SCHG [ALPS]
Combine Type Connector (for SIM Card 8pins, microSDTM Card); 组合型连接器（用于SIM卡8pins ， microSDTM卡）
| 型号： | SCHG |
| 厂家： | 
ALPS ELECTRIC CO.,LTD. |
| 描述： | Combine Type Connector (for SIM Card 8pins, microSDTM Card) |
| 文件： | 总3页 (文件大小：193K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Combine Type Connector (for SIM Card 8pins, microSDTM Card)
Series
SCHG
Double-deck for SIM Card (8pins) combine type.
For
SD Memory
Card
NEW
For
microSD™
Card
For
SIM Card
8pins
For
W-SIM
Features
Applications
For
Memory
Stick Micro™
●
●
Two-slot, double-deck structure enables two typs cards, the
SIM Card (8pins) and microSD™ Card, to be separately
inserted.
For mobile phones, various personal digital assistants,
notebook PCs.
For
Memory
Stick™
Combine Type
Typical Specifications
Items
For
Compact
Flash™
Specifications
SIM Card 8pins
For PC cards
supporting
CardBus
Applicable media
microSDTM Card
For
Express
Card™
Structure
Mounting type
Mounting style
Surface mounting type
Standard mount
For CMOS
Camera Module
Media ejection
structure
Manual insertion/removal/Push-push type
－25℃ to ＋70℃
Operating temperature
range
Voltage proof
500V AC 1minute
Insulation
resistance（Initial）
1,000MΩ min.
Performance
Connector
100mΩ max.
Contact
resistance
（Initial）
contacts
Detection
switch
500mΩ max.
Insertion and
removal cycle
5,000cycles（SIM Card 8pins）
10,000cycles（microSDTM Card）
Product Line
Media ejection structure
Mounting system
Packing system
Product No.
Stand-of（f mm）
Push-push type
Standard mount
0
Taping
SCHG1B0100
44
Combine Type Connector (for SIM Card 8pins, microSD™ Card)
SCHG Series
Unit:mm
Dimensions
Style
For
SD Memory
Card
For
microSD™
Card
!
!
!
!
!
4
1
5
2
6
For
SIM Card
8pins
!
9
!8
!
0
7
8
7
6
5
For
W-SIM
For
4
3
2
1
Memory
Stick Micro™
!
3
For
Memory
Stick™
Combine Type
PIN ASSIGMENTS
CONNECTOR
PIN
LAYOUT
DAT 2
CD/DAT3
CMD
CONNECTOR
PIN
LAYOUT
VCC
PIN No.
PIN No.
TERMINAL No.
No.1
TERMINAL No.
No.9
For
Compact
Flash™
microSD No.1
microSD No.2
microSD No.3
microSD No.4
microSD No.5
microSD No.6
microSD No.7
microSD No.8
SIM No.C1
SIM No.C2
SIM No.C3
SIM No.C4
SIM No.C5
SIM No.C6
SIM No.C7
SIM No.C8
No.2
No.10
RST
No.3
No.11
CLK
RESERVED
GND
VPP
I/O
RESERVED
No.4
VDD
No.12
No.5
CLK
VSS
No.13
For PC cards
supporting
CardBus
No.6
No.14
No.7
DAT0
DAT1
No.15
No.8
No.16
For
Express
Card™
PC board mounting hole dimensions
（Viewed from the mounting face side）
For CMOS
Camera Module
45
Small Memory Card Connectors
Soldering Conditions
Example of Reflow Soldering Condition（Reference）
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）.
3. Temperature profile（Surface of products）.
For
SD Memory
Card
For
microSD™
Card
240℃(max.)
230℃(min.)
For
200
100
SIM Card
8pins
180℃
150℃
For
W-SIM
For
Memory
Stick Micro™
Room
temperature
Time (s)
For
Memory
Stick™
Pre-heating
90±30 sec.
10 sec.(max.)
Combine Type
Heating time
sec.
For
Compact
Flash™
For PC cards
supporting
CardBus
Cautions for using this product
1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or
electrical degradation to occur depending on the conditions. Caution is therefore required.
2. Avoid use of water-soluble soldering flux, since it may corrode the product.
3. Check and conform to reflow soldering requirements under actual mass production conditions.
4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and
layout.
For
Express
Card™
For CMOS
Camera Module
5. The card specifications are provided by the above manufactures. Products by other manufactures may not be
compliant with these specifications and are subject to change without prior notice.
50
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