ADUC7022BCP [ADI]
IC 32-BIT, FLASH, 45.5 MHz, RISC MICROCONTROLLER, QCC40, 6 X 6 MM, MO-220VJJD-2, LFCSP-40, Microcontroller;型号: | ADUC7022BCP |
厂家: | ADI |
描述: | IC 32-BIT, FLASH, 45.5 MHz, RISC MICROCONTROLLER, QCC40, 6 X 6 MM, MO-220VJJD-2, LFCSP-40, Microcontroller 微控制器 外围集成电路 |
文件: | 总16页 (文件大小:199K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Precision Analog Microcontroller
Small Package, 12-bit Analog I/O, ARM7TDMI® MCU
Preliminary Technical Data
ADuC7020/ADuC7021/ADuC7022
FEATURES
Analog I/O
On-Chip Peripherals
UART, dual I2C and SPI Serial I/O
14-Pin GPIO Port
2 X General Purpose Timers
Wake-up and Watchdog Timers
Power Supply Monitor
PLA – Programmable Logic (Array)
Power
Multi-Channel, 12-bit, 1MSPS ADC
- 5 Channels on the ADuC7020
- 8 Channels on the ADuC7021
- 10 Channels on the ADuC7022
Differential and single-ended modes
0 to Vref Analog Input Range
Multi-Channel 12-bit Voltage Output DACs
- 4 Outputs on the ADuC7020
- 2 Outputs on the ADuC7021
Specified for 3V operation
Active Mode: 6mW (@1MHz)
300mW (@45MHz)
On-Chip 20ppm/°C Voltage Reference
On-Chip Temperature Sensor ( 3°C)
Uncommitted Voltage Comparator
Microcontroller
Packages and Temperature Range
40 Pin LFCSP 6x6mm body package
Fully specified for –40°C to 85°C operation
Tools
ARM7TDMI Core, 16/32-bit RISC architecture
JTAG Port supports code download and debug
Low-Cost QuickStart Development System
Full Third-Party Support
Clocking options: - Trimmed On-Chip Oscillator ( 2%)
- External Watch crystal
APPLICATIONS
- External clock source
45MHz PLL with Programmable Divider
Memory
62k Bytes Flash/EE Memory, 8k Bytes SRAM
In-Circuit Download, JTAG based Debug
Software triggered in-circuit re-programmability
Optical Networking – Laser Power Control
Base Station Systems
Precision Instrumentation, Smart Sensors
Optical Transceivers – Digital Diagnostic Monitoring
(See general description on page 10)
FUNCTIONAL BLOCK DIAGRAM
ADC0
12-BIT DAC
12-BIT DAC
12-BIT DAC
12-BIT DAC
DAC0***
ADuC7020
ADuC7021
ADuC7022
ADC5*
1MSPS
12-BIT ADC
MUX
DAC1***
DAC2****
DAC3****
ADC7*
ADC8**
ADC9**
TEMP
SENSOR
CMP0
CMP1
+
-
BANDGAP
REF
CMP
OUT
ARM7TDMI-BASED MCU WITH
ADDITIONAL PERIPHERALS
V
REF
2kX32 SRAM
31kX16 FLASH/EEPROM
PLA
GPIO
*
not on the ADuC7020
SERIAL I/O
4 GEN. PUR-
POSE TIMERS
** ADuC7022 only
*** not on the ADuC7022
**** ADuC7020 only
OSC
& PLL
JTAG
RST
POR
PSM
2
UART, SPI, 2xI
C
Figure 1
Rev. PrC
Information furnis hed by Analog Devices is believed to be accurate and reliable.
However, no res pons ibility is as s umed by Analog Devices for its us e, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective companies.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
© 2004 Analog Devices, Inc. All rights reserved.
Fax: 781.326.8703
ADuC7020/ADuC7021/ADuC7022
Preliminary Technical Data
TABLE OF CONTENTS
ADuC7020/21/22—Specifications ................................................. 3
General Description....................................................................... 10
Overview of the ARM7TDMI core.......................................... 10
Memory organisation ................................................................ 11
Outline Dimensions....................................................................... 16
Absolute Maximum Ratings............................................................ 7
Ordering Guide............................................................................. 7
Pin function descriptions ................................................................ 8
Rev. PrC | Page 2 of 16
Preliminary Technical Data
ADuC7020/ADuC7021/ADuC7022
ADUC7020/21/22—SPECIFICATIONS1
Table 1. (AVDD = IOVDD = 2.7 to 3.6V, VREF = 2.5 V Internal Reference, fCORE = 45MHz, All specifications TA = TMAX to TMIN, unless otherwise noted.)
Parameter
ADuC7020/21/22
Unit
Test Conditions/Comments
ADC CHANNEL SPECIFICATIONS
DC Accuracy 2, 3
fSAMPLE = 1MSPS
Resolution
12
Bits
Integral Nonlinearity
1.5
0.5
2.0
+1/-0.9
0.5
LSB max
LSB typ
LSB max
LSB max
LSB typ
LSB max
LSB typ
2.5V internal reference
2.5V internal reference
1.0V external reference
2.5V internal reference
2.5V internal reference
1.0V external reference
ADC input is a dc voltage
Integral Nonlinearity 4
Differential Nonlinearity
4
Differential Nonlinearity
+1/-0.9
1
DC Code Distribution
CALIBRATED ENDPOINT ERRORS 5
Offset Error
Offset Error Match
Gain Error
5
1
5
1
LSB max
LSB typ
LSB max
LSB typ
Gain Error Match
DYNAMIC PERFORMANCE
Signal-to-Noise Ratio (SNR) 6
Total Harmonic Distortion (THD)
Peak Harmonic or Spurious Noise
Channel-to-Channel Crosstalk 7
ANALOG INPUT
Fin = 10kHz Sine Wave, fSAMPLE = 1MSPS
71
dB typ
dB typ
dB typ
dB typ
-78
-78
-80
Input Voltage Ranges
Differential mode
8
VCM VREF/2
Volts
Single-ended mode
0 to VREF
Volts
Leakage Current
Input Capacitance
5
20
µA max
pF typ
During ADC Acquisition
ON-CHIP VOLTAGE REFERENCE
Output Voltage
Accuracy
Reference Temperature Coefficient
Power Supply Rejection Ratio
Output Impedance
0.47µF from VREF (pin 55) to AGND
2.5
10
10
80
10
1
V
mV max
ppm/°C typ
dB typ
Ω typ
Measured at TA = 25°C
Internal VREF Power-On Time
ms typ
EXTERNAL REFERENCE INPUT9
Input Voltage Range
0.625
AVDD
TBD
V min
V max
KΩ typ
Input Impedance
DAC CHANNEL SPECIFICATIONS
DC ACCURACY
RL = 5kΩ, CL = 100pF
Resolution
12
2
1
2
5
Bits
Relative Accuracy
Differential Nonlinearity
Offset Error
LSB typ
LSB max
mV max
mV max
% max
% typ
Guaranteed Monotonic
DAC output unbuffered
DAC output buffered
Gain Error
Gain Error Mismatch
0.5
TBD
% of fullscale on DAC0
Rev. PrC | Page 3 of 16
ADuC7020/ADuC7021/ADuC7022
Preliminary Technical Data
Parameter
ADuC7020/21/22
Unit
Test Conditions/Comments
ANALOG OUTPUTS
Output Voltage Range_0
Ouput Voltage Range_1
Output Voltage Range_2
Output Impedance
0 to DACREF
0 to 2.5V
0 to DACVDD
V typ
V typ
V typ
DACREF range: DACGND to DACVDD
10
Ω typ
DAC AC CHARACTERISTICS
Voltage Output Settling Time
Voltage Output Settling Time
Digital to Analog Glitch Energy
COMPARATOR
10
15
TBD
µs typ
µs typ
nV-sec typ
DAC Output buffered
DAC Output unbuffered
I LSB change at major carry
Input Offset Voltage
Input Bias Current
Input Voltage Range
Input Capacitance
10
mV
5
nA typ
V max
pF typ
mV min
mv max
µs min
µs max
AVDD-1.2
7
5
Hysteresis
Hysteresis can be turned on or off via the CMPHYST
bit in the CMPCON register
Response time may be modified via the CMPRES bits
in the CMPCON register
10
1
10
Response Time
TEMPERATURE SENSOR
Voltage Output at 25°C
Voltage TC
TBD
-2.0
3
mV typ
mV/°C typ
°C typ
Accuracy
POWER SUPPLY MONITOR (PSM)
IOVDD Trip Point Selection
2.79
3.07
2.5
V
V
Two selectable Trip Points
Power Supply Trip Point Accuracy
Watchdog Timer (WDT)4
Timeout Period
% max
Of the selected nominal Trip Point Voltage
0
TBD
ms min
ms max
Flash/EE MEMORY
Endurance10
Data Retention11
10,000
30
Cycles min
Years min
TJ = 55°C
Digital Inputs
All digital inputs including XTAL1 and XTAL2
Input Leakage Current
10
1
10
µA max
µA typ
pF typ
Input Capacitance
Logic Inputs4
All Logic inputs including XTAL1 and XTAL2
VINL, Input Low Voltage
VINH, Input High Voltage
Logic Outputs
0.4
2.0
V max
V min
VOH, Output High Voltage
VOL, Output Low Voltage
MCU CLOCK RATE
2.4
0.4
V min
V max
ISOURCE = 20µA
ISINK = 1.6mA
355.5
45.5
kHz min
MHz max
8 programmable core clock selections within this
range
STARTUP TIME
Core Clock = TBD MHz
At Power-On
From Idle Mode
From Power-Down Mode
Programmable Logic Array (PLA)
Propagation Delay
TBD
TBD
TBD
TBD
ns typ
From input pin to output pin
Rev. PrC | Page 4 of 16
Preliminary Technical Data
ADuC7020/ADuC7021/ADuC7022
Parameter
POWER REQUIREMENTS 12
ADuC7020/21/22
Unit
Test Conditions/Comments
13
,
Power Supply Voltage Range
AVDD – AGND and IOVDD - IOGND
2.7
3.6
V min
V max
Power Supply Current Normal Mode
3mA
5
50
mA typ
mA max
mA typ
mA max
1MHz clock
1MHz clock
45MHz clock
45MHz clock
60
Power Supply Current Idle Mode
1
mA max
Power Supply Current Power Down
Mode
30
100
µA typ
µA max
External Crystal or Internal Osc ON
External Crystal or Internal Osc ON
1 Temperature Range -40° to +85°C
2 All ADC Channel Specifications are guaranteed during normal MicroConverter core operation.
3 These specification apply to all ADC input channels.
4 These numbers are not production tested but are supported by design and/or characterization data on production release.
5
Based on external ADC system components, the user may need to execute a system calibration to remove external endpoint and a chieve these specifications..
SNR calculation includes distortion and noise components.
Channel-to-channel crosstalk is measured on adjacent channels.
6
7
8
The input signal can be centered on any dc common-mode voltage (V ) as long as this value is within the ADC voltage input range specified.
CM
9
When using an external reference input pin, the internal reference must be disabled by setting the lsb in the REFCON MemeoryMapped Register to 0.
10 Endurance is qualified to 50,000 cycles as per JEDEC Std. 22 method A117 and measured at -40°C, +25°C and +85°C. Typical endurance at 25°C is 70,000 cycles.
11 Retention lifetime equivalent at junction temperature (Tj) = 55°C as per JEDEC Std. 22 method A117. Retention lifetime will derate with junction temperature.
12 Power supply current consumption is measured in normal, idle and power-down modes under the following conditions:
Normal Mode:
Idle Mode:
Power-Down:
TBD
TBD
TBD
13 DVDD power supply current increases typically by TBD mA during a Flash/EE memory program or erase cycle.
Rev. PrC | Page 5 of 16
ADuC7020/ADuC7021/ADuC7022
Terminology
Preliminary Technical Data
output of the ADC. The signal is the rms amplitude of the
fundamental. Noise is the rms sum of all nonfundamental
signals up to half the sampling frequency (fS/2), excluding dc.
The ratio is dependent upon the number of quantization levels
in the digitisation process; the more levels, the smaller the
quantization noise. The theoretical signal to (noise + distortion)
ratio for an ideal N-bit converter with a sine wave input is given
by:
ADC Specifications
Integral Nonlinearity
This is the maximum deviation of any code from a straight line
passing through the endpoints of the ADC transfer function.
The endpoints of the transfer function are zero scale, a point 1/2
LSB below the first code transition and full scale, a point 1/2
LSB above the last code transition.
Signal to (Noise + Distortion) = (6.02N + 1.76) dB
Thus for a 12-bit converter, this is 74 dB.
Total Harmonic Distortion
Differential Nonlinearity
This is the difference between the measured and the ideal 1 LSB
change between any two adjacent codes in the ADC.
Total Harmonic Distortion is the ratio of the rms sum of the
harmonics to the fundamental.
Offset Error
DAC SPECIFICATIONS
This is the deviation of the first code transition (0000 . . . 000) to
(0000 . . . 001) from the ideal, i.e., +1/2 LSB.
Relative Accuracy
Relative accuracy or endpoint linearity is a measure of the
maximum deviation from a straight line passing through the
endpoints of the DAC transfer function. It is measured after
adjusting for zero error and full-scale error.
Gain Error
This is the deviation of the last code transition from the ideal
AIN voltage (Full Scale – 1.5 LSB) after the offset error has been
adjusted out.
VoltageOutputSettlingTime
Signal to (Noise + Distortion) Ratio
This is the amount of time it takes for the output to settle to
within a 1 LSB level for a full-scale input change..
This is the measured ratio of signal to (noise + distortion) at the
Rev. PrC | Page 6 of 16
Preliminary Technical Data
ADuC7020/ADuC7021/ADuC7022
ABSOLUTE MAXIMUM RATINGS
Table 2. Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Parameter
Rating
TBD
TBD
PIN CONFIGURATION
40-Lead CSP
AVDD to DVDD
AGND to DGND
DVDD to DGND, AVDD to AGND
Digital Input Voltage to DGND
Digital Output Voltage to DGND
VREF to AGND
TBD
TBD
TBD
TBD
40
31
PIN 1
IDENTIFIER
30
1
Analog Inputs to AGND
TBD
Operating Temperature Range
Industrial ADuC7020/21/22
Storage Temperature Range
Junction Temperature
–40°C to +85°C
TOP VIEW
(Not to Scale)
TBD
TBD
TBD
θJA Thermal Impedance
(ADuC7020/21/22BCP)
21
10
Lead Temperature, Soldering
Vapor Phase (60 sec)
Infrared (15 sec)
11
20
TBD
TBD
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ORDERING GUIDE
Model
Temperature Range
–40°C to + 85°C
–40°C to + 85°C
–40°C to + 85°C
Package Description
Package Option
CP-40
CP-40
ADuC7020BCP
ADuC7021BCP
ADuC7022BCP
EVAL_ADuC7020QS
40-Lead Chip Scale Package
40-Lead Chip Scale Package
40-Lead Chip Scale Package
Development System
CP-40
Contact the factory for chip availability.
ESD Caution
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. PrC | Page 7 of 16
ADuC7020/ADuC7021/ADuC7022
Preliminary Technical Data
PIN FUNCTION DESCRIPTIONS
Table 3. Pin Function Descriptions
Pin# ADuC702X
Mnemonic
Type* Function
7020
7021
37
38
39
40
1
7022
36
37
38
39
40
1
38
39
40
1
2
-
ADC0
I
I
I
I
I
I
I
I
I
I
Single-ended or differential Analog input 0
Single-ended or differential Analog input 1
ADC1
ADC2/CMP0
ADC3/CMP1
ADC4
Single-ended or differential Analog input 2 / Comparator Positive Input
Single-ended or differential Analog input 3 / Comparator Negative Input
Single-ended or differential Analog input 4
2
ADC5
Single-ended or differential Analog input 5
-
3
2
ADC6
Single-ended or differential Analog input 6
-
4
3
ADC7
Single-ended or differential Analog input 7
-
-
4
ADC8
Single-ended or differential Analog input 8
-
-
5
ADC9
Single-ended or differential Analog input 9
Ground voltage reference for the ADC. For optimal performance the
analog power supply should be separated from IOGND and DGND
3
5
6
GNDREF
S
4
5
6
7
8
9
6
7
-
-
-
DAC0/ADC12
DAC1/ADC13
DAC2/ADC14
DAC3/ADC15
TMS
I/O
I/O
I/O
I/O
I
DAC0 Voltage Output / Single-ended or differential Analog input 12
DAC1 Voltage Output / Single-ended or differential Analog input 13
DAC2 Voltage Output / Single-ended or differential Analog input 14
DAC3 Voltage Output / Single-ended or differential Analog input 15
JTAG Test Port Input - Test Mode Select. Debug and download access
JTAG Test Port Input – Test Data In. Debug and download access
Multifunction I/O pin:
-
-
-
8
9
7
8
TDI
I
Boot Mode. The ADuC702X will enter UART serial download mode if BM
is low at reset and will execute code if BM is pulled high at reset through
a 1kOhm resistor/ General Purpose Input-Output Port 0.0 / Voltage
Comparator Output/ Programmable Logic Array Input Element 7
BM/P0.0/CMPOUT/P
LAI[7]
10
10
9
I/O
Multifunction pin: driven low after reset
General Purpose Output Port 0.6 / Timer 1 Input / Power on reset output
/ Programmable Logic Array Output Element 3
P0.6/T1/MRST/PLA
O[3]
11
12
11
12
10
11
O
I
JTAG Test Port Input - Test Clock. Debug and download access / Input to
the internal clock generator circuits
TCK/XCLK
13
14
15
13
14
15
12
13
14
TDO
O
S
JTAG Test Port Output - Test Data Out. Debug and download access
Ground for GPIO. Typically connected to DGND
IOGND
IOVDD
S
3.3V Supply for GPIO and input of the on-chip voltage regulator.
2.5V. Output of the on-chip voltage regulator. Must be connected to a
0.47µF capacitor to DGND
16
16
15
LVDD
S
17
18
19
17
18
19
16
17
18
DGND
TRST
RST
S
I
Ground for core logic.
JTAG Test Port Output - Test Reset. Debug and download access
Reset Input. (active low)
I
Multifunction I/O pin:
IRQ0/P0.4/CONVST
ART/PLAO[1]
External Interrupt Request 0, active high / General Purpose Input-Output
Port 0.4 / Start conversion input signal for ADC / Programmable Logic
Array Output Element 1
20
21
20
21
19
20
I/O
I/O
Multifunction I/O pin:
External Interrupt Request 1, active high / General Purpose Input-Output
Port 0.5 / ADCBUSY signal / Programmable Logic Array Output Element 2
IRQ1/P0.5/ADCBUSY
/PLAO[2]
Serial Port Multiplexed:
General Purpose Input-Output Port 2.0 / UART / Programmable Logic
Array Output Element 5/ Start conversion input signal for ADC
P2.0/SPM9/PLAO[
5]/CONVSTART
22
23
22
23
21
22
I/O
I/O
Serial Port Multiplexed:
General Purpose Input-Output Port 0.7 / Output for External Clock signal
P0.7/ECLK/SPM8/P
LAO[4]
Rev. PrC | Page 8 of 16
Preliminary Technical Data
ADuC7020/ADuC7021/ADuC7022
Pin# ADuC702X
Mnemonic
Type* Function
7020
7021
7022
/ UART / Programmable Logic Array Output Element 4
Output to the crystal oscillator inverter
24
25
24
24
23
24
XCLKO
XCLKI
O
I
Input to the crystal oscillator inverter and input to the internal clock
generator circuits
Serial Port Multiplexed:
General Purpose Input-Output Port 1.7 / UART / SPI / Programmable
Logic Array Output Element 0
P1.7/SPM7/PLAO[
0]
26
27
28
29
30
31
32
33
26
27
28
29
30
31
32
33
25
26
27
28
29
30
31
32
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Serial Port Multiplexed:
General Purpose Input-Output Port 1.6 / UART / SPI / Programmable
Logic Array Input Element 6
P1.6/SPM6/PLAI[6]
P1.5/SPM5/PLAI[5]
P1.4/SPM4/PLAI[4]
P1.3/SPM3/PLAI[3]
P1.2/SPM2/PLAI[2]
P1.1/SPM1/PLAI[1]
Serial Port Multiplexed:
General Purpose Input-Output Port 1.5 / UART / SPI / Programmable
Logic Array Input Element 5
Serial Port Multiplexed:
General Purpose Input-Output Port 1.4 / UART / SPI / Programmable
Logic Array Input Element 4
Serial Port Multiplexed:
General Purpose Input-Output Port 1.3/ UART / I2C1 /Programmable
Logic Array Input Element 3
Serial Port Multiplexed:
General Purpose Input-Output Port 1.2 / UART / I2C1 /Programmable
Logic Array Input Element 2
Serial Port Multiplexed:
General Purpose Input-Output Port 1.1 / UART / I2C0 / Programmable
Logic Array Input Element 1
Serial Port Multiplexed:
General Purpose Input-Output Port 1.0/ Timer 1 Input / UART / I2C0 /
Programmable Logic Array Input Element 0
P1.0/T1/SPM0/PLA
I[0]
General Purpose Input-Output Port 4.2 / Programmable Logic Array
Output Element 10
34
35
-
-
P4.2/PLAO[10]
VREF
I/O
I/O
2.5V internal Voltage Reference. Must be connected to a 0.47uF capacitor
when using the internal reference.
34
33
36
37
35
36
34
35
AGND
AVDD
S
S
Analog Ground. Ground reference point for the analog circuitry
3.3V Analog Power
* I = Input, O = Output, S = Supply.
- No pin assigned.
Rev. PrC | Page 9 of 16
ADuC7020/ADuC7021/ADuC7022
GENERAL DESCRIPTION
Preliminary Technical Data
compressed into 16-bits, the Thumb instruction set. Faster
execution from 16-bit memory and greater code density can
usually be achieved by using the Thumb instruction set instead
of the ARM instruction set, which makes the ARM7TDMI core
particularly suitable for embedded applications.
The ADuC7020/21/22 are fully integrated, 1MSPS, 12-bit data
acquisition systems incorporating a high performance multi-
channel ADC, a 16/32-bit MCU and Flash/EE Memory on a
single chip.
The ADC consists of 5/8/10 single-ended inputs. An additional
2/4 inputs are available on the ADuC7021/20 but are
multiplexed with the 2/4 DAC output pins. The ADC can
operate in single-ended or differential input modes with a fully
flexible front end. The ADC input voltage is 0 to VREF. Low drift
bandgap reference, temperature sensor and voltage comparator
complete the ADC peripheral set.
However the Thumb mode has two limitations:
- Thumb code usually uses more instructions for the same job,
so ARM code is usually best for maximising the performance
of the time-critical code.
- The Thumb instruction set does not include some
instructions that are needed for exception handling, so ARM
code needs to be used for exception handling.
The part also integrates 2/4 buffered voltage output DACs on-
chip. The DAC output range is 0 to AVDD max.
See ARM7TDMI User Guide for details on the core
architecture, the programming model and both the ARM and
ARM Thumb instruction sets.
The device operates from the on-chip oscillator and PLL
generating an internal high-frequency clock of 45 MHz. This
clock is routed through a programmable clock divider from
which the MCU core clock operating frequency is generated.
The microcontroller core is an ARM7TDMI, 16/32-bit RISC
machine, offering up to 45 MIPS peak performance. 62k Bytes
of non-volatile Flash/EE are provided on-chip as well as 8k
Bytes of SRAM. Both the Flash/EE and SRAM memory arrays
are mapped into a single linear array.
Long multiple (M)
The ARM7TDMI instruction set includes four extra
instructions which perform 32-bit by 32-bit multiplication with
64-bit result and 32-bit by 32-bit multiplication-accumulation
(MAC) with 64-bit result.
EmbeddedICE (I)
O n-chip factory firmware supports in-circuit serial download
via the UART and JTAG serial interface ports while non-
intrusive emulation is also supported via the JTAG interface.
These features are incorporated into a low cost QuickStart
system supporting this MicroConverter family.
EmbeddedICE provides integrated on-chip support for the core.
The EmbeddedICE module contains the breakpoint and
watchpoint registers which allow code to be halted for
debugging purposes. These registers are controlled through the
JTAG test port.
The parts operate from 2.7V to 3.6V and are specified over an
industrial temperature range of -40°C to 85°C. When operating
@45MHz the power dissipation is 300mW. The
ADuC7020/21/22 are available in a 40-lead LFCSP package.
When a breakpoint or watchpoint is encountered, the processor
halts and enters debug state. Once in a debug state, the
processor registers may be inspected as well as the Flash/EE, the
SRAM and the Memory Mapped Registers.
OVERVIEW OF THE ARM7TDMI CORE
Exceptions
The ARM7 core is a 32-bit Reduced Instruction Set Computer
(RISC). It uses a single 32-bit bus for instruction and data. The
length of the data can be 8, 16 or 32 bits and the length of the
instruction word is 32 bits.
ARM supports five types of exceptions, and a privileged
processing mode for each type. The five type of exceptions are:
- Normal interrupt or IRQ. It is provided to service general-
purpose interrupt handling of internal and external events
- Fast interrupt or FIQ. It is provided to service data transfer or
communication channel with low latency. FIQ has priority
over IRQ
The ARM7TDMI is an ARM7 core with 4 additional features:
- T support for the Thumb (16 bit) instruction set.
- D support for debug
- Memory abort
- M support for long multiplies
- Attempted execution of an undefined instruction
- Software interrupt (SWI) instruction which can be used to
make a call to an operating system.
- I include the EmbeddedICE module to support embedded
system debugging.
Thumb mode (T)
Typically the programmer will define interrupts as IRQ but for
higher priority interrupt, i.e. faster response time, the
programmer can define interrupt as FIQ.
An ARM instruction is 32-bits long. The ARM7TDMI
processor supports a second instruction set that has been
Rev. PrC | Page 10 of 16
Preliminary Technical Data
ADuC7020/ADuC7021/ADuC7022
The maximum IRQ latency calculation is similar, but must
allow for the fact that FIQ has higher priority and could delay
entry into the IRQ handling routine for an arbitrary length of
time.
ARM Registers
ARM7TDMI has a total of 37 registers, of which 31 are general
purpose registers and six are status registers. Each operating
mode has dedicated banked registers.
The minimum latency for FIQ or IRQ interrupts is four cycles
in total which consists of the shortest time the request can take
through the synchronizer plus the time to enter the exception
mode.
When writing user-level programs, 15 general purpose 32-bit
registers (r0 to r14), the program counter (r15) and the current
program status register (CPSR) are usable. The remaining
registers are used only for system-level programming and for
exception handling.
Note that the ARM7TDMI will always be run in ARM (32-bit)
mode when in privileged modes, i.e. when executing interrupt
service routines.
When an exception occurs, some of the standard register are
replaced with registers specific to the exception mode. All
exception modes have replacement banked registers for the
stack pointer (r13) and the link register (r14) as represented in
Figure22. The fast interrupt mode has more registers (8 to 12)
for fast interrupt processing, so that the interrupt processing
can begin without the need to save or restore these registers and
thus save critical time in the interrupt handling process.
MEMORY ORGANISATION
The ADuC7020/21/22 incorporate two separate blocks of
memory, 8kByte of SRAM and 64kByte of O n-Chip Flash/EE
memory. 62kByte of On-Chip Flash/EE memory are available to
the user, and the remaining 2kBytes are reserved for the factory
configured boot page. These two blocks are mapped as shown
Figure 3.
r0
r1
r2
usable in user mode
Note that by default, after a reset, the Flash/EE memory is
mirrored at address 0x00000000. It is possible to remap the
SRAM at address 0x00000000 by clearing bit 0 of the REMAP
MMR. This remap function is described in more details in the
Flash/EE memory chapter.
r3
r4
system modes only
r5
r6
r7
r8_fiq
r9_fiq
r8
r9
FFFFFFFFh
MMRs
r10_fiq
r11_fiq
r12_fiq
r13_fiq
r14_fiq
FFFF0000h
r10
r11
r12
r13
r13_und
r13_irq
Reserved
r13_abt
r14_abt
r14_und
r13_svc
r14_svc
r14_irq
0008FFFFh
r14
Flash/EE
r15 (PC)
00080000h
SPSR_und
SPSR_irq
SPSR_abt
Reserved
SPSR_svc
CPSR
SPSR_fiq
00011FFFh
SRAM
00010000h
user mode
fiq
mode
svc
mode
abord
mode
irq undefined
0000FFFFh
mode
mode
Re-mappable Memory Space
(Flash/EE or SRAM)
00000000h
Figure22: register organisation
Figure 3: Physical memory map
Interrupt latency
Memory Access
The worst case latency for an FIQ, assuming that it is enabled,
consists of the longest time the request can take to pass through
the synchronizer, plus the time for the longest instruction to
complete (the longest instruction is an LDM) which loads all
the registers including the PC, plus the time for the data abort
entry, plus the time for FIQ entry. At the end of this time, the
ARM7TDMI will be executing the instruction at 0x1C (FIQ
interrupt vector address). The maximum total time is 44
processor cycles, which is just over 975 nanoseconds in a system
using a continuous 45 MHz processor clock.
32
The ARM7 core sees memory as a linear array of 2 byte
location where the different blocks of memory are mapped as
outlined in Figure 3 above.
The ADuC7020/21/22 memory organisation is configured in
little endian format: the least significant byte is located in the
lowest byte address and the most significant byte in the highest
byte address.
Rev. PrC | Page 11 of 16
ADuC7020/ADuC7021/ADuC7022
Preliminary Technical Data
bit0
0xFFFFFFFF
bit31
Byte3
Byte2 Byte1 Byte0
0xFFFFF820
Flash Control
0xFFFFFFFFh
Interface
0xFFFFF800
B
7
3
A
6
2
9
5
1
8
4
0
0x00000004h
0x00000000h
0xFFFFF46C
GPIO
0xFFFFF400
0xFFFF0B54
32 bits
Figure 4: little endian format
PLA
0xFFFF0B00
0xFFFF0A14
Flash/EE Memory
SPI
0xFFFF0A00
The total 64kBytes of Flash/EE are organised as 32k X 16 bits.
31k X 16 bits are user space and 1k X 16 bits is reserved for boot
loader. The page size of this Flash/EE memory is 256Bytes.
0xFFFF0948
2
I C1
0xFFFF0900
0xFFFF0848
62kBytes of Flash/EE are available to the user as code and non-
volatile data memory. There is no distinction between data and
program as ARM code shares the same space. The real width of
the Flash/EE memory is 16 bits, which means that in ARM
mode (32-bit instruction), two accesses to the Flash/EE are
necessary for each instruction fetch. It is therefore
recommended to use Thumb mode when executing from
Flash/EE memory for optimum access speed. The maximum
access speed for the Flash/EE memory is 45MHz in Thumb
mode and 22.5MHz in full ARM mode. More details on
Flash/EE access time are outlined later in ‘Execution from
SRAM and Flash/EE’ section of this datasheet.
2
I C0
0xFFFF0800
0xFFFF0730
UART
0xFFFF0700
0xFFFF0620
DAC
0xFFFF0600
0xFFFF0538
ADC
0xFFFF0500
0xFFFF0490
Bandgap
Reference
0xFFFF048C
SRAM
0xFFFF0448
Power Supply
8kBytes of SRAM are available to the user, organized as 2k X 32
bits, i.e. 2kWords. ARM code can run directly from SRAM at
45MHz , given that the SRAM array is configured as a 32-bit
wide memory array. More details on SRAM access time are
outlined later in ‘Execution from SRAM and Flash/EE’ section
of this datasheet.
Monitor
0xFFFF0440
0xFFFF0420
PLL &
Oscillator Control
0xFFFF0404
0xFFFF0370
Watchdog
Timer
0xFFFF0360
Memory Mapped Registers
0xFFFF0350
Wake Up
The Memory Mapped Register (MMR) space is mapped into
the upper 2 pages of the Flash/EE space and accessed by
indirect addressing through the ARM7 banked registers.
Timer
0xFFFF0340
0xFFFF0334
General Purpose
Timer
0xFFFF0320
The MMR space provides an interface between the CPU and all
on-chip peripherals. All registers except the core registers
reside in the MMR area. All shaded locations shown in Figure 6
are unoccupied or reserved locations and should not be
accessed by user software. Table 4 shows a full MMR memory
map. The ‘Access’ column corresponds to the access time
reading or writing a MMR. Table 4 shows a full MMR memory
map.
0xFFFF0310
Timer 0
0xFFFF0300
0xFFFF0238
Remap &
System Control
0xFFFF0220
0xFFFF0110
Interrupt
Controller
0xFFFF0000
Figure 5: Memory Mapped
Rev. PrC | Page 12 of 16
Preliminary Technical Data
ADuC7020/ADuC7021/ADuC7022
Table 4. Complete MMRs list
Address Name
Byte
Access
Type
Page
Address Name
Byte
Access
Page
Cycle
Type
RW
W
Cycle
IRQ address base = 0xFFFF0000
0x0414
0x0418
PLLCON
PLLKY2
1
1
2
2
0x0000
0x0004
0x0008
0x000C
0x0010
0x0100
0x0104
0x0108
0x010C
IRQSTA
IRQSIG
IRQEN
4
4
4
4
4
4
4
4
4
R
1
1
1
1
1
1
1
1
1
R
PSM address base = 0xFFFF0440
RW
W
W
R
0x0440
0x0444
PSMCON
CMPCON
2
2
RW
RW
2
2
IRQCLR
SWICFG
FIQSTA
FIQSIG
FIQEN
Reference address base = 0xFFFF0480
0x048C
REFCON
1
RW
2
R
ADC address base = 0xFFFF0500
RW
W
0x0500
0x0504
0x0508
0x050C
0x0510
0x0514
0x0530
0x0534
ADCCON
ADCCP
1
1
1
1
4
1
2
2
RW
RW
RW
RW
R
2
2
2
2
2
2
2
2
FIQCLR
ADCCN
ADCSTA
ADCDAT
ADCRST
ADCGN
ADCOF
System Control address base = 0xFFFF0200
0x0220
0x0230
0x0234
REMAP
RSTSTA
RSTCLR
1
1
1
RW
R
1
1
1
W
RW
RW
RW
Timer address base = 0xFFFF0300
0x0300
0x0304
0x0308
0x030C
0x0320
0x0324
0x0328
0x032C
0x0330
0x0340
0x0344
0x0348
0x034C
0x0360
0x0364
0x0368
0x036C
T0LD
2
2
2
1
4
4
2
1
4
4
4
2
1
2
2
2
1
RW
R
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
T0VAL
T0CON
T0CLRI
T1LD
DAC address base = 0xFFFF0600
RW
W
0x0600
0x0604
0x0608
0x060C
0x0610
0x0614
0x0618
0x061C
DAC0CON
DAC0DAT
DAC1CON
DAC1DAT
DAC2CON
DAC2DAT
DAC3CON
DAC3DAT
1
4
1
4
1
4
1
4
RW
RW
RW
RW
RW
RW
RW
RW
2
2
2
2
2
2
2
2
RW
R
T1VAL
T1CON
T1CLRI
T1CAP
T2LD
RW
W
RW
RW
R
T2VAL
T2CON
T2CLRI
T3LD
UART base address = 0xFFFF0700
RW
W
0x0700
COMTX
1
1
1
1
1
1
1
1
1
1
1
RW
R
2
2
2
2
2
2
2
2
2
2
2
COMRX
RW
R
COMDIV0
COMIEN0
COMDIV1
COMIID0
COMCON0
COMCON1
COMSTA0
COMSTA1
COMSCR
RW
RW
R/W
R
T3VAL
T3CON
T3CLRI
0x0704
RW
W
0x0708
0x070C
0x0710
0x0714
0x0718
0x071C
RW
RW
R
PLL base address = 0xFFFF0400
0x0404
0x0408
0x040C
0x0410
POWKY1
POWCON
POWKY2
PLLKY1
1
1
1
1
W
2
2
2
2
RW
W
R
W
RW
Rev. PrC | Page 13 of 16
ADuC7020/ADuC7021/ADuC7022
Preliminary Technical Data
Address Name
Byte
Access
Type
RW
Page
Address Name
Byte
Access
Type
RW
Page
Cycle
Cycle
0x0720
0x0724
0x0728
0X072C
COMIEN1
1
1
1
2
2
2
2
2
0x0944
I2C1ID3
1
2
COMIID1
COMADR
COMDIV2
R
SPI base address = 0xFFFF0A00
RW
0x0A00
0x0A04
0x0A08
0x0A0C
0x0A10
SPISTA
SPIRX
1
1
1
1
2
R
2
2
2
2
2
RW
R
SPITX
W
I2C0 base address = 0xFFFF0800
SPIDIV
SPICON
RW
RW
0x0800
0x0804
0x0808
0x080C
0x0810
0x0814
0x0818
0x081C
0x0824
0x0828
0x082C
0x0830
0x0834
0x0838
0x083C
0x0840
0x0844
I2C0MSTA
I2C0SSTA
I2C0SRX
I2C0STX
I2C0MRX
I2C0MTX
I2C0CNT
I2C0ADR
I2C0BYTE
I2C0ALT
I2C0CFG
I2C0DIVH
I2C0DIVL
I2C0ID0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
R
R
PLA base address = 0xFFFF0B00
W
0x0B00
0x0B04
0x0B08
0x0B0C
0x0B10
0x0B14
0x0B18
0x0B1C
0x0B20
0x0B24
0x0B28
0x0B2C
0x0B30
0x0B34
0x0B38
0x0B3C
0x0B40
0x0B44
0x0B48
0x0B4C
0x0B50
PLAELM0
PLAELM1
PLAELM2
PLAELM3
PLAELM4
PLAELM5
PLAELM6
PLAELM7
PLAELM8
PLAELM9
PLAELM10
PLAELM11
PLAELM12
PLAELM13
PLAELM14
PLAELM15
PLACLK
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
1
4
4
4
4
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
R
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
R
W
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
I2C0ID1
I2C0ID2
I2C0ID3
I2C1 base address = 0xFFFF0900
0x0900
0x0904
0x0908
0x090C
0x0910
0x0914
0x0918
0x091C
0x0924
0x0928
0x092C
0x0930
0x0934
0x0938
0x093C
0x0940
I2C1MSTA
I2C1SSTA
I2C1SRX
I2C1STX
I2C1MRX
I2C1MTX
I2C1CNT
I2C1ADR
I2C1BYTE
I2C1ALT
I2C1CFG
I2C1DIVH
I2C1DIVL
I2C1ID0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
R
R
PLAIRQ
W
PLAADC
R
PLADIN
W
PLADOUT
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
GPIO base address = 0xFFFFF400
0xF400
0xF404
0xF408
0xF40C
0xF410
0xF420
0xF424
0xF428
0xF430
GP0CON
GP1CON
GP2CON
GP3CON
GP4CON
GP0DAT
GP0SET
GP0CLR
GP1DAT
4
4
4
4
4
4
1
1
4
RW
RW
RW
RW
RW
RW
W
1
1
1
1
1
1
1
1
1
I2C1ID1
W
I2C1ID2
RW
Rev. PrC | Page 14 of 16
Preliminary Technical Data
ADuC7020/ADuC7021/ADuC7022
Development Tools
Address Name
Byte
Access
Type
W
Page
An entry level, low cost development system is available for the
ADuC702X family. This system consists of the following PC-
based (Windows® compatible) hardware and software
development tools:
Cycle
0xF434
0xF438
0xF440
0xF444
0xF448
0xF450
0xF454
0xF458
0xF460
0xF464
0xF468
GP1SET
GP1CLR
GP2DAT
GP2SET
GP2CLR
GP3DAT
GP3SET
GP3CLR
GP4DAT
GP4SET
GP4CLR
1
1
4
1
1
4
1
1
4
1
1
1
1
1
1
1
1
1
1
1
1
1
W
RW
W
Hardware:
-
ADuC702X Evaluation board
- Serial Port programming cable
- JTAG emulator
Software:
- Integrated Development Environment, incorporating
assembler, compiler and non intrusive JTAG-based
debugger
- Serial Downloader software
- Example Code
W
RW
W
W
RW
W
W
Miscellaneous:
-
CD-ROM Documentation
Flash/EE base address = 0xFFFFF800
0xF800
0xF804
0xF808
0xF80C
0xF810
0xF818
0xF81C
FEESTA
1
1
1
2
2
3
4
R
1
1
1
1
1
1
1
FEEMOD
FEECON
FEEDAT
FEEADR
FEESIGN
FEEPRO
RW
RW
RW
RW
R
In-Circuit Serial Downloader
The Serial Downloader is a Windows application that allows
the user to serially download an assembled program (Intel Hex
format file) to the on-chip program FLASH/EE memory via the
serial port on a standard PC.
RW
The ‘Access’ column corresponds to the access time reading or
writing MMR. It depends on the AMBA (Advanced
a
Microcontroller Bus Architecture) bus used to access the
peripheral. The processor has two AMBA busses, AHB
(Advanced High-performance Bus) used for system modules
and APB (Advanced Peripheral Bus) used for lower
performance peripheral.
Rev. PrC | Page 15 of 16
ADuC7020/ADuC7021/ADuC7022
OUTLINE DIMENSIONS
Preliminary Technical Data
6.00
BSC SQ
0.60 MAX
PIN 1
INDICATOR
0.60 MAX
31
30
40
1
PIN 1
INDICATOR
0.50
BSC
4.25
TOP
VIEW
5.75
BSC SQ
BOTTOM
VIEW
3.70 SQ
1.75
0.50
0.40
0.30
21
20
10
11
4.50
REF
128MAX
1.00 MAX
0.65 NOM
0.05 MAX
0.02 NOM
1.00
0.30
0.23
0.18
0.90
0.80
COPLANARITY
0.08
0.20 REF
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2
Figure 6. 40-Lead Frame Chip Scale Package [LFCSP] (CP-40)—Dimensions shown in millimetres
Rev. PrC | Page 16 of 16
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