EVAL-ADXRS290Z-S [ADI]
Ultralow Noise, Dual-Axis MEMS Gyroscope;![EVAL-ADXRS290Z-S](http://pdffile.icpdf.com/pdf2/p00330/img/icpdf/EVAL-ADXRS29_2026284_icpdf.jpg)
型号: | EVAL-ADXRS290Z-S |
厂家: | ![]() |
描述: | Ultralow Noise, Dual-Axis MEMS Gyroscope |
文件: | 总19页 (文件大小:527K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
![](http://public.icpdf.com/style/img/ads.jpg)
Ultralow Noise,
Dual-Axis MEMS Gyroscope
Data Sheet
ADXRS290
FEATURES
GENERAL DESCRIPTION
MEMS pitch and roll rate gyroscope
Ultralow noise: 0.004°/s/√Hz
High vibration rejection over a wide frequency range
Power saving standby mode
80 µA current consumption in standby mode
Fast startup time from standby mode: <100 ms
Low delay of <0.5 ms for a 30 Hz input at the widest
bandwidth setting
Serial peripheral interface (SPI) digital output
Programmable high-pass and low-pass filters
2000 g powered acceleration survivability
2.7 V to 5.0 V operation
The ADXRS290 is a high performance MEMS pitch and roll
(dual-axis in-plane) angular rate sensor (gyroscope) designed
for use in stabilization applications.
The ADXRS290 provides an output full-scale range of 100°/s with
a sensitivity of 200 LSB/°/s. Its resonating disk sensor structure
enables angular rate measurement about the axes normal to the
sides of the package around an in-plane axis. Angular rate data
is formatted as 16-bit twos complement and is accessible through
a SPI digital interface. The ADXRS290 exhibits a low noise floor
of 0.004°/s/√Hz and features programmable high-pass and low-
pass filters.
The ADXRS290 is available in a 4.5 mm × 5.8 mm × 1.2 mm,
18-terminal cavity laminate package.
−25°C to +85°C operation
4.5 mm × 5.8 mm × 1.2 mm cavity laminate package
APPLICATIONS
Optical image stabilization
Platform stabilization
Wearable products
FUNCTIONAL BLOCK DIAGRAM
SYNC/ASEL PDMY PDMX AST
V
CP
V
V
S
DD I/O
REG
POWER
MANAGEMENT
GND
DEMOD
ADC
PITCH
ROLL
FILTERS
DIGITAL
CONTROL LOGIC
DEMOD
ADC
MOSI
MISO
SCLK
CS
SERIAL
INPUT/OUTPUT
ADXRS290
MECHANICAL
SENSOR
PITCH
ROLL
PLL
DRIVE
VELOCITY
Figure 1.
Rev. A
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Technical Support
©2014 Analog Devices, Inc. All rights reserved.
www.analog.com
ADXRS290
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Mechanical Considerations for Mounting.............................. 13
Serial Communications ................................................................. 14
Register Map ................................................................................... 16
Register Descriptions..................................................................... 17
Analog Devices Identifier.......................................................... 17
MEMS Identifier......................................................................... 17
Device Identifier......................................................................... 17
Silicon Revision Number .......................................................... 17
Serial Number (SNx) ................................................................. 17
Rate Output Data ....................................................................... 17
Temperature Data....................................................................... 17
Power Control............................................................................. 17
Band-Pass Filter.......................................................................... 17
Data Ready .................................................................................. 17
Recommended Soldering Profile ................................................. 18
PCB Footprint Pattern............................................................... 18
Outline Dimensions....................................................................... 19
Ordering Guide .......................................................................... 19
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Rate Sensitive Axes....................................................................... 4
Package Information.................................................................... 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Typical Performance Characteristics ............................................. 6
Theory of Operation ...................................................................... 10
Applications Information .............................................................. 11
Application Circuit..................................................................... 11
Power Supply Decoupling ......................................................... 11
Power Sequencing ...................................................................... 11
Setting Bandwidth...................................................................... 11
Analog Evaluation Mode........................................................... 12
REVISION HISTORY
12/14—Rev.0 to Rev. A
Changes to Title ................................................................................ 1
Changes to Features Section and General Description Section....... 1
10/14—Revision 0: Initial Version
Rev. A | Page 2 of 19
Data Sheet
ADXRS290
SPECIFICATIONS
Specified conditions at TA = 25°C. VS = VDD I/O = 3 V, angular rate = 0°/sec, bandwidth = dc to 480 Hz, CS = CREG = CI/O = CCP = 1 µF, digital
mode, temperature sensor = off, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications
are not tested or guaranteed.
Table 1.
Parameter
Test Conditions/Comments
Min
Typ
Max Unit
MEASUREMENT RANGE
Output Full-Scale Range
Resolution
Gyroscope Data Update Rate
LINEARITY
Each axis
±100
16
4250
°/s
Bits
Hz
Nonlinearity
Cross Axis Sensitivity
SENSITIVITY
±0.5
±2.0
% FS
%
Sensitivity
200
±±
±1
LSB/°/s
%
%
Initial Sensitivity Tolerance1
Change Due to Temperature
OFFSET
TA = 25°C
TA = −20°C to +60°C
−12
+12
Offset Error
TA = −20°C to +60°C
±9
°/s
NOISE PERFORMANCE
Rate Noise Density
FREQUENCY RESPONSE
−± dB Frequency2
Low-Pass Filter
TA = 25°C at 10 Hz
0.004
°/s/√Hz
Programmable (see the Setting Bandwidth section)
20
480
Hz
High-Pass Filter
Delay
DC output setting available
±0 Hz input, low-pass filter (LPF) = 480 Hz
0.011
11.± Hz
ms
<0.5
POWER SUPPLY
Operating Voltage Range (VS, VDD I/O
)
2.7
5.0
V
Supply Current
Measurement mode
Standby mode
Power off to standby mode
Standby to measurement mode (to within ±1°/s of final value)
7.8
80
<5
<100
mA
µA
ms
ms
Start-Up Time (Standby)
Start-Up Time (Measurement Mode)
TEMPERATURE SENSOR
Resolution
12
Bits
Sensitivity
0.1
°C/LSB
OPERATING TEMPERATURE RANGE
Operating Temperature Range
–25
+85
°C
1 Initial sensitivity tolerance minimum and maximum specifications are guaranteed by characterization and are not tested in production.
2 Guaranteed by design and are not tested in production.
Rev. A | Page ± of 19
ADXRS290
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
PACKAGE INFORMATION
The information in Figure 2 and Table 3 provide details about
the package branding for the ADXRS290. For a complete listing
of product availability, see the Ordering Guide section.
Parameter
Rating
Acceleration (Any Axis, Unpowered, 0.5 ms)
Acceleration (Any Axis, Powered, 0.5 ms)
VS, VDD I/O
All Other Pins
Output Short-Circuit Duration (Any Pin to
Common)
2000 g
2000 g
2.7 V to 5.25 V
2.7 V to 5.25 V
Indefinite
Table 3. Package Branding Information
Branding Key
Field Description
XR290
#yyyy
Part identifier for ADXRS290
Date code
Operating Temperature Range
Storage Temperature Range
–40°C to +105°C
–40°C to +105°C
Pin 1 and factory lot code identifiers
●XXXXXX
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
RATE SENSITIVE AXES
The ADXRS290 is an x-axis and y-axis rate sensing device that
is also called a roll and pitch rate sensing device. It produces a
positive output voltage for clockwise rotation about the x-axis
and y-axis, as shown in Figure 2.
Ω
X
Ω
Y
Figure 2. Axes of Sensitivity
Rev. A | Page 4 of 19
Data Sheet
ADXRS290
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
5
4
3
2
1
PDMY
6
7
8
9
18
17
16
15
V
V
S
CS
MISO
MOSI
REG
ADXRS290
TOP VIEW
(TERMINAL SIDE DOWN)
Not to Scale
GND
GND
10
11
12
13
14
Figure 3. Pin Configuration (Top View)
Table 4. Pin Function Descriptions
Description
Pin No.
Mnemonic
VREG
VDD I/O
AST
SENS
PDMX
PDMY
CS
Digital Mode
Regulator Output. Connect a 1 µF capacitor to this pin.
Digital Interface Supply Voltage.
This pin is internally pulled to ground.
This pin is internally pulled to ground.
This pin is internally pulled to ground.
This pin is internally pulled to ground.
Chip Select. Active low.
Analog Evaluation Mode
1
2
±
4
5
6
7
Regulator Output. Connect a 1 µF capacitor to this pin.
Digital Interface Supply Voltage.
Self Test.
Sensitivity Select.
Pulse-Density Modulation (PDM) XOUT
PDM YOUT
.
.
Chip Select. Active low.
Serial Data Out.
8
9
10
11
MISO (SDO)
MOSI (SDI)
SCLK
Serial Data Out.
Serial Data In.
Serial Communications Clock.
Data Ready Out (SYNC). Connect this pin to ground if
it is not used.
Serial Data In.
Serial Communications Clock.
Analog Enable (ASEL).
SYNC/ASEL
12
CP
Charge Pump Output. Connect a 1 µF capacitor (rated Charge Pump Output. Connect a 1 µF capacitor (rated
for 50 V) to this pin.
for 50 V) to this pin.
1±, 15, 16 GND
Ground. Connect to ground.
Analog Supply Voltage.
Regulator Output. Connect a 1 µF capacitor to this pin.
Analog Supply Voltage.
Ground. Connect to ground.
Analog Supply Voltage.
Regulator Output. Connect a 1 µF capacitor to this pin.
Analog Supply Voltage.
14
17
18
VS
VREG
VS
Rev. A | Page 5 of 19
ADXRS290
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
N > 240 for all typical performance characteristics plots, unless otherwise noted.
70
60
50
40
30
20
10
0
40
35
30
25
20
15
10
5
0
–500 –400 –300 –200 –100
0
100 200 300 400 500
–500 –400 –300 –200 –100
0
100 200 300 400 500
X-AXIS OFFSET (LSB)
Y-AXIS OFFSET (LSB)
Figure 4. X-Axis Offset at 25°C
Figure 7. Y-Axis Offset at 25°C
400
300
1500
1000
500
200
100
0
0
–100
–200
–300
–400
–500
–1000
–1500
–50
–25
0
25
50
75
100
–50
–25
0
25
50
75
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 5. X-Axis Offset vs. Temperature (N = 16)
Figure 8. Y-Axis Offset vs. Temperature (N = 16)
22
20
20
18
16
14
12
10
8
18
16
14
12
10
8
6
6
4
4
2
2
0
0
X-AXIS SENSITIVITY (LSB/°/s)
Y-AXIS SENSITIVITY (LSB/°/s)
Figure 6. X-Axis Sensitivity at 25°C
Figure 9. Y-Axis Sensitivity at 25°C
Rev. A | Page 6 of 19
Data Sheet
ADXRS290
220
215
210
205
200
195
190
185
180
220
215
210
205
200
195
190
185
180
–50
–25
0
25
50
75
100
–50
–25
0
25
50
75
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 10. X-Axis Sensitivity vs. Temperature (N = 16)
Figure 13. Y-Axis Sensitivity vs. Temperature (N = 16)
250
200
150
100
50
0.20
0.10
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
0.15
0.10
0.05
0
0
–50
–100
–150
–200
–250
–0.05
–0.10
–0.15
–0.20
X OUTPUT (AVERAGE)
Y OUTPUT (AVERAGE)
X OUTPUT (RMS)
ADXRS290
REFERENCE
Y OUTPUT (RMS)
1
10
0
10
20
30
40
50
60
70
80
FREQUENCY (kHz)
TIME (ms)
Figure 11. Rate Output Saturation Behavior
Figure 14. Response to 10 g Sine Vibration Along the Z-Axis (Out-of-Plane),
HPF = Off and LPF = 480 Hz
0.1
2.0
60
50
40
30
20
10
0
X-AXIS
Y-AXIS
X-AXIS
Y-AXIS
INPUT REFERENCE
1.5
1.0
0.01
0.5
0.001
0.0001
0
–0.5
–1.0
–1.5
–2.0
–10
0.00001
–20
0.20
0.1
1
10
100
1k
10k
0
0.05
0.10
TIME (Seconds)
0.15
FREQUENCY (Hz)
Figure 12. Response to 50 g, 10 ms Half-Sine Shock Along the Z-Axis
Figure 15. Typical Noise Spectral Density
(Out-of-Plane), HPF = Off and LPF = 480 Hz
Rev. A | Page 7 of 19
ADXRS290
Data Sheet
200
150
100
50
0
–5
X-AXIS
Y-AXIS
–10
–15
–20
–25
–30
–35
0
–50
–100
–150
–200
LPF = 80Hz
LPF = 160Hz
LPF = 320Hz
0
10
20
30
40
50
60
70
80
90
100
0
10
20
30
40
50
TIME (ms)
INPUT FREQUENCY (Hz)
Figure 16. Start-Up Time (Standby to Measurement Mode)
Figure 19. Low-Pass Filter Phase Delay
1200
0.5
0.4
1000
800
600
400
200
0
0.3
0.2
0.1
0
–0.1
–0.2
–0.3
–0.4
–0.5
–200
–400
–600
–50
–25
0
25
50
75
100
–125
–75
–25
25
75
125
AMBIENT TEMPERATURE (°C)
ANGULAR RATE (°/s)
Figure 17. Temperature Sensor Output vs. Ambient Temperature (N = 16)
Figure 20. Rate Output Nonlinearity (N = 15)
3.0
50
LPF = 80Hz
LPF = 160Hz
45
40
35
30
25
20
15
10
5
2.5
2.0
1.5
1.0
0.5
0
LPF = 320Hz
0
0
10
20
30
40
50
10
15
20
25
30
35
40
45
50
55
60
INPUT FREQUENCY (Hz)
STANDBY MODE CURRENT (µA)
Figure 18. Low-Pass Filter Group Delay
Figure 21. Standby Mode Current Consumption
Rev. A | Page 8 of 19
Data Sheet
ADXRS290
50
45
40
35
30
25
20
15
10
5
0
6.5 6.6 6.7 6.8 6.9 7.0 7.1 7.2 7.3 7.4 7.5
MEASUREMENT MODE CURRENT (mA)
Figure 22. Measurement Mode Current Consumption
Rev. A | Page 9 of 19
ADXRS290
Data Sheet
THEORY OF OPERATION
The ADXRS290 is designed to sense x-axis and y-axis (roll and
pitch) angular rate. The ADXRS290 operates on the principle of
a vibratory rate gyroscope. Figure 23 presents a simplified
illustration of one of four, coupled polysilicon sensing structures.
Each sensing structure contains a resonating disk that is
electrostatically driven to resonance, which produces the
necessary rotating velocity element needed to generate a
Coriolis torque when experiencing angular rate.
When the sensing structure is exposed to an angular rate, the
resulting Coriolis torque drives each of the disks into a tilting
motion, which is sensed by plates under the disk. The disk and
plate form a capacitive pickoff structure that senses angular rate.
The resulting signal is fed to a series of gain and demodulation
stages that produce the electrical rate signal output. The sensor
design rejects linear and angular acceleration because external
g-forces appear as common-mode signals that are removed by
the fully differential architecture of the ADXRS290.
The resonator requires 31 V (typical) for operation. Because
only 5 V is typically available in most applications, a switching
regulator is included on-chip. An external 1 µF capacitor rated
for 50 V is required for proper operation of the charge pump
circuit.
X-AXIS
Ω
X
Ω
Y
After demodulation and analog-to-digital conversion, the rate
signal is filtered using a single-pole band-pass filter. The high-
pass and low-pass poles of this filter are programmable via the
digital interface.
Y-AXIS
Figure 23. Simplified Gyroscope Sensing Structure
Rev. A | Page 10 of 19
Data Sheet
ADXRS290
APPLICATIONS INFORMATION
APPLICATION CIRCUIT
POWER SEQUENCING
The interface voltage level is set with the interface supply voltage
DD I/O, which must be present to ensure that the ADXRS290
The ADXRS290 application circuit is shown in Figure 24. The
primary communications port is the 4-wire SPI interface. For
this device, external pull-up/pull-down resistors are not required
for the SPI interface, and these pins can be connected directly to
the system microcontroller. Four capacitors are required for
proper operation of the device. For optimum device performance,
separate the capacitors placed on the VS, VDD I/O, VREG, and CP pins.
V
does not create a conflict on the communications bus. For single-
supply operation, VDD I/O can be the same as the main supply (VS).
Conversely, in a dual-supply application, VDD I/O can differ from
VS to accommodate the desired interface voltage. When VS is
applied, the device enters standby state, where power consumption
is minimized, and the device waits for VDD I/O to be applied and
for a command to enter measurement mode. Measurement mode
is activated by setting Bit B1 in Register 0x10 (POWER_CTL).
Clear this bit to return the device to a standby state.
2.7V TO
5.25V
C
S
1µF
In standby mode, the current consumption is reduced to 80 µA
(typical). In standby mode, only single-address SPI transactions
are performed, which includes reading from or writing to a single
register, but does not include writing to or reading from several
registers in one command. In standby mode, the gyroscope does
not respond to rate outputs. Transition time to measurement mode
where offsets settle to within 1°/s of the final value is <100 ms.
V
V
S
REG
1
2
3
4
5
14
13
12
11
10
2.7V TO
5.25V
V
GND
CP
DD I/O
AST
ADXRS290
TOP VIEW
(TERMINAL SIDE DOWN)
Not to Scale
C
C
I/O
REG
1µF
1µF
C
1µF
50V
CP
SETTING BANDWIDTH
SENS
PDMX
SYNC/ASEL
SCLK
The ADXRS290 includes an internal configurable band-pass filter.
Both the high-pass and low-pass poles of the filter are adjustable, as
shown in Table 5 and Table 6. The filter frequency response is
shown in Figure 25 and Figure 26. The group delay of the
wideband filter option is less than 0.5 ms (see Figure 18 for filter
delay). At power-up, the default condition for the filters is dc for
the high-pass filter and 480 Hz for the low-pass filter.
SPI BUS
Table 5. Low-Pass Filter Pole Locations
Figure 24. Recommended Application Circuit
Bit 2 Filter
Bit 1 Filter
Bit 0 Filter
Frequency (Hz)
POWER SUPPLY DECOUPLING
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
480 (Default)
In many applications, bypass capacitors at VS, VREG, and VDD I/O
(as shown in Figure 24) placed close to the ADXRS290 supply
pins adequately decouple the gyroscope from noise on the power
supply. However, in applications where noise is present at the
internal clock frequency, or any harmonic thereof, additional
care in power supply bypassing is required because this noise
may cause errors in angular rate measurement. If additional
decoupling is necessary, a 10 Ω resistor or ferrite bead in series
with VS and an additional larger bypass capacitor (2.2 µF or
greater) at VS may be helpful.
±20
160
80
56.6
40
28.±
20
Table 6. High-Pass Filter Pole Locations
Bit 7
Filter
Bit 6
Filter
Bit 5
Filter
Bit 4
Filter
Frequency
(Hz)
Ensure that the connection from the ADXRS290 ground to
the power supply ground be low impedance because noise
transmitted through ground has an effect similar to noise
transmitted through VS.
0
0
0
0
All pass
(default)
0
0
0
0
0
0
0
1
1
1
0
0
0
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
0.011
0.022
0.044
0.087
0.175
0.±50
0.700
1.400
2.800
11.±0
Rev. A | Page 11 of 19
ADXRS290
Data Sheet
1.2
1.0
0.8
0.6
0.4
0.2
0
ANALOG EVALUATION MODE
An analog output evaluation mode has been incorporated in
the ADXRS290. In this mode, the output of the ADXRS290
is formatted as a pulse density modulated data stream at a
frequency of 144 kHz via the PDMX and PDMY pins. The
PDMX and PDMY pins high and low voltage levels are ratiometric
to VDD I/O. This signal can be decoded into an analog baseband
using a low-pass filter. Higher order filters allow for greater
attenuation of the 144 kHz switching noise while maintaining
the integrity of the baseband signal. A recommended application
circuit with a third-order Sallen-Key filter is shown in Figure 27.
Figure 28 shows the recommended low-pass filter for
0.011Hz
0.022Hz
0.044Hz
0.087Hz
0.175Hz
0.35Hz
0.7Hz
1.4Hz
2.8Hz
11.3Hz
0.0001
0.001
0.01
0.1
1
10
100
1k
demodulating the PDM output in analog mode operation.
FREQUENCY (Hz)
2.7V TO
5.25V
Figure 25. High-Pass Filter Frequency Response
1.2
20Hz
C
S
28.3Hz
40Hz
1µF
1.0
0.8
0.6
0.4
0.2
0
56.6Hz
80Hz
160Hz
320Hz
480Hz
V
V
S
REG
1
2
3
4
5
14
13
12
11
10
2.7V TO
5.25V
V
GND
CP
DD I/O
AST
ADXRS290
TOP VIEW
(TERMINAL SIDE DOWN)
Not to Scale
C
C
I/O
1µF
REG
1µF
C
1µF
50V
CP
SENS
PDMX
SYNC/ASEL
SCLK
1
10
100
1k
10k
FREQUENCY (Hz)
Figure 26. Low-Pass Filter Frequency Response
Offset Preservation in the High-Pass Filter
LOW-PASS FILTER
One of the functions of the high-pass filter is to remove offset.
The high-pass filter effectively estimates the offset and subtracts
it from the output. When the high-pass filter settings are
changed, the output remains unchanged; the filter preserves its
estimate of offset. The high-pass filter can be set to the fast
settling option, allowed to converge to zero offset, and then set
to any other high-pass filter option while maintaining near zero
offset. Exiting measurement mode clears the preserved offset.
Figure 27. Recommended Application Circuit for Analog Mode Operation
47kΩ
+5V
0.1µF
ANALOG
BASEBAND
SIGNAL
PDMX 24kΩ
30.1kΩ
30.1kΩ
OR
PDMY
0.01µF
0.01µF
5100pF
0.1µF
–5V
Figure 28. Recommended Low-Pass Filter for Demodulating the PDM Output
in Analog Mode Operation
In analog mode, the band-pass filter is disabled and the device
cannot be placed in standby mode. SPI communication to the
ADXRS290 is available but not required. Sensitivity in this
mode is 5 mV/°/s.
Rev. A | Page 12 of 19
Data Sheet
ADXRS290
BAD PLACEMENT
MECHANICAL CONSIDERATIONS FOR MOUNTING
GOOD
PLACEMENT
Mount the ADXRS290 on the printed circuit board (PCB) in a
location close to a hard mounting point of the PCB to the case.
Mounting the ADXRS290 at an unsupported PCB location, as
shown in Figure 29, may result in large, apparent measurement
errors due to undamped PCB vibration. Locating the ADXRS290
near a hard mounting point ensures that any PCB vibration at
the device is above the resonant frequencies of the MEMS elements
and, therefore, effectively invisible to the device. In applications
where the gyroscope may be subjected to large shock events or
excessive vibration, consider the use of damping materials (such
as Polyurethane) at the mounting locations to dampen the
vibration. A thicker PCB can also help to reduce the effect of
system resonance on the performance of the ADXRS290.
MOUNTING POINTS
Figure 29. Two Examples of Incorrectly Mounted Gyroscopes
Rev. A | Page 1± of 19
ADXRS290
Data Sheet
SERIAL COMMUNICATIONS
In digital mode, the ADXRS290 communicates via 4-wire SPI
and operates as a slave. Ignore data transmitted from the
ADXRS290 to the master device during writes to the ADXRS290.
data can be sampled. Unless the ADXRS290 is in standby
mode, multiple bytes can be written to or read from in a single
transmission. In standby mode, only single register transactions
CS
are supported. Deasserting the
commands for transmissions with multiple commands. For SPI
CS
pin is necessary between
Wire the ADXRS290 for SPI communication as shown in the
connection diagram in Figure 30. The maximum SPI clock
speed is 5 MHz, with 12 pF maximum loading. The timing
scheme follows clock phase (CPHA) = clock polarity (CPOL) = 1.
operation greater than 1 MHz, it is necessary to deassert the
pin to ensure a total delay of 10 µs between the register addressing
portion of the transmission. The delay is required to allow
settling of the internal voltage controlled oscillator. For SPI
operation of 1 MHz or lower, the communication rate is low
enough to ensure a sufficient delay between register writes.
ADXRS290
PROCESSOR
CS
SDI
SS
MOSI
MISO
SCLK
SDO
SCLK
SPI read and write operations are completed in 16 or more
clock cycles, as shown in Figure 31. Setting the R/W bit to 1
indicates a read operation and setting it to 0 indicates a write
operation. For R/W = 0 (write), [D7:D0] data is written to the
device in the register map based on the [A6:A0] addresses. For
R/W = 1 (read), [D7:D0] is the data read by the external master
device based on the [A6:A0] addresses. Examples of SPI write
and read are shown in Figure 32 and Figure 33.
Figure 30. 4-Wire SPI Connection
CS
is the serial port enable line and is controlled by the SPI
master. It must go low at the start of transmissions and high at
the end as shown in Figure 31. SCLK is the serial port clock and
is supplied by the SPI master. It is stopped high when is high,
during periods of no transmission. At the rising edge of SCLK,
CS
tDELAY
tSCLK
tM
tS
tQUIET
CS
SCLK
SDI
R/W
A6
A5
A4
A3
A2
A1
A0
D7
D7
D6
D6
D5
D5
D4
D4
D3
D3
D2
D2
D4
D1
D0
D0
SDO
tSETUP
tHOLD
tSDO
Figure 31. SPI Timing Diagram
Table 7. SPI Timing Specifications (TA = 25°C, VS = VDD I/O = 2.7 V)
Parameter
Limit
Unit
Description
fSCLK
5
MHz max
ns min
ns min
ns min
ns min
ns min
ns max
ns min
ns min
SPI clock frequency
tSCLK
200
200
1/(SPI clock frequency), mark/space ratio for the SCLK input is 40/60 to 60/40
CS
tDELAY
tQUIET
tS
falling edge to SCLK falling edge
200
CS
SCLK rising edge to rising edge
SCLK low pulse width (space)
SCLK high pulse width (mark)
SCLK falling edge to SDO transition
SDI valid before SCLK rising edge
SDI valid after SCLK rising edge
0.4 × tSCLK
0.4 × tSCLK
20
tM
tSDO
tSETUP
tHOLD
10
10
Rev. A | Page 14 of 19
Data Sheet
ADXRS290
T
T
CS
CS
1
1
MOSI
2
MOSI
2
3
4
MISO
3
MISO
SCLK
SCLK
4
CH1 5.00V CH2 5.00V
CH3 5.00V CH4 5.00V
M4.00µs
7.400µs
A
CH1
1.8V
CH1 5.00V CH2 5.00V
CH3 5.00V CH4 5.00V
M4.00µs
7.400µs
A
CH1
1.8V
T
T
Figure 32. SPI Write Example: Writing to Register 0x10 (Write 0x02 to Enter
Measurement Mode)
Figure 33. SPI Read Example: Reading Register 0x01 (Output = 0x1D)
Rev. A | Page 15 of 19
ADXRS290
Data Sheet
REGISTER MAP
Table 8.
Register No. (Hex)
Name
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3
ADI_ID[7:0]
Bit 2 Bit 1
Bit 0 Reset
10101101
00011101
R/W
0x00
ADI_ID
MEMS_ID
DEV_ID
REV_ID
SN0
R
0x01
MEMS_ID[7:0]
DEV_ID[7:0]
REV_ID[7:0]
SN[7:0]
R
0x02
10010010
00001001
SN[7:0]
R
0x0±
R
0x04
R
0x05
SN1
SN[15:8]
SN[15:8]
R
0x06
SN2
SN[2±:16]
SN[±1:24]
X0[7:0]
SN[2±:16]
SN[±1:24]
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000011
00000000
00000000
00000000
R
0x07
SN±
R
0x08
DATAX0
DATAX1
DATAY0
DATAY1
TEMP0
TEMP1
Reserved
Reserved
POWER_CTL
Filter
R
0x09
X1[15:8]
R
0x0A
Y0[7:0]
R
0x0B
Y1[15:8]
R
0x0C
TEMP[7:0]
R
0x0D
0x0E
0
0
0
0
TEMP[11:8]
R
Reserved[7:0]
Reserved[7:0]
R
0x0F
R
0x10
0
0
0
0
0
HPF[±:0]
0
0
0
0
0
0
0
Measurement TSM
LPF[2:0]
Sync[1:0]
R/W
R/W
R/W
0x11
0x012
DATA_READY
0
Rev. A | Page 16 of 19
Data Sheet
ADXRS290
REGISTER DESCRIPTIONS
This section describes the functions of the ADXRS290 registers.
The ADXRS290 powers up with default register values as shown
in the reset column of Table 8.
TEMPERATURE DATA
Register 0x0C to Register 0x0D: TEMP0 and TEMP1
(Read Only)
ANALOG DEVICES IDENTIFIER
These two bytes hold temperature output data written in twos
complement. Register 0x0C contains Bits[7:0] and Register
0x0D contains Bits[11:8] of the 12-bit temperature reading.
When concurrent temperature and output data points are
desired, perform a multiple byte read of the TEMP1:TEMP0,
DATAX1:DATAX0, and DATAY1:DATAY0 registers. The scale
factor of the temperature reading is 10 LSB/°C, and 0 codes is
equivalent to 0°C.
Table 9. Register 0x00, ADI_ID (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
1
0
1
0
1
1
0
1
The ADI_ID register holds a fixed code 0xAD.
MEMS IDENTIFIER
Table 10. Register 0x01, MEMS_ID (Read Only)
POWER CONTROL
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Table 13. Register 0x10, POWER_CTL (Read/Write)
0
0
0
1
1
1
0
1
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1
Bit 0
The MEMS_ID register holds a fixed code of 0x1D.
0
0
0
0
0
0
Measurement TSM
DEVICE IDENTIFIER
TSM Bit
Table 11. Register 0x02, DEV_ID (Read Only)
The TSM bit controls the temperature sensor. The default value
of this bit is 0 (temperature sensor off) and setting this bit to 1
enables the temperature sensor.
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
1
0
0
1
0
0
1
0
The DEV_ID register holds a fixed code of 0x92.
Measurement Bit
To set the ADXRS290 to standby mode, set the measurement bit
to 0. To set the ADXRS290 to measurement mode, set this bit to 1.
SILICON REVISION NUMBER
Table 12. Register 0x03, REV_ID (Read Only)
The ADXRS290 powers up in standby mode with a current
consumption of 80 µA (typical).
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
1
0
0
1
BAND-PASS FILTER
The REV_ID register holds a revision ID code that increments
with each subsequent silicon revision.
Table 14. Register 0x11, Filter (Read/Write)
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3
Bit 2 Bit 1 Bit 0
SERIAL NUMBER (SNx)
HPF[±:0]
0
LPF[2:0]
These four bytes (Register 0x04 to Register 0x07) store the
unique electronic serial number for the part.
LPF Bits
The three LPF bits define the low-pass filter pole (see Table 5).
HPF Bits
RATE OUTPUT DATA
Register 0x08 to Register 0x0B: DATAX0, DATAX1,
DATAY0, and DATAY1 (Read Only)
The four HPF bits define the high-pass filter pole (see Table 6).
These four bytes (Register 0x08 to Register 0x0B) hold the rate
output data for each axis. Register 0x08 and Register 0x09 hold
the output data for the x-axis, and Register 0x0A and Register 0x0B
hold the output data for the y-axis. The output data is written in
twos complement. In each two byte set, DATAx0 is the least
significant byte, and DATAx1 is the most significant byte, where
x represents the x-axis or the y-axis. To prevent a change in data
between reads of the sequential registers, perform a multiple
byte read of all rate output data registers.
DATA READY
Table 15. Register 0x12, DATA_READY (Read/Write)
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1
Bit 0
0
0
0
0
0
0
Sync[1:0]
Sync Bits
Set the sync bits to 01 to generate a data ready interrupt at the
SYNC/ASEL pin when new data becomes available.
Table 16. SYNC Pin Functions
Bit 1
Bit 0
Description
X
0
0
1
Read for analog enable
Data ready out, high until read
Rev. A | Page 17 of 19
ADXRS290
Data Sheet
RECOMMENDED SOLDERING PROFILE
Figure 34 and Table 17 provide details about the recommended soldering profile.
CRITICAL ZONE
TO T
tP
T
L
P
T
P
RAMP-UP
T
L
tL
T
SMAX
T
SMIN
tS
RAMP-DOWN
PREHEAT
t25°C TO PEAK
TIME
Figure 34. Recommended Soldering Profile
Table 17. Recommended Soldering Profile1, 2
Condition
Pb-Free
Profile Feature
Sn63/Pb37
Average Ramp Rate from Liquid Temperature (TL) to Peak Temperature (TP)
Preheat
±°C/sec maximum
±°C/sec maximum
Minimum Temperature (TSMIN
)
100°C
150°C
Maximum Temperature (TSMAX
Time from TSMIN to TSMAX (tS)
TSMAX to TL Ramp-Up Rate
Liquid Temperature (TL)
Time Maintained Above TL (tL)
Peak Temperature (TP)
)
150°C
200°C
60 seconds to 120 seconds
±°C/second maximum
18±°C
60 seconds to 150 seconds
240 + 0/−5°C
60 seconds to 180 seconds
±°C/second maximum
217°C
60 seconds to 150 seconds
260 + 0/−5°C
Time of Actual TP − 5°C (tP)
Ramp-Down Rate
Time 25°C to Peak Temperature
10 seconds to ±0 seconds
6°C/sec maximum
6 minutes maximum
20 seconds to 40 seconds
6°C/sec maximum
8 minutes maximum
1 Based on JEDEC Standard J-STD-020D.1.
2 For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used.
PCB FOOTPRINT PATTERN
2.70mm
0.25mm
TYP
4.00mm
5.66mm
0.40mm
TYP
0.60mm TYP
4.35mm
Figure 35. PCB Footprint Pattern and Dimensions
Rev. A | Page 18 of 19
Data Sheet
ADXRS290
OUTLINE DIMENSIONS
5.90
5.80
5.70
0.35 REF
PIN 1 LAND
CORNER
1.03
BSC
5.36 REF
R 0.15
REF
VENT HOLE
0.095 REF
PIN 1 LAND
INDICATOR
0.70
BSC
1
5
0.45 × 0.30
4.60
4.50
4.40
18
15
6
18)
(PINS 6-9, 15-
0.35
REF
0.65
BSC
4.06
REF
9
14
10
1.28
REF
R 0.68
REF
BOTTOM VIEW
TOP VIEW
1.60 REF
0.30 × 0.45
0.65 BSC
14)
(PINS 1-5, 10-
1.30
1.20
1.10
SIDE VIEW
0.24 REF
Figure 36. 18-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV]
5.80 mm × 4.50 mm Body
(CE-18-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADXRS290BCEZ
ADXRS290BCEZ-RL
ADXRS290BCEZ-RL7
EVAL-ADXRS290Z
EVAL-ADXRS290Z-M
Temperature Range
Package Description
Package Option
CE-18-2
CE-18-2
−25°C to +85°C
−25°C to +85°C
−25°C to +85°C
18-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV]
18-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV]
18-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV]
Breakout Evaluation Board
Analog Devices Inertial Sensor Evaluation System, which includes a
socket version of the satellite (ADXRS290-S) board
CE-18-2
EVAL-ADXRS290Z-S
ADXRS290 Satellite, Standalone Socket Version
EVAL-ADXRS290Z-M2
Analog Devices Inertial Sensor Evaluation System, which includes a
soldered version of the satellite (ADXRS290-S2) board
EVAL-ADXRS290Z-S2
ADXRS290 Satellite, Standalone Soldered Version
1 Z = RoHS Compliant Part.
©2014 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D12636-0-12/14(A)
Rev. A | Page 19 of 19
相关型号:
©2020 ICPDF网 联系我们和版权申明