EV1HMC1094LP3 [ADI]
EVAL BRD HMC1094LP3E;
ADI 
50 dB, Logarithmic Detector,
1 GHz to 23 GHz
Data Sheet
HMC1094
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Wide input bandwidth: 1 to 23 GHz
Wide dynamic range: 50 dB up to 23 GHz
Single positive supply: 3.3 V
Excellent stability over temperature
Fast rise/fall time: 12 ns/65 ns
16-lead 3 mm × 3 mm SMT package: 9 mm²
BIAS AND
GND
RFIN
GND
RSV
1
2
3
4
12 VTEMP
11 LOGOUT
10 RSV
CONTROL CIRCUIT
DET DET
DET
APPLICATIONS
Point-to-point microwave radio
VSAT
Wideband power monitoring
Receiver signal strength indication (RSSI)
Test and measurement
9
RSV
HMC1094
PACKAGE
BASE
GND
Figure 1.
GENERAL DESCRIPTION
The HMC1094 logarithmic detector converts RF signals at its
input to a proportional dc voltage at its output. The HMC1094
employs successive compression topology that delivers high
dynamic range over a wide input frequency range.
verted into the voltage domain, and buffered to drive the
LOGOUT output.
The HMC1094 provides a nominal logarithmic slope of 18 mV/dB
and an intercept of −113 dBm at 23 GHz. Ideal as a log detector
for high volume microwave radio and VSAT applications, the
HMC1094 is housed in a compact 3 mm ×3 mm RoHS
compliant SMT plastic package.
As the input power is increased, successive amplifiers move into
saturation one by one, creating an approximation of the logarithm
function. The output of a series of detectors is summed, con-
Rev. A
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Tel: 781.329.4700 ©2013–2014 Analog Devices, Inc. All rights reserved.
Technical Support
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HMC1094
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Interface Schematics..........................................................................7
Typical Performance Characteristics ..............................................8
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings ....................................................... 5
ESD Caution.................................................................................. 5
Pin Configuration and Function Descriptions............................. 6
Application and Evaluation Printed Circuit Board (PCB)
Schematic......................................................................................... 11
Evaluation PCB............................................................................... 12
Bill of Materials for Evaluation PCB........................................ 12
Packaging and Ordering Information ......................................... 13
Outline Dimensions................................................................... 13
Ordering Guide .......................................................................... 14
REVISION HISTORY
11/14—Rev. 00.0813 to Rev. A
This Hittite Microwave Products data sheet has been reformatted
to meet the styles and standards of Analog Devices, Inc.
Updated Format..................................................................Universal
Changes to Ordering Guide .......................................................... 14
Rev. A | Page 2 of 14
Data Sheet
HMC1094
SPECIFICATIONS
VCC = 3.3 V, TA = 25°C, unless otherwise noted.
Table 1.
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
GHz
Ω
OVERALL FUNCTION
Input Frequency Range1
RF INPUT INTERFACE
Nominal Input Impedance
OUTPUT INTERFACE
Output Voltage Range
Rise Time
1
23
PIN = RFIN
50
1
2.1
V
ns
ns
f = 10 GHz, PIN = off to 0 dBm, 10% to 90%
f = 10 GHz, PIN = off to 0 dBm, 10% to 90%
12
65
Fall Time
fIN = 1 GHz
3 dB Dynamic Range
3 dB Dynamic Range Center
Deviation vs. Temperature
48
−20
0.8
dB
dBm
dB
Deviation from calculated ideal output at 25°C,
−40°C < TA < +85°C
Logarithmic Slope
Logarithmic Intercept
fIN = 5 GHz
Calibration at −38 dBm and −2 dBm
Calibration at −38 dBm and −2 dBm (x-intercept)
20
−96
mV/dB
dBm
3 dB Dynamic Range
3 dB Dynamic Range Center
Deviation vs. Temperature
48
−22
0.7
dB
dBm
dB
Deviation from calculated ideal output at 25°C,
−40°C < TA < +85°C
Logarithmic Slope
Logarithmic Intercept
fIN = 10 GHz
Calibration at −38 dBm and −2 dBm
Calibration at −38 dBm and −2 dBm (x-intercept)
21
−97
mV/dB
dBm
3 dB Dynamic Range
3 dB Dynamic Range Center
Deviation vs. Temperature
48
−23
0.5
dB
dBm
dB
Deviation from calculated ideal output at 25°C,
−40°C < TA < +85°C
Logarithmic Slope
Logarithmic Intercept
fIN = 14 GHz
Calibration at −38 dBm and −2 dBm
Calibration at −38 dBm and −2 dBm (x-intercept)
20
−100
mV/dB
dBm
3 dB Dynamic Range
3 dB Dynamic Range Center
Deviation vs. Temperature
50
−24
1
dB
dBm
dB
Deviation from calculated ideal output at 25°C,
−40°C < TA < +85°C
Logarithmic Slope
Logarithmic Intercept
fIN = 16 GHz
Calibration at −38 dBm and −2 dBm
Calibration at −38 dBm and −2 dBm (x-intercept)
19
−105
mV/dB
dBm
3 dB Dynamic Range
3 dB Dynamic Range Center
Deviation vs. Temperature
54
−25
0.7
dB
dBm
dB
Deviation from calculated ideal output at 25°C,
−40°C < TA < +85°C
Logarithmic Slope
Logarithmic Intercept
Calibration at −38 dBm and −2 dBm
Calibration at −38 dBm and −2 dBm (x-intercept)
19
−108
mV/dB
dBm
Rev. A | Page 3 of 14
HMC1094
Data Sheet
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
fIN = 18 GHz
3 dB Dynamic Range
3 dB Dynamic Range Center
Deviation vs. Temperature
54
−26
0.7
dB
dBm
dB
Deviation from calculated ideal output at 25°C,
−40°C < TA < +85°C
Logarithmic Slope
Logarithmic Intercept
fIN = 20 GHz
Calibration at −38 dBm and −2 dBm
Calibration at −38 dBm and −2 dBm (x-intercept)
18
−111
mV/dB
dBm
3 dB Dynamic Range
3 dB Dynamic Range Center
Deviation vs. Temperature
55
−27
0.8
dB
dBm
dB
Deviation from calculated ideal output at 25°C,
−40°C < TA < +85°C
Logarithmic Slope
Logarithmic Intercept
fIN = 23 GHz
Calibration at −38 dBm and −2 dBm
Calibration at −38 dBm and −2 dBm (x-intercept)
18
−113
mV/dB
dBm
3 dB Dynamic Range
3 dB Dynamic Range Center
Deviation vs. Temperature
57
−24
1.1
dB
dBm
dB
Deviation from calculated ideal output at 25°C,
−40°C < TA < +85°C
Logarithmic Slope
Logarithmic Intercept
POWER SUPPLY INTERFACE
Supply Voltage
Calibration at −38 dBm and −2 dBm
Calibration at −38 dBm and −2 dBm (x-intercept)
18
−113
mV/dB
dBm
3.15
70
3.30
85
3.45
95
V
mA
Supply Current
1 Video output load should be 1 kΩ or higher.
Rev. A | Page 4 of 14
Data Sheet
HMC1094
ABSOLUTE MAXIMUM RATINGS
Stresses at or above those listed under Absolute Maximum
Table 2.
Parameter
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rating
3.6 V
13 dBm
1.1 V
125°C
2.62 W
Supply Voltage, VCC
RF Input Power, RFIN
RF DC Level
Maximum Junction Temperature (TJ)
Continuous Power Dissipation (PDISS) at TA =
85°C (Derate 65.4 mW/°C Above 85°C)
Thermal Resistance (RTH) (Junction to
Ground Paddle)
15.29°C/W
ESD CAUTION
Storage Temperature
Operating Temperature
ESD Sensitivity Level (HBM)
−65°C to +150°C
−40°C to +85°C
Class 1B
Rev. A | Page 5 of 14
HMC1094
Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
GND
RFIN
GND
RSV
1
2
3
4
12 VTEMP
HMC1094
11 LOGOUT
TOP VIEW
10
9
RSV
RSV
(Not to Scale)
NOTES
1. NO CONNECTION NECESSARY. THIS PIN
MAY BE CONNECTED TO RF/DC GROUND
WITHOUT AFFECTING PERFORMANCE.
2. EXPOSED PAD. CONNECT THE EXPOSED
PAD TO A HIGH QUALITY RF/DC GROUND.
Figure 2. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
Mnemonic Description
1
2
GND
RFIN
Ground. This pin must be connected to a high quality RF/dc ground.
RF Input. The dc voltage level of the RF input should be 0 V. If the RF input has a dc level different than 0 V, use a
dc block capacitor.
3
4
5
6
7
8
GND
RSV
RSV
GND
GND
NC
Ground. This pin must be connected to a high quality RF/dc ground.
Reserved. This pin is reserved for internal use; leave this pin floating.
Reserved. This pin is reserved for internal use; leave this pin floating.
Ground. This pin must be connected to a high quality RF/dc ground.
Ground. This pin must be connected to a high quality RF/dc ground.
No Connect. No connection is necessary for this pin; this pin may be connected to RF/dc ground without
affecting performance.
9
RSV
RSV
LOGOUT
VTEMP
VCC
VCC
VCC
VCC
EP
Reserved. This pin is reserved for internal use; leave this pin floating.
Reserved. This pin is reserved for internal use; leave this pin floating.
Log Out. The log out load should be at least 1 kΩ or higher.
Temperature Sensor Output. This pin requires a minimum 10 kΩ resistance or higher.
Bias Supply. Connect a supply voltage to this pin with appropriate filtering.
Bias Supply. Connect a supply voltage to this pin with appropriate filtering.
Bias Supply. Connect a supply voltage to this pin with appropriate filtering.
Bias Supply. Connect a supply voltage to this pin with appropriate filtering.
Exposed Pad. Connect the exposed pad to a high quality RF/dc ground.
10
11
12
13
14
15
16
Rev. A | Page 6 of 14
Data Sheet
HMC1094
INTERFACE SCHEMATICS
V
CC
GND
VTEMP
Figure 3. GND Interface
Figure 6. VTEMP Interface
RFIN
V
CC
ESD
Figure 4. RFIN Interface
ESD
V
CC
LOGOUT
Figure 7. VCC Interface
Figure 5. LOGOUT Interface
Rev. A | Page 7 of 14
HMC1094
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
VCC = 3.3 V, T A = 25°C, unless otherwise noted.
2.25
2.00
1.75
1.50
1.25
1.00
0.75
3
2.25
2.00
1.75
1.50
1.25
1.00
0.75
3
2
2
1
1
0
0
–1
–2
–3
–1
IDEAL
IDEAL
–2
T
T
T
= +85°C
= +25°C
= –40°C
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
A
A
A
–3
10
–60
–50
–40
–30
–20
–10
0
10
–60
–50
–40
–30
–20
–10
0
INPUT POWER (dBm)
INPUT POWER (dBm)
Figure 8. LOGOUT and Error vs. Input Power, fIN = 1 GHz
Figure 11. LOGOUT and Error vs. Input Power, fIN = 14 GHz
2.25
3
2
1
0
2.25
2.00
1.75
1.50
1.25
1.00
0.75
3
2
2.00
1.75
1.50
1.25
1.00
0.75
1
0
–1
–2
–3
–1
IDEAL
IDEAL
T
T
T
= +85°C
= +25°C
= –40°C
–2
A
A
A
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
–3
10
–60
–50
–40
–30
–20
–10
0
10
–60
–50
–40
–30
–20
–10
0
INPUT POWER (dBm)
INPUT POWER (dBm)
Figure 12. LOGOUT and Error vs. Input Power, fIN = 16 GHz
Figure 9. LOGOUT and Error vs. Input Power, fIN = 5 GHz
2.25
3
2.25
3
2
1
0
2.00
1.75
1.50
1.25
1.00
0.75
2
2.00
1.75
1.50
1.25
1.00
0.75
1
0
–1
–2
–3
–1
IDEAL
IDEAL
–2
T
T
T
= +85°C
= +25°C
= –40°C
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
A
A
A
–3
10
–60
–50
–40
–30
–20
–10
0
10
–60
–50
–40
–30
–20
–10
0
INPUT POWER (dBm)
INPUT POWER (dBm)
Figure 13. LOGOUT and Error vs. Input Power, fIN = 18 GHz
Figure 10. LOGOUT and Error vs. Input Power, fIN = 10 GHz
Rev. A | Page 8 of 14
Data Sheet
HMC1094
2.25
2.00
1.75
1.50
1.25
1.00
0.75
3
2.25
2.00
1.75
1.50
1.25
1.00
0.75
2
1
0
1GHz
5GHz
–1
–2
–3
10GHz
14GHz
16GHz
18GHz
20GHz
23GHz
IDEAL
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
–60
–50
–40
–30
–20
–10
0
10
–60
–50
–40
–30
–20
–10
0
10
INPUT POWER (dBm)
INPUT POWER (dBm)
Figure 14. LOGOUT and Error vs. Input Power, fIN = 20 GHz
Figure 16. LOGOUT vs. Frequency
2.25
2.00
1.75
1.50
1.25
1.00
0.75
3
2.1
2.0
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
2GHz
10GHz
18GHz
2
1
0
–1
–2
–3
IDEAL
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
–60
–50
–40
–30
–20
–10
0
10
0
25
50
75
100 125 150 175 200 225 250
TIME (ns)
INPUT POWER (dBm)
Figure 15. LOGOUT and Error vs. Input Power, fIN = 23 GHz
Figure 17. Fall Time for Various Frequencies at PIN = 0 dBm
Rev. A | Page 9 of 14
HMC1094
Data Sheet
2.0
1.8
1.6
1.4
1.2
1.0
1.4
1.3
1.2
1.1
1.0
0.9
0.8
2GHz
10GHz
18GHz
0
5
10 15 20 25 30 35 40 45 50 55 60
TIME (ns)
–45
25
95
TEMPERATURE (°C)
Figure 18. Rise Time for Various Frequencies at PIN = 0 dBm
Figure 20. VTEMP vs. Temperature
0
–5
–10
–15
–20
–25
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
0
5
10
15
20
25
30
FREQUENCY (GHz)
Figure 19. Input Return Loss vs. Frequency
Rev. A | Page 10 of 14
Data Sheet
HMC1094
APPLICATION AND EVALUATION PRINTED CIRCUIT BOARD (PCB) SCHEMATIC
V
CC
TP1
+
C1
4.7µF
C2
10nF
C3
10nF
VTEMP
TP3
GND
RFIN
GND
RSV
1
12 VTEMP
11 LOGOUT
10 RSV
BIAS AND
CONTROL CIRCUIT
RFIN
J2
2
3
4
R7
0Ω
DET DET
DET
LOGOUT
J5
9
RSV
HMC1094
PACKAGE
BASE
GND
TP2
GND
NOTES
1. LOG OUTPUT LOAD SHOULD BE 1kΩ OR HIGHER.
Figure 21. Application and Evaluation PCB Schematic
Table 4.
Component
R7
Description
Default Value
Bypass resistor; used to make the RFIN line connection on the board
Power supply decoupling
R7 = 0 Ω (Size 0402)
C1 = 4.7 μF (size tantalum)
C1
C2, C3
Power supply decoupling
C2 and C3 = 10 nF (Size 0402)
Rev. A | Page 11 of 14
HMC1094
Data Sheet
EVALUATION PCB
TP1
VTEMP
TP2
GND
V
TP3
CC
C1
C2
C3
LOGOUT
R7
H1094
XXXX
J2
J5
RFIN
600-00733-00-2
U1
Figure 22. Evaluation PCB Layout, Top Side
BILL OF MATERIALS FOR EVALUATION PCB
The circuit board used in the application uses RF circuit design
techniques. Signal lines should have 50 Ω impedance whereas
the package ground leads and exposed paddle should be
connected directly to the ground plane similar to that shown in
Figure 21. Use a sufficient number of via holes to connect the
top and bottom ground planes.
Table 5. Bill of Materials
Item
Description
J2
K-type connector
J5
SMA connector
TP1, TP2, TP3
DC pin
C2, C3
C1
R7
U1
PCB1
10 nF capacitor, 0402 package
4.7 µF tantalum capacitor
0 Ω resistor, 0402 package
HMC1094 log detector
600-00733-00 evaluation PCB
1 Circuit board material: Rogers 4350B or Arlon 25 FR.
Rev. A | Page 12 of 14
Data Sheet
HMC1094
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
TOP VIEW
BOTTOM VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
NOTES:
1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA
AND SILICON IMPREGNATED.
2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.
3. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
6. CHARACTERS TO BE HELVETICA MEDIUM, .018 HIGH, WHITE INK, OR LASER MARK
LOCATED APPROX. AS SHOWN.
7. PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL BE 0.05mm.
8. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
9. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN.
Figure 23. 16-Lead Quad Flat No-Lead Package [QFN]
3 mm × 3 mm Body, Very Thin Quad
Dimensions shown in inches and [millimeters]
Figure 24. Tape and Reel Outline Dimensions
Dimensions shown in millimeters
Rev. A | Page 13 of 14
HMC1094
Data Sheet
ORDERING GUIDE
Temperature
MSL
Package
Option
Model1
Range
Lead Finish
Rating2 Package Description
Qty.
Branding3
H1094
HMC1094LP3E
−40°C to +85°C
100% matte Sn
MSL1
16-Lead Low Stress Injection
Molded Plastic
XXXX
HMC1094LP3ETR −40°C to +85°C 100% matte Sn
MSL1
16-Lead Low Stress Injection
Molded Plastic, 7” Tape and Reel
QFN
500
H1094
XXXX
EV1HMC1094LP3
HMC1094 Evaluation Board
1 E = RoHS Compliant Part.
2 Maximum peak reflow temperature of 260°C for HMC1094LP3E and HMC1094LP3ETR.
3 Four-digit lot number represented by XXXX.
©2013–2014 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D12810-0-11/14(A)
www.analog.com/HMC1094
Rev. A | Page 14 of 14
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