NANOX-BT-N2930-2G [ADLINK]
Extreme Rugged COM Express Mini Size Type 10 Module;型号: | NANOX-BT-N2930-2G |
厂家: | ADLINK |
描述: | Extreme Rugged COM Express Mini Size Type 10 Module |
文件: | 总4页 (文件大小:430K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
nanoX-BT
Extreme Rugged COM Express® Mini Size Type 10 Module with
Intel Atom® E3800 series or Celeron® Processor SoC
Features
Single, dual, quad-core Intel Atom® or Celeron® Processor SoC
●
●
Up to 4GB soldered Dual Channel DDR3L at 1333MHz
●
One DDI channel, one LVDS (build option, eDP)
●
Three PCIe x1
●
GbE, two SATA 3Gb/s, four USB and one USB client
Supports Smart Embedded Management Agent (SEMA®) functions
●
●
Extreme Rugged operating temperature: -40°C to +85°C
(build option)
Specifications
● Core System
CPU
Debug Headers
Single, dual, quad-core Intel Atom® or quad-core Celeron®
40-pin multipurpose flat cable connector
Use in combination with DB-40 debug module
providing BIOS POST code LED, BMC access, SPI BIOS flashing, power test points,
debug LEDs
Atom® E3845 1.91 GHz 542/792 Gfx (Turbo) 10W (4C/1333)
Atom® E3827 1.75 GHz 542/792 Gfx (Turbo) 8W (2C/1333)
Atom® E3826 1.46 GHz 533/667 Gfx (Turbo) 7W (2C/1066)
Atom® E3825 1.33 GHz 533 Gfx (No Turbo) 6W (2C/1066)
Atom® E3815 1.46 GHz 400 Gfx (No Turbo) 5W (1C/1066) Atom® E3805 1.33 GHz
(No GFX) 3W (2C/1066)
60-pin XDP header for ICE debug of CPU/chipset on break out board
GPU Feature Support
7th generation Intel® graphics core architecture with four execution units
supporting two independent displays
Celeron® N2930 1.83/2.16 (Burst) GHz, 313/854 (Turbo) 7.5W (4C/1333)Celeron®
J1900 2.0/2.42 (Burst) GHz, 688/854 (Turbo) 10W (4C/1333)
Supports: Single, dual or quad Out-of-Order Execution (OOE) processor
cores, Intel® VT-x, Intel® SSE4.1 and SSE4.2, Intel® 64 architecture, IA 32-bit ,
PCLMULQDQ Instruction DRNG, Intel® Thermal Monitor (TM1 & TM2)
Note: Availability of features may vary between processor SKUs.
3D graphics hardware acceleration
Supports for DirectX11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2
Video decode hardware acceleration including support for H.264, MPEG2, MVC,
VC-1, WMV9 and VP8 formats
Memory
Video encode hardware acceleration including support for H.264, MPEG2 and
MVC formats
Single channel non-ECC 1333/1066 MHz soldered DDR3L memory up to 4GB
(2GB or 4GB)
Digital Display Interface
One DDI channel supporting DisplayPort/HDMI/DVI
Embedded BIOS
AMI EFI with CMOS backup in 8MB SPI BIOS
LVDS/eDP
Single channel 18/24-bit LVDS
(BOM option support for 24-bit EDID panel)
Cache
Primary 32 KB, 8-way L1 instruction cache and 24 KB, 6-way L1 write-back data
cache
eDP support (build option)
2MB for E3845, N2930 and J1900
1MB for E3827, E3826, E3825 and E3805
512K for E3815
● Audio
Chipset
Intel® HD Audio integrated in SOC
Expansion Busses
3 PCI Express x1 Gen2 (AB): Ianes 0/1/2;
optional PCIe x4 (lose GbE)
Audio Codec
Located on carrier miniBASE-10R
LPC bus, SMBus (system), I2C (user)
SEMA Board Controller
● Ethernet
Supports: Voltage/Current monitoring, Power sequence debug support, AT/ATX
mode control, Logistics and Forensic information, Flat Panel Control, General
Purpose I2C, Watchdog Timer
Intel® MAC/PHY: Intel® i210LM (MAC/PHY) Ethernet controller
Interface: 10/100/1000 GbE connection
Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times.
Specifications
● Mechanical and Environmental
Form Factor: PICMG COM.0: Rev 2.1 Type 10
● I/O Interfaces
USB: 1x USB 3.0 (USB 0) 3x USB 2.0 (USB 1,2,3) and 1x USB 2.0 client (USB 7)
Dimension: Mini size: 84 mm x 55 mm
SATA: Two SATA 3 Gb/s ports
Serial: 2 UART ports COM 0/1 (COM 0 support console redirection)
eMMC: Optional soldered on module bootable eMMC flash storage
8G to 32 GB
Operating Temperature
Standard: 0°C to +60°C
Extreme Rugged: -40 to +85°C (build option, Atom™ E38xx series only)
SD: Optional, SD support multiplexed over GPIO pins
eMMC and SD functions may vary between OS
GPIO: 4 GPO and 4 GPI
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
● Super I/O
On carrier if needed (standard support for W83627DHG-P)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table
214-I, Condition D
● Power
Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
Wide Input: ATX = 5-14V / 5Vsb (standard temp. only)
AT = 5-14V (standard temp. only)
HALT
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Management: ACPI 4.0 compliant, Smart Battery support
Power States: C0, C1, C1E, C4, C6
S0, S3, S4, S5 (Wake on USB S3/S4, WOL S3/S4/S5
ECO mode: Supports deep S5 (ECO mode) for power saving
● Operating Systems
Standard Support
Windows 7/8 32/64-bit, Windows 10 64-bit, Linux 32/64-bit
Extended Support (BSP)
WES7/8, Linux, VxWorks 32/64-bit, WEC7 32-bit
Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times.
Functional Diagram
eDP (optional)
LVDS
eDP to LVDS
RTL2132
DDI1
eDP 1 lane
Soldered
1-2 GB DDR3L
non ECC (only)
®
Intel Atom
E3845
E3827
E3826
E3825
E3815
DDI2
4 lanes
1x USB 1.1/2.0/3.0 (port 0)
3x USB 1.1/2.0 (port 1~3)
1x USB 1.1/2.0 client (port 7)
®
®
Intel Celeron
N2930
J1900
3 PCIe x1 Gen2
(port 0~2)
PCIe x1
alternative
route
(formerly
“Baytrail”)
GbE
i210
PCIe x1 Gen2
(port 3)
On break-out board
XDP
60-pin
2x SATA 3Gb/s
(port 0/1)
eMMC
8GB/16GB/
32GB
HD Audio
2 UART (Tx/Rx)
LPC Bus
SDIO/MMC port 0 (optional)
4x GP0, 4x GPI
GPIO
PCA9535
SMBus
GP I2C
DDC I2C
SPI0
BIOS
SEMA
BMC
LM73
to CPU
SPI_CS#
SPI
Ordering Information
Accessories
●
nanoX-BT-E3845-2G
Heat Spreaders
COM Express® Mini Size Type 10 with Intel Atom® E3845
●
HTS-nXBT-B
at 1.91 GHz and 2GB non ECC DDR3L
Heatspreader for nanoX-BT with threaded standoffs for bottom
mounting
●
nanoX-BT-E3827-2G
COM Express® Mini Size Type 10 with Intel Atom® E3827
●
at 1.75 GHz and 2GB non ECC DDR3L
HTS-nXBT-BT
Heatspreader for nanoX-BT with through hole standoffs for top
mounting
●
nanoX-BT-E3826-2G
COM Express® Mini Size Type 10 with Intel Atom® E3826
at 1.46 GHz and 2GB non ECC DDR3L
Passive Heatsinks
●
nanoX-BT-E3825-2G
COM Express® Mini Size Type 10 with Intel Atom® E3825
THS-nXBT-B
●
at 1.33 GHz and 2GB non ECC DDR3L
Low profile heatsink for nanoX-BT with threaded standoffs for
bottom mounting
●
nanoX-BT-E3815-2G
COM Express® Mini Size Type 10 with Intel Atom® E3815
●
THS-nXBT-BT
at 1.46 GHz and 2GB non ECC DDR3L
Low profile heatsink for nanoX-BT with through hole standoffs
for top mounting
●
nanoX-BT-E3805-2G
COM Express Mini Size Type 10 with Intel Atom® E3805
●
THSM-nXBT-B
at 1.33 GHz and 2GB non ECC DDR3L
High profile heatsink for nanoX-BT with threaded standoffs for
bottom mounting
●
nanoX-BT-N2930-2G
COM Express Mini Size Type 10 with Intel® Celeron® N2930
at 1.83 GHz and 2GB non ECC DDR3L
●
nanoX-BT-J1900-2G
Starter Kit
COM Express® Mini Size Type 10 with Intel® Celeron® J1900
at 2.00 GHz and 2GB non ECC DDR3L
●
COM Express Type 10 Starter Kit Plus
COM Express formfactor starter kit with miniBase-10R carrier
board, power supply, and accessory kit
www.adlinktech.com
All products and company names listed are trademarks or trade names of their respective companies.
Updated Dec. 10, 2019. ©2019 ADLINK Technology, Inc. All Rights Reserved.
All specifications are subject to change without further notice.
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