A2525EL [ALLEGRO]

USB POWER CONTROL SWITCHES; USB电源控制开关
A2525EL
型号: A2525EL
厂家: ALLEGRO MICROSYSTEMS    ALLEGRO MICROSYSTEMS
描述:

USB POWER CONTROL SWITCHES
USB电源控制开关

电源电路 开关 电源管理电路 功率控制 光电二极管
文件: 总12页 (文件大小:202K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
2535 AND  
2525  
USB POWER CONTROL SWITCHES  
The A2525EL/M and A2535EL/M are integrated high-side power  
switches, optimized for self-powered and bus-powered Universal Serial  
Bus (USB) applications. Few external components are necessary to  
satisfy USB requirements. The A2525EL/EM ENABLE inputs are  
active high; the A2535EL/EM are active low.  
A2525EM  
1
2
3
4
8
7
6
5
OUT  
IN  
EN  
FLG  
GND  
NC  
All devices are ideally suited for USB applications. Each switch  
channel supplies up to 500 mA as required by USB peripheral devices.  
In addition, the switch’s low on-resistance permits achieving the USB  
voltage-drop requirements. Fault current is limited to typically  
750 mA, satisfying the UL 25 VA safety requirements, and a flag  
output is available to indicate a fault condition to the local USB  
controller. Momentary voltage drops that may occur on the upstream  
port when the switch is enabled in bus-powered applications is elimi-  
nated by a “soft start” feature.  
NC  
NC  
NC  
NC  
NC  
Dwg. PP-070A  
Note that the A2525EM (DIP) and the  
A2525EL (SOIC) are electrically identical and  
share a common terminal number assignment.  
Additional features include thermal shutdown to prevent catastrophic  
switch failure from high-current loads, undervoltage lockout to ensure  
that the device remains OFF unless there is a valid input voltage  
present, and 3.3 V and 5 V logic-compatible enable inputs.  
These switches are provided in 8-pin mini-DIP (suffix ‘M’) and  
8-lead SOIC (suffix ‘L’) packages.  
ABSOLUTE MAXIMUM RATINGS  
Supply Voltage, VIN ..................... 6.0 V  
Output Voltage, VOUT .................. 6.0 V  
Features  
I 2.7 V to 5.8 V Input  
Output Current,  
IOUT ................. Internally Limited  
ENABLE Voltage Range,  
VEN ......................... –0.3 V to 10 V  
Fault Flag Voltage, VFLG .............. 8.0 V  
Fault Flag Current, IFLG ............. 50 mA  
Package Power Dissipation,  
PD ................................. See Graph  
Operating Temperature Range,  
I Up to 500 mA Continuous Load Current per Port  
I 140 mMaximum ON-Resistance  
I 1.25 A Maximum Short-Circuit Current Limit  
I Individual Open-Drain Fault Flag Outputs  
I 100 µA Typical ON-State Supply Current  
I <1 µA Typical OFF-State Supply Current  
I Outputs Can be Forced Higher Than Input (off-state)  
I Thermal Shutdown  
I 2.2 V Typical Undervoltage Lockout  
I 0.6 ms Turn On (soft-start) and Fast Turn Off  
I A2525 (active-high) Improved Replacement for MIC2525-1  
I A2535 (active-low) Improved Replacement for MIC2525-2  
TA .......................... -40°C to +85°C  
Junction Temperature, TJ ....... +150°C*  
Storage Temperature Range,  
TS ........................... -65°C to 150°C  
Applications  
* Fault conditions that produce excessive  
junction temperature will activate device  
thermal shutdown circuitry. These conditions  
can be tolerated but should be avoided.  
I USB Hosts and Self-Powered Hubs  
I USB Bus-Powered Hubs  
I Hot Plug-In Power Supplies  
I Battery-Charger Circuits  
2525 AND 2535  
USB  
POWER CONTROL  
SWITCHES  
FUNCTIONAL BLOCK DIAGRAM  
FLG  
OUT  
A2535 ONLY  
EN  
CHARGE  
PUMP  
CURRENT  
LIMIT  
OSC  
1.2 V  
REF.  
IN  
UVLO  
TSD  
GND  
Dwg. FP-049  
2.5  
2.0  
1.5  
1.0  
0.5  
0
A2535EM  
1
2
3
4
8
7
6
5
OUT  
EN  
FLG  
GND  
NC  
IN  
SUFFIX 'M', RθJA = 60°C/W  
NC  
NC  
NC  
NC  
NC  
SUFFIX 'L', RθJA = 108°C/W  
Dwg. PP-070-1A  
Note that the A2535EM (DIP) and the  
25  
50  
75  
100  
125  
150  
A2535EL (SOIC) are electrically identical and  
share a common terminal number assignment.  
AMBIENT TEMPERATURE IN °C  
Dwg. GP-009-2  
115 Northeast Cutoff, Box 15036  
Worcester, Massachusetts 01615-0036 (508) 853-5000  
Copyright © 2000, Allegro MicroSystems, Inc.  
2
2525 AND 2535  
USB  
POWER CONTROL  
SWITCHES  
Electrical Characteristics at TA = 25°C, VIN = 5 V.  
Limits  
Parameter  
Test Conditions  
Min  
2.7  
Typ  
Max  
5.8  
140  
140  
10  
Units  
V
Operating Voltage Range  
Switch Resistance  
VIN  
VIN = 5 V, IOUT = 500 mA  
VIN = 3.3 V, IOUT = 500 mA  
Output disabled, VIN = 5 V, VOUT = 0  
100  
100  
<1.0  
mΩ  
mΩ  
µA  
mA  
A
Output Leakage Current  
Maximum Load Current  
500  
0.5  
Short-Circuit Current Limit Output enabled into load, VOUT = 4 V  
0.75  
0.9  
2.1  
1.9  
0.2  
0.01  
1.0  
0.5  
0.6  
10  
1.25  
Current-Limit Threshold  
ENABLE Input Threshold  
Ramped load applied to enabled output, VOUT 4 V  
A
Low-to-high transition  
High-to-low transition  
2.4  
V
0.8  
V
ENABLE Input Hysteresis  
ENABLE Input Current  
ENABLE Input Cap.  
V
VEN = 0 V to 5.5 V  
1.0  
µA  
pF  
ms  
ms  
µs  
µs  
Output Turn-On Delay  
RL = 10 , CL = 1 µF, 50% VENABLE to 10% VOUT  
Output Turn-On Rise Time RL = 10 , CL = 1 µF, 10% VOUT to 90% VOUT  
Output Turn-Off Delay RL = 10 , CL = 1 µF, 50% VENABLE to 90% VOUT  
Output Turn-Off Fall Time RL = 10 , CL = 1 µF, 90% VOUT to 10% VOUT  
25  
Error Flag Output  
Resistance  
VIN = 5 V, IL = 10 mA  
VIN = 3.3 V, IL = 10 mA  
VFLG = 5 V  
8.0  
10  
Error Flag Off Current  
Supply Current  
0.01  
0.2  
100  
2.35  
2.2  
165  
155  
µA  
µA  
µA  
V
Switch disabled (see note), OUT = open  
Switch enabled (see note), OUT = open  
Increasing VIN  
5.0  
160  
UVLO Threshold  
Decreasing VIN  
V
Over-Temperature  
Increasing TJ  
°C  
°C  
Shutdown Threshold  
Decreasing TJ  
Note — Disabled is 0.8 V and enabled is 2.4 V (active high) for the A2525EL/EM. Disabled is 0.8VIN and enabled is 0.8 V  
(active low) for the A2535EL/EM.  
www.allegromicro.com  
3
2525 AND 2535  
USB  
POWER CONTROL  
SWITCHES  
FUNCTIONAL DESCRIPTION  
Power switch  
Fault Flag (FLG)  
The power switch is an N-channel MOSFET with a maximum  
on-state resistance of 140 m(VIN = 5 V). Configured as a  
high-side switch, the power switch prevents current flow in  
either direction if disabled. The drain body diode is discon-  
nected from the source when the switch is OFF allowing the  
output voltage to exceed the input voltage without causing  
current conduction. The power switch supplies a minimum of  
500 mA per switch.  
This open drain output is asserted (active low) when an  
overcurrent or over temperature condition is encountered. The  
output will remain asserted until the overcurrent or over  
temperature condition is removed.  
Current sense  
A sense FET monitors the current supplied to the load. The  
sense FET measures current more efficiently than conventional  
resistance methods. When an overload or short circuit is  
encountered, the current-sense circuitry sends a control signal to  
the driver. The driver in turn reduces the gate voltage and  
drives the power FET into its saturation region, which switches  
the output into a constant-current mode and holds the current  
constant while varying the voltage on the load.  
Charge pump  
An internal charge pump supplies power to the driver circuit  
and provides the necessary voltage to pull the gate of the  
MOSFET above the source. The charge pump operates from  
input voltages as low as 2.7 V. The charge pump is limited to  
2.5 µA to establish a controlled turn on time of typically 1 ms.  
Thermal sense  
Driver  
An internal thermal-sense circuit shuts off the power switch  
when the junction temperature rises to approximately 165°C.  
Hysteresis is built into the thermal sense circuit. After the  
device has cooled approximately 10°C, the switch turns back  
ON. The switch continues to cycle off and on until the fault is  
removed.  
The driver controls the gate voltage of the power switch. To  
limit large current surges and reduce the associated electromag-  
netic interference (EMI) produced, the driver incorporates  
circuitry that controls the rise times and fall times of the output  
voltage. The rise time is typically 1 ms.  
ENABLE (EN or EN)  
Undervoltage lockout  
The logic enable disables the power switch and the bias for the  
charge pump, driver, and other circuitry to reduce the supply  
current to less than 5 µA maximum when a logic high is present  
on EN (A2525) or a logic low is present (A2535). The proper  
logic level restores bias to the drive and control circuits and  
turns the power ON. The enable input is a compatible with both  
TTL and CMOS logic levels.  
A voltage-sense circuit monitors the input voltage. When the  
input voltage is approximately 2 V, a control signal turns OFF  
the power switch.  
115 Northeast Cutoff, Box 15036  
Worcester, Massachusetts 01615-0036 (508) 853-5000  
4
2525 AND 2535  
USB  
POWER CONTROL  
SWITCHES  
NO-LOAD SWITCHING PERFORMANCE  
V
OUT  
1 V/  
200 µs/ꢀ  
V
1 V/  
OUT  
50 µs/ꢀ  
V
ENABLE  
VENABLE  
V
OUT  
1 V/  
50 µs/ꢀ  
V
ENABLE  
www.allegromicro.com  
5
2525 AND 2535  
USB  
POWER CONTROL  
SWITCHES  
CAPACITIVE-LOAD SWITCHING PERFORMANCE  
V
ENABLE  
VENABLE  
V
OUT  
2 V/  
V
OUT  
2 V/ꢀ  
1 ms/ꢀ  
1 ms/ꢀ  
C
R
L
= 50 µF  
C
R
L
= 100 µF  
L
= 100 Ω  
L
= 100 Ω  
I
OUT  
I
OUT  
500 mA/ꢀ  
500 mA/ꢀ  
V
FAULT  
VFAULT  
VENABLE  
VOUT  
2 V/  
1 ms/ꢀ  
C
L
= 1000 µF  
R = 12 Ω  
L
CURRENT LIMITING  
IOUT  
500 mA/ꢀ  
VFAULT  
115 Northeast Cutoff, Box 15036  
Worcester, Massachusetts 01615-0036 (508) 853-5000  
6
2525 AND 2535  
USB  
POWER CONTROL  
SWITCHES  
OUTPUT SHORT-CIRCUIT PERFORMANCE  
VFAULT  
V
FAULT  
V
OUT  
VOUT  
2 µs/  
5 ms/  
I
OUT  
4 A/ꢀ  
IOUT  
4 A/ꢀ  
15 mΩ  
SHORT CIRCUIT  
15 m  
SHORT CIRCUIT  
V
FAULT  
VFAULT  
I
OUT  
500 ms/  
400 mA/ꢀ  
500 ms/  
RL = 15 m  
THERMAL  
SHUTDOWN  
THERMAL SHUTDOWN  
IOUT  
1 A/ꢀ  
15 m  
SHORT CIRCUIT  
www.allegromicro.com  
7
2525 AND 2535  
USB  
POWER CONTROL  
SWITCHES  
APPLICATIONS INFORMATION  
Overcurrent  
compared to those of power packages; it is good design practice  
to check power dissipation and junction temperature. The first  
step is to find rDS(on) at the input voltage and operating tempera-  
ture. Next, calculate the power dissipation using:  
PD = rDS(on) x I2  
Finally, calculate the junction temperature:  
TJ = PD x RθJA + TA  
A sense FET is employed for overcurrent conditions. Unlike  
current-sense resistors, sense FETs do not increase the series  
resistance of the current path. When an overcurrent condition is  
detected, the device maintains a constant output current and  
reduces the output voltage accordingly. Complete shutdown  
occurs only if the fault is present long enough to activate  
thermal limiting.  
where:  
TA = ambient temperature °C  
RθJA = thermal resistance (SOIC = 108°C/W, DIP = 60°C/W).  
Three possible overload conditions can occur. In the first  
condition, the output has been shorted before the device is  
enabled or between VIN has been applied. The device senses  
the short and immediately switches into a constant-current  
output.  
Thermal protection  
Thermal protection prevents damage to the IC when heavy-  
overload or short-circuit faults are present for extended periods  
of time. The faults force these devices into constant-current  
mode, which causes the voltage across the high-side switch to  
increase; under short-circuit conditions, the voltage across the  
switch is equal to the input voltage. The increased dissipation  
causes the junction temperature to rise to high levels. The  
protection circuit senses the junction temperature of the switch  
and shuts it OFF. Hysteresis is built into the thermal sense  
circuit, and after the device has cooled approximately 20°, the  
switch turns back ON. The switch continues to cycle in this  
manner until the load fault or input power is removed.  
In the second condition, the short occurs while the device is  
enabled. At the instant the short occurs, very high currents may  
flow for a short time before the current-limit circuit can react .  
After the current-limit circuit has tripped (reached the  
overcurrent trip threshold) the device switches into constant-  
current mode.  
In the third condition, the load has been gradually increased  
beyond the recommended operating current. The current is  
permitted to rise until the current-limit threshold is reached or  
until the thermal limit of the device is exceeded. The device is  
capable of delivering current up to the current-limit threshold  
without damage. Once the threshold has been reached, the  
device switches into its constant-current mode.  
Undervoltage lock-out (UVLO)  
An undervoltage lockout ensures that the power switch is in the  
OFF state at power up. Whenever the input voltage falls below  
approximately 2 V, the power switch will be quickly turned  
OFF. This facilitates the design of hot-insertion systems where  
it is not possible to turn OFF the power switch before input  
power is removed. The UVLO will also keep the switch from  
being turned ON until the power supply has reached at least  
2 V, even if the switch is enabled. Upon reinsertion, the power  
switch will be turned ON, with a controlled rise time to reduce  
EMI and voltage overshoots.  
Fault Flag (FLG)  
The FLG open-drain output is asserted (active low) when an  
overcurrent or over-temperature condition is encountered. The  
output will remain asserted until the overcurrent or over-  
temperature condition is removed. Connecting a heavy  
capacitive load to an enabled device can cause momentary false  
over-current reporting from the inrush current flowing through  
the device, charging the downstream capacitor. An RC filter  
can be connected to the terminal to reduce false overcurrent  
reporting. Using low-ESR electrolytic capacitors on the output  
lowers the inrush current flow through the device during hot-  
plug events by providing a low impedance energy source,  
thereby reducing erroneous overcurrent reporting.  
Power supply considerations  
A 0.1 µF ceramic bypass capacitor between IN and GND, close  
to the device, is recommended. Placing a high-value electro-  
lytic capacitor on the output terminals is also desirable when the  
output load is heavy. The capacitor reduces power supply  
transients that may cause ringing on the input. Also, bypassing  
the output with a 0.01 µF to 0.1 µF ceramic capacitor improves  
the immunity of the device to short-circuit transients.  
Power dissipation and junction temperature  
The low on-resistance of the n-channel MOSFET allows small  
surface-mount packages, such as an SOIC, to pass large  
currents. The thermal resistance of these packages are high  
115 Northeast Cutoff, Box 15036  
Worcester, Massachusetts 01615-0036 (508) 853-5000  
8
2525 AND 2535  
USB  
POWER CONTROL  
SWITCHES  
TYPICAL APPLICATIONS  
5 V  
UPSTREAM  
CONNECTOR  
100 mA MAX  
10 k  
+5 V  
A2525EM  
USB  
PORT  
FERRITE  
BEADS  
USB CONTROLLER  
V
BUS  
VBUS  
1
2
3
8
7
6
3.3 V  
REG  
VIN  
ON/OFF  
D+  
+
OVER-  
CURRENT  
0.1 µF  
D–  
GROUND  
NC  
NC  
GND  
4
NC  
5
DATA  
DATA  
Dwg. EP-070A  
USB Host Application  
5 V  
UPSTREAM  
CONNECTOR  
100 mA MAX  
1.5 kΩ  
10 kΩ  
A2525EM  
USB  
PORT  
FERRITE  
BEADS  
USB CONTROLLER  
VBUS  
VBUS  
1
2
3
8
7
6
3.3 V  
REG  
VIN  
ON/OFF  
D+  
+
OVER-  
CURRENT  
0.1 µF  
D–  
GROUND  
NC  
NC  
GND  
4
NC  
5
DATA  
DATA  
Dwg. EP-070-10A  
USB Bus-Powered Hub  
www.allegromicro.com  
9
2525 AND 2535  
USB  
POWER CONTROL  
SWITCHES  
A2525EL and A2535EL  
Dimensions in Inches  
(for reference only)  
8
0.0098  
0.0075  
0.1574  
0.1497  
0.2440  
0.2284  
0.050  
0.016  
0.020  
0.013  
1
0.050  
BSC  
0° TO 8°  
0.1968  
0.1890  
0.0688  
0.0532  
Dwg. MA-007-8 in  
0.0040 MIN.  
Dimensions in Millimeters  
(controlling dimensions)  
8
0.25  
0.19  
4.00  
3.80  
6.20  
5.80  
1.27  
0.40  
0.51  
0.33  
1
1.27  
BSC  
0° TO 8°  
5.00  
4.80  
1.75  
1.35  
Dwg. MA-007-8 mm  
0.10 MIN.  
NOTES: 1. Lead spacing tolerance is non-cumulative.  
2. Exact body and lead configuration at vendor’s option within limits shown.  
115 Northeast Cutoff, Box 15036  
Worcester, Massachusetts 01615-0036 (508) 853-5000  
10  
2525 AND 2535  
USB  
POWER CONTROL  
SWITCHES  
A2525EM and A2535EM  
Dimensions in Inches  
(controlling dimensions)  
0.014  
0.008  
8
5
0.430  
MAX  
0.280  
0.240  
0.300  
BSC  
4
1
0.070  
0.005  
MIN  
0.045  
0.400  
0.355  
0.210  
MAX  
0.015  
0.150  
0.115  
MIN  
0.022  
0.014  
0.100  
Dwg. MA-001-8A in  
BSC  
Dimensions in Millimeters  
(for reference only)  
0.355  
0.204  
8
5
10.92  
MAX  
7.11  
6.10  
7.62  
BSC  
4
1
1.77  
0.13  
MIN  
1.15  
10.16  
9.02  
5.33  
MAX  
0.39  
3.81  
2.93  
MIN  
0.558  
0.356  
2.54  
Dwg. MA-001-8A mm  
BSC  
NOTES: 1. Leads 1, 4, 5, and 8 may be half leads at vendor’s option.  
2. Lead thickness is measured at seating plane or below.  
3. Lead spacing tolerance is non-cumulative.  
4. Exact body and lead configuration at vendor’s option within limits shown.  
www.allegromicro.com  
11  
2525 AND 2535  
USB  
POWER CONTROL  
SWITCHES  
The products described here are manufactured under one or more  
U.S. patents or U.S. patents pending.  
Allegro MicroSystems, Inc. reserves the right to make, from time to  
time, such departures from the detail specifications as may be  
required to permit improvements in the performance, reliability, or  
manufacturability of its products. Before placing an order, the user is  
cautioned to verify that the information being relied upon is current.  
Allegro products are not authorized for use as critical components  
in life-support devices or systems without express written approval.  
The information included herein is believed to be accurate and  
reliable. However, Allegro MicroSystems, Inc. assumes no responsi-  
bility for its use; nor for any infringement of patents or other rights of  
third parties which may result from its use.  
115 Northeast Cutoff, Box 15036  
Worcester, Massachusetts 01615-0036 (508) 853-5000  
12  

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