ACPF-7002 [AGILENT]
High Rejection Tx Filter for US PCS Band; 高带外抑制TX滤波器为美国PCS频段
| 型号： | ACPF-7002 |
| 厂家： | 
AGILENT TECHNOLOGIES, LTD. |
| 描述： | High Rejection Tx Filter for US PCS Band |
| 文件： | 总8页 (文件大小：316K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Agilent ACPF-7002
High Rejection Tx Filter
for US PCS Band
Data Sheet
General Description
The ACPF-7002 is a high
rejection full band transmit
filter designed for US PCS
handsets. Its performance rivals
splitband surface acoustic wave
(SAW) transmit filters. Since a
single filter provides the
rejection, no switches are
required, saving board space
and external components,
eliminating switch loss, and
reducing programming
Features
• High rejection from a single filter
With no switches required.
complexity.
• Passband: 1850-1910 MHz
33 dB min Attenuation,
1930-1990 MHz
The ACPF-7002 FBAR transmit
filter utilizes Agilent's Microcap
bonded-wafer chip scale
packaging technology. This
process allows the ultra small
filters to be assembled into a
Molded Chip on Board (MCOB)
module.
2.5 dB Typical Insertion Loss
• Space saving solution
Small footprint:
1.6 x 2.0-mm solution
Low profile package:
0.9 mm high (Typ)
1.0 mm (MAX)
In typical cellular phone
architectures, the transmit filter
fits between the driver amplifier
and the Power Amplifier. The
ACPF-7002 FBAR filter reduces
the noise in the Rx band being
amplified by the transmit chain,
enhancing receiver sensitivity.
High rejection keeps unwanted
signals out of the receive path.
Applications
• US PCS band handsets
• Wireless Data terminals
Agilent’s thin-Film Bulk
Acoustic Resonator (FBAR)
technology makes possible high-
Q filters at a fraction their
usual size.
Electrical Specifications, Zo=50 Ω
+25° C
-30° to +25° C
25° to +85° C
Symbol
Parameters
Units
Min Typ Max Min Typ Max Min Typ Max
f
Passband
MHz 1850
1910 1850
1910 1850
1910
3.2
IL
Insertion Loss 1850-1855 MHz
Insertion Loss 1855-1905 MHz
Insertion Loss 1905-1910 MHz
Ripple, 1850-1910 MHz
dB
dB
dB
dB
2.0
1.5
2.5
3.5
2.5
3.0
2.5
33
3.7
2.5
2.7
IL
2.5
IL
3.7
D S21
S21
S21
S21
S21
Min Rejection, 1930-1990 MHz
Min Rejection 10 –1800 MHz
Min Rejection 1990 – 3820 MHz
Min Rejection 3820 − 5730 MHz
dB
dB
33
25
37
33
25
25
dB
22
22
22
dB
15.0
9.0
20
15.0
9.0
20
15.0
9.0
20
S11, S22 In-band return loss
dB
11
11
11
Pin max Safe Input Power Level
dBm
[2]
Absolute Maximum Ratings
Parameter
Unit
°C
Value
[1]
Operating temperature
-30 to +85
[1]
Storage temperature
°C
-30 to +100
Notes:
1. Temperature is defined at case TC, the temperature of the underside of the filter where it makes contact with the circuit board.
2. Specifications are guaranteed over the given temperature range. Operation in excess of any one of these conditions may result in permanent damage to
the device.
2
o
Typical Performance (25 C, Zo = 50 Ohms)
0
-10
-20
-30
-40
-50
0
-1
-2
-3
-4
-5
1.70
1.75
1.80
1.85
1.90
1.95
2.00
2.05
2.10
1.83 1.84 1.85 1.86 1.87 1.88 1.89 1.90 1.91 1.92 1.93
Figure 1. Attenuation [dB] vs. Frequency
Figure 2. Insertion Loss [dB] vs. Frequency
0
-5
0
-10
-20
-30
-40
-50
-10
-15
-20
-25
-30
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
1.70
1.75
1.80
1.85
1.90
1.95
2.00
2.05
2.10
Figure 3. Attenuation [dB] vs. Frequency (broadband)
Figure 4. Return Loss [dB] vs. Frequency
freq (1.700GHz to 2.100GHz)
freq (1.700GHz to 2.100GHz)
Figure 5. Typical S(1,1)
Figure 6. Typical S(2,2)
3
PCB Interface & Mounting instructions
Mounting Consideration and board description
Input connection
The ACPF-7002 FBAR filter has one input (Pin 1),
one output (Pin 3) and two grounds (Pins 2, 4).
TOP
BACK
• Demo board uses 3 mil Getek Microstrip.
The demoboard uses CPWG transmission lines for
high isolation between the two ports. It uses via
holes to connect the CPWG line from the
underside of the board to the filter mounting pads
on top.
Output connection
Note:
Figure 8. PCB Footprint pad
For best performance, try to reproduce this board stack up
closely. If Ground-Signal-Ground (GSG) type board is used,
better return loss can be achieved since it eliminates
connector mismatch.
Demo boards
Demo boards are available.
(See board drawing in Figure 7, 8, 9).
Layer1 (signal)
0.7 mils
3 mils
0.7 mils
Getek ML200D (T=3.9)
Layer 2 (ground)
Figure 9. Closer look at the recommended board footprint and soldermask
28 mils
Getek ML200D (T=4.2)
Layer 3 (signal)
Getek material ML200D and RG200D
Figure 7. Board stack up description
4
1.25 MAX
0.60 0.15
1
0.35 0.15
8X
2
3
4
2.0
Shaded Region Grounded
: Pin 1 Location
A
B,C,D
: Work Week
: Lot Number
Pin 1
Marking
Note:
Dimensions in mm
Figure 10. Detailed Bottom, Side and Top view of Package
Layer 1
Layer 2 (GROUND layer)
0.61
0.70
0.61
0.3
0.30
OUT
3
4
Metal voided
To decrease
Capacitance at
Input Port
0.3
Metal voided
To decrease
Capacitance at
output Port
IN
1
0.3
2
0.33
1.92
Via to layer 2
This region is Soldermask covering ground
Region (4) & (2) is exposed ground for soldering filter pads
Note:
Dimensions in mm
Figure 11. Suggested PCB layers, viewed from top
5
Solder Compositions
o
o
Alloy type
Melting temp. ( C)
Recommended working temperature ( C)
Sn42Bi58
138
160 − 180
165 − 185
200 − 240
200 − 240
200 − 240
235 − 255
235 − 255
240 − 260
260 − 280
260 − 280
260 − 300
Sn43Pb43Bi14
Sn63Pb37
144 − 163
183
Sn60Pb40
186
Sn91/Zn9
199
Sn96.2Ag2.5Cu0.8Sb0.5
Sn95.8Ag3.5Cu0.7
Sn96.5Ag3.5
Sn100
216
217
221
232
Sn95Sb5
235
Sn97Cu3
240
300
250
200
150
100
50
Tested profile shown.
0
0
50
100
150
200
250
300
Time, seconds
Figure 12. Recommended solder profile
6
USER DIRECTION
OF UNREELING
NOTES:
1. MEASURED FROM THE CENTRELINE OF THE SPROCKET HOLE TO THE CENTRELINE OF THE POCKET
HOLE AND FROM THE CENTRELINE OF THE SPROCKET HOLE TO THE CENTERLINE OF THE POCKET
2. CUMULATIVE TOLERANCE OF 10 SPROCKET HOLES IS 0.20
3. THIS THICKNESS IS APPLICABLE AS MEASURED AT THE EDGE OF THE TAPE.
4. MATERIAL:BLACK POLYSTYRENE
5. ALL DIMENSIONS IN MM.
6. ALLOWABLE CAMBER TO BE 1MM PER 250MM IN LENGTH
7. UNLESS OTHERWISE SPECIFIED TOLERANCE 0.10.
8. MEASUREMENT POINT TO BE 0.3 FROM BOTTOM POCKET.
11
9. SURFACE RESISITIVTY FROM 1.0X105 TO 1.0x10 OHMS/SQ
Figure 13. Tape drawing
Figure 14. Reel drawing
7
Notes:
1. Material Polyester and AcrylicAdhesive Layers.
2. All Dimensions in MM except tape length.
3. Surface Resistivity: 106 to 1012 OHMS/SQ.
Pin 1 Position
User Feed Direction
Empty
Leader : 125 Pocket - 1
Trailer : 125 Pocket - 1
A
C
B
D
A
C
B
D
A
C
B
D
: Pin 1 Location
A
: WORK WEEK
B,C,D : LOT NUMBER
Top View
End View
Figure 15. Device orientation in the tape
Ordering information
Specify part number followed by option. For example:
A C P F - 7 0 0 2 - X X X
BLK = Bulk, Min 100pcs per antistatic bag
TR1 = Tape and Reel, 3000pcs per 7” reel
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
Data subject to change.
Copyright 2003 Agilent Technologies, Inc.
January 21, 2004
5989-0380EN
相关型号：
ACPF-7024
2441.5MHz, BAND PASS FILTER, HALOGEN, TBBP-A FREE AND ROHS COMPLIANT, MINIATURE, SMD, 3 PIN
AVAGO
ACPF-7024-BLK
2441.5MHz, BAND PASS FILTER, ROHS COMPLIANT, HALOGEN FREE, MINIATURE, SMD, 3 PIN
AVAGO
ACPF-7024-TR1
2441.5MHz, BAND PASS FILTER, ROHS COMPLIANT, HALOGEN FREE, MINIATURE, SMD, 3 PIN
AVAGO
©2020 ICPDF网 联系我们和版权申明