HCPL-250L#020 [AGILENT]

Transistor Output Optocoupler, 1-Element;
HCPL-250L#020
型号: HCPL-250L#020
厂家: AGILENT TECHNOLOGIES, LTD.    AGILENT TECHNOLOGIES, LTD.
描述:

Transistor Output Optocoupler, 1-Element

文件: 总12页 (文件大小:214K)
中文:  中文翻译
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Agilent HCPL-270L/ 070L/273L/073L  
Low Input Current High Gain  
LVTTL/LVCMOS Compatible  
3.3 V Optocouplers  
Data Sheet  
Features  
Low power consumption  
High current transfer ratio  
Low input current requirements –  
0.5 mA  
LVTTL/LVCMOS compatible output  
darlington operation. A base  
access terminal allows a gain  
bandwidth adjustment to be  
made.  
Description  
Performance guaranteed over  
temperature 0˚C to +70˚C  
These high gain series couplers use  
a Light Emitting Diode and an  
integrated high gain photodetector  
to provide extremely high current  
transfer ratio between input and  
output. Separate pins for the  
photodiode and output stage result  
in LVTTL compatible saturation  
voltages and high speed operation.  
Where desired, the V and V  
Base access allows gain  
bandwidth adjustment  
These optocouplers are for use in  
LVTTL/LVCMOS or other low  
power applications. A 400%  
minimum current transfer ratio is  
guaranteed over 0 to +70˚C  
operating range for only 0.5 mA  
of LED current.  
High output current – 60 mA  
Safety approval, UL, VDE, CSA  
(pending)  
CC  
O
Applications  
terminals may be tied together to  
achieve conventional photo-  
Ground isolate most logic  
families – LVTTL/LVCMOS  
Low input current line receiver  
High voltage insulation  
Functional Diagram  
EIA RS-232C line receiver  
Telephone ring detector  
HCPL-270L/070L  
HCPL-273L/073L  
117 V AC line voltage status  
indicator – low input power  
dissipation  
8
NC  
ANODE  
CATHODE  
NC  
1
2
3
4
V
V
V
CC  
1
2
3
4
8
7
6
5
V
V
V
ANODE  
CATHODE  
CATHODE  
ANODE  
CC  
O1  
O2  
1
1
2
2
7
6
5
B
Low power systems – ground  
isolation  
O
GND  
GND  
SHIELD  
TRUTH TABLE  
LED  
V
O
ON  
OFF  
LOW  
HIGH  
A 0.1 µF bypass capacitor connected between pins 8 and 5 is recommended.  
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent  
damage and/or degradation which may be induced by ESD.  
Ordering Information  
Specify Part Number followed by Option Number (if desired).  
The HCPL-070L and HCPL-073L  
are surface mount devices  
packaged in an industry standard  
SOIC-8 footprint.  
Example:  
HCPL-270L #XXX  
The SOIC-8 does not require  
"through holes" in a PCB. This  
package occupies approximately  
one-third the footprint area of the  
standard dual-in-line package.  
The lead profile is designed to be  
compatible with standard surface  
mount processes.  
060 = VDE 0884 V  
500 = Tape and Reel Packaging Option  
= 630 V  
Option  
peak  
IORM  
Option data sheets available. Contact your Agilent sales representative  
or authorized distributor for information.  
Selection Guide  
8-Pin DIP (300 Mil)  
Small Outline SO-8  
Single Channel  
Package HCPL-  
270L  
Dual Channel  
Package HCPL-  
273L  
Single Channel  
Package HCPL-  
070L  
Dual Channel  
Package HCPL-  
073L  
Minimum Input  
ON Current (I )  
Minimum CTR  
400%  
300%  
F
0.5 mA  
1.6 mA  
Schematic  
I
I
CC  
1
+
F1  
V
CC  
8
V
F1  
V
CC  
8
2
I
O1  
V
O1  
I
CC  
7
6
5
I
F
2
+
ANODE  
I
3
F2  
I
O2  
V
F
V
O2  
3
V
F2  
CATHODE  
I
O
6
5
V
O
+
4
GND  
GND  
SHIELD  
SHIELD  
I
B
USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED  
BETWEEN PINS 5 AND 8 IS RECOMMENDED  
7
V
B
HCPL-270L/HCPL-070L  
HCPL-273L/HCPL-073L  
2
Package Outline Drawings  
8-Pin DIP Package  
7.62 ± 0.25  
(0.300 ± 0.010)  
9.65 ± 0.25  
(0.380 ± 0.010)  
8
1
7
6
5
6.35 ± 0.25  
(0.250 ± 0.010)  
TYPE NUMBER  
OPTION CODE*  
DATE CODE  
A XXXXZ  
YYWW  
U R  
UL  
2
3
4
RECOGNITION  
1.78 (0.070) MAX.  
1.19 (0.047) MAX.  
+ 0.076  
- 0.051  
0.254  
5° TYP.  
+ 0.003)  
- 0.002)  
(0.010  
4.70 (0.185) MAX.  
0.51 (0.020) MIN.  
2.92 (0.115) MIN.  
DIMENSIONS IN MILLIMETERS AND (INCHES).  
*MARKING CODE LETTER FOR OPTION NUMBERS  
"L" = OPTION 020  
1.080 ± 0.320  
(0.043 ± 0.013)  
0.65 (0.025) MAX.  
OPTION NUMBERS 300 AND 500 NOT MARKED.  
2.54 ± 0.25  
(0.100 ± 0.010)  
3
Small Outline SO-8 Package  
8
1
7
2
6
5
4
5.994 ± 0.203  
(0.236 ± 0.008)  
XXX  
YWW  
3.937 ± 0.127  
(0.155 ± 0.005)  
TYPE NUMBER  
(LAST 3 DIGITS)  
DATE CODE  
3
PIN ONE  
0.406 ± 0.076  
(0.016 ± 0.003)  
1.270  
(0.050)  
BSG  
0.432  
(0.017)  
*
7°  
5.080 ± 0.127  
(0.200 ± 0.005)  
45° X  
3.175 ± 0.127  
(0.125 ± 0.005)  
0 ~ 7°  
0.228 ± 0.025  
(0.009 ± 0.001)  
1.524  
(0.060)  
0.203 ± 0.102  
(0.008 ± 0.004)  
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)  
5.207 ± 0.254 (0.205 ± 0.010)  
*
0.305  
(0.012)  
MIN.  
DIMENSIONS IN MILLIMETERS (INCHES).  
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.  
Solder Reflow Temperature Profile (Surface Mount Option Parts)  
Regulatory Information  
The devices contained in this  
data sheet are pending by the  
following organizations:  
260  
240  
T = 145°C, 1°C/SEC  
220  
200  
180  
160  
140  
120  
100  
80  
T = 115°C, 0.3°C/SEC  
UL  
Approval (pending) under UL  
1577, Component Recognition  
Program, File E55361.  
T = 100°C, 1.5°C/SEC  
CSA  
60  
40  
Approval (pending) under CSA  
Component Acceptance  
Notice #5, File CA 88324.  
20  
0
0
1
2
3
4
5
6
7
8
9
10  
11  
12  
TIME – MINUTES  
VDE  
(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS HIGHLY RECOMMENDED.)  
Approval (pending) according to  
VDE 0884/06.92.  
4
Insulation and Safety Related Specifications  
8-Pin DIP  
(300 Mil)  
Value  
SO-8  
Parameter  
Symbol  
Value Units Conditions  
Minimum External Air  
Gap (External Clearance)  
Minimum External Tracking L (102)  
(External Creepage)  
Minimum Internal Plastic  
Gap (Internal Clearance)  
L (101)  
7.1  
4.9  
mm  
mm  
mm  
Measured from input terminals to output  
terminals, shortest distance through air.  
Measured from input terminals to output  
7.4  
4.8  
terminals, shortest distance path along body.  
0.08  
0.08  
Through insulation distance, conductor to  
conductor, usually the direct distance  
between the photoemitter and photodetector  
inside the optocoupler cavity.  
Minimum Internal Tracking  
(Internal Creepage)  
Tracking Resistance  
(Comparative Tracking  
Index)  
NA  
200  
NA  
200  
mm  
Measured from input terminals to output  
terminals, along internal cavity.  
CTI  
Volts DIN IEC 112/VDE 0303 Part 1.  
Isolation Group  
IIIa  
IIIa  
Material Group (DIN VDE 0110, 1/89, Table 1).  
VDE 0884 Insulation Related Characteristics  
Description  
Symbol  
Characteristic Units  
Installation classification per DIN VDE 0110/1.89, Table 1  
for rated mains voltage 300 V rms  
I-IV  
I-III  
for rated mains voltage 450 V rms  
Climatic Classification  
55/100/21  
2
630  
Pollution Degree (DIN VDE 0110/1.89)  
Maximum Working Insulation Voltage  
Input to Output Test Voltage, Method b*  
V
V
V
V
IORM  
peak  
V
PR  
= 1.875 x V  
, 100% Production Test with t = 1 sec,  
1181  
IORM  
P
PR  
peak  
Partial Discharge < 5 pC  
Input to Output Test Voltage, Method a*  
V
= 1.5 x V  
, Type and Sample Test,  
V
V
945  
V
V
PR  
IORM  
PR  
peak  
t = 60 sec, Partial Discharge < 5 pC  
P
Highest Allowable Overvoltage*  
6000  
IOTM  
peak  
(Transient Overvoltage, t = 10 sec)  
ini  
Safety Limiting Values  
(Maximum values allowed in the event of a failure,  
also see Figure 11, Thermal Derating curve.)  
Case Temperature  
T
175  
400  
600  
˚C  
mA  
mW  
S
Current (Input Current I , P = 0)  
I
F
S
S,INPUT  
Output Power  
P
R
S,OUTPUT  
S
9
Insulation Resistance at T , V = 500 V  
10  
S
IO  
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, (VDE 0884), for a detailed description.  
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.  
5
Absolute Maximum Ratings (No Derating Required up to +85˚C)  
Parameter  
Symbol  
Min.  
–55  
–40  
Max.  
125  
85  
20  
40  
Units  
˚C  
˚C  
mA  
mA  
Storage Temperature  
Operating Temperature  
Average Forward Input Current  
T
T
S
A
I
I
F(AVG)  
F(PEAK)  
Peak Forward Input Current  
(50% Duty Cycle, 1 ms Pulse Width)  
Peak Transient Input Current  
I
1.0  
A
F(TRAN)  
(< 1 µs Pulse Width, 300 pps)  
Reverse Input Voltage  
Input Power Dissipation  
Output Current (Pin 6)  
Emitter Base Reverse Voltage (Pin 5-7)  
Supply Voltage and Output Voltage  
Output Power Dissipation  
V
P
I
O
5
V
R
35  
60  
0.5  
7
100  
135  
mW  
mA  
V
V
mW  
mW  
I
V
V
P
P
EB  
CC  
O
–0.5  
Total Power Dissipation  
T
Lead Solder Temperature (for Through Hole Devices)  
Reflow Temperature Profile  
(for SOIC-8 and Option #300)  
260˚C for 10 sec., 1.6 mm below seating plane.  
See Package Outline Drawings section.  
Recommended Operating Conditions  
Parameter  
Symbol  
Min.  
2.7  
0.5  
0
Max.  
3.3  
12.0  
0.8  
Units  
V
mA  
V
Power Supply Voltage  
Forward Input Current (ON)  
Forward Input Voltage (OFF)  
Operating Temperature  
V
CC  
I
F(ON)  
V
T
F(OFF)  
A
0
70  
˚C  
6
Electrical Specifications  
0˚C T +70˚C, 2.7 V V 3.3 V, 0.5 mA I  
12 mA, 0 V V 0.8 V, unless otherwise specified. All  
F(OFF)  
A
CC  
F(ON)  
typicals at T = 25˚C. (See Note 8.)  
A
Device  
Sym. HCPL-  
Parameter  
Current Transfer CTR  
Ratio  
Min. Typ.* Max. Units  
Test Conditions  
I = 0.5 mA  
Fig. Note  
400 1300 5000  
%
V
= 3.3 V  
1, 2  
2
F
CC  
V = 0.4 V  
O
Logic Low  
Output Voltage  
V
OL  
0.05 0.3  
V
I = 1.6 mA,  
I = 8 mA  
O
V
CC  
= 3.3 V  
F
0.05 0.4  
V
I = 5.0 mA,  
F
I = 15 mA  
O
Logic High  
Output Current  
Logic Low  
I
I
5
25  
µA  
V = V = 3.3 V  
I = 0 mA  
F
2
OH  
O
CC  
270L/070L  
0.0015 0.15 mA  
V
CC  
= 3.3 V  
I = I = 1.6 mA  
F1 F2  
CCL  
Supply Current  
V = V = Open  
O1 O2  
273L/073L  
270L/070L  
0.0015 0.3  
mA  
µA  
Logic High  
Supply Current  
I
0.002  
1
V
CC  
= 3.3 V  
I = I = 0 mA  
F1 F2  
CCH  
V = V = Open  
O1 O2  
273L/073L  
0.002  
1.5  
2
1.7  
µA  
V
Input Forward  
Voltage  
V
F
T = 25˚C  
A
I = 1.6 mA  
F
3, 4  
Input Reverse  
Breakdown  
Voltage  
BV  
5.0  
V
I = 10 µA, T = 25˚C  
2
2
R
R
A
Input  
C
IN  
60  
pF  
f = 1 MHz, V = 0  
F
Capacitance  
*All typical values at T = 25˚C and V = 3.3 V, unless otherwise noted.  
A
CC  
7
Switching Specifications (AC)  
Over Recommended Operating Conditions (T = 0˚C to +70˚C), V = 3.3 V, unless otherwise specified. (See Note 8.)  
A
CC  
Device  
Sym. HCPL- Min. Typ.* Max. Units Test Conditions  
Parameter  
Fig. Note  
Propagation  
Delay Time to  
Logic Low at  
Output  
Propagation  
Delay Time to  
Logic High at  
Output  
Common Mode |CM |  
Transient  
Immunity at  
Logic High  
Level Output  
t
µs  
T = 25˚C  
5
5
6
2
PHL  
A
30  
90  
I = 0.5 mA  
F
Rl = 4.7 kΩ  
T = 25˚C  
A
t
µs  
2
PLH  
I = 0.5 mA, R = 4.7 kΩ  
F
L
1000 10000  
1000 10000  
V/µs  
I = 0 mA, T = 25˚C,  
2, 6, 7  
H
F
A
Rl = 2.2 kΩ  
|V | = 10 V  
CM p-p  
Common Mode |CM |  
V/µs  
I = 1.6 mA, T = 25˚C,  
F
6
2, 6, 7  
L
A
Transient  
Rl = 2.2 kΩ  
|V | = 10 V  
CM p-p  
Immunity at  
Logic Low  
Level Output  
*All typical values at T = 25˚C and V = 3.3 V, unless otherwise noted.  
A
CC  
8
Package Characteristics  
Parameter  
Sym. Device HCPL- Min. Typ.* Max.  
Units Test Conditions  
Fig. Note  
Input-Output  
Momentary  
Withstand  
Voltage**  
Resistance  
(Input-Output)  
Capacitance  
(Input-Output)  
Input-Input  
V
2500  
V rms RH 50%,  
4, 9  
ISO  
t = 1 min.,  
T = 25˚C  
A
12  
R
C
10  
V
I-O  
= 500 Vdc  
4
I-O  
RH 45%  
0.6  
pF  
µA  
f = 1 MHz  
11  
5
I-O  
I
0.005  
RH 45%  
I-I  
Insulation  
V = 500 Vdc  
I-I  
Leakage Current  
Input-Input  
Insulation  
Leakage Current  
Capacitance  
(Input-Input)  
11  
R
10  
5
5
I-I  
I-I  
C
2730  
2731  
0730  
0731  
0.03  
0.25  
pF  
*All typical values at T = 25˚C, unless otherwise noted.  
A
**The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous  
voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable), your equipment level  
safety specification or Agilent Application Note 1074 entitled "Optocoupler Input-Output Endurance Voltage."  
Notes:  
1. Pin 5 should be the most negative voltage at the detector side.  
2. Each channel.  
3. DC CURRENT TRANSFER RATIO (CTR) is defined as the ratio of output collector current, I , to the forward LED input current, I , times 100%.  
O
F
4. Device considered a two-terminal device: pins 1, 2, 3, and 4 shorted together, and pins 5, 6, 7, and 8 shorted together.  
5. Measured between pins 1 and 2 shorted together, and pins 3 and 4 shorted together.  
6. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dV /dt of the common mode pulse, V , to  
CM  
CM  
assure that the output will remain in a Logic High state (i.e., V > 2.0 V). Common mode transient immunity in a Logic Low level is the  
O
maximum tolerable (negative) dV /dt of the common mode pulse, V , to assure that the output will remain in a Logic Low state  
CM  
CM  
(i.e., V < 0.8 V).  
O
7. In applications where dV/dt may exceed 50,000 V/µs (such as static discharge) a series resistor, R , should be included to protect the  
CC  
detector IC from destructively high surge currents. The recommended value is R = 110 .  
CC  
8. Use of a 0.1 µF bypass capacitor connected between pins 5 and 8 adjacent to the device is recommended.  
9. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage > 3000 V rms for 1 second (leakage  
detection current limit, I < 5 µA).  
I-O  
10. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage > 6000 V rms for 1 second (leakage  
detection current limit, I < 5 µA).  
I-O  
11. Measured between the LED anode and cathode shorted together and pins 5 through 8 shorted together.  
12. Derate linearly above 65˚C free-air temperature at a rate of 2.3 mW/˚C for the SO-8 package.  
9
1000  
100  
10  
85°C  
I
F
2000  
1600  
1200  
800  
100  
10  
70°C  
25°C  
70°C  
-40°C  
+
V
F
T
= 85° C  
A
T
= 85°C  
A
A
1.0  
T
= 70°C  
1.0  
0.1  
T
= 70° C  
= 25° C  
= 0° C  
A
A
A
A
T
T
T
T
T
T
= 25°C  
= 0°C  
A
A
A
V
V
O
= 3.3 V  
= 0.4 V  
CC  
0.1  
400  
0
0.01  
0.001  
= -40° C  
= -40°C  
0.01  
0.01  
0.1  
1.0  
10  
1.1  
1.2  
1.3  
1.4  
1.5  
1.6  
0.1  
1
10  
I
– FORWARD CURRENT – mA  
I
– INPUT DIODE FORWARD CURRENT – mA  
F
V
– FORWARD VOLTAGE – V  
F
F
Figure 1. Current transfer ratio vs. forward  
current.  
Figure 2. Output current vs. input diode  
forward current.  
Figure 3. Input diode forward current vs.  
forward voltage.  
1.6  
I
= 1.6 mA  
F
1.5  
1.4  
1.3  
1.2  
-60 -40 -20  
0
20 40 60 80 100  
T
– TEMPERATURE – °C  
A
Figure 4. Forward voltage vs. temperature.  
10  
I
F
I
PULSE  
GEN.  
F
0
8
7
6
5
3.3 V  
1
2
3
4
Z
t
= 50  
= 5 ns  
O
r
3.3 V  
V
O
R
L
10% DUTY CYCLE  
I/f < 100 µs  
(SATURATED  
RESPONSE)  
50%  
50%  
V
O
V
OL  
0.1 µF  
I
MONITOR  
F
t
t
PHL  
PLH  
C
= 15 pF*  
L
R
M
3.3 V  
* INCLUDES PROBE AND  
FIXTURE CAPACITANCE  
V
O
90%  
10%  
90%  
10%  
(NON-SATURATED  
RESPONSE)  
t
f
t
r
Figure 5. Switching test circuit.  
R
(SEE NOTE 6)  
CC  
I
F
t , t = 16 ns  
8
7
6
5
1
2
3
4
+3.3 V  
r
f
10 V  
90% 90%  
V
CM  
B
A
0 V  
10%  
10%  
R
L
t
r
t
f
V
O
V
3.3 V  
O
V
FF  
SWITCH AT A: I = 0 mA  
F
V
V
O
V
CM  
OL  
+
SWITCH AT B: I = 1.6 mA  
F
PULSE GEN.  
Figure 6. Test circuit for transient immunity and typical waveforms.  
11  
www.semiconductor.agilent.com  
Data subject to change.  
Copyright © 2000 Agilent Technologies  
5988-0282EN (11/00)  

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HCPL-250L-320E

LVTTL/LVCMOS Compatible 3.3 V Optocouplers (1 Mb/s)
AVAGO

HCPL-250L-360E

LVTTL/LVCMOS Compatible 3.3 V Optocouplers (1 Mb/s)
AVAGO

HCPL-250L-500

LVTTL/LVCMOS Compatible 3.3 V Optocouplers (1 Mb/s)
AGILENT

HCPL-250L-500

LVTTL/LVCMOS Compatible 3.3 V Optocouplers (1 Mb/s)
HP