A3983SLPTR [ALLEGRO]
DMOS Microstepping Driver with Translator; DMOS细分驱动器与翻译型号: | A3983SLPTR |
厂家: | ALLEGRO MICROSYSTEMS |
描述: | DMOS Microstepping Driver with Translator |
文件: | 总13页 (文件大小:342K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
A3983
DMOS Microstepping Driver with Translator
Features and Benefits
▪ Low RDS(ON) outputs
Description
The A3983 is a complete microstepping motor driver with
▪ Automatic current decay mode detection/selection
▪ Mixed and Slow current decay modes
▪ Synchronous rectification for low power dissipation
▪ Internal UVLO and thermal shutdown circuitry
▪ Crossover-current protection
built-in translator for easy operation. It is designed to operate
bipolar stepper motors in full-, half-, quarter-, and eighth-step
modes, with an output drive capacity of up to 35 V and ±2 A.
The A3983 includes a fixed off-time current regulator which
has the ability to operate in Slow or Mixed decay modes.
The translator is the key to the easy implementation of the
A3983. Simply inputting one pulse on the STEP input drives
the motor one microstep. There are no phase sequence tables,
highfrequencycontrollines,orcomplexinterfacestoprogram.
The A3983 interface is an ideal fit for applications where a
complex microprocessor is unavailable or is overburdened.
Package: 24-pin TSSOP with exposed thermal pad
(suffix LP)
The chopping control in the A3983 automatically selects the
current decay mode (Slow or Mixed). When a signal occurs at
the STEP input pin, the A3983 determines if that step results
in a higher or lower current in each of the motor phases. If
the change is to a higher current, then the decay mode is set to
Slow decay. If the change is to a lower current, then the current
decay is set to Mixed (set initially to a fast decay for a period
amounting to 31.25% of the fixed off-time, then to a slow
decay for the remainder of the off-time). This current decay
Not to scale
Continued on the next page…
Functional Block Diagram
0.1 μF
0.22 μF
CP1
CP2
VREG
ROSC
VDD
REF
Current
Regulator
Charge
Pump
OSC
VCP
0.1 μF
DMOS Full Bridge
VBB1
DAC
OUT1A
OUT1B
PWM Latch
Blanking
Mixed Decay
SENSE1
VBB2
STEP
DIR
Gate
Drive
RS1
DMOS Full Bridge
RESET
Control
Logic
Translator
MS1
MS2
OUT2A
OUT2B
PWM Latch
Blanking
Mixed Decay
ENABLE
SLEEP
SENSE2
RS2
DAC
VREF
26184.29D
A3983
DMOS Microstepping Driver with Translator
Description (continued)
control scheme results in reduced audible motor noise, increased
step accuracy, and reduced power dissipation.
lockout (UVLO), and crossover-current protection. Special power-
on sequencing is not required.
Internal synchronous rectification control circuitry is provided to
improve power dissipation during PWM operation. Internal circuit
protectionincludes:thermalshutdownwithhysteresis,undervoltage
TheA3983 is supplied in a low-profile (1.2 mm maximum height),
24-pin TSSOPwith exposed thermal pad (suffix LP). It is lead (Pb)
free, with 100% matte tin leadframe plating.
Selection Guide
Part Number
Package
Packing
A3983SLPTR-T
24-pin TSSOP with exposed thermal pad
4000 pieces per 13-in. reel
Absolute Maximum Ratings
Characteristic
Symbol
Notes
Rating
Units
Load Supply Voltage
VBB
35
V
Output current rating may be limited by duty cycle, ambient
temperature, and heat sinking. Under any set of conditions,
do not exceed the specified current rating or a junction tem-
perature of 150°C.
Output Current
IOUT
±2
A
Logic Input Voltage
Sense Voltage
V
–0.3 to 7
0.5
V
V
IN
VSENSE
VREF
Reference Voltage
4
V
Operating Ambient Temperature
Maximum Junction
TA
Range S
–20 to 85
150
ºC
ºC
ºC
TJ(max)
Tstg
Storage Temperature
–55 to 150
THERMAL CHARACTERISTICS
Characteristic
Symbol
Test Conditions*
Value Units
RθJA
Package Thermal Resistance
4-layer PCB, based on JEDEC standard)
28 ºC/W
*In still air. Additional thermal information available on Allegro Web site.
Maximum Power Dissipation, PD(max)
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
20
40
60
80
100
120
140
160
180
Temperature (°C)
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
2
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
A3983
DMOS Microstepping Driver with Translator
ELECTRICAL CHARACTERISTICS1 at TA = 25°C, VBB = 35 V (unless otherwise noted)
2
Characteristics
Output Drivers
Symbol
Test Conditions
Min.
Max.
Units
Typ.
Operating
8
0
–
–
–
35
35
V
V
Load Supply Voltage Range
Logic Supply Voltage Range
Output On Resistance
VBB
VDD
During Sleep Mode
Operating
3.0
–
5.5
0.450
0.370
1.2
1.2
4
V
Source Driver, IOUT = –1.5 A
Sink Driver, IOUT = 1.5 A
Source Diode, IF = –1.5 A
Sink Diode, IF = 1.5 A
fPWM < 50 kHz
0.350
Ω
RDSON
–
0.300
Ω
–
–
–
–
–
–
–
–
–
V
Body Diode Forward Voltage
Motor Supply Current
VF
–
V
–
mA
mA
μA
mA
mA
μA
IBB
Operating, outputs disabled
Sleep Mode
–
2
–
10
fPWM < 50 kHz
–
8
Logic Supply Current
IDD
Outputs off
–
5
Sleep Mode
–
10
Control Logic
VIN(1)
–
–
V
VDD0.7
–
Logic Input Voltage
VIN(0)
IIN(1)
IIN(0)
–
V
VDD0.3
–20
<1.0
<1.0
20
ꢀA
ꢀA
VIN = VDD0.7
VIN = VDD0.3
Logic Input Current
–20
20
Microstep Select 2
Input Hysteresis
Blank Time
MS2
VHYS(IN)
tBLANK
–
150
0.7
20
23
0
100
300
1
–
500
1.3
40
37
4
kΩ
mV
μs
μs
μs
V
OSC > 3 V
30
30
–
Fixed Off-Time
tOFF
ROSC = 25 kΩ
Reference Input Voltage Range
Reference Input Current
VREF
IREF
–3
–
0
3
μA
%
VREF = 2 V, %ITripMAX = 38.27%
VREF = 2 V, %ITripMAX = 70.71%
VREF = 2 V, %ITripMAX = 100.00%
–
±15
±5
±5
800
Current Trip-Level Error3
–
–
%
errI
tDT
–
–
%
Crossover Dead Time
Protection
100
475
ns
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
UVLO Enable Threshold
UVLO Hysteresis
TJ
–
165
15
–
–
3
–
°C
°C
V
TJHYS
UVLO
UVHYS
–
VDD rising
2.35
0.05
2.7
0.10
V
1
2
Negative current is defined as coming out of (sourcing from) the specified device pin.
Typical data are for initial design estimations only, and assume optimum manufacturing and application conditions. Performance may vary for
individual units, within the specified maximum and minimum limits.
3errI = (ITrip – IProg) ⁄ IProg, where IProg = %ITripMAX
I
.
TripMAX
Allegro MicroSystems, LLC
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115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
A3983
DMOS Microstepping Driver with Translator
t
t
B
A
STEP
t
t
D
C
MS1, MS2,
RESET, or DIR
Time Duration
Symbol
Typ.
1
Unit
μs
STEP minimum, HIGH pulse width
STEP minimum, LOW pulse width
Setup time, input change to STEP
Hold time, input change to STEP
tA
tB
tC
tD
1
μs
200
200
ns
ns
Figure 1. Logic Interface Timing Diagram
Table 1. Microstep Resolution Truth Table
MS1 MS2 Microstep Resolution Excitation Mode
L
H
L
L
L
Full Step
2 Phase
Half Step
1-2 Phase
W1-2 Phase
2W1-2 Phase
H
H
Quarter Step
Eighth Step
H
Allegro MicroSystems, LLC
4
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
A3983
DMOS Microstepping Driver with Translator
Functional Description
Device Operation. The A3983 is a complete microstep-
ping motor driver with a built-in translator for easy operation
Microstep Select (MS1 and MS2). Selects the micro-
stepping format, as shown in table 1. MS2 has a 100 kΩ pull-
down resistance. Any changes made to these inputs do not take
effect until the next STEP rising edge.
with minimal control lines. It is designed to operate bipolar
stepper motors in full-, half-, quarter-, and sixteenth-step
modes. The currents in each of the two output full-bridges
and all of the N-channel DMOS FETs are regulated with
fixed off-time PMW (pulse width modulated) control cir-
cuitry. At each step, the current for each full-bridge is set by
the value of its external current-sense resistor (RS1 or RS2), a
reference voltage (VREF), and the output voltage of its DAC
(which in turn is controlled by the output of the translator).
Direction Input (DIR). This determines the direction of
rotation of the motor. When low, the direction will be clock-
wise and when high, counterclockwise. Changes to this input
do not take effect until the next STEP rising edge.
Internal PWM Current Control. Each full-bridge is
controlled by a fixed off-time PWM current control circuit
that limits the load current to a desired value, ITRIP. Ini-
tially, a diagonal pair of source and sink DMOS outputs are
enabled and current flows through the motor winding and
the current sense resistor, RSx. When the voltage across RSx
equals the DAC output voltage, the current sense compara-
tor resets the PWM latch. The latch then turns off either the
source DMOS FETs (when in Slow Decay Mode) or the sink
and source DMOS FETs (when in Mixed Decay Mode).
At power-on or reset, the translator sets the DACs and the
phase current polarity to the initial Home state (shown in fig-
ures 2 through 5), and the current regulator to Mixed Decay
Mode for both phases. When a step command signal occurs
on the STEP input, the translator automatically sequences the
DACs to the next level and current polarity. (See table 2 for
the current-level sequence.) The microstep resolution is set
by the combined effect of inputs MS1 and MS2, as shown in
table 1.
The maximum value of current limiting is set by the selec-
tion of RSx and the voltage at the VREF pin. The transcon-
ductance function is approximated by the maximum value of
current limiting, ITripMAX (A), which is set by
When stepping, if the new output levels of the DACs are
lower than their previous output levels, then the decay mode
for the active full-bridge is set to Mixed. If the new output
levels of the DACs are higher than or equal to their previous
levels, then the decay mode for the active full-bridge is set
to Slow. This automatic current decay selection improves
microstepping performance by reducing the distortion of
the current waveform that results from the back EMF of the
motor.
ITripMAX = VREF /(8 R )
S
where RS is the resistance of the sense resistor (Ω) and VREF
is the input voltage on the REF pin (V).
The DAC output reduces the VREF output to the current
sense comparator in precise steps, such that
RESET Input (RESET). The RESET input sets the
translator to a predefined Home state (shown in figures 2
through 5), and turns off all of the DMOS outputs. All STEP
inputs are ignored until the RESET input is set to high.
Itrip = (%ITripMAX /100)
I
TripMAX
×
(See table 2 for %ITripMAX at each step.)
It is critical that the maximum rating (0.5 V) on the SENSE1
and SENSE2 pins is not exceeded.
Step Input (STEP). A low-to-high transition on the STEP
input sequences the translator and advances the motor one
increment. The translator controls the input to the DACs and
the direction of current flow in each winding. The size of
the increment is determined by the combined state of inputs
MS1 and MS2.
Fixed Off-Time. The internal PWM current control cir-
cuitry uses a one-shot circuit to control the duration of time
that the DMOS FETs remain off. The one shot off-time, tOFF
is determined by the selection of an external resistor con-
nected from the ROSC timing pin to ground. If the ROSC
,
Allegro MicroSystems, LLC
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115 Northeast Cutoff, Box 15036
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www.allegromicro.com
A3983
DMOS Microstepping Driver with Translator
pin is tied to an external voltage > 3 V, then tOFF defaults to
30 μs. The ROSC pin can be safely connected to the VDD
pin for this purpose. The value of tOFF (μs) is approximately
Shutdown. In the event of a fault, overtemperature
(excess TJ) or an undervoltage (on VCP), the DMOS out-
puts of the A3983 are disabled until the fault condition is
removed. At power-on, the UVLO (undervoltage lockout)
circuit disables the DMOS outputs and resets the translator to
the Home state.
tOFF ≈ ROSC ⁄ 825
Blanking. This function blanks the output of the current
sense comparators when the outputs are switched by the
internal current control circuitry. The comparator outputs are
blanked to prevent false overcurrent detection due to reverse
recovery currents of the clamp diodes, and switching tran-
sients related to the capacitance of the load. The blank time,
tBLANK (μs), is approximately
Sleep Mode (SLEEP). To minimize power consumption
when the motor is not in use, this input disables much of the
internal circuitry including the output DMOS FETs, current
regulator, and charge pump. A logic low on the SLEEP pin
puts the A3983 into Sleep mode. A logic high allows normal
operation, as well as start-up (at which time the A3983 drives
the motor to the Home microstep position). When emerging
from Sleep mode, in order to allow the charge pump to stabi-
lize, provide a delay of 1 ms before issuing a Step command.
tBLANK ≈ 1 μs
Charge Pump (CP1 and CP2). The charge pump is
used to generate a gate supply greater than that of VBB
for driving the source-side DMOS gates. A 0.1 μF ceramic
capacitor, should be connected between CP1 and CP2. In
addition, a 0.1 μF ceramic capacitor is required between
VCP and VBB, to act as a reservoir for operating the
high-side DMOS gates.
Mixed Decay Operation. The bridge can operate in
Mixed Decay mode, depending on the step sequence, as
shown in figures 3 thru 5. As the trip point is reached, the
A3983 initially goes into a fast decay mode for 31.25% of
the off-time. tOFF. After that, it switches to Slow Decay mode
for the remainder of tOFF
.
VREG (VREG). This internally-generated voltage is used
to operate the sink-side DMOS outputs. The VREG pin must
be decoupled with a 0.22 μF ceramic capacitor to ground.
VREG is internally monitored. In the case of a fault condi-
tion, the DMOS outputs of the A3983 are disabled.
Synchronous Rectification. When a PWM-off cycle
is triggered by an internal fixed–off-time cycle, load current
recirculates according to the decay mode selected by the
control logic. This synchronous rectification feature turns on
the appropriate FETs during current decay, and effectively
shorts out the body diodes with the low DMOS RDS(ON). This
reduces power dissipation significantly, and can eliminate
the need for external Schottky diodes in many applications.
Turning off synchronous rectification prevents the reversal of
the load current when a zero-current level is detected.
Enable Input (ENABLE). This input turns on or off all of
the DMOS outputs. When set to a logic high, the outputs are
disabled. When set to a logic low, the internal control enables
the outputs as required. The translator inputs STEP, DIR,
MS1, and MS2, as well as the internal sequencing logic, all
remain active, independent of the ENABLE input state.
Allegro MicroSystems, LLC
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115 Northeast Cutoff, Box 15036
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www.allegromicro.com
A3983
DMOS Microstepping Driver with Translator
Application Layout
be created using the exposed thermal pad under the device, to
serve both as a low impedance ground point and thermal path.
Layout. The printed circuit board should use a heavy ground-
plane. For optimum electrical and thermal performance, the
A3983 must be soldered directly onto the board. On the under-
side of the A3983 package is an exposed pad, which provides a
The two input capacitors should be placed in parallel, and as
close to the device supply pins as possible. The ceramic capaci-
path for enhanced thermal dissipation. The thermal pad should be tor (CIN1) should be closer to the pins than the bulk capacitor
(CIN2). This is necessary because the ceramic capacitor will be
responsible for delivering the high frequency current components.
The sense resistors, RSx, should have a very low impedance
path to ground, because they must carry a large current while
supporting very accurate voltage measurements by the current
sense comparators. Long ground traces will cause additional
voltage drops, adversely affecting the ability of the comparators
to accurately measure the current in the windings. The SENSEx
pins have very short traces to the RSx resistors and very thick,
low impedance traces directly to the star ground underneath the
device. If possible, there should be no other components on the
sense circuits.
soldered directly to an exposed surface on the PCB. Thermal vias
are used to transfer heat to other layers of the PCB.
In order to minimize the effects of ground bounce and offset
issues, it is important to have a low impedance single-point
ground, known as a star ground, located very close to the device.
By making the connection between the pad and the ground plane
directly under the A3983, that area becomes an ideal location for
a star ground point. A low impedance ground will prevent ground
bounce during high current operation and ensure that the supply
voltage remains stable at the input terminal. The star ground can
Solder
A3983
Trace (2 oz.)
Signal (1 oz.)
Ground (1 oz.)
Thermal (2 oz.)
PCB
Thermal Vias
OUT2B
C6
C3
GND
U1
A3983
GND
CP1
C4
GND
C3
GND
C5
ENABLE
OUT2B
CP2
VCP
OUT2A
OUT1A
R4
R5
C4
C5
VBB2
SENSE2
OUT2A
OUT1A
SENSE1
VBB1
C6
PAD
VREG
ROSC
C1
R4
R5
MS1
MS2
GND
RESET
ROSC
ROSC
SLEEP
OUT1B
OUT1B
DIR
VDD
STEP
REF
BULK
GND
GND
GND
C1
GND
C2
GND
CAPACITANCE
C2
VDD
V
BB
VDD
VBB
Allegro MicroSystems, LLC
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Worcester, Massachusetts 01615-0036 (508) 853-5000
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A3983
DMOS Microstepping Driver with Translator
STEP
STEP
100.00
70.71
100.00
70.71
Slow
Mixed
Slow
Mixed
Slow
Mixed
Slow
Phase 1
IOUT1A
Phase 1
IOUT1A
0.00
0.00
Direction = H
(%)
Direction = H
(%)
–70.71
–70.71
–100.00
100.00
70.71
–100.00
100.00
70.71
Slow
Slow
Mixed
Slow
Mixed
Slow
Mixed
Phase 2
Phase 2
IOUT2A
IOUT2B
0.00
0.00
Direction = H
(%)
Direction = H
(%)
Slow
–70.71
–70.71
–100.00
–100.00
Figure 2. Decay Mode for Full-Step Increments
Figure 3. Decay Modes for Half-Step Increments
STEP
100.00
92.39
70.71
38.27
Phase 1
Slow
Mixed
Slow
Mixed
Slow
IOUT1A
0.00
Direction = H
(%)
–38.27
–70.71
–92.39
–100.00
100.00
92.39
70.71
38.27
Slow
Phase 2
IOUT2B
Mixed
Slow
Mixed
Slow
Mixed
0.00
Direction = H
(%)
–38.27
–70.71
–92.39
–100.00
Figure 4. Decay Modes for Quarter-Step Increments
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A3983
DMOS Microstepping Driver with Translator
STEP
100.00
92.39
83.15
70.71
55.56
38.27
Phase 1
IOUT1A
19.51
Slow
Mixed
Slow
Mixed
0.00
Direction = H
(%)
–19.51
–38.27
–55.56
–70.71
–83.15
–92.39
–100.00
100.00
92.39
83.15
70.71
55.56
38.27
Phase 2
IOUT2B
19.51
Mixed
Slow
Mixed
Slow
0.00
Direction = H
(%)
–19.51
–38.27
–55.56
–70.71
–83.15
–92.39
–100.00
Figure 5. Decay Modes for Eighth-Step Increments
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A3983
DMOS Microstepping Driver with Translator
Table 2. Step Sequencing Settings
Home microstep position at Step Angle 45º; DIR = H
Phase 1
Current
tripMax
(%)
Phase 2
Current
tripMax
(%)
Full
Half
1/4
1/8
Step
Angle
(º)
Step Step Step Step [% I
#
]
[% I
]
#
#
#
1
1
1
100.00
98.08
0.00
19.51
0.0
2
11.3
2
3
3
92.39
38.27
22.5
4
83.15
55.56
33.8
1
2
3
4
5
6
7
8
5
70.71
70.71
45.0
6
55.56
83.15
56.3
4
7
38.27
92.39
67.5
8
19.51
98.08
78.8
5
9
0.00
100.00
98.08
90.0
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
–19.51
–38.27
–55.56
–70.71
–83.15
–92.39
–98.08
–100.00
–98.08
–92.39
–83.15
–70.71
–55.56
–38.27
–19.51
0.00
101.3
112.5
123.8
135.0
146.3
157.5
168.8
180.0
191.3
202.5
213.8
225.0
236.3
247.5
258.8
270.0
281.3
292.5
303.8
315.0
326.3
337.5
348.8
6
92.39
83.15
2
3
4
7
70.71
55.56
8
38.27
19.51
9
0.00
–19.51
–38.27
–55.56
–70.71
–83.15
–92.39
–98.08
–100.00
–98.08
–92.39
–83.15
–70.71
–55.56
–38.27
–19.51
10
11
12
13
14
15
16
19.51
38.27
55.56
70.71
83.15
92.39
98.08
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
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Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
A3983
DMOS Microstepping Driver with Translator
Package LP
GND
CP1
CP2
1
2
24
23
22
21
20
19
18
17
16
15
14
13
ENABLE
OUT2B
VBB2
VCP
3
VREG
MS1
4
SENSE2
OUT2A
OUT1A
SENSE1
VBB1
5
MS2
6
PAD
RESET
ROSC
SLEEP
VDD
7
8
9
OUT1B
DIR
10
11
12
STEP
REF
GND
Terminal List Table
Number
Name
Description
Package LP
CP1
CP2
1
2
Charge pump capacitor terminal
Charge pump capacitor terminal
Reservoir capacitor terminal
Regulator decoupling terminal
Logic input
VCP
3
VREG
MS1
4
5
MS2
6
Logic input
RESET
ROSC
SLEEP
VDD
7
Logic input
8
Timing set
9
Logic input
10
11
12
13, 24
14
15
16
17
18
19
20
21
22
23
–
Logic supply
STEP
REF
Logic input
G
m reference voltage input
GND
Ground*
DIR
Logic input
OUT1B
VBB1
SENSE1
OUT1A
OUT2A
SENSE2
VBB2
OUT2B
ENABLE
NC
DMOS Full Bridge 1 Output B
Load supply
Sense resistor terminal for Bridge 1
DMOS Full Bridge 1 Output A
DMOS Full Bridge 2 Output A
Sense resistor terminal for Bridge 2
Load supply
DMOS Full Bridge 2 Output B
Logic input
No connection
PAD
–
Exposed pad for enhanced thermal dissipation*
*The GND pins must be tied together externally by connecting to the PAD ground plane
under the device.
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
11
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
A3983
DMOS Microstepping Driver with Translator
LP Package, 24-Pin TSSOP with Exposed Thermal Pad
0.65
7.80 ±0.10
0.45
4° ±4
24
+0.05
0.15
–0.06
B
3.00
6.10
3.00 4.40 ±0.10 6.40 ±0.20
0.60 ±0.15
(1.00)
A
1
2
4.32
0.25
1.65
4.32
24X
C
SEATING PLANE
GAUGE PLANE
SEATING
PLANE
C
PCB Layout Reference View
0.10
C
+0.05
–0.06
0.25
0.65
1.20 MAX
0.15 MAX
For reference only
(reference JEDEC MO-153 ADT)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
Terminal #1 mark area
A
B
C
Exposed thermal pad (bottom surface)
Reference land pattern layout (reference IPC7351
TSOP65P640X120-25M); all pads a minimum of 0.20 mm from all
adjacent pads; adjust as necessary to meet application process
requirements and PCB layout tolerances; when mounting on a multilayer
PCB, thermal vias at the exposed thermal pad land can improve thermal
dissipation (reference EIA/JEDEC Standard JESD51-5)
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
12
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
A3983
DMOS Microstepping Driver with Translator
Copyright ©2005-2013, Allegro MicroSystems, LLC
Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to
permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its
use; nor for any infringement of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
www.allegromicro.com
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
13
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
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