HMC329ALC3BTR-R5 [ADI]
24 GHz to 32 GHz, GaAs, MMIC, Double Balanced Mixer;
| 型号： | HMC329ALC3BTR-R5 |
| 厂家： | 
ADI |
| 描述： | 24 GHz to 32 GHz, GaAs, MMIC, Double Balanced Mixer 局域网 射频 微波 |
| 文件： | 总23页 (文件大小：376K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
24 GHz to 32 GHz, GaAs, MMIC,
Double Balanced Mixer
HMC329ALC3B
Data Sheet
FEATURES
FUNCTIONAL BLOCK DIAGRAM
HMC329ALC3B
Conversion loss (downconverter): 11 dB typical
LO to RF isolation: 36.5 dB typical for 24 GHz to 30 GHz
performance
12 11 10
Input IP3 (downconverter): 20 dBm typical
12-terminal, RoHS compliant, 3 mm × 3 mm LCC package
1
2
3
9
8
7
GND
RF
GND
LO
APPLICATIONS
GND
GND
Microwave and very small aperture terminal (VSAT) radios
Test equipment
4
5
6
PACKAGE
BASE
Military electronic warfare (EW)
GND
Electronic countermeasure (ECM)
Figure 1.
Command, control, communications, and intelligence (C3I)
GENERAL DESCRIPTION
The HMC329ALC3B is a general-purpose, double balanced
mixer in a leadless, RoHS compliant, surface-mount technology
(SMT) package that can be used as an upconverter or down-
converter between 24 GHz and 32 GHz. This mixer is fabricated
in a gallium arsenide (GaAs), monolithic microwave integrated
circuit (MMIC) process and requires no external components
or matching circuitry. The HMC329ALC3B provides excellent local
oscillator (LO) to radio frequency (RF) and LO to intermediate
frequency (IF) suppression due to optimized balun preliminary
structures. The mixer operates with LO amplitude above 9 dBm.
The RoHS compliant HMC329ALC3B eliminates the need for
wire bonding, allowing the use of surface-mount manufacturing
techniques.
Rev. 0
Document Feedback
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rightsof third parties that may result fromits use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks andregisteredtrademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Technical Support
©2018 Analog Devices, Inc. All rights reserved.
www.analog.com
HMC329ALC3B
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Downconverter Performance, IF = 1000 MHz..........................6
Downconverter Performance, IF = 8000 MHz....................... 10
Upconverter Performance, IF = 1000 MHz............................ 12
Upconverter Performance, IF = 8000 MHz............................ 14
IF Bandwidth—Downconverter............................................... 18
Spurious and Harmonics Performance ................................... 20
Theory of Operation ...................................................................... 21
Applications Information .............................................................. 22
Typical Application Circuit....................................................... 22
Evaluation PCB Information .................................................... 22
Outline Dimensions....................................................................... 23
Ordering Guide .......................................................................... 23
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6
REVISION HISTORY
5/2018—Revision 0: Initial Version
Rev. 0 | Page 2 of 23
Data Sheet
HMC329ALC3B
SPECIFICATIONS
TA = 25°C, IF = 1000 MHz, LO = 13 dBm for the upper sideband, unless otherwise noted. All measurements performed as a downconverter,
unless otherwise noted, on the evaluation printed circuit board (PCB).
Table 1.
Parameter
Symbol
Min
Typ
Max
Unit
FREQUENCY RANGE
RF Pin
IF Pin
24
DC
24
9
32
8
32
15
GHz
GHz
GHz
dBm
LO Pin
LO AMPLITUDE
13
24 GHz to 32 GHz Performance
Downconverter
Conversion Loss
Single Sideband Noise Figure
Input Third-Order Intercept
Input 1 dB Compression Point
Input Second-Order Intercept
Upconverter
11
12
20
12
42
13.5
dB
dB
dBm
dBm
dBm
SSB NF
IP3
P1dB
IP2
15.5
IFIN
Conversion Loss
Input Third-Order Intercept
Input 1 dB Compression Point
ISOLATION
10.5
15.3
4.5
dB
dBm
dBm
IP3
P1dB
24 GHz to 30 GHz Performance
LO to IF
RF to IF
28
20
32
35.5
31.5
36.5
dB
dB
dB
LO to RF
30 GHz to 32 GHz Performance
LO to IF
RF to IF
22
10.5
22.5
30
24.4
30.5
dB
dB
dB
LO to RF
Rev. 0 | Page 3 of 23
HMC329ALC3B
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Parameter
Rating
13 dBm
24 dBm
13 dBm
3 mA
RF Input Power
LO Input Power
IF Input Power
IF Source or Sink Current
Peak Reflow Temperature
Maximum Junction Temperature
θ
JA is the natural convection, junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure.
JC is the junction to case thermal resistance.
260°C
175°C
θ
Continuous Power Dissipation, PDISS (TA = 85°C,
Derate 3.7 mW/°C Above 85°C)
Operating Temperature Range
Storage Temperature Range
Lead Temperature (Soldering 60 sec)
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
Field-Induced Charged Device Model
(FICDM)
200 mW
Table 3. Thermal Resistance
Package Type
θJA
θJC
Unit
−55°C to +85°C
−65°C to +150°C
260°C
E-12-41
120
445
°C/W
1 Test Condition 1: JEDEC standard JESD51-2.
ESD CAUTION
1500 V, Class 1C
1250 V, Class IV
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. 0 | Page 4 of 23
Data Sheet
HMC329ALC3B
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
HMC329ALC3B
TOP VIEW
(Not to Scale)
12 11 10
1
2
3
9
8
7
GND
RF
GND
LO
GND
GND
4
5
6
NOTES
1. NOT INTERNALLY CONNECTED. THESE PINS
CAN BE CONNECTED TO RF/DC GROUND.
PERFORMANCE IS NOT AFFECTED.
2. EXPOSED PAD. THE EXPOSED PAD MUST BE
CONNECTED TO RF/DC GROUND.
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic Description
1, 3, 4, 6, 7, 9 GND
Ground. These pins must be connected to RF/dc ground. See Figure 3 for the interface schematic.
LO Port. This pin is ac-coupled and matched to 50 Ω. See Figure 4 for the interface schematic.
IF Port. This pin is dc-coupled. For applications not requiring operation to dc, dc block this port externally
using a series capacitor of a value chosen to pass the necessary IF frequency range. For operation to dc, this
pin must not source or sink more than 3 mA of current. Otherwise, die malfunction or die failure may result.
See Figure 5 for the interface schematic.
2
5
LO
IF
8
RF
NIC
EPAD
RF Port. This pin is ac-coupled and matched to 50 Ω. See Figure 6 for the interface schematic.
Not Internally Connected. Connect these pins to RF/dc ground. Performance is not affected.
Exposed Pad. The exposed pad must be connected to RF/dc ground.
10, 11, 12
INTERFACE SCHEMATICS
GND
IF
Figure 3. GND Interface Schematic
Figure 5. IF Interface Schematic
LO
RF
Figure 4. LO Interface Schematic
Figure 6. RF Interface Schematic
Rev. 0 | Page 5 of 23
HMC329ALC3B
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE, IF = 1000 MHz
Upper Sideband (Low-Side LO)
–5
–5
–10
–15
–20
–25
–30
–10
–40°C
+25°C
–15
+85°C
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–20
–25
–30
23
24
25
26
27
28
29
30
31
32
33
23
24
25
26
27
28
29
30
31
32
33
RF FREQUENCY
RF FREQUENCY
Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 10. Conversion Gain vs. RF Frequency at Various LO Power Levels,
T
A = 25°C
30
30
25
20
15
10
5
25
20
–40°C
+25°C
+85°C
15
10
5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
0
0
23
24
25
26
27
28
29
30
31
32
33
23
24
25
26
27
28
29
30
31
32
33
RF FREQUENCY
RF FREQUENCY
Figure 8. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 11. Input IP3 vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
70
60
50
70
60
50
40
30
20
10
0
40
–40°C
+25°C
+85°C
30
20
10
0
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
23
24
25
26
27
28
29
30
31
32
33
23
24
25
26
27
28
29
30
31
32
33
RF FREQUENCY
RF FREQUENCY
Figure 9. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 12. Input IP2 vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. 0 | Page 6 of 23
Data Sheet
HMC329ALC3B
20
20
15
10
5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–40°C
+25°C
+85°C
15
10
5
0
0
23
24
25
26
27
28
29
30
31
32
33
23
24
25
26
27
28
29
30
31
32
33
RF FREQUENCY
RF FREQUENCY
Figure 13. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 14. Input P1dB vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. 0 | Page 7 of 23
HMC329ALC3B
Data Sheet
Lower Sideband (High-Side LO)
–5
–5
–10
–15
–20
–25
–30
–10
–40°C
+25°C
–15
+85°C
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–20
–25
–30
23
24
25
26
27
28
29
30
31
32
33
23
24
25
26
27
28
29
30
31
32
33
RF FREQUENCY
RF FREQUENCY
Figure 15. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 18. Conversion Gain vs. RF Frequency at Various LO Power Levels,
T
A = 25°C
30
30
25
20
15
10
5
–40°C
+25°C
+85°C
25
20
15
10
5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
0
0
23
24
25
26
27
28
29
30
31
32
33
23
24
25
26
27
28
29
30
31
32
33
RF FREQUENCY
RF FREQUENCY
Figure 16. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 19. Input IP3 vs. RF Frequency at Various LO Power Levels,
T
A = 25°C
70
70
60
50
40
30
20
10
0
60
50
40
–40°C
+25°C
+85°C
30
20
10
0
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
23
24
25
26
27
28
29
30
31
32
33
23
24
25
26
27
28
29
30
31
32
33
RF FREQUENCY
RF FREQUENCY
Figure 17. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 20. Input IP2 vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. 0 | Page 8 of 23
Data Sheet
HMC329ALC3B
20
20
15
10
5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–40°C
+25°C
+85°C
15
10
5
0
0
23
24
25
26
27
28
29
30
31
32
33
23
24
25
26
27
28
29
30
31
32
33
RF FREQUENCY
RF FREQUENCY
Figure 21. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 23. Input P1dB vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
20
18
16
14
12
10
8
6
4
2
0
23
24
25
26
27
28
29
30
31
32
33
RF FREQUENCY
Figure 22. Noise Figure vs. RF Frequency at LO = 13 dBm, TA = 25°C
Rev. 0 | Page 9 of 23
HMC329ALC3B
Data Sheet
DOWNCONVERTER PERFORMANCE, IF = 8000 MHz
Upper Sideband (Low-Side LO)
–5
–5
–10
–15
–20
–25
–30
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–10
–15
–40°C
+25°C
+85°C
–20
–25
–30
27
28
29
30
31
32
33
34
35
27
28
29
30
31
32
33
34
35
RF FREQUENCY
RF FREQUENCY
Figure 24. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 27. Conversion Gain vs. RF Frequency at Various LO Power Levels,
T
A = 25°C
30
30
25
20
15
10
5
25
–40°C
+25°C
+85°C
20
15
10
5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
0
0
27
28
29
30
31
32
33
34
35
27
28
29
30
31
32
33
34
35
RF FREQUENCY
RF FREQUENCY
Figure 25. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 28. Input IP3 vs. RF Frequency at Various LO Power Levels,
T
A = 25°C
70
60
50
70
60
50
40
30
20
10
0
40
–40°C
+25°C
+85°C
30
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
20
10
0
27
28
29
30
31
32
33
34
35
27
28
29
30
31
32
33
34
35
RF FREQUENCY
RF FREQUENCY
Figure 26. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 29. Input IP2 vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. 0 | Page 10 of 23
Data Sheet
HMC329ALC3B
Lower Sideband (High-Side LO)
–5
–5
–10
–15
–20
–25
–30
–10
–40°C
+25°C
–15
+85°C
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–20
–25
–30
20
21
22
23
24
25
26
27
28
29
30
20
21
22
23
24
25
26
27
28
29
30
RF FREQUENCY
RF FREQUENCY
Figure 30. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 33. Conversion Gain vs. RF Frequency at Various LO Power Levels,
T
A = 25°C
30
30
25
20
15
10
5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
25
–40°C
+25°C
+85°C
20
15
10
5
0
0
20
21
22
23
24
25
26
27
28
29
30
20
21
22
23
24
25
26
27
28
29
30
RF FREQUENCY
RF FREQUENCY
Figure 31. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm
Figure 34. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25°C
70
70
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–40°C
+25°C
+85°C
60
60
50
50
40
30
10
10
0
40
30
10
10
0
20
21
22
23
24
25
26
27
28
29
30
20
21
22
23
24
25
26
27
28
29
30
RF FREQUENCY
RF FREQUENCY
Figure 32. Input IP2 vs. RF Frequency at Various Temperatures, LO = 13 dBm
Figure 35. Input IP2 vs. RF Frequency at Various LO Power Levels, TA = 25°C
Rev. 0 | Page 11 of 23
HMC329ALC3B
Data Sheet
UPCONVERTER PERFORMANCE, IF = 1000 MHz
Upper Sideband (Low-Side LO)
–5
–5
–10
–15
–20
–25
–30
–10
–40°C
+25°C
–15
+85°C
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–20
–25
–30
23
24
25
26
27
28
29
30
31
32
33
23
24
25
26
27
28
29
30
31
32
33
RF FREQUENCY
RF FREQUENCY
Figure 36. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 39. Conversion Gain vs RF Frequency at Various LO Power Levels,
T
A = 25°C
30
30
25
20
15
10
5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–40°C
+25°C
+85°C
25
20
15
10
5
0
0
23
24
25
26
27
28
29
30
31
32
33
23
24
25
26
27
28
29
30
31
32
33
RF FREQUENCY
RF FREQUENCY
Figure 37. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm
Figure 40. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25°C
20
20
–40°C
+25°C
+85°C
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
15
10
5
15
10
5
0
0
23
24
25
26
27
28
29
30
31
32
33
23
24
25
26
27
28
29
30
31
32
33
RF FREQUENCY
RF FREQUENCY
Figure 38. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 41. Input P1dB vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. 0 | Page 12 of 23
Data Sheet
HMC329ALC3B
Lower Sideband (High-Side LO)
–5
–5
–10
–15
–20
–25
–30
–10
–15
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–40°C
+25°C
+85°C
–20
–25
–30
23
24
25
26
27
28
29
30
31
32
33
23
24
25
26
27
28
29
30
31
32
33
RF FREQUENCY
RF FREQUENCY
Figure 42. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 45. Conversion Gain vs. RF Frequency at Various LO Power Levels,
T
A = 25°C
30
30
25
20
15
10
5
LO = 9dBm
–40°C
+25°C
+85°C
LO = 11dBm
LO = 13dBm
LO = 15dBm
25
20
15
10
5
0
0
23
24
25
26
27
28
29
30
31
32
33
23
24
25
26
27
28
29
30
31
32
33
RF FREQUENCY
RF FREQUENCY
Figure 43. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm
Figure 46. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25°C
20
20
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–40°C
+25°C
+85°C
15
15
10
10
5
5
0
0
23
24
25
26
27
28
29
30
31
32
33
23
24
25
26
27
28
29
30
31
32
33
RF FREQUENCY
RF FREQUENCY
Figure 44. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 47. Input P1dB vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. 0 | Page 13 of 23
HMC329ALC3B
Data Sheet
UPCONVERTER PERFORMANCE, IF = 8000 MHz
Upper Sideband (Low-Side LO)
–5
–5
–10
–15
–20
–25
–30
–10
–15
–40°C
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
+25°C
+85°C
–20
–25
–30
27
28
29
30
31
32
33
34
35
27
28
29
30
31
32
33
34
35
RF FREQUENCY
RF FREQUENCY
Figure 48. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 50. Conversion Gain vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
30
30
25
20
15
10
5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
25
–40°C
+25°C
+85°C
20
15
10
5
0
0
27
28
29
30
31
32
33
34
35
27
28
29
30
31
32
33
34
35
RF FREQUENCY
RF FREQUENCY
Figure 49. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm
Figure 51. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25°C
Rev. 0 | Page 14 of 23
Data Sheet
HMC329ALC3B
Lower Sideband (High-Side LO)
–5
–5
–10
–15
–20
–25
–30
–10
–15
–40°C
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–20
–25
–30
+25°C
+85°C
20
21
22
23
24
25
26
27
28
29
30
20
21
22
23
24
25
26
27
28
29
30
RF FREQUENCY
RF FREQUENCY
Figure 52. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 54. Conversion Gain vs. RF Frequency at Various LO Power Levels,
T
A = 25°C
30
30
25
20
15
10
5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–40°C
+25°C
+85°C
25
20
15
10
5
0
0
20
21
22
23
24
25
26
27
28
29
30
20
21
22
23
24
25
26
27
28
29
30
RF FREQUENCY
RF FREQUENCY
Figure 53. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm
Figure 55. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25°C
Rev. 0 | Page 15 of 23
HMC329ALC3B
Data Sheet
Isolation and Return Loss
50
50
45
40
35
30
25
20
15
10
5
45
40
35
30
–40°C
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
25
20
15
10
5
+25°C
+85°C
0
0
23
24
25
26
27
28
29
30
31
32
33
23
24
25
26
27
28
29
30
31
32
33
RF FREQUENCY
RF FREQUENCY
Figure 56. LO to RF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 59. LO to RF Isolation vs. RF Frequency at Various LO Power Levels,
T
A = 25°C
50
45
40
35
50
45
40
35
30
25
20
15
10
5
30
–40°C
+25°C
+85°C
LO = 9dBm
25
20
15
10
5
LO = 11dBm
LO = 13dBm
LO = 15dBm
0
0
23
24
25
26
27
28
29
30
31
32
33
23
24
25
26
27
28
29
30
31
32
33
RF FREQUENCY
RF FREQUENCY
Figure 57. LO to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 60. LO to IF Isolation vs. RF Frequency at Various LO Power Levels,
T
A = 25°C
50
45
40
35
30
50
45
40
35
30
25
20
15
10
5
LO = 9dBm
–40°C
+25°C
+85°C
25
20
15
10
5
LO = 11dBm
LO = 13dBm
LO = 15dBm
0
0
23
24
25
26
27
28
29
30
31
32
33
23
24
25
26
27
28
29
30
31
32
33
RF FREQUENCY
RF FREQUENCY
Figure 58. RF to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 61. RF to IF Isolation vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. 0 | Page 16 of 23
Data Sheet
HMC329ALC3B
0
–5
0
–5
–10
–15
–20
–25
–10
–15
–20
–25
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
0
1
2
3
4
5
6
7
8
9
10
23
24
25
26
27
28
29
30
31
32
33
IF FREQUENCY
RF FREQUENCY
Figure 62. LO Return Loss vs. RF Frequency at LO = 13 dBm, TA = 25°C
Figure 64. IF Return Loss vs. IF Frequency at Various LO Power Levels,
A = 25°C, LO = 27 GHz
T
0
–5
–10
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–15
–20
–25
23
24
25
26
27
28
29
30
31
32
33
RF FREQUENCY
Figure 63. RF Return Loss vs. RF Frequency at Various LO Power Levels,
A = 25°C, LO = 27 GHz
T
Rev. 0 | Page 17 of 23
HMC329ALC3B
Data Sheet
IF BANDWIDTH—DOWNCONVERTER
Upper Sideband, LO Frequency = 25 GHz
–5
–5
–10
–15
–20
–25
–30
–10
–15
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–40°C
+25°C
+85°C
–20
–25
–30
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
8
9
10
IF FREQUENCY
IF FREQUENCY
Figure 65. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 13 dBm
Figure 67. Conversion Gain vs. IF Frequency at Various LO Power Levels,
T
A = 25°C
30
25
20
30
25
20
15
10
5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
15
–40°C
+25°C
+85°C
10
5
0
0
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
8
9
10
IF FREQUENCY
IF FREQUENCY
Figure 66. Input IP3 vs. IF Frequency at Various Temperatures, LO = 13 dBm
Figure 68. Input IP3 vs. IF Frequency at Various LO Power Levels, TA = 25°C
Rev. 0 | Page 18 of 23
Data Sheet
HMC329ALC3B
Lower Sideband, LO Frequency = 31 GHz
–5
–5
–10
–15
–20
–25
–30
–10
–15
–40°C
+25°C
+85°C
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–20
–25
–30
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
8
9
10
IF FREQUENCY
IF FREQUENCY
Figure 69. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 13 dBm
Figure 71. Conversion Gain vs. IF Frequency at Various LO Power Levels,
T
A = 25°C
30
30
25
20
15
10
5
LO = 9dBm
–40°C
+25°C
+85°C
LO = 11dBm
LO = 13dBm
LO = 15dBm
25
20
15
10
5
0
0
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
8
9
10
IF FREQUENCY
IF FREQUENCY
Figure 72. Input IP3 vs. IF Frequency at Various LO Power Levels, TA = 25°C
Figure 70. Input IP3 vs. IF Frequency at Various Temperatures, LO = 13 dBm
Rev. 0 | Page 19 of 23
HMC329ALC3B
Data Sheet
M × N Spurious Outputs
SPURIOUS AND HARMONICS PERFORMANCE
Downconverter, Upper Sideband
Mixer spurious products are measured in dBc from the IF output
power level. N/A means not applicable.
Spur values are (M × RF) − (N × LO). RF = 28 GHz at
−10 dBm, LO = 27 GHz at 13 dBm.
LO Harmonics
LO = 13 dBm, all values in dBc are below input LO level and are
measured at the RF port.
N × LO
0
1
2
3
4
5
0
1
2
3
4
5
N/A
27
7
N/A N/A N/A
N/A N/A
N/A
N/A
N/A
N/A
72
Table 5. LO Harmonics at RF
N/A 36
66 57
N/A 72
N × LO Spur at RF Port
N/A
N/A
N/A
N/A
69
81
N/A
72
LO Frequency (GHz)
1
2
3
4
M × RF
22
25
28
30
33
35
38
43
42
45
37
30
37
28
69
75
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A N/A 73
78
N/A N/A N/A 71
78
N/A
N/A
N/A
N/A
N/A
Upconverter, Upper Sideband
Spur values are (M × IF) + (N × LO). IFIN = 1000 MHz at
−10 dBm, LO = 27 GHz at 13 dBm.
N × LO
LO = 13 dBm, all values in dBc are below input LO level and are
measured at the IF port.
0
1
2
3
−5
−4
−3
−2
−1
0
80
79
74
55
20
N/A
20
55
72
79
80
70
71
61
41
0
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
58
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Table 6. LO Harmonics at IF
N × LO Spur at IF Port
LO Frequency (GHz)
1
2
3
4
22
25
28
30
33
35
38
41
43
43
34
36
39
31
99
78
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
6
M × IF
N/A
N/A
N/A
N/A
N/A
+1
+2
+3
+4
+5
0
39
58
75
74
58
Rev. 0 | Page 20 of 23
Data Sheet
HMC329ALC3B
THEORY OF OPERATION
The HMC329ALC3B is a general-purpose, double balanced
mixer that can be used as an upconverter or a downconverter
from 24 GHz to 32 GHz.
When used as an upconverter, the mixer upconverts intermediate
frequencies between dc and 8 GHz to radio frequencies between
24 GHz and 32 GHz.
When used as a downconverter, the HMC329ALC3B down-
converts radio frequencies between 24 GHz and 32 GHz to
intermediate frequencies between dc and 8 GHz.
Rev. 0 | Page 21 of 23
HMC329ALC3B
Data Sheet
APPLICATIONS INFORMATION
TYPICAL APPLICATION CIRCUIT
EVALUATION PCB INFORMATION
Figure 73 shows the typical application circuit for the
Use RF circuit design techniques for the circuit board used in
the application. Ensure that signal lines have 50 Ω impedance
and connect the package ground leads and the exposed pad
directly to the ground plane (see Figure 74). Use a sufficient
number of via holes to connect the top and bottom ground
planes. The evaluation circuit board shown in Figure 74 is
available from Analog Devices, Inc., upon request.
HMC329ALC3B. The HMC329ALC3B is a passive device
and does not require any external components. The LO and RF
pins are internally ac-coupled. The IF pin is internally dc-coupled.
For applications not requiring operation to dc, dc block this
port externally using a series capacitor of a value chosen to pass
the necessary IF frequency range. When IF operation to dc is
required, do not exceed the IF source and sink current rating
specified in the Absolute Maximum Ratings section.
Table 7. List of Materials for Evaluation PCB
EV1HMC329ALC3B
Item
Description
12
11 10
J1, J2 PCB mount, SRI, 2.92 mm connectors
HMC329ALC3B
GND
LO
GND
RF
J3
U1
PCB1
PCB mount, Johnson Components SMA connector
HMC329ALC3B
9
8
7
1
2
3
LO
RF
117611-1 evaluation board on
GND
GND
Rogers Corporation RO4350B laminates
4
5
6
1 117611-1 is the raw bare PCB identifier. Reference EV1HMC329ALC3B when
ordering complete evaluation PCB.
IF
Figure 73. Typical Application Circuit
LO
RF
117611–1
329 A
J2
J1
IF
U1
J3
Figure 74. Evaluation PCB Top Layer
Rev. 0 | Page 22 of 23
Data Sheet
HMC329ALC3B
OUTLINE DIMENSIONS
3.05
2.90 SQ
2.75
0.36
0.30
0.24
0.08
BSC
PIN 1
INDICATOR
10
12
PIN 1
9
1
3
0.50
BSC
1.60
1.50 SQ
1.40
EXPOSED
PAD
7
6
4
0.32
BSC
BOTTOM VIEW
TOP VIEW
SIDE VIEW
1.00 REF
2.10 BSC
0.90
0.80
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SEATING
PLANE
SECTION OF THIS DATA SHEET.
Figure 75. 12-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-12-4)
Dimensions shown in millimeters
ORDERING GUIDE
Package
Model1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Moisture Sensitivity Level (MSL) Rating2
Package Description
Option
E-12-4
E-12-4
E-12-4
HMC329ALC3B
HMC329ALC3BTR
HMC329ALC3BTR-R5
EV1HMC329ALC3B
MSL3
MSL3
MSL3
12-Terminal LCC
12-Terminal LCC
12-Terminal LCC
Evaluation PCB Assembly
1 The HMC554ALC3B, HMC554ALC3BTR, and HMC554ALC3BTR-R5 are RoHS compliant parts.
2 See Table 2 in the Absolute Maximum Ratings section.
©2018 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D16676-0-5/18(0)
Rev. 0 | Page 23 of 23
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