MIC-5342SA1-P1E [ADVANTECH]

AdvancedTCA, Dual Socket CPU Blade with IntelÂ® XeonÂ® E5-2600 v3 Series Processors for Telecom Applications;


型号：	MIC-5342SA1-P1E
厂家：	Advantech Co., Ltd.
描述：	AdvancedTCA, Dual Socket CPU Blade with IntelÂ® XeonÂ® E5-2600 v3 Series Processors for Telecom Applications
文件：	总2页 (文件大小：846K)
中文：	中文翻译
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AdvancedTCA, Dual Socket CPU Blade

with Intel^®Xeon^®E5-2600 v3 Series

Processors for Telecom Applications

MIC-5342

Features

Two 12-Core Intel^®Xeon^®E5-2600 v3 Series processors

Intel^®Communications Chipset 8900 Series

Eight DDR4 VLP DIMMs with ECC support

Up to four 40GBase-KR4 ports on Fabric interface to support Dual-Dual Star

Topology

Two 10/100/1000Mbps BI ports

Two 10/100/1000BASE-T front panel ports

One Fabric Mezzanine Module (type II) for optional front I/O or additional

acceleration

Fully managed, hot-swappable RTM with 8 PCIe gen.3 lanes

RoHS

COMPLIANT

2002/95/EC

Introduction

Advantech’s MIC-5342 is a dual processor ATCA blade based on the Intel® platform formerly codenamed "River Forest". It enables the highest performance available in the ATCA

form factor with up to 28 cores and 56 threads of processing power, fast PCI Express gen. 3 lanes running at up to 8Gbps, and best in class virtualization support. Two QPI interfaces

between the CPUs improve memory and I/O access throughput and latencies when one processor needs to access resources hosted by the other socket. With four DDR4 DIMMs per

socket in a quad channel design running up to 2133MT/s, the MIC-5342 not only offers superior memory bandwidth over 3-channel designs, but can also support RAM density up

to 256GB. It outperforms previous generation dual socket designs while keeping similar thermal characteristics with balanced airﬂow resistance.

Fabric connectivity is implemented by two Intel® Ethernet controllers XL710-AM2 devices onboard, connecting to four backplane fabric channels. This allows the MIC-5342 to scale

from legacy 10GbE to high speed 40GbE network interfaces as well as enable optional dual-dual star support for the most demanding applications utilizing 4 hub blades per system.

A Fabric Mezzanine Module type II socket with PCIe x16 connectivity provides on-board expansion capability for additional front panel I/O, ofﬂoad and acceleration controllers such

as the Intel® Communications Chipset 8900 Series, IPSec ofﬂoad engines, or customer speciﬁc logic.

The onboard IPMI ﬁrmware based on Advantech’s advanced IPMI core enhances modularity and ﬂexibility for customization of system management features, and provides a framework

for value-added features that enhance the Reliability, Availability, Serviceability, Usability and Manageability (RASUM) of the product. HPM.1 based updates, including rollback

support, are available for all programmable components such as the BIOS, BIOS settings, IPMC ﬁrmware, and FPGA. Advantech’s IPMI solution, combined with an optimized UEFI

BIOS, continues to offer advanced features used on previous generation Advantech MIC-533x blades, such as HPM.2 support, Dynamic Power Budgeting, BIOS redundancy, Real

Time Clock Synchronization and MAC mirroring. Advantech’s IPMI ﬁrmware has been tested for CP-TA compliance using the Polaris Networks ATCA Test Suite and against a variety

of AdvancedTCA shelf management solutions.

The MIC-5342 connects 8 PCIe gen.3 lanes to the Zone 3 interface for hot-swappable RTMs such as the RTM-5107, which supports two SAS HDDs. Please contact Advantech for

more information about available RTMs. The MIC-5342 can also be easily customized based on Advantech’s unique Customized COTS framework with custom RTMs, FMMs, or

modiﬁcations of the on-board system FPGA, IPMI and/or BIOS ﬁrmware.

The optimization of features and unmatched ﬂexibility based on Advantech’s leading FMM technology make the MIC-5342 equally well suited for both control plane and application

workloads in telecom networks.

Zone3 connectors

Eight DDR4 VLP DIMMs

40GBASE-KR4 Fabric Interface

FMM type II site

Console ports

Two 10/100/1000BASE-T ports

USB ports

All product specifications are subject to change without notice

Last updated : 14-Aug-2015

MIC-5342

Speciﬁcations

CPU

Dual Intel^®Xeon^®E5-2600 v3 Series processors up to 120W TDP (chassis airﬂow dependent)

Max. Speed

Chipset

BIOS

2.5 GHz (SKU dependent)

Processor System

Intel^®Communications Chipset 8900 Series

Redundant AMI UEFI based BIOS

9.6 GT/s

QPI

Technology

Max. Capacity

Socket

Four channel DDR4 2133MHz SDRAM (72-bit ECC Un-/ Registered) to each CPU

Conﬁgurable up to 256GB

8 x VLP RDIMMs

Memory

Fabric Interface

Base Interface

Serial (COM)

Ethernet

Up to four 40GBASE-KR4 ports

2 x 10/100/1000BASE-T ports

1 x 16C550 compatible Serial Port (RJ-45 connector)

2 x 10/100/1000BASE-T ports

2 x Type A ports

Zone 2

Front I/O Interface

USB 2.0

Operating System

IPMC

Compatibility

BMC Controller

Site

CentOS 7.0, Red Hat Enterprise 7.0, Wind River Linux 6.0

Compliant with IPMI 2.0

1 FMM type II socket

FMM

Interface

1 x PCIe x16

Storage

TPM

2 x CFast, 1 x MO-297 SATA slim SSD, 2 x M.2 SSD, or 1 x 2.5” SSD

TPM 2.0

Miscellaneous

2 x E5-2658Av3 (TDP 105W), 8 x DDR4 2133 8GB VLP Memory, FMM-5001F (Single Intel® Ethernet

Controller with 2x SFP+ output to Front Panel), no RTM

Conﬁguration

Power Requirement

Consumption

RTM

Interface

Dimensions (W x D)

Weight

Input Voltage: -48V / 300W (Preliminary)

Advantech common RTM interface Type 2

1 x PCIe x8, 1 x PCIe x16, 1x COM, 2x USB 2.0, 2x SATA 3.0

6HP, 322.25 x 280.00 mm (12.69" x 11.02") (PCB size)

2.8 kg

Zone 3 (RTM)

Physical Characteristics

Operating

Non-operating

Temperature

Humidity

Shock

0 ~ 55° C (32 ~ 131° F) (selected SKUs, only)

5 to 95% @ 40° C (non-condensing)

4 G each axis

-40 ~ 70° C (-40 ~ 158° F)

95% @ 60° C (non-condensing)

5 Hz to 20 Hz @ 1 m2/s3 (0.01 g2 /Hz) (ﬂat)

20 Hz to 200 Hz @ -3 dB/oct (slope down)

Environment

Compliance

Vibration

5-200 Hz, 0.5 Grms each axis

ETSI EN300019-2-1 Class1.2, EN300019-2-2 Class 2.3, ETSI EN300019-2-3 Class 3.1E, Designed to meet

GR-63-CORE

3.0 R3.0, 3.1 R2.0, HPM.1, HPM.2, HPM.3

Environment

PICMG

FCC47 CFR Part15, Class A, CE Mark (EN55022/EN55024/EN300386)

Designed to meet GR-1089-CORE

EMC

Ordering Information

MIC-5342SA1-P1E [ADVANTECH]

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