AIC1117A-25 [AIC]
1A Low Dropout Positive Regulator;
| 型号： | AIC1117A-25 |
| 厂家： | 
ANALOG INTERGRATIONS CORPORATION |
| 描述： | 1A Low Dropout Positive Regulator |
| 文件： | 总11页 (文件大小：220K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AIC1117A
1A Low Dropout Positive Regulator
FEATURES
DESCRIPTION
Dropout Voltage 1.3V at 1A Output Current.
Fast Transient Response.
The AIC1117A is a low dropout, three terminals
regulator designed to provide output current up
to 1A. The device is available in an adjustable
version and fixed output voltage of 1.8V, 2.5V
and 3.3V. Dropout voltage of maximum of 1.5V
Line Regulation, typical at 0.015%.
Load Regulation, typical at 0.1%
Current Limiting and Thermal Protection.
Adjustable Output Voltage or Fixed at 1.8V, 2.5V
and 3.3V.
is guaranteed at 1A output current. The quality
of low dropout voltage and fast transient
response make this device ideal for low voltage
microprocessor applications.
Standard 3-Pin Power Packages.
APPLICATIONS
The AIC1117A requires output capacitance of a
minimum of 10μF for stability. Built-in output
current limiting and thermal limiting provide
maximal protection to the AIC1117A against
fault conditions.
Active SCSI Terminators.
Post Regulators for Switching Supplies.
Battery Chargers.
PC Add-On Card.
TYPICAL APPLICATION CIRCUIT
VREF=VOUT - VADJ=1.25V (typ.)
2
3
VIN
5V
AIC1117A
VOUT
3.3V
VOUT=VREF x (1+RF2/RF1)+ IADJ x RF2
I
ADJ=55A (typ.)
RF1
125
1%
VREF
ADJ
1
+
+
C1
C2
(1) C1 needed if device is far away from filter
capacitors.
10F
RF2
205
1%
10F
(Note1)
(2) C2 required for stability.
Adjustable Voltage Regulator
2
3
V
5V
AIC1117A-33
IN
V
3.3V
OUT
1
+
+
C1
10F
C2
10F
(Note1)
GND
Fixed Voltage Regulator
Analog Integrations Corporation
Si-Soft Research Center
3A1, 1 Li-Hsin 1st Rd., Science Park , Hsinchu 300, Taiwan , R.O.C.
DS-1117AG-02 20131018
TEL: 886-3-5772500
FAX: 886-3-5772510
www.analog.com.tw
1
AIC1117A
ORDERING INFORMATION
AIC1117A-XXXXXX
PIN CONFIGURATION
PACKING TYPE
TR: TAPE & REEL
TB: TUBE
TO-252
TOP VIEW
BG: BAG (for SOT-223)
1: ADJ (GND)
2: VOUT (TAB)
3: VIN
1
2
3
PACKAGING TYPE
E: TO-252
M: TO-263
T: TO-220
TO-263
TOP VIEW
Y: SOT-223
P: Lead Free Commercial
G: Green Package
1: ADJ (GND)
2: VOUT (TAB)
3: VIN
1
2
3
OUTPUT VOLTAGE
DEFAULT:ADJUSTABLE
18: 1.8V
TO-220
FRONT VIEW
25: 2.5V
33: 3.3V
1: ADJ (GND)
2: VOUT (TAB)
3: VIN
1
2
3
Example: AIC1117A-25GETR
2.5V version in TO-252 Green
Package & Taping & Reel
Packing Type
SOT-223
TOP VIEW
AIC1117A-25PYTR
1: ADJ (GND)
2: VOUT (TAB)
3: VIN
1
2
3
2.5V version in SOT-223 Lead
Free Package & Taping & Reel
Packing Type
SOT-223 Marking
Part No.
PY
GY
AIC1117A
BS17P
BS18P
BS25P
BS33P
BS17G
BS18G
BS25G
BS33G
AIC1117A-18
AIC1117A-25
AIC1117A-33
2
AIC1117A
ABSOLUTE MAXIMUM RATINGS
VIN pin to ADJ/GND pin
7V
–40C to 85C
–65C to 150C
125C
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Lead Temperature (Soldering, 10 sec)
260C
Thermal Resistance (Junction to Case)
TO-220
TO-263
SOT-223
TO-252
3C /W
3C /W
15C /W
12.5C /W
50C/W
Thermal Resistance (Junction to Ambient) TO-220
(Assume no ambient airflow, no heatsink) TO-263
60C/W
SOT-223
TO-252
155C/W
100C/W
Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.
TEST CIRCUIT
Refer to TYPICAL APPLICATION CIRCUIT.
ELECTRICAL CHARACTERISTICS
(VIN=5V, TA=25C, IO=10mA, unless otherwise specified) (Note2)
PARAMETER
TEST CONDITIONS
TJ=25C
MIN.
TYP.
MAX. UNIT
1.238
1.25
1.262
0CTJ125C
2.65VVIN7V
Reference Voltage
V
1.225
1.25
1.275
10mAIO1A
AIC1117A-18, VIN=3.3V
AIC1117A-25, VIN=5V
AIC1117A-33, VIN=5V
AIC1117A
1.78
2.47
3.26
1.80
2.50
3.30
1.82
2.53
3.33
Output Voltage
V
0CTJ125C
VOUT
0.98V
1.02V
OUT
OUT
2.65VVIN7V
10mAIO1A
3
AIC1117A
ELECTRICAL CHARACTERISTICS (Continued)
PARAMETER
TEST CONDITIONS
2.65VIN7V, TJ=25C
0CTJ125C
MIN.
TYP.
0.015
0.035
0.1
MAX. UNIT
0.2
Line Regulation
%VOUT
0.2
TJ=25C, IO=10mA ~1A
0CTJ125C
0.3
Load Regulation
%VOUT
0.2
0.4
Dropout Voltage
Current Limit
VOUT, VREF=1%, IO=1A
1.3
1.5
V
A
1
2.65VIN7V
10mAIO1A
2.65VIN7V
10mAIO1A
IO=0.5A
Adjusted Pin Current (IADJ
)
55
0.2
0.5
120
5
A
A
Adjusted Pin Current Change
(IADJ
)
% VOUT
Temperature Stability
0CTJ125C
5
10
14
mA
mA
Minimum Load Current ( Adj. )
10
Quiescent Current ( Fixed Version)
10Hz f 10KHz
0.003
%VOUT
RMS Output Noise (% of VOUT
)
120Hz input ripple
60
72
dB
Ripple Rejection Ratio
COUT=25F
Note 1: To avoid output oscillation, aluminum electrolytic output capacitor is recommended and ceramic
capacitor is not suggested.
Note 2: Specifications are production tested at TA=25C. Specifications over the -40C to 85C operating
temperature range are assured by design, characterization and correlation with Statistical Quality
Controls (SQC).
4
AIC1117A
TYPICAL PERFORMANCE CHARACTERISTICS
0.1
50
0
0.05
0
-0.05
--50
VIN=5V
IN=1F
COUT=10F (Tantalum)
COUT=10F (Tantalum)
VOUT=3.3V
-0.1
--100
C
VOUT=3.3V
7.0
6.0
0.4A
0.1A
0
10
20
30
40
50
0
40
80
120
160
200
Time (S)
Time (S)
Fig. 2 Line Transient Response
Fig. 1 Load Transient Response
1.26
1.24
1.22
1.20
1.18
1.16
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0
1
2
3
4
5
0
200
400
600
800
1000
Output Current (mA)
Fig. 3 Dropout Voltage (VOUT=3.3V)
Differential Voltage (V)
Fig. 4 Minimum Operating Current
5
4
3
2
1
0
T =125C
A
T =25C
A
T =0C
A
1
2
3
4
5
6
7
8
9
Input/Output Differential (V)
Fig. 5 Minimum Load Current (Adjustable Version)
5
AIC1117A
BLOCK DIAGRAM
IN
V
Current Amp.
+
GM
-
+
REF
V
1.25V
Thermal
Limit
Current
Limit
55A
OUT
V
For fixed voltage
device
GND
ADJ
PIN DESCRIPTIONS
ADJ PIN
-
Providing VREF=1.25V (typ.) for adjustable VOUT. VREF=VOUT-VADJ and IADJ=55A (typ.)
(GND PIN- Power ground.)
VOUT PIN -
VIN PIN
Adjustable output voltage.
Power Input.
-
6
AIC1117A
APPLICATION INFORMATION
INPUT-OUTPUT CAPACITORS
mounting pad configuration on the PCB, the
board material, and the ambient temperature.
When the IC mounting with good thermal
conductivity is used, the junction temperature
will be low even when large power dissipation
applies.
Linear regulators require input and output
capacitors to maintain stability. Input capacitor at
10F with a 10F aluminum electrolytic output
capacitor is recommended.
POWER DISSIPATION
The power dissipation across the device is
P = IOUT (VIN-VOUT).
The AIC1117A obtains thermal-limiting circuitry,
which is designed to protect the device against
overload condition. For continuous load
The maximum power dissipation is:
(TJ-max - TA )
PMAX
condition,
maximum
rating
of
junction
RθJA
temperature must not be exceeded. It is
important to pay more attention in thermal
resistance. It includes junction to case, junction
to ambient. The maximum power dissipation of
AIC1117A depends on the thermal resistance of
its case and circuit board, the temperature
difference between the die junction and ambient
air, and the rate of airflow. The rate of
temperature rise is greatly affected by the
Where TJ-max is the maximum allowable junction
temperature (125C), and TA is the ambient
temperature suitable in application.
As a general rule, the lower temperature is, the
better reliability of the device is. So the PCB
mounting pad should provide maximum thermal
conductivity to maintain low device temperature.
APPLICATION EXAMPLES
3
2
AIC1117A
1 ADJ
Vin
5V
Vout
3.3V
3
2
Vin
5V
Vout
3.3V
AIC1117A
1 ADJ
R1
125
+
+
R1
C2
100uF
C1
10uF
+
+
125
C1
C2
10uF
10uF
R3
R2
205
Cadj
MMBT2222A
TTL
R2
205
1k
R4
1k
* Cadj can improve ripple rejection
Fig. 6 VOUT=3.3V with Shutdown
Fig. 7 Improving Ripple Rejection
T1
D1
3
2
AIC1117A
1 ADJ
Vin
5V
Vout
1.25V
2
Vin
3
AIC1117A-33
1
R1
125
+
+
C1
C2
10uF
+
+
C1
10uF
C2
10uF
100uF
Vout
-3.3V
FLOATING INPUT
Fig. 8 VOUT=1.25V Application Circuit
Fig. 9 Low Dropout Negative Supply
7
AIC1117A
PHYSICAL DIMENSIONS (unit: mm)
TO-220
A
E
A1
E1
THERMAL PAD
A
e
A
b2
A2
S
Y
M
B
O
L
TO-220
MILLIMETERS
MAX.
4.82
b
MIN.
3.56
0.51
2.04
0.38
1.15
0.35
14.23
8.38
11.75
9.66
6.86
WITH PLATING
BASE METAL
A
A1
A2
b
1.39
2.92
1.01
SECTION A-A
b2
c
1.77
0.61
16.51
9.02
D
D1
D2
E
12.88
10.66
8.90
Note: 1. Refer to JEDEC TO-220AB.
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "D1" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
E1
e
2.54 BSC
6.85
H1
L
5.85
12.70
--
14.73
6.35
L1
P
3.54
2.54
4.08
3.42
Q
8
AIC1117A
SOT-223
D
b2
A
A
SEE VIEW B
b
e
e1
WITH PLATING
BASE METAL
SECTION A-A
GAUGE PLANE
SEATING PLANE
S
Y
M
B
O
L
SOT-223
MILLIMETERS
L
MIN.
MAX.
1.80
VIEW B
A
A1
A2
b
0.02
1.55
0.66
2.90
0.10
1.65
0.84
3.10
b2
Note: 1. Refer to JEDEC TO-261AA.
c
0.23
6.30
0.33
6.70
D
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
E
6.70
3.30
7.30
3.70
E1
e
3. Dimension "E1" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
2.30 BSC
4.60 BSC
e1
L
0.90
0°
8°
θ
9
AIC1117A
TO-263
A
E
c2
E1
THERMAL PAD
A
A
b2
e
SEE VIEW B
b
S
Y
M
B
O
L
TO-263-3L
WITH PLATING
MILLIMETERS
MIN.
4.06
MAX.
4.83
A
BASE METAL
SECTION A-A
A1
b
0.00
0.51
1.14
0.38
0.25
0.99
1.78
0.74
b2
c
c2
D
1.14
8.38
1.65
9.65
--
GAUGE PLANE
SEATING PLANE
L
D1
E
6.86
9.65
6.23
VIEW B
10.67
--
E1
e
2.54 BSC
15.88
2.79
Note: 1. Refer to JEDEC TO-263AB.
H
14.61
1.78
--
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
L
L1
L2
L3
θ
1.68
--
1.78
3. Dimension "D" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
0.25 BSC
8°
0°
10
AIC1117A
TO-252
E
A
c2
E1
b3
THERMAL PAD
S
Y
M
B
O
L
TO-252-3L
MILLIMETERS
A
A
e
SEE VIEW B
MIN.
2.19
0.00
0.64
4.95
0.46
MAX.
2.38
A
b
A1
b
0.13
0.89
5.46
0.61
WITH PLATING
b3
c
BASE METAL
c2
D
0.46
5.33
0.89
6.22
SECTION A-A
D1
E
4.60
6.35
3.90
6.00
6.73
5.46
E1
e
GAUGE PLANE
SEATING PLANE
2.28 BSC
L
H
9.40
1.40
10.41
1.78
L1
L
VIEW B
L1
L2
L3
2.67 REF
0.51 BSC
Note: 1. Refer to JEDEC TO-252AA and AB.
2.03
1.02
8°
0.89
--
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
L4
0°
3. Dimension "D" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
Note:
Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry
other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result
from its use. We reserve the right to change the circuitry and specifications without notice.
Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or
systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure
to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in
a significant injury to the user.
11
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