D2300 [AGERE]
1.3 mm D2300-Type Laser Isolated DFB Laser Module; 1.3毫米D2300型激光隔离DFB激光器模块
| 型号： | D2300 |
| 厂家： | 
AGERE SYSTEMS |
| 描述： | 1.3 mm D2300-Type Laser Isolated DFB Laser Module |
| 文件： | 总8页 (文件大小：268K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Data Sheet
February 2000
1.3 µm D2300-Type Laser
Isolated DFB Laser Module
Features
■ Integrated optical isolator
■ SONET/SDH compatible up to OC-48/STM-16
■ High-performance, distributed-feedback (DFB)
laser
■ High optical power available
■ Industry-standard, 14-pin butterfly package
■ Characterized at 2.488 Gbits/s (NRZ)
■ Wide operating case temperature range:
–40 °C to +80 °C
■ InGaAs, PIN photodetector back-facet monitor
■ Low threshold current
The 1.3 µm D2300-Type Laser Module is offered in a 14-pin,
hermetic, butterfly package.
■ High reliability
■ Qualified to meet the intent of Telcordia Technolo-
gies* 468
* Telcordia Technologies is a trademark of Bell Communications
Research, Inc.
Applications
■ Telecommunications:
— SONET/SDH
— Long reach
— Interexchange
■ Digital video
1.3 µm D2300-Type Digital
Isolated DFB Laser Module
Data Sheet
February 2000
Lucent Technologies Microelectronics Group optoelec-
tronic components are qualified to rigorous internal
standards that are consistent with Telcordia Technolo-
gies TR-NWT-000468. All design and manufacturing
operations are ISO* 9001 certified. The module is fully
qualified for central office applications.
Description
The D2300-Type Digital Isolated DFB Laser Module
contains an internally cooled, InGaAsP, distributed-
feedback (DFB) laser designed for 1.3 µm applications.
The laser is designed to be used in OC-12/STM-4 (622
Mbits/s) and OC-48/STM-16 (2.488 Gbits/s) for long-
reach and extended-reach applications.
* ISO is a registered trademark of The International Organization for
Standardization.
The device is available with an average output power of
0 dBm (3 dBm peak), which meets the SONET/SDH
standard.
Pin Information
Pin
1
Name
Controlled Feedback
Thermistor
Thermistor
2
The module contains an internal optical isolator that
suppresses optical feedback in laser-based, fiber-optic
systems. Light reflected back to the laser is attenuated
a minimum of 30 dB.
3
Laser dc Bias (cathode) (–)
Back-facet Monitor Anode (–)
Back-facet Monitor Cathode (+)
Thermoelectric Cooler (+)*
Thermoelectric Cooler (–)*
Case Ground
4
5
6
7
Controlled Temperature
8
An integral thermoelectric cooler (TEC) provides stable
thermal characteristics.The TEC allows for heating and
cooling of the laser chip to maintain a temperature of
25 °C for case temperatures from –40 °C to +80 °C.
The laser temperature is monitored by the internal ther-
mistor, which can be used with external circuitry to con-
trol the laser chip temperature.
9
Case Ground
10
11
Case Ground
Laser Anode† (+)
12
13
RF Laser Input Cathode (–)
Laser Anode† (+)
14
Case Ground
* A positive current through the thermoelectric heat pump cools the
laser.
†Both leads should be grounded for optimum performance.
Controlled Power
An internal, InGaAs, PIN photodiode functions as the
back-facet monitor. The photodiode monitors emission
from the rear facet of the laser and, when used in con-
junction with control circuitry, can control optical power
launched into the fiber. Normally, this configuration is
used in a feedback arrangement to maintain the aver-
age laser output power.
7
6
5
4
3
2
1
–
+
+
–
–
L1
160 nH
TH
10 kΩ
TEC
ISOLATOR
R1
20 Ω
PACKAGE
GROUNDS
Standard Package
+
11
–
+
The laser module is fabricated in a 14-pin, hermetic,
metal/ceramic butterfly package. The package also
incorporates a bias tee that separates the dc-bias path
from the RF input. The RF input has a nominal 25 Ω
impedance. The laser module is equipped with a sin-
gle-mode fiber. The pigtail has an 8 µm core and
125 µm cladding with a 900 µm tight buffer coating.
8
Top view.
9
10
12
13
14
1-567
Figure 1. Circuit Schematic
2
Lucent Technologies Inc.
1.3 µm D2300-Type Digital
Isolated DFB Laser Module
Data Sheet
February 2000
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the performance characteristics of the data sheet. Exposure to absolute maximum ratings for
extended periods can adversely affect device reliability.
Parameter
Laser Reverse Voltage
Symbol
VRLMAX
IFLMAX
TC
Min
—
Max
2
Unit
V
dc Forward Current
—
150
80
85
10
1
mA
°C
°C
V
Operating Case Temperature Range
Storage Case Temperature Range*
Photodiode Reverse Voltage
Photodiode Forward Current
* Does not apply to shipping container.
–40
–40
—
Tstg
VRPDMAX
IFPDMAX
—
mA
Mounting Instructions
Handling Precautions
Power Sequencing
The minimum fiber bend radius is 1.18 in. (30 mm).
To avoid degradation in performance, mount the mod-
ule on the board as follows:
To avoid the possibility of damage to the laser module
from power supply switching transients, follow this turn-
on sequence:
1. Place the bottom flange of the module on a flat heat
sink at least 0.5 in. x 1.180 in. (12.7 mm x 30 mm) in
size. The surface finish of the heat sink should be
better than 32 µin. (0.8 µm), and the surface flatness
must be better than 0.001 in. (25.4 µm). Using ther-
mal conductive grease is optional; however, thermal
performance can be improved by up to 5% if conduc-
tive grease is applied between the bottom flange and
the heat sink.
1. All ground connections
2. Most negative supply
3. Most positive supply
4. All remaining connections
Reverse the order for the proper turn-off sequence.
2. Mount four #2-56 screws with Fillister heads
(M2-3 mm) at the four screw-hole locations (see Out-
line Diagram). The Fillister head diameter must not
exceed 0.140 in. (3.55 mm). Do not apply more than
1 in.-lb. of torque to the screws.
Electrostatic Discharge
CAUTION:This device is susceptible to damage as
a result of electrostatic discharge.Take
proper precautions during both handling
and testing. Follow guidelines such as
JEDEC Publication No. 108-A (Dec.
1988).
0.118
0.062 (1.58)
(3.00)
0.086
(2.18)
0.031 (0.79)
Lucent employs a human-body model (HBM) for ESD-
susceptibility testing and protection-design evaluation.
ESD voltage thresholds are dependent on the critical
parameters used to define the model. A standard HBM
(resistance = 1.5 kΩ, capacitance = 100 pF) is widely
used and, therefore, can be used for comparison pur-
poses. The HBM ESD threshold presented here was
obtained using these circuit parameters:
0.140
(3.56)
0.129 (3.28) R
0.041 (1.04)
1-532
Note: Dimensions are in inches and (millimeters).
Figure 2. Fillister Head Screw
Parameter
Human-body Model
Value
Unit
>400
V
Lucent Technologies Inc.
3
1.3 µm D2300-Type Digital
Isolated DFB Laser Module
Data Sheet
February 2000
Characteristics
Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are
the result of engineering evaluations. Typical values are for information purposes only and are not part of the test-
ing requirements.
Table 1. Electrical Characteristics (at 25 °C Laser Temperature)
Parameter
Laser Forward Voltage
Slope Efficiency
Symbol
VLF
η
Test Conditions
Min
—
Typ
1.3
0.06
15
Max
1.8
—
Unit
V
LF = 2 mW (CW)
LF = 2 mW (CW)
0.025
—
mW/mA
mA
V
Threshold Current
ITH
—
50
Monitor Reverse-bias Voltage*
Monitor Current
VRMON
IRMON
ID
—
3
5
10
PO = 1 mW (CW)
0.1
—
1.0
0.01
25
2.0
0.1
—
mA
µA
Monitor Dark Current
Input Impedance
IF = 0, VRMON = 5 V
ZIN
—
—
—
—
Ω
Thermistor Current
ITC
10
—
100
9.6
µA
Resistance Ratio†
—
8.6
—
—
Thermistor Resistance
RTH
ITEC
TL = 25 °C
9.5
—
—
—
10.5
1.0
kΩ
TL = 25 °C, TC = 70 °C
A
TEC Current
VTEC
TL = 25 °C, TC = 70 °C
TC = 80 °C
—
—
—
2.0
—
V
TEC Voltage
TEC Capacity
∆T
55
°C
* Standard operating condition is 5.0 V reverse bias.
†Ratio of thermistor resistance at 0 °C to thermistor resistance at 50 °C.
Table 2. Optical Characteristics (at 25 °C Laser Temperature)
Parameter
Peak Optical Output Power
Center Wavelength
Symbol
PPEAK
λC
Test Conditions
Min
Typ
—
Max
Unit
mW
nm
—
—
2.0
—
1290
1310
1330
Spectral Width:
Full Width at –3 dB
Full Width at –20 dB
∆λ
Modulated at 2.5 Gbits/s at
rated power
—
—
0.20
0.8
0.30
1.0
nm
nm
Side-mode Suppression Ratio
Optical Isolation
SMSR
—
Modulated at 2.5 Gbits/s
30
30
—
—
—
—
dB
dB
0 °C to 65 °C
4
Lucent Technologies Inc.
1.3 µm D2300-Type Digital
Isolated DFB Laser Module
Data Sheet
February 2000
Outline Diagram
Dimensions are in inches and (millimeters). Tolerances are ±0.005 in. (±0.127 mm).
1.025 (26.04)
PIN 1
0.020 (0.51) TYP
0.10 ± 0.002
(0.25 ± 0.064)
0.508 ± 0.008
(12.90 ± 0.2)
TRADEMARK, CODE, LASER SERIAL NUMBER,
AND DATE CODE IN APPROX. AREA SHOWN
STRAIN
RELIEF
0.036
(0.91)
0.500
(12.70)
0.200
(5.08)
0.605
(15.37)
MAX
0.350
(8.89)
0.078 (1.98)
0.105 (2.67) DIA
TYP (4) PLACES
PIN 14
0.213 (5.40) TYP
0.100 (2.54) TYP
39.37 (1000.00)
MIN
2.03 (51.6)
0.180 (4.56)
0.056 (1.42)
0.820 (20.83)
0.700 (17.78)
0.863 (21.91)
0.575 (14.61)
0.260 (6.60)
0.10
(2.5)
0.365
(9.27)
MAX
0.215
(5.47)
REF
0.030 (0.75)
1.180 (29.97)
HEAT SINK
0.215 (5.45)
1-520.g
Lucent Technologies Inc.
5
1.3 µm D2300-Type Digital
Isolated DFB Laser Module
Data Sheet
February 2000
Class IIIb Laser Product
FDA/CDRH Class IIIb laser product. All versions are Class IIIb laser products per CDRH, 21 CFR 1040 Laser
Safety requirements. All versions are Class IIIb laser products per IEC* 60825-1:1993. The device has been certi-
fied with the FDA under accession number 8720010.
This product complies with 21 CFR 1040.10 and 1040.11.
8 µm/125 µm single-mode fiber pigtail with 900 µm tight buffer jacket and connector
Wavelength = 1.3 µm
Maximum power = 10 mW
Because of size constraints, labeling is not affixed to the module but is contained in the shipping carton.
Product is not shipped with power supply.
Caution: Use of controls, adjustments, and procedures other than those specified herein may result in
hazardous laser radiation exposure.
* IEC is a registered trademark of The International Electrotechnical Commission.
10 mW
1.3 µm
6
Lucent Technologies Inc.
1.3 µm D2300-Type Digital
Isolated DFB Laser Module
Data Sheet
February 2000
Ordering Information
Table 3. Ordering Information
Device Code
D2304G
Connector
Comcode
FC-PC*
107912990
* Other connector options are available.
Lucent Technologies Inc.
7
For additional information, contact your Microelectronics Group Account Manager or the following:
INTERNET:
E-MAIL:
http://www.lucent.com/micro, or for Optoelectronics information, http://www.lucent.com/micro/opto
docmaster@micro.lucent.com
N. AMERICA: Microelectronics Group, Lucent Technologies Inc., 555 Union Boulevard, Room 30L-15P-BA, Allentown, PA 18103
1-800-372-2447, FAX 610-712-4106 (In CANADA: 1-800-553-2448, FAX 610-712-4106)
ASIA PACIFIC: Microelectronics Group, Lucent Technologies Singapore Pte. Ltd., 77 Science Park Drive, #03-18 Cintech III, Singapore 118256
Tel. (65) 778 8833, FAX (65) 777 7495
CHINA:
Microelectronics Group, Lucent Technologies (China) Co., Ltd., A-F2, 23/F, Zao Fong Universe Building, 1800 Zhong Shan Xi Road,
Shanghai 200233 P. R. China Tel. (86) 21 6440 0468, ext. 316, FAX (86) 21 6440 0652
JAPAN:
Microelectronics Group, Lucent Technologies Japan Ltd., 7-18, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo 141, Japan
Tel. (81) 3 5421 1600, FAX (81) 3 5421 1700
EUROPE:
Data Requests: MICROELECTRONICS GROUP DATALINE:Tel. (44) 7000 582 368, FAX (44) 1189 328 148
Technical Inquiries:OPTOELECTRONICS MARKETING: (44) 1344 865 900 (Ascot UK)
Lucent Technologies Inc. reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No
rights under any patent accompany the sale of any such product(s) or information.
Copyright © 2000 Lucent Technologies Inc.
All Rights Reserved
February 2000
DS00-167OPTO (Replaces MN97068-5)
相关型号：
©2020 ICPDF网 联系我们和版权申明