2SC6011Y [ALLEGRO]
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| 型号： | 2SC6011Y |
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ALLEGRO MICROSYSTEMS |
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2SC6011
Audio Amplification Transistor
Features and Benefits
Description
▪ Small package (TO-3P)
By adapting the Sanken unique wafer-thinner technique, these
NPNpowertransistorsachievepower-upbydecreasingthermal
resistance, and provide higher voltage avalanche breakdown
rating.Thehighpower-handlingcapacityofthe TO-3Ppackage
allows a smaller footprint on the circuit board design. This
seriesoftransistorsisverywellsuitedtonotonlymultichannel
applications for AV (audio-visual) amplifiers and receivers,
but also parallel connection applications for PA (professional
audio system) amplifiers.
▪ High power handling capacity, 160 W
▪ Improved sound output by reduced on-chip impedance
▪ For professional audio (PA) applications, VCEO = 200 V
versions available
▪ Complementary to 2SA2151
▪ Recommended output driver: 2SC4832
Applications include the following:
▪ Single transistors for audio amplifiers
▪ Home audio amplifiers
Package: 3 Lead TO-3P
▪ Professional audio amplifiers
▪ Automobile audio amplifiers
▪ Audio market
▪ Single transistors for general purpose
38102
Audio Amplification Transistor
2SC6011
SELECTION GUIDE
Part Number
Type
h
FE Rating
Packing
Range O: 50 to 100
Range P: 70 tp 140
Range Y: 90 to 180
2SC6011*
NPN
Bulk, 100 pieces
*Specify hFE range when ordering. If no hFE range is specified, order will be fulfilled with either or both range O and range Y,
depending upon availability.
ABSOLUTE MAXIMUM RATINGS at TA = 25°C
Characteristic
Collector-Base Voltage
Symbol
VCBO
VCEO
VEBO
IC
Rating
Unit
V
200
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
200
V
6
15
V
A
Base Current
IB
4
A
Collector Power Dissipation
Junction Temperature
Storage Temperature
PC
160
W
°C
°C
TJ
150
T
stg
–55 to150
ELECTRICAL CHARACTERISTICS at TA = 25°C
Characteristic Symbol
Collector-Cutoff Current ICBO
IEBO
Test Conditions
Min.
–
Typ.
–
Max.
10
10
–
Unit
μA
μA
V
VCB = 200 V
VEB = 6 V
Emitter Cutoff Current
–
–
Collector-Emitter Voltage
DC Current Transfer Ratio*
Collector-Emitter Saturation Voltage
Cutoff Frequency
V(BR)CEO IC = 50 mA
200
50
–
–
hFE
VCE(sat)
fT
VCE = 4 V, IC = 3 A
IC = 5 A, IB = 0.5 A
–
180
0.5
–
–
–
V
VCE = 12 V, IE = –0.5 A
–
20
270
MHz
pF
Output Capacitance
COB
VCB = 10 V, IE = 0 A, f = 1 MHz
–
–
*hFE rating: 50 to 100 (O brand on package), 70 to 140 (P), 90 to 180 (Y).
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
2
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Audio Amplification Transistor
2SC6011
Performance Characteristics
15
10
5
3
2
1
0
IC vs. VCE
VCE(sat) vs. IB
50 mA
IC= 10 A
IB= 20 mA
IC= 5 A
0.5
0
0
1
2
3
4
0
1.0
IB (A)
1.5
2.0
VCE (V)
15
1000
100
10
10
5
hFE vs. IC
IC vs. VBE
VCE = 4 V Continuous
V
CE = 4 V Continuous
1
0
0.01
0.1
1
10
100
0
0.5
1.0
1.5
2.0
VBE (V)
IC (A)
10.00
1000
100
10
1.00
0.10
0.01
hFE vs. IC
VCE = 4 V Continuous
RθJA vs. t
1
0.01
0.1
1
10
100
1000
1
10
100
IC (A)
t (ms)
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
3
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Audio Amplification Transistor
2SC6011
Performance Characteristics, continued
Safe Operating Area
T = 25°C, single pulse, no heatsink, natural cooling
A
100.0
10.0
1.0
0.1
0.01
1
10
100
1000
VCE (V)
40
200
150
100
50
Typ.
30
20
10
0
fT vs. IE
VCE = 12 V Continuous
PC vs. TA
Without Heatsink
3.5
0
0.01
0.1
1
10
100
0
25
50
75
A (°C)
100
125
150
T
IE (A)
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
4
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Audio Amplification Transistor
2SC6011
PACKAGE OUTLINE DRAWING, TO-3P
15.6 ±0.3
14.0 ±0.3
13.6 ±0.2
5.0 MAX
2.1 MAX
9.6 ±0.3
Branding
XXXXXXXX
XXXXXXXX
+0.2
–0.3
1.7
+0.2
–0.1
2
(2×)
(3×)
+0.2
–0.1
3
+0.2
–0.1
0.6
+0.2
–0.1
1.0
2×P5.45 ±0.1
Terminal dimension at lead tips
15.8 ±0.2
Pin Assignments:
1. Base
2. Collector
3. Emitter
1
2
3
Terminal core material: Cu
Terminal treatment: Ni plating and solder dip
Heat sink core material: Cu
Branding codes (exact appearance at manufacturer discretion):
1st line, type: C6011
Heat sink treatment: Ni plating
Leadform number: 100
2nd line, lot:
YM
H
Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
H is the hFE rating (O, P, or Y; for values see
footnote, Electrical Characteristics table)
Dimensions in millimeters
Leadframe plating Pb-free. Device composition
includes high-temperature solder (Pb >85%),
which is exempted from the RoHS directive.
Allegro MicroSystems, Inc.
5
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Audio Amplification Transistor
2SC6011
WARNING —These devices are designed to be operated at lethal voltages and energy levels. Circuit designs
thatembodythesecomponentsmustconformwithapplicablesafetyrequirements. Precautionsmustbe
takentopreventaccidentalcontactwithpower-linepotentials. Donotconnectgroundedtestequipment.
The use of an isolation transformer is recommended during circuit development and breadboarding.
Because reliability can be affected adversely by improper storage
Heatsink Mounting Method
environments and handling methods, please observe the following
cautions.
Cautions for Storage
•
Torque When Tightening Mounting Screws. Thermal resistance
increases when tightening torque is low, and radiation effects are
decreased. When the torque is too high, the screw can strip, the
heatsink can be deformed, and distortion can arise in the product frame.
To avoid these problems, observe the recommended tightening torques
for this product package type, TO-3P (MT-100): 0.686 to 0.882 N•m (7
to 9 kgf•cm).
•
Ensure that storage conditions comply with the standard
temperature (5°C to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience
extreme changes in temperature or humidity.
•
•
Avoid locations where dust or harmful gases are present and
avoid direct sunlight.
Reinspect for rust on leads and solderability of products that have
been stored for a long time.
•
Diameter of Heatsink Hole: < 4 mm. The deflection of the press mold
when making the hole may cause the case material to crack at the joint
with the heatsink. Please pay special attention for this effect.
Cautions for Testing and Handling
Soldering
When tests are carried out during inspection testing and other
standard test periods, protect the products from power surges
from the testing device, shorts between adjacent products, and
shorts to the heatsink.
•
When soldering the products, please be sure to minimize the
working time, within the following limits:
260±5°C 10 s
Remarks About Using Silicone Grease with a Heatsink
350±5°C 3 s
•
•
•
When silicone grease is used in mounting this product on a
heatsink, it shall be applied evenly and thinly. If more silicone
grease than required is applied, it may produce stress.
•
Soldering iron should be at a distance of at least 1.5 mm from the
body of the products
Coat the back surface of the product and both surfaces of the
insulating plate to improve heat transfer between the product and
the heatsink.
Electrostatic Discharge
•
When handling the products, operator must be grounded.
Grounded wrist straps worn should have at least 1 MΩ of
resistance to ground to prevent shock hazard.
Volatile-type silicone greases may permeate the product and
produce cracks after long periods of time, resulting in reduced
heat radiation effect, and possibly shortening the lifetime of the
product.
•
•
•
Workbenches where the products are handled should be
grounded and be provided with conductive table and floor mats.
•
Our recommended silicone greases for heat radiation purposes,
which will not cause any adverse effect on the product life, are
indicated below:
When using measuring equipment such as a curve tracer, the
equipment should be grounded.
When soldering the products, the head of soldering irons or the
solder bath must be grounded in other to prevent leak voltages
generated by them from being applied to the products.
Type
G746
Suppliers
Shin-Etsu Chemical Co., Ltd.
GE Toshiba Silicone Co., Ltd.
Dow Corning Toray Silicone Co., Ltd.
•
The products should always be stored and transported in our
shipping containers or conductive containers, or be wrapped in
aluminum foil.
YG6260
SC102
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
6
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Audio Amplification Transistor
2SC6011
The products described herein are manufactured in Japan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc.
Sanken and Allegro reserve the right to make, from time to time, such departures from the detail specifications as may be required to permit im-
provements in the performance, reliability, or manufacturability of its products. Therefore, the user is cautioned to verify that the information in this
publication is current before placing any order.
When using the products described herein, the applicability and suitability of such products for the intended purpose shall be reviewed at the users
responsibility.
Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products
at a certain rate is inevitable.
Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems
against any possible injury, death, fires or damages to society due to device failure or malfunction.
Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equipment or apparatus
(home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Their use in any application requiring radiation
hardness assurance (e.g., aerospace equipment) is not supported.
When considering the use of Sanken products in applications where higher reliability is required (transportation equipment and its control systems
or equipment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written
confirmation of your specifications.
The use of Sanken products without the written consent of Sanken in applications where extremely high reliability is required (aerospace equip-
ment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited.
The information included herein is believed to be accurate and reliable. Application and operation examples described in this publication are
given for reference only and Sanken and Allegro assume no responsibility for any infringement of industrial property rights, intellectual property
rights, or any other rights of Sanken or Allegro or any third party that may result from its use.
Anti radioactive ray design is not considered for the products listed herein.
Copyright © 2006 Allegro MicroSystems, Inc.
This datasheet is based on Sanken datasheet SSE-23013
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
7
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
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