AM4409M8R [AITSEMI]

P-CHANNEL ENHANCEMENT MODE MOSFET;
AM4409M8R
型号: AM4409M8R
厂家: AiT Semiconductor    AiT Semiconductor
描述:

P-CHANNEL ENHANCEMENT MODE MOSFET

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AM4409  
AiT Semiconductor Inc.  
www.ait-ic.com  
MOSFET  
P-CHANNEL ENHANCEMENT MODE  
DESCRIPTION  
FEATURES  
The AM4409 is the P-Channel logic enhancement  
mode power field effect transistor is produced using  
high cell density advanced trench technology..  
-30V/-15A, RDS(ON)=5.5mΩ(typ.)@VGS=-10V  
-30V/-10A, RDS(ON)=6.5mΩ(typ.)@VGS=-4.5V  
Super high design for extremely low RDS(ON)  
Exceptional on-resistance and Maximum DC  
current capability  
This high density process is especially tailored to  
minimize on-state resistance. These devices are  
particularly suited for low voltage application,  
notebook computer power management and other  
battery powered circuits where high-side switching  
ESD Protected: 3kV  
Available in SOP8 package.  
AM4409 is available in SOP8 package.  
ORDERING INFORMATION  
APPLICATION  
High Frequency Point-of-Load Synchronous  
Networking DC-DC Power System  
Load Switch  
Package Type  
Part Number  
AM4409M8R  
AM4409M8VR  
SOP8  
M8  
SPQ: 3,000pcs/Reel  
PIN DESCRIPTION  
V: Halogen free Package  
R: Tape & Reel  
Note  
AiT provides all RoHS products  
REV1.0  
- MAR 2017 RELEASED -  
- 1 -  
AM4409  
AiT Semiconductor Inc.  
www.ait-ic.com  
MOSFET  
P-CHANNEL ENHANCEMENT MODE  
PIN DESCRIPTION  
Top View  
Pin #  
Symbol  
Function  
Source  
Source  
Source  
Gate  
1
2
3
4
5
6
7
8
S
S
S
G
D
D
D
D
Drain  
Drain  
Drain  
Drain  
REV1.0  
- MAR 2017 RELEASED -  
- 2 -  
AM4409  
AiT Semiconductor Inc.  
www.ait-ic.com  
MOSFET  
P-CHANNEL ENHANCEMENT MODE  
ABSOLUTE MAXIMUM RATINGS  
TA = 25, unless otherwise noted  
VDSS, Drain-Source Voltage  
-30V  
±20V  
VGSS, Gate-Source Voltage  
ID, Continuous Drain Current(VGS=10V)  
IDM, Pulsed Drain Current  
TA=25℃  
-17A  
-80A  
IS, Continuous Source Current (Diode Conduction)  
-2.7A  
TA=25oC  
3.0W  
PD, Power Dissipation  
TA=70℃  
2.1W  
TJ, Operation Junction Temperature  
TSTG, Storage Temperature Range  
150℃  
-55~150℃  
85°C/W  
RθJA, Thermal Resistance Junction to Ambient  
Stress beyond above listed “Absolute Maximum Ratings” may lead permanent damage to the device. These are stress ratings only and  
operations of the device at these or any other conditions beyond those indicated in the operational sections of the specifications are not  
implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.  
REV1.0  
- MAR 2017 RELEASED -  
- 3 -  
AM4409  
AiT Semiconductor Inc.  
www.ait-ic.com  
MOSFET  
P-CHANNEL ENHANCEMENT MODE  
ELECTRICAL CHARACTERISTICS  
TA = 25, unless otherwise noted  
Parameter  
Static Parameters  
Symbol  
Conditions  
Min  
Typ.  
Max  
Units  
Drain-Source Breakdown Voltage  
Gate Threshold Voltage  
V(BR)DSS VGS=0V,IDS=-250μA  
-30  
-
-1.3  
-
-
V
V
VGS(th)  
IGSS  
VDS=VGS,IDS=-250μA  
VDS=0V, VGS16V  
VDS=-24V,VGS=0V  
-1.0  
-2.0  
±10  
±1  
Gate Leakage Current  
-
-
-
-
-
μA  
-
Zero Gate Voltage Drain Current  
IDSS  
μA  
TJ=55°C  
-
±5  
VGS=-20V,IDS=-15A  
VGS=-10V,IDS=-10A  
5.5  
7.0  
8.0  
9.0  
Drain-Source On-state Resistance RDS(ON)  
Source-Drain Diode  
mΩ  
Diode Forward Voltage  
Dynamic Parameters  
Total Gate Charge  
VSD  
ISD=-1.0A,VGS=0V  
-
-0.71  
-1.0  
V
Qg  
Qgs  
Qgd  
Ciss  
Coss  
Crss  
td(on)  
tr  
-
-
-
-
-
-
-
-
-
-
37.08  
10.12  
11.24  
3887  
577  
48.2  
13.16  
14.61  
-
VDS=-15V, VGS=-4.5V,  
IDS=-15A  
Gate-Source Charge  
Gate-Drain Charge  
nC  
pF  
Input Capacitance  
VDS=-15V, VGS=0V,  
f=1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
-
425  
-
19.52  
10.12  
137.6  
39.04  
20.34  
275.2  
Turn-on Time  
VDS=-15V, ID=-10A,  
ns  
VGEN=-10V, RG=6Ω  
td(off)  
Turn-off Time  
tf  
55.32 110.64  
NOTE1: Pulse test; pulse width300μs, duty cycle2%.  
NOTE2: Static parameters are based on package level with recommended wire bonding  
REV1.0  
- MAR 2017 RELEASED -  
- 4 -  
AM4409  
AiT Semiconductor Inc.  
www.ait-ic.com  
MOSFET  
P-CHANNEL ENHANCEMENT MODE  
TYPICAL CHARACTERISTICS  
1. On-Region Characteristics  
2. Transfer Characteristics  
3. On-Resistance vs. Drain Current and Gate Voltage 4. On-Resistance vs. Junction Temperature  
5. On-Resistance vs. Gate-Source Voltage  
6. Body-Diode Characteristics  
REV1.0  
- MAR 2017 RELEASED -  
- 5 -  
AM4409  
AiT Semiconductor Inc.  
www.ait-ic.com  
MOSFET  
P-CHANNEL ENHANCEMENT MODE  
7. Gate-Charge Characteristics  
8. Capacitance Characteristics  
9. Maximum Forward Biased Safe Operating Area  
10. Single Pulse Power Rating Junction-to-Ambient  
11. Normalized Maximum Transient Thermal Impedance  
REV1.0  
- MAR 2017 RELEASED -  
- 6 -  
AM4409  
AiT Semiconductor Inc.  
www.ait-ic.com  
MOSFET  
P-CHANNEL ENHANCEMENT MODE  
PACKAGE INFORMATION  
Dimension in SOP8 Package (Unit: mm)  
Millimeters  
Inches  
MAX.  
Symbol  
MIN.  
MAX.  
1.750  
0.250  
1.550  
0.510  
0.250  
5.100  
4.000  
6.200  
MIN.  
0.053  
0.004  
0.053  
0.013  
0.006  
0.185  
0.150  
0.228  
A
A1  
A2  
b
1.350  
0.100  
1.350  
0.330  
0.170  
4.700  
3.800  
5.800  
0.069  
0.010  
0.061  
0.020  
0.010  
0.200  
0.157  
0.244  
0.050(BSC)  
0.050  
8°  
c
D
E
E1  
e
1.270(BSC)  
0.400  
0°  
L
1.270  
0.016  
θ
8°  
0°  
REV1.0  
- MAR 2017 RELEASED -  
- 7 -  
AM4409  
AiT Semiconductor Inc.  
www.ait-ic.com  
MOSFET  
P-CHANNEL ENHANCEMENT MODE  
IMPORTANT NOTICE  
AiT Semiconductor Inc. (AiT) reserves the right to make changes to any its product, specifications, to  
discontinue any integrated circuit product or service without notice, and advises its customers to obtain the  
latest version of relevant information to verify, before placing orders, that the information being relied on is  
current.  
AiT Semiconductor Inc.'s integrated circuit products are not designed, intended, authorized, or warranted to  
be suitable for use in life support applications, devices or systems or other critical applications. Use of AiT  
products in such applications is understood to be fully at the risk of the customer. As used herein may involve  
potential risks of death, personal injury, or servere property, or environmental damage. In order to minimize  
risks associated with the customer's applications, the customer should provide adequate design and  
operating safeguards.  
AiT Semiconductor Inc. assumes to no liability to customer product design or application support. AiT  
warrants the performance of its products of the specifications applicable at the time of sale.  
REV1.0  
- MAR 2017 RELEASED -  
- 8 -  

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