEF
SPEH, SPPH2
SPUJ
350±5℃
350℃ max.
3 0 0±10 ℃
Reference for Dip Soldering
(For PC board terminal types)
For PC boardꢀ端子タイプに適用
Items
Dip soldering
Series
Preheating temperature
100℃ max.
Preheating time
Soldering temperature Duration of immersion
SPPJ3
60s max.
260±5℃
260±5℃
260±5℃
260±5℃
5±1s
10±1s
5±1s
SPUN
100℃ max.
60s max.
SPUJ, SPPH2, SPPH4
SPPJ2, SPPH1, SPED2, SPED4, SPEF
—
—
10±1s
138
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