5962R9583403VXA [AEROFLEX]

Quad Receiver; 四通道接收机
5962R9583403VXA
型号: 5962R9583403VXA
厂家: AEROFLEX CIRCUIT TECHNOLOGY    AEROFLEX CIRCUIT TECHNOLOGY
描述:

Quad Receiver
四通道接收机

接口集成电路 接收机 CD
文件: 总11页 (文件大小:81K)
中文:  中文翻译
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Standard Products  
UT54LVDS032 Quad Receiver  
Data Sheet  
May 22, 2003  
FEATURES  
INTRODUCTION  
The UT54LVDS032 Quad Receiver is a quad CMOS  
differential line receiver designed for applications requiring  
ultra low power dissipation and high data rates. The device  
is designed to support data rates in excess of 155.5 Mbps  
(77.7 MHz) utilizing Low Voltage Differential Signaling  
(LVDS) technology.  
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>155.5 Mbps (77.7 MHz) switching rates  
+340mV differential signaling  
5 V power supply  
TTL compatible outputs  
Ultra low power CMOS technology  
8.0ns maximum propagation delay  
3.0ns maximum differential skew  
The UT54LVDS032 accepts low voltage (340mV)  
differential input signals and translates them to 5V TTL  
output levels. The receiver supports a three-state function  
that may be used to multiplex outputs. The receiver also  
supports OPEN, shorted and terminated (100W) input fail-  
safe. Receiver output will be HIGH for all fail-safe  
conditions.  
Radiation-hardened design; total dose irradiation testing to  
MIL-STD-883 Method 1019  
- Total-dose: 300 krad(Si)and 1Mrad(Si)  
- Latchup immune (LET > 111 M eV-cm2/mg)  
The UT54LVDS032 and companion quad line driver  
UT54LVDS031 provides new alternatives to high power  
pseudo-ECL devices for high speed point-to-point interface  
applications.  
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Packaging options:  
- 16-lead flatpack (dual in-line)  
Standard Microcircuit Drawing5962-95834  
- QML Q and V compliant part  
q
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Compatible with IEEE 1596.3SCI LVDS  
Compatible with ANSI/TIA/EIA 644-1996 LVDS Standard  
RIN1+  
RIN1-  
+
-
ROUT1  
R1  
RIN2+  
RIN2-  
+
ROUT2  
R2  
-
RIN3+  
RIN3-  
+
-
ROUT3  
R3  
RIN4+  
RIN4-  
+
-
ROUT4  
R4  
EN  
EN  
Figure 1. UT54LVDS032 Quad Receiver Block Diagram  
APPLICATIONS INFORMATION  
The UT54LVDS032 receiver’s intended use is primarily in an  
uncomplicated point-to-point configuration as is shown in  
Figure 3. This configuration provides a clean signaling  
environment for quick edge rates of the drivers. The receiver is  
connected to the driver through a balanced media which may be  
a standard twisted pair cable, a parallel pair cable, or simply  
PCB traces. Typically, the characteristic impedance of the media  
is in the range of 100W. A termination resistor of 100W should  
be selected to match the media and is located as close to the  
receiver input pins as possible. The termination resistor converts  
the current sourced by the driver into voltages that are detected  
by the receiver. Other configurations are possible such as a  
multi-receiver configuration, but the effects of a mid-stream  
connector(s), cable stub(s), and other impedance discontinuities,  
as well as ground shifting, noise margin limits, and total  
termination loading must be taken into account.  
1
R
16  
V
DD  
IN1-  
2
3
R
15  
14  
R
R
IN1+  
IN4-  
R
OUT1  
IN4+  
UT54LVDS032  
Receiver  
EN  
4
5
6
13  
12  
11  
R
OUT4  
R
EN  
OUT2  
R
R
R
IN2+  
OUT3  
IN3+  
7
8
R
10  
9
IN2-  
V
SS  
R
IN3-  
Figure 2. UT54LVDS032 Pinout  
TRUTH TABLE  
ENABLE  
1/4 UT54LVDS032  
DATA  
+
-
Enables  
Input  
RIN+ - RIN-  
X
Output  
RT 100W  
INPUT  
1/4 UT54LVDS031  
DATA  
OUTPUT  
EN  
L
EN  
ROUT  
H
Z
H
L
All other combinations  
of ENABLE inputs  
VID > 0.1V  
VID < -0.1V  
Figure 3. Point-to-Point Application  
Full Fail-safe  
OPEN/SHORT or  
Terminated  
H
The UT54LVDS032 differential line receiver is capable of  
detecting signals as low as 100mV, over a + 1V common-mode  
range centered around +1.2V. This is related to the driver offset  
voltage which is typically +1.2V. The driven signal is centered  
around this voltage and may shift+1V around this center point.  
The +1V shifting may be the result of a ground potential  
difference between the driver’s ground reference and the  
receiver’s ground reference, the common-mode effects of  
coupled noise or a combination of the two. Both receiver input  
pins should honor their specified operating input voltage range  
of 0V to +2.4V (measured from each pin to ground).  
PIN DESCRIPTION  
Pin No.  
Name  
Description  
2, 6, 10, 14  
RIN+  
Non-inverting receiver input pin  
Inverting receiver input pin  
Receiver output pin  
1, 7, 9, 15  
3, 5, 11, 13  
4
RIN-  
ROUT  
EN  
Active high enable pin, OR-ed  
with EN  
12  
EN  
Active low enable pin, OR-ed  
with EN  
16  
8
VDD  
VSS  
Power supply pin, +5V + 10%  
Ground pin  
2
Receiver Fail-Safe  
2. Terminated Input. If the driver is disconnected (cable  
unplugged), or if the driver is in a three-state condition,  
the receiver output will again be in a HIGH state, even  
with the end of cable 100W termination resistor across  
the input pins. The unplugged cable can become a  
floating antenna which can pick up noise. If the cable  
picks up more than 10mV of differential noise, the  
receiver may see the noise as a valid signal and switch.  
To insure that any noise is seen as common-mode and  
not differential, a balanced interconnect should be used.  
Twisted pair cable offers better balance than flat ribbon  
cable.  
The UT54LVDS032 receiver is a high gain, high speed device  
that amplifies a small differential signal (20mV) toTTL logic  
levels. Due to the high gain and tight threshold of the receiver,  
care should be taken to prevent noise from appearing as a valid  
signal.  
The receiver’s internal fail-safe circuitry is designed to source/  
sink a small amount of current, providing fail-safe protection (a  
stable known state of HIGH output voltage) for floating,  
terminated or shorted receiver inputs.  
1. Open Input Pins. The UT54LVDS032 is a quad  
receiver device, and if an application requires only 1, 2  
or 3 receivers, the unused channel(s) inputs should be  
left OPEN. Do not tie unused receiver inputs to ground  
or any other voltages. The input is biased by internal high  
value pull up and pull down resistors to set the output to  
a HIGH state. This internal circuitry will guarantee a  
HIGH, stable output state for open inputs.  
3. Shorted Inputs. If a fault condition occurs that shorts  
the receiver inputs together, thus resulting in a 0V  
differential input voltage, the receiver output remains in  
a HIGH state. Shorted input fail-safe is not supported  
across the common-mode range of the device (VSS to  
2.4V). It is only supported with inputs shorted and no  
external common-mode voltage applied.  
3
1
ABSOLUTE MAXIMUM RATINGS  
(Referenced to VSS  
)
SYMBOL  
VDD  
PARAMETER  
DC supply voltage  
LIMITS  
-0.3 to 6.0V  
VI/O  
Voltage on any pin  
-0.3 to (VDD + 0.3V)  
TSTG  
PD  
Storage temperature  
-65 to +150°C  
1.25 W  
Maximum power dissipation  
Maximum junction temperature2  
TJ  
+150°C  
Thermal resistance, junction-to-case3  
DC input current  
QJC  
10°C/W  
II  
±10mA  
Notes:  
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device  
at these or any other conditions beyond limits indicated in the operational sections of this specification is not recommended. Exposure to absolute maximum rating  
conditions for extended periods may affect device reliability and performance.  
2. Maximum junction temperature may be increased to +175°C during burn-in and steady-static life.  
3. Test per MIL-STD-883, Method 1012.  
RECOMMENDED OPERATING CONDITIONS  
SYMBOL  
VDD  
PARAMETER  
Positive supply voltage  
LIMITS  
4.5 to 5.5V  
-55 to +125°C  
TC  
Case temperature range  
VIN  
DC input voltage, receiver inputs  
DC input voltage, logic inputs  
2.4V  
0 to VDD for EN, EN  
4
DC ELECTRICAL CHARACTERISTICS 1  
(VDD = 5.0V +10%; -55°C < TC < +125°C)  
SYMBOL  
PARAMETER  
CONDITION  
MIN  
MAX  
UNIT  
VIH  
High-level input voltage  
(TTL)  
(TTL)  
2.0  
V
VIL  
VOL  
VOH  
IIN  
Low-level input voltage  
Low-level output voltage  
High-level output voltage  
Logic input leakage current  
0.8  
0.3  
V
V
IOL = 2mA, VDD = 4.5V  
IOH = -0.4mA, VDD = 4.5V  
Inputs, VIN = 0 and 2.4V, V CC = 5.5  
4.0  
V
-10  
-10  
+10  
+10  
mA  
Enables = EN/EN= 0 and 5.5V,  
VCC = 5.5  
3
Differential Input High Threshold  
Differential Input Low Threshold  
VCM = +1.2V  
VCM = +1.2V  
+100  
mV  
mV  
VTH  
3
-100  
VTL  
II  
Receiver input Current  
VIN = 2.4V  
-10  
-10  
+10  
+10  
mA  
mA  
4
Output Three-State Current  
Disabled, VOUT = 0 V or VDD  
IOZ  
VCL  
Input clamp voltage  
ICL = +/-18mA  
-1.5  
-15  
1.5  
V
3
IOS  
Enabled, VOUT = 0 V2  
Output Short Circuit Current  
-130  
mA  
4
Loaded supply current receivers  
enabled  
EN, EN = VDD or VSS  
Inputs Open  
11  
11  
mA  
mA  
ICC  
4
Loaded supply current receivers  
disabled  
EN = VSS, EN = VDD  
Inputs Open  
ICCZ  
Notes:  
1. Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground.  
2. Output short circuit current (I ) is specified as magnitude only, minus sign indicates direction only. Only one output should be shorted at a time, do not exceed  
OS  
maximum junction temperature specification.  
3. Guaranteed by characterization.  
4. Device tested at V = 5.5V only.  
CC  
5
AC SWITCHING CHARACTERISTICS1, 2, 3, 4  
(VDD = +5.0V + 10%, TA = -55 °C to +125°C)  
SYMBOL  
PARAMETER  
MIN  
MAX  
UNIT  
tPHLD  
Differential Propagation Delay High to Low  
CL = 20pf (figures 4 and 5)  
1.0  
8.0  
ns  
tPLHD  
Differential Propagation Delay Low to High  
CL = 20pf (figures 4 and 5)  
1.0  
8.0  
ns  
tSKD  
Differential Skew (tPHLD - tPLHD) (figures 4 and 5)  
Channel-to-Channel Skew1 (figures 4 and 5)  
0
0
3.0  
3.0  
ns  
ns  
4
tSK1  
4
7.0  
2.0  
2.0  
20  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tSK2  
Chip-to-Chip Skew5 (figures 4 and 5)  
Rise Time (figures 4 and 5)  
4
tTLH  
4
Fall Time (figures 4 and 5)  
tTHL  
4
Disable Time High to Z (figures 6 and 7)  
Disable Time Low to Z (figures 6 and 7)  
Enable Time Z to High (figures 6 and 7)  
Enable Time Z to Low (figures 6 and 7)  
tPHZ  
4
20  
tPLZ  
4
20  
tPZH  
4
20  
tPZL  
Notes:  
1. Channel-to-Channel Skew is defined as the difference between the propagation delay of the channel and the other channels in the same chip with an event on the inputs.  
2. Generator waveform for all tests unless otherwise specified: f = 1 MHz, Z = 50W, t and t (0% - 100%) < 1ns for R and t and t < 6ns for EN or EN.  
0
r
f
IN  
r
f
3. C includes probe and jig capacitance.  
L
4. Guaranteed by characterization.  
5. Chip to Chip Skew is defined as the difference between the minimum and maximum specified differential propagation delays.  
6
R
IN+  
R
R
Generator  
OUT  
R
IN-  
C
L
50W  
50W  
Receiver Enabled  
Figure 4. Receiver Propagation Delay and Transition Time Test Circuit or Equivalent Circuit  
R
+1.3V  
+1.1V  
IN-  
+1.2V  
V
= 200mV  
0V Differential  
ID  
R
IN+  
t
PHLD  
t
PLHD  
V
OH  
80%  
80%  
1.25V  
1.25V  
20%  
R
OUT  
20%  
V
OL  
t
t
THL  
TLH  
Figure 5. Receiver Propagation Delay and Transition Time Waveforms  
7
EN  
V
DD  
2K  
R
IN+  
IN-  
R
20pf  
2K  
Figure 6. Receiver Three-State Delay Test Circuit or Equivalent Circuit  
EN when EN = VDD  
VDD  
1.25V  
1.25V  
1.25V  
0V  
VDD  
1.25V  
tPLZ  
EN when EN = VSS  
0V  
tPZL  
VDD  
50%  
50%  
0.5V  
Output when  
VID = -100mV  
VOL  
VOH  
tPHZ  
tPZH  
Output when  
VID = +100mV  
0.5V  
VSS  
Figure 7. Receiver Three-State Delay Waveform  
8
PACKAGING  
Notes:  
1. All exposed metalized areas are gold plated over electroplated nickel per MIL-PRF-38535.  
2. The lid is electrically connected to VSS.  
3. Lead finishes are in accordance to MIL-PRF-38535.  
4. Package dimensions and symbols are similar to MIL-STD-1835 variation F-5A.  
5. Lead position and coplanarity are not measured.  
6. ID mark symbol is vendor option.  
7. With solder, increase maximum by 0.003.  
Figure 8. 16-pin Ceramic Flatpack  
9
ORDERING INFORMATION  
UT54LVDS032 QUAD RECEIVER:  
UT 54LVDS032- * * * * *  
Lead Finish:  
(A)  
(C)  
(X)  
=
=
=
Hot solder dipped  
Gold  
Factory option (gold or solder)  
Screening:  
(C)  
(P)  
=
=
Military Temperature Range flow  
Prototype flow  
Package Type:  
(U) 16-lead Flatpack (dual-in-line)  
=
Access Time:  
Not applicable  
Device Type:  
UT54LVDS032 LVDS Receiver  
Notes:  
1. Lead finish (A,C, or X) must be specified.  
2. If an “X” is specified when ordering, then the part marking will match the lead finish and will be either “A” (solder) or “C” (gold).  
3. Prototype flow per UTMC Manufacturing Flows Document. Tested at 25°C only. Lead finish is GOLD ONLY. Radiation neither  
tested nor guaranteed.  
4. Military Temperature Range flow per UTMC Manufacturing Flows Document. Devices are tested at -55°C, room temp, and 125°C.  
Radiation neither tested nor guaranteed.  
10  
UT54LVDS032 QUAD RECEIVER: SMD  
95834  
5962 -  
**  
* * *  
Lead Finish:  
(A)  
(C)  
(X)  
=
=
=
Hot solder dipped  
Gold  
Factory Option (gold or solder)  
Case Outline:  
(X) 16 lead Flatpack (dual-in-line)  
=
Class Designator:  
(Q)  
(V)  
=
=
QML Class Q  
QML Class V  
Device Type  
02 = LVDS Receiver  
Drawing Number: 95834  
Total Dose  
(R) = 1E5 rad(Si)  
(F) = 3E5 rad(Si)  
(G) = 5E5 rad(Si)  
(H) = 1E6 rad(Si)  
Federal Stock Class Designator: No Options  
Notes:  
1.Lead finish (A,C, or X) must be specified.  
2.If an “X” is specified when ordering, part marking will match the lead finish and will be either “A” (solder) or “C” (gold).  
3.Total dose radiation must be specified when ordering. QML Q and QML V not available without radiation hardening.  
11  

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