ADUM3200WARZ-RL7 [ADI]
Dual-Channel, Digital Isolators, Enhanced System-Level ESD Reliability; 双通道数字隔离器，增强的系统级ESD可靠性
| 型号： | ADUM3200WARZ-RL7 |
| 厂家： | 
ADI |
| 描述： | Dual-Channel, Digital Isolators, Enhanced System-Level ESD Reliability |
| 文件： | 总20页 (文件大小：467K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Dual-Channel, Digital Isolators,
Enhanced System-Level ESD Reliability
Data Sheet
ADuM3200/ADuM3201
FEATURES
GENERAL DESCRIPTION
Enhanced system-level ESD performance per IEC 61000-4-x
High temperature operation: 125°C
Narrow body, RoHS-compliant, 8-lead SOIC
Low power operation
The ADuM3200/ADuM32011 are dual-channel, digital isola-
tors based on the Analog Devices, Inc., iCoupler® technology.
Combining high speed CMOS and monolithic transformer
technology, these isolation components provide outstanding
performance characteristics superior to alternatives such as
optocoupler devices.
5 V operation
1.7 mA per channel maximum @ 0 Mbps to 2 Mbps
3.7 mA per channel maximum @ 10 Mbps
7.0 mA per channel maximum @ 25 Mbps
3 V operation
1.5 mA per channel maximum @ 0 Mbps to 2 Mbps
2.5 mA per channel maximum @ 10 Mbps
4.7 mA per channel maximum @ 25 Mbps
Bidirectional communication
3 V/5 V level translation
High data rate: dc to 25 Mbps (NRZ)
Precise timing characteristics
3 ns maximum pulse width distortion
3 ns maximum channel-to-channel matching
High common-mode transient immunity: >25 kV/μs
Safety and regulatory approvals
UL recognition: 2500 V rms for 1 minute per UL 1577
CSA Component Acceptance Notice #5A
VDE Certificate of Conformity
By avoiding the use of LEDs and photodiodes, iCoupler
devices remove the design difficulties commonly associated
with optocouplers. The typical optocoupler concerns regarding
uncertain current transfer ratios, nonlinear transfer functions,
and temperature and lifetime effects are eliminated with the
simple iCoupler digital interfaces and stable performance char-
acteristics. The need for external drivers and other discrete
components is eliminated with these iCoupler products. Further-
more, iCoupler devices consume one-tenth to one-sixth the
power of optocouplers at comparable signal data rates.
The ADuM3200/ADuM3201 isolators provide two independent
isolation channels in a variety of channel configurations and
data rates (see the Ordering Guide). They operate with 3.3 V
or 5 V supply voltages on either side, providing compatibility
with lower voltage systems as well as enabling voltage translation
functionality across the isolation barrier. The ADuM3200W
and ADuM3201W are automotive grade versions qualified
for 125°C operation.
DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12
V
IORM = 560 V peak
Qualified for automotive applications
In comparison to the ADuM120x isolators, the ADuM3200/
ADuM3201 isolators contain various circuit and layout changes
to provide increased capability relative to system-level IEC
61000-4-x testing (ESD, burst, and surge). The precise capability
in these tests for either the ADuM120x or ADuM3200/
ADuM3201 products is strongly determined by the design and
layout of the user’s board or module. For more information, see
the AN-793 Application Note, ESD/Latch-Up Considerations with
iCoupler Isolation Products.
APPLICATIONS
Size-critical multichannel isolation
SPI interface/data converter isolation
RS-232/RS-422/RS-485 transceiver isolation
Digital field bus isolation
Hybrid electric vehicles, battery monitor
1 Protected by U.S. Patents 5,952,849; 6,873,065; 7,075,329.
FUNCTIONAL BLOCK DIAGRAMS
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
V
V
V
V
V
V
V
V
DD1
DD2
OA
OB
DD1
DD2
IA
ENCODE
ENCODE
DECODE
DECODE
DECODE
ENCODE
ENCODE
DECODE
V
V
V
OA
IA
V
IB
IB
OB
GND
GND
GND
GND
2
1
2
1
Figure 1. ADuM3200 Functional Block Diagram
Figure 2. ADuM3201 Functional Block Diagram
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 ©2006–2012 Analog Devices, Inc. All rights reserved.
ADuM3200/ADuM3201
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
DIN V VDE V 0884-10 (VDE V 0884-10) Insulation
Characteristics ............................................................................ 12
Recommended Operating Conditions .................................... 12
Absolute Maximum Ratings ......................................................... 13
ESD Caution................................................................................ 13
Pin Configurations and Function Descriptions......................... 14
Typical Performance Characteristics ........................................... 15
Application Information................................................................ 16
PC Board Layout ........................................................................ 16
System-Level ESD Considerations and Enhancements ........ 16
Propagation Delay-Related Parameters................................... 16
DC Correctness and Magnetic Field Immunity........................... 16
Power Consumption .................................................................. 18
Insulation Lifetime..................................................................... 18
Outline Dimensions....................................................................... 19
Ordering Guide .......................................................................... 20
Automotive Products................................................................. 20
Applications....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagrams............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Electrical Characteristics—5 V, 105°C Operation ................... 3
Electrical Characteristics—3 V, 105°C Operation ................... 4
Electrical Characteristics—Mixed 5 V/3 V, 105°C Operation .. 5
Electrical Characteristics—Mixed 3 V/5 V, 105°C Operation .. 6
Electrical Characteristics—5 V, 125°C Operation ................... 7
Electrical Characteristics—3 V, 125°C Operation ................... 8
Electrical Characteristics—Mixed 5 V/3 V, 125°C Operation .. 9
Electrical Characteristics—Mixed 3 V/5 V, 125°C Operation 10
Package Characteristics ............................................................. 11
Regulatory Information............................................................. 11
Insulation and Safety-Related Specifications.......................... 11
6/07—Rev. 0 to Rev. A
REVISION HISTORY
Updated VDE Certification Throughout.......................................1
Changes to Features, General Description, and Note 1 ...............1
Changes to Regulatory Information Section .............................. 10
Changes to DIN V VDE V 0884-10 (VDE V 0884-10)
Insulation Characteristics Section................................................ 11
Added Table 10 ............................................................................... 12
Added Insulation Lifetime Section .............................................. 17
2/12—Rev. B to Rev. C
Created Hyperlink for Safety and Regulatory Approvals
Entry in Features Section................................................................. 1
Change to PC Board Layout Section............................................ 16
11/11—Rev. A to Rev. B
Changes to Features Section, Applications Section, and
General Descriptions Section ......................................................... 1
Changes to Specifications Section.................................................. 3
Changes to Table 29........................................................................ 12
Changes to Ambient Operating Temperature Maximum
Value, Table 30 ................................................................................ 13
Changes to VDD1 Pin Descriptions ............................................... 14
Changes to Figure 9, Figure 10, Figure 11 Captions ................. 15
Changes to Ordering Guide ......................................................... 20
Added Automotive Products Section........................................... 20
7/06—Revision 0: Initial Version
Rev. C | Page 2 of 20
Data Sheet
ADuM3200/ADuM3201
SPECIFICATIONS
ELECTRICAL CHARACTERISTICS—5 V, 105°C OPERATION
All typical specifications are at TA = 25°C, VDD1 = VDD2 = 5 V. Minimum/maximum specifications apply over the entire recommended
operation range: 4.5 V ≤ VDD1 ≤ 5.5 V, 4.5 V ≤ VDD2 ≤ 5.5 V, and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications
are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted.
Table 1.
A Grade
B Grade
C Grade
Parameter
Symbol Min
Typ Max Min Typ Max Min Typ Max Unit
Test Conditions
Mbps Within PWD limit
SWITCHING SPECIFICATIONS
Data Rate
Propagation Delay
Pulse Width Distortion
Change vs. Temperature
Pulse Width
Propagation Delay Skew
Channel Matching
Codirectional
Opposing-Direction
Output Rise/Fall Time
1
150
40
10
50
3
25
45
3
tPHL, tPLH 20
PWD
20
20
40
ns
ns
50% input to 50% output
|tPLH − tPHL
|
6
5
5
ps/°C
ns
PW
tPSK
1000
100
Within PWD limit
Between any two units
100
15
15
ns
tPSKCD
tPSKOD
tR/tF
50
50
3
15
3
15
ns
ns
ns
10
2.5
2.5
10% to 90%
Table 2.
1 Mbps—A Grade,
B Grade, and C Grade
10 Mbps—B Grade and
C Grade
25 Mbps—C Grade
Parameter
Symbol Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit Test Conditions
SUPPLY CURRENT
ADuM3200
IDD1
IDD2
IDD1
IDD2
1.3
1.0
1.1
1.3
1.7
1.6
1.5
1.8
3.5
1.7
2.6
3.1
4.6
2.8
3.4
4.0
7.7
3.1
5.3
6.4
10.0
3.9
6.8
mA
mA
mA
mA
No load
No load
No load
No load
ADuM3201
8.3
Table 3. For All Models
Parameter
Symbol
Min
Typ
Max
Unit
Test Conditions
DC SPECIFICATIONS
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages
VIH
VIL
VOH
0.7 VDDx
V
V
V
V
V
V
µA
0.3 VDDx
VDDx − 0.1
VDDx − 0.5
5.0
4.8
0.0
0.2
IOx = −20 µA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
IOx = 20 µA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
0 V ≤ VIx ≤ VDDX
Logic Low Output Voltages
VOL
II
0.1
0.4
+10
Input Current per Channel
Supply Current per Channel
Quiescent Input Supply Current
Quiescent Output Supply Current
Dynamic Input Supply Current
Dynamic Output Supply Current
AC SPECIFICATIONS
−10
+0.01
IDDI(Q)
IDDO(Q)
IDDI(D)
IDDO(D)
0.4
0.5
0.19
0.05
0.8
0.6
mA
mA
mA/Mbps
mA/Mbps
VIA = VIB = 0 V
VIA = VIB = 0 V
Common-Mode Transient Immunity1
|CM|
fr
25
35
kV/µs
Mbps
VIx = VDDX, VCM = 1000 V,
transient magnitude = 800 V
Refresh Rate
1.2
1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
Rev. C | Page 3 of 20
ADuM3200/ADuM3201
Data Sheet
ELECTRICAL CHARACTERISTICS—3 V, 105°C OPERATION
All typical specifications are at TA = 25°C, VDD1 = VDD2 = 3.0 V. Minimum/maximum specifications apply over the entire recommended
operation range: 2.7 V ≤ VDD1 ≤ 3.6 V, 2.7 V ≤ VDD2 ≤ 3.6 V, and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications
are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted.
Table 4.
A Grade
B Grade
C Grade
Parameter
Symbol Min
Typ Max Min Typ Max Min Typ Max Unit
Test Conditions
Mbps Within PWD limit
SWITCHING SPECIFICATIONS
Data Rate
Propagation Delay
Pulse Width Distortion
ADuM3200
ADuM3201
Change vs. Temperature
Pulse Width
Propagation Delay Skew
Channel Matching
Codirectional
Opposing-Direction
Output Rise/Fall Time
1
150
10
60
25
55
tPHL, tPLH 20
PWD
20
20
40
ns
50% input to 50% output
40
40
3
4
3
4
ns
ns
|tPLH − tPHL
|tPLH − tPHL
|
|
6
5
5
ps/°C
ns
PW
tPSK
1000
100
Within PWD limit
Between any two units
100
22
16
ns
tPSKCD
tPSKOD
tR/tF
50
50
3
22
3
16
ns
ns
ns
3.0
3.0
3.0
10% to 90%
Table 5.
1 Mbps—A Grade,
B Grade, and C Grade
10 Mbps—B Grade and
C Grade
25 Mbps—C Grade
Parameter
Symbol Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit Test Conditions
SUPPLY CURRENT
ADuM3200
IDD1
IDD2
IDD1
IDD2
0.8
0.7
0.7
0.8
1.3
1.0
1.3
1.6
2.0
1.1
1.5
1.9
3.2
1.7
2.1
2.4
4.3
1.8
3.0
3.6
6.4
2.4
4.2
5.1
mA
mA
mA
mA
No load
No load
No load
No load
ADuM3201
Table 6. For All Models
Parameter
Symbol
Min
Typ
Max
Unit
Test Conditions
DC SPECIFICATIONS
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages
VIH
VIL
VOH
0.7 VDDx
V
V
V
V
V
V
µA
0.3 VDDx
VDDx − 0.1
VDDx − 0.5
3.0
2.8
0.0
0.2
IOx = −20 µA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
IOx = 20 µA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
0 V ≤ VIx ≤ VDDX
Logic Low Output Voltages
VOL
II
0.1
0.4
+10
Input Current per Channel
Supply Current per Channel
Quiescent Input Supply Current
Quiescent Output Supply Current
Dynamic Input Supply Current
Dynamic Output Supply Current
AC SPECIFICATIONS
−10
+0.01
IDDI(Q)
IDDO(Q)
IDDI(D)
IDDO(D)
0.3
0.3
0.10
0.03
0.5
0.5
mA
mA
mA/Mbps
mA/Mbps
VIA = VIB = 0 V
VIA = VIB = 0 V
Common-Mode Transient Immunity1
|CM|
fr
25
35
kV/µs
Mbps
VIx = VDDX, VCM = 1000 V,
transient magnitude = 800 V
Refresh Rate
1.1
1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
Rev. C | Page 4 of 20
Data Sheet
ADuM3200/ADuM3201
ELECTRICAL CHARACTERISTICS—MIXED 5 V/3 V, 105°C OPERATION
All typical specifications are at TA = 25°C, VDD1 = 5 V, V DD2 = 3. 0 V. Minimum/maximum specifications apply over the entire recommended
operation range: 4.5 V ≤ VDD1 ≤ 5.5 V, 2.7 V ≤ VDD2 ≤ 3.6 V, and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications
are tested with CL = 15 pF, and CMOS signal levels, unless otherwise noted.
Table 7.
A Grade
B Grade
C Grade
Parameter
Symbol Min
Typ Max Min Typ Max Min Typ Max Unit
Test Conditions
Mbps Within PWD limit
SWITCHING SPECIFICATIONS
Data Rate
Propagation Delay
Pulse Width Distortion
Change vs. Temperature
Pulse Width
1
150
40
10
55
3
25
50
3
tPHL, tPLH 15
PWD
15
15
40
ns
ns
50% input to 50% output
|tPLH − tPHL
|
6
5
5
ps/°C
ns
PW
1000
100
Within PWD limit
Propagation Delay Skew tPSK
Channel Matching
50
22
15
ns
Between any two units
Codirectional
Opposing-Direction
Output Rise/Fall Time
tPSKCD
tPSKOD
tR/tF
50
50
3
22
3
15
ns
ns
ns
3.0
3.0
3.0
10% to 90%
Table 8.
1 Mbps—A Grade,
B Grade, and C Grade
10 Mbps—B Grade and
C Grade
25 Mbps—C Grade
Parameter
Symbol Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit Test Conditions
SUPPLY CURRENT
ADuM3200
IDD1
IDD2
IDD1
IDD2
1.3
0.7
1.1
0.8
1.7
1.0
1.5
1.6
3.5
1.1
2.6
1.9
4.6
1.7
3.4
2.4
7.7
1.8
5.3
3.6
10.0
2.4
6.8
mA
mA
mA
mA
No load
No load
No load
No load
ADuM3201
5.1
Table 9. For All Models
Parameter
Symbol
Min
Typ
Max
Unit
Test Conditions
DC SPECIFICATIONS
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages
VIH
VIL
VOH
0.7 VDDx
0.8
VDDx − 0.1
VDDx − 0.5
V
V
V
V
V
V
µA
0.3 VDDx
VDDx
VDDx − 0.2
0.0
0.2
+0.01
IOx = −20 µA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
IOx = 20 µA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
0 V ≤ VIx ≤ VDDX
Logic Low Output Voltages
VOL
II
0.1
0.4
+10
Input Current per Channel
Supply Current per Channel
Quiescent Input Supply Current
Quiescent Output Supply Current
Dynamic Input Supply Current
Dynamic Output Supply Current
AC SPECIFICATIONS
−10
IDDI(Q)
IDDO(Q)
IDDI(D)
IDDO(D)
0.4
0.3
0.19
0.03
0.8
0.5
mA
mA
mA/Mbps
mA/Mbps
VIA = VIB = 0 V
VIA = VIB = 0 V
Common-Mode Transient Immunity1
|CM|
fr
25
35
kV/µs
Mbps
VIx = VDDX, VCM = 1000 V,
transient magnitude = 800 V
Refresh Rate
1.2
1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
Rev. C | Page 5 of 20
ADuM3200/ADuM3201
Data Sheet
ELECTRICAL CHARACTERISTICS—MIXED 3 V/5 V, 105°C OPERATION
All typical specifications are at TA = 25°C, VDD1 = 3 V, V DD2 = 5. 0 V. Minimum/maximum specifications apply over the entire recommended
operation range: 2.7 V ≤ VDD1 ≤ 3.6 V, 4.5 V ≤ VDD2 ≤ 5.5 V, and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications
are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted.
Table 10.
A Grade
B Grade
C Grade
Parameter
Symbol Min
Typ Max Min Typ Max Min Typ Max Unit
Test Conditions
Mbps Within PWD limit
SWITCHING SPECIFICATIONS
Data Rate
Propagation Delay
Pulse Width Distortion
ADuM3200
ADuM3201
Change vs. Temperature
Pulse Width
Propagation Delay Skew
Channel Matching
Codirectional
Opposing-Direction
Output Rise/Fall Time
1
150
10
55
25
50
tPHL, tPLH 15
PWD
15
15
40
ns
50% input to 50% output
40
40
3
4
3
4
ns
ns
|tPLH − tPHL
|tPLH − tPHL
|
|
6
5
5
ps/°C
ns
PW
tPSK
1000
100
Within PWD limit
Between any two units
50
22
15
ns
tPSKCD
tPSKOD
tR/tF
50
50
3
22
3
15
ns
ns
ns
2.5
2.5
2.5
10% to 90%
Table 11.
1 Mbps—A Grade,
B Grade, and C Grade
10 Mbps—B Grade and
C Grade
25 Mbps—C Grade
Parameter
Symbol Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit Test Conditions
SUPPLY CURRENT
ADuM3200
IDD1
IDD2
IDD1
IDD2
0.8
1.0
0.7
1.3
1.3
1.6
1.3
1.8
2.0
1.7
1.5
3.1
3.2
2.8
2.1
4.0
4.3
3.1
3.0
6.4
6.4
3.9
4.2
8.3
mA
mA
mA
mA
No load
No load
No load
No load
ADuM3201
Table 12. For All Models
Parameter
Symbol
Min
Typ
Max
Unit
Test Conditions
DC SPECIFICATIONS
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages
VIH
VIL
VOH
0.7 VDDx
0.4
VDDx − 0. 1
VDDx − 0.5
V
V
V
V
V
V
µA
0.3 VDDx
VDDx
VDDx − 0.2
0.0
0.2
+0.01
IOx = −20 µA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
IOx = 20 µA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
0 V ≤ VIx ≤ VDDX
Logic Low Output Voltages
VOL
II
0.1
0.4
+10
Input Current per Channel
Supply Current per Channel
Quiescent Input Supply Current
Quiescent Output Supply Current
Dynamic Input Supply Current
Dynamic Output Supply Current
AC SPECIFICATIONS
−10
IDDI(Q)
IDDO(Q)
IDDI(D)
IDDO(D)
0.3
0.5
0.10
0.05
0.5
0.6
mA
mA
mA/Mbps
mA/Mbps
VIA = VIB = 0 V
VIA = VIB = 0 V
Common-Mode Transient Immunity1
|CM|
fr
25
35
kV/µs
Mbps
VIx = VDDX, VCM = 1000 V,
transient magnitude = 800 V
Refresh Rate
1.1
1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
Rev. C | Page 6 of 20
Data Sheet
ADuM3200/ADuM3201
ELECTRICAL CHARACTERISTICS—5 V, 125°C OPERATION
All typical specifications are at TA = 25°C, VDD1 = VDD2 = 5 V. Minimum/maximum specifications apply over the entire recommended
operation range: 4.5 V ≤ VDD1 ≤ 5.5 V, 4.5 V ≤ VDD2 ≤ 5.5 V, and −40°C ≤ TA ≤ +125°C, unless otherwise noted. Switching specifications
are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted.
Table 13.
A Grade
B Grade
C Grade
Parameter
Symbol Min
Typ Max Min Typ Max Min Typ Max Unit
Test Conditions
Mbps Within PWD limit
SWITCHING SPECIFICATIONS
Data Rate
Propagation Delay
Pulse Width Distortion
Change vs. Temperature
Pulse Width
1
150
40
10
50
3
25
45
3
tPHL, tPLH 20
PWD
20
20
40
ns
ns
50% input to 50% output
|tPLH − tPHL
|
6
5
5
ps/°C
ns
PW
1000
100
Within PWD limit
Propagation Delay Skew tPSK
Channel Matching
100
15
15
ns
Between any two units
Codirectional
Opposing-Direction
Output Rise/Fall Time
tPSKCD
tPSKOD
tR/tF
50
50
3
15
3
15
ns
ns
ns
2.5
2.5
2.5
10% to 90%
Table 14.
1 Mbps—A Grade,
B Grade, and C Grade
10 Mbps—B Grade and
C Grade
25 Mbps—C Grade
Parameter
Symbol Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit Test Conditions
SUPPLY CURRENT
ADuM3200
IDD1
IDD2
IDD1
IDD2
1.3
1.0
1.1
1.3
2.0
1.6
1.5
1.8
3.5
1.7
2.6
3.1
4.6
2.8
3.4
4.0
7.7
3.1
5.3
6.4
10.0
3.9
6.8
mA
mA
mA
mA
No load
No load
No load
No load
ADuM3201
8.3
Table 15. For All Models
Parameter
Symbol
Min
Typ
Max
Unit
Test Conditions
DC SPECIFICATIONS
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages
VIH
VIL
VOH
0.7 VDDx
V
V
V
V
V
V
µA
0.3 VDDx
VDDx − 0.1
VDDx − 0.5
5.0
4.8
0.0
0.2
IOx = −20 µA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
IOx = 20 µA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
0 V ≤ VIx ≤ VDDX
Logic Low Output Voltages
VOL
II
0.1
0.4
+10
Input Current per Channel
Supply Current per Channel
Quiescent Input Supply Current
Quiescent Output Supply Current
Dynamic Input Supply Current
Dynamic Output Supply Current
AC SPECIFICATIONS
−10
+0.01
IDDI(Q)
IDDO(Q)
IDDI(D)
IDDO(D)
0.4
0.5
0.19
0.05
0.8
0.6
mA
mA
mA/Mbps
mA/Mbps
VIA = VIB = 0 V
VIA = VIB = 0 V
Common-Mode Transient Immunity1
|CM|
fr
25
35
kV/µs
Mbps
VIx = VDDX, VCM = 1000 V,
transient magnitude = 800 V
Refresh Rate
1.2
1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
Rev. C | Page 7 of 20
ADuM3200/ADuM3201
Data Sheet
ELECTRICAL CHARACTERISTICS—3 V, 125°C OPERATION
All typical specifications are at TA = 25°C, VDD1 = VDD2 = 3.0 V. Minimum/maximum specifications apply over the entire recommended
operation range: 3.0 V ≤ VDD1 ≤ 3.6 V, 3.0 V ≤ VDD2 ≤ 3.6 V, and −40°C ≤ TA ≤ +125°C, unless otherwise noted. Switching specifications
are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted.
Table 16.
A Grade
B Grade
C Grade
Parameter
Symbol Min
Typ Max Min Typ Max Min Typ Max Unit
Test Conditions
Mbps Within PWD limit
SWITCHING SPECIFICATIONS
Data Rate
Propagation Delay
Pulse Width Distortion
ADuM3200
ADuM3201
Change vs. Temperature
Pulse Width
Propagation Delay Skew
Channel Matching
Codirectional
Opposing-Direction
Output Rise/Fall Time
1
150
10
60
25
55
tPHL, tPLH 20
PWD
20
20
40
ns
50% input to 50% output
40
40
3
4
3
4
ns
ns
|tPLH − tPHL
|tPLH − tPHL
|
|
6
5
5
ps/°C
ns
PW
tPSK
1000
100
Within PWD limit
Between any two units
100
22
16
ns
tPSKCD
tPSKOD
tR/tF
50
50
3
22
3
16
ns
ns
ns
3.0
3.0
3.0
10% to 90%
Table 17.
1 Mbps—A Grade,
B Grade, and C Grade
10 Mbps—B Grade and
C Grade
25 Mbps—C Grade
Parameter
Symbol Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit Test Conditions
SUPPLY CURRENT
ADuM3200
IDD1
IDD2
IDD1
IDD2
0.8
0.7
0.7
0.8
1.3
1.0
1.3
1.6
2.0
1.1
1.5
1.9
3.2
1.7
2.1
2.4
4.3
1.8
3.0
3.6
6.4
2.4
4.2
5.1
mA
mA
mA
mA
No load
No load
No load
No load
ADuM3201
Table 18. For All Models
Parameter
Symbol
Min
Typ
Max
Unit
Test Conditions
DC SPECIFICATIONS
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages
VIH
VIL
VOH
0.7 VDDx
V
V
V
V
V
V
µA
0.3 VDDx
VDDx − 0.1
VDDx − 0.5
3.0
2.8
0.0
0.2
IOx = −20 µA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
IOx = 20 µA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
0 V ≤ VIx ≤ VDDX
Logic Low Output Voltages
VOL
II
0.1
0.4
+10
Input Current per Channel
Supply Current per Channel
Quiescent Input Supply Current
Quiescent Output Supply Current
Dynamic Input Supply Current
Dynamic Output Supply Current
AC SPECIFICATIONS
−10
+0.01
IDDI(Q)
IDDO(Q)
IDDI(D)
IDDO(D)
0.3
0.3
0.10
0.03
0.5
0.5
mA
mA
mA/Mbps
mA/Mbps
VIA = VIB = 0 V
VIA = VIB = 0 V
Common-Mode Transient Immunity1
|CM|
fr
25
35
kV/µs
Mbps
VIx = VDDX, VCM = 1000 V,
transient magnitude = 800 V
Refresh Rate
1.1
1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
Rev. C | Page 8 of 20
Data Sheet
ADuM3200/ADuM3201
ELECTRICAL CHARACTERISTICS—MIXED 5 V/3 V, 125°C OPERATION
All typical specifications are at TA = 25°C, VDD1 = 5 V, V DD2 = 3.0 V. Minimum/maximum specifications apply over the entire recommended
operation range: 4.5 V ≤ VDD1 ≤ 5.5 V, 3.0 V ≤ VDD2 ≤ 3.6 V, and −40°C ≤ TA ≤ +125°C, unless otherwise noted. Switching specifications
are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted.
Table 19.
A Grade
B Grade
C Grade
Parameter
Symbol Min
Typ Max Min Typ Max Min Typ Max Unit
Test Conditions
Mbps Within PWD limit
SWITCHING SPECIFICATIONS
Data Rate
Propagation Delay
Pulse Width Distortion
Change vs. Temperature
Pulse Width
1
150
40
10
55
3
25
50
3
tPHL, tPLH 15
PWD
15
15
40
ns
ns
50% input to 50% output
|tPLH − tPHL
|
6
5
5
ps/°C
ns
PW
1000
100
Within PWD limit
Propagation Delay Skew tPSK
Channel Matching
50
22
15
ns
Between any two units
Codirectional
Opposing-Direction
Output Rise/Fall Time
tPSKCD
tPSKOD
tR/tF
50
50
3
22
3
15
ns
ns
ns
3.0
3.0
3.0
10% to 90%
Table 20.
1 Mbps—A Grade,
B Grade, and C Grade
10 Mbps—B Grade and
C Grade
25 Mbps—C Grade
Parameter
Symbol Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit Test Conditions
SUPPLY CURRENT
ADuM3200
IDD1
IDD2
IDD1
IDD2
1.3
0.7
1.1
0.8
2.0
1.0
1.5
1.6
3.5
1.1
2.6
1.9
4.6
1.7
3.4
2.4
7.7
1.8
5.3
3.6
10.0
2.4
6.8
mA
mA
mA
mA
No load
No load
No load
No load
ADuM3201
5.1
Table 21. For All Models
Parameter
Symbol
Min
Typ
Max
Unit
Test Conditions
DC SPECIFICATIONS
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages
VIH
VIL
VOH
0.7 VDDx
0.8
VDDx − 0.1
VDDx − 0.5
V
V
V
V
V
V
µA
0.3 VDDx
VDDx
VDDx − 0.2
0.0
0.2
+0.01
IOx = −20 µA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
IOx = 20 µA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
0 V ≤ VIx ≤ VDDX
Logic Low Output Voltages
VOL
II
0.1
0.4
+10
Input Current per Channel
Supply Current per Channel
Quiescent Input Supply Current
Quiescent Output Supply Current
Dynamic Input Supply Current
Dynamic Output Supply Current
AC SPECIFICATIONS
−10
IDDI(Q)
IDDO(Q)
IDDI(D)
IDDO(D)
0.4
0.3
0.19
0.03
0.8
0.5
mA
mA
mA/Mbps
mA/Mbps
VIA = VIB = 0 V
VIA = VIB = 0 V
Common-Mode Transient Immunity1
|CM|
fr
25
35
kV/µs
Mbps
VIx = VDDX, VCM = 1000 V,
transient magnitude = 800 V
Refresh Rate
1.2
1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
Rev. C | Page 9 of 20
ADuM3200/ADuM3201
Data Sheet
ELECTRICAL CHARACTERISTICS—MIXED 3 V/5 V, 125°C OPERATION
All typical specifications are at TA = 25°C, VDD1 = 3 V, V DD2 = 5.0 V. Minimum/maximum specifications apply over the entire recommended
operation range: 3.0 V ≤ VDD1 ≤ 3.6 V, 4.5 V ≤ VDD2 ≤ 5.5 V, and −40°C ≤ TA ≤ +125°C, unless otherwise noted. Switching specifications
are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted.
Table 22.
A Grade
B Grade
C Grade
Parameter
Symbol Min
Typ Max Min Typ Max Min Typ Max Unit
Test Conditions
Mbps Within PWD limit
SWITCHING SPECIFICATIONS
Data Rate
Propagation Delay
Pulse Width Distortion
ADuM3200
ADuM3201
Change vs. Temperature
Pulse Width
Propagation Delay Skew
Channel Matching
Codirectional
Opposing-Direction
Output Rise/Fall Time
1
150
10
55
25
50
tPHL, tPLH 15
PWD
15
15
40
ns
50% input to 50% output
40
40
3
4
3
4
ns
ns
|tPLH − tPHL
|tPLH − tPHL
|
|
6
5
5
ps/°C
ns
PW
tPSK
1000
100
Within PWD limit
Between any two units
50
22
15
ns
tPSKCD
tPSKOD
tR/tF
50
50
3
22
3
15
ns
ns
ns
2.5
2.5
2.5
10% to 90%
Table 23.
1 Mbps—A Grade,
B Grade, and C Grade
10 Mbps—B Grade and
C Grade
25 Mbps—C Grade
Parameter
Symbol Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit Test Conditions
SUPPLY CURRENT
ADuM3200
IDD1
IDD2
IDD1
IDD2
0.8
1.0
0.7
1.3
1.3
1.6
1.3
1.8
2.0
1.7
1.5
3.1
3.2
2.8
2.1
4.0
4.3
3.1
3.0
6.4
6.4
3.9
4.2
8.3
mA
mA
mA
mA
No load
No load
No load
No load
ADuM3201
Table 24. For All Models
Parameter
Symbol Min
Typ
Max
Unit
Test Conditions
DC SPECIFICATIONS
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages
VIH
VIL
VOH
0.7 VDDx
0.4
VDDx − 0.1
VDDx − 0.5
V
V
V
V
V
V
µA
0.3 VDDx
VDDx
VDDx − 0.2
0.0
0.2
+0.01
IOx = −20 µA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
IOx = 20 µA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
0 V ≤ VIx ≤ VDDX
Logic Low Output Voltages
VOL
II
0.1
0.4
+10
Input Current per Channel
Supply Current per Channel
Quiescent Input Supply Current
Quiescent Output Supply Current
Dynamic Input Supply Current
Dynamic Output Supply Current
AC SPECIFICATIONS
−10
IDDI(Q)
IDDO(Q)
IDDI(D)
IDDO(D)
0.3
0.5
0.10
0.05
0.5
0.6
mA
mA
mA/Mbps
mA/Mbps
VIA = VIB = 0 V
VIA = VIB = 0 V
Common-Mode Transient Immunity1
|CM|
fr
25
35
kV/µs
Mbps
VIx = VDDX, VCM = 1000 V,
transient magnitude = 800 V
Refresh Rate
1.1
1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
Rev. C | Page 10 of 20
Data Sheet
ADuM3200/ADuM3201
PACKAGE CHARACTERISTICS
Table 25.
Parameter
Symbol
RI-O
CI-O
CI
θJCI
Min
Typ
1012
1.0
4.0
46
Max
Unit
Ω
pF
pF
°C/W
Test Conditions
Resistance (Input to Output)1
Capacitance (Input to Output)1
Input Capacitance
f = 1 MHz
IC Junction-to-Case Thermal Resistance, Side 1
Thermocouple located at center
of package underside
IC Junction-to-Case Thermal Resistance, Side 2
θJCO
41
°C/W
1 The device is considered a 2-terminal device; Pin 1, Pin 2, Pin 3, and Pin 4 are shorted together, and Pin 5, Pin 6, Pin 7, and Pin 8 are shorted together.
REGULATORY INFORMATION
The ADuM3200/ADuM3201 devices are approved by the organizations listed in Table 26. Refer to Table 31 and the Insulation Lifetime
section for details regarding recommended maximum working voltages for specific cross-isolation waveforms and insulation levels.
Table 26.
UL
CSA
VDE
Recognized under UL 1577
Component Recognition
Program1
Approved under CSA Component
Acceptance Notice #5A
Certified according to DIN V VDE V 0884-10
(VDE V 0884-10): 2006-122
Single/basic 2500 V rms
isolation voltage
Basic insulation per CSA 60950-1-03 and IEC 60950-1, 400 V
rms (566 V peak) maximum working voltage
Reinforced insulation, 560 V peak
Functional insulation per CSA 60950-1-03 and IEC 60950-1,
800 V rms (1131 V peak) maximum working voltage
File E214100
File 205078
File 2471900-4880-0001
1 In accordance with UL 1577, each ADuM320x is proof-tested by applying an insulation test voltage ≥3000 V rms for 1 second (current leakage detection limit = 5 µA).
2 In accordance with DIN V VDE V 0884-10, each ADuM320x is proof tested by applying an insulation test voltage ≥1050 V peak for 1 second (partial discharge detection
limit = 5 pC). An asterisk (*) marking branded on the component designates DIN V VDE V 0884-10 approval.
INSULATION AND SAFETY-RELATED SPECIFICATIONS
Table 27.
Parameter
Symbol Value
Unit
Conditions
Rated Dielectric Insulation Voltage
Minimum External Air Gap (Clearance)
2500
4.90 min
V rms 1-minute duration
L(I01)
L(I02)
mm
mm
Measured from input terminals to output terminals,
shortest distance through air
Measured from input terminals to output terminals,
shortest distance path along body
Minimum External Tracking (Creepage)
4.01 min
Minimum Internal Gap (Internal Clearance)
Tracking Resistance (Comparative Tracking Index)
Isolation Group
0.017 min mm
Insulation distance through insulation
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
CTI
>175
IIIa
V
Rev. C | Page 11 of 20
ADuM3200/ADuM3201
Data Sheet
DIN V VDE V 0884-10 (VDE V 0884-10) INSULATION CHARACTERISTICS
These isolators are suitable for reinforced isolation only within the safety limit data. Maintenance of the safety data is ensured by
protective circuits. The asterisk (*) marking on the package denotes DIN V VDE V 0884-10 approval for a 560 V peak working voltage.
Table 28.
Description
Conditions
Symbol Characteristic
Unit
Installation Classification per DIN VDE 0110
For Rated Mains Voltage ≤ 150 V rms
For Rated Mains Voltage ≤ 300 V rms
For Rated Mains Voltage ≤ 400 V rms
Climatic Classification
Pollution Degree per DIN VDE 0110, Table 1
Maximum Working Insulation Voltage
Input-to-Output Test Voltage, Method B1
I to IV
I to III
I to II
40/105/21
2
VIORM
VPR
560
1050
V peak
V peak
VIORM × 1.875 = VPR, 100% production test, tm = 1 sec,
partial discharge < 5 pC
Input-to-Output Test Voltage, Method A
After Environmental Tests Subgroup 1
After Input and/or Safety Test Subgroup 2 VIORM × 1.2 = VPR, tm = 60 sec, partial discharge < 5 pC
and Subgroup 3
VIORM × 1.6 = VPR, tm = 60 sec, partial discharge < 5 pC
VPR
896
672
V peak
V peak
Highest Allowable Overvoltage
Safety-Limiting Values
Transient overvoltage, tTR = 10 seconds
Maximum value allowed in the event of a failure
(see Figure 3)
VTR
4000
V peak
Case Temperature
Side 1 Current
Side 2 Current
TS
IS1
IS2
RS
150
160
170
>109
°C
mA
mA
Ω
Insulation Resistance at TS
VIO = 500 V
200
180
160
140
RECOMMENDED OPERATING CONDITIONS
Table 29.
Parameter
Symbol
Min Max
Unit
Operating Temperature
ADuM3200A/ADuM3201A
ADuM3200B/ADuM3201B
ADuM3200C/ADuM3201C
ADuM3200WA/ADuM3201WA
ADuM3200WB/ADuM3201WB
ADuM3200WC/ADuM3201WC
Supply Voltages1
TA
SIDE #2
SIDE #1
120
100
80
60
40
20
0
−40 +105 °C
−40 +105 °C
−40 +105 °C
−40 +125 °C
−40 +125 °C
−40 +125 °C
VDD1, VDD2
ADuM3200A/ADuM3201A
ADuM3200B/ADuM3201B
ADuM3200C/ADuM3201C
ADuM3200WA/ADuM3201WA
ADuM3200WB/ADuM3201WB
ADuM3200WC/ADuM3201WC
2.7
2.7
2.7
3.0
3.0
3.0
5.5
5.5
5.5
5.5
5.5
5.5
1.0
V
V
V
V
V
V
ms
0
50
100
150
200
CASE TEMPERATURE (°C)
Figure 3. Thermal Derating Curve, Dependence of Safety-Limiting Values
on Case Temperature, per DIN V VDE V 0884-10
Maximum Input Signal Rise and
Fall Times
1 All voltages are relative to their respective ground. See the DC Correctness
and Magnetic Field Immunity section for information on immunity to external
magnetic fields.
Rev. C | Page 12 of 20
Data Sheet
ADuM3200/ADuM3201
ABSOLUTE MAXIMUM RATINGS
Ambient temperature = 25°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 30.
Parameter
Rating
Storage Temperature (TST)
−55°C to +150°C
Ambient Operating Temperature (TA) −40°C to +125°C
1
Supply Voltages (VDD1, VDD2
)
−0.5 V to +7.0 V
−0.5 V to VDDI + 0.5 V
−0.5 V to VDDO + 0.5 V
Input Voltage (VIA, VIB)1, 2
Output Voltage (VOA, VOB)1, 2
Average Output Current, per Pin (IO)3 −22 mA to +22 mA
ESD CAUTION
Common-Mode Transients
(CML, CMH)4
−100 kV/μs to +100 kV/μs
1 All voltages are relative to their respective ground.
2 VDDI and VDDO refer to the supply voltages on the input and output sides of a
given channel, respectively.
3 See Figure 3 for maximum rated current values for various temperatures.
4 Refers to common-mode transients across the insulation barrier. Common-
mode transients exceeding the Absolute Maximum Ratings can cause latch-up
or permanent damage.
Table 31. Maximum Continuous Working Voltage1
Parameter
Max
Unit
Constraint
AC Voltage, Bipolar Waveform
AC Voltage, Unipolar Waveform
Functional Insulation
Basic Insulation
565
V peak
50-year minimum lifetime
1131
560
V peak
V peak
Maximum approved working voltage per IEC 60950-1
Maximum approved working voltage per IEC 60950-1 and VDE V 0884-10
DC Voltage
Functional Insulation
Basic Insulation
1131
560
V peak
V peak
Maximum approved working voltage per IEC 60950-1
Maximum approved working voltage per IEC 60950-1 and VDE V 0884-10
1 Refers to continuous voltage magnitude imposed across the isolation barrier. See the Insulation Lifetime section for more details.
Table 32. ADuM3200 Truth Table (Positive Logic)
VIA Input
VIB Input
VDD1 State
Powered
Powered
Powered
Powered
Unpowered
VDD2 State
Powered
Powered
Powered
Powered
Powered
VOA Output
VOB Output
Notes
H
L
H
L
H
L
L
H
X
H
L
H
L
H
L
L
H
H
X
H
Outputs return to the input state within
1 μs of VDDI power restoration.
X
X
Powered
Unpowered
Indeterminate
Indeterminate
Outputs return to the input state within
1 μs of VDDO power restoration.
Table 33. ADuM3201 Truth Table (Positive Logic)
VIA Input
VIB Input
VDD1 State
Powered
Powered
Powered
Powered
Unpowered
VDD2 State
Powered
Powered
Powered
Powered
Powered
VOA Output
VOB Output
Notes
H
L
H
L
H
L
L
H
X
H
L
H
L
H
L
L
H
H
X
Indeterminate
Outputs return to the input state within
1 μs of VDDI power restoration.
X
X
Powered
Unpowered
H
Indeterminate
Outputs return to the input state within
1 μs of VDDO power restoration.
Rev. C | Page 13 of 20
ADuM3200/ADuM3201
Data Sheet
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
V
1
2
3
4
8
7
6
5
V
V
V
DD1
DD2
OA
OB
ADuM3200
V
IA
IB
V
TOP VIEW
(Not to Scale)
GND
GND
2
1
Figure 4. ADuM3200 Pin Configuration
Table 34. ADuM3200 Pin Function Descriptions
Pin No.
Mnemonic
Description
1
2
3
4
5
6
7
8
VDD1
VIA
VIB
GND1
GND2
VOB
VOA
VDD2
Supply Voltage for Isolator Side 1.
Logic Input A.
Logic Input B.
Ground 1. Ground reference for Isolator Side 1.
Ground 2. Ground reference for Isolator Side 2.
Logic Output B.
Logic Output A.
Supply Voltage for Isolator Side 2.
V
1
2
3
4
8
7
6
5
V
V
V
DD1
DD2
ADuM3201
V
OA
IA
V
TOP VIEW
(Not to Scale)
IB
OB
GND
GND
1
2
Figure 5. ADuM3201 Pin Configuration
Table 35. ADuM3201 Pin Function Descriptions
Pin No.
Mnemonic
Description
1
2
3
4
5
6
7
8
VDD1
VOA
VIB
GND1
GND2
VOB
VIA
VDD2
Supply Voltage for Isolator Side 1.
Logic Output A.
Logic Input B.
Ground 1. Ground reference for Isolator Side 1.
Ground 2. Ground reference for Isolator Side 2.
Logic Output B.
Logic Input A.
Supply Voltage for Isolator Side 2.
Rev. C | Page 14 of 20
Data Sheet
ADuM3200/ADuM3201
TYPICAL PERFORMANCE CHARACTERISTICS
10
20
15
10
5
8
6
4
5V
5V
2
3V
3V
0
0
0
10
20
30
0
10
20
30
DATA RATE (Mbps)
DATA RATE (Mbps)
Figure 6. Typical Input Supply Current per Channel vs. Data Rate
for 5 V and 3 V Operation
Figure 9. Typical ADuM3200 IDD1 Supply Current vs. Data Rate
for 5 V and 3 V Operation
4
3
2
4
3
5V
2
5V
3V
1
1
3V
0
0
0
10
20
30
0
10
20
30
DATA RATE (Mbps)
DATA RATE (Mbps)
Figure 7. Typical Output Supply Current per Channel vs. Data Rate
for 5 V and 3 V Operation (No Output Load)
Figure 10. Typical ADuM3200 IDD2 Supply Current vs. Data Rate
for 5 V and 3 V Operation
4
10
8
3
6
2
5V
4
5V
1
2
3V
3V
0
0
0
10
20
30
0
10
20
30
DATA RATE (Mbps)
DATA RATE (Mbps)
Figure 8. Typical Output Supply Current per Channel vs. Data Rate
for 5 V and 3 V Operation (15 pF Output Load)
Figure 11. Typical ADuM3201 IDD1 or IDD2 Supply Current vs. Data Rate
for 5 V and 3 V Operation
Rev. C | Page 15 of 20
ADuM3200/ADuM3201
Data Sheet
APPLICATION INFORMATION
Channel-to-channel matching refers to the maximum amount
that the propagation delay differs between channels within a
single ADuM3200/ADuM3201 component.
PC BOARD LAYOUT
The ADuM3200/ADuM3201 digital isolators require no
external interface circuitry for the logic interfaces. Power
supply bypassing is strongly recommended at the input and
output supply pins. The capacitor value should be between
0.01 μF and 0.1 μF. The total lead length between both ends
of the capacitor and the input power supply pin should not
exceed 20 mm. See the AN-1109 Application Note for board
layout guidelines.
Propagation delay skew refers to the maximum amount that
the propagation delay differs between multiple ADuM3200/
ADuM3201 components operating under the same conditions.
DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY
Positive and negative logic transitions at the isolator input cause
narrow (~1 ns) pulses to be sent to the decoder via the transformer.
The decoder is bistable and is therefore either set or reset by the
pulses, indicating input logic transitions. In the absence of logic
transitions of more than ~1 μs at the input, a periodic set of
refresh pulses indicative of the correct input state are sent to
ensure dc correctness at the output. If the decoder receives
no internal pulses for more than about 5 μs, the input side is
assumed to be unpowered or nonfunctional, in which case,
the isolator output is forced to a default state (see Table 32 and
Table 33) by the watchdog timer circuit.
SYSTEM-LEVEL ESD CONSIDERATIONS AND
ENHANCEMENTS
System-level ESD reliability (for example, per IEC 61000-4-x)
is highly dependent on system design which varies widely by
application. The ADuM3200/ADuM3201 incorporate many
enhancements to make ESD reliability less dependent on system
design. The enhancements include:
ESD protection cells added to all input/output interfaces.
Key metal trace resistances reduced using wider geometry
and paralleling of lines with vias.
The ADuM3200/ADuM3201 are extremely immune to external
magnetic fields. The limitation on the ADuM3200/ADuM3201’s
magnetic field immunity is set by the condition in which induced
voltage in the transformer’s receiving coil is sufficiently large to
either falsely set or reset the decoder. The following analysis
defines the conditions under which this can occur. The 3 V
operating condition of the ADuM3200/ADuM3201 is examined
because it represents the most susceptible mode of operation.
The SCR effect inherent in CMOS devices minimized by
use of guarding and isolation technique between PMOS
and NMOS devices.
Areas of high electric field concentration eliminated using
45° corners on metal traces.
Supply pin overvoltage prevented with larger ESD clamps
between each supply pin and its respective ground.
The pulses at the transformer output have an amplitude greater
than 1.0 V. The decoder has a sensing threshold at about 0.5 V,
therefore establishing a 0.5 V margin in which induced voltages
can be tolerated. The voltage induced across the receiving coil is
given by
While the ADuM3200/ADuM3201 improve system-level
ESD reliability, they are no substitute for a robust system-level
design. See the AN-793 Application Note, ESD/Latch-Up
Considerations with iCoupler Isolation Products for detailed
recommendations on board layout and system-level design.
2
V = (−dβ/dt) ∑π rn , n = 1, 2,…, N
PROPAGATION DELAY-RELATED PARAMETERS
where:
Propagation delay is a parameter that describes the time it takes
a logic signal to propagate through a component. The propagation
delay to a logic low output can differ from the propagation
delay to a logic high.
β is the magnetic flux density (gauss).
N is the number of turns in the receiving coil.
rn is the radius of the nth turn in the receiving coil (cm).
INPUT (V
)
50%
Ix
tPLH
tPHL
OUTPUT (V
)
50%
Ox
Figure 12. Propagation Delay Parameters
Pulse width distortion is the maximum difference between
these two propagation delay values and is an indication of
how accurately the input signal’s timing is preserved.
Rev. C | Page 16 of 20
Data Sheet
ADuM3200/ADuM3201
Given the geometry of the receiving coil in the ADuM3200/
ADuM3201 and an imposed requirement that the induced
voltage is at most 50% of the 0.5 V margin at the decoder, a
maximum allowable magnetic field is calculated, as shown in
Figure 13.
The preceding magnetic flux density values correspond to
specific current magnitudes at given distances away from the
ADuM3200/ADuM3201 transformers. Figure 14 expresses
these allowable current magnitudes as a function of frequency
for selected distances. As seen, the ADuM3200/ADuM3201 are
extremely immune and can be affected only by extremely large
currents operated at high frequency and very close to the com-
ponent. For the 1 MHz example, one would have to place a 0.5 kA
current 5 mm away from the ADuM3200/ADuM3201 to affect
the component’s operation.
100
10
1
1000
DISTANCE = 1m
0.1
100
0.01
0.001
10
DISTANCE = 100mm
1
1k
10k
100k
1M
10M
100M
MAGNETIC FIELD FREQUENCY (Hz)
DISTANCE = 5mm
Figure 13. Maximum Allowable External Magnetic Flux Density
0.1
For example, at a magnetic field frequency of 1 MHz, the
maximum allowable magnetic field of 0.2 kgauss induces a
voltage of 0.25 V at the receiving coil. This is about 50% of the
sensing threshold and does not cause a faulty output transition.
Similarly, if such an event were to occur during a transmitted
pulse (and had the worst-case polarity), it would reduce the
received pulse from >1.0 V to 0.75 V—still well above the
0.5 V sensing threshold of the decoder.
0.01
1k
10k
100k
1M
10M
100M
MAGNETIC FIELD FREQUENCY (Hz)
Figure 14. Maximum Allowable Current for Various
Current-to-ADuM3200/ADuM3201 Spacings
Note that at combinations of strong magnetic fields and high
frequencies, any loops formed by printed circuit board traces
could induce sufficiently large error voltages to trigger the
threshold of succeeding circuitry. Care should be taken in
the layout of such traces to avoid this possibility.
Rev. C | Page 17 of 20
ADuM3200/ADuM3201
Data Sheet
The values shown in Table 31 summarize the peak voltage for
50 years of service life for a bipolar ac operating condition, and
the maximum CSA/VDE approved working voltages. In many
cases, the approved working voltage is higher than the 50-year
service life voltage. Operation at these high working voltages
can lead to shortened insulation life.
POWER CONSUMPTION
The supply current at a given channel of the ADuM3200/
ADuM3201 isolator is a function of the supply voltage, the
channel’s data rate, and the channel’s output load.
For each input channel, the supply current is given by
I
DDI = IDDI (Q)
f ≤ 0.5fr
f > 0.5fr
The insulation lifetime of the ADuM3200/ADuM3201 depends
on the voltage waveform type imposed across the isolation
barrier. The iCoupler insulation structure degrades at different
rates depending on whether the waveform is bipolar ac, unipolar
ac, or dc. Figure 15, Figure 16, and Figure 17 illustrate these
different isolation voltage waveforms.
IDDI = IDDI (D) × (2f − fr) + IDDI (Q)
For each output channel, the supply current is given by
IDDO = IDDO (Q)
f ≤ 0.5fr
I
DDO = (IDDO (D) + (0.5 × 10−3) × CLVDDO) × (2f − fr) + IDDO (Q)
f > 0.5fr
A bipolar ac voltage environment is the most stringent. The
goal of a 50-year operating lifetime under the ac bipolar
condition determines the Analog Devices recommended
maximum working voltage.
where:
DDI (D), IDDO (D) are the input and output dynamic supply currents
per channel (mA/Mbps).
I
CL is the output load capacitance (pF).
In the case of unipolar ac or dc voltage, the stress on the insu-
lation is significantly lower. This allows operation at higher
working voltages while still achieving a 50-year service life.
The working voltages listed in Table 31 can be applied while
maintaining the 50-year minimum lifetime, provided that
the voltage conforms to either the unipolar ac or dc voltage
cases. Any cross-insulation voltage waveform that does not
conform to Figure 16 or Figure 17 should be treated as a
bipolar ac waveform and its peak voltage should be limited
to the 50-year lifetime voltage value listed in Table 31.
VDDO is the output supply voltage (V).
f is the input logic signal frequency (MHz, half of the input data
rate, NRZ signaling).
fr is the input stage refresh rate (Mbps).
IDDI (Q), IDDO (Q) are the specified input and output quiescent
supply currents (mA).
To calculate the total IDD1 and IDD2 supply current, the supply
currents for each input and output channel corresponding to
I
DD1 and IDD2 are calculated and totaled. Figure 6 provides per-
channel input supply currents as a function of data rate.
Note that the voltage presented in Figure 16 is shown as sinusoi-
dal for illustration purposes only. It is meant to represent any
voltage waveform varying between 0 V and some limiting value.
The limiting value can be positive or negative, but the voltage
cannot cross 0 V.
Figure 7 and Figure 8 provide per-channel output supply
currents as a function of data rate for an unloaded output
condition and for a 15 pF output condition, respectively.
Figure 9 through Figure 11 provide total IDD1 and IDD2
supply current as a function of data rate for ADuM3200
and ADuM3201 channel configurations.
RATED PEAK VOLTAGE
0V
INSULATION LIFETIME
Figure 15. Bipolar AC Waveform
All insulation structures eventually break down when subjected
to voltage stress over a sufficiently long period. The rate of
insulation degradation depends upon the characteristics of
the voltage waveform applied across the insulation. In addition
to the testing performed by the regulatory agencies, Analog
Devices carries out an extensive set of evaluations to determine
the lifetime of the insulation structure within the ADuM3200/
ADuM3201.
RATED PEAK VOLTAGE
0V
Figure 16. Unipolar AC Waveform
RATED PEAK VOLTAGE
Analog Devices performs accelerated life testing using voltage
levels higher than the rated continuous working voltage. Accel-
eration factors for several operating conditions are determined.
These factors allow calculation of the time to failure at the
actual working voltage.
0V
Figure 17. DC Waveform
Rev. C | Page 18 of 20
Data Sheet
ADuM3200/ADuM3201
OUTLINE DIMENSIONS
5.00 (0.1968)
4.80 (0.1890)
8
1
5
4
6.20 (0.2441)
5.80 (0.2284)
4.00 (0.1574)
3.80 (0.1497)
0.50 (0.0196)
0.25 (0.0099)
1.27 (0.0500)
BSC
45°
1.75 (0.0688)
1.35 (0.0532)
0.25 (0.0098)
0.10 (0.0040)
8°
0°
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MS-012-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 18. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body (R-8)
Dimensions shown in millimeters (inches)
Rev. C | Page 19 of 20
ADuM3200/ADuM3201
Data Sheet
ORDERING GUIDE
Number
of Inputs,
VDD1 Side
Number
of Inputs,
VDD2 Side
Maximum
Data Rate
(Mbps)
Maximum
Propagation
Delay, 5 V (ns)
Maximum
Pulse Width
Distortion (ns)
Temperature
Package
Option3
Model1, 2
Range (°C)
−40 to +105
−40 to +105
−40 to +105
−40 to +105
−40 to +105
−40 to +105
−40 to +125
−40 to +125
−40 to +125
−40 to +125
−40 to +125
−40 to +125
−40 to +105
−40 to +105
−40 to +105
−40 to +105
−40 to +105
−40 to +105
−40 to +125
−40 to +125
−40 to +125
−40 to +125
−40 to +125
−40 to +125
ADuM3200ARZ
ADuM3200ARZ-RL7
ADuM3200BRZ
ADuM3200BRZ-RL7
ADuM3200CRZ
ADuM3200CRZ-RL7
ADuM3200WARZ
ADuM3200WARZ-RL7
ADuM3200WBRZ
ADuM3200WBRZ-RL7
ADuM3200WCRZ
ADuM3200WCRZ-RL7
ADuM3201ARZ
ADuM3201ARZ-RL7
ADuM3201BRZ
ADuM3201BRZ-RL7
ADuM3201CRZ
ADuM3201CRZ-RL7
ADuM3201WARZ
ADuM3201WARZ-RL7
ADuM3201WBRZ
ADuM3201WBRZ-RL7
ADuM3201WCRZ
ADuM3201WCRZ-RL7
2
2
2
2
2
2
2
2
2
2
2
2
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
150
150
50
50
45
40
40
3
3
3
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
10
10
25
25
1
45
3
150
150
50
50
45
40
40
3
3
3
1
10
10
25
25
1
45
3
150
150
50
50
45
40
40
3
3
3
1
10
10
25
25
1
45
3
150
150
50
50
45
40
40
3
3
3
1
10
10
25
25
45
3
1 Z = RoHS Compliant Part.
2 W = Qualified for Automotive Applications.
3 R-8 = 8-lead narrow body SOIC_N.
AUTOMOTIVE PRODUCTS
The ADuM3200W/ADuM3201W models are available with controlled manufacturing to support the quality and reliability requirements
of automotive applications. Note that these automotive models may have specifications that differ from the commercial models; therefore,
designers should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for
use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and
to obtain the specific Automotive Reliability reports for these models.
©2006–2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05927-2/12(C)
Rev. C | Page 20 of 20
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