CM1440 [ALLEGRO]
6 Channel EMI Filter Array with ESD Protection; 带ESD保护6通道EMI滤波器阵列
| 型号： | CM1440 |
| 厂家： | 
ALLEGRO MICROSYSTEMS |
| 描述： | 6 Channel EMI Filter Array with ESD Protection |
| 文件： | 总9页 (文件大小：802K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CM1440
6 Channel EMI Filter Array with ESD Protection
Product Description
Features
•
•
Six channels of EMI filtering for data ports
Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
The CM1440 is a six channel low-pass EMI filter array
with ESD protection that reduces EMI/RFI emissions
while providing robust protection from ESD strikes.
Each EMI filter channel integrates a high quality pi-
style filter (30pF-100Ω-30pF) which provides greater
than 30dB of attenuation in the 800MHz to 2.7GHz fre-
quency range. The parts include avalanche-type ESD
diodes on every pin, which provide a very high level of
protection for sensitive electronic components that may
be subjected to electrostatic discharge (ESD). The
ESD protection diodes connected to the filter ports
safely dissipate ESD strikes of 30kV, beyond the
maximum requirement of the IEC61000-4-2 interna-
tional standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the
pins are protected for contact discharges at greater
than 30kV.
•
30kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
30kV ESD protection on each channel (HBM)
Greater than 35dB attenuation (typical) at 1 GHz
15-bump, 0.4mm pitch, 2.360mm x 1.053mm foot-
print Chip Scale Package (CSP)
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
•
•
•
•
•
•
OptiGuard™ coated for improved reliability at
assembly
Lead-free version available
Applications
•
•
This device is particularly well-suited for portable elec-
tronics (e.g. wireless handsets, PDAs, notebook com-
puters) because of its small package and easy-to-use
pin assignments. In particular, the CM1440 is ideal for
EMI filtering and protecting data and control lines for
the I/O data ports, LCD display and camera interface in
mobile handsets.
LCD and Camera data lines in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
EMI filtering for data ports in cell phones, PDAs or
notebook computers.
•
•
•
•
Wireless handsets
Handheld PCs/PDAs
LCD and camera modules
The CM1440 incorporates OptiGuard™ which results
in improved reliability at assembly. The CM1440 is
available in a space saving, low profile Chip Scale
Package with optional lead-free finishing. It is manu-
factured with a 0.40mm pitch and 0.25mm CSP solder
ball to provide up to 28% board space savings versus
competing CSP devices with 0.50mm pitch and
0.30mm CSP solder ball.
Electrical Schematic
100Ω
FILTERn*
FILTERn*
(Pins A1-A6)
(Pins C1-C6)
30pF
30pF
GND
(Pins B1-B3)
* See Package/Pinout Diagram
for expanded pin information.
1 of 6 EMI/RFI + ESD Channels
© 2005 California Micro Devices Corp. All rights reserved.
11/08/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
1
CM1440
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
TOP VIEW
(Bumps Up View)
(Bumps Down View)
Orientation
Marking
1
2
3
4
5
6
(see note 2)
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
C1
C2
C3
C4
C5
C6
A
B
C
GND
GND
GND
B1
B2
B3
N406
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
Orientation
Marking
A1
A2
A3
A4
A5
A6
A1
CM1440-06CS/CP
15 Bump CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "
+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN(s)
A1
NAME
DESCRIPTION
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
GND
Filter Channel 1
Filter Channel 2
Filter Channel 3
Filter Channel 4
Filter Channel 5
Filter Channel 6
Device Ground
Filter Channel 1
Filter Channel 2
Filter Channel 3
Filter Channel 4
Filter Channel 5
Filter Channel 6
A2
A3
A4
A5
A6
B1-B3
C1
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
C2
C3
C4
C5
C6
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Lead-free Finish2
Ordering Part
Number1
CM1440-06CP
Ordering Part
Number1
Pins
Package
Part Marking
Part Marking
15
CSP
CM1440-06CS
N406
N406
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 11/08/05
CM1440
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
-65 to +150
100
UNITS
°C
Storage Temperature Range
DC Power per Resistor
DC Package Power Rating
mW
mW
500
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
°C
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1)
SYMBOL PARAMETER
CONDITIONS
MIN
80
TYP
100
60
MAX
UNITS
Ω
R
Resistance
120
72
CTOTAL
Total Channel Capacitance
At 2.5VDC Reverse
48
pF
Bias, 1MHz, 30mVAC
C
Capacitance C1
At 2.5VDC Reverse
24
30
36
pF
Bias, 1MHz, 30mVAC
VDIODE
ILEAK
VSIG
Standoff Voltage
IDIODE=10μA
VDIODE=+3.3V
ILOAD = 10mA
6.0
0.1
V
Diode Leakage Current (reverse bias)
1
μA
Signal Clamp Voltage
Positive Clamp
5.6
-1.5
6.8
-0.8
9.0
-0.4
V
V
Negative Clamp
VESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883, Method
3015
Notes 2 and 3
30
30
kV
kV
b) Contact Discharge per IEC 61000-4-2 Level 4
RDYN
Dynamic Resistance
Positive
2.3
0.9
Ω
Ω
Negative
Cut-off Frequency
R=100Ω, C=30pF
fC
ZSOURCE=50Ω, ZLOAD=50Ω
60
MHz
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: These parameters are guaranteed by design and characterization.
© 2005 California Micro Devices Corp. All rights reserved.
11/08/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
3
CM1440
Performance Information
Typical Filter Performance (T =25°C, DC Bias=0V, 50 Ohm Environment)
A
Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1)
Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1)
© 2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 11/08/05
CM1440
Performance Information (cont’d)
Typical Filter Performance (T =25°C, DC Bias=0V, 50 Ohm Environment)
A
Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2)
© 2005 California Micro Devices Corp. All rights reserved.
11/08/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
5
CM1440
Performance Information (cont’d)
Typical Filter Performance (T =25°C, DC Bias=0V, 50 Ohm Environment)
A
Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B3)
Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B3)
© 2005 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 11/08/05
CM1440
Performance Information (cont’d)
Typical Diode Capacitance vs. Input Voltage
DC Voltage
Figure 7. Filter Capacitance vs. Input Voltage
(normalized to capacitance at 2.5VDC and 25°C)
© 2005 California Micro Devices Corp. All rights reserved.
11/08/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
7
CM1440
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
0.240mm
Pad Size on PCB
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
0.290mm Round
0.125mm - 0.150mm
0.300mm Round
50/50 by volume
No Clean
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
OSP (Entek Cu Plus 106A)
+50μm
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous (183°C)
Maximum Soldering Temperature for a Eutectic Device using Eutectic Solder Paste
Maximum Soldering Temperature for a Lead-free Device using Lead-free Solder Paste
60 seconds
240°C
260°C
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 8. Recommended Non-Solder Mask Defined Pad Illustration
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
Figure 9. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 10. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2005 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 11/08/05
CM1440
Mechanical Details
CSP Mechanical Specifications
Mechanical Package Diagrams
CM1440 devices are supplied in a custom Chip Scale
Package (CSP). Dimensions are presented below. For
complete information on CSP packaging, see the Cali-
fornia Micro Devices CSP Package Information docu-
ment.
OptiGuardTM
Coating
BOTTOM VIEW
A1
C1
B2
B1
PACKAGE DIMENSIONS
C
B
A
Package
Bumps
Custom CSP
15
Millimeters
Nom
Inches
Nom
1
2
3
4
5
6
Dim
D1
D2
Min
Max
Min
Max
0.25 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
2.3150 2.3600 2.4050 0.911 0.0929 0.0947
1.008 1.053 1.098 0.0397 0.0415 0.0432
0.395 0.4000 0.405 0.0156 0.0157 0.0159
0.195 0.2000 0.205 0.0076 0.0078 0.0080
0.3415 0.3465 0.3515 0.0134 0.0136 0.0138
0.3415 0.3465 0.3515 0.0134 0.0136 0.0138
0.130 0.1800 0.230 0.0051 0.0071 0.0091
0.130 0.1800 0.230 0.0051 0.0071 0.0091
0.575 0.644 0.714 0.0226 0.0254 0.0281
0.368 0.419 0.470 0.0145 0.0165 0.0185
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1440 Chip Scale Package
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
POCKET SIZE (mm)
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
B0 X A0 X K0
P0
P1
PART NUMBER
CHIP SIZE (mm)
CM1440
2.36 X 1.053X 0.644
2.62 X 1.12X 0.76
8mm
178mm (7")
3500
4mm 4mm
10 Pitches Cumulative
Tolerance On Tape
0.2 mm
P
o
±
Top
Cover
Tape
A
o
W
B
o
K
o
For Tape Feeder Reference
Embossment
Only including Draft.
P
Center Lines
of Cavity
1
Concentric Around B.
User Direction of Feed
Figure 11. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
11/08/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
9
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