HMC553ALC3BTR [ADI]
6 GHz to 14 GHz, GaAs, MMIC, Double-Balanced Mixer;
| 型号： | HMC553ALC3BTR |
| 厂家： | 
ADI |
| 描述： | 6 GHz to 14 GHz, GaAs, MMIC, Double-Balanced Mixer 局域网 射频 微波 |
| 文件： | 总25页 (文件大小：376K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
6 GHz to 14 GHz, GaAs, MMIC,
Double-Balanced Mixer
HMC553ALC3B
Data Sheet
FEATURES
FUNCTIONAL BLOCK DIAGRAM
HMC553ALC3B
Passive: no dc bias required
Conversion loss: 7 dB typical at 6 GHz to 11 GHz
Input IP3: 18 dBm typical at 6 GHz to 11 GHz
LO to RF isolation: 36 dB typical
Wide IF bandwidth: dc to 5 GHz
RoHS compliant, 12-terminal, 2.90 mm × 2.90 mm LCC package
12 11 10
1
2
3
9
8
7
GND
RF
GND
LO
GND
GND
APPLICATIONS
4
5
6
PACKAGE
BASE
Microwave and very small aperture terminal (VSAT) radios
Test equipment
GND
Figure 1.
Point to point radios
Military electronic warfare (EW); electronic countermeasure
(ECM); and command, control, communications and
intelligence (C3I)
GENERAL DESCRIPTION
The HMC553ALC3B is a general-purpose, double-balanced,
gallium arsenide (GaAs), monolithic microwave integrated
circuit (MMIC) mixer housed in a leadless Pb-free, RoHS
compliant LCC package. The HMC553ALC3B can be used as an
upconverter or downconverter between 6 GHz and 14 GHz.
This mixer requires no external components or matching
circuitry.
The HMC553ALC3B provides local oscillator (LO) to radio
frequency (RF) and LO to intermediate frequency (IF) suppression
due to optimized balun structures. The mixer operates with LO
drive levels from 9 dBm to 15 dBm. The HMC553ALC3B
eliminates the need for wire bonding, allowing use of surface-
mount manufacturing techniques.
Rev. B
Document Feedback
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
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One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2018–2019 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
HMC553ALC3B
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Upconverter Performance......................................................... 14
Isolation and Return Loss ......................................................... 18
IF Bandwidth—Downconverter, Upper Sideband................. 20
IF Bandwidth—Downconverter, Lower Sideband................. 21
Spurious and Harmonics Performance ................................... 22
Theory of Operation ...................................................................... 23
Applications Information.............................................................. 24
Typical Application Circuit....................................................... 24
Evaluation PCB Information .................................................... 24
Outline Dimensions....................................................................... 25
Ordering Guide .......................................................................... 25
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6
Downconverter Performance...................................................... 6
REVISION HISTORY
3/2019—Rev.A to Rev. B
2/2018—Revision 0: Initial Version
Change to Table 5 ........................................................................... 22
Changes to Downconversion, Upper Sideband Section,
Downconversion, Lower Sideband Section, Upconversion, Upper
Sideband Section, and Upconversion, Lower Sideband Section ... 22
6/2018—Rev.0 to Rev. A
Added 6 GHz to 11 GHz Downconverter Performance, Noise
Figure Parameter and 11 GHz to 14 GHz Downconverter
Performance, Noise Figure Parameter, Table 1............................. 3
Rev. B | Page 2 of 25
Data Sheet
HMC553ALC3B
SPECIFICATIONS
TA = 25°C, IF = 100 MHz, RF = −10 dBm, LO = 13 dBm, upper side band. All measurements performed as a downconverter, unless
otherwise noted, on the evaluation printed circuit board (PCB).
Table 1.
Parameter
Symbol
Test Conditions/Comments
Min
Typ
Max
Unit
FREQUENCY RANGE
RF
LO Input
6
6
DC
9
14
14
5
GHz
GHz
GHz
dBm
IF
LO DRIVE LEVELS
6 GHz to 11 GHz PERFORMANCE
Downconverter
13
15
Conversion Loss
Noise Figure
Input Third-Order Intercept
Input 1 dB Compression Point
Input Second-Order Intercept
Upconverter
7
9
dB
dB
dBm
dBm
dBm
8.5
18
9.5
40
IP3
P1dB
IP2
15
IFIN
Conversion Loss
Input Third-Order Intercept
Input 1 dB Compression Point
Isolation
7
19
8
dB
dBm
dBm
IP3
P1dB
RF to IF
LO to RF
LO to IF
18
30
28
32
36
32
dB
dB
dB
11 GHz to 14 GHz PERFORMANCE
Downconverter
Conversion Loss
Noise Figure
Input Third-Order Intercept
Input 1 dB Compression Point
Input Second-Order Intercept
Upconverter
9
10
dB
dB
dBm
dBm
dBm
10
22
11.5
45
IP3
P1dB
IP2
18
IFIN
Conversion Loss
Input Third-Order Intercept
Input 1 dB Compression Point
Isolation
8
19
8
dB
dBm
dBm
IP3
P1dB
RF to IF
LO to RF
LO to IF
25
30
28
29
37
33
dB
dB
dB
Rev. B | Page 3 of 25
HMC553ALC3B
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Thermal performance is directly linked to PCB design and
operating environment. Careful attention to PCB thermal
design is required.
Parameter
Rating
25 dBm
25 dBm
25 dBm
3 mA
RF Input Power
LO Input Power
IF Input Power
IF Source/Sink Current
Reflow Temperature
Maximum Junction Temperature
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θJC is
the junction to case thermal resistance.
260°C
175°C
Table 3. Thermal Resistance
Package Type
E-12-41
Continuous Power Dissipation, PDISS
(TA = 85°C, Derate 4.6 mW/°C Above 85°C)
414 mW
θJA
θJC
Unit
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
−40°C to +85°C
−65°C to +150°C
−65°C to +150°C
120
175
°C/W
1 See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
ESD CAUTION
1000 V
1250 V
Field Induced Charged Device Model
(FICDM)
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. B | Page 4 of 25
Data Sheet
HMC553ALC3B
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
HMC553ALC3B
TOP VIEW
(Not to Scale)
12 11 10
1
2
3
9
8
7
GND
RF
GND
LO
GND
GND
4
5
6
PACKAGE
BASE
GND
NOTES
1. NOT INTERNALLY CONNECTED. THESE PINS
CAN BE CONNECTED TO RF/DC GROUND.
PERFORMANCE IS NOT AFFECTED.
2. EXPOSED PAD. THE EXPOSED PAD MUST BE
CONNECTED TO RF/DC GROUND.
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic Description
1, 3, 4, 6, 7, 9 GND
Ground. These pins and package bottom must be connected to RF/dc ground.
Local Oscillator Port. This pin is ac-coupled and matched to 50 Ω.
Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to dc, dc block
this port externally using a series capacitor of a value chosen to pass the necessary IF frequency range. For
operation to dc, this pin must not source or sink more than 3 mA of current or die malfunction and possible
die failure may result.
2
5
LO
IF
8
RF
Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω.
10, 11, 12
NIC
EPAD
Not Internally Connected. These pins can be connected to RF/dc ground. Performance is not affected.
Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS
GND
IF
Figure 5. IF Interface Schematic
Figure 3. GND Interface Schematic
RF
LO
Figure 4. LO Interface Schematic
Figure 6. RF Interface Schematic
Rev. B | Page 5 of 25
HMC553ALC3B
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE
IF = 100 MHz, Upper Sideband (Low-Side LO)
0
0
–5
–5
–10
–10
–15
–20
T
T
T
= –40°C
= +25°C
= +85°C
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
A
A
A
–15
–20
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 9. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
30
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
25
20
15
10
5
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
10
5
0
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 8. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 10. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 6 of 25
Data Sheet
HMC553ALC3B
Downconverter P1dB and IP2, IF = 100 MHz, Upper Sideband (Low-Side LO)
20
15
10
5
20
15
10
5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
0
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 11. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 13. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
60
50
40
30
60
50
40
30
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
20
10
0
20
10
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 12. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 14. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 7 of 25
HMC553ALC3B
Data Sheet
IF = 100 MHz, Lower Sideband (High-Side LO)
0
0
–5
–5
–10
–10
–15
–20
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
–15
–20
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 15. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 18. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
30
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
25
20
15
10
5
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
10
5
0
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 16. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 19. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
20
20
15
15
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
10
5
10
LO = 9dBm
LO = 11dBm
5
LO = 13dBm
LO = 15dBm
0
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 17. Noise Figure vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 20. Noise Figure vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 8 of 25
Data Sheet
HMC553ALC3B
Downconverter P1dB and IP2, IF = 100 MHz, Lower Sideband (High-Side LO)
20
15
10
5
20
15
10
5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
0
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 21. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 23. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
80
70
60
50
40
30
80
70
60
50
40
30
LO = 9dBm
LO = 11dBm
LO = 13dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
20
10
0
20
LO = 15dBm
10
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 22. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 24. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 9 of 25
HMC553ALC3B
Data Sheet
IF = 4000 MHz, Upper Sideband (Low-Side LO)
0
0
–5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
–5
–10
–15
–20
–10
–15
–20
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 25. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 27. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
30
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
25
25
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
20
15
10
5
20
15
10
5
0
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 26. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 28. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 10 of 25
Data Sheet
HMC553ALC3B
Downconverter P1dB and IP2, IF = 40000 MHz, Upper Sideband (Low-Side LO)
20
15
10
5
20
15
10
5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
0
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 29. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 31. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
80
70
60
50
40
30
80
70
60
50
40
LO = 9dBm
30
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
20
10
0
20
10
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 30. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 32. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 11 of 25
HMC553ALC3B
Data Sheet
IF = 4000 MHz, Lower Sideband (High-Side LO)
0
0
–5
–5
–10
–10
–15
–20
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
–15
–20
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 33. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 35. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
30
25
20
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
15
10
5
15
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
10
5
0
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 34. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 36. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 12 of 25
Data Sheet
HMC553ALC3B
Downconverter P1dB and IP2, IF = 4000 MHz, Lower Sideband (High-Side LO)
20
15
10
5
20
15
10
5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
0
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 37. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 39. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
80
70
60
50
80
70
60
50
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
40
30
20
10
0
40
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
30
20
10
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 38. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 40. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 13 of 25
HMC553ALC3B
Data Sheet
UPCONVERTER PERFORMANCE
IFIN = 100 MHz, Upper sideband (Low-Side LO)
0
0
–5
–5
–10
–10
–15
–20
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
–15
–20
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 41. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 44. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
30
25
20
15
15
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
10
10
5
5
0
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 42. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 45. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
20
20
LO = 9dBm
LO = 11dBm
15
15
T
T
T
= –40°C
= +25°C
= +85°C
LO = 13dBm
LO = 15dBm
A
A
A
10
5
10
5
0
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 43. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 46. Input P1dB vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. B | Page 14 of 25
Data Sheet
HMC553ALC3B
IFIN = 100 MHz, Lower Sideband (High-Side LO)
0
0
–5
–5
–10
–10
–15
–20
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
–15
–20
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 47. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 50. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
30
25
20
15
15
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
10
10
5
5
0
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 48. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 51. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
20
15
10
15
10
5
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
5
0
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 49. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 52. Input P1dB vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. B | Page 15 of 25
HMC553ALC3B
Data Sheet
IFIN = 4000 MHz, Upper Sideband (Low-Side LO)
0
0
–5
–5
–10
–10
–15
–20
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–15
–20
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 53. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 56. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
30
25
20
15
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
10
5
10
LO = 9dBm
LO = 11dBm
LO = 13dBm
5
LO = 15dBm
0
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 54. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 57. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
20
20
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
15
10
5
15
10
5
0
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 55. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 58. Input P1dB vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. B | Page 16 of 25
Data Sheet
HMC553ALC3B
IFIN = 4000 MHz, Lower Sideband (High-Side LO)
0
0
–5
–5
–10
–10
–15
–20
T
T
T
= –40°C
= +25°C
= +85°C
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
A
A
A
–15
–20
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 59. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 62. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
30
25
20
15
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
10
5
10
5
0
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 60. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 63. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
15
10
5
20
15
10
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
5
0
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 61. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 64. Input P1dB vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. B | Page 17 of 25
HMC553ALC3B
Data Sheet
ISOLATION AND RETURN LOSS
Downconverter performance at IF = 100 MHz, upper sideband (low-side LO).
60
50
40
30
20
10
0
60
50
40
30
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
= –40°C
= +25°C
= +85°C
A
20
10
0
T
A
T
A
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 65. LO to RF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 68. LO to RF Isolation vs. RF Frequency at Various LO Power Levels,
TA = 25°C
60
50
40
30
60
50
40
30
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
= –40°C
= +25°C
= +85°C
A
20
20
10
0
T
A
T
A
10
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 66. LO to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 69. LO to IF Isolation vs. RF Frequency at Various LO Power Levels,
TA = 25°C
60
50
40
60
50
40
30
30
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
20
20
10
0
10
0
5
6
7
8
9
10
11
12
13
14
15
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 67. RF to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 70. RF to IF Isolation vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 18 of 25
Data Sheet
HMC553ALC3B
0
0
–5
–5
–10
–15
–20
–10
–15
–20
–25
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
5
6
7
8
9
10
11
12
13
14
15
0.01
1.01
2.01
3.01
4.01
5.01
6.01
7.01
8.01
LO FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 73. IF Return Loss vs. IF Frequency at LO Power Levels,
TA = 25°C, LO = 10 GHz
Figure 71. LO Return Loss vs. LO Frequency at LO = 13 dBm,
TA = 25°C
0
–5
–10
–15
–20
–25
–30
–35
–40
–45
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 72. RF Return Loss vs. RF Frequency at LO Power Levels,
A = 25°C, LO = 10 GHz
T
Rev. B | Page 19 of 25
HMC553ALC3B
Data Sheet
IF BANDWIDTH—DOWNCONVERTER, UPPER SIDEBAND
LO frequency = 8 GHz.
0
0
–5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–5
–10
–15
–20
–10
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
–15
–20
0.1
1.1
2.1
3.1
4.1
5.1
6.1
7.1
0.1
1.1
2.1
3.1
4.1
5.1
6.1
7.1
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 74. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 13 dBm
Figure 76. Conversion Gain vs. IF Frequency at Various LO Power Levels,
A = 25°C
T
30
25
20
15
30
25
20
15
10
5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
10
5
0
0.1
0
0.1
1.1
2.1
3.1
4.1
5.1
6.1
7.1
1.1
2.1
3.1
4.1
5.1
6.1
7.1
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 75. Input IP3 vs. IF Frequency at Various Temperatures,
LO = 13 dBm
Figure 77. Input IP3 vs. IF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. B | Page 20 of 25
Data Sheet
HMC553ALC3B
IF BANDWIDTH—DOWNCONVERTER, LOWER SIDEBAND
LO frequency = 13 GHz.
0
0
–5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
–5
–10
–15
–20
–10
–15
–20
0.1
1.1
2.1
3.1
4.1
5.1
6.1
7.1
0.1
1.1
2.1
3.1
4.1
5.1
6.1
7.1
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 78. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 13 dBm
Figure 80. Conversion Gain vs. IF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
30
25
20
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
15
10
5
15
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
10
5
0
0.1
0
1.1
2.1
3.1
4.1
5.1
6.1
7.1
0.1
1.1
2.1
3.1
4.1
5.1
6.1
7.1
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 79. Input IP3 vs. IF Frequency at Various Temperatures,
LO = 13 dBm
Figure 81. Input IP3 vs. IF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 21 of 25
HMC553ALC3B
Data Sheet
Upconversion, Upper Sideband
SPURIOUS AND HARMONICS PERFORMANCE
LO Harmonics
Spur values are (M × IFIN) + (N × LO). IFIN = 0.1 GHz, LO =
10 GHz, RF power = −10 dBm, and LO power = 13 dBm. Mixer
spurious products are measured in dBc from the RF output power
level. N/A means not applicable.
LO = 13 dBm, all values in dBc below input LO level and
measured at RF port. N/A means not applicable.
Table 5. LO Harmonics at RF
N × LO
N × LO Spur at RF Port (dBc)
0
1
2
3
4
LO Frequency (GHz)
1
2
3
4
N/A
N/A
N/A
N/A
N/A
N/A
36
99
86
81
51
0
96
94
83
59
35
10
36
58
84
92
94
64
62
75
72
22
27
20
68
76
84
84
61
−5
−4
−3
−2
−1
0
6
8
9
10
12
14
37
38
38
37
37
39
21
41
46
45
50
50
51
43
49
58
45
71
53
64
70
82
105
N/A
61
61
59
43
6
19
M × IFIN
0
N/A
N/A
N/A
N/A
N/A
+1
+2
+3
+4
+5
LO = 13 dBm, all values in dBc below input LO level and
measured at IF port. N/A means not applicable.
81
50
63
85
100
95
101
102
Table 6. LO Harmonics at IF
N × LO Spur at IF Port (dBc)
LO Frequency (GHz)
1
2
3
4
Upconversion, Lower Sideband
6
8
9
10
12
14
43
28
29
29
31
43
38
50
66
76
84
93
60
88
102
103
88
74
Spur values are (M × IFIN) + (N × LO).
104
109
108
10
IFIN = 0.1 GHz, LO = 14.1 GHz, RF power = −10 dBm, and
LO power = 13 dBm. Mixer spurious products are measured in
dBc from the RF output power level. N/A means not applicable.
107
N/A
N × LO
M × N Spurious Outputs
0
1
2
3
4
N/A
N/A
N/A
N/A
N/A
N/A
34
96
85
71
52
0
82
84
77
60
28
20
28
61
61
84
62
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
−5
−4
−3
−2
−1
0
Downconversion, Upper Sideband
Spur values are (M × RF) − (N × LO). RF = 10.1 GHz, LO =
10 GHz, RF power = −10 dBm, and LO power = 13 dBm. Mixer
spurious products are measured in dBc from the IF output power
level. N/A means not applicable.
8
M × IFIN
N × LO
0
+1
+2
+3
+4
+5
0
1
2
3
4
79
50
63
86
95
N/A
22
0.6
0
26
44
58
93
93
25
70
70
71
98
N/A
68
0
1
2
3
4
96
100
100
71
67
92
82
78
M × RF
84
91
N/A
101
Downconversion, Lower Sideband
Spur values are (M × RF) − (N × LO). RF = 14 GHz, LO =
14.1 GHz, RF power = −10 dBm, and LO power = 13 dBm.
Mixer spurious products are measured in dBc from the IF
output power level. N/A means not applicable.
N × LO
0
1
2
3
4
N/A
18
3
26
40
70
93
58
N/A
65
77
74
95
N/A
N/A
56
0
1
2
3
4
0
55
72
57
N/A
M × RF
N/A
N/A
89
101
Rev. B | Page 22 of 25
Data Sheet
HMC553ALC3B
THEORY OF OPERATION
The HMC553ALC3B is a general-purpose, double-balanced
mixer that can be used as an upconverter or a downconverter
from 6 GHz to 14 GHz.
When used as an upconverter, the mixer upconverts intermediate
frequencies between dc and 5 GHz to radio frequencies between
6 GHz and 14 GHz.
When used a downconverter, the HMC553ALC3B downconverts
radio frequencies (RF) between 6 GHz and 14 GHz to intermediate
frequencies (IF) between dc and 5 GHz.
Rev. B | Page 23 of 25
HMC553ALC3B
Data Sheet
APPLICATIONS INFORMATION
TYPICAL APPLICATION CIRCUIT
EVALUATION PCB INFORMATION
Figure 82 shows the typical application circuit for the
Use RF circuit design techniques for the circuit board used in
the application. Ensure that signal lines have 50 Ω impedance,
and connect the package ground leads and the exposed pad
directly to the ground plane (see Figure 83). Use a sufficient
number of via holes to connect the top and bottom ground
planes. The evaluation circuit board shown in Figure 83 is
available from Analog Devices, Inc., upon request.
HMC553ALC3B. The HMC553ALC3B is a passive device and
does not require any external components. The LO and RF pins
are internally ac-coupled. The IF pin is internally dc-coupled.
When IF operation to dc is not required, use of an external
series capacitor is recommended, of a value chosen to pass the
necessary IF frequency range. When IF operation to dc is
required, do not exceed the IF source and sink current rating
specified in the Absolute Maximum Ratings section.
Table 7. List of Materials for Evaluation PCB
EV1HMC553ALC3B
Item
J1, J2
J3
U1
PCB1
Description
SRI 2.92 mm connector
Johnson Surface-Mount Type A (SMA) connector
HMC553ALC3B
12
11 10
HMC553ALC3B
GND
LO
GND
RF
9
8
7
1
2
3
LO
RF
117611-7 evaluation board
GND
GND
1 117611-7 is the raw bare PCB identifier. Reference EV1HMC553ALC3B when
ordering the complete evaluation PCB.
4
5
6
IF
Figure 82. Typical Application Circuit
LO
RF
117611–7
553A
J2
J1
IF
U1
J3
Figure 83. Evaluation PCB Top Layer
Rev. B | Page 24 of 25
Data Sheet
HMC553ALC3B
OUTLINE DIMENSIONS
3.05
2.90 SQ
2.75
0.36
0.30
0.24
0.08
BSC
PIN 1
INDICATOR
10
12
PIN 1
9
1
3
0.50
BSC
1.60
1.50 SQ
1.40
EXPOSED
PAD
7
6
4
0.32
BSC
BOTTOM VIEW
TOP VIEW
SIDE VIEW
1.00 REF
2.10 BSC
0.90
0.80
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SEATING
PLANE
SECTION OF THIS DATA SHEET.
Figure 84. 12-Terminal Ceramic Leadless Chip Carrier (LCC)
(E-12-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range Moisture Sensitivity Level (MSL) Rating2 Package Description
Package Option
HMC553ALC3B
HMC553ALC3BTR
HMC553ALC3BTR-R5 −40°C to +85°C
EV1HMC553ALC3B
−40°C to +85°C
−40°C to +85°C
MSL3
MSL3
MSL3
12-Terminal Ceramic LCC
E-12-4
E-12-4
E-12-4
12-Terminal Ceramic LCC
12-Terminal Ceramic LCC
Evaluation PCB Assembly
1 All models are RoHS compliant.
2 The peak reflow temperature is 260°C. See the Absolute Maximum Ratings section, Table 2.
©2018–2019 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D16420-0-3/19(B)
Rev. B | Page 25 of 25
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