AM4435AM8R [AITSEMI]
P-CHANNEL ENHANCEMENT MODE MOSFET;型号: | AM4435AM8R |
厂家: | AiT Semiconductor |
描述: | P-CHANNEL ENHANCEMENT MODE MOSFET |
文件: | 总8页 (文件大小:511K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AM4435A
AiT Semiconductor Inc.
MOSFET
www.ait-ic.com
P-CHANNEL ENHANCEMENT MODE
DESCRIPTION
FEATURES
AM4435A is the P-Channel enhancement mode
power field effect transistors are using trench DMOS
technology. This advanced technology has been
especially tailored to minimize on-state resistance,
provide superior, fast switching performance, and
withstand high energy pulse in the avalanche and
commutation mode. This device is suitable for use as
a load switch or PWM applications.
VDS = -30V, ID = -10.6A
R
R
DS(ON) =14mΩ(Typ.)@VGS = -10V
DS(ON) =18mΩ(Typ.)@VGS = -4.5V
Fast switch
High power and current handling capability
Available in SOP8 Package
APPLICATIONS
Load Switch
The AM4435A is available in SOP8 package.
LED Application
DC-DC Power Management
ORDERING INFORMATION
P CHANNEL MOSFET
Package Type
Part Number
AM4435AM8R
AM4435AM8VR
SOP8
M8
SPQ: 2,500pcs/Reel
V: Halogen free Package
R: Tape & Reel
Note
AiT provides all RoHS products
Schematic diagram
REV1.0
- APR 2018 RELEASED -
- 1 -
AM4435A
AiT Semiconductor Inc.
MOSFET
www.ait-ic.com
P-CHANNEL ENHANCEMENT MODE
PIN DESCRIPTION
Top View
Pin #
Symbol
Function
Source
Source
Source
Gate
1
2
3
4
5
6
7
8
S
S
S
G
D
D
D
D
Drain
Drain
Drain
Drain
REV1.0
- APR 2018 RELEASED -
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AM4435A
AiT Semiconductor Inc.
MOSFET
www.ait-ic.com
P-CHANNEL ENHANCEMENT MODE
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted
V
DSS, Drain-Source Voltage
-30V
±20V
VGSS, Gate-Source Voltage
TA = 25°C
TA= 70°C
-10.6A
ID, Continuous Drain Current
-8.5A
IDM, Pulsed Drain CurrentNOTE1
-42.4A
IAS, Avalanche CurrentNOTE1, 6
-30A
EAS, Single Pulse Avalanche Energy L=0.1mH NOTE1, 6
45mJ
TA = 25°C
TA= 70°C
3.1W
PD, Power DissipationNOTE2
2.0W
TJ, Operation Junction Temperature
TSTG, Storage Temperature Range
−55°C ~150°C
−55°C ~150°C
Stress beyond above listed “Absolute Maximum Ratings” may lead permanent damage to the device. These are stress ratings only and
operations of the device at these or any other conditions beyond those indicated in the operational sections of the specifications are not
implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
THERMAL RESISTANCE
Parameter
Symbol
RθJA
Max
40
Unit
Thermal Resistance Junction to AmbientNOTE3 t≦10s
Thermal Resistance Junction to AmbientNOTE3
Thermal Resistance Junction to CaseNOTE3
75
°C/W
Steady-State
RθJC
27
REV1.0
- APR 2018 RELEASED -
- 3 -
AM4435A
AiT Semiconductor Inc.
MOSFET
www.ait-ic.com
P-CHANNEL ENHANCEMENT MODE
ELECTRICAL CHARACTERISTICS
TA= 25°C, unless otherwise noted
Parameter
Static Parameters
Symbol
Conditions
Min
Typ
Max Units
Drain-Source Breakdown Voltage
Gate Threshold Voltage
BVDSS
VGS(th)
IGSS
VGS=0V, ID=-250μA
VDS=VGS, ID=-250μA
VDS=0V, VGS=±20V
VDS=-30V, VGS=0V
TJ=25°C
-30
-1
-
-
-1.6
-
-
V
V
-2.5
±100
Gate Leakage Current
nA
-
-
-
-
-1
Zero Gate Voltage Drain Current
IDSS
μA
VDS=-24V,VGS=0V
TJ=75°C
-10
VGS=-10V, ID=-10.6A
VGS=-4.5V, ID=-8A
VDS=-10V, ID=-10A
-
-
-
14
18
18
25
-
Drain-source On-ResistanceNOTE4
RDS(ON)
Gfs
mΩ
Forward Transconductance
Diode Characteristics
12.5
S
Diode Forward VoltageNOTE2
Continuous Source Current
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Dynamic and Switching Parameters
Total Gate Charge(10V)
VSD
IS
IS=-1A,VGS=0V
-
-
-
-
-0.7
-
-1
V
A
-5.3
trr
13.8
12.3
-
-
ns
nC
IS=-10A,
dl/dt=100A/μs
Qrr
Qg
Qg
-
-
-
-
-
-
-
36
18
48.6
24.3
10.9
13.9
Total Gate Charge(4.5V)
Gate-Source Charge
VDS=-15V, VGS=-10V,
ID=-10A
nC
Qgs
Qgd
Ciss
Coss
Crss
8.1
10.3
Gate-Drain Charge
Input Capacitance
2590 3626
VDS=-15V, VGS=0V,
f=1MHz
Output Capacitance
283
172
396
241
pF
Reverse Transfer Capacitance
VGS=0V, VDS=0V,
f=1MHz
Gate Resistance
Turn-On TimeNOTE5
Turn-Off TimeNOTE5
Rg
-
8.8
13
Ω
td(on)
tr
td(off)
tf
-
-
-
-
19.1
4.8
-
-
-
-
VDD=-15V, VGEN=-10V,
ns
RG=3Ω, ID=-1A
58
11.5
NOTE1: The value of RθJA is measured with the device in a still air environment with maximum junction temperature TJ(MAX)=150°C (initial
temperature TA=25°C).
NOTE2: The TJ(MAX)=150°C, using junction-to-ambient thermal resistance.
NOTE3.Surface−mounted on FR-4 board using 1 sq−in pad, 2 oz Cu, in a still air environment with TA=25°C.
NOTE4: The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
NOTE5: Pulsed width limited by maximum junction temperature.
NOTE6: The EAS data shows Max.
REV1.0
- APR 2018 RELEASED -
- 4 -
AM4435A
AiT Semiconductor Inc.
MOSFET
www.ait-ic.com
P-CHANNEL ENHANCEMENT MODE
TYPICAL ELECTRICAL CHARACTERISTICS
1.
3.
5.
Output Characteristics
2.
4.
6.
Drain-Source On Resistance
Gate Charge
Capacitance
Gate Threshold Voltage
Power Dissipation
REV1.0
- APR 2018 RELEASED -
- 5 -
AM4435A
AiT Semiconductor Inc.
MOSFET
www.ait-ic.com
P-CHANNEL ENHANCEMENT MODE
7.
RDS(ON) vs. Junction Temperature
8.
Drain Current vs. TJ
9.
Maximum Safe Operation Area
10. Thermal Transient Impedance
11. Gate Charge Waveform
12. Switching Time Waveform
REV1.0
- APR 2018 RELEASED -
- 6 -
AM4435A
AiT Semiconductor Inc.
MOSFET
www.ait-ic.com
P-CHANNEL ENHANCEMENT MODE
PACKAGE INFORMATION
Dimension in SOP8 Package (Unit: mm)
Millimeters
Inches
Max.
Symbol
Min.
Max.
1.750
0.250
1.550
0.510
0.250
5.100
4.000
6.200
Min.
A
A1
A2
b
1.350
0.100
1.350
0.330
0.170
4.700
3.800
5.800
0.053
0.004
0.053
0.013
0.006
0.185
0.150
0.228
0.069
0.010
0.061
0.020
0.010
0.200
0.157
0.244
0.050 BSC
0.050
8°
c
D
E
E1
e
1.270 BSC
L
0.400
0°
1.270
8°
0.016
0°
θ
REV1.0
- APR 2018 RELEASED -
- 7 -
AM4435A
AiT Semiconductor Inc.
MOSFET
www.ait-ic.com
P-CHANNEL ENHANCEMENT MODE
IMPORTANT NOTICE
AiT Semiconductor Inc. (AiT) reserves the right to make changes to any its product, specifications, to
discontinue any integrated circuit product or service without notice, and advises its customers to obtain the
latest version of relevant information to verify, before placing orders, that the information being relied on is
current.
AiT Semiconductor Inc.'s integrated circuit products are not designed, intended, authorized, or warranted to
be suitable for use in life support applications, devices or systems or other critical applications. Use of AiT
products in such applications is understood to be fully at the risk of the customer. As used herein may involve
potential risks of death, personal injury, or server property, or environmental damage. In order to minimize
risks associated with the customer's applications, the customer should provide adequate design and
operating safeguards.
AiT Semiconductor Inc. assumes to no liability to customer product design or application support. AiT
warrants the performance of its products of the specifications applicable at the time of sale.
REV1.0
- APR 2018 RELEASED -
- 8 -
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