HMC525ALC4TR [ADI]
4 GHz to 8.5 GHz, GaAs, MMIC, I/Q Mixer;
| 型号： | HMC525ALC4TR |
| 厂家： | 
ADI |
| 描述： | 4 GHz to 8.5 GHz, GaAs, MMIC, I/Q Mixer |
| 文件： | 总28页 (文件大小：498K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
4 GHz to 8.5 GHz,
GaAs, MMIC, I/Q Mixer
Data Sheet
HMC525ALC4
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Passive: no dc bias required
Conversion loss: 8 dB (typical)
Input IP3: 20 dBm (typical)
HMC525ALC4
NIC 1
NIC 2
NIC
18
17 NIC
GND
LO to RF isolation: 47 dB (typical)
IF frequency range: dc to 3.5 GHz
RoHS compliant, 24-terminal, 4 mm × 4 mm LCC package
90° HYBRID
GND 3
16
4
15 LO
RF
GND 5
14 GND
NIC
13
6
NIC
APPLICATIONS
PACKAGE
BASE
Microwave and very small aperture terminal radios
Test equipment
GND
Point to point radios
Military electronic warfare; electronic countermeasure; and
command, control, communications, and intelligence
Figure 1.
GENERAL DESCRIPTION
The HMC525ALC4 is a compact gallium arsenide (GaAs),
monolithic microwave integrated circuit (MMIC), in phase
quadrature (I/Q) mixer in a 24-terminal, RoHS compliant, ceramic
leadless chip carrier (LCC) package. The device can be used as
either an image reject mixer or a single sideband (SSB)
upconverter. The mixer uses two standard double balanced
mixer cells and a 90° hybrid fabricated in a GaAs, metal
semiconductor field effect transistor (MESFET) process. The
HMC525ALC4 is a much smaller alternative to a hybrid style
image reject mixer and a SSB upconverter assembly. The
HMC525ALC4 eliminates the need for wire bonding, allowing the
use of surface-mount manufacturing techniques.
Rev. A
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rightsof third parties that may result fromits use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks andregisteredtrademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Technical Support
©2018 Analog Devices, Inc. All rights reserved.
www.analog.com
HMC525ALC4
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Upconverter Performance......................................................... 12
Phase and Amplitude Balance—Downconverter................... 18
Isolation and Return Loss ......................................................... 20
IF Bandwidth—Downconverter............................................... 22
Spurious and Harmonics Performance ................................... 24
Theory of Operation ...................................................................... 25
Applications Information .............................................................. 26
Typical Application Circuit....................................................... 26
Evaluation PCB Information .................................................... 26
Soldering Information and Recommended Land Pattern.... 27
Outline Dimensions....................................................................... 28
Ordering Guide .......................................................................... 28
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6
Downconverter Performance...................................................... 6
REVISION HISTORY
5/2018—Rev. 0 to Rev. A
Changes to Typical Application Circuit Section......................... 26
4/2018—Revision 0: Initial Version
Rev. A | Page 2 of 28
Data Sheet
HMC525ALC4
SPECIFICATIONS
LO = 15 dBm, intermediate frequency (IF) = 100 MHz, RF = −10 dBm, TA = 25°C, unless otherwise noted. All measurements were made
as downconverter with lower sideband selected (high-side LO) and an external 90° IF hybrid at the IF ports, unless otherwise noted.
Table 1.
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
FREQUENCY RANGE
RF
LO Input
4
4
DC
13
8.5
8.5
3.5
17
GHz
GHz
GHz
dBm
IF
LO AMPLITUDE
4 GHz to 8.5 GHz PERFORMANCE
Downconverter
Conversion Loss
Noise Figure
Input Third-Order Intercept (IP3)
Input Power for 1dB Compression (P1dB)
Image Rejection
Upconverter
Conversion Loss
Input IP3
Input P1dB
Sideband Rejection
Isolation
LO to RF
LO to IF
15
Taken as image reject mixer
8
8
20
13
30
11
dB
dB
dBm
dBm
dBc
17
23
Taken as SSB upconverter mixer
7.5
20
8.5
30
dB
dBm
dBm
dBc
Taken without external 90° IF hybrid
Taken without external 90° IF hybrid
Taken as image reject mixer
35
47
23
42
dB
dB
dB
RF to IF
Balance
Phase
Amplitude
2
0.05
Degree
dB
4.5 GHz to 6 GHz PERFORMANCE
Downconverter
Conversion Loss
Noise Figure
Input IP3
7.5
7.5
21
12
30
9.5
dB
dB
dBm
dBm
dBc
17
25
Input P1dB
Image Rejection
Upconverter
Conversion Loss
Input IP3
Input P1dB
Sideband Rejection
Isolation
LO to RF
LO to IF
RF to IF
Balance
Taken as SSB upconverter mixer
7
dB
22
10.5
30
dBm
dBm
dBc
Taken without external 90° IF hybrid
Taken without external 90° IF hybrid
35
45
21
40
dB
dB
dB
Phase
Amplitude
3
0.15
Degree
dB
Rev. A | Page 3 of 28
HMC525ALC4
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Parameter
Rating
20 dBm
25 dBm
20 dBm
2 mA
260°C
175°C
>1 × 106 hours
3
560 mW
RF Input Power
LO Input Power
IF Input Power
θ
JA is the natural convection junction to ambient thermal
IF Source and Sink Current
Reflow Temperature
Maximum Junction Temperature (TJ)
Lifetime at Maximum (TJ)
Moisture Sensitivity Level (MSL)1
Continuous Power Dissipation, PDISS (TA =
85°C, Derate 6.22 mW/°C Above 85°C)2
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range
resistance measured in a one cubic foot sealed enclosure. θJC is
the junction to case thermal resistance.
Table 3. Thermal Resistance
Package Type
θJA
θJC
Unit
E-24-11
120
161
°C/W
1 See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
−40°C to +85°C
−65°C to +150°C
−65°C to +150°C
ESD CAUTION
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
Field Induced Charged Device Model
(FICDM)
250 V
500 V
1 Based on IPC/JEDEC J-STD-20 MSL Classifications.
2 PDISS is a theoretical number calculated by (TJ − 85°C)/θJC
.
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any
other conditions above those indicated in the operational section of
this specification is not implied. Operation beyond the maximum
operating conditions for extended periods may affect product
reliability.
Rev. A | Page 4 of 28
Data Sheet
HMC525ALC4
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
NIC
NIC
1
2
3
4
5
6
18 NIC
NIC
17
16 GND
HMC525A
GND
RF
TOP VIEW
LO
15
14
(Not to Scale)
GND
GND
NIC
13 NIC
NOTES
1. NIC = NOT INTERNALY CONNECTED.
2. EXPOSED PAD. THE EXPOSED PAD
MUST BE CONNECTED TO THE GND PIN.
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic Description
1, 2, 6 to 8, 10,
13, 17 to 24
NIC
Not Internally Connected.
3, 5, 12, 14, 16
4
GND
RF
Ground. See Figure 7 for the GND interface schematic.
RF Port. This pin is ac-coupled internally and matches to 50 Ω from 4 GHz to 8.5 GHz. See Figure 3 for the RF
interface schematic.
9, 11
IF1, IF2
First and Second Quadrature Intermediate Frequency Input Pins. These pins are dc-coupled. For applications
that do not require operation to dc, use an off-chip dc blocking capacitor. For applications that require
operation to dc, these pins must not source or sink more than 2 mA of current because the device may not
function or possible device failure may result. See Figure 5 and Figure 6 for the IF1 and IF2 interface schematics.
15
LO
EPAD
Local Oscillator Port. This pin is ac-coupled and matches to 50 Ω. See Figure 4 for the LO interface schematic.
Exposed Pad. The exposed pad must be connected to the GND pin.
INTERFACE SCHEMATICS
IF2
RF
Figure 3. RF Interface Schematic
Figure 6. IF2 Interface Schematic
GND
LO
Figure 4. LO Interface Schematic
Figure 7. GND Interface Schematic
IF1
Figure 5. IF1 Interface Schematic
Rev. A | Page 5 of 28
HMC525ALC4
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE
IF = 100 MHz, Upper Side Band (Low-Side LO)
Data taken as image reject mixer with external 90° hybrid at the IF ports.
0
0
–5
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
–5
–10
–15
–20
–10
–15
–20
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 8. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 11. Conversion Gain vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
0
0
–10
–20
–30
–40
–50
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
–10
–20
–30
–40
–50
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 9. Image Rejection vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 12. Image Rejection vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
20
20
15
10
5
LO = 13dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 15dBm
LO = 17dBm
LO = 19dBm
15
10
5
0
0
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 10. Noise Figure vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 13. Noise Figure vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. A | Page 6 of 28
Data Sheet
HMC525ALC4
IF = 100 MHz, Upper Side Band (Low-Side LO)
Data taken as image reject mixer with external 90° hybrid at the IF ports.
40
40
35
30
25
20
15
10
5
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
35
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
30
25
20
15
10
5
0
0
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 14. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 17. Input IP3 vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
80
80
70
60
50
40
30
20
10
0
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
70
60
50
40
30
20
10
0
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 15. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 18. Input IP2 vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
20
15
10
5
20
15
10
5
LO = 13dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 15dBm
LO = 17dBm
LO = 19dBm
0
0
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 16. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 19. Input P1dB vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. A | Page 7 of 28
HMC525ALC4
Data Sheet
IF = 100 MHz, Lower Side Band (High-Side LO)
Data taken as image reject mixer with external 90° hybrid at the IF ports.
0
0
–5
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
–5
–10
–15
–20
–10
–15
–20
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 20. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 23. Conversion Gain vs. RF Frequency at Various LO Power Levels,
T
A = 25°C
0
0
–10
–20
–30
–40
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
–10
–20
–30
–40
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 21. Image Rejection vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 24. Image Rejection vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
20
20
15
10
5
LO = 13dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 15dBm
LO = 17dBm
LO = 19dBm
15
10
5
0
0
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 22. Noise Figure vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 25. Noise Figure vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. A | Page 8 of 28
Data Sheet
HMC525ALC4
IF = 100 MHz, Lower Side Band (High-Side LO)
Data taken as image reject mixer with external 90° hybrid at the IF ports.
40
40
35
30
25
20
15
10
5
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
35
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
30
25
20
15
10
5
0
0
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 26. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 29. Input IP3 vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
80
70
60
50
80
70
60
50
40
30
20
10
0
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
40
30
20
10
0
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 27. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 30. Input IP2 vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
20
15
10
5
20
15
10
5
LO = 13dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 15dBm
LO = 17dBm
LO = 19dBm
0
0
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 28. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 31. Input P1dB vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. A | Page 9 of 28
HMC525ALC4
Data Sheet
IF = 2500 MHz, Upper Side Band (Low-Side LO)
Data taken as image reject mixer with external 90° hybrid at the IF ports.
0
0
–5
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
–5
–10
–15
–20
–10
–15
–20
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 32. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 35. Conversion Gain vs. RF Frequency at Various LO Power Levels,
T
A = 25°C
40
40
35
30
25
20
15
10
5
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
35
30
25
20
15
10
5
0
0
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 33. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 36. Input IP3 vs. RF Frequency at Various LO Power Levels,
T
A = 25°C
0
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 34. Image Rejection vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 37. Image Rejection vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. A | Page 10 of 28
Data Sheet
HMC525ALC4
IF = 2500 MHz, Lower Side Band (High-Side LO)
Data taken as image-reject mixer with external 90° hybrid at the IF ports.
0
0
–5
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
–5
–10
–15
–20
–10
–15
–20
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 38. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 41. Conversion Gain vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
40
40
35
30
25
20
15
10
5
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
35
30
25
20
15
10
5
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
0
0
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 39. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 42. Input IP3 vs. RF Frequency Various LO Power Levels,
T
A = 25°C
0
–10
–20
–30
–40
–50
–60
0
–10
–20
–30
–40
–50
–60
T
T
T
= –40°C
= +25°C
= +85°C
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
A
A
A
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 40. Image Rejection vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 43. Image Rejection vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. A | Page 11 of 28
HMC525ALC4
Data Sheet
UPCONVERTER PERFORMANCE
IFIN = 100 MHz, Upper Side Band (Low-Side LO)
Data taken as single sideband upconverter with external 90° hybrid at the IF ports.
0
–5
0
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
–5
–10
–15
–20
–10
–15
–20
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 44. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 46. Conversion Gain vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
0
0
–10
–20
–30
–40
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
–10
–20
–30
–40
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 45. Sideband Rejection vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 47. Sideband Rejection vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. A | Page 12 of 28
Data Sheet
HMC525ALC4
IFIN = 100 MHz, Upper Side Band (Low-Side LO)
Data taken as single sideband upconverter with external 90° hybrid at the IF ports.
40
35
30
25
20
15
10
5
40
35
30
25
20
15
10
5
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
0
0
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 48. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 50. Input IP3 vs. RF Frequency at LO Power Levels,
T
A = 25°C
20
20
15
10
5
LO = 13dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 15dBm
LO = 17dBm
LO = 19dBm
15
10
5
0
0
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 49. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 51. Input P1dB vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. A | Page 13 of 28
HMC525ALC4
Data Sheet
IFIN = 100 MHz, Lower Side Band (High-Side LO)
Data taken as single sideband upconverter with external 90° hybrid at the IF ports.
0
0
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
–5
–5
–10
–10
–15
–20
T
T
T
= –40°C
A
A
A
=
+25°C
= +85°C
–15
–20
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 52. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 54. Conversion Gain vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
0
0
–10
–20
–30
–40
–50
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
–10
–20
–30
–40
–50
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 53. Sideband Rejection vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 55. Sideband Rejection vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. A | Page 14 of 28
Data Sheet
HMC525ALC4
IFIN = 100 MHz, Lower Side Band (High-Side LO)
Data taken as single sideband upconverter with external 90° hybrid at the IF ports.
40
35
30
25
20
15
10
5
40
35
30
25
20
15
10
5
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
0
0
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 56. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 58. Input IP3 vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
20
20
15
10
5
LO = 13dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 15dBm
LO = 17dBm
LO = 19dBm
15
10
5
0
0
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 57. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 59. Input P1dB vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. A | Page 15 of 28
HMC525ALC4
Data Sheet
IFIN = 2500 MHz, Upper Side Band (Low-Side LO)
Data taken as single sideband upconverter with external 90° hybrid at the IF ports.
0
0
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
–5
–5
–10
–15
–20
–10
–15
–20
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 60. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 63. Conversion Gain vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
40
35
40
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
30
25
20
15
10
5
30
25
20
15
10
5
0
0
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 61. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 64. Input IP3 vs. RF Frequency at Various LO Power Levels,
T
A = 25°C
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 62. Sideband Rejection vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 65. Sideband Rejection vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. A | Page 16 of 28
Data Sheet
HMC525ALC4
IFIN = 2500 MHz, Lower Side Band (High-Side LO)
Data taken as single sideband upconverter with external 90° hybrid at the IF ports.
0
0
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
–5
–5
–10
–15
–20
–10
–15
–20
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 66. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 69. Conversion Gain vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
40
35
30
25
20
15
10
5
40
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
35
30
25
20
15
10
5
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
0
0
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 70. Input IP3 vs. RF Frequency at Various LO Power Levels,
Figure 67. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 15 dBm
T
A = 25°C
0
–10
–20
–30
–40
0
–10
–20
–30
–40
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 71. Sideband Rejection vs. RF Frequency at Various LO Power Levels,
A = 25°C
Figure 68. Sideband Rejection vs. RF Frequency at Various Temperatures,
LO = 15 dBm
T
Rev. A | Page 17 of 28
HMC525ALC4
Data Sheet
PHASE AND AMPLITUDE BALANCE—DOWNCONVERTER
Upper Sideband, IF = 100 MHz
5
5
4
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
4
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
3
2
3
2
1
1
0
0
–1
–2
–3
–4
–5
–1
–2
–3
–4
–5
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 72. Amplitude Balance vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 74. Amplitude Balance vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
10
10
8
LO = 13dBm
8
6
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 15dBm
LO = 17dBm
LO = 19dBm
6
4
4
2
2
0
0
–2
–4
–6
–8
–10
–2
–4
–6
–8
–10
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 73. Phase Balance vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 75. Phase Balance vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. A | Page 18 of 28
Data Sheet
HMC525ALC4
Lower Sideband, IF = 100 MHz
5
5
4
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
4
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
3
2
3
2
1
1
0
0
–1
–2
–3
–4
–5
–1
–2
–3
–4
–5
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 76. Amplitude Balance vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 78. Amplitude Balance vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
10
10
8
LO = 13dBm
8
6
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 15dBm
LO = 17dBm
LO = 19dBm
6
4
4
2
2
0
0
–2
–4
–6
–8
–10
–2
–4
–6
–8
–10
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 77. Phase Balance vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 79. Phase Balance vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. A | Page 19 of 28
HMC525ALC4
Data Sheet
ISOLATION AND RETURN LOSS
Downconverter performance at IF = 100 MHz, upper sideband (low-side LO).
70
70
60
50
40
30
20
10
0
T
T
T
= –40°C
= +25°C
= +85°C
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
A
A
A
60
50
40
30
20
10
0
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 83. LO to RF Isolation vs. RF Frequency at Various LO Power levels,
A = 25°C
Figure 80. LO to RF Isolation vs. RF Frequency at Various Temperatures,
LO = 15 dBm
T
70
60
50
40
30
20
10
0
70
LO TO IF1, 13dBm
LO TO IF1, 15dBm
LO TO IF1, 17dBm
LO TO IF1, 19dBm
LO TO IF2, 13dBm
LO TO IF2, 15dBm
LO TO IF2, 17dBm
LO TO IF1, 19dBm
LO TO IF1, T = –40°C
A
60
50
40
30
20
10
0
LO TO IF1, T = +25°C
A
LO TO IF1, T = +85°C
A
LO TO IF2, T = –40°C
A
LO TO IF2, T = +25°C
A
LO TO IF2, T = +85°C
A
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 84. LO to IF Isolation vs. RF Frequency at Various LO Power Levels,
A = 25°C
Figure 81. LO to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 15 dBm
T
70
60
50
40
30
20
10
0
70
60
50
40
30
RF TO IF1, 13dBm
RF TO IF1, 15dBm
RF TO IF1, 17dBm
RF TO IF1, 19dBm
RF TO IF2, 13dBm
RF TO IF2, 15dBm
RF TO IF2, 17dBm
RF TO IF1, 19dBm
RF TO IF1, T = –40°C
A
RF TO IF1, T = +25°C
A
20
10
0
RF TO IF1, T = +85°C
A
RF TO IF2, T = –40°C
A
RF TO IF2, T = +25°C
A
RF TO IF2, T = +85°C
A
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
RF FREQUENCY (GHz)
Figure 85. RF to IF Isolation vs. RF Frequency at Various LO Power Levels,
A = 25°C
Figure 82. RF to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 15 dBm
T
Rev. A | Page 20 of 28
Data Sheet
HMC525ALC4
0
0
–10
–20
–30
–40
–50
–60
–10
–20
–30
–40
IF1, LO = 13dBm
IF1, LO = 15dBm
IF1, LO = 17dBm
IF1, LO = 19dBm
IF2, LO = 13dBm
IF2, LO = 15dBm
IF2, LO = 17dBm
IF2, LO = 19dBm
0.1
0.6
1.1
1.6
2.1
2.6 3.1
3.6
4.1
4.6
5.1
2
3
4
5
6
7
8
9
10
IF FREQUENCY (GHz)
LO FREQUENCY (GHz)
Figure 88. IF Return Loss vs. IF Frequency at Various LO Power Levels,
LO = 5 GHz, TA = 25°C
Figure 86. LO Return Loss vs. LO Frequency at LO = 15 dBm,
A = 25°C
T
0
–10
–20
–30
–40
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
2
3
4
5
6
7
8
9
10
RF FREQUENCY (GHz)
Figure 87. RF Return Loss vs. RF Frequency at Various LO Power Levels,
LO = 5 GHz, TA = 25°C
Rev. A | Page 21 of 28
HMC525ALC4
Data Sheet
IF BANDWIDTH—DOWNCONVERTER
LO = 5 GHz, Upper Side Band
Data taken as image-reject mixer with external 90° hybrid at the IF ports.
0
0
–5
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
–5
–10
–15
–20
–10
–15
–20
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 89. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 15 dBm
Figure 92. Conversion Gain vs. IF Frequency at Various LO Power Levels,
A = 25°C
T
0
0
–10
–20
–30
–40
–50
–60
–70
–80
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
–10
–20
–30
–40
–50
–60
–70
–80
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 90. Image Rejection vs. IF Frequency at Various Temperatures,
LO = 15 dBm
Figure 93. Image Rejection vs. IF Frequency at Various LO Power Levels,
A = 25°C
T
30
25
20
15
10
5
30
25
20
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
15
10
5
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 94. Input IP3 vs. IF Frequency at Various LO Power Levels,
A = 25°C
Figure 91. Input IP3 vs. IF Frequency at Various Temperatures,
LO = 15 dBm
T
Rev. A | Page 22 of 28
Data Sheet
HMC525ALC4
LO = 8 GHz, Lower Side Band
Data taken as image reject mixer with external 90° hybrid at the IF ports.
0
0
–5
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
–5
–10
–15
–20
–10
–15
–20
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
IF FRREEQQUUEENNCCYY ((GGHHzz))
IF FREQUENCY (GHz)
Figure 95. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 15 dBm
Figure 98. Conversion Gain vs. IF Frequency at Various LO Power Levels,
A = 25°C
T
0
0
–10
–20
–30
–40
–50
–60
–70
–80
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
–10
–20
–30
–40
–50
–60
–70
–80
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 96. Image Rejection vs. IF Frequency at Various Temperatures,
LO = 15 dBm
Figure 99. Image Rejection vs. IF Frequency at Various LO Power Levels,
A = 25°C
T
30
25
20
15
30
25
20
15
10
5
T
T
T
= –40°C
= +25°C
= +85°C
A
A
A
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
10
5
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 97. Input IP3 vs. IF Frequency at Various Temperatures,
LO = 15 dBm
Figure 100. Input IP3 vs. IF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. A | Page 23 of 28
HMC525ALC4
Data Sheet
Upconverter Performance
SPURIOUS AND HARMONICS PERFORMANCE
LO Harmonics
Mixer spurious products are measured in dBc from the RF output
power level (M × IFIN + N × LO). N/A means not applicable.
LO = 15 dBm, and all values in dBc below input LO level measured
at RF port.
IFIN = 0.1 GHz, LO = 5.5 GHz, RF power = −10 dBm, and
LO power = 15 dBm.
Table 5. LO Harmonics at RF Port
N × LO
N
LO Spur at RF Port
0
1
2
3
4
LO Frequency (GHz)
1
2
3
4
−5
−4
−3
−2
−1
+0
+1
+2
+3
+4
+5
99
95
85
59
48
0
96
91
75
62
32
27
32
66
76
94
94
92
92
87
68
45
28
43
68
85
94
90
92
91
86
56
51
15
51
55
88
90
90
2.5
3.5
4.5
5.5
6.5
7.5
60
48
43
42
43
47
54
42
39
65
70
77
64
68
62
91
76
66
66
91
88
75
80
92
100
98
95
80
M × IFIN
N/A
80
9.4
0
LO = 15 dBm, and all values in dBc below input LO level measured
at IF port.
96
48
55
84
96
100
100
98
Table 6. LO Harmonics at IF Port
NLO Spur at IF Port
LO Frequency (GHz)
1
2
3
4
IFIN = 0.1 GHz, LO = 7.5 GHz, RF power = −10 dBm, and
LO power = 15 dBm.
2.5
3.5
4.5
5.5
6.5
7.5
24
20
20
22
30
34
54
47
47
22
89
93
42
46
65
62
80
95
59
82
91
73
104
117
N × LO
0
1
2
3
4
−5
−4
−3
−2
−1
0
102
101
101
100
79
95
87
61
50
0
95
94
82
74
41
44
44
74
85
95
93
92
90
78
67
30
26
28
65
81
89
91
81
81
83
60
55
17
54
60
83
82
81
M × N Spurious Outputs
Downconverter Performance
Mixer spurious products are measured in dBc from the IF output
power level (M × RF − N × LO). N/A means not applicable.
M × IFIN
N/A
79
12
0
+1
+2
+3
+4
+5
RF = 5.6 GHz, LO = 5.5 GHz, RF power = −10 dBm, and
LO power = 15 dBm.
102
102
100
101
49
58
87
97
N × LO
0
1
2
3
4
0
1
2
3
4
0
−14
0
+37
+39
+66
+84
+93
+32
+48
+58
+80
+94
+50
+66
+93
+85
+99
+32
+89
+92
+85
M × RF
+59
+93
+91
RF = 7.4 GHz, LO = 7.5 GHz, RF power = −10 dBm, and
LO power = 15 dBm.
N × LO
0
1
2
3
4
0
1
2
3
4
0
−12
0
+32
+45
+72
+88
+87
+29
+48
+56
+72
+90
+40
+59
+92
+90
+93
+32
+84
+89
+76
M × RF
+55
+92
+56
Rev. A | Page 24 of 28
Data Sheet
HMC525ALC4
THEORY OF OPERATION
The HMC525ALC4 is a compact GaAs, MMIC, I/Q mixer in a
24-terminal, RoHS compliant, ceramic LCC package. The
device can be used as either an image reject mixer or a SSB
upconverter. The mixer uses two standard double balanced
mixer cells and a 90° hybrid fabricated in a GaAs, MESFET
process. This device is a much smaller alternative to a hybrid
style image reject mixer and a SSB upconverter assembly. The
HMC525ALC4 eliminates the need for wire bonding, allowing
the use of the surface-mount manufacturing techniques.
Rev. A | Page 25 of 28
HMC525ALC4
Data Sheet
APPLICATIONS INFORMATION
TYPICAL APPLICATION CIRCUIT
EVALUATION PCB INFORMATION
Figure 101 shows the typical application circuit for the
HMC525ALC4. To select the appropriate sideband, an external
90° degree hybrid is needed. For applications not requiring
operation to dc, use an off-chip dc blocking capacitor. For
applications that require suppression of the LO signal at the
output, use a bias tee or RF feed as shown in Figure 101. Ensure
that the source or sink current used for LO suppression is
<2 mA for each IF port to prevent damage to the device. The
common-mode voltage for each IF port is 0 V.
Use RF circuit design techniques for the circuit board used in
the application. Ensure that signal lines have 50 Ω impedance
and connect the package ground leads and the exposed pad
directly to the ground plane (see Figure 103). Use a sufficient
number of via holes to connect the top and bottom ground planes.
The evaluation circuit board shown in Figure 103 is available
from Analog Devices, Inc., upon request.
Table 7. Materials for Evaluation PCB EV1HMC525ALC4
Item
PCB1
J1, J2
Description
To select the upper sideband when using as an upconverter,
connect the IF1 pin to the 90° port of the hybrid, and connect
the IF2 pin to the 0° port of the hybrid. To select the lower
sideband, connect IF1 to the 0° port of the hybrid and IF2 to the
90° port of the hybrid. The input is from the sum port of the
hybrid and the difference port is 50 Ω terminated.
PCB, 109996-1
2.92 mm SubMiniature Version A (SMA) connectors, SRI
connector gage
J3, J4
U1
Gold plated SMA, edge mount with 0.02 inch pin
connectors, Johnson SMA connectors
Device under test, HMC525ALC4
To select the upper sideband (low-side LO) when using as
downconverter, connect the IF1 pin to the 0° port of the hybrid,
and connect the IF2 pin to the 90° port of the hybrid. To select
the lower sideband (high-side LO), connect the IF1 pin to the
90° port of the hybrid and IF2 to the 0° port of the hybrid. The
output is from the sum port of the hybrid, and the difference
port is 50 Ω terminated.
1 109996-1 is the raw bare PCB identifier. Reference EV1HMC525ALC4 when
ordering complete evaluation PCB.
1
2
3
4
5
6
90°
HYBRID
18
17
16
15
14
13
RF
LO
PACKAGE
BASE
IF1
IF2
GND
BIAS TEE/
DC FEED FOR IF1
BIAS TEE/
DC FEED FOR IF2
DC BLOCKING
CAPACITORS
SUPPLY
FOR IF1
SUPPLY
FOR IF2
EXTERNAL
90° HYBRID
50Ω
IF
NOTES
1. DASHED SECTIONS ARE OPTIONAL AND MEANT FOR LO NULLING.
Figure 101. Typical Application Circuit
Rev. A | Page 26 of 28
Data Sheet
HMC525ALC4
electrical performance, solder the pad to the low impedance
ground plane on the PCB. It is recommended that the ground
planes on all layers under the pad be stitched together with vias,
to further reduce thermal impedance. The land pattern on the
EV1HMC525ALC4 evaluation board provides a simulated
thermal resistance (θJC) of 161° C /W.
SOLDERING INFORMATION AND RECOMMENDED
LAND PATTERN
Figure 102 shows the recommended land pattern for the
HMC525ALC4. The HMC525ALC4 is contained in a 4 mm ×
4 mm, 24-terminal, ceramic LCC package, with an exposed
ground pad (EPAD). This pad is internally connected to the
ground of the chip. To minimize thermal impedance and ensure
.178" SQUARE
.004" MASK/METAL OVERLAP
.010" MIN MASK WIDTH
SOLDERMASK
GROUND PAD
PAD SIZE
.026" × .010"
PIN 1
.0197"
[0.50]
.116"
MASK
.034"
TYPICAL
VIA
OPENING
SPACING
ᶲ .010"
TYPICAL VIA
.010" REF
.030"
MASK OPENING
.098" SQUARE MASK OPENING
.020 × 45" CHAMFER FOR PIN 1
.106" SQUARE
GROUND PAD
Figure 102. Evaluation Board Land Pattern for the HMC525ALC4 Package
Figure 103. Evaluation PCB Top Layer
Rev. A | Page 27 of 28
HMC525ALC4
Data Sheet
OUTLINE DIMENSIONS
4.05
3.90 SQ
3.75
0.36
0.30
0.24
PIN 1
0.08
BSC
INDICATOR
PIN 1
24
19
18
1
0.50
BSC
2.60
2.50 SQ
2.40
EXPOSED
PAD
13
6
12
7
BOTTOM VIEW
2.50 REF
0.32
BSC
TOP VIEW
SIDE VIEW
1.00
0.90
0.80
3.10 BSC
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SEATING
PLANE
SECTION OF THIS DATA SHEET.
Figure 104. 24-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-24-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
Package Option
HMC525ALC4
24-Terminal Ceramic LCC
24-Terminal Ceramic LCC
24-Terminal Ceramic LCC
Evaluation PCB Assembly
E-24-1
E-24-1
E-24-1
HMC525ALC4TR
HMC525ALC4TR-R5
EV1HMC525ALC4
1 The HMC525ALC4, HMC525ALC4TR, and HMC525ALC4TR-R5 are RoHS compliant.
©2018 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D16401-0-5/18(A)
Rev. A | Page 28 of 28
相关型号：
HMC525LC4TR
Image Rejection Mixer, 4000MHz Min, 8500MHz Max, 11dB Conversion Loss-Max, 4 X 4 MM, ROHS COMPLIANT, LEADLESS, ALUMINUM, SMT, 24 PIN
HITTITE
©2020 ICPDF网 联系我们和版权申明