HCPL2530 [AGILENT]
Dual Channel, High Speed Optocouplers; 双通道高速光电耦合器
| 型号： | HCPL2530 |
| 厂家： | 
AGILENT TECHNOLOGIES, LTD. |
| 描述： | Dual Channel, High Speed Optocouplers |
| 文件： | 总12页 (文件大小：210K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Dual Channel, High Speed
Optocouplers
Technical Data
HCPL-2530 HCPL-0530
HCPL-2531 HCPL-0531
HCPL-4534 HCPL-0534
Features
Applications
Description
• 15 kV/µs Minimum Common
Mode Transient Immunity at
VCM = 1500 V
(HCPL-4534/0534)
• High Speed: 1 Mb/s
• TTL Compatible
• Available in 8 Pin DIP, SO-8,
and 8 Pin DIP – Gull Wing
Surface Mount (Option 020)
Packages
• High Density Packaging
• 3 MHz Bandwidth
• Open Collector Outputs
• Guaranteed Performance
from 0°C to 70°C
• Safety Approval
UL Recognized – 2500 V rms
for 1 minute (5000 V rms for
1 minute for Option 020) per
UL1577
• Line Receivers – High
Common Mode Transient
Immunity (>1000 V/µs) and
Low Input-Output Capacitance
(0.6 pF)
• High Speed Logic Ground
Isolation – TTL/TTL, TTL/
LTTL, TTL/CMOS, TTL/LSTTL
These dual channel optocouplers
contain a pair of light emitting
diodes and integrated photodetec-
tors with electrical insulation
between input and output.
Separate connection for the
photodiode bias and output
transistor collectors increase the
speed up to a hundred times that
of a conventional phototransistor
coupler by reducing the base-
collector capacitance.
• Replace Pulse Transformers
– Save Board Space and Weight
• Analog Signal Ground
Isolation – Integrated Photon
Detector Provides Improved
Linearity over Phototransistor
Type
• Polarity Sensing
• Isolated Analog Amplifier –
Dual Channel Packaging
Enhances Thermal Tracking
CSA Approved
Functional Diagram
• Single Channel Version
Available (4502/3, 0452/3)
• MIL-STD-1772 Version
ANODE
CATHODE
CATHODE
ANODE
1
2
3
4
8
7
6
5
V
V
V
1
1
2
2
CC
TRUTH TABLE
(POSITIVE LOGIC)
O1
O2
LED
V
O
Available (55XX/65XX/4N55)
ON
OFF
LOW
HIGH
GND
A 0.1 µF bypass capacitor between pins 5 and 8 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
2
These dual channel optocouplers
are available in an 8 Pin DIP and
in an industry standard SO-8
package. The following is a cross
reference table listing the 8 Pin
DIP part number and the
The SO-8 does not require
The HCPL-2531/0531 is designed
for high speed TTL/TTL
“through holes” in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
applications. A standard 16 mA
TTL sink current through the
input LED will provide enough
output current for 1 TTL load and
a 5.6 kΩ pull-up resistor. CTR of
the HCPL-2531/0531 is 19%
minimum at IF = 16 mA.
electrically equivalent SO-8 part
number.
SO-8
Package
HCPL-0530
HCPL-0531
HCPL-0534
The HCPL-2530/0530 is for use in
TTL/CMOS, TTL/LSTTL or wide
bandwidth analog applications.
Current transfer ratio (CTR) for
the HCPL-2530/0530 is 7%
8 Pin DIP
HCPL-2530
HCPL-2531
HCPL-4534
The HCPL-4534/0534 is an
HCPL-2531/0531 with increased
common mode transient immunity
of 15,000 V/µs minimum at
VCM = 1500 V guaranteed.
minimum at IF = 16 mA.
Selection Guide
Widebody
Minimum CMR
8-pin DIP (300 Mil)
Small-Outline SO-8
(400 Mil)
Hermetic
Current
VCM Transfer
Dual
Channel
Package
Single
Channel
Package*
Dual
Channel
Package
Single
Channel
Package*
Single
Channel
Package*
Single and
Dual Channel
Packages*
dV/dt
(V/µs)
(V)
Ratio (%)
1,000
10
7
HCPL-2530
HCPL-2531
6N135
HCPL-0530
HCPL-0531
HCPL-0500
HCNW135
19
6N136
HCPL-4502
HCPL-0501
HCPL-0452
HCNW136
HCNW4502
15,000 1500
1,000 10
19
9
HCPL-4534 HCPL-4503
HCPL-0534
HCPL-0453
HCNW4503
HCPL-55XX
HCPL-65XX
4N55
*Technical data for these products are on separate HP publications.
3
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-2531#XXX
020 = UL 5000 V rms/1 Minute Option*
300 = Gull Wing Surface Mount Option†
500 = Tape and Reel Packaging Option
Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for
information.
*For HCPL-2530/1 and HCPL-4534 only.
†Gull wing surface mount option applies to through hole parts only.
Schematic
1
+
I
CC
I
F1
V
CC
8
7
V
F1
I
O1
V
O1
–
2
3
–
I
F2
I
O2
V
O2
6
5
V
F2
+
4
GND
HCPL-4534/0534 SHIELD
USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED
BETWEEN PINS 5 AND 8 IS RECOMMENDED.
4
Package Outline Drawings
8-Pin DIP Package (HCPL-2530/2531/4534)
7.62 ± 0.25
(0.300 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
8
1
7
6
5
6.35 ± 0.25
(0.250 ± 0.010)
TYPE NUMBER
OPTION CODE*
DATE CODE
HP XXXXZ
YYWW
U R
4
UL
2
3
RECOGNITION
1.78 (0.070) MAX.
1.19 (0.047) MAX.
+ 0.076
- 0.051
0.254
5° TYP.
+ 0.003)
- 0.002)
(0.010
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
1.080 ± 0.320
0.65 (0.025) MAX.
(0.043 ± 0.013)
DIMENSIONS IN MILLIMETERS AND (INCHES).
2.54 ± 0.25
(0.100 ± 0.010)
* MARKING CODE LETTER FOR OPTION NUMBERS.
"L" = OPTION 020
OPTION NUMBERS 300 AND 500 NOT MARKED.
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2530/2531/4534)
PAD LOCATION (FOR REFERENCE ONLY)
9.65 ± 0.25
(0.380 ± 0.010)
1.016 (0.040)
1.194 (0.047)
6
5
8
1
7
4.826
(0.190)
TYP.
6.350 ± 0.25
(0.250 ± 0.010)
9.398 (0.370)
9.906 (0.390)
2
3
4
0.381 (0.015)
0.635 (0.025)
1.194 (0.047)
1.778 (0.070)
9.65 ± 0.25
(0.380 ± 0.010)
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
7.62 ± 0.25
(0.300 ± 0.010)
+ 0.076
- 0.051
0.254
4.19
+ 0.003)
- 0.002)
MAX.
(0.165)
(0.010
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
0.635 ± 0.130
(0.025 ± 0.005)
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
5
Small Outline SO-8 Package (HCPL-0530/0531/0534)
8
7
6
5
5.994 ± 0.203
(0.236 ± 0.008)
XXX
3.937 ± 0.127
(0.155 ± 0.005)
YWW
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
1
2
3
4
PIN ONE
0.406 ± 0.076
(0.016 ± 0.003)
1.270
(0.050)
BSG
0.432
(0.017)
*
7°
5.080 ± 0.127
(0.200 ± 0.005)
45° X
3.175 ± 0.127
(0.125 ± 0.005)
0 ~ 7°
0.228 ± 0.025
(0.009 ± 0.001)
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
*
0.305
(0.012)
MIN.
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
Solder Reflow Temperature Profile (HCPL-0530/0531/0534 and Gull Wing Surface
Mount Option Parts)
260
240
∆T = 145°C, 1°C/SEC
220
∆T = 115°C, 0.3°C/SEC
200
180
160
140
120
100
80
∆T = 100°C, 1.5°C/SEC
60
40
20
0
0
1
2
3
4
5
6
7
8
9
10
11
12
TIME – MINUTES
Note: Use of nonchlorine activiated fluxes is highly recommended.
CSA
Regulatory Information
UL
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
The devices contained in this data
sheet have been approved by the
following organizations:
Recognized under UL 1577,
Component Recognition
Program, File E55361.
6
Insulation and Safety Related Specifications
8-Pin DIP
(300 Mil) SO-8
Parameter
Symbol
Value
Value Units
Conditions
Minimum External
Air Gap (External
Clearance)
L(101)
7.1
4.9
mm Measured from input terminals to output to
to output terminals, shortest distance through
air.
Minimum External
Tracking (External
Creepage)
L(102)
7.4
4.8
mm Measured from input terminals to output
terminals, shortest distance path along body.
Minimum Internal
Plastic Gap
(Internal Clearance)
0.08
0.08
mm Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity.
Minimum Internal
Tracking (Internal
Creepage)
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
NA
200
IIIa
NA
200
IIIa
mm Measured from input terminals to output
terminals, along internal cavity.
CTI
Volts DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
Parameter
Storage Temperature
Operating Temperature
Average Forward Input Current
(each channel)
Symbol
Device
Min.
-55
-55
Max. Units Note
T
S
125
100
25
°C
°C
mA
T
A
I
F(AVG)
Peak Forward Input Current (each channel)
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current (each channel)
I
50
1
mA
A
F(PEAK)
I
F(TRANS)
(≤ 1 µs pulse width, 300 pps)
Reverse LED Input Voltage (each channel)
Input Power Dissipation (each channel)
Average Output Current (each channel)
Peak Output Current
Supply Voltage (Pin 8-5)
Output Voltage (Pins 7-5, 6-5)
V
5
45
8
16
30
20
35
V
mW
mA
mA
V
R
P
IN
I
I
O(AVG)
O(PEAK)
V
-0.5
-0.5
CC
V
V
mW
O
Output Power Dissipation (each channel)
P
O
13
Lead Solder Temperature
(Through-Hole Parts Only)
1.6 mm below seating plane, 10 seconds
T
LS
8 Pin DIP
260
°C
See Package Outline
Drawings section
Reflow Temperature Profile
T
RP
SO-8 and
Option 300
7
Electrical Specifications (DC)
Over recommended temperature (TA = 0°C to 70°C) unless otherwise specified. See note 9.
Parameter Sym. Device Min. Typ.* Max. Units Test Conditions
Fig. Note
IF = 16 mA, 1, 2 1, 2
Current
Transfer
Ratio
CTR HCPL-2530/
0530
7
5
18
24
50
50
%
%
T = 25°C
A
VCC = 4.5 V
4
VO = 0.5 V
HCPL-2531/ 19
0531
T = 25°C
A
HCPL-4534/ 15
0534
Logic Low
Output
Voltage
VOL HCPL-2530/
0.1
0.1
0.5
V
V
T = 25°C IO = 1.1 mA IF = 16 mA,
1
1
1
A
0530
VCC = 4.5 V
0.5
0.5
IO = 0.8 mA
HCPL-2531/
0531
HCPL-4534/
0534
T = 25°C IO = 3.0 mA
A
0.5
IO = 2.4 mA
Logic High
Output
Current
IOH
0.003 0.5
µA TA = 25°C VO = Open IF = 0 mA
CC = 5.5 V
6
3
1
V
50
VO = Open
CC = 15.0 V
µA IF = 16 mA, VO = Open,
CC = 15 V
V
Logic Low
Supply
Current
ICCL
ICCH
VF
100 400
V
Logic High
Supply
Current
0.05
1.5
4
µA IF = 0 mA, VO = Open,
CC = 15 V
V
Input
Forward
Voltage
1.7
1.8
V
V
TA = 25°C
IR=10 µA
1
1
IF = 16 mA
Input
BVR
5
Reverse
Breakdown
Voltage
Temperature ∆VF
-1.6
60
mV/ IF = 16 mA
°C
Coefficient
of Forward
Voltage
∆TA
Input
CIN
pF f = 1 MHz, VF = 0 V
Capacitance
*All typicals at TA = 25°C.
8
Switching Specifications (AC)
Over recommended temperature (T = 0°C to 70°C), VCC = 5 V, IF = 16 mA unless otherwise specified.
A
Device
Parameter
Sym.
HCPL-
Min. Typ.* Max. Units
Test Conditions
Fig. Note
Propagation
Delay Time
to Logic Low
at Output
tPHL 2530/0530
0.2
1.5
2.0
0.8
1.0
µs
TA = 25°C
RL = 4.1 kΩ
5, 9, 6, 7
11
2531/0531/
4534/0534
0.2
TA = 25°C
RL = 1.9 kΩ
Propagation
Delay Time
High to Logic
at Output
tPLH 2530/0530
1.3
0.6
1.5
2.0
0.8
1.0
µs
TA = 25°C
TA = 25°C
RL = 4.1 kΩ
RL = 1.9 kΩ
5, 9, 6, 7
11
2531/0531/
4534/0534
Common
|CMH| 2530/0530
2531/0531
1
1
15
10
10
30
kV/µs RL = 4.1 kΩ IF = 0 mA,
RL = 1.9 kΩ TA = 25°C,
10 5, 6,
7
Mode Transient
Immunity at
Logic High
Level Output
4534/0534
RL = 1.9 kΩ VCM = 10 Vp-p
Common
|CML| 2530/0530
2531/0531
1
1
15
10
10
30
kV/µs RL = 4.1 kΩ IF = 0 mA,
RL = 1.9 kΩ TA = 25°C,
10 5, 6,
7
Mode Transient
Immunity at
Logic Low
4534/0534
RL = 1.9 kΩ VCM = 10 Vp-p
Level Output
Bandwidth
BW
3
MHz RL = 100 kΩ
7, 8
*All typicals at TA = 25°C.
Package Characteristics
Parameter
Sym.
Device
Min. Typ.* Max. Units Test Conditions Fig. Note
Input-Output
Momentary With-
stand Voltage**
V
ISO
2500
HCPL-2530/ 5000
2531/4534
V rms
RH < 50%,
t = 1 min.,
3, 10
3, 11
Option 020
Resistance
(Input-Output)
RI-O
1012
Ω
RH ≤ 45%
VI-O = 500 Vdc,
t = 5 s
3
Capacitance
CI-O
II-I
0.6
pF
f = 1 MHz,
A
12
4
(Input-Output)
T = 25°C
Input-Input
0.005
µA
RH ≤ 45%,
Insulation
t = 5 s,
Leakage Current
V = 500 Vdc
I-I
Resistance
RI-I
CI-I
1011
0.03
0.25
Ω
4
4
(Input-Input)
Capacitance
(Input-Input)
HCPL-2530/
2531/4534
HCPL-0530/
0531/0534
pF
f = 1 MHz
*All typicals at T = 25°C.
A
**The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output
continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable),
your equipment level safety specification or HP Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage,”
publication number 5963-2203E.
9
Notes:
1. Each channel.
VO > 2.0 V). Common mode transient
immunity in a Logic Low level is the
maximum tolerable (negative)
dVCM/dt on the falling edge of the
common mode pulse signal, VCM, to
assure that the output will remain in a
Logic Low state (i.e., VO < 0.8 V).
6. The 1.9 kΩ load represents 1 TTL
unit load of 1.6 mA and the 5.6 kΩ
pull-up resistor.
10. In accordance with UL 1577, each
optocoupler is proof tested by
2. CURRENT TRANSFER RATIO is
defined as the ratio of output
collector current, IO, to the forward
LED input current, IF, times 100%.
3. Device considered a two-terminal
device: pins 1, 2, 3, and 4 shorted
together and pins 5, 6, 7, and 8
shorted together.
applying an insulation test voltage
≥ 3000 V rms for 1 second (leakage
detection current limit, II-O ≤ 5 µA).
11. In accordance with UL 1577, each
optocoupler is proof tested by
applying an insulation test voltage
≥ 6000 V rms for 1 second (leakage
detection current limit, II-O ≤ 5 µA).
12. Measured between the LED anode and
cathode shorted together and pins 5
through 8 shorted together.
4. Measured between pins 1 and 2
shorted together, and pins 3 and 4
shorted together.
7. The 4.1 kΩ load represents 1 LSTTL
unit load of 0.36 mA and the 6.1 kΩ
pull-up resistor.
5. Common mode transient immunity in
a Logic High level is the maximum
tolerable (positive) dVCM/dt on the
rising edge of the common mode
pulse, VCM, to assure that the output
will remain in a Logic High state (i.e.,
8. The frequency at which the ac output
voltage is 3 dB below the low
frequency asymptote.
9. Use of a 0.1 µF bypass capacitor
connected between pins 5 and 8 is
recommended.
13. Derate linearly above 90°C free-air
temperature at a rate of 3.0 mW/°C
for the SOIC-8 package.
1.5
1000
100
40 mA
35 mA
T
= 25°C
= 5.0 V
A
HCPL-2530/0530
HCPL-2531/0531/4534/0534
10
V
CC
I
F
T
A
= 25°C
30 mA
25 mA
20 mA
+
10
1.0
1.0
V
F
–
5
0.1
0.5
NORMALIZED
15 mA
10 mA
I
V
V
T
= 16 mA
F
0.01
0.001
= 0.5 V
O
= 5 V
CC
I
= 5 mA
F
= 25°C
A
0.1
0
0
20
10
– OUTPUT VOLTAGE – V
0
1
10
100
1.1
1.2
V – FORWARD VOLTAGE – VOLTS
F
1.3
1.4
1.5
1.6
V
I
– INPUT CURRENT – mA
O
F
Figure 2. Current Transfer Ratio vs.
Input Current.
Figure 3. Input Current vs. Forward
Voltage.
Figure 1. DC and Pulsed Transfer
Characteristics.
10
+4
1.1
1.0
0.9
2000
1500
1000
500
0
10
I
= 16 mA, V
= 5.0 V
CC
F
I
= 0
F
HCPL-2530/0530 (R = 4.1 kΩ)
HCPL-2531/0531/4534/0534
(R = 1.9 kΩ)
L
V
O
= V
= 5.0 V
CC
+3
10
10
L
+2
NORMALIZED
= 16 mA
+1
I
F
10
V
= 0.5 V
= 5 V
= 25°C
O
0.8
0.7
0.6
V
CC
A
t
t
PHL
0
PLH
10
T
-1
HCPL-2530/0530
HCPL-2531/0531/4534/0534
10
10
-2
-60 -40 -20
0
20 40 60 80 100
-60
-20
– TEMPERATURE – °C
-50
-25
T
0
+25 +50 +75 +100
20
60
100
T
A
– TEMPERATURE – °C
T
– TEMPERATURE – °C
A
A
Figure 4. Current Transfer Ratio vs.
Temperature.
Figure 5. Propagation Delay vs.
Temperature.
Figure 6. Logic High Output Current vs.
Temperature.
0
0.30
T
I
F
= 25°C
= 16 mA
A
T
= 25°C, R = 100 Ω, V = 5 V
CC
A
L
-5
-10
-15
R
= 100 Ω
= 220 Ω
= 470 Ω
= 1 kΩ
L
R
L
0.20
0.10
0
R
L
R
L
-20
-25
-30
0.01
0.1
1.0
10
0
4
8
12
16
20
24
f – FREQUENCY – MHz
I
– QUIESCENT INPUT CURRENT – mA
F
+5 V
+5 V
1
2
8
7
Figure 7. Small-Signal Current Transfer
Ratio vs. Quiescent Input Current.
SET I
F
20 kΩ
100 Ω
R
L
AC INPUT
2N3053
0.1 µF
3
4
6
5
V
O
560 Ω
0.1 µF
1.6 V dc
0.25 Vp-p ac
Figure 8. Frequency Response.
11
I
F
PULSE
GEN.
I
F
1
2
3
4
8
7
6
5
+5 V
Z
t
= 50 Ω
= 5 ns
O
r
0
R
L
5 V
V
V
10% DUTY CYCLE
1/f < 100 µs
O
V
O
1.5 V
1.5 V
0.1µF
I
MONITOR
F
OL
C
= 1.5 pF
L
R
M
t
t
PHL
PLH
Figure 9. Switching Test Circuit.
B
1
8
7
6
5
+5 V
I
F
A
R
2
3
4
L
V
CM
90% 90%
10%
r
10%
V
O
0 V
V
FF
t
t
f
0.1 µF
V
O
5 V
SWITCH AT A:
SWITCH AT B:
I
I
= 0 mA
F
F
V
O
V
OL
V
CM
= 16 mA
–
+
PULSE GEN.
Figure 10. Test Circuit for Transient Immunity and Typical Waveforms.
3.0
I
I
= 10 mA
= 16 mA
F
F
2.0
V
T
A
= 5.0 V
= 25 °C
CC
1.0
0.8
t
PLH
0.6
0.4
t
PHL
0.2
0.1
1
2
3
4
5
6 7 8 9 10
R
– LOAD RESISTANCE – kΩ
L
Figure 11. Propagation Delay Time vs. Load Resistance.
www.hp.com/go/isolator
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distributor or representative call:
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Data subject to change.
Copyright © 1998 Hewlett-Packard Co.
Obsoletes 5966-1272E
Printed in U.S.A.
5968-1090E (7/98)
相关型号：
HCPL2530SD
8-Pin DIP 1Mbit/s Dual-Channel High Speed Transistor Output Optocoupler, 8LD,MDIP,OPTO,BLACK, SURFACE MOUNT FORM, 1000/TAPE REEL
FAIRCHILD
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