ADSP-BF538_07 [ADI]
Blackfin㈢ Embedded Processor; Blackfin㈢嵌入式处理器型号: | ADSP-BF538_07 |
厂家: | ADI |
描述: | Blackfin㈢ Embedded Processor |
文件: | 总56页 (文件大小:2297K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Blackfin®
Embedded Processor
ADSP-BF538/ADSP-BF538F
External memory controller with glueless support
for SDRAM, SRAM, flash, and ROM
Flexible memory booting options from SPI® and external
memory
FEATURES
Up to 533 MHz high performance Blackfin processor
Two 16-bit MACs, two 40-bit ALUs, four 8-bit video ALUs,
40-bit shifter
RISC-like register and instruction model for ease of program-
ming and compiler friendly support
Advanced debug, trace, and performance monitoring
0.85 V to 1.25 V core VDD with on-chip voltage regulation
2.5 V to 3.3 V I/O VDD
PERIPHERALS
Parallel peripheral interface (PPI) supporting ITU-R 656 video
data formats
Four dual-channel, full-duplex synchronous serial ports,
supporting 16 stereo I2S® channels
Up to 3.3 V tolerant I/O with specific 5 V tolerant pins
316-ball Pb-free mini-BGA package
Two DMA controllers supporting 26 peripheral DMAs
Four memory-to-memory DMAs
Controller area network (CAN) 2.0B controller
Three SPI-compatible ports
MEMORY
148K bytes of on-chip memory:
16K bytes of instruction SRAM/cache
64K bytes of instruction SRAM
32K bytes of data SRAM
32K bytes of data SRAM/cache
4K bytes of scratchpad SRAM
512K ϫ 16-bit or 256K ϫ 16-bit of flash memory
(ADSP-BF538F only)
Three 32-bit timer/counters with PWM support
Three UARTs with support for IrDA®
Two TWI controllers compatible with I2C® industry standard
Up to 54 general-purpose I/O pins (GPIO)
Real time clock, watchdog timer, and 32-bit core timer
On-chip PLL capable of 0.5ϫ to 64ϫ frequency multiplication
Debug/JTAG interface
Memory management unit providing memory protection
JTAG TEST AND EMULATION
VOLTAGE REGULATOR
PERIPHERAL ACCESS BUS
TWI0-1
INTERRUPT
WATCHDOG
CONTROLLER
TIMER
B
CAN 2.0B
GPIO
GPIO
PORT
C
RTC
L1
L1
DATA
MEMORY
DMA
CONTROLLER1
DMA
CONTROLLER0
PPI
INSTRUCTION
MEMORY
SPI1-2
GPIO
PORT
D
GPIO
PORT
F
TIMER0-2
DMA
EXTERNAL
UART1-2
SPORT2-3
DM A CO RE
DM A
EXTERNAL
BUS
BUS
1
SPI0
D MA CORE BUS
0
BUS
0
1
GPIO
PORT
E
UART0
EXTERNAL PORT
FLASH, SDRAM CONTROL
SPORT0-1
16
512kB OR 1MB
FLASH MEMORY
BOOT ROM
(ADSP-BF538F ONLY)
Figure 1. Functional Block Diagram
Blackfin and the Blackfin logo are registered trademarks of Analog Devices, Inc.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2007 Analog Devices, Inc. All rights reserved.
ADSP-BF538/ADSP-BF538F
TABLE OF CONTENTS
Operating Conditions ........................................... 23
Electrical Characteristics ....................................... 24
Absolute Maximum Ratings ................................... 25
Package Information ............................................ 25
ESD Sensitivity ................................................... 25
Timing Specifications ........................................... 26
Clock and Reset Timing ..................................... 27
Asynchronous Memory Read Cycle Timing ............ 28
Asynchronous Memory Write Cycle Timing ........... 30
SDRAM Interface Timing .................................. 32
External Port Bus Request and Grant Cycle Timing .. 33
Parallel Peripheral Interface Timing ...................... 35
Serial Port Timing ............................................ 38
Serial Peripheral Interface Ports—Master Timing ..... 41
Serial Peripheral Interface Ports—Slave Timing ....... 42
General-Purpose Port Timing ............................. 43
Timer Cycle Timing .......................................... 44
JTAG Test And Emulation Port Timing ................. 45
Output Drive Currents ......................................... 46
Power Dissipation ............................................... 48
Test Conditions .................................................. 48
Thermal Characteristics ........................................ 51
316-Ball Mini-BGA Ball Assignments .......................... 52
Outline Dimensions ................................................ 55
Surface Mount Design .......................................... 56
Ordering Guide ..................................................... 56
General Description ................................................. 3
Low Power Architecture ......................................... 3
System Integration ................................................ 3
ADSP-BF538/ADSP-BF538F Processor Peripherals ....... 3
Blackfin Processor Core .......................................... 4
Memory Architecture ............................................ 5
DMA Controllers .................................................. 9
Real Time Clock ................................................... 9
Watchdog Timer ................................................ 10
Timers ............................................................. 10
Serial Ports (SPORTs) .......................................... 10
Serial Peripheral Interface (SPI) Ports ...................... 10
2-Wire Interface ................................................. 11
UART Ports ...................................................... 11
General-Purpose Ports ......................................... 11
Parallel Peripheral Interface ................................... 12
Controller Area Network (CAN) Interface ................ 13
Dynamic Power Management ................................ 13
Voltage Regulation .............................................. 14
Booting Modes ................................................... 16
Instruction Set Description ................................... 16
Development Tools ............................................. 17
Designing an Emulator Compatible Processor Board ... 18
Pin Descriptions .................................................... 19
Specifications ........................................................ 23
REVISION HISTORY
05/07—Revision PrE to Rev.0
Add new wording to Power Savings section
Revise driver types in Pin Descriptions
Line changes in footnotes for Specifications and Operating
Conditions
Replace Rise and Fall Times graphs in Capacitive Loading
section
Reorder Ball Assignments
SPORT timing and External Late Frame Sync diagrams
changed.
Rev. 0
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May 2007
ADSP-BF538/ADSP-BF538F
GENERAL DESCRIPTION
The ADSP-BF538/ADSP-BF538F processors are members of
the Blackfin family of products, incorporating the Analog
Devices Inc./Intel Micro Signal Architecture (MSA). Blackfin
processors combine a dual-MAC state-of-the-art signal process-
ing engine, the advantages of a clean, orthogonal RISC-like
microprocessor instruction set, and single-instruction, multi-
ple-data (SIMD) multimedia capabilities into a single
instruction set architecture.
SYSTEM INTEGRATION
The ADSP-BF538/ADSP-BF538F processors are highly inte-
grated system-on-a-chip solutions for the next generation of
consumer and industrial applications including audio and video
signal processing. By combining advanced memory configura-
tions, such as on-chip flash memory, industry-standard
interfaces, and a high performance signal processing core, cost-
effective solutions can be quickly developed, without the need
for costly external components. The system peripherals include
three UART ports, three SPI ports, four serial ports (SPORTs),
one CAN interface, two 2-wire interfaces (TWI), four general-
purpose timers (three with PWM capability), a real-time clock, a
watchdog timer, a parallel peripheral interface (PPI), and gen-
eral-purpose I/O pins.
The ADSP-BF538/ADSP-BF538F processors are completely
code compatible with other Blackfin processors, differing only
with respect to performance, peripherals, and on-chip memory.
Specific performance, peripherals, and memory configurations
are shown in Table 1.
Table 1. Processor Features
ADSP-BF538/ADSP-BF538F PROCESSOR
PERIPHERALS
ADSP-
BF538
ADSP-
BF538F4
ADSP-
BF538F8
Feature
SPORTs
UARTs
SPI
The ADSP-BF538/ADSP-BF538F processors contain a rich set
of peripherals connected to the core via several high bandwidth
buses, providing flexibility in system configuration as well as
excellent overall system performance (see the block diagram
on Page 1). The general-purpose peripherals include functions
such as UART, timers with PWM (pulse-width modulation)
and pulse measurement capability, general-purpose I/O pins, a
real time clock, and a watchdog timer. This set of functions sat-
isfies a wide variety of typical system support needs and is
augmented by the system expansion capabilities of the device. In
addition to these general-purpose peripherals, the processors
contain high speed serial and parallel ports for interfacing to a
variety of audio, video, and modem codec functions. A CAN
2.0B controller is provided for automotive and industrial con-
trol networks. An interrupt controller manages interrupts from
the on-chip peripherals or from external sources. Power man-
agement control functions tailor the performance and power
characteristics of the processors and system to many application
scenarios.
4
3
3
2
1
1
4
3
3
2
1
1
4
3
3
TWI
2
PPI
1
CAN
1
Instruction SRAM/Cache 16K bytes 16K bytes
16K bytes
64K bytes
32K bytes
32K bytes
4K bytes
Instruction SRAM
Data SRAM/Cache
Data SRAM
64K bytes 64K bytes
32K bytes 32K bytes
32K bytes 32K bytes
Scratchpad
4K bytes
Not
4K bytes
Flash
256K ϫ 16- 512K ϫ 16-
Applicable bit
bit
Maximum Speed Grade 533 MHz
533 MHz
1066
533 MHz
1066
1066
MMACS
MMACS
MMACS
All of the peripherals, except for general-purpose I/O, CAN,
TWI, real time clock, and timers, are supported by a flexible
DMA structure. There are also four separate memory DMA
channels dedicated to data transfers between the processor’s
various memory spaces, including external SDRAM and asyn-
chronous memory. Multiple on-chip buses running at up to
133 MHz provide enough bandwidth to keep the processor core
running with activity on all of the on-chip and external
peripherals.
Package Option
BC-316
BC-316
BC-316
By integrating a rich set of industry-leading system peripherals
and memory, Blackfin processors are the platform of choice for
next generation applications that require RISC-like program-
mability, multimedia support and leading edge signal
processing in one integrated package.
LOW POWER ARCHITECTURE
The ADSP-BF538/ADSP-BF538F processors include an on-chip
voltage regulator in support of the processor’s dynamic power
management capability. The voltage regulator provides a range
of core voltage levels from a single 2.25 V to 3.6 V input. The
voltage regulator can be bypassed as needed.
Blackfin processors provide world class power management and
performance. They are designed using a low power and low
voltage methodology and feature dynamic power management
which is the ability to vary both the voltage and frequency of
operation to significantly lower overall power consumption.
Varying the voltage and frequency can result in a substantial
reduction in power consumption, compared with just varying
the frequency of operation. This translates into longer battery
life and lower heat dissipation.
Rev. 0
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May 2007
ADSP-BF538/ADSP-BF538F
instructions include byte alignment and packing operations,
16-bit and 8-bit adds with clipping, 8-bit average operations,
and 8-bit subtract/absolute value/accumulate (SAA) operations.
The compare/select and vector search instructions are also
provided.
BLACKFIN PROCESSOR CORE
As shown in Figure 2 on Page 4, the Blackfin processor core
contains two 16-bit multipliers, two 40-bit accumulators, two
40-bit ALUs, four video ALUs, and a 40-bit shifter. The compu-
tation units process 8-bit, 16-bit, or 32-bit data from the
register file.
For certain instructions, two 16-bit ALU operations can be per-
formed simultaneously on register pairs (a 16-bit high half and
16-bit low half of a compute register). Quad 16-bit operations
are possible using the second ALU.
The compute register file contains eight 32-bit registers. When
performing compute operations on 16-bit operand data, the
register file operates as 16 independent 16-bit registers. All
operands for compute operations come from the multiported
register file and instruction constant fields.
The 40-bit shifter can perform shifts and rotates and is used to
support normalization, field extract, and field deposit
instructions.
Each MAC can perform a 16-bit by 16-bit multiply in each
cycle, accumulating the results into the 40-bit accumulators.
Signed and unsigned formats, rounding, and saturation are
supported.
The program sequencer controls the flow of instruction execu-
tion, including instruction alignment and decoding. For
program flow control, the sequencer supports PC relative and
indirect conditional jumps (with static branch prediction), and
subroutine calls. Hardware is provided to support zero over-
head looping. The architecture is fully interlocked, meaning that
the programmer need not manage the pipeline when executing
instructions with data dependencies.
The ALUs perform a traditional set of arithmetic and logical
operations on 16-bit or 32-bit data. In addition, many special
instructions are included to accelerate various signal processing
tasks. These include bit operations such as field extract and pop-
ulation count, modulo 232 multiply, divide primitives, saturation
and rounding, and sign/exponent detection. The set of video
ADDRESS ARITHMETIC UNIT
SP
FP
P5
P4
I3
I2
I1
I0
L3
L2
L1
L0
B3
B2
B1
B0
M3
M2
M1
M0
DAG1
P3
DAG0
P2
P1
P0
DA1
DA0
32
32
32
PREG
32
RAB
SD
LD1
LD0
32
32
32
ASTAT
32
32
SEQUENCER
R7.H
R7.L
R6.H
R5.H
R4.H
R3.H
R2.H
R1.H
R0.H
R6.L
R5.L
R4.L
R3.L
R2.L
R1.L
R0.L
ALIGN
16
16
8
8
8
8
DECODE
BARREL
SHIFTER
LOOP BUFFER
40
40
40 40
A0
A1
CONTROL
UNIT
32
32
DATA ARITHMETIC UNIT
Figure 2. Blackfin Processor Core
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ADSP-BF538/ADSP-BF538F
The address arithmetic unit provides two addresses for simulta-
neous dual fetches from memory. It contains a multiported
register file consisting of four sets of 32-bit index, modify,
length, and base registers (for circular buffering), and eight
additional 32-bit pointer registers (for C style indexed stack
manipulation).
0xFFFF FFFF
0xFFE0 0000
0xFFC0 0000
0xFFB0 1000
0xFFB0 0000
0xFFA1 4000
0xFFA1 0000
0xFFA0 0000
0xFF90 8000
0xFF90 4000
0xFF90 0000
0xFF80 8000
0xFF80 4000
0xFF80 0000
0xEF00 0000
0x2040 0000
CORE MMR REGISTERS (2M BYTE)
SYSTEM MMR REGISTERS (2M BYTE)
RESERVED
SCRATCHPAD SRAM (4K BYTE)
RESERVED
Blackfin processors support a modified Harvard architecture in
combination with a hierarchical memory structure. Level 1 (L1)
memories are those that typically operate at the full processor
speed with little or no latency. At the L1 level, the instruction
memory holds instructions only. The two data memories hold
data, and a dedicated scratchpad data memory stores stack and
local variable information.
INSTRUCTION SRAM/CACHE (16K BYTE)
INSTRUCTION SRAM (64K BYTE)
RESERVED
DATA BANK B SRAM/CACHE (16K BYTE)
DATA BANK B SRAM (16K BYTE)
RESERVED
DATA BANK A SRAM/CACHE (16K BYTE)
DATA BANK A SRAM (16K BYTE)
RESERVED
In addition, multiple L1 memory blocks are provided, offering a
configurable mix of SRAM and cache. The Memory Manage-
ment Unit (MMU) provides memory protection for individual
tasks that may be operating on the core and can protect system
registers from unintended access.
RESERVED
ASYNC MEMORY BANK 3 (1M BYTE) OR
ON-CHIP FLASH (ADSP-BF538F ONLY)
The architecture provides three modes of operation: User mode,
Supervisor mode, and Emulation mode. User mode has
restricted access to certain system resources, thus providing a
protected software environment, while supervisor mode has
unrestricted access to the system and core resources.
0x2030 0000
0x2020 0000
ASYNC MEMORY BANK 2 (1M BYTE) OR
ON-CHIP FLASH (ADSP-BF538F ONLY)
ASYNC MEMORY BANK 1 (1M BYTE) OR
ON-CHIP FLASH (ADSP-BF538F ONLY)
0x2010 0000
ASYNC MEMORY BANK 0 (1M BYTE) OR
ON-CHIP FLASH (ADSP-BF538F ONLY)
0x2000 0000
0x0800 0000
0x0000 0000
The Blackfin processor instruction set has been optimized so
that 16-bit opcodes represent the most frequently used instruc-
tions, resulting in excellent compiled code density. Complex
DSP instructions are encoded into 32-bit opcodes, representing
fully featured multifunction instructions. Blackfin processors
support a limited multi-issue capability, where a 32-bit instruc-
tion can be issued in parallel with two 16-bit instructions,
allowing the programmer to use many of the core resources in a
single instruction cycle.
RESERVED
SDRAM MEMORY (16M BYTE TO 128M BYTE)
Figure 3. ADSP-BF538/ADSP-BF538F Internal/External Memory Map
The memory DMA controllers provide high bandwidth data
movement capability. They can perform block transfers of code
or data between the internal memory and the external
memory spaces.
The Blackfin processor assembly language uses an algebraic syn-
tax for ease of coding and readability. The architecture has been
optimized for use in conjunction with the C/C++ compiler,
resulting in fast and efficient software implementations.
Internal (On-chip) Memory
The ADSP-BF538/ADSP-BF538F processors have three blocks
of on-chip memory providing high bandwidth access to
the core.
MEMORY ARCHITECTURE
The first is the L1 instruction memory, consisting of 80K bytes
SRAM, of which 16K bytes can be configured as a four way set-
associative cache. This memory is accessed at full
processor speed.
The ADSP-BF538/ADSP-BF538F processors view memory as a
single unified 4G byte address space, using 32-bit addresses. All
resources, including internal memory, external memory, and
I/O control registers, occupy separate sections of this common
address space. The memory portions of this address space are
arranged in a hierarchical structure to provide a good cost/per-
formance balance of some very fast, low latency on-chip
memory as cache or SRAM, and larger, lower cost and perfor-
mance off-chip memory systems. See Figure 3.
The second on-chip memory block is the L1 data memory, con-
sisting of two banks of up to 32K bytes each. Each memory bank
is configurable, offering both two-way set-associative cache and
SRAM functionality. This memory block is accessed at full pro-
cessor speed.
The third memory block is a 4K byte scratchpad SRAM which
runs at the same speed as the L1 memories, but is only accessible
as data SRAM and cannot be configured as cache memory.
The L1 memory system is the primary highest performance
memory available to the Blackfin processor. The off-chip mem-
ory system, accessed through the External Bus Interface Unit
(EBIU), provides expansion with SDRAM, flash memory, and
SRAM, optionally accessing up to 132M bytes of
physical memory.
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ADSP-BF538/ADSP-BF538F
• one million write cycles per sector
• 20 year data retention
External (Off-Chip) Memory
External memory is accessed via the external bus interface unit
(EBIU). This 16-bit interface provides a glueless connection to a
bank of synchronous DRAM (SDRAM) as well as up to four
banks of asynchronous memory devices including flash,
EPROM, ROM, SRAM, and memory mapped I/O devices.
The Blackfin processor connects to the flash memory die with
address, data, chip enable, write enable, and output enable con-
trols as if it were an external memory device.
The flash chip enable pin FCE must be connected to AMS0 or
AMS3–1 through a printed circuit board trace. When connected
to AMS0 the Blackfin processor can boot from the flash die.
When connected to AMS3–1 the flash memory appears as non-
volatile memory in the processor memory map shown in
Figure 3 on Page 5.
The PC133-compliant SDRAM controller can be programmed
to interface to up to 128M bytes of SDRAM. The SDRAM con-
troller allows one row to be open for each internal SDRAM
bank, for up to four internal SDRAM banks, improving overall
system performance.
The asynchronous memory controller can be programmed to
control up to four banks of devices with very flexible timing
parameters for a wide variety of devices. Each bank occupies a
1M byte segment regardless of the size of the devices used, so
that these banks will only be contiguous if each is fully popu-
lated with 1M byte of memory.
Flash Memory Programming
The ADSP-BF538F4 and ADSP-BF538F8 flash memory may be
programmed before or after mounting on the printed
circuit board.
To program the flash prior to mounting on the printed circuit
board, use a hardware programming tool that can provide the
data, address, and control stimuli to the flash die through the
external pins on the package. During this programming, VDDEXT
and GND must be provided to the package and the Blackfin
must be held in reset with bus request (BR) asserted and a
CLKIN provided.
Flash Memory
The ADSP-BF538F4 and ADSP-BF538F8 processors contain a
separate flash die, connected to the EBIU bus, within the pack-
age of the processors. Figure 4 on Page 6 shows how the flash
memory die and Blackfin processor die are connected.
The VisualDSP++® tools may be used to program the flash
memory after the device is mounted on a printed circuit board.
Flash Memory Sector Protection
To use the sector protection feature, a high voltage (+12 V nom-
inal) must be applied to the flash FRESET pin. Refer to the flash
data sheet for details.
ADDR19-1
A18-0
OE
WE
RY/BY
DQ15-0
VSS
VCC
BYTE
CE
ARE
AWE
ARDY
DATA15-0
I/O Memory Space
GND
DDEXT
V
Blackfin processors do not define a separate I/O space. All
resources are mapped through the flat 32-bit address space. On-
chip I/O devices have their control registers mapped into mem-
ory mapped registers (MMRs) at addresses near the top of the
4G byte address space. These are separated into two smaller
blocks, one which contains the control MMRs for all core func-
tions, and the other which contains the registers needed for
setup and control of the on-chip peripherals outside of the core.
The MMRs are accessible only in supervisor mode and appear
as reserved space to on-chip peripherals.
AMS3-0
RESET
RESET
ADSP-BF538Fx
PACKAGE
Figure 4. Internal Connection of Flash Memory (ADSP-BF538Fx)
Booting
The ADSP-BF538/ADSP-BF538F processors contain a small
boot kernel, which configures the appropriate peripheral for
booting. If the processor is configured to boot from boot ROM
memory space, the processor starts executing from the on-chip
boot ROM. For more information, see Booting Modes on
Page 16.
The ADSP-BF538F4 contains a 4M bit (256K ϫ 16-bit) bottom
boot sector Spansion S29AL004D known good die flash mem-
ory†. The ADSP-BF538F8 contains an 8M bit (512K ϫ 16-bit)
bottom boot sector Spansion S29AL008D known good die flash
memory. The following features are also included.
• access times as fast as 70 ns (EBIU registers must be set
appropriately)
Event Handling
• sector protection
The event controller on the ADSP-BF538/ADSP-BF538F pro-
cessors handle all asynchronous and synchronous events to the
processors. The processor provides event handling that sup-
ports both nesting and prioritization. Nesting allows multiple
† Refer to the Spansion web-site for the appropriate data sheets.
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ADSP-BF538/ADSP-BF538F
event service routines to be active simultaneously. Prioritization
ensures that servicing of a higher priority event takes prece-
dence over servicing of a lower priority event. The controller
provides support for five different types of events:
Table 2. Core Event Controller (CEC)
Priority
(0 is Highest) Event Class
EVT Entry
EMU
0
Emulation/Test Control
• Emulation – An emulation event causes the processor to
enter emulation mode, allowing command and control of
the processor via the JTAG interface.
1
Reset
RST
2
Nonmaskable Interrupt
Exception
NMI
• Reset – This event resets the processor.
3
EVX
• Nonmaskable interrupt (NMI) – The NMI event can be
generated by the software watchdog timer or by the NMI
input signal to the processor. The NMI event is frequently
used as a power-down indicator to initiate an orderly shut-
down of the system.
4
Reserved
—
5
Hardware Error
IVHW
IVTMR
IVG7
6
Core Timer
7
General Interrupt 7
General Interrupt 8
General Interrupt 9
General Interrupt 10
General Interrupt 11
General Interrupt 12
General Interrupt 13
General Interrupt 14
General Interrupt 15
8
IVG8
• Exceptions – Events that occur synchronously to program
flow (the exception is taken before the instruction is
allowed to complete). Conditions such as data alignment
violations and undefined instructions cause exceptions.
9
IVG9
10
11
12
13
14
15
IVG10
IVG11
IVG12
IVG13
IVG14
IVG15
• Interrupts – Events that occur asynchronously to program
flow. They are caused by input pins, timers, and other
peripherals, as well as by an explicit software instruction.
Each event type has an associated register to hold the return
address and an associated return-from-event instruction. When
an event is triggered, the state of the processors is saved on the
supervisor stack.
The ADSP-BF538/ADSP-BF538F processor’s event controllers
consist of two stages, the core event controller (CEC) and the
system interrupt controllers (SIC). The core event controller
works with the system interrupt controllers to prioritize and
control all system events. Conceptually, interrupts from the
peripherals enter into one of the SICs, and are then routed
directly into the general-purpose interrupts of the CEC.
Core Event Controller (CEC)
The CEC supports nine general-purpose interrupts (IVG15–7),
in addition to the dedicated interrupt and exception events. Of
these general-purpose interrupts, the two lowest priority inter-
rupts (IVG15–14) are recommended to be reserved for software
interrupt handlers, leaving seven prioritized interrupt inputs to
support the peripherals of the processor.
Table 2 describes the inputs to the CEC, identifies their names
in the event vector table (EVT), and lists their priorities.
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ADSP-BF538/ADSP-BF538F
Table 3. System and Core Event Mapping (Continued)
System Interrupt Controllers (SIC)
The system interrupt controllers (SIC0, SIC1) provide the map-
ping and routing of events from the many peripheral interrupt
sources to the prioritized general-purpose interrupt inputs of
the CEC. Although the ADSP-BF538/ADSP-BF538F processors
provide a default mapping, the user can alter the mappings and
priorities of interrupt events by writing the appropriate values
into the interrupt assignment registers (SIC_IARx).
Core
Event Name
Event Source
Timer0, Timer1, Timer2 Interrupts
TWI0 Interrupt
IVG11
IVG11
IVG11
IVG11
IVG11
IVG12
IVG13
IVG13
IVG13
IVG13
IVG13
TWI1 Interrupt
CAN Receive Interrupt
CAN Transmit Interrupt
Port F GPIO Interrupts A and B
MDMA0 Stream 0 Interrupt
MDMA0 Stream 1 Interrupt
MDMA1 Stream 0 Interrupt
MDMA1 Stream 1 Interrupt
Software Watchdog Timer
Table 3 describes the inputs into the SICs and the default map-
pings into the CEC.
Table 3. System and Core Event Mapping
Core
Event Source
Event Name
PLL Wakeup Interrupt
IVG7
DMA Controller 0 Error
DMA Controller 1 Error
PPI Error Interrupt
IVG7
IVG7
Event Control
IVG7
The ADSP-BF538/ADSP-BF538F processors provide the user
with a very flexible mechanism to control the processing of
events. In the CEC, three registers are used to coordinate and
control events. Each register is 32 bits wide:
SPORT0 Error Interrupt
SPORT1 Error Interrupt
SPORT2 Error Interrupt
SPORT3 Error Interrupt
SPI0 Error Interrupt
IVG7
IVG7
IVG7
• CEC interrupt latch register (ILAT) – The ILAT register
indicates when events have been latched. The appropriate
bit is set when the processor has latched the event and
cleared when the event has been accepted into the system.
This register is updated automatically by the controller, but
it may also be written to clear (cancel) latched events. This
register may be read while in supervisor mode and may
only be written while in supervisor mode when the corre-
sponding IMASK bit is cleared.
IVG7
IVG7
SPI1 Error Interrupt
IVG7
SPI2 Error Interrupt
IVG7
UART0 Error Interrupt
IVG7
UART1 Error Interrupt
IVG7
UART2 Error Interrupt
IVG7
CAN Error Interrupt
IVG7
• CEC interrupt mask register (IMASK) – The IMASK regis-
ter controls the masking and unmasking of individual
events. When a bit is set in the IMASK register, that event is
unmasked and will be processed by the CEC when asserted.
A cleared bit in the IMASK register masks the event, pre-
venting the processor from servicing the event even though
the event may be latched in the ILAT register. This register
may be read or written while in supervisor mode. (Note
that general-purpose interrupts can be globally enabled and
disabled with the STI and CLI instructions, respectively.)
Real Time Clock Interrupts
DMA0 Interrupt (PPI)
IVG8
IVG8
DMA1 Interrupt (SPORT0 Rx)
DMA2 Interrupt (SPORT0 Tx)
DMA3 Interrupt (SPORT1 Rx)
DMA4 Interrupt (SPORT1 Tx)
DMA8 Interrupt (SPORT2 Rx)
DMA9 Interrupt (SPORT2 Tx)
DMA10 Interrupt (SPORT3 Rx)
DMA11 Interrupt (SPORT3 Tx)
DMA5 Interrupt (SPI0)
DMA14 Interrupt (SPI1)
DMA15 Interrupt (SPI2)
DMA6 Interrupt (UART0 Rx)
DMA7 Interrupt (UART0 Tx)
DMA16 Interrupt (UART1 Rx)
DMA17 Interrupt (UART1 Tx)
DMA18 Interrupt (UART2 Rx)
DMA19 Interrupt (UART2 Tx)
IVG9
IVG9
IVG9
IVG9
IVG9
IVG9
• CEC interrupt pending register (IPEND) – The IPEND
register keeps track of all nested events. A set bit in the
IPEND register indicates the event is currently active or
nested at some level. This register is updated automatically
by the controller but may be read while in supervisor mode.
IVG9
IVG9
IVG10
IVG10
IVG10
IVG10
IVG10
IVG10
IVG10
IVG10
IVG10
Each SIC allows further control of event processing by provid-
ing three 32-bit interrupt control and status registers. Each
register contains a bit corresponding to each of the peripheral
interrupt events shown in Table 3 on Page 8.
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ADSP-BF538/ADSP-BF538F
• SIC interrupt mask registers (SIC_IMASKx) – These regis-
ters control the masking and unmasking of each peripheral
interrupt event. When a bit is set in these registers, that
peripheral event is unmasked and will be processed by the
system when asserted. A cleared bit in these registers masks
the peripheral event, preventing the processor from servic-
ing the event.
implementation of interleaved data streams. This feature is
especially useful in video applications where data can be
deinterleaved on the fly.
Examples of DMA types supported by the processor DMA con-
troller include:
• A single, linear buffer that stops upon completion
• A circular, auto-refreshing buffer that interrupts on each
full or fractionally full buffer
• SIC interrupt status registers (SIC_ISRx) – As multiple
peripherals can be mapped to a single event, these registers
allow the software to determine which peripheral event
source triggered the interrupt. A set bit indicates the
peripheral is asserting the interrupt, and a cleared bit indi-
cates the peripheral is not asserting the event.
• 1-D or 2-D DMA using a linked list of descriptors
• 2-D DMA using an array of descriptors, specifying only the
base DMA address within a common page
In addition to the dedicated peripheral DMA channels, there are
four memory DMA channels provided for transfers between the
various memories of the ADSP-BF538/ADSP-BF538F proces-
sor’s systems. This enables transfers of blocks of data between
any of the memories—including external SDRAM, ROM,
SRAM, and flash memory—with minimal processor interven-
tion. Memory DMA transfers can be controlled by a very
flexible descriptor based methodology or by a standard register
based autobuffer mechanism.
• SIC interrupt wakeup enable registers (SIC_IWRx) – By
enabling the corresponding bit in these registers, a periph-
eral can be configured to wake up the processor, should the
core be idled when the event is generated. (For more infor-
mation, see Dynamic Power Management on Page 13.)
Because multiple interrupt sources can map to a single general-
purpose interrupt, multiple pulse assertions can occur simulta-
neously, before or during interrupt processing for an interrupt
event already detected on this interrupt input. The IPEND
register contents are monitored by the SICs as the interrupt
acknowledgement.
REAL TIME CLOCK
The ADSP-BF538/ADSP-BF538F processor’s real time clock
(RTC) provides a robust set of digital watch features, including
current time, stopwatch, and alarm. The RTC is clocked by a
32.768 kHz crystal external to the processor. The RTC periph-
eral has dedicated power supply pins so that it can remain
powered up and clocked even when the rest of the processors
are in a low power state. The RTC provides several programma-
ble interrupt options, including interrupt per second, minute,
hour, or day clock ticks, interrupt on programmable stopwatch
countdown, or interrupt at a programmed alarm time.
The appropriate ILAT register bit is set when an interrupt rising
edge is detected (detection requires two core clock cycles). The
bit is cleared when the respective IPEND register bit is set. The
IPEND bit indicates that the event has entered into the proces-
sor pipeline. At this point the CEC will recognize and queue the
next rising edge event on the corresponding event input. The
minimum latency from the rising edge transition of the general-
purpose interrupt to the IPEND output asserted is three core
clock cycles; however, the latency can be much higher, depend-
ing on the activity within and the state of the processor.
The 32.768 kHz input clock frequency is divided down to a 1 Hz
signal by a prescaler. The counter function of the timer consists
of four counters: a 60 second counter, a 60 minute counter, a 24
hour counter, and a 32,768 day counter.
DMA CONTROLLERS
The ADSP-BF538/ADSP-BF538F processors have two, inde-
pendent DMA controllers that support automated data transfers
with minimal overhead for the processor core. DMA transfers
can occur between the processor internal memories and any of
its DMA capable peripherals. Additionally, DMA transfers can
be accomplished between any of the DMA capable peripherals
and external devices connected to the external memory inter-
faces, including the SDRAM controller and the asynchronous
memory controller. DMA capable peripherals include the
SPORTs, SPI ports, UARTs, and PPI. Each individual DMA
capable peripheral has at least one dedicated DMA channel.
When enabled, the alarm function generates an interrupt when
the output of the timer matches the programmed value in the
alarm control register. There are two alarms: The first alarm is
for a time of day. The second alarm is for a day and time of that
day.
The stopwatch function counts down from a programmed
value, with one second resolution. When the stopwatch is
enabled and the counter underflows, an interrupt is generated.
Like the other peripherals, the RTC can wake up the ADSP-
BF538/ADSP-BF538F processor from sleep mode upon genera-
tion of any RTC wakeup event. Additionally, an RTC wakeup
event can wake up the processor from deep sleep mode and
wake up the on-chip internal voltage regulator from the pow-
ered down hibernate state.
The DMA controllers support both 1-dimensional (1-D) and 2-
dimensional (2-D) DMA transfers. DMA transfer initialization
can be implemented from registers or from sets of parameters
called descriptor blocks.
The 2-D DMA capability supports arbitrary row and column
sizes up to 64K elements by 64K elements, and arbitrary row
and column step sizes up to 32K elements. Furthermore, the
column step size can be less than the row step size, allowing
Connect RTC pins RTXI and RTXO with external components
as shown in Figure 5.
Rev. 0
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May 2007
ADSP-BF538/ADSP-BF538F
In addition to the three general-purpose programmable timers,
a fourth timer is also provided. This extra timer is clocked by the
internal processor clock and is typically used as a system tick
clock for generation of operating system periodic interrupts.
RTXI
RTXO
R1
X1
SERIAL PORTS (SPORTs)
C1
C2
The ADSP-BF538/ADSP-BF538F processors incorporate four
dual-channel synchronous serial ports for serial and multipro-
cessor communications. The SPORTs support the following
features:
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• I2S capable operation.
p
C1 = 22 pF
C2 = 22 pF
R1 = 10M OHM
• Bidirectional operation – Each SPORT has two sets of inde-
pendent transmit and receive pins, enabling 16 channels of
I2S stereo audio.
NOTE: C1 AND C2 ARE SPECIFIC TO CRYSTAL SPECIFIED FOR X1.
CONTACT CRYSTAL MANUFACTURER FOR DETAILS. C1 AND C2
SPECIFICATIONS ASSUME BOARD TRACE CAPACITANCE OF 3 F.
p
• Buffered (8-deep) transmit and receive ports – Each port
has a data register for transferring data words to and from
other processor components and shift registers for shifting
data in and out of the data registers.
Figure 5. External Components for RTC
WATCHDOG TIMER
• Clocking – Each transmit and receive port can either use an
external serial clock or generate its own, in frequencies
ranging from (fSCLK/131,070) Hz to (fSCLK/2) Hz.
The ADSP-BF538/ADSP-BF538F processors include a 32-bit
timer that can be used to implement a software watchdog func-
tion. A software watchdog can improve system availability by
forcing the processor to a known state through generation of a
hardware reset, nonmaskable interrupt (NMI), or general-pur-
pose interrupt, if the timer expires before being reset by
software. The programmer initializes the count value of the
timer, enables the appropriate interrupt, then enables the timer.
Thereafter, the software must reload the counter before it
counts to zero from the programmed value. This protects the
system from remaining in an unknown state where software,
which would normally reset the timer, has stopped running due
to an external noise condition or software error.
• Word length – Each SPORT supports serial data words
from 3 bits to 32 bits in length, transferred most significant
bit first or least significant bit first.
• Framing – Each transmit and receive port can run with or
without frame sync signals for each data word. Frame sync
signals can be generated internally or externally, active high
or low, and with either of two pulse widths and early or late
frame sync.
• Companding in hardware – Each SPORT can perform
A-law or μ-law companding according to ITU recommen-
dation G.711. Companding can be selected on the transmit
and/or receive channel of the SPORT without additional
latencies.
If configured to generate a hardware reset, the watchdog timer
resets both the core and the processor peripherals. After a reset,
software can determine if the watchdog was the source of the
hardware reset by interrogating a status bit in the watchdog
timer control register.
• DMA operations with single-cycle overhead – Each SPORT
can automatically receive and transmit multiple buffers of
memory data. The processor can link or chain sequences of
DMA transfers between a SPORT and memory.
The timer is clocked by the system clock (SCLK), at a maximum
frequency of fSCLK
.
• Interrupts – Each transmit and receive port generates an
interrupt upon completing the transfer of a data word or
after transferring an entire data buffer or buffers through
DMA.
TIMERS
There are four general-purpose programmable timer units in
the ADSP-BF538/ADSP-BF538F processors. Three timers have
an external pin that can be configured either as a pulse width
modulator (PWM) or timer output, as an input to clock the
timer, or as a mechanism for measuring pulse widths and peri-
ods of external events. These timers can be synchronized to an
external clock input to the PF1 pin (TACLK), an external clock
input to the PPI_CLK pin (TMRCLK), or to the internal SCLK.
• Multichannel capability – Each SPORT supports 128 chan-
nels out of a 1024 channel window and is compatible with
the H.100, H.110, MVIP-90, and HMVIP standards.
SERIAL PERIPHERAL INTERFACE (SPI) PORTS
The ADSP-BF538/ADSP-BF538F processors incorporate three
SPI compatible ports that enable the processor to communicate
with multiple SPI compatible devices.
The timer units can be used in conjunction with UART0 to
measure the width of the pulses in the data stream to provide an
auto-baud detect function for a serial channel.
The SPI interface uses three pins for transferring data: two data
pins (master output-slave input, MOSIx, and master input-slave
output, MISOx) and a clock pin (serial clock, SCKx). An SPI
chip select input pin (SPIxSS) lets other SPI devices select the
The timers can generate interrupts to the processor core provid-
ing periodic events for synchronization, either to the system
clock or to a count of external signals.
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ADSP-BF538/ADSP-BF538F
processor. For SPI0, seven SPI chip select output pins
(SPI0SEL7–1) let the processor select other SPI devices. SPI1
and SPI2 each have a single SPI chip select output pin
(SPI1SEL1 and SPI2SEL1) for SPI point-to-point communica-
tion. Each of the SPI select pins are reconfigured GPIO pins.
Using these pins, the SPI ports provide a full-duplex, synchro-
nous serial interface, which supports both master/slave modes
and multimaster environments.
DMA channels, one for transmit and one for receive. These
DMA channels have lower default priority than most DMA
channels because of their relatively low service rates.
Each UART port’s baud rate, serial data format, error code gen-
eration and status, and interrupts are programmable:
• Supporting bit rates ranging from (fSCLK/ 1,048,576) to
(fSCLK/16) bits per second.
• Supporting data formats from 7 to12 bits per frame.
The SPI ports’ baud rate and clock phase/polarities are pro-
grammable, and it has an integrated DMA controller,
configurable to support transmit or receive data streams. Each
SPI’s DMA controller can only service unidirectional accesses at
any given time.
• Both transmit and receive operations can be configured to
generate maskable interrupts to the processor.
Each UART port’s clock rate is calculated as:
fSCLK
16 × UART_Divisor
The SPI port’s clock rate is calculated as:
-----------------------------------------------
UART Clock Rate =
fSCLK
2 × SPIx_BAUD
--------------------------------------
SPI Clock Rate =
Where the 16-bit UART_Divisor comes from the UARTx_DLH
register (most significant 8 bits) and UARTx_DLL register (least
significant 8 bits).
Where the 16-bit SPIx_BAUD register contains a value of 2 to
65,535.
In conjunction with the general-purpose timer functions, auto-
baud detection is supported on UART0.
During transfers, the SPI port simultaneously transmits and
receives by serially shifting data in and out on its two serial data
lines. The serial clock line synchronizes the shifting and sam-
pling of data on the two serial data lines.
The capabilities of the UARTs are further extended with sup-
port for the Infrared Data Association (IrDA) Serial Infrared
Physical Layer Link Specification (SIR) protocol.
2-WIRE INTERFACE
GENERAL-PURPOSE PORTS
The ADSP-BF538/ADSP-BF538F processors have two 2-wire
interface (TWI) modules that are compatible with the Philips
Inter-IC bus standard. The TWI modules offer the capabilities
of simultaneous master and slave operation, support for 7-bit
addressing and multimedia data arbitration. The TWI also
includes master clock synchronization and support for clock
low extension.
The ADSP-BF538/ADSP-BF538F processors have up to 54 gen-
eral-purpose I/O pins that are multiplexed with other
peripherals. They are arranged into ports C, D, E, and F as
shown in Table 4.
The general-purpose I/O pins may be individually controlled by
manipulation of the control and status registers. These pins may
be polled to determine their status.
The TWI interface uses two pins for transferring clock (SCLx)
and data (SDAx) and supports the protocol at speeds up to
400 kbps.
• GPIO direction control register – Specifies the direction of
each individual GPIO pin as input or output.
• GPIO control and status registers – The processor employs
a “write one to modify” mechanism that allows any combi-
nation of individual GPIO to be modified in a single
instruction, without affecting the level of any other GPIO.
Four control registers and a data register are provided for
each GPIO port. One register is written in order to set
GPIO values, one register is written in order to clear GPIO
values, one register is written in order to toggle GPIO val-
ues, and one register is written in order to specify a GPIO
input or output. Reading the GPIO data allows software to
determine the state of the input GPIO pins.
The TWI interface pins are compatible with 5 V logic levels.
UART PORTs
The ADSP-BF538/ADSP-BF538F processors incorporate three
full-duplex Universal Asynchronous Receiver/Transmitter
(UART) ports, which are fully compatible with PC standard
UARTs. The UART ports provide a simplified UART interface
to other peripherals or hosts, supporting full-duplex, DMA sup-
ported, asynchronous transfers of serial data. The UART ports
include support for 5 data bits to 8 data bits, 1 stop bit or 2 stop
bits, and none, even, or odd parity. The UART ports support
two modes of operation:
In addition to the GPIO function described above, the 16 port F
pins can be individually configured to generate interrupts.
• PIO (programmed I/O) – The processor sends or receives
data by writing or reading I/O mapped UART registers.
The data is double buffered on both transmit and receive.
• GPIO Pin interrupt mask registers – The two GPIO pin
interrupt mask registers allow each individual PFx pin to
function as an interrupt to the processor. Similar to the two
GPIO control registers that are used to set and clear indi-
vidual GPIO pin values, one GPIO pin interrupt mask
register sets bits to enable interrupt function, and the other
GPIO pin interrupt mask register clears bits to disable
• DMA (direct memory access) – The DMA controller trans-
fers both transmit and receive data. This reduces the
number and frequency of interrupts required to transfer
data to and from memory. Each UART has two dedicated
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ADSP-BF538/ADSP-BF538F
interrupt function. PFx pins defined as inputs can be con-
figured to generate hardware interrupts, while output PFx
pins can be triggered by software interrupts.
General-Purpose Mode Descriptions
The general-purpose modes of the PPI are intended to suit a
wide variety of data capture and transmission applications.
Three distinct submodes are supported:
• GPIO pin interrupt sensitivity registers – The two GPIO
pin interrupt sensitivity registers specify whether individ-
ual PFx pins are level- or edge-sensitive and specify—if
edge-sensitive—whether just the rising edge or both the ris-
ing and falling edges of the signal are significant. One
register selects the type of sensitivity, and one register
selects which edges are significant for edge-sensitivity.
• Input mode – frame syncs and data are inputs into the PPI.
• Frame capture mode – frame syncs are outputs from the
PPI, but data are inputs.
• Output mode – frame syncs and data are outputs from the
PPI.
Input Mode
Table 4. GPIO Ports
Input mode is intended for ADC applications, as well as video
communication with hardware signaling. In its simplest form,
PPI_FS1 is an external frame sync input that controls when to
read data. The PPI_DELAY MMR allows for a delay (in
PPI_CLK cycles) between reception of this frame sync and the
initiation of data reads. The number of input data samples is
user programmable and defined by the contents of the
PPI_COUNT register. The PPI supports 8-bit, and 10-bit
through 16-bit data, and are programmable in the
Peripheral
PPI
Alternate GPIO Port Function
GPIO Port F15–3
GPIO Port E7–0
SPORT2
SPORT3
SPI0
GPIO Port E15–8
GPIO Port F7–0
SPI1
GPIO Port D4–0
SPI2
GPIO Port D9–5
PPI_CONTROL register.
UART1
UART2
CAN
GPIO Port D11–10
GPIO Port D13–12
GPIO Port C1–0
Frame Capture Mode
Frame capture mode allows the video source(s) to act as a slave
(e.g., for frame capture). The ADSP-BF538/ADSP-BF538F pro-
cessors control when to read from the video source(s). PPI_FS1
is an HSYNC output and PPI_FS2 is a VSYNC output.
GPIO
GPIO Port C9–41
1 Note that the PC9–PC4 pins are GPIO only and cannot be reconfigured through
software.
Output Mode
PARALLEL PERIPHERAL INTERFACE
Output mode is used for transmitting video or other data with
up to three output frame syncs. Typically, a single frame sync is
appropriate for data converter applications, whereas two or
three frame syncs could be used for sending video with hard-
ware signaling.
The ADSP-BF538/ADSP-BF538F processors provide a parallel
peripheral interface (PPI) that can connect directly to parallel
A/D and D/A converters, video encoders and decoders, and
other general-purpose peripherals. The PPI consists of a dedi-
cated input clock pin, up to 3 frame synchronization pins, and
up to 16 data pins. The input clock supports parallel data rates at
up to fSCLK/2 MHz, and the synchronization signals can be con-
figured as either inputs or outputs.
ITU-R 656 Mode Descriptions
The ITU-R 656 modes of the PPI are intended to suit a wide
variety of video capture, processing, and transmission applica-
tions. Three distinct submodes are supported:
The PPI supports a variety of general-purpose and ITU-R 656
modes of operation. In general-purpose mode, the PPI provides
half-duplex, bi-directional data transfer with up to 16 bits of
data. Up to 3 frame synchronization signals are also provided.
In ITU-R 656 mode, the PPI provides half-duplex, bi-direc-
tional transfer of 8- or 10-bit video data. Additionally, on-chip
decode of embedded start-of-line (SOL) and start-of-field (SOF)
preamble packets is supported.
• Active video only mode
• Vertical blanking only mode
• Entire field mode
Active Video Only Mode
Active video only mode is used when only the active video por-
tion of a field is of interest and not any of the blanking intervals.
The PPI does not read in any data between the end of active
video (EAV) and start of active video (SAV) preamble symbols,
or any data present during the vertical blanking intervals. In this
mode, the control byte sequences are not stored to memory;
they are filtered by the PPI. After synchronizing to the start of
Field 1, the PPI ignores incoming samples until it sees an SAV
code. The user specifies the number of active video lines per
frame (in PPI_COUNT register).
Rev. 0
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ADSP-BF538/ADSP-BF538F
further reducing power dissipation. Control of clocking to each
of the processor peripherals also reduces power consumption.
See Table 5 for a summary of the power settings for each mode.
Vertical Blanking Interval Mode
In this mode, the PPI only transfers vertical blanking interval
(VBI) data.
Full-On Operating Mode—Maximum Performance
Entire Field Mode
In the full-on mode, the PLL is enabled and is not bypassed,
providing capability for maximum operational frequency. This
is the powerup default execution state in which maximum per-
formance can be achieved. The processor core and all enabled
peripherals run at full speed.
In this mode, the entire incoming bit stream is read in through
the PPI. This includes active video, control preamble sequences,
and ancillary data that may be embedded in horizontal and ver-
tical blanking intervals. Data transfer starts immediately after
synchronization to Field 1.
Active Operating Mode—Moderate Power Savings
CONTROLLER AREA NETWORK (CAN) INTERFACE
In the active mode, the PLL is enabled but bypassed. Because the
PLL is bypassed, the processor’s core clock (CCLK) and system
clock (SCLK) run at the input clock (CLKIN) frequency. In this
mode, the CLKIN to CCLK multiplier ratio can be changed,
although the changes are not realized until the full-on mode is
entered. DMA access is available to appropriately configured L1
memories.
The ADSP-BF538/ADSP-BF538F processors provide a CAN
controller that is a communication controller implementing the
Controller Area Network (CAN) V2.0B protocol. This protocol
is an asynchronous communications protocol used in both
industrial and automotive control systems. CAN is well suited
for control applications due to its capability to communicate
reliably over a network since the protocol incorporates CRC
checking, message error tracking, and fault node confinement.
In the active mode, it is possible to disable the PLL through the
PLL Control register (PLL_CTL). If disabled, the PLL must be
re-enabled before transitioning to the Full-On or Sleep modes.
The CAN controller is based on a 32-entry mailbox RAM and
supports both the standard and extended identifier (ID) mes-
sage formats specified in the CAN protocol specification,
revision 2.0, part B.
Table 5. Power Settings
Each mailbox consists of eight 16-bit data words. The data is
divided into fields, which includes a message identifier, a time
stamp, a byte count, up to 8 bytes of data, and several control
bits. Each node monitors the messages being passed on the net-
work. If the identifier in the transmitted message matches an
identifier in one of its mailboxes, then the module knows that
the message was meant for it, passes the data into its appropriate
mailbox, and signals the processor of message arrival with an
interrupt.
Full On
Active
Sleep
Enabled
No
Enabled Enabled On
Enabled Enabled On
Disabled Enabled On
Disabled Disabled On
Disabled Disabled Off
Enabled/ Disabled Yes
Enabled
Deep Sleep Disabled
Hibernate Disabled
The CAN controller can wake up the processor from sleep mode
upon generation of a wakeup event, such that the processor can
be maintained in a low power mode during idle conditions.
Additionally, a CAN wakeup event can wake up the on-chip
internal voltage regulator from the powered-down
hibernate state.
Sleep Operating Mode—High Dynamic Power Savings
The sleep mode reduces dynamic power dissipation by disabling
the clock to the processor core (CCLK). The PLL and system
clock (SCLK), however, continue to operate in this mode. Typi-
cally an external event or RTC activity will wake up the
processor. When in the Sleep mode, assertion of wakeup causes
the processor to sense the value of the BYPASS bit in the PLL
control register (PLL_CTL). If BYPASS is disabled, the proces-
sor transitions to the full on mode. If BYPASS is enabled, the
processor will transition to the Active mode. When in the sleep
mode, system DMA access to L1 memory is not supported.
The electrical characteristics of each network connection are
very stringent, therefore the CAN interface is typically divided
into 2 parts: a controller and a transceiver. This allows a single
controller to support different drivers and CAN networks. The
ADSP-BF538/ADSP-BF538F CAN module represents the con-
troller part of the interface. This module’s network I/O is a
single transmit output and a single receive input, which connect
to a line transceiver.
Deep Sleep Operating Mode—Maximum Dynamic Power
Savings
The CAN clock is derived from the processor system clock
(SCLK) through a programmable divider and therefore does not
require an additional crystal.
The deep sleep mode maximizes dynamic power savings by dis-
abling the clocks to the processor core (CCLK) and to all
synchronous peripherals (SCLK). Asynchronous peripherals
such as the RTC may still be running, but will not be able to
access internal resources or external memory. This powered
down mode can only be exited by assertion of the reset interrupt
(RESET) or by an asynchronous interrupt generated by the
DYNAMIC POWER MANAGEMENT
The ADSP-BF538/ADSP-BF538F processors provide four oper-
ating modes, each with a different performance/power profile.
In addition, dynamic power management provides the control
functions to dynamically alter the processor core supply voltage,
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ADSP-BF538/ADSP-BF538F
RTC. When in deep sleep mode, an RTC asynchronous inter-
rupt causes the processor to transition to the active mode.
Assertion of RESET while in deep sleep mode causes the proces-
sor to transition to the full on mode after processor reset.
The dynamic power management feature of the processor
allows both the processor’s input voltage (VDDINT) and clock fre-
quency (fCCLK) to be dynamically controlled.
The savings in power dissipation can be modeled using the
power savings factor and % power savings calculations.
Hibernate State—Maximum Static Power Savings
The power savings factor is calculated as:
The hibernate state maximizes static power savings by disabling
the voltage and clocks to the processor core (CCLK) and to all
the synchronous peripherals (SCLK). The internal voltage regu-
lator for the processor can be shut off by writing b#00 to the
FREQ bits of the VR_CTL register. This disables both CCLK
and SCLK. Furthermore, it sets the internal power supply volt-
age (VDDINT) to 0 V to provide the lowest static power
dissipation. Any critical information stored internally (memory
contents, register contents, etc.) must be written to a nonvolatile
storage device prior to removing power if the processor state is
to be preserved. Since VDDEXT is still supplied in this mode, all of
the external pins three-state, unless otherwise specified. This
allows other devices that may be connected to the processor to
still have power applied without drawing unwanted current.
The internal supply regulator can be woken up either by a real
time clock wakeup, by CAN bus traffic, by asserting the RESET
pin, or by an external source.
Power Savings Factor
2
fCCLKRED
---------------------
fCCLKNOM
VDDINTRED
DDINTNOM
TRED
------------
TNOM
⎛
⎝
⎞
⎠
⎛
⎝
⎞
⎠
------------------------
=
×
×
V
where the variables in the equation are:
• fCCLKNOM is the nominal core clock frequency
• fCCLKRED is the reduced core clock frequency
• VDDINTNOM is the nominal internal supply voltage
• VDDINTRED is the reduced internal supply voltage
• TNOM is the duration running at fCCLKNOM
• TRED is the duration running at fCCLKRED
The power savings factor is calculated as:
Power Savings
% Power Savings = (1 – Power Savings Factor) × 100%
As shown in Table 6, the ADSP-BF538/ADSP-BF538F proces-
sors support three different power domains. The use of multiple
power domains maximizes flexibility, while maintaining com-
pliance with industry standards and conventions. The 3.3 V
VDDRTC power domain supplies the RTC I/O and logic so that
the RTC can remain functional when the rest of the chip is pow-
ered off. The 1.25 V VDDINT power domain supplies all the
internal logic except for the RTC logic. The 3.3 V VDDEXT power
domain supplies all the I/O except for the RTC crystal. There
are no sequencing requirements for the various power domains.
VOLTAGE REGULATION
The Blackfin processor provides an on-chip voltage regulator
that can generate processor core voltage levels of 0.8 V
(–5%/+10%) to 1.2 V (–5%/+10%) and 1.25 V (–4% to +10%)
from an external 2.7 V to 3.6 V supply. Figure 6 shows the typi-
cal external components required to complete the power
management system.
Table 6. Power Domains
SET OF DECOUPLING
CAPACITORS
2.25V TO 3.6V
INPUT VOLTAGE
RANGE
V
DDEXT
Power Domain
VDD Range
VDDRTC
(LOW-INDUCTANCE)
RTC Crystal I/O and Logic
All Internal Logic Except RTC
All I/O Except RTC
V
V
DDEXT
DDINT
+
VDDINT
100µF
VDDEXT
10µH
100nF
+
+
The VDDRTC should either be connected to a battery (if the RTC
is to operate while the rest of the chip is powered down) or
should be connected to the VDDEXT plane on the board. The
100µF
FDS9431A
100µF
10µF
LOW ESR
ZHCS1000
VDDRTC should remain powered when the processor is in hiber-
VR
VR
OUT
OUT
nate state, and should also be powered even if the RTC
functionality is not being used in an application.
SHORT AND LOW-
INDUCTANCE WIRE
The power dissipated by a processor is largely a function of the
clock frequency of the processor and the square of the operating
voltage. For example, reducing the clock frequency by 25%
results in a 25% reduction in dynamic power dissipation, while
reducing the voltage by 25% reduces dynamic power dissipation
by more than 40%. Further, these power savings are additive, in
that if the clock frequency and supply voltage are both reduced,
the power savings can be dramatic.
NOTE: DESIGNER SHOULD MINIMIZE
TRACE LENGTH TO FDS9431A.
GND
Figure 6. Voltage Regulator Circuit
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ADSP-BF538/ADSP-BF538F
The regulator controls the internal logic voltage levels and is
programmable with the voltage regulator control register
(VR_CTL) in increments of 50 mV. To reduce standby power
consumption, the internal voltage regulator can be programmed
BLACKFIN
CLKOUT
TO PLL CIRCUITRY
to remove power to the processor core while I/O power (VDDRTC
,
VDDEXT) is still supplied. While in the hibernate state, I/O power
EN
is still being applied, eliminating the need for external buffers.
The voltage regulator can be activated from this power-down
state either through an RTC wakeup, a CAN wakeup, a general-
purpose wakeup, or by asserting RESET, all of which will then
initiate a boot sequence. The regulator can also be disabled and
bypassed at the user’s discretion.
CLKIN
18 pF*
XTAL
FOR OVERTONE
OPERATION ONLY
Voltage Regulator Layout Guidelines
Regulator external component placement, board routing, and
bypass capacitors all have a significant effect on noise injected
into the other analog circuits on-chip. The VROUT1-0 traces
and voltage regulator external components should be consid-
ered as noise sources when doing board layout and should not
be routed or placed near sensitive circuits or components on the
board. All internal and I/O power supplies should be well
bypassed with bypass capacitors placed as close to the
18 pF*
NOTE: VALUES MARKED WITH * MUST BE CUSTOMIZED
DEPENDING ON THE CRYSTAL AND LAYOUT. PLEASE
ANALYZE CAREFULLY.
Figure 7. External Crystal Connections
As shown in Figure 8, the core clock (CCLK) and system
peripheral clock (SCLK) are derived from the input clock
(CLKIN) signal. An on-chip PLL is capable of multiplying the
CLKIN signal by a user programmable 0.5× to 64× multiplica-
tion factor (bounded by specified minimum and maximum
VCO frequencies). The default multiplier is 10×, but it can be
modified by a software instruction sequence. On-the-fly fre-
quency changes can be effected by simply writing to the
PLL_DIV register.
ADSPBF538/ADSP-BF538F processors as possible.
For further details on the on-chip voltage regulator and related
board design guidelines, see the Switching Regulator Design
Considerations for ADSP-BF533 Blackfin Processor (EE-228)
applications note on the Analog Devices web site (www.ana-
log.com)—use site search on “EE-228”.
The ADSP-BF538/ADSP-BF538F processor can be clocked by
an external crystal, a sine wave input, or a buffered, shaped
clock derived from an external clock oscillator.
If an external clock is used, it should be a TTL compatible signal
and must not be halted, changed, or operated below the speci-
fied frequency during normal operation. This signal is
connected to the processor’s CLKIN pin. When an external
clock is used, the XTAL pin must be left unconnected.
“FINE” ADJUSTMENT
“COARSE” ADJUSTMENT
ON-THE-FLY
REQUIRES PLL SEQUENCING
، 1, 2, 4, 8
، 1:15
CCLK
PLL
0.5ϫ TO 64ϫ
Alternatively, because the ADSP-BF538/ADSP-BF538F proces-
sor includes an on-chip oscillator circuit, an external crystal
may be used. For fundamental frequency operation, use the cir-
cuit shown in Figure 7. A parallel-resonant, fundamental
frequency, microprocessor-grade crystal is connected across the
CLKIN and XTAL pins. The on-chip resistance between CLKIN
and the XTAL pin is in the 500 kW range. Further parallel resis-
tors are typically not recommended. The two capacitors and the
series resistor, shown in Figure 7, fine tune the phase and ampli-
tude of the sine frequency. The capacitor and resistor values,
shown in Figure 7, are typical values only. The capacitor values
are dependent upon the crystal manufacturer's load capacitance
recommendations and the physical PCB layout. The resistor
value depends on the drive level specified by the crystal manu-
facturer. System designs should verify the customized values
based on careful investigation on multiple devices over the
allowed temperature range.
CLKIN
VCO
SCLK
SCLK ≤ CCLK
SCLK ≤ 133 MHz
Figure 8. Frequency Modification Methods
All on-chip peripherals are clocked by the system clock (SCLK).
The system clock frequency is programmable by means of the
SSEL3–0 bits of the PLL_DIV register. The values programmed
into the SSEL fields define a divide ratio between the PLL output
(VCO) and the system clock. SCLK divider values are 1
through 15.
A third-overtone crystal can be used at frequencies above
25 MHz. The circuit is then modified to ensure crystal operation
only at the third overtone, by adding a tuned inductor circuit as
shown in Figure 7.
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ADSP-BF538/ADSP-BF538F
Table 7 illustrates typical system clock ratios:
The BMODE pins of the reset configuration register, sampled
during power-on resets and software initiated resets, implement
the following modes:
Table 7. Example System Clock Ratios
• Execute from 16-bit external memory – Execution starts
from address 0x2000 0000 with 16-bit packing. The boot
ROM is bypassed in this mode. All configuration settings
are set for the slowest device possible (3-cycle hold time;
15-cycle R/W access times; 4-cycle setup).
Example Frequency Ratios (MHz)
Signal Name Divider Ratio
SSEL3–0
VCO/SCLK
VCO
100
300
500
SCLK
100
50
0001
1:1
0110
6:1
• Boot from 8-bit or 16-bit external flash memory – The 8-bit
flash boot routine located in boot ROM memory space is
set up using asynchronous memory bank 0. For
ADSP-BF538F processors, the on-chip flash is booted if
FCE is connected to AMS0. All configuration settings are
set for the slowest device possible (3-cycle hold time;
15-cycle R/W access times; 4-cycle setup).
1010
10:1
50
The maximum frequency of the system clock is fSCLK. Note that
the divisor ratio must be chosen to limit the system clock fre-
quency to its maximum of fSCLK. The SSEL value can be changed
dynamically without any PLL lock latencies by writing the
appropriate values to the PLL divisor register (PLL_DIV).
• Boot from SPI serial EEPROM/flash (8-, 16-, or 24-bit
addressable, or Atmel AT45DB041, AT45DB081, or
AT45DB161) connected to SPI0– SPI0 uses the PF2 output
pin to select a single SPI EEPROM/flash device, submits a
read command and successive address bytes (0x00) until a
valid 8-, 16-, or 24-bit, or Atmel addressable device is
detected, and begins clocking data into the processor at the
beginning of L1 instruction memory.
Note that when the SSEL value is changed, it will affect all the
peripherals that derive their clock signals from the SCLK signal.
The core clock (CCLK) frequency can also be dynamically
changed by means of the CSEL1–0 bits of the PLL_DIV register.
Supported CCLK divider ratios are 1, 2, 4, and 8, as shown in
Table 8. This programmable core clock capability is useful for
fast core frequency modifications.
• Boot from SPI host device connected to SPI0 – The Black-
fin processor operates in SPI slave mode and is configured
to receive the bytes of the LDR file from an SPI host (mas-
ter) agent. To hold off the host device from transmitting
while the boot ROM is busy, the Blackfin processor asserts
a GPIO pin, called host wait (HWAIT), to signal the host
device not to send any more bytes until the flag is deas-
serted. The flag is chosen by the user and this information
is transferred to the Blackfin processor via bits 10:5 of the
FLAG header in the LDR image.
Table 8. Core Clock Ratios
Example Frequency Ratios
Signal Name Divider Ratio
CSEL1–0
VCO/CCLK
VCO
300
300
500
200
CCLK
300
150
125
25
00
01
10
11
1:1
2:1
4:1
8:1
For each of the boot modes, a 10-byte header is first read from
an external memory device. The header specifies the number of
bytes to be transferred and the memory destination address.
Multiple memory blocks may be loaded by any boot sequence.
Once all blocks are loaded, program execution commences from
the start of L1 instruction SRAM.
BOOTING MODES
The ADSP-BF538/ADSP-BF538F processors have three mecha-
nisms (listed in Table 9) for automatically loading internal L1
instruction memory after a reset. A fourth mode is provided to
execute from external memory, bypassing the boot sequence.
In addition, Bit 4 of the reset configuration register can be set by
application code to bypass the normal boot sequence during a
software reset. For this case, the processor jumps directly to the
beginning of L1 instruction memory.
Table 9. Booting Modes
BMODE1–0 Description
00
Execute from 16-Bit External Memory
(Bypass Boot ROM)
To augment the boot modes, a secondary software loader is pro-
vided that adds additional booting mechanisms. This secondary
loader provides the capability to boot from 16-bit flash memory,
fast flash, variable baud rate, and other sources. In all boot
modes except bypass, program execution starts from on-chip L1
memory address 0xFFA0 0000.
01
Boot from 8-Bit or 16-Bit Flash, or
Boot from On-Chip Flash (ADSP-BF538F Only)
10
11
Boot from SPI Serial Master Connected to SPI0
Boot from SPI Serial Slave EEPROM /Flash
(8-,16-, or 24-Bit Address Range, or Atmel
AT45DB041, AT45DB081, or AT45DB161 Serial Flash)
Connected to SPI0
INSTRUCTION SET DESCRIPTION
The Blackfin processor family assembly language instruction set
employs an algebraic syntax designed for ease of coding and
readability. The instructions have been specifically tuned to pro-
vide a flexible, densely encoded instruction set that compiles to
a very small final memory size. The instruction set also provides
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ADSP-BF538/ADSP-BF538F
fully featured multifunction instructions that allow the pro-
grammer to use many of the processor core resources in a single
instruction. Coupled with many features more often seen on
microcontrollers, this instruction set is very efficient when com-
piling C and C++ source code. In addition, the architecture
supports both user (algorithm/application code) and supervisor
(O/S kernel, device drivers, debuggers, ISRs) modes of opera-
tion, allowing multiple levels of access to core processor
resources.
plexity, this capability can have increasing significance on the
designer’s development schedule, increasing productivity. Sta-
tistical profiling enables the programmer to nonintrusively poll
the processors as they are running the program. This feature,
unique to VisualDSP++, enables the software developer to pas-
sively gather important code execution metrics without
interrupting the real time characteristics of the program. Essen-
tially, the developer can identify bottlenecks in software quickly
and efficiently. By using the profiler, the programmer can focus
on those areas in the program that impact performance and take
corrective action.
The assembly language, which takes advantage of the proces-
sor’s unique architecture, offers the following advantages:
Debugging both C/C++ and assembly programs with the
VisualDSP++ debugger, programmers can:
• Seamlessly integrated DSP/CPU features are optimized for
both 8-bit and 16-bit operations.
• View mixed C/C++ and assembly code (interleaved source
and object information).
• A multi-issue load/store modified Harvard architecture,
which supports two 16-bit MAC or four 8-bit ALU plus
two load/store plus two pointer updates per cycle.
• Insert breakpoints.
• All registers, I/O, and memory are mapped into a unified
4G byte memory space, providing a simplified program-
ming model.
• Set conditional breakpoints on registers, memory,
and stacks.
• Trace instruction execution.
• Microcontroller features, such as arbitrary bit and bit-field
manipulation, insertion, and extraction; integer operations
on 8-, 16-, and 32-bit data types; and separate user and
supervisor stack pointers.
• Perform linear or statistical profiling of program execution.
• Fill, dump, and graphically plot the contents of memory.
• Perform source level debugging.
• Code density enhancements, which include intermixing of
16- and 32-bit instructions (no mode switching, no code
segregation). Frequently used instructions are encoded in
16 bits.
• Create custom debugger windows.
The VisualDSP++ IDDE lets programmers define and manage
software development. Its dialog boxes and property pages let
programmers configure and manage all of the Blackfin develop-
ment tools, including the color syntax highlighting in the
VisualDSP++ editor. This capability permits programmers to:
DEVELOPMENT TOOLS
The ADSP-BF538/ADSP-BF538F processors are supported with
a complete set of CROSSCORE® †software and hardware devel-
opment tools, including Analog Devices emulators and
VisualDSP++®‡ development environment. The same emulator
hardware that supports other Blackfin processors also fully
emulates the ADSP-BF538/ADSP-BF538F processors.
• Control how the development tools process inputs and
generate outputs.
• Maintain a one-to-one correspondence with the tool’s
command line switches.
The VisualDSP++ Kernel (VDK) incorporates scheduling and
resource management tailored specifically to address the mem-
ory and timing constraints of DSP programming. These
capabilities enable engineers to develop code more effectively,
eliminating the need to start from the very beginning when
developing new application code. The VDK features include
threads, critical and unscheduled regions, semaphores, events,
and device flags. The VDK also supports priority-based, pre-
emptive, cooperative, and time-sliced scheduling approaches. In
addition, the VDK was designed to be scalable. If the application
does not use a specific feature, the support code for that feature
is excluded from the target system.
The VisualDSP++ project management environment lets pro-
grammers develop and debug an application. This environment
includes an easy to use assembler (which is based on an alge-
braic syntax), an archiver (librarian/library builder), a linker, a
loader, a cycle-accurate instruction-level simulator, a C/C++
compiler, and a C/C++ runtime library that includes DSP and
mathematical functions. A key point for these tools is C/C++
code efficiency. The compiler has been developed for efficient
translation of C/C++ code to processor assembly. The proces-
sors have architectural features that improve the efficiency of
compiled C/C++ code.
The VisualDSP++ debugger has a number of important fea-
tures. Data visualization is enhanced by a plotting package that
offers a significant level of flexibility. This graphical representa-
tion of user data enables the programmer to quickly determine
the performance of an algorithm. As algorithms grow in com-
Because the VDK is a library, a developer can decide whether to
use it or not. The VDK is integrated into the VisualDSP++
development environment, but can also be used via standard
command line tools. When the VDK is used, the development
environment assists the developer with many error prone tasks
and assists in managing system resources, automating the gen-
eration of various VDK based objects, and visualizing the
system state, when debugging an application that uses the VDK.
† CROSSCORE is a registered trademark of Analog Devices, Inc.
‡ VisualDSP++ is a registered trademark of Analog Devices, Inc.
Rev. 0
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ADSP-BF538/ADSP-BF538F
Use the Expert Linker to visually manipulate the placement of
code and data on the embedded system. View memory utiliza-
tion in a color coded graphical form, easily move code and data
to different areas of the processor or external memory with the
drag of the mouse, examine run time stack and heap usage. The
Expert Linker is fully compatible with existing Linker Definition
File (LDF), allowing the developer to move between the graphi-
cal and textual environments.
sor must be halted to send data and commands, but once an
operation has been completed by the emulator, the processor
system is set running at full speed with no impact on system
timing.
To use these emulators, the target board must include a header
that connects the processor’s JTAG port to the emulator.
For details on target board design issues including mechanical
layout, single processor connections, multiprocessor scan
chains, signal buffering, signal termination, and emulator pod
logic, see Analog Devices JTAG Emulation Technical Reference
(EE-68) on the Analog Devices web site (www.analog.com)—
use site search on “EE-68.” This document is updated regularly
to keep pace with improvements to emulator support.
Analog Devices emulators use the IEEE 1149.1 JTAG Test
Access Port of the ADSP-BF538/ADSP-BF538F processors to
monitor and control the target board processor during emula-
tion. The emulator provides full speed emulation, allowing
inspection and modification of memory, registers, and proces-
sor stacks. Nonintrusive in-circuit emulation is assured by the
use of the processor’s JTAG interface—the emulator does not
affect target system loading or timing.
In addition to the software and hardware development tools
available from Analog Devices, third parties provide a wide
range of tools supporting the Blackfin processor family. Hard-
ware tools include Blackfin processor PC plug-in cards. Third
party software tools include DSP libraries, real time operating
systems, and block diagram design tools.
Evaluation Kit
Analog Devices offers a range of EZ-KIT Lite® evaluation plat-
forms to use as a cost effective method to learn more about
developing or prototyping applications with Analog Devices
processors, platforms, and software tools. Each EZ-KIT Lite
includes an evaluation board along with an evaluation suite of
the VisualDSP++ development and debugging environment
with the C/C++ compiler, assembler, and linker. Also included
are sample application programs, power supply, and a USB
cable. All evaluation versions of the software tools are limited
for use only with the EZ-KIT Lite product.
The USB controller on the EZ-KIT Lite board connects the
board to the USB port of the user’s PC, enabling the
VisualDSP++ evaluation suite to emulate the on-board proces-
sor in-circuit. This permits the customer to download, execute,
and debug programs for the EZ-KIT Lite system. It also allows
in-circuit programming of the on-board flash device to store
user-specific boot code, enabling the board to run as a standal-
one unit without being connected to the PC.
With a full version of VisualDSP++ installed (sold separately),
engineers can develop software for the EZ-KIT Lite or any cus-
tom defined system. Connecting one of Analog Devices JTAG
emulators to the EZ-KIT Lite board enables high speed, non-
intrusive emulation.
DESIGNING AN EMULATOR COMPATIBLE
PROCESSOR BOARD
The Analog Devices family of emulators are tools that every sys-
tem developer needs to test and debug hardware and software
systems. Analog Devices has supplied an IEEE 1149.1 JTAG
Test Access Port (TAP) on each JTAG processor. The emulator
uses the TAP to access the internal features of the processor,
allowing the developer to load code, set breakpoints, observe
variables, observe memory, and examine registers. The proces-
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ADSP-BF538/ADSP-BF538F
PIN DESCRIPTIONS
ADSP-BF538/ADSP-BF538F processor pin definitions are listed
in Table 10.
unused I/O pins have their input buffers disabled with the
exception of the pins that need pull-ups or pull-downs, as noted
in the table.
All pins are three-stated during and immediately after reset,
except the memory interface, asynchronous memory control,
and synchronous memory control pins, which are driven high.
If BR is active, then the memory pins are also three-stated. All
In order to maintain maximum functionality and reduce pack-
age size and pin count, some pins have dual, multiplexed
functionality. In cases where pin functionality is reconfigurable,
the default state is shown in plain text, while alternate function-
ality is shown in italics.
Table 10. Pin Descriptions
Pin Name
I/O
Function
Driver Type1
Memory Interface
ADDR19–1
O
I/O
O
I
Address Bus for Async/Sync Access
Data Bus for Async/Sync Access
Byte Enables/Data Masks for Async/Sync Access
Bus Request (This pin should be pulled high when not used.)
Bus Grant
A
A
A
DATA15–0
ABE1–0/SDQM1–0
BR
BG
O
O
A
A
BGH
Bus Grant Hang
Asynchronous Memory Control
AMS3–0
ARDY
O
I
Bank Select
A
Hardware Ready Control (This pin should always be pulled low when not
used.)
AOE
O
O
O
Output Enable
Read Enable
Write Enable
A
A
A
ARE
AWE
Flash Control
FCE
I
I
Flash Enable (This pin should be left unconnected or pulled low for the
ADSP-BF538.)
FRESET
Flash Reset (This pin should be left unconnected or pulled low for the
ADSP-BF538.)
Synchronous Memory Control
SRAS
O
O
O
O
O
O
O
Row Address Strobe
Column Address Strobe
Write Enable
A
A
A
A
B
SCAS
SWE
SCKE
Clock Enable
CLKOUT
SA10
Clock Output
A10 Pin
A
A
SMS
Bank Select
Timers
TMR0
I/O
I/O
I/O
Timer 0
C
C
C
TMR1/PPI_FS1
TMR2/PPI_FS2
Timer 1/PPI Frame Sync1
Timer 2/PPI Frame Sync2
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ADSP-BF538/ADSP-BF538F
Table 10. Pin Descriptions (Continued)
Pin Name
I/O
Function
Driver Type1
2-Wire Interface Port
These pins are open drain and require a pullup resistor. See version 2.1 of
the I2C specification for proper resistor values.
SDA0
I/O 5 V
I/O 5 V
I/O 5 V
I/O 5 V
TWI0 Serial Data
TWI0 Serial Clock
TWI1 Serial Data
TWI1 Serial Clock
E
E
E
E
SCL0
SDA1
SCL1
Serial Port0
RSCLK0
RFS0
I/O
I/O
I
SPORT0 Receive Serial Clock
SPORT0 Receive Frame Sync
SPORT0 Receive Data Primary
SPORT0 Receive Data Secondary
SPORT0 Transmit Serial Clock
SPORT0 Transmit Frame Sync
SPORT0 Transmit Data Primary
SPORT0 Transmit Data Secondary
D
C
DR0PRI
DR0SEC
TSCLK0
TFS0
I
I/O
I/O
O
D
C
C
C
DT0PRI
DT0SEC
Serial Port1
RSCLK1
RFS1
O
I/O
I/O
I
SPORT1 Receive Serial Clock
SPORT1 Receive Frame Sync
SPORT1 Receive Data Primary
SPORT1 Receive Data Secondary
SPORT1 Transmit Serial Clock
SPORT1 Transmit Frame Sync
SPORT1 Transmit Data Primary
SPORT1 Transmit Data Secondary
D
C
DR1PRI
DR1SEC
TSCLK1
TFS1
I
I/O
I/O
O
D
C
C
C
DT1PRI
DT1SEC
SPI0 Port
MOSI0
MISO0
O
I/O
I/O
SPI0 Master Out Slave In
C
C
SPI0 Master In Slave Out (This pin should always be pulled high through
a 4.7 kΩ resistor if booting via the SPI port.)
SCK0
I/O
SPI0 Clock
D
UART0 Port
RX0
I
UART0 Receive
UART0 Transmit
TX0
O
C
C
PPI Port
PPI3–0
I/O
I
PPI3–0
PPI_CLK/TMRCLK
Port C: Controller Area Network/GPIO
CANTX/PC0
PPI Clock/External Timer Reference
I/O 5 V
I 5 V
CAN Transmit/GPIO
CAN Receive/GPIO
C
C
CANRX/PC1
PC[9-5]
PC[4]
I/O
I 5 V
GPIO
GPIO
Rev. 0
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ADSP-BF538/ADSP-BF538F
Table 10. Pin Descriptions (Continued)
Pin Name
I/O
Function
Driver Type1
Port D: SPI1/SPI2/UART1/UART2/GPIO
MOSI1/PD0
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
SPI1 Master Out Slave In/GPIO
SPI1 Master In Slave Out/GPIO
SPI1 Clock/GPIO
C
MISO1/PD1
C
SCK1/PD2
D
D
D
C
SPI1SS/PD3
SPI1 Slave Select Input/GPIO
SPI1 Slave Select Enable/GPIO
SPI2 Master Out Slave In/GPIO
SPI2 Master In Slave Out/GPIO
SPI2 Clock/GPIO
SPI1SEL1/PD4
MOSI2/PD5
MISO2/PD6
C
SCK2/PD7
D
D
D
D
D
D
D
SPI2SS/PD8
SPI2 Slave Select Input/GPIO
SPI2 Slave Select Enable/GPIO
UART1 Receive/GPIO
SPI2SEL1/PD9
RX1/PD10
TX1/PD11
UART1 Transmit/GPIO
RX2/PD12
UART2 Receive/GPIO
TX2/PD13
UART2 Transmit/GPIO
Port E: SPORT2/SPORT3/GPIO
RSCLK2/PE0
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
SPORT2 Receive Serial Clock/GPIO
SPORT2 Receive Frame Sync/GPIO
SPORT2 Receive Data Primary/GPIO
SPORT2 Receive Data Secondary/GPIO
SPORT2 Transmit Serial Clock/GPIO
SPORT2 Transmit Frame Sync/GPIO
SPORT2 Transmit Data Primary/GPIO
SPORT2 Transmit Data Secondary/GPIO
SPORT3 Receive Serial Clock/GPIO
SPORT3 Receive Frame Sync/GPIO
SPORT3 Receive Data Primary/GPIO
SPORT3 Receive Data Secondary/GPIO
SPORT3 Transmit Serial Clock/GPIO
SPORT3 Transmit Frame Sync/GPIO
SPORT3 Transmit Data Primary/GPIO
SPORT3 Transmit Data Secondary/GPIO
D
C
C
C
D
C
C
C
D
C
C
C
D
C
C
C
RFS2/PE1
DR2PRI/PE2
DR2SEC/PE3
TSCLK2/PE4
TFS2/PE5
DT2PRI /PE6
DT2SEC/PE7
RSCLK3/PE8
RFS3/PE9
DR3PRI/PE10
DR3SEC/PE11
TSCLK3/PE12
TFS3/PE13
DT3PRI /PE14
DT3SEC/PE15
Port F: GPIO/PPI/SPI0/Timers
PF0/SPI0SS
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GPIO/SPI0 Slave Select Input
C
PF1/SPI0SEL1/TACLK
PF2/SPI0SEL2
PF3/PPI_FS3/SPI0SEL3
PF4/PPI15/SPI0SEL4
PF5/PPI14/SPI0SEL5
PF6/PPI13/SPI0SEL6
PF7/PPI12/SPI0SEL7
GPIO/SPI0 Slave Select Enable 1/Timer Alternate Clock Input
GPIO/SPI0 Slave Select Enable 2
C
C
C
C
C
C
C
GPIO/PPI Frame Sync 3/SPI0 Slave Select Enable 3
GPIO/PPI15/SPI0 Slave Select Enable 4
GPIO/PPI14/SPI0 Slave Select Enable 5
GPIO/PPI13/SPI0 Slave Select Enable 6
GPIO/PPI12/SPI0 Slave Select Enable 7
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Page 21 of 56
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May 2007
ADSP-BF538/ADSP-BF538F
Table 10. Pin Descriptions (Continued)
Pin Name
PF8/PPI11
PF9/PPI10
PF10/PPI9
PF11/PPI8
PF12/PPI7
PF13/PPI6
PF14/PPI5
PF15/PPI4
Real Time Clock
RTXI
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Function
GPIO/PPI11
GPIO/PPI10
GPIO/PPI9
GPIO/PPI8
GPIO/PPI7
GPIO/PPI6
GPIO/PPI5
GPIO/PPI4
Driver Type1
C
C
C
C
C
C
C
C
I
RTC Crystal Input (This pin should be pulled low when not used.)
RTC Crystal Output
RTXO
O
JTAG Port
TCK
I
JTAG Clock
TDO
O
I
JTAG Serial Data Out
C
C
TDI
JTAG Serial Data In
TMS
I
JTAG Mode Select
TRST
I
JTAG Reset (This pin should be pulled low if the JTAG port will not be used.)
Emulation Output
EMU
O
Clock
CLKIN
I
Clock/Crystal Input
Crystal Output
XTAL
O
Mode Controls
RESET
I
I
I
Reset
NMI
Nonmaskable Interrupt (This pin should be pulled high when not used.)
Boot Mode Strap
BMODE1–0
Voltage Regulator
VROUT0
O
External FET Drive 0 (This pin should be left unconnected when not
used.)
VROUT1
GPW
O
External FET Drive 1 (This pin should be left unconnected when not used.)
I 5 V
General-Purpose Regulator Wakeup (This pin should be pulled high when
not used.)
Supplies
VDDEXT
VDDINT
VDDRTC
GND
P
P
P
G
I/O Power Supply
Internal Power Supply
Real Time Clock Power Supply
Ground
1 Refer to Figure 29 on Page 46 to Figure 39 on Page 48.
Rev. 0
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Page 22 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
SPECIFICATIONS
Note that component specifications are subject to change
without notice.
OPERATING CONDITIONS
Parameter
Conditions
Min
Nominal Max
Unit
VDDINT Internal Supply Voltage
VDDINT Internal Supply Voltage
533 MHz Speed Grade Models1,2
400 MHz Speed Grade Models1,2
0.8
0.8
1.25
1.2
1.375
1.32
V
V
VDDEXT External Supply Voltage
VDDEXT External Supply Voltage
Model with on-chip flash2
Models without on-chip flash2
2.7
3.3
3.0
3.6
3.6
3.6
V
V
V
2.25
2.25
VDDRTC Real Time Clock Power Supply
Voltage
VIH
High Level Input Voltage3
High Level Input Voltage4
@ VDDEXT=Maximum
@ VDDEXT=Maximum
@ VDDEXT=Maximum
@ VDDEXT=Minimum
@ VDDEXT=Minimum
2.0
3.6
V
VIH5V
2.0
5.5
V
VIHCLKIN High Level Input Voltage5
2.2
3.6
V
VIL
Low Level Input Voltage3,6
Low Level Input Voltage 4
Junction Temperature
–0.3
–0.3
–40
+0.6
+0.8
+105
V
VIL5V
TJ
V
316-Ball Chip Scale Ball Grid Array (Mini-BGA)
@ TAMBIENT = –40°C to +85°C
°C
1 The regulator can generate VDDINT at levels of 0.85 V to 1.2 V with –5% to +10% tolerance and 1.25 V with –4% to +10% tolerance
2 See Ordering Guide on Page 56.
3 The 3.3 V tolerant pins are capable of accepting up to 3.6 V maximum VIH The following bi-directional pins are 3.3 V tolerant: DATA15–0, SCK2-0, MISO2-0, MOSI2-0,
PF15–0, PPI3–0, SPI1SS, SPI1SEL1, PC[9-5], SPI2SS, SPI2SEL1, RX2-1, TX2-1, TSCLK3-0, RSCLK3-0, TFS3-0, RFS3-0, DT2PRI, DT2SEC, DR2PRI, DR2SEC, DT3PRI,
DT3SEC, DR3PRI, DR3SEC, and TMR2–0. The following input-only pins are 3.3 V tolerant: RESET, RX0, TCK, TDI, TMS, TRST, ARDY, BMODE1–0, BR, DR0PRI,
DR0SEC, DR1PRI, DR1SEC, NMI, PPI_CLK, and RTXI.
4 The 5.V tolerant pins are capable of accepting up to 5.5 V maximum VIH. The following bi-directional pins are 5 V tolerant: SCL0, SCL1, SDA0, SDA1, and CANTX. The
following input-only pins are 5 V tolerant: CANRX, PC4 and GPW.
5 Parameter value applies to the CLKIN input pin.
6 Parameter value applies to all input and bi-directional pins.
Rev. 0
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Page 23 of 56
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May 2007
ADSP-BF538/ADSP-BF538F
ELECTRICAL CHARACTERISTICS
Parameter1
Test Conditions
Min
Typical
Max
Unit
V
VOH
High Level Output Voltage2
Low Level Output Voltage2
High Level Input Current3
High Level Input Current JTAG4
Low Level Input Current3
Three-State Leakage Current5
Three-State Leakage Current5
Input Capacitance6, 7
@ VDDEXT = +3.0 V, IOH = –0.5 mA
2.4
VOL
@ VDDEXT = 3.0 V, IOL = 2.0 mA
0.4
V
IIH
@ VDDEXT = Maximum, VIN = VDD Maximum
@ VDDEXT = Maximum, VIN = VDD Maximum
@ VDDEXT = Maximum, VIN = 0 V
10.0
50.0
10.0
10.0
10.0
8
μA
μA
μA
μA
μA
pF
IIHP
IIL
IOZH
@ VDDEXT = Maximum, VIN = VDD Maximum
@ VDDEXT = Maximum, VIN = 0 V
IOZL
CIN
fCCLK = 1 MHz, TAMBIENT = 25°C, VIN = 2.5 V
VDDEXT = 3.6 V with Voltage Regulator Off (VDDINT = 0 V)
4
IDDHIBERNATE
IDDDEEPSLEEP
IDDSLEEP
VDDINT Current in Hibernate State
50
33
37
47
202
260
20
μA
mA
mA
mA
mA
mA
μA
8
VDDINT Current in Deep Sleep Mode VDDINT = 0.80 V, TJUNCTION = 25°C
VDDINT Current in Sleep Mode
VDDINT = 0.80 V, TJUNCTION = 25°C @ fSCLK = 50 MHz
8, 9
IDD_TYP
VDDINT Current Dissipation (Typical) VDDINT = 0.80 V, fCCLK = 50 MHz, TJUNCTION = 25°C
VDDINT Current Dissipation (Typical) VDDINT = 1.14 V, fCCLK = 400 MHz, TJUNCTION = 25°C
VDDINT Current Dissipation (Typical) VDDINT = 1.2 V, fCCLK = 533 MHz, TJUNCTION = 25°C
8, 9
IDD_TYP
8, 9
IDD_TYP
IDDRTC
VDDRTC Current
VDDRTC = 3.3 V, TJUNCTION = 25°C
1 Specifications subject to change without notice.
2 Applies to output and bi-directional pins.
3 Applies to input pins except JTAG inputs.
4 Applies to JTAG input pins (TCK, TDI, TMS, TRST).
5 Applies to three-statable pins.
6 Applies to all signal pins.
7 Guaranteed, but not tested.
8 See Power Dissipation on Page 48.
9 Processor executing 75% dual MAC, 25% ADD with moderate data bus activity.
Rev. 0
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Page 24 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
ABSOLUTE MAXIMUM RATINGS
PACKAGE INFORMATION
Stresses greater than those listed below may cause permanent
damage to the device. These are stress ratings only. Functional
operation of the device at these or any other conditions greater
than those indicated in the operational sections of this specifica-
tion is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
The information presented in Figure 9 and Table 12 provides
information about how to read the package brand and relate it
to specific product features. For a complete listing of product
offerings, see the Ordering Guide on Page 56.
a
ADSP-BF538
Parameter
Rating
Internal (Core) Supply Voltage (VDDINT
)
–0.3 V to +1.4 V
–0.3 V to +3.8 V
–0.5 V to +3.6 V
–0.5 V to +5.5 V
–0.5 V to VDDEXT +0.5 V
200 pF
tppZccc
vvvvvv.x n.n
External (I/O) Supply Voltage (VDDEXT
)
Input Voltage
Input Voltage1
yyww country_of_origin
B
Output Voltage Swing
Load Capacitance
Figure 9. Product Information on Package
Storage Temperature Range
–65°C to +150°C
+125°C
Junction Temperature Under bias
Table 12. Package Brand Information
1 The 5.V tolerant pins are capable of accepting up to 5.5 V maximum VIH. The
following bi-directional pins are 5 V tolerant: SCL0, SCL1, SDA0, SDA1, and
CANTX. The following input-only pins are 5 V tolerant: CANRX, PC4, and
GPW. For other duty cycles, see Table 11.
Brand Key
Field Description
Temperature Range
Package Type
t
pp
Table 11. Maximum Duty Cycle for Input Transient Voltage1
Z
RoHS Compliant Part
See Ordering Guide
Assembly Lot Code
Silicon Revision
ccc
VIN Min (V)
–0.50
VIN Max (V)2
+3.80
Maximum Duty Cycle
vvvvvv.x
n.n
100%
40%
25%
15%
10%
–0.70
+4.00
yyww
Date Code
–0.80
+4.10
–0.90
+4.20
–1.00
+4.30
1 Applies to all signal pins with the exception of CLKIN, XTAL, and VROUT1–0.
2 Only one of the listed options can apply to a particular design.
ESD SENSITIVITY
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can discharge
without detection. Although this product features
patented or proprietary circuitry, damage may occur
on devices subjected to high energy ESD. Therefore,
proper ESD precautions should be take to avoid
performance degradation or loss of functionality.
Rev. 0
|
Page 25 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
TIMING SPECIFICATIONS
Table 13 and Table 14 describe the timing requirements for the
ADSP-BF538/ADSP-BF538F processor clocks. Take care in
selecting MSEL, SSEL, and CSEL ratios so as not to exceed the
maximum core clock, system clock, and voltage controlled
oscillator (VCO) operating frequencies, as described in Abso-
lute Maximum Ratings on Page 25. Table 15 describes phase-
locked loop operating conditions. Table 16 lists System Clock
Requirements.
Table 13. Core Clock (CCLK) Requirements - 400 MHz Models
Internal Regulator
Parameter
Setting
1.20 V
1.10 V
1.00 V
0.90 V
0.85 V
Max
400
364
333
280
250
Unit
MHz
MHz
MHz
MHz
MHz
fCCLK CLK Frequency (VDDINT=1.14 V Minimum)
fCCLK CLK Frequency (VDDINT=1.045 V Minimum)
fCCLK CLK Frequency (VDDINT=0.95 V Minimum)
fCCLK CLK Frequency (VDDINT=0.85 V Minimum)
fCCLK CLK Frequency (VDDINT=0.8 V Minimum)
Table 14. Core Clock (CCLK) Requirements - 533 MHz Models
Internal Regulator
Setting
Parameter
Max
533
500
444
400
333
250
Unit
MHz
MHz
MHz
MHz
MHz
MHz
fCCLK Core Clock Frequency (VDDINT=1.2 V Minimum)
fCCLK Core Clock Frequency (VDDINT=1.14 V Minimum)
fCCLK Core Clock Frequency (VDDINT=1.045 V Minimum)
fCCLK Core Clock Frequency (VDDINT=0.95 V Minimum)
fCCLK Core Clock Frequency (VDDINT=0.85 V Minimum)
fCCLK Core Clock Frequency (VDDINT=0.8 V Minimum)
1.25 V
1.20 V
1.10 V
1.00 V
0.95 V
0.85 V
Table 15. Phase-Locked Loop Operating Conditions
Parameter
Minimum
Maximum
Unit
fVCO
Voltage Controlled Oscillator (VCO) Frequency
50
Max fCCLK
MHz
Table 16. System Clock (SCLK) Requirements
Parameter1
Max
133
100
Unit
MHz
MHz
fSCLK
CLKOUT/SCLK Frequency (VDDINT≥ 1.14 V)
CLKOUT/SCLK Frequency (VDDINT< 1.14 V)
fSCLK
1 tSCLK (= 1/fSCLK) must be greater than or equal to tCCLK
.
Rev. 0
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Page 26 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
Clock and Reset Timing
Table 17 and Figure 10 describe clock and reset operations. Per
Absolute Maximum Ratings on Page 25, combinations of
CLKIN and clock multipliers must not select core/peripheral
clocks that exceed maximum operating conditions.
Table 17. Clock and Reset Timing
Parameter
Min
Max
Unit
Timing Requirements
tCKIN
CLKIN Period1, 2, 3
20.0
8.0
100.0
ns
ns
ns
ns
tCKINL
tCKINH
tWRST
CLKIN Low Pulse
CLKIN High Pulse
RESET Asserted Pulse Width Low4
8.0
11 tCKIN
1 Applies to PLL bypass mode and PLL non-bypass mode.
2 If the DF bit in the PLL_CTL register is set, then the maximum tCKIN period is 50 ns.
3 CLKIN frequency must not change on the fly.
4 Applies after power-up sequence is complete. At power-up, the processor’s internal phase-locked loop requires no more than 2000 CLKIN cycles, while RESET is asserted,
assuming stable power supplies and CLKIN (not including startup time of external clock oscillator).
tCKIN
CLKIN
tCKINL
tCKINH
tWRST
RESET
Figure 10. Clock and Reset Timing
Rev. 0
|
Page 27 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
Asynchronous Memory Read Cycle Timing
Table 18 and Table 19 on Page 29 and Figure 11 and Figure 12
on Page 29 describe asynchronous memory read cycle opera-
tions for synchronous and for asynchronous ARDY.
Table 18. Asynchronous Memory Read Cycle Timing with Synchronous ARDY
Parameter
Min
Max
Unit
Timing Requirements
tSDAT
tHDAT
tSARDY
tHARDY
tDO
DATA15–0 Setup Before CLKOUT
DATA15–0 Hold After CLKOUT
2.1
0.8
4.0
0.0
ns
ns
ns
ns
ns
ns
ARDY Setup Before the Falling Edge of CLKOUT
ARDY Hold After the Falling Edge of CLKOUT
Output Delay After CLKOUT1
6.0
tHO
Output Hold After CLKOUT1
0.8
1 Output pins include AMS3–0, ABE1–0, ADDR19–1, AOE, ARE.
HOLD
1 CYCLE
SETUP
2 CYCLES
PROGRAMMED READ ACCESS
4 CYCLES
ACCESS EXTENDED
3 CYCLES
CLKOUT
tDO
tHO
AMSx
ABE1–0
BE, ADDRESS
ADDR19–1
AOE
tDO
tHO
ARE
tHARDY
tSARDY
tHARDY
ARDY
tSARDY
tSDAT
tHDAT
DATA15–0
READ
Figure 11. Asynchronous Memory Read Cycle Timing with Synchronous ARDY
Rev. 0
|
Page 28 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
Table 19. Asynchronous Memory Read Cycle Timing with Asynchronous ARDY
Parameter
Min
Max
Unit
Timing Requirements
tSDAT
tHDAT
tDANR
DATA15–0 Setup Before CLKOUT
DATA15–0 Hold After CLKOUT
ARDY Negated Delay from AMSx Asserted1
2.1
0.8
ns
ns
ns
(S + RA – 2) × tSCLK
tHAA
tDO
tHO
ARDY Asserted Hold After ARE Negated
Output Delay After CLKOUT2
Output Hold After CLKOUT2
0.0
0.8
ns
ns
ns
6.0
1 S = number of programmed setup cycles, RA = number of programmed read access cycles.
2 Output pins include AMS3–0, ABE1–0, ADDR19–1, AOE, ARE.
HOLD
1 CYCLE
SETUP
2 CYCLES
PROGRAMMED READ ACCESS
4 CYCLES
ACCESS EXTENDED
CLKOUT
tDO
tHO
AMSx
ABE1–0
BE, ADDRESS
ADDR19–1
AOE
tDO
tHO
ARE
tHAA
tDANR
ARDY
tSDAT
tHDAT
DATA15–0
READ
Figure 12. Asynchronous Memory Read Cycle Timing with Asynchronous ARDY
Rev. 0
|
Page 29 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
Asynchronous Memory Write Cycle Timing
Table 20 and Table 21 on Page 31 and Figure 13 and Figure 14
on Page 31 describe asynchronous memory write cycle opera-
tions for synchronous and for asynchronous ARDY.
Table 20. Asynchronous Memory Write Cycle Timing with Synchronous ARDY
Parameter
Min
Max
Unit
Timing Requirements
tSARDY
tHARDY
ARDY Setup Before the Falling Edge of CLKOUT
ARDY Hold After the Falling Edge of CLKOUT
4.0
0.0
ns
ns
Switching Characteristics
tDDAT
tENDAT
tDO
DATA15–0 Disable After CLKOUT
6.0
6.0
ns
ns
ns
ns
DATA15–0 Enable After CLKOUT
Output Delay After CLKOUT1
Output Hold After CLKOUT1
1.0
0.8
tHO
1 Output pins include AMS3–0, ABE1–0, ADDR19–1, DATA15–0, AOE, AWE.
ACCESS
EXTENDED
1 CYCLE
SETUP
2 CYCLES
HOLD
1 CYCLE
PROGRAMMED WRITE
ACCESS 2 CYCLES
CLKOUT
AMSx
tDO
tHO
ABE1–0
BE, ADDRESS
ADDR19–1
tDO
tHO
AWE
tSARDY
ARDY
tSARDY
tHARDY
tHARDY
tDDAT
tENDAT
DATA15–0
WRITE DATA
Figure 13. Asynchronous Memory Write Cycle Timing with Synchronous ARDY
Rev. 0
|
Page 30 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
Table 21. Asynchronous Memory Write Cycle Timing with Asynchronous ARDY
Parameter
Min
Max
Unit
Timing Requirements
(S + WA – 2) × tSCLK
tDANR
tHAA
ARDY Negated Delay from AMSx Asserted1
ns
ns
ARDY Asserted Hold After ARE Negated
0.0
Switching Characteristics
tDDAT
tENDAT
tDO
DATA15–0 Disable After CLKOUT
6.0
6.0
ns
ns
ns
ns
DATA15–0 Enable After CLKOUT
Output Delay After CLKOUT2
Output Hold After CLKOUT2
1.0
0.8
tHO
1 S = number of programmed setup cycles, WA = number of programmed write access cycles.
2 Output pins include AMS3–0, ABE1–0, ADDR19–1, DATA15–0, AOE, AWE.
ACCESS
EXTENDED
SETUP
2 CYCLES
HOLD
1 CYCLE
PROGRAMMED WRITE
ACCESS 2 CYCLES
CLKOUT
AMSx
tDO
tHO
ABE1–0
BE, ADDRESS
ADDR19–1
tDO
tHO
AWE
tDANW
tHAA
ARDY
tDDAT
tENDAT
DATA15–0
WRITE DATA
Figure 14. Asynchronous Memory Write Cycle Timing with Asynchronous ARDY
Rev. 0
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Page 31 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
SDRAM Interface Timing
Table 22. SDRAM Interface Timing
Parameter
Min
Max
Unit
Timing Requirements
tSSDAT
tHSDAT
DATA Setup Before CLKOUT
DATA Hold After CLKOUT
2.1
0.8
ns
ns
Switching Characteristics
tSCLK
CLKOUT Period
7.5
2.5
2.5
ns
ns
ns
ns
ns
ns
ns
tSCLKH
tSCLKL
tDCAD
tHCAD
tDSDAT
tENSDAT
CLKOUT Width High
CLKOUT Width Low
Command, ADDR, Data Delay After CLKOUT1
Command, ADDR, Data Hold After CLKOUT1
Data Disable After CLKOUT
Data Enable After CLKOUT
6.0
6.0
0.8
1.0
1 Command pins include: SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.
tSCLK
tSCLKH
CLKOUT
tSSDAT
tSCLKL
tHSDAT
DATA (IN)
tDCAD
tDSDAT
tENSDAT
tHCAD
DATA(OUT)
tDCAD
CMND ADDR
(OUT)
tHCAD
NOTE: COMMAND = SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.
Figure 15. SDRAM Interface Timing
Rev. 0
|
Page 32 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
External Port Bus Request and Grant Cycle Timing
Table 23 and Table 24 on Page 34 and Figure 16 and Figure 17
on Page 34 describe external port bus request and grant cycle
operations for synchronous and for asynchronous BR.
Table 23. External Port Bus Request and Grant Cycle Timing with Synchronous BR
Parameter
Min
Max
Unit
Timing Requirements
tBS
tBH
BR Setup to Falling Edge of CLKOUT
4.0
0.0
ns
ns
Falling Edge of CLKOUT to BR Deasserted Hold Time
Switching Characteristics
tSD
CLKOUT Low to AMSx, Address, and ARE/AWE Disable
4.5
4.5
3.6
3.6
3.6
3.6
ns
ns
ns
ns
ns
ns
tSE
CLKOUT Low to AMSx, Address, and ARE/AWE Enable
CLKOUT High to BG High Setup
tDBG
tEBG
tDBH
tEBH
CLKOUT High to BG Deasserted Hold Time
CLKOUT High to BGH High Setup
CLKOUT High to BGH Deasserted Hold Time
CLKOUT
tBH
tBS
BR
tSD
tSE
AMSx
tSD
tSE
ADDR19-1
ABE1-0
tSD
tSE
AWE
ARE
tDBG
tEBG
BG
tDBH
tEBH
BGH
Figure 16. External Port Bus Request and Grant Cycle Timing with Synchronous BR
Rev. 0
|
Page 33 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
Table 24. External Port Bus Request and Grant Cycle Timing with Asynchronous BR
Parameter
Min
Max
Unit
Timing Requirement
tWBR
BR Pulse Width
2 ϫ tSCLK
ns
Switching Characteristics
tSD
CLKOUT Low to AMSx, Address, and ARE/AWE Disable
4.5
4.5
3.6
3.6
3.6
3.6
ns
ns
ns
ns
ns
ns
tSE
CLKOUT Low to AMSx, Address, and ARE/AWE Enable
CLKOUT High to BG High Setup
tDBG
tEBG
tDBH
tEBH
CLKOUT High to BG Deasserted Hold Time
CLKOUT High to BGH High Setup
CLKOUT High to BGH Deasserted Hold Time
CLKOUT
tWBR
BR
tSD
tSE
AMSx
tSD
tSE
ADDR19-1
ABE1-0
tSD
tSE
AWE
ARE
tDBG
tEBG
BG
tDBH
tEBH
BGH
Figure 17. External Port Bus Request and Grant Cycle Timing with Asynchronous BR
Rev. 0
|
Page 34 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
Parallel Peripheral Interface Timing
Table 25 and Figure 18, Figure 19, Figure 20, and Figure 21
describe Parallel Peripheral Interface operations.
Table 25. Parallel Peripheral Interface Timing
Parameter
Min
Max
Unit
Timing Requirements
tPCLKW
tPCLK
PPI_CLK Width
PPI_CLK Period1
6.0
15.0
5.0
1.0
2.0
4.0
ns
ns
ns
ns
ns
ns
tSFSPE
tHRSPE
tSDRPE
tHDRPE
External Frame Sync Setup Before PPI_CLK
External Frame Sync Hold After PPI_CLK
Receive Data Setup Before PPI_CLK
Receive Data Hold After PPI_CLK
Switching Characteristics—GP Output and Frame Capture Modes
tDFSPE
tHOFSPE
tDDTPE
tHDTPE
Internal Frame Sync Delay After PPI_CLK
Internal Frame Sync Hold After PPI_CLK
Transmit Data Delay After PPI_CLK
Transmit Data Hold After PPI_CLK
10.0
10.0
ns
ns
ns
ns
0.0
0.0
1 PPI_CLK frequency cannot exceed fSCLK/2
FRAME
SYNC IS
DRIVEN
OUT
DATA0
IS
SAMPLED
POLC = 0
PPI_CLK
PPI_CLK
POLC = 1
t
DFSPE
t
HOFSPE
POLS = 1
PPI_FS1
POLS = 0
POLS = 1
PPI_FS2
POLS = 0
t
t
SDRPE
HDRPE
PPI_DATA
Figure 18. PPI GP Rx Mode with Internal Frame Sync Timing
Rev. 0
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May 2007
ADSP-BF538/ADSP-BF538F
FRAME
SYNC IS
SAMPLED
FOR
DATA0 IS
DATA1 IS
SAMPLED
DATA0
SAMPLED
PPI_CLK
POLC = 0
PPI_CLK
POLC = 1
t
HFSPE
t
SFSPE
POLS = 1
PPI_FS1
POLS = 0
POLS = 1
PPI_FS2
POLS = 0
t
t
SDRPE
HDRPE
PPI_DATA
Figure 19. PPI GP Rx Mode with External Frame Sync Timing
FRAME
SYNC IS
SAMPLED
DATA0 IS
DRIVEN
OUT
PPI_CLK
POLC = 0
PPI_CLK
POLC = 1
t
HFSPE
t
SFSPE
POLS = 1
POLS = 0
PPI_FS1
POLS = 1
POLS = 0
PPI_FS2
t
HDTPE
PPI_DATA
DATA0
t
DDTPE
Figure 20. PPI GP Tx Mode with External Frame Sync Timing
Rev. 0
|
Page 36 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
FRAME
SYNC IS
DATA0 IS
DRIVEN
OUT
REFERENCED
TO THIS CLOCK
EDGE
PPI_CLK
POLC = 0
PPI_CLK
POLC = 1
t
DFSPE
t
HOFSPE
POLS = 1
POLS = 0
PPI_FS1
PPI_FS2
POLS = 1
POLS = 0
t
DDTPE
t
HDTPE
PPI_DATA
DATA0
Figure 21. PPI GP Tx Mode with Internal Frame Sync Timing
Rev. 0
|
Page 37 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
Serial Port Timing
Table 26 through Table 29 on Page 39 and Figure 22 on Page 39
through Figure 23 on Page 40 describe Serial Port operations.
Table 26. Serial Ports—External Clock
Parameter
Min
Max
Unit
Timing Requirements
tSFSE
TFSx/RFSx Setup Before TSCLKx/RSCLKx (Externally Generated TFSx/RFSx)1
3.0
3.0
3.0
3.0
4.5
15.0
ns
ns
ns
ns
ns
ns
tHRSE
tSDRE
tHDRE
tSCLEW
tSCLKE
TFSx/RFSx Hold After TSCLKx/RSCLKx (Externally Generated TFSx/RFSx)1
Receive Data Setup Before RSCLKx1
Receive Data Hold After RSCLKx1
TSCLKx/RSCLKx Width
TSCLKx/RSCLKx Period
Switching Characteristics
tDFSE
tHOFSE
tDDTE
tHDTE
TFSx/RFSx Delay After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)2
TFSx/RFSx Hold After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)2
Transmit Data Delay After TSCLKx2
10.0
10.0
ns
ns
ns
ns
0.0
0.0
Transmit Data Hold After TSCLKx2
1 Referenced to sample edge.
2 Referenced to drive edge.
Table 27. Serial Ports—Internal Clock
Parameter
Min
Max
Unit
Timing Requirements
tSFSI
TFSx/RFSx Setup Before TSCLKx/RSCLKx (Externally Generated TFSx/RFSx)1
8.0
ns
ns
ns
ns
ns
ns
tHFSI
TFSx/RFSx Hold After TSCLKx/RSCLKx (Externally Generated TFSx/RFSx)1
Receive Data Setup Before RSCLKx1
Receive Data Hold After RSCLKx1
–1.5
8.0
tSDRI
tHDRI
tSCLKEW
tSCLKE
–1.5
4.5
TSCLKx/RSCLKx Width
TSCLKx/RSCLKx Period
15.0
Switching Characteristics
tDFSI
TFSx/RFSx Delay After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)2
TFSx/RFSx Hold After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)2
Transmit Data Delay After TSCLKx2
3.0
3.0
ns
ns
ns
ns
ns
tHOFSI
tDDTI
–1.0
tHDTI
Transmit Data Hold After TSCLKx2
–2.0
4.5
tSCLKIW
TSCLKx/RSCLKx Width
1 Referenced to sample edge.
2 Referenced to drive edge.
Table 28. Serial Ports—Enable and Three-State
Parameter
Min
0
Max
Unit
Switching Characteristics
tDTENE
tDDTTE
tDTENI
tDDTTI
Data Enable Delay from External TSCLKx1
Data Disable Delay from External TSCLKx1
Data Enable Delay from Internal TSCLKx1
Data Disable Delay from Internal TSCLKx1
ns
ns
ns
ns
10.0
3.0
–2.0
1 Referenced to drive edge.
Rev. 0
|
Page 38 of 56
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May 2007
ADSP-BF538/ADSP-BF538F
Table 29. External Late Frame Sync
Parameter
Min
Max
Unit
Switching Characteristics
tDDTLFSE
tDTENLFS
Data Delay from Late External TFSx or External RFSx with MCE = 1, MFD = 01, 2
Data Enable from late FS or MCE = 1, MFD = 01, 2
10.0
ns
ns
0
1 MCE = 1, TFSx enable and TFSx valid follow tDTENLFS and tDDTLFSE
2 If external RFSx/TFSx setup to RSCLKx/TSCLKx > tSCLKE/2, then tDDTTE/I and tDTENE/I apply; otherwise tDDTLFSE and tDTENLFS apply.
.
DATA RECEIVE—INTERNAL CLOCK
DATA RECEIVE—EXTERNAL CLOCK
DRIVE
EDGE
SAMPLE
EDGE
DRIVE
EDGE
SAMPLE
EDGE
tSCLKIW
tSCLKEW
RSCLKx
RSCLKx
tDFSI
tDFSE
tHOFSI
tSFSI
tHFSI
tHOFSE
tSFSE
tHFSE
RFSx
DRx
RFSx
DRx
tSDRI
tHDRI
tSDRE
tHDRE
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RSCLKx OR TSCLKx CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DATA TRANSMIT—INTERNAL CLOCK
DATA TRANSMIT—EXTERNAL CLOCK
DRIVE
EDGE
SAMPLE
EDGE
DRIVE
EDGE
SAMPLE
EDGE
tSCLKIW
tSCLKEW
TSCLKx
TFSx
TSCLKx
TFSx
tDFSI
tDFSE
tHOFSI
tSFSI
tHFSI
tHOFSE
tSFSE
tHFSE
tDDTI
tDDTE
tHDTI
tHDTE
DTx
DTx
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RSCLKx OR TSCLKx CAN BE USED AS THE ACTIVE SAMPLING EDGE.
Figure 22. Serial Ports
Rev. 0
|
Page 39 of 56
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May 2007
ADSP-BF538/ADSP-BF538F
EXTERNAL RFSx WITH MCE = 1, MFD = 0
DRIVE SAMPLE
DRIVE
RSCLKx
tSFSE/I
tHOFSE/I
RFSx
tDDTTE/I
tDTENE/I
tDTENLFS
1ST BIT
2ND BIT
DTx
tDDTLFSE
LATE EXTERNAL TFSx
DRIVE
SAMPLE
DRIVE
TSCLKx
TFSx
tHOFSE/I
tSFSE/I
tDDTTE/I
tDTENE/I
tDTENLFS
DTx
1ST BIT
2ND BIT
tDDTLFSE
Figure 23. External Late Frame Sync
Rev. 0
|
Page 40 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
Serial Peripheral Interface Ports—Master Timing
Table 30 and Figure 24 describe SPI ports master operations.
Table 30. Serial Peripheral Interface (SPI) Ports—Master Timing
Parameter
Min
Max
Unit
Timing Requirements
tSSPIDM
tHSPIDM
Switching Characteristics
tSD SPIxSELy Low to First SCK Edge
Data Input Valid to SCKx Edge (Data Input Setup)
7.5
ns
ns
SCKx Sampling Edge to Data Input Invalid
–1.5
2tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
4tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
0
ns
ns
ns
ns
ns
ns
ns
ns
SCSCIM
tSPICHM
tSPICLM
tSPICLK
Serial Clock High Period
Serial Clock Low Period
Serial Clock Period
tHDSM
Last SCKx Edge to SPIxSELy High
Sequential Transfer Delay
tSPITDM
tDDSPIDM
tHDSPIDM
SCKx Edge to Data Out Valid (Data Out Delay)
SCKx Edge to Data Out Invalid (Data Out Hold)
6
–1.0
+4.0
SPIxSELy
(OUTPUT)
tSPICLK
tHDSM
tSPITDM
tSDSCIM
tSPICHM
tSPICLM
SCKx
(CPOL = 0)
(OUTPUT)
tSPICLM
tSPICHM
SCKx
(CPOL = 1)
(OUTPUT)
tDDSPIDM
tHDSPIDM
MOSIx
(OUTPUT)
MSB
LSB
CPHA = 1
tSSPIDM
tHSPIDM
tSSPIDM
tHSPIDM
MISOx
(INPUT)
MSB VALID
LSB VALID
tDDSPIDM
tHDSPIDM
MOSIx
(OUTPUT)
MSB
LSB
CPHA = 0
tSSPIDM
tHSPIDM
MISOx
(INPUT)
MSB VALID
LSB VALID
Figure 24. Serial Peripheral Interface (SPI) Ports—Master Timing
Rev. 0
|
Page 41 of 56
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May 2007
ADSP-BF538/ADSP-BF538F
Serial Peripheral Interface Ports—Slave Timing
Table 31 and Figure 25 describe SPI port’s slave operations.
Table 31. Serial Peripheral Interface (SPI) Ports—Slave Timing
Parameter
Min
Max
Unit
Timing Requirements
tSPICHS
tSPICLS
tSPICLK
tHDS
Serial Clock High Period
2tSCLK –1.5
2tSCLK –1.5
4tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
1.6
ns
ns
ns
ns
ns
ns
ns
ns
Serial Clock Low Period
Serial Clock Period
Last SCKx Edge to SPIxSS Not Asserted
Sequential Transfer Delay
tSPITDS
tSDSCI
tSSPID
tHSPID
SPIxSS Assertion to First SCKx Edge
Data Input Valid to SCKx Edge (Data Input Setup)
SCKx Sampling Edge to Data Input Invalid
1.6
Switching Characteristics
tDSOE
SPIxSS Assertion to Data Out Active
0
0
0
0
8
ns
ns
ns
ns
tDSDHI
tDDSPID
tHDSPID
SPIxSS Deassertion to Data High impedance
SCKx Edge to Data Out Valid (Data Out Delay)
SCKx Edge to Data Out Invalid (Data Out Hold)
8
10
10
SPIxSS
(INPUT)
tSPICHS
tSPICLS
tSPICLK
tHDS
tSPITDS
SCKx
(CPOL = 0)
(INPUT)
tSDSCI
tSPICLS
tSPICHS
SCKx
(CPOL = 1)
(INPUT)
tDSOE
tDDSPID
tHDSPID
MSB
tDDSPID
tDSDHI
LSB
MISOx
(OUTPUT)
tHSPID
tSSPID
CPHA = 1
tSSPID
tHSPID
MOSIx
(INPUT)
MSB VALID
LSB VALID
tDSOE
tDDSPID
tDSDHI
MISOx
(OUTPUT)
MSB
LSB
tHSPID
CPHA = 0
tSSPID
MOSIx
(INPUT)
MSB VALID
LSB VALID
Figure 25. Serial Peripheral Interface (SPI) Ports—Slave Timing
Rev. 0
|
Page 42 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
General-Purpose Port Timing
Table 32 and Figure 26 describe general-purpose operations.
Table 32. General-Purpose Port Timing
Parameter
Min
tSCLK + 1
0
Max
Unit
ns
Timing Requirement
tWFI
Switching Characteristic
tGPOD GP Port Pin Output Delay From CLKOUT Low
GP Port Pin Input Pulse Width
6
ns
CLKOUT
tGPOD
GPP OUTPUT
tWFI
GPP INPUT
Figure 26. General-Purpose Port Cycle Timing
Rev. 0
|
Page 43 of 56
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May 2007
ADSP-BF538/ADSP-BF538F
Timer Cycle Timing
Table 33 and Figure 27 describe timer expired operations. The
input signal is asynchronous in “width capture mode” and
“external clock mode” and has an absolute maximum input fre-
quency of fSCLK/2 MHz.
Table 33. Timer Cycle Timing
Parameter
Min
Max
Unit
Timing Characteristics
tWL
tWH
Timer Pulse Width Input Low1 (Measured in SCLK Cycles)
Timer Pulse Width Input High1 (Measured in SCLK Cycles)
1
1
SCLK
SCLK
Switching Characteristic
tHTO Timer Pulse Width Output (measured in SCLK Cycles)
1
(232 – 1)
SCLK
1 The minimum pulse widths apply for TMRx input pins in width capture and external clock modes. They also apply to the PF1 (TACLK) or PPI_CLK (TMRCLK) input pins
in PWM output mode.
CLKOUT
tHTO
TMRx
(PWM OUTPUT MODE)
TMRx
tWL
tWH
(WIDTH CAPTURE AND
EXTERNAL CLOCK MODES)
Figure 27. Timer PWM_OUT Cycle Timing
Rev. 0
|
Page 44 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
JTAG Test And Emulation Port Timing
Table 34 and Figure 28 describe JTAG port operations.
Table 34. JTAG Port Timing
Parameter
Min
Max
Unit
Timing Requirements
tTCK
TCK Period
20
4
ns
tSTAP
tHTAP
tSSYS
tHSYS
tTRSTW
TDI, TMS Setup Before TCK High
TDI, TMS Hold After TCK High
System Inputs Setup Before TCK High1
System Inputs Hold After TCK High1
TRST Pulse Width2 (Measured in TCK Cycles)
ns
4
ns
4
ns
5
ns
4
TCK
Switching Characteristics
tDTDO TDO Delay from TCK Low
tDSYS
System Outputs Delay After TCK Low3
10
12
ns
ns
0
1 System Inputs=ARDY, BMODE1–0, BR, DATA15–0, DR0PRI, DR0SEC, NMI, PF15–0, PPI_CLK, PPI3–0, SCL1-0, SDA1-0, SCK2-0, MISO2-0, MOSI2-0, SPI1SS, SPI1SEL1,
SPI2SS, SPI2SEL1, RX2-0, TX2-1, DT2PRI, DT2SEC, DR2PRI, DR2SEC, DT3PRI, DT3SEC, TSCLK3-0, DR3PRI, DR3SEC, RSCLK3-0, RFS3-0, TFS3-0, CANTX, CANRX,
RESET, PC9-4, GPW, and TMR2–0.
2 50 MHz Maximum
3 System Outputs = AMS, AOE, ARE, AWE, ABE, BG, DATA15–0, PF15-0, PC9-5, PPI3-0, SPI1SS, SPI1SEL1, SCK2-0, MISO2-0, MOSI2-0, SPI2SS, SPI2SEL1, RX2-1, TX2-
0, DT2PRI, DT2SEC, DR2PRI, DR2SEC, DT3PRI, DT3SEC, DR3PRI, DR3SEC, RSCLK3-0, RFS3-0, TSCLK3-0, TFS3-0, CANTX, CLKOUT, SA10, SCAS, SCKE, SMS, SRAS,
SWE, and TMR2–0.
tTCK
TCK
tSTAP
tHTAP
TMS
TDI
tDTDO
TDO
tSSYS
tHSYS
SYSTEM
INPUTS
tDSYS
SYSTEM
OUTPUTS
Figure 28. JTAG Port Timing
Rev. 0
|
Page 45 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
OUTPUT DRIVE CURRENTS
150
100
50
VDD E XT = 2.25V
VDD E XT = 2.50V
VDD E XT = 2.75V
Figure 29 through Figure 36 on Page 47 shows typical current-
voltage characteristics for the output drivers of the ADSP-
BF538/ADSP-BF538F processors. The curves represent the cur-
rent drive capability of the output drivers as a function of output
voltage.
VOH
0
120
-
50
VDDEXT = 2.25V
DDEXT = 2.50V
VDDEXT = 2.75V
100
V
VOL
80
-
100
150
60
40
20
VOH
-
0
0.5
1.0
1.5
2.0
2.5
3.0
4.0
3.0
SOURCE VOLTAGE (V)
0
Figure 31. Drive Current B (Low VDDEXT
)
-20
-40
VOL
-
60
200
150
-80
VDDEXT = 3.0V
DDEXT = 3.3V
VDDEXT = 3.6V
-
100
V
3. 0
0
0.5
1.0
1.5
2.0
2.5
100
50
0
SOURCE VOLTAGE (V)
VO H
Figure 29. Drive Current A (Low VDDEXT
)
150
100
50
-50
VDD E XT = 3.0V
DD E XT = 3.3V
VDDEXT = 3.6V
-
-
-
100
150
200
V
VOL
VO H
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0
SOURCE VOLTAGE (V)
Figure 32. Drive Current B (High VDDEXT
)
-50
VOL
-
100
80
60
VDD E XT = 2.25V
VDD E XT = 2.50V
VDD E XT = 2.75V
-150
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
40
20
0
SOURCE VOLTAGE (V)
VOH
Figure 30. Drive Current A (High VDDEXT
)
-20
VOL
-40
-60
0
0.5
1.0
1.5
2.0
2.5
SOURCE VOLTAGE (V)
Figure 33. Drive Current C (Low VDDEXT
)
Rev. 0
|
Page 46 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
100
80
0
–10
–20
–30
–40
–50
–60
VDDEXT = 3.0V
VDDEX T = 2.25V
VDDEXT = 3.3V
VDDEXT = 3.6V
V
DDEX T = 2.50V
DDEX T = 2.75V
V
60
40
VOH
20
0
VOL
-
20
40
60
80
-
VO L
-
-
0
0.5
1.0
1.5
2.0
2.5
3.0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
SOURCE VOLTAGE (V)
SOURCE VOLTAGE (V)
Figure 34. Drive Current C (High VDDEXT
)
Figure 37. Drive Current E (Low VDDEXT
)
100
80
0
–10
–20
VDDEXT = 2.25V
VDDEXT = 2.50V
VDDEXT = 2.75V
VDDEXT =3.0V
VDDEXT =3.3V
VDDEXT =3.6V
60
40
–30
–40
VOH
20
0
VOL
–50
–60
–70
–80
-
20
40
60
80
-
VOL
-
-
0
0.5
1.0
1.5
2.0
2.5
3.0
4.0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
SOURCE VOLTAGE (V)
SOURCE VOLTAGE (V)
Figure 35. Drive Current D (Low VDDEXT
)
Figure 38. Drive Current E (High VDDEXT
)
150
100
VDDEXT = 3.0V
DDEXT = 3.3V
DDEXT = 3.6V
V
V
50
0
VOH
-50
VOL
-100
-150
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
SOURCE VOLTAGE (V)
Figure 36. Drive Current D (High VDDEXT
)
Rev. 0
|
Page 47 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
POWER DISSIPATION
tDECAY = (CLΔV) ⁄ IL
Many operating conditions can affect power dissipation. System
designers should refer to Estimating Power for ADSP-
BF538/ADSP-BF539 Blackfin Processors (EE-298) on the Analog
Devices website (www.analog.com)—use site search on
“EE-298.” This document provides detailed information for
optimizing your design for lowest power.
The time tDECAY is calculated with test loads CL and IL, and with
ΔV equal to 0.5 V for VDDEXT (nominal) = 3.0 V/3.3 V.
The time tDIS+_MEASURED is the interval from when the reference
signal switches, to when the output voltage decays ΔV from the
measured output high or output low voltage.
See the ADSP-BF538/ADSP-BF538F Blackfin Processor Hard-
ware Reference Manual for definitions of the various operating
modes and for instructions on how to minimize system power.
Example System Hold Time Calculation
To determine the data output hold time in a particular system,
first calculate tDECAY using the equation given above. Choose ΔV
to be the difference between the ADSP-BF538/ADSP-BF538F
processor’s output voltage and the input threshold for the
device requiring the hold time. CL is the total bus capacitance
(per data line), and IL is the total leakage or three-state current
(per data line). The hold time will be tDECAY plus the various out-
put disable times as specified in the Timing Specifications on
Page 26 (for example tDSDAT for an SDRAM write cycle as shown
in Table 22 on Page 32).
TEST CONDITIONS
All timing parameters appearing in this data sheet were mea-
sured under the conditions described in this section. Figure 39
shows the measurement point for AC measurements (except
output enable/disable). The measurement point VMEAS is 1.5 V
for VDDEXT (nominal) = 3.0 V/3.3 V.
INPUT
OR
1.5V
1.5V
OUTPUT
REFERENCE
SIGNAL
Figure 39. Voltage Reference Levels for AC
tDIS_MEASURED
tENA-MEASURED
Measurements (Except Output Enable/Disable)
tDIS
VOH
tENA
VOH
(MEASURED)
Output Enable Time Measurement
(MEASURED)
VOH (MEASURED) ؊ ⌬V
VOL (MEASURED) + ⌬V
2.0V
1.0V
Output pins are considered to be enabled when they have made
a transition from a high impedance state to the point when they
start driving.
VOL
(MEASURED)
VOL
(MEASURED)
tDECAY
tTRIP
The output enable time tENA is the interval from the point when
a reference signal reaches a high or low voltage level to the point
when the output starts driving as shown on the right side of Fig-
ure 40, “Output Enable/Disable,” on Page 48.
OUTPUT STOPS DRIVING
OUTPUT STARTS DRIVING
HIGH IMPEDANCE STATE.
TEST CONDITIONS CAUSE THIS
VOLTAGE TO BE APPROXIMATELY 1.5V.
The time tENA_MEASURED is the interval, from when the reference
signal switches, to when the output voltage reaches VTRIP(high)
or VTRIP(low). VTRIP(high) is 2.0 V and VTRIP(low) is 1.0 V for
Figure 40. Output Enable/Disable
50⍀
V
DDEXT (nominal) = 3.0 V/3.3 V. Time tTRIP is the interval from
TO
OUTPUT
PIN
1.5V
when the output starts driving to when the output reaches the
VTRIP(high) or VTRIP(low) trip voltage.
30pF
Time tENA is calculated as shown in the equation:
tENA = tENA_MEASURED – tTRIP
Figure 41. Equivalent Device Loading for AC Measurements
(Includes All Fixtures)
If multiple pins (such as the data bus) are enabled, the measure-
ment value is that of the first pin to start driving.
Output Disable Time Measurement
Output pins are considered to be disabled when they stop driv-
ing, go into a high impedance state, and start to decay from their
output high or low voltage. The output disable time tDIS is the
difference between tDIS_MEASURED and tDECAY as shown on the left
side of Figure 40.
tDIS = tDIS_MEASURED – tDECAY
The time for the voltage on the bus to decay by ΔV is dependent
on the capacitive load CL and the load current IL. This decay
time can be approximated by the equation:
Rev. 0
|
Page 48 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
Capacitive Loading
Output delays and holds are based on standard capacitive loads:
30 pF on all pins (see Figure 41). VLOAD is 1.5 V for VDDEXT
(nominal) = 3.0 V/3.3 V. Figure 42 through Figure 51 on
Page 51 show how output rise and fall times vary with capaci-
tance. The delay and hold specifications given should be derated
by a factor derived from these figures. The graphs in these fig-
ures may not be linear outside the ranges shown.
12
10
RISE TIME
8
6
4
2
0
FALL TIME
14
12
RISE TIME
10
0
50
100
150
200
250
LOAD CAPACITANCE (pF)
FALL TIME
8
Figure 44. Typical Output Rise and Fall Times (10% to 90%) vs. Load Capaci-
tance for Driver B at VDDEXT = 2.7 V (MIN)
6
4
2
0
10
9
0
50
100
150
200
250
LOAD CAPACITANCE (pF)
8
RISE TIME
7
Figure 42. Typical Output Rise and Fall Times (10% to 90%) vs. Load Capaci-
tance for Driver A at VDDEXT = 2.7 V (MIN)
6
FALL TIME
5
4
3
2
1
0
12
10
RISE TIME
0
50
100
150
200
250
8
LOAD CAPACITANCE (pF)
FALL TIME
6
Figure 45. Typical Output Rise and Fall Times (10% to 90%) vs. Load Capaci-
tance for Driver B at VDDEXT = 3.6 V (MAX)
4
2
0
0
50
100
150
200
250
LOAD CAPACITANCE (pF)
Figure 43. Typical Output Rise and Fall Times (10% to 90%) vs. Load Capaci-
tance for Driver A at VDDEXT = 3.6 V (MAX)
Rev. 0
|
Page 49 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
30
18
16
14
12
10
8
25
RISE TIME
RISE TIME
20
FALL TIME
15
FALL TIME
10
5
6
4
2
0
0
0
50
100
150
200
250
0
50
100
150
200
250
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
Figure 46. Typical Output Rise and Fall Times (10% to 90%) vs. Load
Capacitance for Driver C at VDDEXT = 2.7 V (MIN)
Figure 48. Typical Output Rise and Fall Times (10% to 90%) vs. Load
Capacitance for Driver D at VDDEXT = 2.7 V (MIN)
14
12
20
18
16
RISE TIME
RISE TIME
10
14
12
8
FALL TIME
FALL TIME
10
6
4
2
0
8
6
4
2
0
0
50
100
150
200
250
0
50
100
150
200
250
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
Figure 47. Typical Output Rise and Fall Times (10% to 90%) vs. Load
Capacitance for Driver C at VDDEXT = 3.6 V (MAX)
Figure 49. Typical Output Rise and Fall Times (10% to 90%) vs. Load
Capacitance for Driver D at VDDEXT = 3.6 V (MAX)
Rev. 0
|
Page 50 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
Values of θJA are provided for package comparison and printed
circuit board design considerations. θJA can be used for a first
order approximation of TJ by the equation:
135
130
TJ = TA + (θJA × PD)
125
120
115
where:
FALL TIME
TA = Ambient temperature (؇C)
Values of θJC are provided for package comparison and printed
circuit board design considerations when an external heatsink is
required.
110
100
Values of θJB are provided for package comparison and printed
circuit board design considerations.
In Table 35, airflow measurements comply with JEDEC stan-
dards JESD51-2 and JESD51-6, and the junction-to-board
measurement complies with JESD51-8. The junction-to-case
measurement complies with MIL-STD-883 (Method 1012.1).
All measurements use a 2S2P JEDEC test board.
0
50
100
150
200
250
LOAD CAPACITANCE (pF)
Figure 50. Typical Output Fall Times (10% to 90%) vs. Load
Capacitance for Driver E at VDDEXT = 2.7 V (MIN)
Table 35. Thermal Characteristics BC-316 Without Flash
Parameter
θJA
Condition
Typical
21.6
Unit
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
124
120
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
θJMA
θJMA
θJC
18.8
18.1
116
112
108
5.36
FALL TIME
ΨJT
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
0.13
ΨJT
0.25
ΨJT
0.25
Table 36. Thermal Characteristics BC-316 With Flash
104
100
Parameter
θJA
Condition
Typical
20.9
Unit
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
0
50
100
150
200
250
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
LOAD CAPACITANCE (pF)
θJMA
θJMA
θJC
18.1
17.4
Figure 51. Typical Output Fall Times (10% to 90%) vs. Load
Capacitance for Driver E at VDDEXT = 3.6 V (MAX)
5.01
ΨJT
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
0.12
THERMAL CHARACTERISTICS
ΨJT
0.24
To determine the junction temperature on the application
printed circuit board use:
ΨJT
0.24
TJ = TCASE + (ΨJT × PD)
where:
TJ = Junction temperature (؇C)
TCASE = Case temperature (؇C) measured by customer at top
center of package.
ΨJT = From Table 35
PD = Power dissipation (see Power Dissipation on Page 48 for
the method to calculate PD)
Rev. 0
|
Page 51 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
316-BALL MINI-BGA BALL ASSIGNMENTS
Table 37 on Page 53 lists the mini-BGA ball assignment by ball
number. Table 38 on Page 54 lists the mini-BGA ball assign-
ment by signal.
A1 BALL
A1 BALL
A
B
C
D
E
F
A
B
C
D
E
F
G
H
J
G
H
J
K
L
K
L
M
N
P
R
T
M
N
P
R
T
U
V
W
Y
U
V
W
Y
20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
1
2
3
4
5
6
7
8 9 10 11 12 13 14 15 16 17 18 19 20
GND
VDDINT
VDDRTC
NC
VDDEXT
VROUTx
FLASH CONTROL
GND
I/O
VDDRTC
VROUTx
NC
I/O
VDDINT
VDDEXT
Note: H18 andY14 are NC for ADSP-BF538
and I/O (FCE and RESET) for ADSP-538F.
FLASH CONTROL
Note: H18 andY14 are NC for ADSP-BF538
and I/O (FCE and RESET) for ADSP-538F.
Figure 53. 316-Ball Mini-BGA Ball Configuration (Bottom View)
Figure 52. 316-Ball Mini-BGA Ball Configuration (Top View)
Rev. 0
|
Page 52 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
Table 37. 316-Ball Mini-BGA Ball Assignment (Numerically by Ball Number)
Ball No. Signal
Ball No. Signal Ball No. Signal Ball No. Signal Ball No. Signal Ball No. Signal
Ball No. Signal
A1
GND
PF10
PF11
C7
C8
C9
SPI2SEL1 F8
SPI2SS F9
MOSI2 F10
MISO2 F11
GND
GND
GND
GND
GND
GND
GND
J12
J13
J14
J18
J19
J20
K1
GND
GND
GND
AMS0
AMS2
SA10
RFS1
TMR2
M19
M20
N1
ABE0
ABE1
TFS0
T3
T7
T8
GND
W1
TCK
A2
VDDEXT W2
VDDEXT W3
VDDEXT W4
VDDEXT W5
VDDEXT W6
VDDINT W7
VDDINT W8
VDDINT W9
GND
A3
DATA15
DATA13
DATA11
DATA9
DATA7
DATA5
DATA3
DATA1
RSCLK2
DR2PRI
DT2PRI
RX2
A4
PPI_CLK C10
N2
DR0PRI T9
A5
PPI0
PPI2
PF15
PF13
C11
C12
C13
C14
SCK2
F12
N3
GND
T10
A6
VDDINT F13
SPI1SEL1 F14
MISO1 F18
SPI1SS F19
MOSI1 F20
N7
VDDEXT T11
A7
N8
GND
GND
GND
GND
GND
GND
T12
T13
T14
T18
T19
T20
A8
DT3PRI K2
N9
A9
VDDRTC C15
PC4
K3
K7
K8
VDDEXT N10
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
B1
RTXO
RTXI
GND
CLKIN
XTAL
GND
NC
C16
C17
C18
C19
C20
D1
PC8
GND
GND
GND
GND
GND
GND
GND
GND
AMS3
AMS1
AOE
N11
N12
N13
N14
N18
N19
N20
P1
RFS3
W10
SCK1
GND
PC6
G1
G2
G3
G7
G8
G9
SCK0
ADDR7 W11
ADDR8 W12
MOSI0 K9
DT0SEC K10
VDDINT U1
DT3SEC U2
ADDR1 U3
ADDR2 U7
TSCLK0 U8
TRST
TMS
GND
W13
W14
W15
SCKE
PF4
GND
GND
GND
GND
GND
GND
GND
GND
BR
K11
K12
K13
K14
K18
K19
K20
L1
TX2
D2
PF5
VDDEXT W16
VDDEXT W17
VDDEXT W18
VDDEXT W19
VDDEXT W20
VDDINT Y1
VDDINT Y2
VDDINT Y3
RSCLK3 Y4
ADDR9 Y5
ADDR10 Y6
ADDR18
ADDR15
ADDR13
GND
GND
GPW
D3
DT1SEC G10
D7
GND
GND
GND
GND
GND
GND
GND
GND
GND
PC7
G11
G12
G13
G14
G18
G19
G20
H1
P2
RFS0
GND
U9
VROUT1 D8
P3
U10
GND
PF8
D9
P7
VDDEXT U11
ADDR14
GND
D10
D11
D12
D13
D14
D18
D19
D20
E1
RSCLK1 P8
GND
GND
GND
GND
GND
GND
U12
U13
U14
U18
U19
U20
B2
GND
PF9
L2
TMR1
GND
GND
GND
GND
GND
GND
GND
GND
GND
P9
TDO
B3
CLKOUT L3
SRAS L7
P10
P11
P12
P13
P14
P18
P19
P20
R1
DATA14
DATA12
DATA10
DATA8
DATA6
DATA4
DATA2
DATA0
RFS2
B4
PF3
B5
PPI1
DT1PRI L8
TSCLK1 L9
DR1SEC L10
B6
PPI3
H2
B7
PF14
PF12
SCL0
SDA0
CANRX
CANTX
NMI
H3
VDDINT V1
DR3SEC V2
ADDR3 V3
ADDR4 V4
TDI
Y7
Y8
Y9
B8
SMS
PF1
H7
GND
GND
GND
GND
GND
GND
GND
GND
FCE
L11
L12
L13
L14
L18
L19
L20
M1
M2
M3
M7
M8
GND
GND
B9
H8
B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20
C1
E2
PF2
H9
BMODE1 Y10
BMODE0 Y11
E3
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
PC5
H10
H11
H12
H13
H14
H18
H19
H20
J1
TX0
RSCLK0 V6
GND V7
VDDEXT V8
V5
E7
TSCLK3 R2
GND
Y12
TSCLK2
TFS2
E8
ARE
R3
R7
VDDEXT Y13
VDDEXT Y14
VDDEXT Y15
VDDEXT Y16
VDDEXT Y17
VDDINT Y18
DR2SEC Y19
RESET
E9
AWE
FRESET
SCL1
VDDEXT E10
DT0PRI R8
GND
GND
GND
GND
GND
GND
V9
GND
PC9
E11
E12
E13
E14
TMR0
GND
R9
V10
V11
V12
V13
V14
SDA1
SCAS
SWE
TFS1
R10
ADDR19
ADDR17
ADDR16
GND
GND
GND
VDDEXT R11
GND
GND
GND
GND
GND
GND
R12
R13
R14
R18
R19
R20
VROUT0 E18
J2
DR1PRI M9
DR0SEC M10
BG
Y20
PF6
E19
E20
F1
J3
VDDINT V15
DR3PRI V16
ADDR5 V17
ADDR6 V18
BGH
C2
PF7
ARDY
PF0
J7
GND
GND
GND
GND
GND
M11
M12
M13
M14
M18
DT2SEC
GND
C3
GND
GND
RX1
TX1
J8
C4
F2
MISO0 J9
GND
C5
F3
GND
GND
J10
J11
VDDINT T1
RX0
V19
V20
ADDR11
ADDR12
C6
F7
TFS3
T2
EMU
Rev. 0
|
Page 53 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
Table 38. 316-Ball Mini-BGA Ball Assignment (Alphabetically by Signal)
Signal
ABE0
Ball No. Signal Ball No. Signal Ball No. Signal Ball No. Signal Ball No. Signal
Ball No. Signal Ball No.
M19
M20
N19
N20
P19
P20
R19
R20
T19
T20
U19
U20
V19
V20
W18
W20
W17
Y19
Y18
W16
Y17
J18
DATA8 Y6
DATA9 W6
DATA10 Y5
DATA11 W5
DATA12 Y4
DATA13 W4
DATA14 Y3
DATA15 W3
DR0PRI N2
DR0SEC J3
DR1PRI J2
DR1SEC H3
DR2PRI W12
DR2SEC V13
DR3PRI R18
DR3SEC P18
DT0PRI M1
DT0SEC G3
DT1PRI H1
DT1SEC D3
DT2PRI W13
DT2SEC V16
DT3PRI F18
DT3SEC N18
GND
D14
GND
K8
GND
GND
GND
GND
GND
GND
GND
GND
GND
GPW
V2
RFS0
RFS1
RFS2
RFS3
P2
TX0
TX1
TX2
R1
ABE1
GND D18
GND K9
V3
K1
C6
ADDR1
ADDR2
ADDR3
ADDR4
ADDR5
ADDR6
ADDR7
ADDR8
ADDR9
ADDR10
ADDR11
ADDR12
ADDR13
ADDR14
ADDR15
ADDR16
ADDR17
ADDR18
ADDR19
AMS0
GND
GND
GND
GND
GND
GND
E3
E7
E8
E9
F8
F9
GND
GND
GND
GND
GND
GND
K10
V6
Y11
T18
W15
K11
K12
K13
L13
L14
V17
V18
W2
W19
Y1
VDDEXT K3
VDDEXT B15
VDDEXT T8
VDDEXT T9
VDDEXT T10
VDDEXT T11
VDDEXT U7
VDDEXT U8
VDDEXT U9
VDDEXT U10
VDDEXT U11
VDDEXT V7
VDDEXT M7
VDDEXT N7
VDDEXT P7
VDDEXT R7
VDDEXT T7
VDDEXT V8
VDDEXT V9
VDDEXT V10
VDDEXT V11
VDDINT C12
VDDINT M14
VDDINT N14
VDDINT P14
VDDINT R14
VDDINT T12
VDDINT T13
VDDINT T14
VDDINT U12
VDDINT U13
VDDINT U14
VDDINT V12
VDDRTC A9
VROUT0 B20
VROUT1 A19
RSCLK0 R2
RSCLK1 L1
RSCLK2 W11
RSCLK3 U18
GND F10
GND F11
GND F12
GND M3
GND M8
GND M9
Y20
A18
RTXI
RTXO
RX0
A11
A10
T1
MISO0 F2
MISO1 C14
MISO2 C10
MOSI0 G2
MOSI1 C16
MOSI2 C9
GND
F13
GND
M10
RX1
C5
GND F14
GND M11
RX2
W14
J20
H19
G1
GND
GND
GND
G7
G8
G9
GND
GND
GND
M12
M13
N3
SA10
SCAS
SCK0
SCK1
SCK2
SCKE
SCL0
SCL1
SDA0
SDA1
SMS
GND E10
GND K14
NC
A16
B13
F19
E19
C19
D19
F20
B17
F1
C17
C11
C20
B9
GND
GND
E11
E12
GND
GND
L3
L7
NMI
PC4
PC5
PC6
PC7
PC8
PC9
PF0
PF1
PF2
PF3
PF4
PF5
PF6
PF7
PF8
PF9
PF10
PF11
PF12
PF13
PF14
PF15
GND E13
GND L8
GND
GND
E14
E18
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
L9
Y15
B10
Y16
D20
L10
L11
L12
N8
AMS1
K19
J19
GND F3
AMS2
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
F7
AMS3
K18
K20
E20
L19
L20
V14
V15
V5
EMU
FCE
T2
G10
G11
G12
G13
G14
H7
SPI1SEL1 C13
SPI1SS C15
SPI2SEL1 C7
AOE
H18
N9
E1
ARDY
FRESET Y14
N10
N11
N12
N13
P3
E2
ARE
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
A1
B4
SPI2SS
SRAS
SWE
C8
AWE
A12
A15
A17
A20
B16
B18
B19
B2
D1
D2
C1
G20
H20
W1
V1
BG
BGH
H8
TCK
BMODE0
BMODE1
BR
H9
P8
C2
TDI
V4
H10
H11
H12
H13
H14
J7
P9
B1
TDO
Y2
G18
B11
B12
A13
G19
Y10
W10
Y9
P10
P11
P12
P13
R3
B3
TFS0
N1
J1
CANRX
CANTX
CLKIN
A2
TFS1
A3
TFS2
Y13
M18
M2
L2
C18
C3
B8
TFS3
CLKOUT
DATA0
DATA1
DATA2
DATA3
DATA4
DATA5
DATA6
DATA7
A8
TMR0
TMR1
TMR2
TMS
C4
J8
R8
B7
D7
J9
R9
A7
K2
XTAL
A14
D8
J10
J11
J12
J13
R10
R11
R12
R13
PPI_CLK A4
U2
W9
D9
PPI0
PPI1
PPI2
PPI3
A5
B5
A6
B6
TRST
U1
Y8
D10
D11
D12
D13
TSCLK0
TSCLK1
TSCLK2
TSCLK3
P1
W8
H2
Y12
L18
Y7
GND J14
GND K7
GND T3
GND U3
W7
RESET B14
Rev. 0
|
Page 54 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
OUTLINE DIMENSIONS
Dimensions in Figure 54—316-Ball Mini Ball Grid Array
(BC-316) are shown in millimeters.
15.20 BSC SQ
17.00 BSC SQ
A1 BALL
0.80 BSC BALL PITCH
A1 BALL INDICATOR
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
20 19 18 17 16 1514 13 12 11 10
9 8 7 6 5 4 3 2 1
BOTTOM VIEW
TOP VIEW
0.30 MIN
0.12 MAX
COPLANARITY
SIDE VIEW
1.70
MAX
0.50
0.45
0.40
SEATING PLANE
BALL DIAMETER
DETAIL A
DETAIL A
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. COMPLIANT TO JEDEC REGISTERED OUTLINE MO-205, VARIATION AM,
WITH THE EXCEPTION OF BALL DIAMETER.
3. CENTER DIMENSIONS ARE NOMINAL.
Figure 54. 316-Ball Mini Ball Grid Array (BC-316)
Rev. 0
|
Page 55 of 56
|
May 2007
ADSP-BF538/ADSP-BF538F
SURFACE MOUNT DESIGN
Table 39 is provided as an aid to PCB design. For industry-
standard design recommendations, refer to IPC-7351,
Generic Requirements for Surface Mount Design and Land Pattern Standard.
Table 39. BGA Data for Use with Surface Mount Design
Solder Mask
Package
Ball Attach Type
Opening
Ball Pad Size
316-Ball Mini Ball Grid Array Solder Mask Defined 0.40 mm diameter 0.50 mm diameter
(BC-316)
ORDERING GUIDE
Temperature
Range2
Instruction Flash
Rate (Max) Memory
Operating Voltage
(Nominal)
Package
Option
Model 1
Package Description
ADSP-BF538BBCZ-4A
ADSP-BF538BBCZ-5A
ADSP-BF538BBCZ-4F4
ADSP-BF538BBCZ-4F8
ADSP-BF538BBCZ-5F4
ADSP-BF538BBCZ-5F8
1 Z = RoHS Compliant Part.
–40ЊC to +85ЊC 400 MHz
–40ЊC to +85ЊC 533 MHz
–40ЊC to +85ЊC 400 MHz
–40ЊC to +85ЊC 400 MHz
–40ЊC to +85ЊC 533 MHz
–40ЊC to +85ЊC 533 MHz
N/A
N/A
1.2 V internal/ 2.5 V or 3.3 V I/O 316-Ball Mini BGA
1.25 V internal/ 2.5 V or 3.3 V I/O 316-Ball Mini BGA
BC-316
BC-316
BC-316
BC-316
BC-316
BC-316
512K byte 1.2 V internal/ 3.0 V or 3.3 V I/O 316-Ball Mini BGA
1M byte 1.2 V internal/ 3.0 V or 3.3 V I/O 316-Ball Mini BGA
512K byte 1.25 V internal/ 3.0 V or 3.3 V I/O 316-Ball Mini BGA
1M byte 1.25 V internal/ 3.0 V or 3.3 V I/O 316-Ball Mini BGA
2 Referenced temperature is ambient temperature.
©2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06700-0-5/07(0)
Rev. 0
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Page 56 of 56
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May 2007
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