ADXL327BCPZ-RL7 [ADI]

Small, Low Power, 3-Axis ±2 g Accelerometer; 小尺寸,低功耗, 3轴±2 g加速度
ADXL327BCPZ-RL7
型号: ADXL327BCPZ-RL7
厂家: ADI    ADI
描述:

Small, Low Power, 3-Axis ±2 g Accelerometer
小尺寸,低功耗, 3轴±2 g加速度

模拟IC 信号电路
文件: 总16页 (文件大小:332K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Small, Low Power, 3-Axis ± ± g  
Accelerometer  
ADXL3±7  
FEATURES  
GENERAL DESCRIPTION  
3-axis sensing  
Small, low profile package  
4 mm × 4 mm × 1.45 mm LFCSP  
Low power: 350 μA typical  
Single-supply operation: 1.8 V to 3.6 V  
10,000 g shock survival  
The ADXL327 is a small, low power, complete 3-axis accelerometer  
with signal conditioned voltage outputs. The product measures  
acceleration with a minimum full-scale range of 2 g. It can  
measure the static acceleration of gravity in tilt-sensing  
applications, as well as dynamic acceleration, resulting from  
motion, shock, or vibration.  
Excellent temperature stability  
Bandwidth adjustment with a single capacitor per axis  
RoHS/WEEE lead-free compliant  
The user selects the bandwidth of the accelerometer using  
the CX, CY, and CZ capacitors at the XOUT, YOUT, and ZOUT pins.  
Bandwidths can be selected to suit the application with a  
range of 0.5 Hz to 1600 Hz for X and Y axes and a range of  
0.5 Hz to 550 Hz for the Z axis.  
APPLICATIONS  
Cost-sensitive, low power, motion- and tilt-sensing applications  
Mobile devices  
Gaming systems  
The ADXL327 is available in a small, low profile, 4 mm ×  
4 mm × 1.45 mm, 16-lead, plastic lead frame chip scale package  
(LFCSP_LQ).  
Disk drive protection  
Image stabilization  
Sports and health devices  
FUNCTIONAL BLOCK DIAGRAM  
+3V  
V
S
ADXL327  
X
OUT  
~32k  
~32kΩ  
~32kΩ  
OUTPUT AMP  
OUTPUT AMP  
OUTPUT AMP  
C
X
Y
Z
3-AXIS  
SENSOR  
Y
Z
OUT  
C
AC AMP  
DEMOD  
DC  
C
OUT  
C
COM  
ST  
Figure 1.  
Rev. 0  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks and registeredtrademarks arethe property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
©2009 Analog Devices, Inc. All rights reserved.  
 
ADXL3±7  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Performance................................................................................ 10  
Applications Information.............................................................. 11  
Power Supply Decoupling ......................................................... 11  
Setting the Bandwidth Using CX, CY, and CZ .......................... 11  
Self Test........................................................................................ 11  
Applications....................................................................................... 1  
General Description......................................................................... 1  
Functional Block Diagram .............................................................. 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
Absolute Maximum Ratings............................................................ 4  
ESD Caution.................................................................................. 4  
Pin Configuration and Function Descriptions............................. 5  
Typical Performance Characteristics ............................................. 6  
Theory of Operation ...................................................................... 10  
Mechanical Sensor...................................................................... 10  
Design Trade-Offs for Selecting Filter Characteristics: The  
Noise/BW Trade-Off.................................................................. 11  
Use with Operating Voltages Other Than 3 V .......................... 11  
Axes of Acceleration Sensitivity ............................................... 12  
Layout and Design Recommendations ................................... 13  
Outline Dimensions....................................................................... 14  
Ordering Guide .......................................................................... 14  
REVISION HISTORY  
8/09—Revision 0: Initial Version  
Rev. 0 | Page 2 of 16  
 
ADXL3±7  
SPECIFICATIONS  
TA = 25°C, VS = 3 V, CX = CY = CZ = 0.1 μF, acceleration = 0 g, unless otherwise noted. All minimum and maximum specifications are  
guaranteed. Typical specifications are not guaranteed.  
Table 1.  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
SENSOR INPUT  
Each axis  
Measurement Range  
2
2.ꢀ  
0.2  
1
0.1  
1
g
Nonlinearity  
Percent of full scale  
%
Package Alignment Error  
Interaxis Alignment Error  
Cross Axis Sensitivity1  
SENSITIVITY (RATIOMETRIC)2  
Sensitivity at XOUT, YOUT, ZOUT  
Sensitivity Change Due to Temperature3  
ZERO g BIAS LEVEL (RATIOMETRIC)  
0 g Voltage at XOUT, YOUT  
0 g Voltage at ZOUT  
Degrees  
Degrees  
%
Each axis  
VS = 3 V  
VS = 3 V  
378  
420  
0.01  
462  
mV/g  
%/°C  
VS = 3 V  
VS = 3 V  
1.3  
1.2  
1.ꢀ  
1.ꢀ  
1
1.7  
1.8  
V
V
0 g Offset vs. Temperature  
NOISE PERFORMANCE  
Noise Density XOUT, YOUT, ZOUT  
FREQUENCY RESPONSE4  
mg/°C  
2ꢀ0  
μg/√Hz rms  
Bandwidth XOUT, YOUT  
No external filter  
No external filter  
1600  
ꢀꢀ0  
Hz  
Bandwidth ZOUT  
Hz  
RFILT Tolerance  
Sensor Resonant Frequency  
SELF TEST6  
32 1ꢀ%  
ꢀ.ꢀ  
kΩ  
kHz  
Logic Input Low  
Logic Input High  
+0.6  
+2.4  
+60  
−4ꢀ0  
+4ꢀ0  
+770  
V
V
ST Actuation Current  
Output Change at XOUT  
Output Change at YOUT  
Output Change at ZOUT  
OUTPUT AMPLIFIER  
Output Swing Low  
Output Swing High  
POWER SUPPLY  
μA  
mV  
mV  
Self test 0 to 1  
Self test 0 to 1  
Self test 0 to 1  
−210  
+210  
+210  
−8ꢀ0  
+8ꢀ0  
+1400 mV  
No load  
No load  
0.1  
2.8  
V
V
Operating Voltage Range  
1.8  
3.6  
V
Supply Current  
Turn-On Time7  
VS = 3 V  
3ꢀ0  
1
μA  
ms  
No external filter  
TEMPERATURE  
Operating Temperature Range  
−40  
+8ꢀ  
°C  
1 Defined as coupling between any two axes.  
2 Sensitivity is essentially ratiometric to VS.  
3 Defined as the output change from ambient-to-maximum temperature or ambient-to-minimum temperature.  
4 Actual frequency response controlled by user-supplied external filter capacitors (CX, CY, CZ).  
Bandwidth with external capacitors = 1/(2 × π × 32 kΩ × C). For CX, CY = 0.003 μF, bandwidth = 1.6 kHz. For CZ = 0.01 μF, bandwidth = ꢀ00 Hz. For CX, CY, CZ = 10 μF,  
bandwidth = 0.ꢀ Hz.  
6 Self test response changes cubically with VS.  
7 Turn-on time is dependent on CX, CY, CZ and is approximately 160 × CX or CY or CZ + 1 ms, where CX, CY, CZ are in μF.  
Rev. 0 | Page 3 of 16  
 
 
ADXL3±7  
ABSOLUTE MAXIMUM RATINGS  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Table 2.  
Parameter  
Rating  
Acceleration (Any Axis, Unpowered)  
10,000 g  
Acceleration (Any Axis, Powered)  
10,000 g  
VS  
−0.3 V to +3.6 V  
(COM − 0.3 V) to (VS + 0.3 V)  
Indefinite  
All Other Pins  
Output Short-Circuit Duration  
(Any Pin to Common)  
Temperature Range (Powered)  
Temperature Range (Storage)  
−ꢀꢀ°C to +12ꢀ°C  
−6ꢀ°C to +1ꢀ0°C  
ESD CAUTION  
Rev. 0 | Page 4 of 16  
 
ADXL3±7  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS  
16  
15  
14  
13  
ADXL327  
1
2
3
4
12  
NC  
ST  
X
OUT  
TOP VIEW  
(Not to Scale)  
11  
10  
NC  
Y
+Y  
+Z  
+X  
COM  
NC  
OUT  
9
NC  
5
6
7
8
NC = NO CONNECT  
Figure 2. Pin Configuration  
Table 3. Pin Function Descriptions  
Pin No.  
Mnemonic  
Description  
1
NC  
No Connect (or Optionally Ground)  
2
ST  
Self Test  
3
4
COM  
NC  
Common  
No Connect  
6
7
8
COM  
COM  
COM  
ZOUT  
Common  
Common  
Common  
Z Channel Output  
9
NC  
YOUT  
NC  
XOUT  
NC  
VS  
VS  
NC  
No Connect (or Optionally Ground)  
Y Channel Output  
No Connect  
X Channel Output  
No Connect  
Supply Voltage (1.8 V to 3.6 V)  
Supply Voltage (1.8 V to 3.6 V)  
No Connect  
10  
11  
12  
13  
14  
1ꢀ  
16  
EP  
Exposed pad  
Not internally connected. Solder for mechanical integrity.  
Rev. 0 | Page ꢀ of 16  
 
ADXL3±7  
TYPICAL PERFORMANCE CHARACTERISTICS  
N > 1000 for all typical performance plots, unless otherwise noted.  
60  
50  
40  
30  
20  
10  
0
50  
40  
30  
20  
10  
0
1.45 1.46 1.47 1.48 1.49 1.50 1.51 1.52 1.53 1.54 1.55  
–0.48  
–0.46  
–0.44  
–0.42  
–0.40  
–0.38  
–0.36  
OUTPUT (V)  
VOLTAGE (V)  
Figure 3. X-Axis Zero g Bias at 25°C, VS = 3 V  
Figure 6. X-Axis Self Test Response at 25°C, VS = 3 V  
40  
30  
20  
10  
50  
40  
30  
20  
10  
0
0
1.45 1.46 1.47 1.48 1.49 1.50 1.51 1.52 1.53 1.54 1.55  
0.36 0.37 0.38 0.39 0.40 0.41 0.42 0.43 0.44 0.45 0.46 0.47 0.48  
VOLTAGE (V)  
OUTPUT (V)  
Figure 7. Y-Axis Self Test Response at 25°C, VS = 3 V  
Figure 4. Y-Axis Zero g Bias at 25°C, VS = 3 V  
25  
20  
15  
10  
5
30  
20  
10  
0
0
0.66  
0.68  
0.70  
0.72  
0.74  
0.76  
0.78  
0.80  
0.82  
1.40 1.42 1.44 1.46 1.48 1.50 1.52 1.54 1.56 1.58 1.60  
VOLTAGE (V)  
OUTPUT (V)  
Figure 8. Z-Axis Self Test Response at 25°C, VS = 3 V  
Figure 5. Z-Axis Zero g Bias at 25°C, VS = 3 V  
Rev. 0 | Page 6 of 16  
 
ADXL3±7  
70  
60  
50  
40  
30  
20  
10  
0
N = 8  
1.57  
1.55  
1.53  
1.51  
1.49  
1.47  
1.45  
1.43  
–40 –30 –20 –10  
0
10 20 30 40 50 60 70 80 90 100  
TEMPERATURE (°C)  
–1.0 –0.8 –0.6 –0.4 –0.2  
0
0.2 0.4 0.6 0.8 1.0  
/°C)  
TEMPERATURE COEFFICIENT (m  
g
Figure 12. X-Axis Zero g Bias vs. Temperature, Eight Parts Soldered to PCB  
Figure 9. X-Axis Zero g Bias Temperature Coefficient, VS = 3 V  
60  
50  
40  
30  
20  
10  
0
N = 8  
1.57  
1.55  
1.53  
1.51  
1.49  
1.47  
1.45  
1.43  
–40 –30 –20 –10  
0
10 20 30 40 50 60 70 80 90 100  
TEMPERATURE (°C)  
–1.0 –0.8 –0.6 –0.4 –0.2  
0
0.2 0.4 0.6 0.8 1.0  
TEMPERATURE COEFFICIENT (mg/°C)  
Figure 10. Y-Axis Zero g Bias Temperature Coefficient, VS = 3 V  
Figure 13. Y-Axis Zero g Bias vs. Temperature, Eight Parts Soldered to PCB  
60  
50  
40  
30  
20  
10  
0
N = 8  
1.54  
1.52  
1.50  
1.48  
1.46  
1.44  
1.42  
1.40  
–40 –30 –20 –10  
0
10 20 30 40 50 60 70 80 90 100  
TEMPERATURE (°C)  
–3.0 –2.5 –2.0 –1.5 –1.0 –0.5  
0
0.5 1.0 1.5 2.0 2.5 3.0  
/°C)  
TEMPERATURE COEFFICIENT (m  
g
Figure 14. Z-Axis Zero g Bias vs. Temperature, Eight Parts Soldered to PCB  
Figure 11. Z-Axis Zero g Bias Temperature Coefficient, VS = 3 V  
Rev. 0 | Page 7 of 16  
ADXL3±7  
0.46  
0.45  
0.44  
0.43  
0.42  
0.41  
0.40  
0.39  
0.38  
60  
50  
40  
30  
20  
10  
N = 8  
0
–40 –30 –20 –10  
0
10 20 30 40 50 60 70 80 90  
TEMPERATURE (°C)  
0.38  
0.39  
0.40  
0.41  
0.42  
0.43  
0.44  
0.45  
0.46  
SENSITIVITY (V/  
g)  
Figure 15. X-Axis Sensitivity at 25°C, VS = 3 V  
Figure 18. X-Axis Sensitivity vs. Temperature,  
Eight Parts Soldered to PCB, VS = 3 V  
70  
60  
50  
40  
30  
20  
10  
0.46  
0.45  
0.44  
0.43  
0.42  
0.41  
0.40  
0.39  
0.38  
N = 8  
0
0.38  
0.39  
0.40  
0.41  
0.42  
0.43  
0.44  
0.45  
0.46  
–40 –30 –20 –10  
0
10 20 30 40 50 60 70 80 90  
TEMPERATURE (°C)  
SENSITIVITY (V/  
g)  
Figure 16. Y-Axis Sensitivity at 25°C, VS = 3 V  
Figure 19. Y-Axis Sensitivity vs. Temperature,  
Eight Parts Soldered to PCB, VS = 3 V  
60  
50  
40  
30  
20  
10  
0.46  
0.45  
0.44  
0.43  
0.42  
0.41  
0.40  
0.39  
0.38  
N = 8  
0
0.38  
0.39  
0.40  
0.41  
0.42  
0.43  
0.44  
0.45  
0.46  
–40 –30 –20 –10  
0
10 20 30 40 50 60 70 80 90  
TEMPERATURE (°C)  
SENSITIVITY (V/g)  
Figure 17. Z-Axis Sensitivity at 25°C, VS = 3 V  
Figure 20. Z-Axis Sensitivity vs. Temperature,  
Eight Parts Soldered to PCB, VS = 3 V  
Rev. 0 | Page 8 of 16  
ADXL3±7  
600  
500  
400  
300  
200  
100  
0
CH4: Z  
, 500mV/DIV  
OUT  
CH3: Y  
CH2: X  
, 500mV/DIV  
, 500mV/DIV  
OUT  
OUT  
4
3
2
CH1: POWER, 2V/DIV  
1
OUTPUTS ARE OFFSET  
FOR CLARITY  
TIME (1ms/DIV)  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
SUPPLY (V)  
Figure 22. Typical Turn-On Time, VS = 3 V  
CX = CY = CZ = 0.0047 μF  
Figure 21. Typical Current Consumption vs. Supply Voltage  
Rev. 0 | Page 9 of 16  
ADXL3±7  
THEORY OF OPERATION  
The ADXL327 is a complete 3-axis acceleration measurement  
system. The ADXL327 has a measurement range of 2 g minimum.  
It contains a polysilicon surface micromachined sensor and signal  
conditioning circuitry to implement an open-loop acceleration  
measurement architecture. The output signals are analog voltages  
that are proportional to acceleration. The accelerometer can  
measure the static acceleration of gravity in tilt sensing applications,  
as well as dynamic acceleration, resulting from motion, shock,  
or vibration.  
MECHANICAL SENSOR  
The ADXL327 uses a single structure for sensing the X, Y, and Z axes.  
As a result, the three axes sense directions are highly orthogonal  
with little cross-axis sensitivity. Mechanical misalignment of the  
sensor die to the package is the chief source of cross-axis sensitivity.  
Mechanical misalignment can, of course, be calibrated out at  
the system level.  
PERFORMANCE  
Rather than using additional temperature compensation circuitry,  
innovative design techniques ensure that high performance is  
built-in to the ADXL327. As a result, there is neither quantization  
error nor nonmonotonic behavior, and temperature hysteresis is  
very low (typically <3 mg over the −25°C to +70°C temperature  
range).  
The sensor is a polysilicon surface micromachined structure  
built on top of a silicon wafer. Polysilicon springs suspend the  
structure over the surface of the wafer and provide a resistance  
against acceleration forces. Deflection of the structure is measured  
using a differential capacitor that consists of independent fixed  
plates and plates attached to the moving mass. The fixed plates  
are driven by 180° out-of-phase square waves. Acceleration deflects  
the moving mass and unbalances the differential capacitor resulting  
in a sensor output whose amplitude is proportional to acceleration.  
Phase-sensitive demodulation techniques are then used to  
determine the magnitude and direction of the acceleration.  
The demodulator output is amplified and brought off-chip through  
a 32 kΩ resistor. The user then sets the signal bandwidth of the  
device by adding a capacitor. This filtering improves measurement  
resolution and helps prevent aliasing.  
Rev. 0 | Page 10 of 16  
 
ADXL3±7  
APPLICATIONS INFORMATION  
POWER SUPPLY DECOUPLING  
DESIGN TRADE-OFFS FOR SELECTING FILTER  
CHARACTERISTICS: THE NOISE/BW TRADE-OFF  
For most applications, a single 0.1 μF capacitor, CDC, placed  
close to the ADXL327 supply pins adequately decouples the  
accelerometer from noise on the power supply. However, in  
applications where noise is present at the 50 kHz internal clock  
frequency (or any harmonic thereof), additional care in power  
supply bypassing is required because this noise can cause errors  
in acceleration measurement. If additional decoupling is needed, a  
100 Ω (or smaller) resistor or ferrite bead can be inserted in the  
supply line. Additionally, a larger bulk bypass capacitor (1 μF or  
greater) can be added in parallel to CDC. Ensure that the  
connection from the ADXL327 ground to the power supply  
ground is low impedance because noise transmitted through  
ground has a similar effect as noise transmitted through VS.  
The selected accelerometer bandwidth ultimately determines  
the measurement resolution (smallest detectable acceleration).  
Filtering can be used to lower the noise floor to improve the  
resolution of the accelerometer. Resolution is dependent on the  
analog filter bandwidth at XOUT, YOUT, and ZOUT  
.
The output of the ADXL327 has a typical bandwidth greater than  
500 Hz. The user must filter the signal at this point to limit  
aliasing errors. The analog bandwidth must be no more than  
half the analog-to-digital sampling frequency to minimize  
aliasing. The analog bandwidth can be further decreased to  
reduce noise and improve resolution.  
The ADXL327 noise has the characteristics of white Gaussian  
noise, which contributes equally at all frequencies and is described  
in terms of μg/√Hz (the noise is proportional to the square root  
of the accelerometer bandwidth). The user should limit bandwidth  
to the lowest frequency needed by the application to maximize the  
resolution and dynamic range of the accelerometer.  
SETTING THE BANDWIDTH USING CX, CY, AND CZ  
The ADXL327 has provisions for band limiting the XOUT  
,
YOUT, and ZOUT pins. Capacitors must be added at these pins to  
implement low-pass filtering for antialiasing and noise reduction.  
The 3 dB bandwidth equation is  
f
−3 dB = 1/(2π(32 kΩ) × C(X, Y, Z)  
or more simply  
–3 dB = 5 ꢀF/C(X, Y, Z)  
)
With the single-pole roll-off characteristic, the typical noise of  
the ADXL327 is determined by  
rms Noise = Noise Density ×  
( BW ×1.6)  
f
Often, the peak value of the noise is desired. Peak-to-peak noise  
can only be estimated by statistical methods. Table 5 is useful  
for estimating the probabilities of exceeding various peak  
values, given the rms value.  
The tolerance of the internal resistor (RFILT) typically varies as  
much as 15% of its nominal value (32 kΩ), and the bandwidth  
varies accordingly. A minimum capacitance of 0.0047 μF for CX,  
CY, and CZ is recommended in all cases.  
Table 5. Estimation of Peak-to-Peak Noise  
Table 4. Filter Capacitor Selection, CX, CY, and CZ  
% of Time That Noise Exceeds  
Bandwidth (Hz)  
Capacitor (μF)  
Peak-to-Peak Value  
2 × rms  
Nominal Peak-to-Peak Value  
1
4.7  
32  
10  
ꢀ0  
100  
200  
ꢀ00  
0.47  
0.10  
0.0ꢀ  
0.027  
0.01  
4 × rms  
6 × rms  
8 × rms  
4.6  
0.27  
0.006  
USE WITH OPERATING VOLTAGES OTHER THAN 3 V  
The ADXL327 is tested and specified at VS = 3 V; however, it can be  
powered with VS as low as 1.8 V or as high as 3.6 V. Note that some  
performance parameters change as the supply voltage is varied.  
SELF TEST  
The ST pin controls the self test feature. When this pin is set to  
VS, an electrostatic force is exerted on the accelerometer beam.  
The resulting movement of the beam allows the user to test  
whether the accelerometer is functional. The typical change in  
output is −1.08 g (corresponding to −450 mV) in the X axis,  
+1.08 g (+450 mV) on the Y axis, and +1.83 g (+770 mV) on  
the Z axis. This ST pin can be left open circuit or connected to  
common (COM) in normal use.  
The ADXL327 output is ratiometric; therefore, the output  
sensitivity (or scale factor) varies proportionally to the supply  
voltage. At VS = 3.6 V, the output sensitivity is typically 500 mV/g.  
At VS = 2 V, the output sensitivity is typically 289 mV/g.  
The zero g bias output is also ratiometric; therefore, the zero g  
output is nominally equal to VS/2 at all supply voltages.  
The output noise is not ratiometric but is absolute in volts;  
therefore, the noise density decreases as the supply voltage  
increases. This is because the scale factor (mV/g) increases while  
the noise voltage remains constant. At VS = 3.6 V, the X- and Y-  
axis noise density is typically 200 μg/√Hz, while at VS = 2 V, the  
X- and Y-axis noise density is typically 300 μg/√Hz.  
Never expose the ST pin to voltages greater than VS + 0.3 V. If  
this cannot be guaranteed due to the system design (for instance,  
there are multiple supply voltages), then a low VF clamping  
diode between ST and VS is recommended.  
Rev. 0 | Page 11 of 16  
 
 
ADXL3±7  
Self test response in g is roughly proportional to the square of  
the supply voltage. However, when ratiometricity of sensitivity  
is factored in with supply voltage, the self test response in volts  
is roughly proportional to the cube of the supply voltage.  
AXES OF ACCELERATION SENSITIVITY  
A
Z
For example, at VS = 3.6 V, the self test response for the ADXL327  
is approximately −780 mV for the X axis, +780 mV for the Y axis,  
and +1330 mV for the Z axis. At VS = 2 V, the self test response  
is approximately −130 mV for the X axis, +130 mV for the Y axis,  
and −220 mV for the Z axis.  
A
Y
TOP  
The supply current decreases as the supply voltage decreases.  
Typical current consumption at VS = 3.6 V is 375 μA, and  
typical current consumption at VS = 2 V is 300 μA.  
A
X
Figure 23. Axes of Acceleration Sensitivity (Corresponding Output Voltage  
Increases When Accelerated Along the Sensitive Axis)  
X
Y
Z
= –1g  
= 0g  
= 0g  
OUT  
OUT  
OUT  
TOP  
GRAVITY  
X
Y
Z
= 0g  
= –1g  
= 0g  
X
Y
Z
= 0g  
= 1g  
= 0g  
OUT  
OUT  
OUT  
OUT  
TOP  
TOP  
OUT  
OUT  
TOP  
X
Y
Z
= 1g  
= 0g  
= 0g  
OUT  
OUT  
OUT  
T
O
P
X
Y
Z
= 0g  
= 0g  
= 1g  
X
Y
Z
= 0g  
= 0g  
= –1g  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
Figure 24. Output Response vs. Orientation to Gravity  
Rev. 0 | Page 12 of 16  
 
ADXL3±7  
LAYOUT AND DESIGN RECOMMENDATIONS  
The recommended soldering profile is shown in Figure 25, followed by a description of the profile features in Table 6. The recommended  
PCB layout or solder land drawing is shown in Figure 26.  
CRITICAL ZONE  
tP  
T
TO T  
L
P
T
P
RAMP-UP  
T
L
tL  
T
SMAX  
T
SMIN  
tS  
RAMP-DOWN  
PREHEAT  
t25°C TO PEAK  
TIME  
Figure 25. Recommended Soldering Profile  
Table 6. Recommended Soldering Profile  
Profile Feature  
Sn63/Pb37  
Pb-Free  
Average Ramp Rate (TL to TP)  
Preheat  
3°C/sec maximum  
3°C/sec maximum  
Minimum Temperature (TSMIN  
)
100°C  
1ꢀ0°C  
Maximum Temperature (TSMAX  
Time (TSMIN to TSMAX), tS  
)
1ꢀ0°C  
60 sec to 120 sec  
200°C  
60 sec to 180 sec  
TSMAX to TL  
Ramp-Up Rate  
3°C/sec maximum  
3°C/sec maximum  
Time Maintained Above Liquidous (TL)  
Liquidous Temperature (TL)  
Time (tL)  
Peak Temperature (TP)  
Time Within ꢀ°C of Actual Peak Temperature (tP)  
Ramp-Down Rate  
183°C  
217°C  
60 sec to 1ꢀ0 sec  
240°C + 0°C/−ꢀ°C  
10 sec to 30 sec  
6°C/sec maximum  
6 minutes maximum  
60 sec to 1ꢀ0 sec  
260°C + 0°C/−ꢀ°C  
20 sec to 40 sec  
6°C/sec maximum  
8 minutes maximum  
Time 2ꢀ°C to Peak Temperature  
0.50  
MAX  
4
0.65  
0.325  
0.35  
MAX  
0.65  
4
1.95  
0.325  
CENTER PAD IS NOT  
INTERNALLY CONNECTED  
BUT SHOULD BE SOLDERED  
FOR MECHANICAL INTEGRITY  
1.95  
DIMENSIONS SHOWN IN MILLIMETERS  
Figure 26. Recommended PCB Layout  
Rev. 0 | Page 13 of 16  
 
 
 
 
ADXL3±7  
OUTLINE DIMENSIONS  
0.20 MIN  
PIN 1  
INDICATOR  
0.20 MIN  
0.65 BSC  
13  
16  
PIN 1  
INDICATOR  
1
4
12  
9
4.15  
2.43  
1.75 SQ  
1.08  
EXPOSED  
PAD  
(BOTTOM VIEW)  
4.00 SQ  
3.85  
TOP VIEW  
8
5
0.55  
0.50  
0.45  
1.95 BSC  
0.05 MAX  
0.02 NOM  
FOR PROPER CONNECTION OF  
THE EXPOSED PAD, REFER TO  
THE PIN CONFIGURATION AND  
FUNCTION DESCRIPTIONS  
1.50  
1.45  
1.40  
0.35  
0.30  
0.25  
COPLANARITY  
0.05  
SEATING  
PLANE  
SECTION OF THIS DATA SHEET.  
*
STACKED DIE WITH GLASS SEAL.  
Figure 27. 16-Lead Lead Frame Chip Scale Package [LFCSP_LQ]  
4 mm × 4 mm Body, 1.45 mm Thick Quad  
(CP-16-5a*)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Model  
Measurement Range Specified Voltage  
Temperature Range Package Description Package Option  
ADXL327BCPZ1  
ADXL327BCPZ–RL1  
ADXL327BCPZ–RL71  
EVAL-ADXL327Z1  
2 g  
2 g  
2 g  
3 V  
3 V  
3 V  
−40°C to +8ꢀ°C  
−40°C to +8ꢀ°C  
−40°C to +8ꢀ°C  
16-Lead LFCSP_LQ  
16-Lead LFCSP_LQ  
16-Lead LFCSP_LQ  
Evaluation Board  
CP-16-ꢀa  
CP-16-ꢀa  
CP-16-ꢀa  
1 Z = RoHS Compliant Part.  
Rev. 0 | Page 14 of 16  
 
 
ADXL3±7  
NOTES  
Rev. 0 | Page 1ꢀ of 16  
ADXL3±7  
NOTES  
Analog Devices offers specific products designated for automotive applications; please consult your local Analog Devices sales representative for details. Standard products sold by  
Analog Devices are not designed, intended, or approved for use in life support, implantable medical devices, transportation, nuclear, safety, or other equipment where malfunction  
of the product can reasonably be expected to result in personal injury, death, severe property damage, or severe environmental harm. Buyer uses or sells standard products for use  
in the above critical applications at Buyer's own risk and Buyer agrees to defend, indemnify, and hold harmless Analog Devices from any and all damages, claims, suits, or expenses  
resulting from such unintended use.  
©2009 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D07949-0-8/09(0)  
Rev. 0 | Page 16 of 16  

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