HCPL-253L-500E [AGILENT]
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| 型号： | HCPL-253L-500E |
| 厂家： | 
AGILENT TECHNOLOGIES, LTD. |
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AgilentHCPL-250L/050L/253L/053L
LVTTL/LVCMOSCompatible3.3V
Optocouplers(1Mb/s)
Data Sheet
Features
•
•
•
•
•
•
Low power consumption
High speed: 1 Mb/s
LVTTL/LVCMOScompatible
Available in 8-pin DIP, SO-8
Open collector output
These optocouplers are available
in an 8-pin DIP and in an industry
standard SO-8 package. The
following is a cross reference
table listing the 8-pin DIP part
number and the electrically
Description
These diode-transistor optocouplers
use an insulating layer between a
LED and an integrated
Guaranteed performance from
temperature:0˚Cto+70˚C
photodetector to provide electrical
insulation between input and
output. Separate connections for
the photodiode bias and output-
transistor collector increase the
speed up to a hundred times that of
a conventional phototransistor
coupler by reducing the base-
collector capacitance.
•
Safetyapproval,UL,CSA,IEC/EN/DIN
EN60747-5-2
equivalent SO-8 part number.
The SO-8 does not require
Applications
"through holes" in a PCB. This
package occupies approximately
one-third the footprint area of the
•
•
•
High voltage insulation
Video signal isolation
Power translator isolation in motor
drives
•
•
Line receivers
Functional Diagram
Feedback element in switched mode
power supplies
HCPL–250L/HCPL–050L
HCPL–253L/HCPL–053L
•
High speed logic ground isolation –
LVTTL/LVCMOS
1
2
3
4
8
7
6
5
V
V
V
8
7
6
5
ANODE
CATHODE
CATHODE
ANODE
NC
ANODE
CATHODE
NC
1
2
3
4
V
V
V
1
1
2
2
CC
O1
O2
CC
B
•
•
Replaces pulse transformers
Replaces slow phototransistor
isolators
O
•
Analog signal ground isolation
GND
GND
TRUTH TABLE
(POSITIVE LOGIC)
LED
V
O
ON
OFF
LOW
HIGH
A 0.1 µF bypass capacitor must be connected between pins 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent
damage and/or degradation which may be induced by ESD.
Ordering Information
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-250L#XXXX
These optocouplers can be used
in LVTTL/LVCMOS or wide
060=IEC/EN/DINEN60747-5-2V
IORM
500 = Tape and Reel Packaging Option
XXXE = Lead Free Option
bandwidth analog applications.
The common mode transient
immunity of 1000 V/µs minimum
Option data sheets available. Contact Agilent sales representative or
authorized distributor for information.
to typical at V = 10 V
CM
guaranteed for these
optocouplers.
Remarks: The notation “#” is used for existing products, while (new)
products launched since 15th July 2001 and lead free option will use “-”
8-Pin DIP
HCPL-250L
HCPL-253L
SO-8 Package
HCPL-050L
HCPL-053L
Schematic
HCPL-250L/HCPL-050L
HCPL-253L/HCPL-053L
I
CC
1
+
I
CC
8
I
F1
V
V
CC
CC
8
7
I
V
F
2
F1
I
ANODE
O1
+
V
O1
–
V
F
2
I
O
6
5
–
V
O
CATHODE
3
3
I
F2
SHIELD
GND
–
I
O2
V
O2
I
B
6
5
V
F2
7
V
B
*
+
4
GND
SHIELD
2
Package Outline Drawings
8-Pin DIP Package
7.62 ± 0.25
(0.300 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
8
1
7
6
5
6.35 ± 0.25
(0.250 ± 0.010)
TYPE NUMBER
OPTION CODE*
DATE CODE
A XXXXZ
YYWW
U R
UL
2
3
4
RECOGNITION
1.78 (0.070) MAX.
1.19 (0.047) MAX.
+ 0.076
- 0.051
0.254
5° TYP.
+ 0.003)
- 0.002)
3.56 ± 0.13
(0.140 ± 0.005)
(0.010
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
1.080 ± 0.320
0.65 (0.025) MAX.
(0.043 ± 0.013)
* MARKING CODE LETTER FOR OPTION NUMBERS
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
2.54 ± 0.25
(0.100 ± 0.010)
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Small Outline SO-8 Package
LAND PATTERN RECOMMENDATION
8
1
7
2
6
5
5.994 ± 0.203
(0.236 ± 0.008)
XXXV
YWW
3.937 ± 0.127
(0.155 ± 0.005)
TYPE NUMBER
(LAST 3 DIGITS)
7.49 (0.295)
DATE CODE
3
4
1.9 (0.075)
PIN ONE
0.406 ± 0.076
(0.016 ± 0.003)
1.270
(0.050)
BSC
0.64 (0.025)
0.432
45° X
*
7°
5.080 ± 0.127
(0.200 ± 0.005)
(0.017)
3.175 ± 0.127
(0.125 ± 0.005)
0 ~ 7°
0.228 ± 0.025
(0.009 ± 0.001)
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
*
0.305
(0.012)
MIN.
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
OPTION NUMBER 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
3
Regulatory Information
Solder Reflow Temperature Profile
The devices contained in this
data sheet have been approved by
the following organizations:
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
UL
PEAK
TEMP.
230°C
Approval under UL 1577,
Component Recognition
Program, File E55361.
200
100
0
2.5°C ± 0.5°C/SEC.
SOLDERING
TIME
200°C
30
160°C
150°C
140°C
SEC.
30
SEC.
CSA
3°C + 1°C/–0.5°C
Approval under CSA Component
Acceptance
Notice #5, File CA 88324.
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
IEC/EN/DINEN60747-5-2
0
50
100
150
200
250
Approved under:
TIME (SECONDS)
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
Recommended Pb-Free IR Profile
TIME WITHIN 5 °C of ACTUAL
PEAKTEMPERATURE
t
p
20-40 SEC.
260 +0/-5 °C
T
T
p
217 °C
L
RAMP-UP
3 °C/SEC. MAX.
RAMP-DOWN
6 °C/SEC. MAX.
150 - 200 °C
T
smax
T
smin
t
s
t
L
60 to 150 SEC.
PREHEAT
60 to 180 SEC.
25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
= 200 °C, T = 150 °C
T
smax
smin
4
Insulation and Safety Related Specifications
8-Pin DIP
(300Mil)
Value
SO-8
Parameter
Symbol
Value Units Conditions
Minimum External Air
Gap (External Clearance)
L (101)
7.1
4.9
mm
mm
mm
Measured from input terminals to output
terminals, shortest distance through air.
Minimum External Tracking L (102)
(External Creepage)
7.4
4.8
Measured from input terminals to output
terminals, shortest distance path along body.
Minimum Internal Plastic
Gap (Internal Clearance)
0.08
0.08
Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity.
Tracking Resistance
(Comparative Tracking
Index)
CTI
200
IIIa
200
IIIa
Volts DIN IEC 112/VDE 0303 Part 1
Isolation Group
Material Group (DIN VDE 0110, 1/89, Table 1)
IEC/EN/DINEN60747-5-2InsulationRelatedCharacteristics
Description
Symbol
PDIP Option 060
SO-8 Option 60
Units
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤ 150 V rms
I-IV
I-III
I-II
for rated mains voltage ≤ 300 V rms
for rated mains voltage ≤ 600 V rms
I-IV
I-III
Climatic Classification
55/85/21
55/85/21
Pollution Degree (DIN VDE 0110/1.89)
Maximum Working Insulation Voltage
Input to Output Test Voltage, Method b*
2
2
V
V
630
566
V
V
IORM
PR
peak
peak
V
x 1.875 = V , 100% Production Test
1181
1063
IORM
PR
with t = 1 sec, Partial Discharge < 5 pC
m
Input to Output Test Voltage, Method a*
V
x 1.5 = V , Type and Sample Test,
= 60 sec, Partial Discharge < 5 pC
V
V
945
849
V
V
IORM
PR
PR
peak
peak
t
m
Highest Allowable Overvoltage*
6000
4000
IOTM
(Transient Overvoltage, t = 10 sec)
ini
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 16, Thermal Derating curve.)
Case Temperature
T
175
230
600
150
150
600
˚C
mA
mW
S
Input Current
Output Power
I
S,INPUT
P
S,OUTPUT
S
9
9
Insulation Resistance at T , V = 500 V
R
≥ 10
≥ 10
Ω
S
IO
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN 60747-5-2, for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.
5
Absolute Maximum Ratings
Parameter
Symbol
Min.
–55
–55
–55
Max.
125
100
85
Units
°C
Note
Storage Temperature
Operating Temperature
T
T
S
°C
A
Average Forward Input Current
I
I
25
mA
mA
1
2
F(AVG)
Peak Forward Input Current
(50% duty cycle, 1 ms pulse width)
F(PEAK)
50
40
1
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current
I
A
F(TRANS)
(≤ 1 µs pulse width, 300 pps)
0.1
5
Reverse LED Input Voltage (Pin 3-2)
Input Power Dissipation
V
P
V
R
45
4
mW
3
IN
Average Output Current (Pin 6)
Peak Output Current
I
I
8
mA
mA
V
O(AVG)
16
5
O(PEAK)
Emitter-Base Reverse Voltage
Supply Voltage (Pin 8-5)
Output Voltage (Pin 6-5)
Base Current
V
V
V
EBR
CC
O
–0.5
–0.5
7
V
7
V
I
5
mA
mW
B
Output Power Dissipation
P
100
4
O
Lead Solder Temperature
(Through Hole Parts Only)
1.6 mm below seating plane, 10 sec.
up to seating plane, 10 seconds
T
T
260
260
°C
°C
LS
Reflow Temperature Profile
See Package Outline Drawings
section
RP
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
3.6
20
Units
V
Power Supply Voltage
Forward Input Current
Forward Input Voltage
Operating Temperature
V
2.7
16
0
CC
I
mA
V
F(ON)
V
0.8
85
F(OFF)
T
0
°C
A
6
Electrical Specifications (DC)
Over Recommended Temperature (T = 0˚C to +70˚C), V = 3.3 V, I = 16 mA, unless otherwise specified. See Note 13.
A
CC
F
Parameter
Sym. Device Min. Typ. Max. Units Test Conditions
Fig. Note
Current Transfer CTR
Ratio
%
T = 25˚C V = 0.4 V
I = 16 mA,
2
5, 11
A
O
F
V
= 3.3 V
CC
15
20
50
Logic Low
V
OL
V
I = 16 mA,
F
Output Voltage
V
= 3.3 V
CC
0.05 0.3
0.003
T = 25˚C I = 3.0 mA
A O
Logic High
Output Current
I
I
I
1
µA
µA
µA
V
T = 25˚C V = V = 3.3 V I = 0 mA
3
1
OH
A
O
CC
F
Logic Low
Supply Current
43.0 100
300
I = 16 mA, V = Open, V = 3.3 V
13
13
CCL
CCH
F
O
CC
Dual
Dual
Logic High
Supply Current
0.005 0.3
10
T = 25˚C I = 0 mA, V = Open,
A F O
V
= 3.3 V
CC
Input Forward
Voltage
V
1.52 1.7
T = 25˚C I = 16 mA
A F
F
Input Reverse
Breakdown
Voltage
BV
5
V
I = 10 µA
R
R
Input
C
60
pF
f = 1 MHz, V = 0 V
F
IN
Capacitance
Switching Specifications (AC)
Over Recommended Temperature (T = 0˚C to +70˚C), V = 3.3 V, I = 16 mA unless otherwise specified.
A
CC
F
All typicals at V = 3.3 V, T = 25°C.
CC
A
Parameter
Sym. Device Min. Typ.* Max. Units Test Conditions
Fig. Note
Propagation
Delay Time to
Logic Low at
Output
t
0.35
0.65
1
1
µs
µs
R = 1.9 kΩ
5
5
6
8, 9
PHL
L
Propagation
Delay Time to
Logic High at
Output
t
1
R = 1.9 kΩ
L
8, 9
PLH
Common Mode |CM |
kV/µs R = 4.1 kΩ I = 0 mA, T = 25˚C,
7, 8, 9
H
L
F
A
Transient
R = 1.9 kΩ
L
V
= 10 V
CM p-p
Immunity at
Logic High
Level Output
C = 15 pF
L
Common Mode |CM |
1
kV/µs R = 4.1 kΩ I = 16 mA, T = 25˚C,
6
7, 8, 9
L
L
F
A
Transient
R = 1.9 kΩ
L
V
= 10 V
CM p-p
Immunity at
Logic Low
Level Output
C = 15 pF
L
*All typicals at T = 25˚C
A
7
Package Characteristics
Over Recommended Temperature (T = 0˚C to 70˚C) unless otherwise specified.
A
Parameter
Sym. Device
Min. Typ.* Max.
Units Test Conditions
Fig. Note
Input-Output
Momentary
Withstand
Voltage**
V
8-Pin DIP
SO-8
3750
V rms RH < 50%,
t = 1 min.,
6, 14
ISO
T = 25˚C
A
I
8-Pin DIP
1
µA
45% RH, t = 5 s,
6, 16
I-O
V
= 3 kVdc,
I-O
T = 25˚C
A
12
Input-Output
Resistance
R
C
8-Pin DIP
SO-8
10
Ω
V
= 500 Vdc
I-O
6
6
I-O
I-O
Input-Output
Capacitance
8-Pin DIP
SO-8
0.6
pF
f = 1 MHz
*All typicals at T = 25˚C.
A
**The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous
voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Table (if applicable),
your equipment level safety specification or Agilent Application Note 1074 entitled "Optocoupler Input-Output Endurance Voltage," publication
number 5963-2203E.
Notes:
1. Derate linearly above 70˚C free-air temperature at a rate of 0.8 mA/˚C (8-Pin DIP).
Derate linearly above 85˚C free-air temperature at a rate of 0.5 mA/˚C (SO-8).
2. Derate linearly above 70˚C free-air temperature at a rate of 1.6 mA/˚C (8-Pin DIP).
Derate linearly above 85˚C free-air temperature at a rate of 1.0 mA/˚C (SO-8).
3. Derate linearly above 70˚C free-air temperature at a rate of 0.9 mW/˚C (8-Pin DIP).
Derate linearly above 85˚C free-air temperature at a rate of 1.1 mW/˚C (SO-8).
4. Derate linearly above 70˚C free-air temperature at a rate of 2.0 mW/˚C (8-Pin DIP).
Derate linearly above 85˚C free-air temperature at a rate of 2.3 mW/˚C (SO-8).
5. CURRENT TRANSFER RATIO in percent is defined as the ratio of output collector current, I , to the forward LED input current, I , times 100.
O
F
6. Device considered a two-terminal device: Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together.
7. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dV /dt on the leading edge of the common
CM
mode pulse signal, V , to assure that the output will remain in a Logic High state (i.e., V > 2.0 V). Common mode transient immunity in a
CM
O
Logic Low level is the maximum tolerable (negative) dV /dt on the trailing edge of the common mode pulse signal, V , to assure that the
CM
CM
output will remain in a Logic Low state (i.e., V < 0.8 V).
O
8. The 1.9 kΩ load represents 1 TTL unit load of 1.6 mA and the 5.6 mA kΩ pull-up resistor.
9. The 4.1 kΩ load represents 1 LSTTL unit load of 0.36 mA and 6.1 kΩ pull-up resistor.
10. The frequency at which the AC output voltage is 3 dB below its mid-frequency value.
11. The JEDEC registration for the 6N136 specifies a minimum CTR of 15%. Agilent guarantees a minimum CTR of 15%.
12. See Option 020 data sheet for more information.
13. Use of a 0.1 µf bypass capacitor connected between pins 5 and 8 is recommended.
14. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 4500 V rms for 1 second (leakage
detection current limit, I ≤ 5 µA). This test is performed before the 100% Production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation
I-O
Related Characteristics Table, if applicable.
15. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 6000 V rms for 1 second (leakage
detection current limit, I ≤ 5 µA). This test is performed before the 100% Production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation
I-O
Related Characteristics Table, if applicable.
16. This rating is equally validated by an equivalent AC proof test.
8
8 PIN DIP, SO-8
8 PIN DIP, SO-8
8 PIN DIP, SO-8
+4
1.1
1.0
0.9
10
1000
100
10
I
V
= 0
O
F
= V = 3.3 V
CC
+3
10
I
F
T
A
= 25°C
+2
+
V
–
10
NORMALIZED
= 16 mA
= 0.4 V
= 3.3 V
CC
= 25°C
F
I
V
V
T
F
O
+1
1.0
10
0.8
0.7
0.6
A
0
0.1
10
-1
0.01
0.001
10
10
-2
-60 -40 -20
0
20 40 60 80 100
-75 -50 -25
0
+25 +50 +75 +100
1.1
1.2
1.3
1.4
1.5
1.6
V
– FORWARD VOLTAGE – VOLTS
T
– TEMPERATURE – °C
F
T
– TEMPERATURE – °C
A
A
Figure 1. Input current vs. forward voltage.
Figure 2. Current transfer ratio vs.
temperature.
Figure 3. Logic high output current vs.
temperature.
800
P
(mW)
S
700
600
500
400
300
200
100
0
I
(mA)
S
0
25 50 75 100 125 150 175 200
– CASE TEMPERATURE – °C
T
S
Figure 4. Thermal derating curve, dependence
of safety limiting value with case temperature
perIEC/EN/DINEN60747-5-2.
9
I
F
I
PULSE
GEN.
F
8
7
6
5
1
2
3
4
+3.3 V
0
Z
t
= 50 Ω
= 5 ns
O
r
R
L
V
O
10% DUTY CYCLE
1/f < 100 µS
V
O
50%
50%
0.1µF
V
I
MONITOR
F
OL
C
= 1.5 µF
L
R
M
t
t
PHL
PLH
Figure 5. Switching test circuit.
I
F
1
8
7
6
5
+3.3 V
B
R
2
L
*
V
CM
A
90% 90%
10%
r
10%
0 V
3
V
O
t
t
f
0.1 µF
V
O
4
3.3 V
V
FF
SWITCH AT A:
SWITCH AT B:
I
I
= 0 mA
F
F
V
O
V
OL
V
CM
= 16 mA
–
+
PULSE GEN.
Figure 6. Test circuit for transient immunity and typical waveforms.
10
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For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
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Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5989-0300EN
December 20, 2004
5989-2111EN
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