ADSP-BF531_07 [ADI]
Blackfin㈢ Embedded Processor; Blackfin㈢嵌入式处理器型号: | ADSP-BF531_07 |
厂家: | ADI |
描述: | Blackfin㈢ Embedded Processor |
文件: | 总60页 (文件大小:3447K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Blackfin®
Embedded Processor
ADSP-BF531/ADSP-BF532/ADSP-BF533
External memory controller with glueless support for
SDRAM, SRAM, flash, and ROM
FEATURES
Up to 600 MHz high performance Blackfin processor
Two 16-bit MACs, two 40-bit ALUs, four 8-bit video ALUs,
40-bit shifter
Flexible memory booting options from SPI® and
external memory
PERIPHERALS
RISC-like register and instruction model for ease of pro-
gramming and compiler-friendly support
Advanced debug, trace, and performance monitoring
0.85 V to 1.30 V core VDD with on-chip voltage regulation
1.8 V, 2.5 V, and 3.3 V compliant I/O
Parallel peripheral interface PPI/GPIO, supporting
ITU-R 656 video data formats
Two dual-channel, full duplex synchronous serial ports, sup-
porting eight stereo I2S channels
Four memory-to-memory DMAs
Eight peripheral DMAs
160-ball CSP_BGA, 169-ball PBGA, and 176-lead LQFP
packages
SPI-compatible port
MEMORY
Three 32-bit timer/counters with PWM support
Real-time clock and watchdog timer
32-bit core timer
Up to 16 general-purpose I/O pins (GPIO)
UART with support for IrDA®
Event handler
Debug/JTAG interface
On-chip PLL capable of 0.5� to 64� frequency multiplication
Up to 148K bytes of on-chip memory:
16K bytes of instruction SRAM/Cache
Up to 64K bytes of instruction SRAM
Up to32K bytes of data SRAM/Cache
Up to32K bytes of data SRAM
4K bytes of scratchpad SRAM
Memory management unit providing memory protection
JTAG TEST AND EMULATION
VOLTAGE REGULATOR
INTERRUPT
CONTROLLER
WATCHDOG
TIMER
B
RTC
L1
L1
DATA
MEMORY
DMA
CONTROLLER
PPI
INSTRUCTION
MEMORY
GPIO
PORT
F
TIMER0-2
SPI
DMA
EXTERNAL
DMA CORE BUS
BUS
EXTERNAL ACCESS BUS
UART
EXTERNAL PORT
FLASH, SDRAM CONTROL
SPORT0-1
16
BOOT ROM
Figure 1. Functional Block Diagram
Blackfin and the Blackfin logo are registered trademarks of Analog Devices, Inc.
Rev. E
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2007 Analog Devices, Inc. All rights reserved.
ADSP-BF531/ADSP-BF532/ADSP-BF533
TABLE OF CONTENTS
General Description ................................................. 3
Portable Low Power Architecture ............................. 3
System Integration ................................................ 3
Serial Peripheral Interface (SPI) Port
—Slave Timing ............................................. 38
Universal Asynchronous Receiver-Transmitter
(UART) Port—Receive and Transmit Timing ...... 39
ADSP-BF531/ADSP-BF532/ADSP-BF533 Processor
Peripherals ....................................................... 3
General-Purpose I/O Port F Pin Cycle Timing ......... 40
Timer Cycle Timing .......................................... 41
JTAG Test and Emulation Port Timing .................. 42
Output Drive Currents ......................................... 43
Power Dissipation ............................................... 45
Test Conditions .................................................. 45
Environmental Conditions .................................... 48
160-Ball BGA Ball Assignment .................................. 49
169-Ball PBGA ball assignment .................................. 52
176-Lead LQFP Pinout ............................................ 55
Outline Dimensions ................................................ 57
Surface Mount Design .......................................... 58
Ordering Guide ..................................................... 59
Blackfin Processor Core .......................................... 4
Memory Architecture ............................................ 4
DMA Controllers .................................................. 8
Real-Time Clock ................................................... 8
Watchdog Timer .................................................. 9
Timers ............................................................... 9
Serial Ports (SPORTs) ............................................ 9
Serial Peripheral Interface (SPI) Port ....................... 10
UART Port ........................................................ 10
General-Purpose I/O Port F ................................... 10
Parallel Peripheral Interface ................................... 11
Dynamic Power Management ................................ 11
Voltage Regulation .............................................. 13
Clock Signals ..................................................... 13
Booting Modes ................................................... 14
Instruction Set Description ................................... 15
Development Tools ............................................. 15
Designing an Emulator-Compatible Processor Board .. 16
Related Documents ............................................. 17
Pin Descriptions .................................................... 18
Specifications ........................................................ 21
Operating Conditions .......................................... 21
Electrical Characteristics ....................................... 22
Absolute Maximum Ratings .................................. 23
Package Information ........................................... 23
ESD Sensitivity ................................................... 23
Timing Specifications .......................................... 24
Clock and Reset Timing .................................... 25
Asynchronous Memory Read Cycle Timing ........... 26
Asynchronous Memory Write Cycle Timing .......... 27
SDRAM Interface Timing .................................. 28
External Port Bus Request and Grant Cycle Timing .. 29
Parallel Peripheral Interface Timing ..................... 30
Serial Ports ..................................................... 34
REVISION HISTORY
7/07—Revision E: Changed from Rev. D to Rev. E
Combined ADSP-BF531/532 Rev D and ADSP-BF533 Rev D
Data sheets into this Revision E .................................. 1
Changed Features .................................................... 1
Reformatted Processor Comparison ............................. 3
Rewrote General-Purpose I/O Port F ........................... 10
Rewrote Parallel Peripheral Interface ........................... 11
Rewrote Dynamic Power Management ........................ 11
Rewrote Voltage Regulation ...................................... 13
Rewrote Clock Signals ............................................. 13
Rewrote Booting Modes ........................................... 14
Rewrote EZ-KIT Lite Evaluation Board ........................ 16
Reformatted Pin Descriptions .................................... 18
Changed Operating Conditions ................................. 21
Changed Electrical Characteristics .............................. 22
Reformatted Timing Specifications ............................. 24
Added Figures to Parallel Peripheral Interface Timing ..... 30
Changed Serial Ports ............................................... 34
Changed Ordering Guide ......................................... 59
8/06—Revision D: Changed from Rev. C to Rev. D
Serial Peripheral Interface (SPI) Port
—Master Timing .......................................... 37
Rev. E
|
Page 2 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
GENERAL DESCRIPTION
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors are
members of the Blackfin family of products, incorporating the
Analog Devices/Intel Micro Signal Architecture (MSA). Black-
fin processors combine a dual-MAC state-of-the-art signal
processing engine, the advantages of a clean, orthogonal RISC-
like microprocessor instruction set, and single instruction, mul-
tiple data (SIMD) multimedia capabilities into a single
instruction set architecture.
power consumption. Varying the voltage and frequency can
result in a substantial reduction in power consumption, com-
pared with just varying the frequency of operation. This
translates into longer battery life for portable appliances.
SYSTEM INTEGRATION
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors are
highly integrated system-on-a-chip solutions for the next gener-
ation of digital communication and consumer multimedia
applications. By combining industry-standard interfaces with a
high performance signal processing core, users can develop
cost-effective solutions quickly without the need for costly
external components. The system peripherals include a UART
port, an SPI port, two serial ports (SPORTs), four general-pur-
pose timers (three with PWM capability), a real-time clock, a
watchdog timer, and a parallel peripheral interface.
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors are
completely code and pin-compatible, differing only with respect
to their performance and on-chip memory. Specific perfor-
mance and memory configurations are shown in Table 1.
Table 1. Processor Comparison
ADSP-BF531/ADSP-BF532/ADSP-BF533
PROCESSOR PERIPHERALS
Features
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors con-
tain a rich set of peripherals connected to the core via several
high bandwidth buses, providing flexibility in system configura-
tion as well as excellent overall system performance (see the
functional block diagram in Figure 1 on Page 1). The general-
purpose peripherals include functions such as UART, timers
with PWM (pulse-width modulation) and pulse measurement
capability, general-purpose I/O pins, a real-time clock, and a
watchdog timer. This set of functions satisfies a wide variety of
typical system support needs and is augmented by the system
expansion capabilities of the part. In addition to these general-
purpose peripherals, the ADSP-BF531/ADSP-BF532/
ADSP-BF533 processors contain high speed serial and parallel
ports for interfacing to a variety of audio, video, and modem
codec functions; an interrupt controller for flexible manage-
ment of interrupts from the on-chip peripherals or external
sources; and power management control functions to tailor the
performance and power characteristics of the processor and sys-
tem to many application scenarios.
SPORTs
2
2
2
UART
1
1
1
SPI
1
1
1
GP Timers
3
3
3
Watchdog Timers
1
1
1
RTC
1
1
1
Parallel Peripheral Interface
GPIOs
1
1
1
16
16
16
L1 Instruction SRAM/Cache 16K bytes 16K bytes 16K bytes
L1 Instruction SRAM
L1 Data SRAM/Cache
L1 Data SRAM
16K bytes 32K bytes 64K bytes
16K bytes 32K bytes 32K bytes
32K bytes
L1 Scratchpad
4K bytes 4K bytes 4K bytes
1K bytes 1K bytes 1K bytes
L3 Boot ROM
Maximum Speed Grade
400 MHz 400 MHz 600 MHz
All of the peripherals, except for general-purpose I/O, real-time
clock, and timers, are supported by a flexible DMA structure.
There is also a separate memory DMA channel dedicated to
data transfers between the processor’s various memory spaces,
including external SDRAM and asynchronous memory. Multi-
ple on-chip buses running at up to 133 MHz provide enough
bandwidth to keep the processor core running along with activ-
ity on all of the on-chip and external peripherals.
Package Options:
CSP_BGA
Plastic BGA
LQFP
160-Ball 160-Ball 160-Ball
169-Ball 169-Ball 169-Ball
176-Lead 176-Lead 176-Lead
By integrating a rich set of industry-leading system peripherals
and memory, Blackfin processors are the platform of choice for
next generation applications that require RISC-like program-
mability, multimedia support, and leading-edge signal
processing in one integrated package.
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors
include an on-chip voltage regulator in support of the proces-
sor’s dynamic power management capability. The voltage
regulator provides a range of core voltage levels from a single
2.25 V to 3.6 V input. The voltage regulator can be bypassed at
the user’s discretion.
PORTABLE LOW POWER ARCHITECTURE
Blackfin processors provide world-class power management
and performance. Blackfin processors are designed in a low
power and low voltage design methodology and feature
dynamic power management—the ability to vary both the volt-
age and frequency of operation to significantly lower overall
Rev. E
|
Page 3 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
In addition, multiple L1 memory blocks are provided, offering a
configurable mix of SRAM and cache. The memory manage-
ment unit (MMU) provides memory protection for individual
tasks that may be operating on the core and can protect system
registers from unintended access.
BLACKFIN PROCESSOR CORE
As shown in Figure 2 on Page 5, the Blackfin processor core
contains two 16-bit multipliers, two 40-bit accumulators, two
40-bit ALUs, four video ALUs, and a 40-bit shifter. The compu-
tation units process 8-bit, 16-bit, or 32-bit data from the
register file.
The architecture provides three modes of operation: user mode,
supervisor mode, and emulation mode. User mode has
restricted access to certain system resources, thus providing a
protected software environment, while supervisor mode has
unrestricted access to the system and core resources.
The compute register file contains eight 32-bit registers. When
performing compute operations on 16-bit operand data, the
register file operates as 16 independent 16-bit registers. All
operands for compute operations come from the multiported
register file and instruction constant fields.
The Blackfin processor instruction set has been optimized so
that 16-bit opcodes represent the most frequently used instruc-
tions, resulting in excellent compiled code density. Complex
DSP instructions are encoded into 32-bit opcodes, representing
fully featured multifunction instructions. Blackfin processors
support a limited multi-issue capability, where a 32-bit instruc-
tion can be issued in parallel with two 16-bit instructions,
allowing the programmer to use many of the core resources in a
single instruction cycle.
Each MAC can perform a 16-bit by 16-bit multiply in each
cycle, accumulating the results into the 40-bit accumulators.
Signed and unsigned formats, rounding, and saturation are
supported.
The ALUs perform a traditional set of arithmetic and logical
operations on 16-bit or 32-bit data. In addition, many special
instructions are included to accelerate various signal processing
tasks. These include bit operations such as field extract and
population count, modulo 232 multiply, divide primitives, satu-
ration and rounding, and sign/exponent detection. The set of
video instructions includes byte alignment and packing opera-
tions, 16-bit and 8-bit adds with clipping, 8-bit average
operations, and 8-bit subtract/absolute value/accumulate (SAA)
operations. Also provided are the compare/select and vector
search instructions.
The Blackfin processor assembly language uses an algebraic syn-
tax for ease of coding and readability. The architecture has been
optimized for use in conjunction with the C/C++ compiler,
resulting in fast and efficient software implementations.
MEMORY ARCHITECTURE
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors view
memory as a single unified 4G byte address space, using 32-bit
addresses. All resources, including internal memory, external
memory, and I/O control registers, occupy separate sections of
this common address space. The memory portions of this
address space are arranged in a hierarchical structure to provide
a good cost/performance balance of some very fast, low latency
on-chip memory as cache or SRAM, and larger, lower cost and
performance off-chip memory systems. See Figure 4 on Page 6,
Figure 5 on Page 6, and Figure 3 on Page 6.
For certain instructions, two 16-bit ALU operations can be per-
formed simultaneously on register pairs (a 16-bit high half and
16-bit low half of a compute register). Quad 16-bit operations
are possible using the second ALU.
The 40-bit shifter can perform shifts and rotates and is used to
support normalization, field extract, and field deposit
instructions.
The program sequencer controls the flow of instruction execu-
tion, including instruction alignment and decoding. For
program flow control, the sequencer supports PC relative and
indirect conditional jumps (with static branch prediction), and
subroutine calls. Hardware is provided to support zero-over-
head looping. The architecture is fully interlocked, meaning that
the programmer need not manage the pipeline when executing
instructions with data dependencies.
The L1 memory system is the primary highest performance
memory available to the Blackfin processor. The off-chip mem-
ory system, accessed through the external bus interface unit
(EBIU), provides expansion with SDRAM, flash memory, and
SRAM, optionally accessing up to 132M bytes of
physical memory.
The memory DMA controller provides high bandwidth data-
movement capability. It can perform block transfers of code or
data between the internal memory and the external
memory spaces.
The address arithmetic unit provides two addresses for simulta-
neous dual fetches from memory. It contains a multiported
register file consisting of four sets of 32-bit index, modify,
length, and base registers (for circular buffering), and eight
additional 32-bit pointer registers (for C-style indexed stack
manipulation).
Internal (On-Chip) Memory
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor has
three blocks of on-chip memory providing high bandwidth
access to the core.
Blackfin processors support a modified Harvard architecture in
combination with a hierarchical memory structure. Level 1 (L1)
memories are those that typically operate at the full processor
speed with little or no latency. At the L1 level, the instruction
memory holds instructions only. The two data memories hold
data, and a dedicated scratchpad data memory stores stack and
local variable information.
The first is the L1 instruction memory, consisting of up to
80K bytes SRAM, of which 16K bytes can be configured as a
four way set-associative cache. This memory is accessed at full
processor speed.
Rev. E
|
Page 4 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
ADDRESS ARITHMETIC UNIT
SP
FP
P5
P4
P3
P2
P1
P0
I3
I2
I1
I0
L3
L2
L1
L0
B3
B2
B1
B0
M3
M2
M1
M0
DAG1
DAG0
DA1
DA0
32
32
32
PREG
32
RAB
SD
LD1
LD0
32
32
32
ASTAT
32
32
SEQUENCER
R7.H
R7.L
R6.H
R5.H
R4.H
R3.H
R2.H
R1.H
R0.H
R6.L
R5.L
R4.L
R3.L
R2.L
R1.L
R0.L
ALIGN
16
16
8
8
8
8
DECODE
BARREL
SHIFTER
LOOP BUFFER
40
40
40 40
A0
A1
CONTROL
UNIT
32
32
DATA ARITHMETIC UNIT
Figure 2. Blackfin Processor Core
The second on-chip memory block is the L1 data memory, con-
sisting of one or two banks of up to 32K bytes. The memory
banks are configurable, offering both cache and SRAM func-
tionality. This memory block is accessed at full processor speed.
1M byte segment regardless of the size of the devices used, so
that these banks will only be contiguous if each is fully popu-
lated with 1M byte of memory.
I/O Memory Space
The third memory block is a 4K byte scratchpad SRAM which
runs at the same speed as the L1 memories, but is only accessible
as data SRAM and cannot be configured as cache memory.
Blackfin processors do not define a separate I/O space. All
resources are mapped through the flat 32-bit address space.
On-chip I/O devices have their control registers mapped into
memory mapped registers (MMRs) at addresses near the top of
the 4G byte address space. These are separated into two smaller
blocks, one containing the control MMRs for all core functions,
and the other containing the registers needed for setup and con-
trol of the on-chip peripherals outside of the core. The MMRs
are accessible only in supervisor mode and appear as reserved
space to on-chip peripherals.
External (Off-Chip) Memory
External memory is accessed via the external bus interface unit
(EBIU). This 16-bit interface provides a glueless connection to a
bank of synchronous DRAM (SDRAM) as well as up to four
banks of asynchronous memory devices including flash,
EPROM, ROM, SRAM, and memory mapped I/O devices.
The PC133-compliant SDRAM controller can be programmed
to interface to up to 128M bytes of SDRAM. The SDRAM con-
troller allows one row to be open for each internal SDRAM
bank, for up to four internal SDRAM banks, improving overall
system performance.
Booting
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor con-
tains a small boot kernel, which configures the appropriate
peripheral for booting. If the ADSP-BF531/ADSP-BF532/
ADSP-BF533 processor is configured to boot from boot ROM
memory space, the processor starts executing from the on-chip
boot ROM. For more information, see Booting Modes on
Page 14.
The asynchronous memory controller can be programmed to
control up to four banks of devices with very flexible timing
parameters for a wide variety of devices. Each bank occupies a
Rev. E
|
Page 5 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
0xFFFF FFFF
0xFFFF FFFF
0xFFE0 0000
0xFFC0 0000
0xFFB0 1000
0xFFB0 0000
0xFFA1 4000
0xFFA1 0000
0xFFA0 0000
0xFF90 8000
0xFF90 4000
0xFF90 0000
0xFF80 8000
0xFF80 4000
0xFF80 0000
0xEF00 0000
0x2040 0000
0x2030 0000
0x2020 0000
0x2010 0000
0x2000 0000
0x0800 0000
0x0000 0000
CORE MMR REGISTERS (2M BYTE)
SYSTEM MMR REGISTERS (2M BYTE)
RESERVED
CORE MMR REGISTERS (2M BYTE)
0xFFE0 0000
SYSTEM MMR REGISTERS (2M BYTE)
0xFFC0 0000
RESERVED
0xFFB0 1000
SCRATCHPAD SRAM (4K BYTE)
RESERVED
SCRATCHPAD SRAM (4K BYTE)
0xFFB0 0000
RESERVED
0xFFA1 4000
INSTRUCTION SRAM/CACHE (16K BYTE)
INSTRUCTION SRAM (64K BYTE)
RESERVED
INSTRUCTION SRAM/CACHE (16K BYTE)
0xFFA1 0000
RESERVED
0xFFA0 C000
INSTRUCTION SRAM (16K BYTE)
0xFFA0 8000
DATA BANK B SRAM/CACHE (16K BYTE)
DATA BANK B SRAM (16K BYTE)
RESERVED
RESERVED
0xFFA0 0000
RESERVED
0xFF90 8000
RESERVED
0xFF90 4000
DATA BANK A SRAM/CACHE (16K BYTE)
DATA BANK A SRAM (16K BYTE)
RESERVED
0xFF80 8000
DATA BANK A SRAM/CACHE (16K BYTE)
0xFF80 4000
RESERVED
0xEF00 0000
RESERVED
0x2040 0000
RESERVED
RESERVED
ASYNC MEMORY BANK 3 (1M BYTE)
ASYNC MEMORY BANK 2 (1M BYTE)
ASYNC MEMORY BANK 1 (1M BYTE)
ASYNC MEMORY BANK 0 (1M BYTE)
RESERVED
ASYNC MEMORY BANK 3 (1M BYTE)
0x2030 0000
ASYNC MEMORY BANK 2 (1M BYTE)
0x2020 0000
ASYNC MEMORY BANK 1 (1M BYTE)
0x2010 0000
ASYNC MEMORY BANK 0 (1M BYTE)
0x2000 0000
RESERVED
0x0800 0000
SDRAM MEMORY (16M BYTE TO 128M BYTE)
SDRAM MEMORY (16M BYTE TO 128M BYTE)
0x0000 0000
Figure 3. ADSP-BF531 Internal/External Memory Map
Figure 5. ADSP-BF533 Internal/External Memory Map
Event Handling
0xFFFF FFFF
CORE MMR REGISTERS (2M BYTE)
0xFFE0 0000
The event controller on the ADSP-BF531/ADSP-BF532/
ADSP-BF533 processor handles all asynchronous and synchro-
nous events to the processor. The ADSP-BF531/ADSP-BF532/
ADSP-BF533 processor provides event handling that supports
both nesting and prioritization. Nesting allows multiple event
service routines to be active simultaneously. Prioritization
ensures that servicing of a higher priority event takes prece-
dence over servicing of a lower priority event. The controller
provides support for five different types of events:
SYSTEM MMR REGISTERS (2M BYTE)
0xFFC0 0000
RESERVED
0xFFB0 1000
SCRATCHPAD SRAM (4K BYTE)
0xFFB0 0000
RESERVED
0xFFA1 4000
INSTRUCTION SRAM/CACHE (16K BYTE)
0xFFA1 0000
INSTRUCTION SRAM (32K BYTE)
0xFFA0 8000
RESERVED
0xFFA0 0000
• Emulation – An emulation event causes the processor to
enter emulation mode, allowing command and control of
the processor via the JTAG interface.
RESERVED
0xFF90 8000
DATA BANK B SRAM/CACHE (16K BYTE)
0xFF90 4000
RESERVED
0xFF80 8000
• Reset – This event resets the processor.
DATA BANK A SRAM/CACHE (16K BYTE)
0xFF80 4000
• Nonmaskable Interrupt (NMI) – The NMI event can be
generated by the software watchdog timer or by the NMI
input signal to the processor. The NMI event is frequently
used as a power-down indicator to initiate an orderly shut-
down of the system.
RESERVED
0xEF00 0000
RESERVED
0x2040 0000
ASYNC MEMORY BANK 3 (1M BYTE)
0x2030 0000
ASYNC MEMORY BANK 2 (1M BYTE)
0x2020 0000
ASYNC MEMORY BANK 1 (1M BYTE)
0x2010 0000
ASYNC MEMORY BANK 0 (1M BYTE)
0x2000 0000
• Exceptions – Events that occur synchronously to program
flow (i.e., the exception will be taken before the instruction
is allowed to complete). Conditions such as data alignment
violations and undefined instructions cause exceptions.
RESERVED
0x0800 0000
SDRAM MEMORY (16M BYTE TO 128M BYTE)
• Interrupts – Events that occur asynchronously to program
flow. They are caused by input pins, timers, and other
peripherals, as well as by an explicit software instruction.
0x0000 0000
Figure 4. ADSP-BF532 Internal/External Memory Map
Rev. E
|
Page 6 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
Each event type has an associated register to hold the return
address and an associated return-from-event instruction. When
an event is triggered, the state of the processor is saved on the
supervisor stack.
Table 3. System Interrupt Controller (SIC)
Peripheral Interrupt Event
PLL Wakeup
Default Mapping
IVG7
DMA Error
IVG7
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor event
controller consists of two stages, the core event controller (CEC)
and the system interrupt controller (SIC). The core event con-
troller works with the system interrupt controller to prioritize
and control all system events. Conceptually, interrupts from the
peripherals enter into the SIC, and are then routed directly into
the general-purpose interrupts of the CEC.
PPI Error
IVG7
SPORT 0 Error
IVG7
SPORT 1 Error
IVG7
SPI Error
IVG7
UART Error
IVG7
Real-Time Clock
IVG8
Core Event Controller (CEC)
DMA Channel 0 (PPI)
DMA Channel 1 (SPORT 0 Receive)
DMA Channel 2 (SPORT 0 Transmit)
DMA Channel 3 (SPORT 1 Receive)
DMA Channel 4 (SPORT 1 Transmit)
DMA Channel 5 (SPI)
DMA Channel 6 (UART Receive)
DMA Channel 7 (UART Transmit)
Timer 0
IVG8
The CEC supports nine general-purpose interrupts (IVG15–7),
in addition to the dedicated interrupt and exception events. Of
these general-purpose interrupts, the two lowest priority inter-
rupts (IVG15–14) are recommended to be reserved for software
interrupt handlers, leaving seven prioritized interrupt inputs to
support the peripherals of the processor. Table 2 describes the
inputs to the CEC, identifies their names in the event vector
table (EVT), and lists their priorities.
IVG9
IVG9
IVG9
IVG9
IVG10
IVG10
IVG10
IVG11
IVG11
IVG11
IVG12
IVG12
IVG13
IVG13
IVG13
Table 2. Core Event Controller (CEC)
Timer 1
Priority
Timer 2
(0 is Highest)
Event Class
Emulation/Test Control EMU
Reset RST
Nonmaskable Interrupt NMI
EVT Entry
Port F GPIO Interrupt A
Port F GPIO Interrupt B
Memory DMA Stream 0
Memory DMA Stream 1
Software Watchdog Timer
0
1
2
3
Exception
EVX
4
Reserved
5
Hardware Error
IVHW
IVTMR
IVG7
Event Control
6
Core Timer
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor pro-
vides the user with a very flexible mechanism to control the
processing of events. In the CEC, three registers are used to
coordinate and control events. Each register is 32 bits wide:
7
General Interrupt 7
General Interrupt 8
General Interrupt 9
General Interrupt 10
General Interrupt 11
General Interrupt 12
General Interrupt 13
General Interrupt 14
General Interrupt 15
8
IVG8
9
IVG9
• CEC interrupt latch register (ILAT) – The ILAT register
indicates when events have been latched. The appropriate
bit is set when the processor has latched the event and
cleared when the event has been accepted into the system.
This register is updated automatically by the controller, but
it may also be written to clear (cancel) latched events. This
register may be read while in supervisor mode and may
only be written while in supervisor mode when the corre-
sponding IMASK bit is cleared.
10
11
12
13
14
15
IVG10
IVG11
IVG12
IVG13
IVG14
IVG15
System Interrupt Controller (SIC)
• CEC interrupt mask register (IMASK) – The IMASK regis-
ter controls the masking and unmasking of individual
events. When a bit is set in the IMASK register, that event is
unmasked and will be processed by the CEC when asserted.
A cleared bit in the IMASK register masks the event,
preventing the processor from servicing the event even
though the event may be latched in the ILAT register. This
register may be read or written while in supervisor mode.
The system interrupt controller provides the mapping and rout-
ing of events from the many peripheral interrupt sources to the
prioritized general-purpose interrupt inputs of the CEC.
Although the ADSP-BF531/ADSP-BF532/ADSP-BF533 proces-
sor provides a default mapping, the user can alter the mappings
and priorities of interrupt events by writing the appropriate val-
ues into the interrupt assignment registers (SIC_IARx). Table 3
describes the inputs into the SIC and the default mappings into
the CEC.
Rev. E
|
Page 7 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
Note that general-purpose interrupts can be globally
enabled and disabled with the STI and CLI instructions,
respectively.
and the asynchronous memory controller. DMA-capable
peripherals include the SPORTs, SPI port, UART, and PPI. Each
individual DMA-capable peripheral has at least one dedicated
DMA channel.
• CEC interrupt pending register (IPEND) – The IPEND
register keeps track of all nested events. A set bit in the
IPEND register indicates the event is currently active or
nested at some level. This register is updated automatically
by the controller but may be read while in supervisor mode.
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor DMA
controller supports both 1-dimensional (1-D) and 2-dimen-
sional (2-D) DMA transfers. DMA transfer initialization can be
implemented from registers or from sets of parameters called
descriptor blocks.
The SIC allows further control of event processing by providing
three 32-bit interrupt control and status registers. Each register
contains a bit corresponding to each of the peripheral interrupt
events shown in Table 3.
The 2-D DMA capability supports arbitrary row and column
sizes up to 64K elements by 64K elements, and arbitrary row
and column step sizes up to 32K elements. Furthermore, the
column step size can be less than the row step size, allowing
implementation of interleaved data streams. This feature is
especially useful in video applications where data can be
de-interleaved on the fly.
• SIC interrupt mask register (SIC_IMASK) – This register
controls the masking and unmasking of each peripheral
interrupt event. When a bit is set in this register, that
peripheral event is unmasked and will be processed by the
system when asserted. A cleared bit in this register masks
the peripheral event, preventing the processor from servic-
ing the event.
Examples of DMA types supported by the ADSP-BF531/
ADSP-BF532/ADSP-BF533 processor DMA controller include:
• A single, linear buffer that stops upon completion
• SIC interrupt status register (SIC_ISR) – As multiple
peripherals can be mapped to a single event, this register
allows the software to determine which peripheral event
source triggered the interrupt. A set bit indicates the
peripheral is asserting the interrupt, and a cleared bit indi-
cates the peripheral is not asserting the event.
• A circular, autorefreshing buffer that interrupts on each
full or fractionally full buffer
• 1-D or 2-D DMA using a linked list of descriptors
• 2-D DMA using an array of descriptors, specifying only the
base DMA address within a common page
• SIC interrupt wakeup enable register (SIC_IWR) – By
enabling the corresponding bit in this register, a peripheral
can be configured to wake up the processor, should the
core be idled when the event is generated. See Dynamic
Power Management on Page 11.
In addition to the dedicated peripheral DMA channels, there are
two pairs of memory DMA channels provided for transfers
between the various memories of the ADSP-BF531/
ADSP-BF532/ADSP-BF533 processor system. This enables
transfers of blocks of data between any of the memories—
including external SDRAM, ROM, SRAM, and flash memory—
with minimal processor intervention. Memory DMA transfers
can be controlled by a very flexible descriptor-based methodol-
ogy or by a standard register-based autobuffer mechanism.
Because multiple interrupt sources can map to a single general-
purpose interrupt, multiple pulse assertions can occur simulta-
neously, before or during interrupt processing for an interrupt
event already detected on this interrupt input. The IPEND reg-
ister contents are monitored by the SIC as the interrupt
acknowledgement.
REAL-TIME CLOCK
The processor real-time clock (RTC) provides a robust set of
digital watch features, including current time, stopwatch, and
alarm. The RTC is clocked by a 32.768 kHz crystal external to
the ADSP-BF531/ADSP-BF532/ADSP-BF533 processor. The
RTC peripheral has dedicated power supply pins so that it can
remain powered up and clocked even when the rest of the pro-
cessor is in a low power state. The RTC provides several
programmable interrupt options, including interrupt per sec-
ond, minute, hour, or day clock ticks, interrupt on
The appropriate ILAT register bit is set when an interrupt rising
edge is detected (detection requires two core clock cycles). The
bit is cleared when the respective IPEND register bit is set. The
IPEND bit indicates that the event has entered into the proces-
sor pipeline. At this point the CEC will recognize and queue the
next rising edge event on the corresponding event input. The
minimum latency from the rising edge transition of the general-
purpose interrupt to the IPEND output asserted is three core
clock cycles; however, the latency can be much higher, depend-
ing on the activity within and the state of the processor.
programmable stopwatch countdown, or interrupt at a pro-
grammed alarm time.
DMA CONTROLLERS
The 32.768 kHz input clock frequency is divided down to a 1 Hz
signal by a prescaler. The counter function of the timer consists
of four counters: a 60 second counter, a 60 minute counter, a 24
hour counter, and a 32,768 day counter.
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor has
multiple, independent DMA channels that support automated
data transfers with minimal overhead for the processor core.
DMA transfers can occur between the processor’s internal
memories and any of its DMA-capable peripherals. Addition-
ally, DMA transfers can be accomplished between any of the
DMA-capable peripherals and external devices connected to the
external memory interfaces, including the SDRAM controller
When enabled, the alarm function generates an interrupt when
the output of the timer matches the programmed value in the
alarm control register. There are two alarms: The first alarm is
for a time of day. The second alarm is for a day and time of
that day.
Rev. E
|
Page 8 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
The stopwatch function counts down from a programmed
value, with one second resolution. When the stopwatch is
enabled and the counter underflows, an interrupt is generated.
clock the timer, or as a mechanism for measuring pulse widths
and periods of external events. These timers can be synchro-
nized to an external clock input to the PF1 pin (TACLK), an
external clock input to the PPI_CLK pin (TMRCLK), or to the
internal SCLK.
Like other peripherals, the RTC can wake up the processor from
sleep mode upon generation of any RTC wakeup event.
Additionally, an RTC wakeup event can wake up the processor
from deep sleep mode, and wake up the on-chip internal voltage
regulator from a powered-down state.
The timer units can be used in conjunction with the UART to
measure the width of the pulses in the data stream to provide an
autobaud detect function for a serial channel.
Connect RTC pins RTXI and RTXO with external components
as shown in Figure 6.
The timers can generate interrupts to the processor core provid-
ing periodic events for synchronization, either to the system
clock or to a count of external signals.
RTXI
RTXO
In addition to the three general-purpose programmable timers,
a fourth timer is also provided. This extra timer is clocked by the
internal processor clock and is typically used as a system tick
clock for generation of operating system periodic interrupts.
R1
X1
SERIAL PORTS (SPORTs)
C1
C2
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor incor-
porates two dual-channel synchronous serial ports (SPORT0
and SPORT1) for serial and multiprocessor communications.
The SPORTs support the following features:
SUGGESTED COMPONENTS:
X1 = ECL IPTEK EC38J (THROUGH-HOLE PACKAGE) OR
• I2S capable operation.
EPSON MC405 12 pF LOAD (SURFACE-MOUNT PACKAGE)
C1 = 22 pF
C2 = 22 pF
R1 = 10 MΩ
• Bidirectional operation – Each SPORT has two sets of inde-
pendent transmit and receive pins, enabling eight channels
of I2S stereo audio.
NOTE: C1 AND C2 ARE SPECIFIC TO CRYSTAL SPECIFIED FOR X1.
CONTACT CRYSTAL MANUFACTURER FOR DETAILS. C1 AND C2
SPECIFICATIONS ASSUME BOARD TRACE CAPACITANCE OF 3pF.
• Buffered (8-deep) transmit and receive ports – Each port
has a data register for transferring data words to and from
other processor components and shift registers for shifting
data in and out of the data registers.
Figure 6. External Components for RTC
WATCHDOG TIMER
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor
includes a 32-bit timer that can be used to implement a software
watchdog function. A software watchdog can improve system
availability by forcing the processor to a known state through
generation of a hardware reset, nonmaskable interrupt (NMI),
or general-purpose interrupt, if the timer expires before being
reset by software. The programmer initializes the count value of
the timer, enables the appropriate interrupt, then enables the
timer. Thereafter, the software must reload the counter before it
counts to zero from the programmed value. This protects the
system from remaining in an unknown state where software,
which would normally reset the timer, has stopped running due
to an external noise condition or software error.
• Clocking – Each transmit and receive port can either use an
external serial clock or generate its own, in frequencies
ranging from (fSCLK/131,070) Hz to (fSCLK/2) Hz.
• Word length – Each SPORT supports serial data words
from 3 bits to 32 bits in length, transferred most-signifi-
cant-bit first or least-significant-bit first.
• Framing – Each transmit and receive port can run with or
without frame sync signals for each data word. Frame sync
signals can be generated internally or externally, active high
or low, and with either of two pulse widths and early or late
frame sync.
• Companding in hardware – Each SPORT can perform
A-law or μ-law companding according to ITU recommen-
dation G.711. Companding can be selected on the transmit
and/or receive channel of the SPORT without additional
latencies.
If configured to generate a hardware reset, the watchdog timer
resets both the core and the processor peripherals. After a reset,
software can determine if the watchdog was the source of the
hardware reset by interrogating a status bit in the watchdog
timer control register.
• DMA operations with single-cycle overhead – Each SPORT
can automatically receive and transmit multiple buffers of
memory data. The processor can link or chain sequences of
DMA transfers between a SPORT and memory.
The timer is clocked by the system clock (SCLK), at a maximum
frequency of fSCLK
.
TIMERS
There are four general-purpose programmable timer units in
the ADSP-BF531/ADSP-BF532/ADSP-BF533 processor. Three
timers have an external pin that can be configured either as a
pulse-width modulator (PWM) or timer output, as an input to
Rev. E
|
Page 9 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
• Interrupts – Each transmit and receive port generates an
interrupt upon completing the transfer of a data-word or
after transferring an entire data buffer or buffers
through DMA.
data to and from memory. The UART has two dedicated
DMA channels, one for transmit and one for receive. These
DMA channels have lower default priority than most DMA
channels because of their relatively low service rates.
• Multichannel capability – Each SPORT supports 128 chan-
nels out of a 1,024-channel window and is compatible with
the H.100, H.110, MVIP-90, and HMVIP standards.
The baud rate, serial data format, error code generation and sta-
tus, and interrupts for the UART port are programmable.
The UART programmable features include:
An additional 250 mV of SPORT input hysteresis can be
enabled by setting Bit 15 of the PLL_CTL register. When this bit
is set, all SPORT input pins have the increased hysteresis.
• Supporting bit rates ranging from (fSCLK/1,048,576) bits per
second to (fSCLK/16) bits per second.
• Supporting data formats from seven bits to 12 bits per
frame.
SERIAL PERIPHERAL INTERFACE (SPI) PORT
• Both transmit and receive operations can be configured to
generate maskable interrupts to the processor.
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor has an
SPI-compatible port that enables the processor to communicate
with multiple SPI-compatible devices.
The UART port’s clock rate is calculated as:
The SPI interface uses three pins for transferring data: two data
pins (master output-slave input, MOSI, and master input-slave
output, MISO) and a clock pin (serial clock, SCK). An SPI chip
select input pin (SPISS) lets other SPI devices select the proces-
sor, and seven SPI chip select output pins (SPISEL7–1) let the
processor select other SPI devices. The SPI select pins are recon-
figured general-purpose I/O pins. Using these pins, the SPI port
provides a full-duplex, synchronous serial interface which sup-
ports both master/slave modes and multimaster environments.
fSCLK
-----------------------------------------------
UART Clock Rate =
16 × UART_Divisor
Where the 16-bit UART_Divisor comes from the UART_DLH
register (most significant 8 bits) and UART_DLL register (least
significant 8 bits).
In conjunction with the general-purpose timer functions,
autobaud detection is supported.
The capabilities of the UART are further extended with support
for the Infrared Data Association (IrDA) serial infrared physical
layer link specification (SIR) protocol.
The baud rate and clock phase/polarities for the SPI port are
programmable, and it has an integrated DMA controller, con-
figurable to support transmit or receive data streams. The SPI
DMA controller can only service unidirectional accesses at any
given time.
GENERAL-PURPOSE I/O PORT F
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor has 16
bidirectional, general-purpose I/O pins on Port F (PF15–0).
Each general-purpose I/O pin can be individually controlled by
manipulation of the GPIO control, status and interrupt
registers:
The SPI port clock rate is calculated as:
fSCLK
2 × SPI_BAUD
-----------------------------------
SPI Clock Rate =
Where the 16-bit SPI_BAUD register contains a value of 2 to
65,535.
• GPIO direction control register – Specifies the direction of
each individual PFx pin as input or output.
During transfers, the SPI port simultaneously transmits and
receives by serially shifting data in and out on its two serial data
lines. The serial clock line synchronizes the shifting and sam-
pling of data on the two serial data lines.
• GPIO control and status registers – The ADSP-BF531/
ADSP-BF532/ADSP-BF533 processor employs a “write one
to modify” mechanism that allows any combination of
individual GPIO pins to be modified in a single instruction,
without affecting the level of any other GPIO pins. Four
control registers are provided. One register is written in
order to set GPIO pin values, one register is written in
order to clear GPIO pin values, one register is written in
order to toggle GPIO pin values, and one register is written
in order to specify GPIO pin values. Reading the GPIO sta-
tus register allows software to interrogate the sense of the
GPIO pin.
UART PORT
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor pro-
vides a full-duplex universal asynchronous receiver/transmitter
(UART) port, which is fully compatible with PC-standard
UARTs. The UART port provides a simplified UART interface
to other peripherals or hosts, supporting full-duplex, DMA-sup-
ported, asynchronous transfers of serial data. The UART port
includes support for 5 data bits to 8 data bits, 1 stop bit or 2 stop
bits, and none, even, or odd parity. The UART port supports
two modes of operation:
• GPIO interrupt mask registers – The two GPIO interrupt
mask registers allow each individual PFx pin to function as
an interrupt to the processor. Similar to the two GPIO con-
trol registers that are used to set and clear individual GPIO
pin values, one GPIO interrupt mask register sets bits to
enable interrupt function, and the other GPIO interrupt
mask register clears bits to disable interrupt function. PFx
• PIO (programmed I/O) – The processor sends or receives
data by writing or reading I/O-mapped UART registers.
The data is double-buffered on both transmit and receive.
• DMA (direct memory access) – The DMA controller trans-
fers both transmit and receive data. This reduces the
number and frequency of interrupts required to transfer
Rev. E
|
Page 10 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
pins defined as inputs can be configured to generate hard-
ware interrupts, while output PFx pins can be triggered by
software interrupts.
Frame Capture Mode
Frame capture mode allows the video source(s) to act as a slave
(e.g., for frame capture). The ADSP-BF531/ADSP-BF532/
ADSP-BF533 processors control when to read from the video
source(s). PPI_FS1 is an HSYNC output and PPI_FS2 is a
VSYNC output.
• GPIO interrupt sensitivity registers – The two GPIO inter-
rupt sensitivity registers specify whether individual PFx
pins are level- or edge-sensitive and specify—if edge-sensi-
tive—whether just the rising edge or both the rising and
falling edges of the signal are significant. One register
selects the type of sensitivity, and one register selects which
edges are significant for edge-sensitivity.
Output Mode
Output mode is used for transmitting video or other data with
up to three output frame syncs. Typically, a single frame sync is
appropriate for data converter applications, whereas two or
three frame syncs could be used for sending video with hard-
ware signaling.
PARALLEL PERIPHERAL INTERFACE
The processor provides a parallel peripheral interface (PPI) that
can connect directly to parallel A/D and D/A converters, video
encoders and decoders, and other general-purpose peripherals.
The PPI consists of a dedicated input clock pin, up to three
frame synchronization pins, and up to 16 data pins. The input
clock supports parallel data rates up to half the system clock rate
and the synchronization signals can be configured as either
inputs or outputs.
ITU-R 656 Mode Descriptions
The ITU-R 656 modes of the PPI are intended to suit a wide
variety of video capture, processing, and transmission applica-
tions. Three distinct submodes are supported:
• Active video only mode
• Vertical blanking only mode
• Entire field mode
The PPI supports a variety of general-purpose and ITU-R 656
modes of operation. In general-purpose mode, the PPI provides
half-duplex, bi-directional data transfer with up to 16 bits of
data. Up to three frame synchronization signals are also pro-
vided. In ITU-R 656 mode, the PPI provides half-duplex bi-
directional transfer of 8- or 10-bit video data. Additionally, on-
chip decode of embedded start-of-line (SOL) and start-of-field
(SOF) preamble packets is supported.
Active Video Only Mode
Active video only mode is used when only the active video por-
tion of a field is of interest and not any of the blanking intervals.
The PPI does not read in any data between the end of active
video (EAV) and start of active video (SAV) preamble symbols,
or any data present during the vertical blanking intervals. In this
mode, the control byte sequences are not stored to memory;
they are filtered by the PPI. After synchronizing to the start of
Field 1, the PPI ignores incoming samples until it sees an SAV
code. The user specifies the number of active video lines per
frame (in PPI_COUNT register).
General-Purpose Mode Descriptions
The general-purpose modes of the PPI are intended to suit a
wide variety of data capture and transmission applications.
Three distinct submodes are supported:
• Input mode – Frame syncs and data are inputs into the PPI.
Vertical Blanking Interval Mode
• Frame capture mode – Frame syncs are outputs from the
PPI, but data are inputs.
In this mode, the PPI only transfers vertical blanking interval
(VBI) data.
• Output mode – Frame syncs and data are outputs from the
PPI.
Entire Field Mode
In this mode, the entire incoming bit stream is read in through
the PPI. This includes active video, control preamble sequences,
and ancillary data that may be embedded in horizontal and ver-
tical blanking intervals. Data transfer starts immediately after
synchronization to Field 1. Data is transferred to or from the
synchronous channels through eight DMA engines that work
autonomously from the processor core.
Input Mode
Input mode is intended for ADC applications, as well as video
communication with hardware signaling. In its simplest form,
PPI_FS1 is an external frame sync input that controls when to
read data. The PPI_DELAY MMR allows for a delay (in
PPI_CLK cycles) between reception of this frame sync and the
initiation of data reads. The number of input data samples is
user programmable and defined by the contents of the
PPI_COUNT register. The PPI supports 8-bit and 10-bit
through 16-bit data, programmable in the PPI_CONTROL
register.
DYNAMIC POWER MANAGEMENT
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor pro-
vides four operating modes, each with a different performance/
power profile. In addition, dynamic power management pro-
vides the control functions to dynamically alter the processor
core supply voltage, further reducing power dissipation. Control
of clocking to each of the processor peripherals also reduces
power consumption. See Table 4 for a summary of the power
settings for each mode.
Rev. E
|
Page 11 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
interrupt causes the processor to transition to the active mode.
Assertion of RESET while in deep sleep mode causes the proces-
sor to transition to the full-on mode.
Full-On Operating Mode—Maximum Performance
In the full-on mode, the PLL is enabled and is not bypassed,
providing capability for maximum operational frequency. This
is the power-up default execution state in which maximum per-
formance can be achieved. The processor core and all enabled
peripherals run at full speed.
Hibernate State—Maximum Static Power Savings
The hibernate state maximizes static power savings by disabling
the voltage and clocks to the processor core (CCLK) and to all
the synchronous peripherals (SCLK). The internal voltage regu-
lator for the processor can be shut off by writing b#00 to
the FREQ bits of the VR_CTL register. In addition to disabling
the clocks, this sets the internal power supply voltage (VDDINT) to
0 V to provide the lowest static power dissipation. Any critical
information stored internally (memory contents, register con-
tents, etc.) must be written to a nonvolatile storage device prior
to removing power if the processor state is to be preserved.
Since VDDEXT is still supplied in this mode, all of the external pins
three-state, unless otherwise specified. This allows other devices
that may be connected to the processor to still have power
applied without drawing unwanted current. The internal supply
regulator can be woken up either by a real-time clock wakeup or
by asserting the RESET pin.
Active Operating Mode—Moderate Power Savings
In the active mode, the PLL is enabled but bypassed. Because the
PLL is bypassed, the processor’s core clock (CCLK) and system
clock (SCLK) run at the input clock (CLKIN) frequency. In this
mode, the CLKIN to CCLK multiplier ratio can be changed,
although the changes are not realized until the full-on mode is
entered. DMA access is available to appropriately configured L1
memories.
In the active mode, it is possible to disable the PLL through the
PLL control register (PLL_CTL). If disabled, the PLL must be
re-enabled before transitioning to the full-on or sleep modes.
Table 4. Power Settings
Core
Clock
System
Clock
Power Savings
PLL
Core
Power
As shown in Table 5, the ADSP-BF531/ADSP-BF532/
ADSP-BF533 processor supports three different power
Mode
Full-On
Active
PLL
Bypassed (CCLK) (SCLK)
Enabled No
Enabled Enabled On
domains. The use of multiple power domains maximizes flexi-
bility, while maintaining compliance with industry standards
and conventions. By isolating the internal logic of the processor
into its own power domain, separate from the RTC and other
I/O, the processor can take advantage of dynamic power man-
agement without affecting the RTC or other I/O devices. There
are no sequencing requirements for the various power domains.
Enabled/ Yes
Disabled
Enabled Enabled On
Sleep
Enabled
Disabled Enabled On
Disabled Disabled On
Disabled Disabled Off
Deep Sleep Disabled
Hibernate Disabled
Sleep Operating Mode—High Dynamic Power Savings
Table 5. Power Domains
The sleep mode reduces dynamic power dissipation by disabling
the clock to the processor core (CCLK). The PLL and system
clock (SCLK), however, continue to operate in this mode. Typi-
cally an external event or RTC activity will wake up the
processor. When in the sleep mode, assertion of wakeup will
cause the processor to sense the value of the BYPASS bit in the
PLL control register (PLL_CTL). If BYPASS is disabled, the pro-
cessor will transition to the full-on mode. If BYPASS is enabled,
the processor will transition to the active mode.
Power Domain
VDD Range
VDDINT
All internal logic, except RTC
RTC internal logic and crystal I/O
All other I/O
VDDRTC
VDDEXT
The power dissipated by a processor is largely a function of the
clock frequency of the processor and the square of the operating
voltage. For example, reducing the clock frequency by 25%
results in a 25% reduction in dynamic power dissipation, while
reducing the voltage by 25% reduces dynamic power dissipation
by more than 40%. Further, these power savings are additive, in
that if the clock frequency and supply voltage are both reduced,
the power savings can be dramatic.
When in the sleep mode, system DMA access to L1 memory is
not supported.
Deep Sleep Operating Mode—Maximum Dynamic Power
Savings
The deep sleep mode maximizes dynamic power savings by dis-
abling the clocks to the processor core (CCLK) and to all
synchronous peripherals (SCLK). Asynchronous peripherals,
such as the RTC, may still be running but will not be able to
access internal resources or external memory. This powered-
down mode can only be exited by assertion of the reset interrupt
(RESET) or by an asynchronous interrupt generated by the
RTC. When in deep sleep mode, an RTC asynchronous
The dynamic power management feature of the ADSP-BF531/
ADSP-BF532/ADSP-BF533 processor allows both the proces-
sor’s input voltage (VDDINT) and clock frequency (fCCLK) to be
dynamically controlled.
The savings in power dissipation can be modeled using the
power savings factor and % power savings calculations.
Rev. E
|
Page 12 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
The power savings factor is calculated as:
Voltage Regulator Layout Guidelines
power savings factor
Regulator external component placement, board routing, and
bypass capacitors all have a significant effect on noise injected
into the other analog circuits on-chip. The VROUT1-0 traces
and voltage regulator external components should be consid-
ered as noise sources when doing board layout and should not
be routed or placed near sensitive circuits or components on the
board. All internal and I/O power supplies should be well
bypassed with bypass capacitors placed as close to the
ADSP-BF531/ADSP-BF532/ADSP-BF533 processors as
possible.
2
fCCLKRED
---------------------
fCCLKNOM
VDDINTRED
--------------------------
VDDINTNOM
tRED
----------
tNOM
⎛
⎝
⎞
⎠
⎛
⎝
⎞
⎠
=
×
×
where the variables in the equation are:
f
CCLKNOM is the nominal core clock frequency
CCLKRED is the reduced core clock frequency
f
V
V
DDINTNOM is the nominal internal supply voltage
DDINTRED is the reduced internal supply voltage
For further details on the on-chip voltage regulator and related
board design guidelines, see the Switching Regulator Design
Considerations for ADSP-BF533 Blackfin Processors (EE-228)
applications note on the Analog Devices web site (www.ana-
log.com)—use site search on “EE-228”.
t
NOM is the duration running at fCCLKNOM
RED is the duration running at fCCLKRED
t
The percent power savings is calculated as:
% power savings = (1 – power savings factor) × 100%
CLOCK SIGNALS
VOLTAGE REGULATION
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor can be
clocked by an external crystal, a sine wave input, or a buffered,
shaped clock derived from an external clock oscillator.
The Blackfin processor provides an on-chip voltage regulator
that can generate appropriate VDDINT voltage levels from the
V
DDEXT supply. See Operating Conditions on Page 21 for regula-
If an external clock is used, it should be a TTL compatible signal
and must not be halted, changed, or operated below the speci-
fied frequency during normal operation. This signal is
connected to the processor’s CLKIN pin. When an external
clock is used, the XTAL pin must be left unconnected.
tor tolerances and acceptable VDDEXT ranges for specific models.
Figure 7 shows the typical external components required to
complete the power management system. The regulator con-
trols the internal logic voltage levels and is programmable with
the voltage regulator control register (VR_CTL) in increments
of 50 mV. To reduce standby power consumption, the internal
voltage regulator can be programmed to remove power to the
processor core while keeping I/O power (VDDEXT) supplied. While
in the hibernate state, I/O power is still being applied, eliminat-
ing the need for external buffers. The voltage regulator can be
activated from this power-down state either through an RTC
wakeup or by asserting RESET, both of which will then initiate a
boot sequence. The regulator can also be disabled and bypassed
at the user’s discretion.
Alternatively, because the ADSP-BF531/ADSP-BF532/
ADSP-BF533 processor includes an on-chip oscillator circuit,
an external crystal may be used. For fundamental frequency
operation, use the circuit shown in Figure 8.
Blackfin
CLKOUT
TO PLL CIRCUITRY
EN
SET OF DECOUPLING
CAPACITORS
2.25V TO 3.6V
INPUT VOLTAGE
RANGE
V
DDEXT
(LOW-INDUCTANCE)
CLKIN
XTAL
V
V
DDEXT
DDINT
+
FOR OVERTONE
OPERATION ONLY:
100µF
10µH
100nF
18pF*
18pF*
+
+
100µF
FDS9431A
NOTE: VALUES MARKED WITH * MUST BE CUSTOMIZED
DEPENDING ON THE CRYSTAL AND LAYOUT. PLEASE
ANALYZE CAREFULLY.
100µF
10µF
LOW ESR
ZHCS1000
VR
VR
OUT
OUT
Figure 8. External Crystal Connections
SHORT AND LOW-
INDUCTANCE WIRE
A parallel-resonant, fundamental frequency, microprocessor-
grade crystal is connected across the CLKIN and XTAL pins.
The on-chip resistance between CLKIN and the XTAL pin is in
the 500 kΩ range. Further parallel resistors are typically not rec-
ommended. The two capacitors and the series resistor shown in
Figure 8 fine tune the phase and amplitude of the sine
NOTE: DESIGNER SHOULD MINIMIZE
TRACE LENGTH TO FDS9431A.
GND
Figure 7. Voltage Regulator Circuit
Rev. E
|
Page 13 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
frequency. The capacitor and resistor values shown in Figure 8
are typical values only. The capacitor values are dependent upon
the crystal manufacturer's load capacitance recommendations
and the physical PCB layout. The resistor value depends on the
drive level specified by the crystal manufacturer. System designs
should verify the customized values based on careful investiga-
tion on multiple devices over the allowed temperature range.
to the PLL divisor register (PLL_DIV). When the SSEL value is
changed, it will affect all the peripherals that derive their clock
signals from the SCLK signal.
The core clock (CCLK) frequency can also be dynamically
changed by means of the CSEL1–0 bits of the PLL_DIV register.
Supported CCLK divider ratios are 1, 2, 4, and 8, as shown in
Table 7. This programmable core clock capability is useful for
fast core frequency modifications.
A third-overtone crystal can be used at frequencies above
25 MHz. The circuit is then modified to ensure crystal operation
only at the third overtone, by adding a tuned inductor circuit as
shown in Figure 8.
Table 7. Core Clock Ratios
Example Frequency Ratios
As shown in Figure 9, the core clock (CCLK) and system
peripheral clock (SCLK) are derived from the input clock
(CLKIN) signal. An on-chip PLL is capable of multiplying the
CLKIN signal by a user programmable 0.5× to 64× multiplica-
tion factor (bounded by specified minimum and maximum
VCO frequencies). The default multiplier is 10×, but it can be
modified by a software instruction sequence. On-the-fly
frequency changes can be effected by simply writing to the
PLL_DIV register.
(MHz)
VCO
300
Signal Name Divider Ratio
CSEL1–0
VCO/CCLK
CCLK
300
150
100
25
00
01
10
11
1:1
2:1
4:1
8:1
300
400
200
BOOTING MODES
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor has
two mechanisms (listed in Table 8) for automatically loading
internal L1 instruction memory after a reset. A third mode is
provided to execute from external memory, bypassing the boot
sequence.
“FINE” ADJUSTMENT
REQUIRES PLL SEQUENCING
“COARSE” ADJUSTMENT
ON-THE-FLY
÷ 1, 2, 4, 8
CCLK
SCLK
PLL
0.5× to 64×
CLKIN
Table 8. Booting Modes
VCO
÷ 1 to 15
BMODE1–0
Description
00
Executefrom16-bitexternalmemory(bypass
boot ROM)
SCLK ≤ CCLK
01
10
11
Boot from 8-bit or 16-bit FLASH
SCLK ≤ 133 MHz
Boot from serial master connected to SPI
Figure 9. Frequency Modification Methods
Boot from serial slave EEPROM /flash (8-,16-,
or 24-bit address range, or Atmel AT45DB041,
AT45DB081, or AT45DB161serial flash)
All on-chip peripherals are clocked by the system clock (SCLK).
The system clock frequency is programmable by means of the
SSEL3–0 bits of the PLL_DIV register. The values programmed
into the SSEL fields define a divide ratio between the PLL output
(VCO) and the system clock. SCLK divider values are 1 through
15. Table 6 illustrates typical system clock ratios.
The BMODE pins of the reset configuration register, sampled
during power-on resets and software-initiated resets, imple-
ment the following modes:
• Execute from 16-bit external memory – Execution starts
from address 0x2000 0000 with 16-bit packing. The boot
ROM is bypassed in this mode. All configuration settings
are set for the slowest device possible (3-cycle hold time;
15-cycle R/W access times; 4-cycle setup).
Table 6. Example System Clock Ratios
Example Frequency Ratios
(MHz)
Signal Name Divider Ratio
SSEL3–0
VCO/SCLK
VCO
100
400
500
SCLK
100
133
50
• Boot from 8-bit or 16-bit external flash memory – The flash
boot routine located in boot ROM memory space is set up
using asynchronous Memory Bank 0. All configuration set-
tings are set for the slowest device possible (3-cycle hold
time; 15-cycle R/W access times; 4-cycle setup).
0001
1:1
0011
3:1
1010
10:1
The maximum frequency of the system clock is fSCLK. The divisor
ratio must be chosen to limit the system clock frequency to its
maximum of fSCLK. The SSEL value can be changed dynamically
without any PLL lock latencies by writing the appropriate values
• Boot from SPI serial EEPROM/flash (8-, 16-, or 24-bit
addressable, or Atmel AT45DB041, AT45DB081, or
AT45DB161) – The SPI uses the PF2 output pin to select a
single SPI EEPROM/flash device, submits a read command
and successive address bytes (0x00) until a valid 8-, 16-, or
Rev. E
|
Page 14 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
24-bit addressable EEPROM/flash device is detected, and
begins clocking data into the processor at the beginning of
L1 instruction memory.
• Microcontroller features, such as arbitrary bit and bit-field
manipulation, insertion, and extraction; integer operations
on 8-, 16-, and 32-bit data types; and separate user and
supervisor stack pointers.
• Boot from SPI serial master – The Blackfin processor oper-
ates in SPI slave mode and is configured to receive the bytes
of the LDR file from an SPI host (master) agent. To hold off
the host device from transmitting while the boot ROM is
busy, the Blackfin processor asserts a GPIO pin, called host
wait (HWAIT), to signal the host device not to send any
more bytes until the flag is deasserted. The GPIO pin is
chosen by the user and this information is transferred to
the Blackfin processor via bits[10:5] of the FLAG header in
the LDR image.
• Code density enhancements, which include intermixing of
16-bit and 32-bit instructions (no mode switching, no code
segregation). Frequently used instructions are encoded in
16 bits.
DEVELOPMENT TOOLS
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor is sup-
ported by a complete set of CROSSCORE®† software and
hardware development tools, including Analog Devices emula-
tors and VisualDSP++®‡ development environment. The same
emulator hardware that supports other Blackfin processors also
fully emulates the ADSP-BF531/ADSP-BF532/ADSP-BF533
processor.
For each of the boot modes, a 10-byte header is first read from
an external memory device. The header specifies the number of
bytes to be transferred and the memory destination address.
Multiple memory blocks may be loaded by any boot sequence.
Once all blocks are loaded, program execution commences from
the start of L1 instruction SRAM.
The VisualDSP++ project management environment lets pro-
grammers develop and debug an application. This environment
includes an easy to use assembler (which is based on an alge-
braic syntax), an archiver (librarian/library builder), a linker, a
loader, a cycle-accurate instruction level simulator, a C/C++
compiler, and a C/C++ runtime library that includes DSP and
mathematical functions. A key point for these tools is C/C++
code efficiency. The compiler has been developed for efficient
translation of C/C++ code to processor assembly. The processor
has architectural features that improve the efficiency of com-
piled C/C++ code.
In addition, Bit 4 of the reset configuration register can be set by
application code to bypass the normal boot sequence during a
software reset. For this case, the processor jumps directly to the
beginning of L1 instruction memory.
INSTRUCTION SET DESCRIPTION
The Blackfin processor family assembly language instruction set
employs an algebraic syntax designed for ease of coding and
readability. The instructions have been specifically tuned to pro-
vide a flexible, densely encoded instruction set that compiles to
a very small final memory size. The instruction set also provides
fully featured multifunction instructions that allow the pro-
grammer to use many of the processor core resources in a single
instruction. Coupled with many features more often seen on
microcontrollers, this instruction set is very efficient when com-
piling C and C++ source code. In addition, the architecture
supports both user (algorithm/application code) and supervisor
(O/S kernel, device drivers, debuggers, ISRs) modes of opera-
tion, allowing multiple levels of access to core processor
resources.
The VisualDSP++ debugger has a number of important fea-
tures. Data visualization is enhanced by a plotting package that
offers a significant level of flexibility. This graphical representa-
tion of user data enables the programmer to quickly determine
the performance of an algorithm. As algorithms grow in com-
plexity, this capability can have increasing significance on the
designer’s development schedule, increasing productivity.
Statistical profiling enables the programmer to nonintrusively
poll the processor as it is running the program. This feature,
unique to VisualDSP++, enables the software developer to pas-
sively gather important code execution metrics without
interrupting the real-time characteristics of the program. Essen-
tially, the developer can identify bottlenecks in software quickly
and efficiently. By using the profiler, the programmer can focus
on those areas in the program that impact performance and take
corrective action.
The assembly language, which takes advantage of the proces-
sor’s unique architecture, offers the following advantages:
• Seamlessly integrated DSP/CPU features are optimized for
both 8-bit and 16-bit operations.
• A multi-issue load/store modified Harvard architecture,
which supports two 16-bit MAC or four 8-bit ALU + two
load/store + two pointer updates per cycle.
Debugging both C/C++ and assembly programs with the
VisualDSP++ debugger, programmers can:
• View mixed C/C++ and assembly code (interleaved source
and object information).
• All registers, I/O, and memory are mapped into a unified
4G byte memory space, providing a simplified program-
ming model.
• Insert breakpoints.
• Set conditional breakpoints on registers, memory,
and stacks.
† CROSSCORE is a registered trademark of Analog Devices, Inc.
‡ VisualDSP++ is a registered trademark of Analog Devices, Inc.
Rev. E
|
Page 15 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
• Trace instruction execution.
Hardware tools include Blackfin processor PC plug-in cards.
Third party software tools include DSP libraries, real-time oper-
ating systems, and block diagram design tools.
• Perform linear or statistical profiling of program execution.
• Fill, dump, and graphically plot the contents of memory.
• Perform source level debugging.
EZ-KIT Lite Evaluation Board
Analog Devices offers a range of EZ-KIT Lite® evaluation plat-
forms to use as a cost effective method to learn more about
developing or prototyping applications with Analog Devices
processors, platforms, and software tools. Each EZ-KIT Lite
includes an evaluation board along with an evaluation suite of
the VisualDSP++ development and debugging environment
with the C/C++ compiler, assembler, and linker. Also included
are sample application programs, power supply, and a USB
cable. All evaluation versions of the software tools are limited
for use only with the EZ-KIT Lite product.
• Create custom debugger windows.
The VisualDSP++ IDDE lets programmers define and manage
software development. Its dialog boxes and property pages let
programmers configure and manage all of the Blackfin develop-
ment tools, including the color syntax highlighting in the
VisualDSP++ editor. This capability permits programmers to:
• Control how the development tools process inputs and
generate outputs
• Maintain a one-to-one correspondence with the tool’s
command line switches
The USB controller on the EZ-KIT Lite board connects the
board to the USB port of the user’s PC, enabling the Visu-
alDSP++ evaluation suite to emulate the on-board processor in-
circuit. This permits the customer to download, execute, and
debug programs for the EZ-KIT Lite system. It also allows in-
circuit programming of the on-board flash device to store user-
specific boot code, enabling the board to run as a standalone
unit without being connected to the PC.
The VisualDSP++ Kernel (VDK) incorporates scheduling and
resource management tailored specifically to address the mem-
ory and timing constraints of DSP programming. These
capabilities enable engineers to develop code more effectively,
eliminating the need to start from the very beginning, when
developing new application code. The VDK features include
threads, critical and unscheduled regions, semaphores, events,
and device flags. The VDK also supports priority-based, pre-
emptive, cooperative, and time-sliced scheduling approaches. In
addition, the VDK was designed to be scalable. If the application
does not use a specific feature, the support code for that feature
is excluded from the target system.
With a full version of VisualDSP++ installed (sold separately),
engineers can develop software for the EZ-KIT Lite or any cus-
tom defined system. Connecting one of Analog Devices JTAG
emulators to the EZ-KIT Lite board enables high speed, non-
intrusive emulation.
For evaluation of ADSP-BF531/ADSP-BF532/ADSP-BF533
processors, use the EZ-KIT Lite board available from Analog
Devices. Order part number ADDS-BF533-EZLITE. The board
comes with on-chip emulation capabilities and is equipped to
enable software development. Multiple daughter cards are
available.
Because the VDK is a library, a developer can decide whether to
use it or not. The VDK is integrated into the VisualDSP++
development environment, but can also be used via standard
command line tools. When the VDK is used, the development
environment assists the developer with many error prone tasks
and assists in managing system resources, automating the gen-
eration of various VDK-based objects, and visualizing the
system state, when debugging an application that uses the VDK.
DESIGNING AN EMULATOR-COMPATIBLE
PROCESSOR BOARD
Use the expert linker to visually manipulate the placement of
code and data on the embedded system. View memory utiliza-
tion in a color coded graphical form, easily move code and data
to different areas of the processor or external memory with the
drag of the mouse, and examine runtime stack and heap usage.
The expert linker is fully compatible with existing linker defini-
tion file (LDF), allowing the developer to move between the
graphical and textual environments.
The Analog Devices family of emulators are tools that every sys-
tem developer needs to test and debug hardware and software
systems. Analog Devices has supplied an IEEE 1149.1 JTAG test
access port (TAP) on each JTAG processor. The emulator uses
the TAP to access the internal features of the processor, allow-
ing the developer to load code, set breakpoints, observe
variables, observe memory, and examine registers. The proces-
sor must be halted to send data and commands, but once an
operation has been completed by the emulator, the processor
system is set running at full speed with no impact on
system timing.
Analog Devices emulators use the IEEE 1149.1 JTAG test access
port of the ADSP-BF531/ADSP-BF532/ADSP-BF533 processor
to monitor and control the target board processor during emu-
lation. The emulator provides full speed emulation, allowing
inspection and modification of memory, registers, and proces-
sor stacks. Nonintrusive in-circuit emulation is assured by the
use of the processor’s JTAG interface—the emulator does not
affect target system loading or timing.
To use these emulators, the target board must include a header
that connects the processor’s JTAG port to the emulator.
In addition to the software and hardware development tools
available from Analog Devices, third parties provide a wide
range of tools supporting the Blackfin processor family.
Rev. E
|
Page 16 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
For details on target board design issues including mechanical
layout, single processor connections, multiprocessor scan
chains, signal buffering, signal termination, and emulator pod
logic, see the Analog Devices JTAG Emulation Technical Refer-
ence (EE-68) on the Analog Devices website
(www.analog.com)—use site search on “EE-68.” This document
is updated regularly to keep pace with improvements to emula-
tor support.
RELATED DOCUMENTS
The following publications that describe the ADSP-BF531/
ADSP-BF532/ADSP-BF533 processors (and related processors)
can be ordered from any Analog Devices sales office or accessed
electronically on our website:
• Getting Started With Blackfin Processors
• ADSP-BF533 Blackfin Processor Hardware Reference
• ADSP-BF53x/BF56x Blackfin Processor Programming
Reference
• ADSP-BF531 Blackfin Processor Anomaly List
• ADSP-BF532 Blackfin Processor Anomaly List
• ADSP-BF533 Blackfin Processor Anomaly List
Rev. E
|
Page 17 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
PIN DESCRIPTIONS
ADSP-BF531/ADSP-BF532/ADSP-BF533 processor pin defini-
tions are listed in Table 9.
If BR is active, then the memory pins are also three-stated. All
unused I/O pins have their input buffers disabled with the
exception of the pins that need pull-ups or pull-downs as noted
in the table footnotes.
All pins are three-stated during and immediately after reset,
except the memory interface, asynchronous memory control,
and synchronous memory control pins, which are driven high.
In order to maintain maximum functionality and reduce pack-
age size and pin count, some pins have dual, multiplexed
functionality. In cases where pin functionality is reconfigurable,
the default state is shown in plain text, while alternate function-
ality is shown in italics.
Table 9. Pin Descriptions
Driver
Pin Name
Type Function
Type1
Memory Interface
ADDR19–1
O
Address Bus for Async/Sync Access
A
A
A
DATA15–0
I/O Data Bus for Async/Sync Access
ABE1–0/SDQM1–0
O
I
Byte Enables/Data Masks for Async/Sync Access
Bus Request (This pin should be pulled HIGH if not used.)
Bus Grant
BR
BG
O
O
A
A
BGH
Bus Grant Hang
Asynchronous Memory Control
AMS3–0
O
I
Bank Select
A
ARDY
Hardware Ready Control (This pin should be pulled HIGH if not used.)
AOE
O
O
O
Output Enable
Read Enable
Write Enable
A
A
A
ARE
AWE
Synchronous Memory Control
SRAS
O
O
O
O
O
O
O
Row Address Strobe
Column Address Strobe
Write Enable
A
A
A
A
B
SCAS
SWE
SCKE
Clock Enable
CLKOUT
SA10
Clock Output
A10 Pin
A
A
SMS
Bank Select
Timers
TMR0
I/O Timer 0
C
C
C
TMR1/PPI_FS1
TMR2/PPI_FS2
PPI Port
PPI3–0
I/O Timer 1/PPI Frame Sync1
I/O Timer 2/PPI Frame Sync2
I/O PPI3–0
C
PPI_CLK/TMRCLK
I
PPI Clock/External Timer Reference
Rev. E
|
Page 18 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
Table 9. Pin Descriptions (Continued)
Driver
Type1
Pin Name
Type Function
Port F: GPIO/Parallel Peripheral
Interface Port/SPI/Timers
PF0/SPISS
PF1/SPISEL1/TACLK
PF2/SPISEL2
PF3/SPISEL3/PPI_FS3
PF4/SPISEL4/PPI15
PF5/SPISEL5/PPI14
PF6/SPISEL6/PPI13
PF7/SPISEL7/PPI12
PF8/PPI11
PF9/PPI10
PF10/PPI9
PF11/PPI8
PF12/PPI7
PF13/PPI6
PF14/PPI5
PF15/PPI4
JTAG Port
I/O GPIO/SPI Slave Select Input
C
I/O GPIO/SPI Slave Select Enable 1/Timer Alternate Clock Input
I/O GPIO/SPI Slave Select Enable 2
I/O GPIO/SPI Slave Select Enable 3/PPI Frame Sync 3
I/O GPIO/SPI Slave Select Enable 4/PPI 15
I/O GPIO/SPI Slave Select Enable 5/PPI 14
I/O GPIO/SPI Slave Select Enable 6/PPI 13
I/O GPIO/SPI Slave Select Enable 7/PPI 12
I/O GPIO/PPI 11
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
I/O GPIO/PPI 10
I/O GPIO/PPI 9
I/O GPIO/PPI 8
I/O GPIO/PPI 7
I/O GPIO/PPI 6
I/O GPIO/PPI 5
I/O GPIO/PPI 4
TCK
I
JTAG Clock
TDO
O
I
JTAG Serial Data Out
C
TDI
JTAG Serial Data In
TMS
I
JTAG Mode Select
TRST
I
JTAG Reset (This pin should be pulled LOW if JTAG is not used.)
Emulation Output
EMU
O
C
C
SPI Port
MOSI
I/O Master Out Slave In
MISO
I/O Master In Slave Out (This pin should be pulled HIGH through a 4.7 kΩ resistor if booting via the C
SPI port.)
SCK
I/O SPI Clock
D
Serial Ports
RSCLK0
RFS0
I/O SPORT0 Receive Serial Clock
I/O SPORT0 Receive Frame Sync
D
C
DR0PRI
DR0SEC
TSCLK0
TFS0
I
I
SPORT0 Receive Data Primary
SPORT0 Receive Data Secondary
I/O SPORT0 Transmit Serial Clock
I/O SPORT0 Transmit Frame Sync
D
C
C
C
D
DT0PRI
DT0SEC
RSCLK1
O
O
SPORT0 Transmit Data Primary
SPORT0 Transmit Data Secondary
I/O SPORT1 Receive Serial Clock
Rev. E
|
Page 19 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
Table 9. Pin Descriptions (Continued)
Driver
Type1
Pin Name
RFS1
Type Function
I/O SPORT1 Receive Frame Sync
C
DR1PRI
DR1SEC
TSCLK1
TFS1
I
I
SPORT1 Receive Data Primary
SPORT1 Receive Data Secondary
I/O SPORT1 Transmit Serial Clock
I/O SPORT1 Transmit Frame Sync
D
C
C
C
DT1PRI
DT1SEC
UART Port
RX
O
O
SPORT1 Transmit Data Primary
SPORT1 Transmit Data Secondary
I
UART Receive
UART Transmit
TX
O
C
Real-Time Clock
RTXI
I
RTC Crystal Input (This pin should be pulled LOW when not used.)
RTC Crystal Output
RTXO
O
Clock
CLKIN
I
Clock/Crystal Input (This pin needs to be at a level or clocking.)
Crystal Output
XTAL
O
Mode Controls
RESET
I
I
I
Reset (This pin is always active during core power-on.)
NMI
Nonmaskable Interrupt (This pin should be pulled LOW when not used.)
Boot Mode Strap (These pins must be pulled to the state required for the desired boot mode.)
BMODE1–0
Voltage Regulator
VROUT1–0
Supplies
VDDEXT
O
External FET Drive
P
P
P
G
I/O Power Supply
VDDINT
Core Power Supply
Real-Time Clock Power Supply
External Ground
VDDRTC
GND
1 Refer to Figure 30 on Page 43 to Figure 41 on Page 45.
Rev. E
|
Page 20 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
SPECIFICATIONS
Component specifications are subject to change
without notice.
OPERATING CONDITIONS
Parameter
Conditions
Min Nominal Max Unit
VDDINT Internal Supply Voltage1
VDDINT Internal Supply Voltage1
VDDINT Internal Supply Voltage1
VDDINT Internal Supply Voltage1
VDDEXT External Supply Voltage
VDDEXT External Supply Voltage
Nonautomotive 400 MHz and 500 MHz speed grade models2
Nonautomotive 533 MHz speed grade models2
600 MHz speed grade models2
Automotive grade models2
Nonautomotive grade models2
0.8 1.2
0.8 1.25
0.8 1.30
0.95 1.2
1.32
V
1.375 V
1.45
1.32
V
V
V
V
V
1.75 1.8/2.5/3.3 3.6
2.7 3.3 3.6
1.75 1.8/2.5/3.3 3.6
Automotive grade models2
Nonautomotive grade models2
VDDRTC Real-Time Clock
Power Supply Voltage
VDDRTC Real-Time Clock
Power Supply Voltage
Automotive grade models2
2.7 3.3
3.6
V
VIH
VIH
High Level Input Voltage3, 4 VDDEXT =1.85 V
High Level Input Voltage3, 4 VDDEXT =Maximum
1.3
2.0
2.2
–0.3
–0.3
0
3.6
V
V
V
V
V
3.6
VIHCLKIN High Level Input Voltage5
VDDEXT =Maximum
3.6
VIL
VIL
TJ
TJ
TJ
TJ
TJ
TJ
Low Level Input Voltage3, 6
Low Level Input Voltage3, 6
Junction Temperature
Junction Temperature
Junction Temperature
Junction Temperature
Junction Temperature
Junction Temperature
VDDEXT =1.75 V
+0.3
+0.6
VDDEXT =2.25 V
160-Ball Chip Scale Ball Grid Array (CSP_BGA) @ TAMBIENT = 0°C to +70°C
+95 °C
+105 °C
+125 °C
+125 °C
+105 °C
+100 °C
160-Ball Chip Scale Ball Grid Array (CSP_BGA) @ TAMBIENT = –40°C to +85°C –40
160-Ball Chip Scale Ball Grid Array (CSP_BGA) @ TAMBIENT = –40°C to +105°C –40
169-Ball Plastic Ball Grid Array (PBGA) @ TAMBIENT = –40°C to +105°C
169-Ball Plastic Ball Grid Array (PBGA) @ TAMBIENT = –40°C to +85°C
176-Lead Quad Flatpack (LQFP) @ TAMBIENT = –40°C to +85°C
–40
–40
–40
1 The regulator can generate VDDINT at levels of 0.85 V to 1.2 V with –5% to +10% tolerance, 1.25 V with–4% to +10% tolerance, and 1.3 V with –0% to +10% tolerance.
2 See Ordering Guide on Page 59.
3 Applies to all input and bidirectional pins except CLKIN.
4 The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors are 3.3 V tolerant (always accepts up to 3.6 V maximum VIH), but voltage compliance (on outputs, VOH) depends on
the input VDDEXT, because VOH (maximum) approximately equals VDDEXT (maximum). This 3.3 V tolerance applies to bidirectional pins (DATA15–0, TMR2–0, PF15–0, PPI3–0,
RSCLK1–0, TSCLK1–0, RFS1–0, TFS1–0, MOSI, MISO, SCK) and input only pins (BR, ARDY, PPI_CLK, DR0PRI, DR0SEC, DR1PRI, DR1SEC, RX, RTXI, TCK, TDI, TMS,
TRST, CLKIN, RESET, NMI, and BMODE1–0).
5 Applies to CLKIN pin only.
6 Applies to all input and bidirectional pins.
Rev. E
|
Page 21 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
ELECTRICAL CHARACTERISTICS
Low Power1
High Speed2
Parameter
Test Conditions
Min Typical Max Min Typical Max Unit
VOH
VOH
VOH
VOL
VOL
IIH
High Level Output Voltage3
High Level Output Voltage3
High Level Output Voltage3
Low Level Output Voltage3
Low Level Output Voltage3
High Level Input Current4
High Level Input Current JTAG5
Low Level Input Current4
Three-State Leakage Current7
Three-State Leakage Current7
Input Capacitance8
@ VDDEXT = 1.75 V, IOH = –0.5 mA
@ VDDEXT = 2.25 V, IOH = –0.5 mA
@ VDDEXT = 3.0 V, IOH = –0.5 mA
1.5
1.9
2.4
1.5
1.9
2.4
V
V
V
V
V
@ VDDEXT = 1.75 V, IOL = 2.0 mA
0.2
0.2
0.4
@ VDDEXT = 2.25 V/3.0 V, IOL = 2.0 mA
@ VDDEXT = Maximum, VIN = VDD Maximum
@ VDDEXT = Maximum, VIN = VDD Maximum
@ VDDEXT = Maximum, VIN = 0 V
@ VDDEXT = Maximum, VIN = VDD Maximum
@ VDDEXT = Maximum, VIN = 0 V
fIN = 1 MHz, TAMBIENT = 25°C, VIN = 2.5 V
0.4
10.0
50.0
10.0
10.0
10.0
89
10.0 μA
50.0 μA
10.0 μA
10.0 μA
10.0 μA
IIHP
6
IIL
IOZH
6
IOZL
CIN
4
4
89
pF
IDDHIBERNATE
VDDINT Current in Hibernate State
VDDEXT = 3.65 V
50
50
μA
with voltage regulator off (VDDINT = 0 V)
IDDRTC
VDDRTC Current
VDDRTC = 3.3 V, TJUNCTION = 25°C
20
20
μA
10
IDDDEEPSLEEP
VDDINT Current in Deep Sleep Mode VDDINT = 0.8 V, TJUNCTION = 25°C
7.5
10
35
mA
mA
mA
mA
mA
mA
mA
IDDSLEEP
VDDINT Current in Sleep Mode
VDDINT = 0.8 V, TJUNCTION = 25°C, SCLK = 25 MHz
37.5
47
10, 11
IDD
VDDINT Current Dissipation (Typical) VDDINT = 0.8 V, fCCLK = 50 MHz, TJUNCTION = 25°C
VDDINT Current Dissipation (Typical) VDDINT = 1.14 V, fCCLK = 400 MHz, TJUNCTION = 25°C
VDDINT Current Dissipation (Typical) VDDINT = 1.2 V, fCCLK = 500 MHz, TJUNCTION = 25°C
VDDINT Current Dissipation (Typical) VDDINT = 1.2 V, fCCLK = 533 MHz, TJUNCTION = 25°C
VDDINT Current Dissipation (Typical) VDDINT = 1.3 V, fCCLK = 600 MHz, TJUNCTION = 25°C
20
_
_
_
_
_
TYP
TYP
TYP
TYP
TYP
10, 11
10, 11
10, 11
10, 11
IDD
IDD
IDD
IDD
132
198
240
250
308
1 Applies to all 400 MHz speed grade models. See Ordering Guide on Page 59.
2 Applies to all 500 MHz, 533 MHz, and 600 MHz speed grade models. See Ordering Guide on Page 59.
3 Applies to output and bidirectional pins.
4 Applies to input pins except JTAG inputs.
5 Applies to JTAG input pins (TCK, TDI, TMS, TRST).
6 Absolute value.
7 Applies to three-statable pins.
8 Applies to all signal pins.
9 Guaranteed, but not tested.
10See Estimating Power for ADSP-BF531/BF532/BF533 Blackfin Processors (EE-229) on the Analog Devices website (www.analog.com)—use site search on “EE-229.”
11Processor executing 75% dual MAC, 25% ADD with moderate data bus activity.
Rev. E
|
Page 22 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
ABSOLUTE MAXIMUM RATINGS
Stresses greater than those listed in the table may cause perma-
nent damage to the device. These are stress ratings only.
Functional operation of the device at these or any other condi-
tions greater than those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device
reliability.
PACKAGE INFORMATION
The information presented in Figure 10 and Table 11 provides
details about the package branding for the Blackfin processors.
For a complete listing of product availability, see the Ordering
Guide on Page 59.
a
Parameter
Rating
ADSP-BF53x
Internal (Core) Supply Voltage (VDDINT
)
–0.3 V to +1.4 V
–0.5 V to +3.8 V
–0.5 V to +3.8 V
–0.5 V to VDDEXT +0.5 V
200 pF
tppZ-cc
External (I/O) Supply Voltage (VDDEXT
Input Voltage1
)
vvvvvv.x n.n
yyww country_of_origin
Output Voltage Swing
Load Capacitance2
B
Figure 10. Product Information on Package
Storage Temperature Range
Junction Temperature Under Bias
–65 C to +150°C
125°C
Table 11. Package Brand Information
1 Applies to 100% transient duty cycle. For other duty cycles see Table 10.
2 For proper SDRAM controller operation, the maximum load capacitance is 50 pF
(at 3.3 V) or 30 pF (at 2.5 V) for ADDR19–1, DATA15–0, ABE1–0/SDQM1–0,
CLKOUT, SCKE, SA10, SRAS, SCAS, SWE, and SMS.
Brand Key Field Description
ADSP-BF53x Either ADSP-BF531, ADSP-BF532, or ADSP-BF533
t
Temperature Range
Package Type
Table 10. Maximum Duty Cycle for Input Transient Voltage1
pp
VIN Min (V)
–0.50
VIN Max (V)2
+3.80
Maximum Duty Cycle
Z
RoHS Compliant Part
See Ordering Guide
Assembly Lot Code
Silicon Revision
Date Code
100%
40%
25%
15%
10%
–0.70
+4.00
cc
–0.80
+4.10
vvvvvv.x
n.n
–0.90
+4.20
–1.00
+4.30
yyww
1 Applies to all signal pins with the exception of CLKIN, XTAL, VROUT1–0.
2 Only one of the listed options can apply to a particular design.
ESD SENSITIVITY
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can discharge
without detection. Although this product features
patented or proprietary circuitry, damage may occur
on devices subjected to high energy ESD. Therefore,
proper ESD precautions should be take to avoid
performance degradation or loss of functionality.
Rev. E
|
Page 23 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
TIMING SPECIFICATIONS
Table 12 through Table 15 describe the timing requirements for
the ADSP-BF531/ADSP-BF532/ADSP-BF533 processor clocks.
Take care in selecting MSEL, SSEL, and CSEL ratios so as not to
exceed the maximum core clock and system clock as described
in Absolute Maximum Ratings on Page 23, and the voltage con-
trolled oscillator (VCO) operating frequencies described in
Table 14. Table 14 describes phase-locked loop operating
conditions.
Table 12. Core Clock (CCLK) Requirements—400 MHz Models1
TJUNCTION = 125°C
All2 Other TJUNCTION
Parameter
Internal Regulator Setting
Max
400
333
295
Max
400
364
333
280
250
Unit
MHz
MHz
MHz
MHz
MHz
fCCLK
fCCLK
fCCLK
fCCLK
fCCLK
CCLK Frequency (VDDINT =1.14 V Minimum)
1.20 V
1.10 V
1.00 V
0.90 V
0.85 V
CCLK Frequency (VDDINT =1.045 V Minimum)
CCLK Frequency (VDDINT =0.95 V Minimum)
CCLK Frequency (VDDINT =0.85 V Minimum)
CCLK Frequency (VDDINT =0.8 V Minimum)
1 See Ordering Guide on Page 59.
2 See Operating Conditions on Page 21.
Table 13. Core Clock (CCLK) Requirements—500 MHz, 533 MHz, and 600 MHz Models
Parameter
Internal Regulator Setting
Max
600
533
500
444
400
333
250
Unit
MHz
MHz
MHz
MHz
MHz
MHz
MHz
fCCLK
fCCLK
fCCLK
fCCLK
fCCLK
fCCLK
fCCLK
CCLK Frequency (VDDINT =1.3 V Minimum)1
1.30 V
1.25 V
1.20 V
1.10 V
1.00 V
0.90 V
0.85 V
CCLK Frequency (VDDINT =1.2 V Minimum)2
CCLK Frequency (VDDINT =1.14 V Minimum)3
CCLK Frequency (VDDINT =1.045 V Minimum)
CCLK Frequency (VDDINT =0.95 V Minimum)
CCLK Frequency (VDDINT =0.85 V Minimum)
CCLK Frequency (VDDINT =0.8 V Minimum)
1 Applies to 600 MHz models only. See Ordering Guide on Page 59.
2 Applies to 533 MHz and 600 MHz models only. See Ordering Guide on Page 59. 533 MHz models cannot support internal regulator levels above 1.25 V.
3 Applies to 500 MHz, 533 MHz, and 600 MHz models. See Ordering Guide on Page 59. 500 MHz models cannot support internal regulator levels above 1.20 V.
Table 14. Phase-Locked Loop Operating Conditions
Parameter
Min
Max
Unit
fVCO Voltage Controlled Oscillator (VCO) Frequency
50
Maximum fCCLK
MHz
Table 15. System Clock (SCLK) Requirements
VDDEXT = 1.8 V
Max
VDDEXT = 2.5 V/3.3 V
Max
Parameter1
Unit
MBGA/PBGA
fSCLK
CLKOUT/SCLK Frequency (VDDINT ≥ 1.14 V)
CLKOUT/SCLK Frequency (VDDINT < 1.14 V)
100
100
133
100
MHz
MHz
fSCLK
LQFP
fSCLK
CLKOUT/SCLK Frequency (VDDINT ≥ 1.14 V)
CLKOUT/SCLK Frequency (VDDINT < 1.14 V)
100
83
133
83
MHz
MHz
fSCLK
1 tSCLK (= 1/fSCLK) must be greater than or equal to tCCLK
.
Rev. E
|
Page 24 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
Clock and Reset Timing
Table 16 and Figure 11 describe clock and reset operations. Per
Absolute Maximum Ratings on Page 23, combinations of
CLKIN and clock multipliers/divisors must not result in core/
system clocks exceeding the maximum limits allowed for the
processor, including system clock restrictions related to supply
voltage.
Table 16. Clock and Reset Timing
Parameter
Min
Max
Unit
Timing Requirements
tCKIN
CLKIN Period1, 2, 3, 4
25.0
100.0
ns
ns
ns
ns
tCKINL
tCKINH
tWRST
CLKIN Low Pulse
10.0
CLKIN High Pulse
RESET Asserted Pulse Width Low5
10.0
11 tCKIN
1 Applies to PLL bypass mode and PLL nonbypass mode.
2 CLKIN frequency must not change on the fly.
3 Combinations of the CLKIN frequency and the PLL clock multiplier must not exceed the allowed fVCO, fCCLK, and fSCLK settings discussed in Table 12 on Page 24 through
Table 15 on Page 24. Since the default behavior of the PLL is to multiply the CLKIN frequency by 10, the 400 MHz speed grade parts cannot use the full CLKIN period range.
4 If the DF bit in the PLL_CTL register is set, then the maximum tCKIN period is 50 ns.
5 Applies after power-up sequence is complete. At power-up, the processor’s internal phase-locked loop requires no more than 2,000 CLKIN cycles, while RESET is asserted,
assuming stable power supplies and CLKIN (not including start-up time of external clock oscillator).
tCKIN
CLKIN
tCKINL
tCKINH
tWRST
RESET
Figure 11. Clock and Reset Timing
Rev. E
|
Page 25 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
Asynchronous Memory Read Cycle Timing
Table 17. Asynchronous Memory Read Cycle Timing
VDDEXT = 1.8 V
VDDEXT = 2.5 V/3.3 V
Parameter
Min
Max
Min
Max
Unit
Timing Requirements
tSDAT
DATA15–0 Setup Before CLKOUT
DATA15–0 Hold After CLKOUT
ARDY Setup Before CLKOUT
ARDY Hold After CLKOUT
2.1
1.0
4.0
1.0
2.1
0.8
4.0
0.0
ns
ns
ns
ns
tHDAT
tSARDY
tHARDY
Switching Characteristics
tDO
tHO
Output Delay After CLKOUT1
Output Hold After CLKOUT 1
6.0
6.0
ns
ns
1.0
0.8
1 Output pins include AMS3–0, ABE1–0, ADDR19–1, DATA15–0, AOE, ARE.
HOLD
1 CYCLE
SETUP
2 CYCLES
PROGRAMMED READ ACCESS
4 CYCLES
ACCESS EXTENDED
3 CYCLES
CLKOUT
tDO
tHO
AMSx
ABE1–0
ABE, ADDRESS
ADDR19–1
AOE
tDO
tHO
ARE
tHARDY
tSARDY
tHARDY
ARDY
tSARDY
tSDAT
tHDAT
DATA15–0
READ
Figure 12. Asynchronous Memory Read Cycle Timing
Rev. E
|
Page 26 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
Asynchronous Memory Write Cycle Timing
Table 18. Asynchronous Memory Write Cycle Timing
VDDEXT = 1.8 V VDDEXT = 2.5 V/3.3 V
Parameter
Min
Max
Min
Max
Unit
Timing Requirements
tSARDY
tHARDY
ARDY Setup Before CLKOUT
ARDY Hold After CLKOUT
4.0
1.0
4.0
0.0
ns
ns
Switching Characteristics
tDDAT
tENDAT
tDO
DATA15–0 Disable After CLKOUT
6.0
6.0
6.0
6.0
ns
ns
ns
ns
DATA15–0 Enable After CLKOUT
Output Delay After CLKOUT1
Output Hold After CLKOUT 1
1.0
1.0
1.0
0.8
tHO
1 Output pins include AMS3–0, ABE1–0, ADDR19–1, DATA15–0, AOE, AWE.
ACCESS
EXTENDED
1 CYCLE
SETUP
2 CYCLES
HOLD
1 CYCLE
PROGRAMMED WRITE
ACCESS 2 CYCLES
CLKOUT
AMSx
tDO
tHO
ABE1–0
ABE, ADDRESS
ADDR19–1
tDO
tHO
AWE
tHARDY
tSARDY
ARDY
tSARDY
tENDAT
tDDAT
DATA15–0
WRITE DATA
Figure 13. Asynchronous Memory Write Cycle Timing
Rev. E
|
Page 27 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
SDRAM Interface Timing
Table 19. SDRAM Interface Timing1
VDDEXT = 1.8 V
VDDEXT = 2.5 V/3.3 V
Parameter
Min
Max
Min
Max
Unit
Timing Requirements
tSSDAT
tHSDAT
DATA Setup Before CLKOUT
DATA Hold After CLKOUT
2.1
0.8
1.5
0.8
ns
ns
Switching Characteristics
tSCLK
CLKOUT Period2
10.0
2.5
7.5
2.5
2.5
ns
ns
ns
ns
ns
ns
ns
tSCLKH
tSCLKL
tDCAD
tHCAD
tDSDAT
tENSDAT
CLKOUT Width High
CLKOUT Width Low
2.5
Command, ADDR, Data Delay After CLKOUT3
Command, ADDR, Data Hold After CLKOUT1
Data Disable After CLKOUT
Data Enable After CLKOUT
6.0
6.0
4.0
4.0
1.0
1.0
1.0
1.0
1 SDRAM timing for TJUNCTION = 125°C is limited to 100 MHz.
2 Refer to Table 15 on Page 24 for maximum fSCLK at various VDDINT
.
3 Command pins include: SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.
tSCLK
tSCLKH
CLKOUT
tSSDAT
tSCLKL
tHSDAT
DATA(IN)
tDCAD
tDSDAT
tENSDAT
tHCAD
DATA(OUT)
tDCAD
CMND ADDR
(OUT)
tHCAD
NOTE: COMMAND = SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.
Figure 14. SDRAM Interface Timing
Rev. E
|
Page 28 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
External Port Bus Request and Grant Cycle Timing
Table 20 and Figure 15 describe external port bus request and
bus grant operations.
Table 20. External Port Bus Request and Grant Cycle Timing
VDDEXT = 1.8 V
LQFP/PBGA Packages MBGA Package
VDDEXT = 1.8 V VDDEXT = 2.5 V/3.3 V
All Packages
Parameter
Min
Max
Min
Max
Min
Max
Unit
Timing Requirements
tBS BR Asserted to CLKOUT High Setup
tBH CLKOUT High to BR Deasserted Hold Time
Switching Characteristics
4.6
1.0
4.6
1.0
4.6
0.0
ns
ns
tSD CLKOUT Low to AMSx, Address, and ARE/AWE Disable
tSE CLKOUT Low to AMSx, Address, and ARE/AWE Enable
tDBG CLKOUT High to BG High Setup
tEBG CLKOUT High to BG Deasserted Hold Time
tDBH CLKOUT High to BGH High Setup
tEBH CLKOUT High to BGH Deasserted Hold Time
4.5
4.5
6.0
6.0
6.0
6.0
4.5
4.5
4.6
4.6
4.6
4.6
4.5
4.5
3.6
3.6
3.6
3.6
ns
ns
ns
ns
ns
ns
CLKOUT
tBH
tBS
BR
tSD
tSE
AMSx
tSD
tSE
ADDR19-1
ABE1-0
tSD
tSE
AWE
ARE
tDBG
tEBG
BG
tDBH
tEBH
BGH
Figure 15. External Port Bus Request and Grant Cycle Timing
Rev. E
|
Page 29 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
Parallel Peripheral Interface Timing
Table 21 and Figure 16 through Figure 21 on Page 33 describe
parallel peripheral interface operations.
Table 21. Parallel Peripheral Interface Timing
VDDEXT = 1.8 V
LQFP/PBGA Packages
VDDEXT = 1.8 V
MBGA Package
VDDEXT = 2.5 V/3.3 V
All Packages
Parameter
Min
Max
Min
Max
Min
Max
Unit
Timing Requirements
tPCLKW PPI_CLK Width
tPCLK PPI_CLK Period1
8.0
8.0
6.0
ns
ns
20.0
6.0
20.0
6.0
15.0
tSFSPE External Frame Sync Setup Before PPI_CLK Edge
(Nonsampling Edge for Rx, Sampling Edge for Tx)
4.02
ns
ns
6.03
tHFSPE External Frame Sync Hold After PPI_CLK
1.02
2.03
1.02
2.03
1.02
2.03
ns
tSDRPE Receive Data Setup Before PPI_CLK
tHDRPE Receive Data Hold After PPI_CLK
3.5
1.5
3.5
1.5
3.5
1.5
ns
ns
Switching Characteristics—GP Output and Frame Capture Modes
tDFSPE Internal Frame Sync Delay After PPI_CLK
tHOFSPE Internal Frame Sync Hold After PPI_CLK
tDDTPE Transmit Data Delay After PPI_CLK
tHDTPE Transmit Data Hold After PPI_CLK
1 PPI_CLK frequency cannot exceed fSCLK/2
11.0
11.0
8.0
9.0
8.0
9.0
ns
ns
ns
ns
1.7
1.8
1.7
1.8
1.7
1.8
2 Applies when PPI_CONTROL Bit 8 is cleared. See Figure 17 on Page 31 and Figure 20 on Page 32.
3 Applies when PPI_CONTROL Bit 8 is set. See Figure 18 on Page 31 and Figure 21 on Page 33.
FRAME
DATA0
IS
SAMPLED
SYNC IS
DRIVEN
OUT
POLC = 0
PPI_CLK
PPI_CLK
POLC = 1
t
DFSPE
t
HOFSPE
POLS = 1
POLS = 0
PPI_FS1
POLS = 1
POLS = 0
PPI_FS2
t
t
SDRPE
HDRPE
PPI_DATA
Figure 16. PPI GP Rx Mode with Internal Frame Sync Timing
Rev. E
|
Page 30 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
FRAME
SYNC IS
SAMPLED
FOR
DATA0 IS
DATA1 IS
SAMPLED
DATA0
SAMPLED
PPI_CLK
POLC = 0
PPI_CLK
POLC = 1
t
HFSPE
t
SFSPE
POLS = 1
POLS = 0
PPI_FS1
POLS = 1
POLS = 0
PPI_FS2
t
t
HDRPE
SDRPE
PPI_DATA
Figure 17. PPI GP Rx Mode with External Frame Sync Timing
DATA
DATA
SAMPLING/
FRAME
SAMPLING/
FRAME
SYNC
SYNC
SAMPLING
EDGE
SAMPLING
EDGE
PPI_CLK
POLC = 0
PPI_CLK
POLC = 1
t
t
HFSPE
SFSPE
POLS = 1
POLS = 0
PPI_FS1
POLS = 1
POLS = 0
PPI_FS2
t
t
SDRPE
HDRPE
PPI_DATA
Figure 18. PPI GP Rx Mode with External Frame Sync Timing (Bit 8 of PPI_CONTROL Set)
Rev. E
|
Page 31 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
FRAME
SYNC IS
DRIVEN
OUT
DATA0 IS
DRIVEN
OUT
PPI_CLK
POLC = 0
PPI_CLK
POLC = 1
t
DFSPE
t
HOFSPE
POLS = 1
POLS = 0
PPI_FS1
PPI_FS2
POLS = 1
POLS = 0
t
DDTPE
t
HDTPE
PPI_DATA
DATA0
Figure 19. PPI GP Tx Mode with Internal Frame Sync Timing
FRAME
SYNC IS
SAMPLED
DATA0 IS
DRIVEN
OUT
PPI_CLK
POLC = 0
PPI_CLK
POLC = 1
t
HFSPE
t
SFSPE
POLS = 1
POLS = 0
PPI_FS1
POLS = 1
POLS = 0
PPI_FS2
t
HDTPE
PPI_DATA
DATA0
t
DDTPE
Figure 20. PPI GP Tx Mode with External Frame Sync Timing
Rev. E
|
Page 32 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
DATA
DATA
DRIVING/
FRAME
SYNC
DRIVING/
FRAME
SYNC
SAMPLING
EDGE
SAMPLING
EDGE
PPI_CLK
POLC = 0
PPI_CLK
POLC = 1
t
HFSPE
t
SFSPE
POLS = 1
POLS = 0
PPI_FS1
POLS = 1
POLS = 0
PPI_FS2
t
DDTPE
t
HDTPE
PPI_DATA
Figure 21. PPI GP Tx Mode with External Frame Sync Timing (Bit 8 of PPI_CONTROL Set)
Rev. E
|
Page 33 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
Serial Ports
Table 22 through Table 25 on Page 35 and Figure 22 on Page 35
through Figure 23 on Page 36 describe Serial Port operations.
Table 22. Serial Ports—External Clock
VDDEXT = 1.8 V VDDEXT = 2.5 V/3.3 V
Parameter
Min
Max
Min
Max
Unit
Timing Requirements
tSFSE
tHFSE
tSDRE
TFSx/RFSx Setup Before TSCLKx/RSCLKx1
TFSx/RFSx Hold After TSCLKx/RSCLKx1
Receive Data Setup Before RSCLKx1
3.0
3.0
3.0
3.0
8.0
20.0
3.0
ns
ns
ns
ns
ns
ns
3.0
3.0
tHDRE Receive Data Hold After RSCLKx1
tSCLKEW TSCLKx/RSCLKx Width
tSCLKE TSCLKx/RSCLKx Period
Switching Characteristics
3.0
4.5
15.02
tDFSE
TFSx/RFSx Delay After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)3
10.0
10.0
10.0
10.0
ns
ns
ns
ns
tHOFSE TFSx/RFSx Hold After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)1
tDDTE Transmit Data Delay After TSCLKx1
tHDTE Transmit Data Hold After TSCLKx1
0.0
0.0
0.0
0.0
1 Referenced to sample edge.
2 For receive mode with external RSCLKx and external RFSx only, the maximum specification is 11.11 ns (90 MHz).
3 Referenced to drive edge.
Table 23. Serial Ports—Internal Clock
VDDEXT = 1.8 V VDDEXT = 1.8 V VDDEXT = 2.5 V/3.3 V
LQFP/PBGA MBGA Package
Packages
All Packages
Parameter
Min
Max
Min
Max
Min
Max
Unit
Timing Requirements
tSFSI TFSx/RFSx Setup Before TSCLKx/RSCLKx1
tHFSI TFSx/RFSx Hold After TSCLKx/RSCLKx1
tSDRI Receive Data Setup Before RSCLKx1
tHDRI Receive Data Hold After RSCLKx1
tSCLKEW TSCLKx/RSCLKx Width
11.0
−2.0
9.5
11.0
−2.0
9.0
9.0
ns
ns
ns
ns
ns
ns
−2.0
9.0
0.0
0.0
0.0
4.5
4.5
4.5
tSCLKE TSCLKx/RSCLKx Period
20.0
15.0
15.0
Switching Characteristics
tDFSI TFSx/RFSx Delay After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)2
tHOFSI TFSx/RFSx Hold After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)1 −1.0
tDDTI Transmit Data Delay After TSCLKx1
3.0
3.0
3.0
3.0
3.0
3.0
ns
ns
ns
ns
ns
−1.0
−1.0
tHDTI Transmit Data Hold After TSCLKx1
−2.5
6.0
−2.0
6.0
−2.0
4.5
tSCLKIW TSCLKx/RSCLKx Width
1 Referenced to sample edge.
2 Referenced to drive edge.
Rev. E
|
Page 34 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
DATA RECEIVE—INTERNAL CLOCK
DATA RECEIVE—EXTERNAL CLOCK
DRIVE
EDGE
SAMPLE
EDGE
DRIVE
EDGE
SAMPLE
EDGE
tSCLKIW
tSCLKEW
RSCLKx
RSCLKx
tDFSI
tDFSE
tHOFSI
tSFSI
tHFSI
tHOFSE
tSFSE
tHFSE
RFSx
DRx
RFSx
DRx
tSDRI
tHDRI
tSDRE
tHDRE
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RSCLKx OR TSCLKx CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DATA TRANSMIT—INTERNAL CLOCK
DATA TRANSMIT—EXTERNAL CLOCK
DRIVE
EDGE
SAMPLE
EDGE
DRIVE
EDGE
SAMPLE
EDGE
tSCLKIW
tSCLKEW
TSCLKx
TFSx
TSCLKx
TFSx
tDFSI
tDFSE
tHOFSI
tSFSI
tHFSI
tHOFSE
tSFSE
tHFSE
tDDTI
tDDTE
tHDTI
tHDTE
DTx
DTx
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RSCLKx OR TSCLKx CAN BE USED AS THE ACTIVE SAMPLING EDGE.
Figure 22. Serial Ports
Table 24. Serial Ports—Enable and Three-State
VDDEXT = 1.8 V
Max
VDDEXT = 2.5 V/3.3 V
Parameter
Min
0
Min
Max
Unit
Switching Characteristics
tDTENE
tDDTTE
tDTENI
tDDTTI
Data Enable Delay from External TSCLKx1
Data Disable Delay from External TSCLKx1
Data Enable Delay from Internal TSCLKx1
Data Disable Delay from Internal TSCLKx1
0
ns
ns
ns
ns
10.0
3.0
10.0
3.0
−2.0
−2.0
1 Referenced to drive edge.
Table 25. External Late Frame Sync
VDDEXT = 1.8 V
LQFP/PBGA Packages
VDDEXT = 1.8 V
MBGA Package
VDDEXT = 2.5 V/3.3 V
All Packages
Parameter
Min
Max
Min
Max
Min
Max
Unit
Switching Characteristics
tDDTLFSE Data Delay from Late External TFSx or External RFSx
with MCE = 1, MFD = 01, 2
10.5
10.0
10.0
ns
ns
t
DTENLFS Data Enable from Late FS or MCE = 1, MFD = 01, 2
0
0
0
1 MCE = 1, TFSx enable and TFSx valid follow tDTENLFS and tDDTLFSE
.
2 If external RFSx/TFSx setup to RSCLKx/TSCLK x> tSCLKE/2, then tDD I and tDTENE I apply; otherwise tDDTLFSE and tDTENLFS apply.
T
TE/
/
Rev. E
|
Page 35 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
EXTERNAL RFSx WITH MCE= 1, MFD =0
DRIVE
SAMPLE
DRIVE
RSCLKx
RFSx
tSFSE/I
tHOFSE/I
tDDTTE/I
tDTENE/I
tDTENLFS
1ST BIT
2ND BIT
DTx
tDDTLFSE
LATE EXTERNAL TFSx
DRIVE
SAMPLE
DRIVE
TSCLKx
TFSx
tHOFSE/I
tSFSE/I
tDDTTE/I
tDTENE/I
tDTENLFS
DTx
1ST BIT
2ND BIT
tDDTLFSE
Figure 23. External Late Frame Sync
Rev. E
|
Page 36 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
Serial Peripheral Interface (SPI) Port
—Master Timing
Table 26 and Figure 24 describe SPI port master operations.
Table 26. Serial Peripheral Interface (SPI) Port—Master Timing
VDDEXT = 1.8 V
LQFP/PBGA Packages
VDDEXT = 1.8 V
MBGA Package
VDDEXT = 2.5 V/3.3 V
All Packages
Parameter
Min
Max
Min
Max
Min
Max
Unit
Timing Requirements
tSSPIDM Data Input Valid to SCK Edge (Data Input Setup) 10.5
8.5
7.5
ns
ns
tHSPIDM SCK Sampling Edge to Data Input Invalid
Switching Characteristics
–1.5
–1.5
–1.5
tSDSCIM SPISELx Low to First SCK Edge
tSPICHM Serial Clock High Period
2tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
4tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
0
2tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
4tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
0
2tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
4tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
0
ns
ns
ns
ns
ns
ns
ns
ns
tSPICLM Serial Clock Low Period
tSPICLK Serial Clock Period
tHDSM Last SCK Edge to SPISELx High
tSPITDM Sequential Transfer Delay
tDDSPIDM SCK Edge to Data Out Valid (Data Out Delay)
6
6
6
tHDSPIDM SCK Edge to Data Out Invalid (Data Out Hold) –1.0
+4.0
–1.0
+4.0
–1.0
+4.0
SPISELx
(OUTPUT)
tSPICLK
tHDSM
tSPITDM
tSDSCIM
tSPICHM
tSPICLM
SCK
(CPOL = 0)
(OUTPUT)
tSPICLM
tSPICHM
SCK
(CPOL = 1)
(OUTPUT)
tDDSPIDM
tHDSPIDM
MOSI
(OUTPUT)
MSB
LSB
CPHA = 1
tSSPIDM
tHSPIDM
tSSPIDM
tHSPIDM
MISO
(INPUT)
MSB VALID
LSB VALID
tHDSPIDM
tDDSPIDM
MOSI
(OUTPUT)
MSB
LSB
CPHA = 0
tSSPIDM
tHSPIDM
MISO
(INPUT)
MSB VALID
LSB VALID
Figure 24. Serial Peripheral Interface (SPI) Port—Master Timing
Rev. E
|
Page 37 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
Serial Peripheral Interface (SPI) Port
—Slave Timing
Table 27 and Figure 25 describe SPI port slave operations.
Table 27. Serial Peripheral Interface (SPI) Port—Slave Timing
VDDEXT = 1.8 V
LQFP/PBGA Packages
VDDEXT = 1.8 V
MBGA Package
VDDEXT = 2.5 V/3.3 V
All Packages
Parameter
Min
Max
Min
Max
Min
Max
Unit
Timing Requirements
tSPICHS Serial Clock High Period
tSPICLS Serial Clock Low Period
tSPICLK Serial Clock Period
2tSCLK –1.5
2tSCLK –1.5
4tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
4tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
1.6
2tSCLK –1.5
2tSCLK –1.5
4tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
1.6
ns
ns
ns
ns
ns
ns
ns
ns
tHDS Last SCK Edge to SPISS Not Asserted
tSPITDS Sequential Transfer Delay
tSDSCI SPISS Assertion to First SCK Edge
tSSPID Data Input Valid to SCK Edge (Data Input Setup) 1.6
tHSPID SCK Sampling Edge to Data Input Invalid
Switching Characteristics
1.6
1.6
1.6
tDSOE SPISS Assertion to Data Out Active
tDSDHI SPISS Deassertion to Data High Impedance
0
0
0
0
10
10
10
10
0
0
0
0
9
0
0
0
0
8
ns
ns
ns
ns
9
8
t
t
DDSPID SCK Edge to Data Out Valid (Data Out Delay)
HDSPID SCK Edge to Data Out Invalid (Data Out Hold)
10
10
10
10
SPISS
(INPUT)
tSPICHS
tSPICLS
tSPICLK
tHDS
tSPITDS
SCK
(CPOL = 0)
(INPUT)
tSDSCI
tSPICLS
tSPICHS
SCK
(CPOL = 1)
(INPUT)
tDSOE
tDDSPID
tHDSPID
MSB
tDDSPID
tDSDHI
LSB
MISO
(OUTPUT)
tHSPID
tSSPID
CPHA = 1
tSSPID
tHSPID
MOSI
(INPUT)
MSB VALID
LSB VALID
tDSOE
tDDSPID
tDSDHI
MISO
(OUTPUT)
MSB
LSB
tHSPID
CPHA = 0
tSSPID
MOSI
(INPUT)
MSB VALID
LSB VALID
Figure 25. Serial Peripheral Interface (SPI) Port—Slave Timing
Rev. E
|
Page 38 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
Universal Asynchronous Receiver-Transmitter
(UART) Port—Receive and Transmit Timing
Figure 26 describes UART port receive and transmit operations.
The maximum baud rate is SCLK/16. As shown in Figure 26
there is some latency between the generation internal UART
interrupts and the external data operations. These latencies are
negligible at the data transmission rates for the UART.
CLKOUT
(SAMPLE CLOCK)
Rx
DATA[8:5]
STOP
RECEIVE
INTERNAL
UART RECEIVE
INTERRUPT
UART RECEIVE BIT SET BY DATA STOP;
CLEARED BY FIFO READ
START
Tx
DATA[8:5]
STOP[2:1]
TRANSMIT
INTERNAL
UART TRANSMIT
INTERRUPT
UART TRANSMIT BIT SET BY PROGRAM;
CLEARED BY WRITE TO TRANSMIT
Figure 26. UART Port—Receive and Transmit Timing
Rev. E
|
Page 39 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
General-Purpose I/O Port F Pin Cycle Timing
Table 28 and Figure 27 describe GPIO pin operations.
Table 28. General-Purpose I/O Port F Pin Cycle Timing
VDDEXT = 1.8 V
Max
VDDEXT = 2.5 V/3.3 V
Parameter
Min
Min
Max
Unit
ns
Timing Requirement
tWFI
Switching Characteristic
tDFO GPIO Output Delay from CLKOUT Low
GPIO Input Pulse Width
tSCLK + 1
tSCLK + 1
6
6
ns
CLKOUT
tDFO
PFx (OUTPUT)
GPIO OUTPUT
GPIO INPUT
tWFI
PFx (INPUT)
Figure 27. GPIO Cycle Timing
Rev. E
|
Page 40 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
Timer Cycle Timing
Table 29 and Figure 28 describe timer expired operations. The
input signal is asynchronous in width capture mode and exter-
nal clock mode and has an absolute maximum input frequency
of fSCLK/2 MHz.
Table 29. Timer Cycle Timing
VDDEXT = 1.8 V
Max
VDDEXT = 2.5 V/3.3 V
Parameter
Min
Min
Max
Unit
Timing Characteristics
tWL Timer Pulse Width Input Low1 (Measured in SCLK Cycles)
tWH Timer Pulse Width Input High1 (Measured in SCLK Cycles)
Switching Characteristic
1
1
1
1
SCLK
SCLK
tHTO Timer Pulse Width Output2 (Measured in SCLK Cycles)
1
(232–1)
1
(232–1)
SCLK
1 The minimum pulse widths apply for TMRx input pins in width capture and external clock modes. They also apply to the PF1 or PPI_CLK input pins in PWM output mode.
2 The minimum time for tHTO is one cycle, and the maximum time for tHTO equals (232–1) cycles.
CLKOUT
tHTO
TMRx
(PWM OUTPUT MODE)
TMRx
tWL
tWH
(WIDTH CAPTURE AND
EXTERNAL CLOCK MODES)
Figure 28. Timer PWM_OUT Cycle Timing
Rev. E
|
Page 41 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
JTAG Test and Emulation Port Timing
Table 30 and Figure 29 describe JTAG port operations.
Table 30. JTAG Port Timing
VDDEXT = 1.8 V
Max
VDDEXT = 2.5 V/3.3 V
Parameter
Min
Min
Max
Unit
Timing Requirements
tTCK
TCK Period
20
4
20
4
ns
tSTAP
tHTAP
tSSYS
tHSYS
tTRSTW
TDI, TMS Setup Before TCK High
TDI, TMS Hold After TCK High
System Inputs Setup Before TCK High1
System Inputs Hold After TCK High1
TRST Pulse Width2 (Measured in TCK Cycles)
ns
4
4
ns
4
4
ns
5
5
ns
4
4
TCK
Switching Characteristics
tDTDO TDO Delay from TCK Low
tDSYS
System Outputs Delay After TCK Low3
10
12
10
12
ns
ns
0
0
1 System Inputs = DATA15–0, ARDY, TMR2–0, PF15–0, PPI_CLK, RSCLK0–1, RFS0–1, DR0PRI, DR0SEC, TSCLK0–1, TFS0–1, DR1PRI, DR1SEC, MOSI, MISO, SCK, RX,
RESET, NMI, BMODE1–0, BR, PP3–0.
2 50 MHz maximum
3 System Outputs = DATA15–0, ADDR19–1, ABE1–0, AOE, ARE, AWE, AMS3–0, SRAS, SCAS, SWE, SCKE, CLKOUT, SA10, SMS, TMR2–0, PF15–0, RSCLK0–1, RFS0–1,
TSCLK0–1, TFS0–1, DT0PRI, DT0SEC, DT1PRI, DT1SEC, MOSI, MISO, SCK, TX, BG, BGH, PPI3–0.
tTCK
TCK
tSTAP
tHTAP
TMS
TDI
tDTDO
TDO
tSSYS
tHSYS
SYSTEM
INPUTS
tDSYS
SYSTEM
OUTPUT
Figure 29. JTAG Port Timing
Rev. E
|
Page 42 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
OUTPUT DRIVE CURRENTS
150
VDDEXT = 3.65V
Figure 30 through Figure 41 show typical current-voltage char-
acteristics for the output drivers of the ADSP-BF531/
ADSP-BF532/ADSP-BF533 processor. The curves represent the
current drive capability of the output drivers as a function of
output voltage.
VDDEXT = 3.30V
100
50
VDDEXT = 2.95V
0
VOH
150
–50
–100
–150
V
DDEXT = 2.75V
VDDEXT = 2.50V
VDDEXT = 2.25V
100
50
VOL
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0
–50
VOH
SOURCE VOLTAGE (V)
Figure 32. Drive Current A (VDDEXT = 3.3 V)
VOL
150
100
50
–100
–150
VDDEXT = 2.75V
VDDEXT = 2.50V
VDDEXT = 2.25V
0
0.5
1.0
1.5
2.0
2.5
3.0
SOURCE VOLTAGE (V)
Figure 30. Drive Current A (VDDEXT = 2.5 V)
0
–50
VOH
80
60
V
DDEXT = 1.9V
VDDEXT = 1.8V
VDDEXT = 1.7V
40
–100
–150
VOL
20
0
0
0.5
1.0
1.5
2.0
2.5
3.0
SOURCE VOLTAGE (V)
–20
–40
–60
–80
Figure 33. Drive Current B (VDDEXT = 2.5 V)
80
60
V
DDEXT = 1.9V
0
0.5
1.0
1.5
2.0
V
DDEXT = 1.8V
SOURCE VOLTAGE (V)
V
DDEXT = 1.7V
40
Figure 31. Drive Current A (VDDEXT = 1.8 V)
20
0
–20
–40
–60
–80
0
0.5
1.0
1.5
2.0
SOURCE VOLTAGE (V)
Figure 34. Drive Current B (VDDEXT = 1.8 V)
Rev. E
|
Page 43 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
100
80
60
40
20
150
VDDEXT = 3.65V
VDDEXT = 3.30V
VDDEXT = 2.95V
V
DDEXT = 3.65V
VDDEXT = 3.30V
100
50
V
DDEXT = 2.95V
0
0
–20
–40
–60
VOH
VOH
–50
–100
–150
VOL
VOL
–80
–100
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
SOURCE VOLTAGE (V)
SOURCE VOLTAGE (V)
Figure 35. Drive Current B (VDDEXT = 3.3 V)
Figure 38. Drive Current C (VDDEXT = 3.3 V)
60
40
20
100
80
VDDEXT = 2.75V
VDDEXT = 2.50V
VDDEXT = 2.25V
VDDEXT = 2.75V
VDDEXT = 2.50V
VDDEXT = 2.25V
60
40
20
0
0
–20
–40
–60
VOH
VOH
–20
–40
–60
VOL
VOL
–80
0
0.5
1.0
1.5
2.0
2.5
3.0
–100
SOURCE VOLTAGE (V)
0
0.5
1.0
1.5
2.0
2.5
3.0
SOURCE VOLTAGE (V)
Figure 36. Drive Current C (VDDEXT = 2.5 V)
Figure 39. Drive Current D (VDDEXT = 2.5 V)
30
VDDEXT = 1.9V
DDEXT = 1.8V
DDEXT = 1.7V
60
40
V
20
V
VDDEXT = 1.9V
VDDEXT = 1.8V
10
0
V
DDEXT = 1.7V
20
–10
–20
0
–20
–40
–30
–40
0
0.5
1.0
1.5
2.0
–60
0
0.5
1.0
1.5
2.0
SOURCE VOLTAGE (V)
SOURCE VOLTAGE (V)
Figure 37. Drive Current C (VDDEXT = 1.8 V)
Figure 40. Drive Current D (VDDEXT = 1.8 V)
Rev. E
|
Page 44 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
V
TRIP (high) is 2.0 V and VTRIP (low) is 1.0 V . Time tTRIP is the
150
100
50
interval from when the output starts driving to when the output
reaches the VTRIP (high) or VTRIP (low) trip voltage.
V
DDEXT = 3.65V
VDDEXT = 3.30V
VDDEXT = 2.95V
Time tENA is calculated as shown in the equation:
tENA = tENA_MEASURED – tTRIP
If multiple pins (such as the data bus) are enabled, the measure-
ment value is that of the first pin to start driving.
0
VOH
–50
Output Disable Time Measurement
VOL
Output pins are considered to be disabled when they stop driv-
ing, go into a high impedance state, and start to decay from their
output high or low voltage. The output disable time tDIS is the
difference between tDIS_MEASURED and tDECAY as shown on the left
–100
–150
side of Figure 42.
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
SOURCE VOLTAGE (V)
tDIS = tDIS_MEASURED – tDECAY
Figure 41. Drive Current D (VDDEXT = 3.3 V)
The time for the voltage on the bus to decay by ΔV is dependent
on the capacitive load CL and the load current II. This decay time
can be approximated by the equation:
POWER DISSIPATION
Many operating conditions can affect power dissipation. System
designers should refer to Estimating Power for ADSP-BF531/
BF532/BF533 Blackfin Processors (EE-229) on the Analog
Devices website (www.analog.com)—use site search on
“EE-229.” This document provides detailed information for
optimizing your design for lowest power.
tDECAY = (CLΔV) ⁄ IL
The time tDECAY is calculated with test loads CL and IL, and with
ΔV equal to 0.1 V for VDDEXT (nominal) = 1.8 V or 0.5 V for
DDEXT (nominal) = 2.5 V/3.3 V.
V
The time tDIS_MEASURED is the interval from when the reference
signal switches, to when the output voltage decays ΔV from the
measured output high or output low voltage.
See the ADSP-BF533 Blackfin Processor Hardware Reference
Manual for definitions of the various operating modes and for
instructions on how to minimize system power.
TEST CONDITIONS
REFERENCE
SIGNAL
All timing parameters appearing in this data sheet were mea-
sured under the conditions described in this section. Figure 42
shows the measurement point for ac measurements (except out-
put enable/disable). The measurement point VMEAS is 0.95 V for
tDIS_MEASURED
tENA_MEASURED
tDIS
tENA
V
DDEXT (nominal) = 1.8 V or 1.5 V for VDDEXT (nominal) = 2.5 V/
V
OH
V
(MEASURED)
3.3 V.
OH
(MEASURED)
V
(MEASURED) ꢀꢁV
(MEASURED) + ꢁV
OH
V
(HIGH)
(LOW)
TRIP
V
TRIP
V
OL
V
OL
V
(MEASURED)
OL
INPUT
OR
OUTPUT
(MEASURED)
VMEAS
VMEAS
tDECAY
tTRIP
Figure 42. Voltage Reference Levels for AC
OUTPUT STOPS DRIVING
OUTPUT STARTS DRIVING
HIGH IMPEDANCE STATE
Measurements (Except Output Enable/Disable)
Figure 43. Output Enable/Disable
Output Enable Time Measurement
Output pins are considered to be enabled when they have made
a transition from a high impedance state to the point when they
start driving.
Example System Hold Time Calculation
To determine the data output hold time in a particular system,
first calculate tDECAY using the equation given above. Choose ΔV
to be the difference between the ADSP-BF531/ADSP-BF532/
ADSP-BF533 processor’s output voltage and the input thresh-
old for the device requiring the hold time. CLis the total bus
capacitance (per data line), and IL is the total leakage or
The output enable time tENA is the interval from the point when a
reference signal reaches a high or low voltage level to the point
when the output starts driving as shown on the right side of
Figure 43.
The time tENA MEASURED is the interval, from when the reference sig-
nal switches,_to when the output voltage reaches VTRIP(high) or
three-state current (per data line). The hold time will be tDECAY
V
TRIP (low). For VDDEXT (nominal) = 1.8 V—VTRIP (high) is 1.3 V
and VTRIP (low) is 0.7 V. For VDDEXT (nominal) = 2.5 V/3.3 V—
Rev. E
|
Page 45 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
plus the various output disable times as specified in the Timing
Specifications on Page 24 (for example tDSDAT for an SDRAM
write cycle as shown in SDRAM Interface Timing on Page 28).
14
12
RISE TIME
Capacitive Loading
10
8
Output delays and holds are based on standard capacitive loads:
30 pF on all pins (see Figure 44). VLOAD is 0.95 V for VDDEXT
(nominal) = 1.8 V or 1.5 V for VDDEXT (nominal) =
2.5 V/3.3 V. Figure 45 through Figure 56 on Page 48 show how
output rise time varies with capacitance. The delay and hold
specifications given should be derated by a factor derived from
these figures. The graphs in these figures may not be linear out-
side the ranges shown.
FALL TIME
6
4
2
0
0
50
100
150
200
250
50ꢂ
TO
OUTPUT
PIN
LOAD CAPACITANCE (pF)
V
LOAD
Figure 46. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver A at VDDEXT = 2.25 V
30pF
12
Figure 44. Equivalent Device Loading for AC Measurements
(Includes All Fixtures)
10
RISE TIME
16
14
12
10
8
8
FALL TIME
RISE TIME
6
4
2
0
FALL TIME
6
0
50
100
150
200
250
4
2
0
LOAD CAPACITANCE (pF)
Figure 47. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver A at VDDEXT = 3.65 V
0
50
100
150
200
250
LOAD CAPACITANCE (pF)
14
12
Figure 45. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver A at VDDEXT = 1.75 V
RISE TIME
10
8
FALL TIME
6
4
2
0
0
50
100
150
200
250
LOAD CAPACITANCE (pF)
Figure 48. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver B at VDDEXT = 1.75 V
Rev. E
|
Page 46 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
30
12
10
25
RISE TIME
RISE TIME
20
8
6
4
2
0
FALL TIME
15
FALL TIME
10
5
0
0
50
100
150
200
250
0
50
100
150
200
250
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
Figure 52. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver C at VDDEXT = 2.25 V
Figure 49. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver B at VDDEXT = 2.25 V
20
10
18
16
9
8
RISE TIME
RISE TIME
14
7
12
6
FALL TIME
FALL TIME
10
5
8
6
4
2
0
4
3
2
1
0
0
50
100
150
200
250
0
50
100
150
200
250
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
Figure 53. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver C at VDDEXT = 3.65 V
Figure 50. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver B at VDDEXT = 3.65 V
18
16
30
RISE TIME
14
25
RISE TIME
12
20
FALL TIME
10
FALL TIME
8
6
4
2
0
15
10
5
0
50
100
150
200
250
LOAD CAPACITANCE (pF)
0
0
50
100
150
200
250
Figure 54. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver D at VDDEXT = 1.75 V
LOAD CAPACITANCE (pF)
Figure 51. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver C at VDDEXT = 1.75 V
Rev. E
|
Page 47 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
where:
18
16
TA = ambient temperature (ꢃC).
In Table 31 through Table 33, airflow measurements comply
with JEDEC standards JESD51–2 and JESD51–6, and the junc-
tion-to-board measurement complies with JESD51–8. The
junction-to-case measurement complies with MIL-STD-883
(Method 1012.1). All measurements use a 2S2P JEDEC test
board.
14
RISE TIME
12
10
FALL TIME
8
6
4
2
0
Thermal resistance θJA in Table 31 through Table 33 is the figure
of merit relating to performance of the package and board in a
convective environment. θJMA represents the thermal resistance
under two conditions of airflow. ΨJT represents the correlation
between TJ and TCASE
Table 31. Thermal Characteristics for BC-160 Package
Parameter Condition Typical Unit
.
0
50
100
150
200
250
LOAD CAPACITANCE (pF)
Figure 55. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver D at VDDEXT = 2.25 V
θJA
0 Linear m/s Airflow
27.1
23.85
22.7
7.26
0.14
0.26
0.35
ꢃC/W
ꢃC/W
ꢃC/W
ꢃC/W
ꢃC/W
ꢃC/W
ꢃC/W
θJMA
θJMA
θJC
1 Linear m/s Airflow
2 Linear m/s Airflow
Not Applicable
14
12
RISE TIME
10
ΨJT
ΨJT
ΨJT
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
8
FALL TIME
6
4
2
0
Table 32. Thermal Characteristics for ST-176-1 Package
Parameter Condition Typical Unit
θJA
0 Linear m/s Airflow
34.9
33.0
32.0
0.50
0.75
1.00
ꢃC/W
ꢃC/W
ꢃC/W
ꢃC/W
ꢃC/W
ꢃC/W
θJMA
θJMA
ΨJT
ΨJT
ΨJT
1 Linear m/s Airflow
2 Linear m/s Airflow
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
0
50
100
150
200
250
LOAD CAPACITANCE (pF)
Figure 56. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver D at VDDEXT = 3.65 V
ENVIRONMENTAL CONDITIONS
To determine the junction temperature on the application
printed circuit board use:
Table 33. Thermal Characteristics for B-169 Package
Parameter Condition Typical Unit
TJ = TCASE + (ΨJT × PD)
θJA
0 Linear m/s Airflow
22.8
20.3
19.3
10.39
0.59
0.88
1.37
ꢃC/W
ꢃC/W
ꢃC/W
ꢃC/W
ꢃC/W
ꢃC/W
ꢃC/W
where:
θJMA
θJMA
θJC
1 Linear m/s Airflow
2 Linear m/s Airflow
Not Applicable
TJ = junction temperature (ꢃC).
T
CASE = case temperature (ꢃC) measured by customer at top
center of package.
ΨJT = from Table 31 through Table 33.
ΨJT
ΨJT
ΨJT
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
PD = power dissipation (see Power Dissipation on Page 45 for
the method to calculate PD).
Values of θJA are provided for package comparison and printed
circuit board design considerations. θJA can be used for a first
order approximation of TJ by the equation:
TJ = TA + (θJA × PD)
Rev. E
|
Page 48 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
160-BALL BGA BALL ASSIGNMENT
Table 34 lists the BGA ball assignment by signal. Table 35 on
Page 50 lists the BGA ball assignment by ball number.
Table 34. 160-Ball CSP_BGA Ball Assignment (Alphabetically by Signal)
Signal
ABE0
Ball No.
H13
H12
J14
Signal
DATA4
DATA5
DATA6
DATA7
DATA8
DATA9
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
DR0PRI
DR0SEC
DR1PRI
DR1SEC
DT0PRI
DT0SEC
DT1PRI
DT1SEC
EMU
Ball No.
N8
Signal
GND
GND
GND
GND
GND
GND
MISO
MOSI
NMI
Ball No.
L6
Signal
SCK
Ball No.
D1
ABE1
P8
L8
SCKE
B13
C13
D13
D12
P2
ADDR1
ADDR2
ADDR3
ADDR4
ADDR5
ADDR6
ADDR7
ADDR8
ADDR9
ADDR10
ADDR11
ADDR12
ADDR13
ADDR14
ADDR15
ADDR16
ADDR17
ADDR18
ADDR19
AMS0
M7
N7
L10
M4
M10
P14
E2
SMS
K14
L14
J13
SRAS
P7
SWE
M6
N6
TCK
K13
L13
K12
L12
M12
M13
M14
N14
N13
N12
M11
N11
P13
P12
P11
E14
F14
F13
G12
G13
E13
G14
H14
P10
N10
N4
TDI
M3
N3
P6
D3
B10
D2
C1
TDO
M5
N5
TFS0
H3
PF0
TFS1
E1
P5
PF1
TMR0
L2
P4
PF2
C2
TMR1
M1
K2
K1
PF3
C3
TMR2
J2
PF4
B1
TMS
N2
G3
PF5
B2
TRST
N1
F3
PF6
B3
TSCLK0
TSCLK1
TX
J1
H1
PF7
B4
F1
H2
PF8
A2
A3
A4
A5
B5
K3
F2
PF9
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDRTC
VROUT0
VROUT1
XTAL
A1
E3
PF10
PF11
PF12
PF13
PF14
PF15
PPI_CLK
PPI0
PPI1
PPI2
PPI3
RESET
RFS0
RFS1
RSCLK0
RSCLK1
RTXI
RTXO
RX
C7
M2
A10
A14
B11
C4
C12
D5
GND
AMS1
GND
B6
D9
AMS2
GND
A6
C6
F12
G4
AMS3
GND
AOE
GND
C5
C9
J4
ARDY
GND
C11
D4
C8
J12
L7
ARE
GND
B8
AWE
GND
D7
A7
B7
L11
P1
BG
GND
D8
BGH
GND
D10
D11
F4
C10
J3
D6
BMODE0
BMODE1
BR
GND
E4
P3
GND
G2
L1
E11
J11
L4
D14
A12
B14
M9
GND
F11
G11
H4
CLKIN
GND
G1
A9
A8
L3
CLKOUT
DATA0
DATA1
DATA2
DATA3
GND
L9
GND
H11
K4
B9
N9
GND
A13
B12
A11
P9
GND
K11
L5
SA10
SCAS
E12
C14
M8
GND
Rev. E
|
Page 49 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
Table 35. 160-Ball CSP_BGA Ball Assignment (Numerically by Ball Number)
Ball No.
A1
Signal
VDDEXT
PF8
Ball No.
C13
C14
D1
Signal
SMS
Ball No.
H1
Signal
DT0PRI
DT0SEC
TFS0
Ball No.
M3
M4
M5
M6
M7
M8
M9
M10
M11
M12
M13
M14
N1
Signal
TDI
A2
SCAS
H2
GND
A3
PF9
SCK
H3
DATA12
DATA9
DATA6
DATA3
DATA0
GND
A4
PF10
PF11
PF14
PPI2
D2
PF0
H4
GND
A5
D3
MOSI
GND
H11
H12
H13
H14
J1
GND
A6
D4
ABE1
A7
D5
VDDEXT
VDDINT
GND
ABE0
A8
RTXO
RTXI
D6
AWE
A9
D7
TSCLK0
DR0SEC
RFS0
ADDR15
ADDR9
ADDR10
ADDR11
TRST
A10
A11
A12
A13
A14
B1
GND
D8
GND
J2
XTAL
CLKIN
VROUT0
GND
D9
VDDEXT
GND
J3
D10
D11
D12
D13
D14
E1
J4
VDDEXT
VDDINT
VDDEXT
ADDR4
ADDR1
DR0PRI
TMR2
GND
J11
J12
J13
J14
K1
SWE
N2
TMS
PF4
SRAS
N3
TDO
B2
PF5
BR
N4
BMODE0
DATA13
DATA10
DATA7
DATA4
DATA1
BGH
B3
PF6
TFS1
N5
B4
PF7
E2
MISO
DT1SEC
VDDINT
VDDINT
SA10
K2
N6
B5
PF12
PF13
PPI3
E3
K3
TX
N7
B6
E4
K4
GND
N8
B7
E11
E12
E13
E14
F1
K11
K12
K13
K14
L1
GND
N9
B8
PPI1
ADDR7
ADDR5
ADDR2
RSCLK0
TMR0
N10
N11
N12
N13
N14
P1
B9
VDDRTC
NMI
ARDY
AMS0
TSCLK1
DT1PRI
DR1SEC
GND
ADDR16
ADDR14
ADDR13
ADDR12
VDDEXT
TCK
B10
B11
B12
B13
B14
C1
GND
VROUT1
SCKE
CLKOUT
PF1
F2
L2
F3
L3
RX
F4
L4
VDDINT
GND
P2
F11
F12
F13
F14
G1
GND
L5
P3
BMODE1
DATA15
DATA14
DATA11
DATA8
DATA5
DATA2
BG
C2
PF2
VDDEXT
AMS2
AMS1
RSCLK1
RFS1
L6
GND
P4
C3
PF3
L7
VDDEXT
GND
P5
C4
GND
L8
P6
C5
GND
L9
VDDINT
GND
P7
C6
PF15
VDDEXT
PPI0
G2
L10
L11
L12
L13
L14
M1
M2
P8
C7
G3
DR1PRI
VDDEXT
GND
VDDEXT
ADDR8
ADDR6
ADDR3
TMR1
P9
C8
G4
P10
P11
P12
P13
P14
C9
PPI_CLK
RESET
GND
G11
G12
G13
G14
ADDR19
ADDR18
ADDR17
GND
C10
C11
C12
AMS3
AOE
VDDEXT
ARE
EMU
Rev. E
|
Page 50 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
Figure 57 lists the top view of the BGA ball configuration.
Figure 58 lists the bottom view of the BGA ball configuration.
1
2
3
4
5
6
7
8
9
10 11 12 13 14
A
B
C
D
E
F
G
H
J
K
L
M
N
P
KEY:
VDDINT
VDDEXT
VDDRTC
VROUT
GND
I/O
Figure 57. 160-Ball CSP_BGA Ground Configuration (Top View)
14 13 12 11 10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
KEY:
VDDINT
VDDRTC
VROUT
GND
I/O
VDDEXT
Figure 58. 160-Ball CSP_BGA Ground Configuration (Bottom View)
Rev. E
|
Page 51 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
169-BALL PBGA BALL ASSIGNMENT
Table 36 lists the PBGA ball assignment by signal. Table 37 on
Page 53 lists the PBGA ball assignment by ball number.
Table 36. 169-Ball PBGA Ball Assignment (Alphabetically by Signal)
Signal
ABE0
Ball No.
H16
H17
J16
Signal
DATA4
DATA5
DATA6
DATA7
DATA8
DATA9
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
DR0PRI
DR0SEC
DR1PRI
DR1SEC
DT0PRI
DT0SEC
DT1PRI
DT1SEC
EMU
Ball No.
U12
U11
T10
U10
T9
Signal
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
MISO
MOSI
NMI
Ball No.
K9
Signal
RTXI
Ball No.
A10
A11
T1
Signal
Ball No.
K6
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VROUT0
VROUT1
XTAL
ABE1
K10
K11
L7
RTXO
RX
L6
ADDR1
ADDR2
ADDR3
ADDR4
ADDR5
ADDR6
ADDR7
ADDR8
ADDR9
ADDR10
ADDR11
ADDR12
ADDR13
ADDR14
ADDR15
ADDR16
ADDR17
ADDR18
ADDR19
AMS0
M6
J17
SA10
SCAS
SCK
B15
A16
D1
M7
K16
K17
L16
L17
M16
M17
N17
N16
P17
P16
R17
R16
T17
U15
T15
U16
T14
D17
E16
E17
F16
F17
C16
G16
G17
T13
U17
U5
L8
M8
U9
L9
T2
T8
L10
L11
M9
T16
E2
SCKE
SMS
B14
A17
A15
B17
U4
B12
B13
A13
U8
U7
SRAS
SWE
T7
U6
TCK
T6
E1
TDI
U3
M2
M1
H1
B11
D2
C1
TDO
T4
PF0
TFS0
L1
PF1
TFS1
G2
H2
PF2
B1
TMR0
TMR1
TMR2
TMS
R1
K2
PF3
C2
P2
K1
PF4
A1
A2
P1
F1
PF5
T3
F2
PF6
B3
TRST
U2
U1
PF7
A3
B4
TSCLK0
TSCLK1
TX
L2
GND
B16
F11
G7
PF8
G1
AMS1
GND
PF9
A4
B5
R2
AMS2
GND
PF10
PF11
PF12
PF13
PF14
PF15
PPI_CLK
PPI0
VDD
F12
G12
H12
J12
K12
L12
M10
M11
M12
B2
AMS3
GND
G8
A5
A6
B6
VDD
AOE
GND
G9
VDD
ARDY
GND
G10
G11
H7
VDD
ARE
GND
A7
B7
VDD
AWE
GND
VDD
BG
GND
H8
B10
B9
VDD
BGH
GND
H9
VDD
BMODE0
BMODE1
BR
GND
H10
H11
J7
PPI1
A9
B8
VDD
T5
GND
PPI2
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
C17
A14
D16
U14
T12
U13
T11
GND
PPI3
A8
A12
N1
J1
F6
CLKIN
GND
J8
RESET
RFS0
RFS1
RSCLK0
RSCLK1
RTCVDD
F7
CLKOUT
DATA0
DATA1
DATA2
DATA3
GND
J9
F8
GND
J10
J11
K7
F9
GND
N2
J2
G6
GND
H6
GND
K8
F10
J6
Rev. E
|
Page 52 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
Table 37. 169-Ball PBGA Ball Assignment (Numerically by Ball Number)
Ball No.
A1
Signal
PF4
Ball No.
D16
D17
E1
Signal
CLKOUT
AMS0
MOSI
Ball No.
J2
Signal
RSCLK1
VDDEXT
GND
Ball No.
M12
M16
M17
N1
Signal
VDD
Ball No.
U9
Signal
DATA9
DATA7
DATA5
DATA4
DATA2
DATA0
ADDR16
ADDR18
BGH
A2
PF5
J6
ADDR7
ADDR8
RFS0
U10
U11
U12
U13
U14
U15
U16
U17
A3
PF7
J7
A4
PF9
E2
MISO
J8
GND
A5
PF11
PF12
PF14
PPI3
E16
E17
F1
AMS1
AMS2
DT1PRI
DT1SEC
VDDEXT
VDDEXT
VDDEXT
VDDEXT
RTCVDD
GND
J9
GND
N2
RSCLK0
ADDR10
ADDR9
TMR2
A6
J10
J11
J12
J16
J17
K1
GND
N16
N17
P1
A7
GND
A8
F2
VDD
A9
PPI1
F6
ADDR1
ADDR2
DT0SEC
DT0PRI
VDDEXT
GND
P2
TMR1
A10
A11
A12
A13
A14
A15
A16
A17
B1
RTXI
RTXO
RESET
XTAL
CLKIN
SRAS
SCAS
SMS
F7
P16
P17
R1
ADDR12
ADDR11
TMR0
F8
F9
K2
F10
F11
F12
F16
F17
G1
K6
R2
TX
K7
R16
R17
T1
ADDR14
ADDR13
RX
VDD
K8
GND
AMS3
AOE
K9
GND
K10
K11
K12
K16
K17
L1
GND
T2
VDDEXT
TMS
PF2
TSCLK1
TFS1
GND
T3
B2
VDDEXT
PF6
G2
VDD
T4
TDO
B3
G6
VDDEXT
GND
ADDR3
ADDR4
TFS0
T5
BMODE1
DATA15
DATA13
DATA10
DATA8
DATA6
DATA3
DATA1
BG
B4
PF8
G7
T6
B5
PF10
PF13
PF15
PPI2
G8
GND
T7
B6
G9
GND
L2
TSCLK0
VDDEXT
GND
T8
B7
G10
G11
G12
G16
G17
H1
GND
L6
T9
B8
GND
L7
T10
T11
T12
T13
T14
T15
T16
T17
U1
B9
PPI0
VDD
L8
GND
B10
B11
B12
B13
B14
B15
B16
B17
C1
PPI_CLK
NMI
ARE
L9
GND
AWE
L10
L11
L12
L16
L17
M1
M2
M6
M7
M8
M9
M10
M11
GND
VROUT0
VROUT1
SCKE
SA10
GND
SWE
DR1PRI
DR1SEC
VDDEXT
GND
GND
ADDR19
ADDR17
GND
H2
VDD
H6
ADDR5
ADDR6
DR0SEC
DR0PRI
VDDEXT
VDDEXT
VDDEXT
GND
H7
ADDR15
EMU
H8
GND
H9
GND
U2
TRST
PF1
H10
H11
H12
H16
H17
J1
GND
U3
TDI
C2
PF3
GND
U4
TCK
C16
C17
D1
ARDY
BR
VDD
U5
BMODE0
DATA14
DATA12
DATA11
ABE0
U6
SCK
ABE1
VDD
U7
D2
PF0
RFS1
VDD
U8
Rev. E
|
Page 53 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
A1 BALL PAD CORNER
A
B
C
D
E
F
KEY
G
H
J
V
V
GND
I/O
NC
V
DDINT
K
L
DDEXT
ROUT
M
N
P
R
T
U
2
4
6
8
10
12
14
16
1
3
5
7
9
11
13
15
17
TOP VIEW
Figure 59. 169-Ball PBGA Ground Configuration (Top View)
A1 BALL PAD CORNER
A
B
C
D
KEY:
V
GND
I/O
NC
E
DDINT
F
V
V
G
DDEXT
ROUT
H
J
K
L
M
N
P
R
T
U
17
15
13
11
9
7
5
3
1
16
14
12
10
8
6
4
2
BOTTOM VIEW
Figure 60. 169-Ball PBGA Ground Configuration (Bottom View)
Rev. E
|
Page 54 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
176-LEAD LQFP PINOUT
Table 38 lists the LQFP pinout by signal. Table 39 on Page 56
lists the LQFP pinout by lead number.
Table 38. 176-Lead LQFP Pin Assignment (Alphabetically by Signal)
Signal
ABE0
Lead No.
151
150
149
148
147
146
142
141
140
139
138
137
136
135
127
126
125
124
123
122
121
161
160
159
158
154
162
153
152
119
120
96
Signal
DATA3
DATA4
DATA5
DATA6
DATA7
DATA8
DATA9
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
DR0PRI
DR0SEC
DR1PRI
DR1SEC
DT0PRI
DT0SEC
DT1PRI
DT1SEC
EMU
Lead No.
113
112
110
109
108
105
104
103
102
101
100
99
Signal
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
MISO
MOSI
NMI
Lead No.
88
Signal
PPI_CLK
PPI0
Lead No.
21
Signal
Lead No.
71
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDRTC
VROUT0
VROUT1
XTAL
ABE1
89
22
93
ADDR1
ADDR2
ADDR3
ADDR4
ADDR5
ADDR6
ADDR7
ADDR8
ADDR9
ADDR10
ADDR11
ADDR12
ADDR13
ADDR14
ADDR15
ADDR16
ADDR17
ADDR18
ADDR19
AMS0
90
PPI1
23
107
118
134
145
156
171
25
91
PPI2
24
92
PPI3
26
97
RESET
RFS0
13
106
117
128
129
130
131
132
133
144
155
170
174
175
176
54
75
RFS1
64
RSCLK0
RSCLK1
RTXI
76
65
52
17
66
RTXO
RX
16
80
98
82
111
143
157
168
18
74
SA10
SCAS
SCK
164
166
53
73
63
62
SCKE
173
172
167
165
94
68
SMS
5
67
SRAS
SWE
4
59
11
58
TCK
83
55
TDI
86
AMS1
GND
1
14
TDO
87
AMS2
GND
2
PF0
51
TFS0
69
AMS3
GND
3
PF1
50
TFS1
60
AOE
GND
7
PF2
49
TMR0
TMR1
TMR2
TMS
79
ARDY
GND
8
PF3
48
78
ARE
GND
9
PF4
47
77
AWE
GND
15
PF5
46
85
BG
GND
19
PF6
38
TRST
84
BGH
GND
30
PF7
37
TSCLK0
TSCLK1
TX
72
BMODE0
BMODE1
BR
GND
39
PF8
36
61
95
GND
40
PF9
35
81
163
10
GND
41
PF10
PF11
PF12
PF13
PF14
PF15
34
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
6
CLKIN
GND
42
33
12
CLKOUT
DATA0
DATA1
DATA10
169
116
115
103
GND
43
32
20
GND
44
29
31
GND
56
28
45
GND
70
27
57
Rev. E
|
Page 55 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
Table 39. 176-Lead LQFP Pin Assignment (Numerically by Lead Number)
Lead No.
1
Signal
GND
Lead No.
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
Signal
GND
Lead No.
81
Signal
TX
Lead No.
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
Signal
ADDR19
ADDR18
ADDR17
ADDR16
ADDR15
ADDR14
ADDR13
GND
Lead No.
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
Signal
AMS0
ARDY
BR
2
GND
GND
82
RX
3
GND
GND
83
EMU
4
VROUT1
VROUT0
VDDEXT
GND
GND
84
TRST
SA10
SWE
5
VDDEXT
PF5
85
TMS
6
86
TDI
SCAS
SRAS
VDDINT
CLKOUT
GND
7
PF4
87
TDO
8
GND
PF3
88
GND
9
GND
PF2
89
GND
GND
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
CLKIN
XTAL
VDDEXT
RESET
NMI
PF1
90
GND
GND
PF0
91
GND
GND
VDDEXT
SMS
VDDINT
SCK
92
GND
GND
93
VDDEXT
TCK
GND
SCKE
GND
MISO
94
VDDEXT
ADDR12
ADDR11
ADDR10
ADDR9
ADDR8
ADDR7
ADDR6
ADDR5
VDDINT
GND
GND
MOSI
95
BMODE1
BMODE0
GND
GND
RTXO
RTXI
GND
96
GND
VDDEXT
DT1SEC
DT1PRI
TFS1
97
VDDRTC
GND
98
DATA15
DATA14
DATA13
DATA12
DATA11
DATA10
DATA9
DATA8
GND
99
VDDEXT
PPI_CLK
PPI0
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
TSCLK1
DR1SEC
DR1PRI
RFS1
PPI1
PPI2
VDDINT
PPI3
RSCLK1
VDDINT
DT0SEC
DT0PRI
TFS0
VDDEXT
ADDR4
ADDR3
ADDR2
ADDR1
ABE1
PF15
VDDEXT
DATA7
DATA6
DATA5
VDDINT
DATA4
DATA3
DATA2
DATA1
DATA0
GND
PF14
PF13
GND
GND
VDDEXT
PF12
VDDEXT
TSCLK0
DR0SEC
DR0PRI
RFS0
ABE0
AWE
PF11
ARE
PF10
AOE
PF9
GND
PF8
RSCLK0
TMR2
TMR1
TMR0
VDDINT
VDDEXT
VDDINT
AMS3
PF7
PF6
VDDEXT
BG
GND
AMS2
GND
BGH
AMS1
Rev. E
|
Page 56 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
OUTLINE DIMENSIONS
Dimensions in the outline dimension figures are shown in
millimeters.
26.00 BSC SQ
24.00 BSC SQ
0.75
0.60
0.45
133
132
176
1
PIN 1
0.27
0.22
0.17
SEATING
PLANE
0.08 MAX LEAD
COPLANARITY
0.15
0.05
89
88
1.45
1.40
44
45
1.35
1.60 MAX
0.50 BSC
LEAD PITCH
DETAIL A
DETAIL A
TOP VIEW (PINS DOWN)
NOTES
1. DIMENSIONS IN MILLIMETERS
2. ACTUAL POSITION OF EACH LEAD IS WITHIN 0.08 OF ITS
IDEAL POSITION, WHEN MEASURED IN THE LATERAL DIRECTION.
3. CENTER DIMENSIONS ARE NOMINAL
Figure 61. 176-Lead Low Profile Quad Flat Package (LQFP) ST-176-1
12.00 BSC SQ
A1 CORNER
INDEX AREA
1
14 12 10
13 11
8
6
4
2
9
7
5
3
A
B
C
D
E
F
G
H
J
BALL A1
INDICATOR
10.40
BSC
SQ
K
L
M
N
P
TOP VIEW
0.80 BSC
BALL PITCH
BOTTOM VIEW
1.31
1.21
1.11
1.70
MAX
DETAIL A
SEATING
PLANE
0.12
MAX
COPLANARITY
0.50
0.45
0.40
0.40 NOM
(NOTE 3)
NOTES
1. DIMENSIONS ARE IN MILLIMETERS.
BALL DIAMETER
2. COMPLIES WITH JEDEC REGISTERED OUTLINE
MO-205, VARIATION AE WITH EXCEPTION OF
THE BALL DIAMETER.
DETAIL A
3. MINIMUM BALL HEIGHT 0.25.
Figure 62. 160-Ball Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-2
Rev. E
|
Page 57 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
A1 BALL PAD CORNER
19.00 BSC SQ
16.00 BSC SQ
1.00 BSC
BALL PITCH
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
16 14 12 10
17 15 13 11
8
6
4
2
9
7
5
3
1
TOP VIEW
BOTTOM VIEW
0.40 MIN
2.50
2.23
SIDE VIEW
1.97
DETAIL A
0.20 MAX
COPLANARITY
NOTES
SEATING PLANE
0.70
0.60
0.50
1. DIMENSIONS ARE IN MILLIMETERS.
2. COMPLIES WITH JEDEC REGISTERED OUTLINE
MS-034, VARIATION AAG-2
DETAIL A
BALL DIAMETER
.
3. MINIMUM BALL HEIGHT 0.40
Figure 63. 169-Ball Plastic Ball Grid Array (B-169)
SURFACE MOUNT DESIGN
Table 40 is provided as an aid to PCB design. For industry-
standard design recommendations, refer to IPC-7351,
Generic Requirements for Surface Mount Design and Land Pat-
tern Standard.
Table 40. BGA Data for Use with Surface Mount Design
Package
Ball Attach Type
Solder Mask Opening
0.40 mm diameter
0.43 mm diameter
Ball Pad Size
Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-2
Plastic Ball Grid Array (PBGA) B-169
Solder Mask Defined
Solder Mask Defined
0.55 mm diameter
0.56 mm diameter
Rev. E
|
Page 58 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
ORDERING GUIDE
Temperature Speed Grade Operating Voltage
Range1
(Max) (Nom)
Package
Option
Model
Package Description
ADSP-BF531SBB400
–40°C to +85°C 400 MHz
–40°C to +85°C 400 MHz
–40°C to +85°C 400 MHz
1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 169-BallPlasticBallGridArray B-169
(PBGA)
ADSP-BF531SBBZ400
ADSP-BF531SBBC400
1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 169-BallPlasticBallGridArray B-169
(PBGA)
1.2 V internal,
1.8 V, 2.5 V or 3.3 V I/O
160-Ball Chip Scale Package BC-160-2
Ball Grid Array (CSP_BGA)
ADSP-BF531SBBCZ4002 –40°C to +85°C 400 MHz
1.2 V internal,
1.8 V, 2.5 V or 3.3 V I/O
160-Ball Chip Scale Package BC-160-2
Ball Grid Array (CSP_BGA)
ADSP-BF531SBST400
–40°C to +85°C 400 MHz
–40°C to +85°C 400 MHz
1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 176-Lead Quad Flatpack
(LQFP)
ST-176-1
ADSP-BF531SBSTZ4002
1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 176-Lead Quad Flatpack
(LQFP)
ST-176-1
ADSP-BF531WBBCZ-4A2,3 –40°C to +85°C 400 MHz
ADSP-BF531WBBZ-4A2,3 –40°C to +85°C 400 MHz
ADSP-BF531WBSTZ-4A2,3 –40°C to +85°C 400 MHz
ADSP-BF531WYBCZ-4A2,3 –40°C to +105°C 400 MHz
ADSP-BF531WYBZ-4A2,3 –40°C to +105°C 400 MHz
1.2 V internal, 3.0 V or 3.3 V I/O
1.2 V internal, 3.0 V or 3.3 V I/O
1.2 V internal, 3.0 V or 3.3 V I/O
1.2 V internal, 3.0 V or 3.3 V I/O
1.2 V internal, 3.0 V or 3.3 V I/O
160-Ball Chip Scale Package BC-160-2
Ball Grid Array (CSP_BGA)
169-BallPlasticBallGridArray B-169
(PBGA)
176-Lead Quad Flatpack
(LQFP)
ST-176-1
160-Ball Chip Scale Package BC-160-2
Ball Grid Array (CSP_BGA)
169-BallPlasticBallGridArray B-169
(PBGA)
ADSP-BF532SBB400
ADSP-BF532SBBZ4002
ADSP-BF532SBBC400
–40°C to +85°C 400 MHz
–40°C to +85°C 400 MHz
–40°C to +85°C 400 MHz
1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 169-BallPlasticBallGridArray B-169
(PBGA)
1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 169-BallPlasticBallGridArray B-169
(PBGA)
1.2 V internal,
1.8 V, 2.5 V or 3.3 V I/O
160-Ball Chip Scale Package BC-160-2
Ball Grid Array (CSP_BGA)
ADSP-BF532SBBCZ4002 –40°C to +85°C 400 MHz
1.2 V internal,
1.8 V, 2.5 V or 3.3 V I/O
160-Ball Chip Scale Package BC-160-2
Ball Grid Array (CSP_BGA)
ADSP-BF532SBST400
ADSP-BF532SBSTZ400
–40°C to +85°C 400 MHz
–40°C to +85°C 400 MHz
1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 176-Lead Quad Flatpack
(LQFP)
ST-176-1
1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 176-Lead Quad Flatpack
(LQFP)
ST-176-1
ADSP-BF532WBBCZ-4A2 –40°C to +85°C 400 MHz
ADSP-BF532WBBZ-4A2,3 –40°C to +85°C 400 MHz
ADSP-BF532WBSTZ-4A2,3 –40°C to +85°C 400 MHz
ADSP-BF532WYBCZ-4A2,3 –40°C to +105°C 400 MHz
ADSP-BF532WYBZ-4A2,3 –40°C to +105°C 400 MHz
1.2 V internal, 3.0 V or 3.3 V I/O
1.2 V internal, 3.0 V or 3.3 V I/O
1.2 V internal, 3.0 V or 3.3 V I/O
1.2 V internal, 3.0 V or 3.3 V I/O
1.2 V internal, 3.0 V or 3.3 V I/O
160-Ball Chip Scale Package BC-160-2
Ball Grid Array (CSP_BGA)
169-BallPlasticBallGridArray B-169
(PBGA)
176-Lead Quad Flatpack
(LQFP)
ST-176-1
160-Ball Chip Scale Package BC-160-2
Ball Grid Array (CSP_BGA)
169-BallPlasticBallGridArray B-169
(PBGA)
Rev. E
|
Page 59 of 60
|
July 2007
ADSP-BF531/ADSP-BF532/ADSP-BF533
Temperature Speed Grade Operating Voltage
Package
Option
Model
Range1
(Max)
(Nom)
Package Description
ADSP-BF533SBB500
–40°C to +85°C 500 MHz
–40°C to +85°C 500 MHz
–40°C to +85°C 500 MHz
1.2 V Internal, 1.8 V or 2.5 V or 3.3 V I/O 169-BallPlasticBallGridArray B-169
(PBGA)
ADSP-BF533SBBZ5002
ADSP-BF533SBBC500
1.2 V Internal, 1.8 V or 2.5 V or 3.3 V I/O 169-BallPlasticBallGridArray B-169
(PBGA)
1.2 V Internal
1.8 V, 2.5 V or 3.3 V I/O
160-Ball Chip Scale Package BC-160-2
Ball Grid Array (CSP_BGA)
ADSP-BF533SBBCZ5002 –40°C to +85°C 500 MHz
1.2 V Internal
1.8 V, 2.5 V or 3.3 V I/O
160-Ball Chip Scale Package BC-160-2
Ball Grid Array (CSP_BGA)
ADSP-BF533SBBC-5V
ADSP-BF533SBBCZ-5V2
–40°C to +85°C 533 MHz
–40°C to +85°C 533 MHz
1.25 V Internal
1.8 V, 2.5 V or 3.3 V I/O
160-Ball Chip Scale Package BC-160-2
Ball Grid Array (CSP_BGA)
1.2 V Internal
1.8 V, 2.5 V or 3.3 V I/O
160-Ball Chip Scale Package BC-160-2
Ball Grid Array (CSP_BGA)
ADSP-BF533SBBCZ4002 –40°C to +85°C 400 MHz
1.25 V internal,
1.8 V, 2.5 V or 3.3 V I/O
160-Ball Chip Scale Package BC-160-2
Ball Grid Array (CSP_BGA)
ADSP-BF533SBST400
ADSP-BF533SBSTZ4002
ADSP-BF533SKBC-6V
ADSP-BF533SKBCZ-6V2
–40°C to +85°C 400 MHz
–40°C to +85°C 400 MHz
1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 176-Lead Quad Flatpack
(LQFP)
ST-176-1
1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 176-Lead Quad Flatpack
(LQFP)
ST-176-1
0°C to +70°C
0°C to +70°C
600 MHz
600 MHz
1.3 V Internal
1.8 V, 2.5 V or 3.3 V I/O
160-Ball Chip Scale Package BC-160-2
Ball Grid Array (CSP_BGA)
1.3 V Internal
1.8 V, 2.5 V or 3.3 V I/O
160-Ball Chip Scale Package BC-160-2
Ball Grid Array (CSP_BGA)
ADSP-BF533WBBCZ-5A2,3 –40°C to +85°C 500 MHz
ADSP-BF533WBBZ-5A2,3 –40°C to +85°C 500 MHz
ADSP-BF533WYBCZ-4A2,3 –40°C to +105°C 400 MHz
ADSP-BF533WYBZ-4A2,3 –40°C to +105°C 400 MHz
1.2 V Internal, 3.0 V or 3.3 V I/O
1.2 V Internal, 3.0 V or 3.3 V I/O
1.2 V internal, 3.0 V or 3.3 V I/O
1.2 V internal, 3.0 V or 3.3 V I/O
160-Ball Chip Scale Package BC-160-2
Ball Grid Array (CSP_BGA)
169-BallPlasticBallGridArray B-169
(PBGA)
160-Ball Chip Scale Package BC-160-2
Ball Grid Array (CSP_BGA)
169-BallPlasticBallGridArray B-169
(PBGA)
1 Referenced temperature is ambient temperature.
2 Z = RoHS Compliant Part.
3 Automotive grade part.
©2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03728-0-7/07(E)
Rev. E
|
Page 60 of 60
|
July 2007
相关型号:
ADSP-BF532SBBC400X
IC 16-BIT, 33.33 MHz, OTHER DSP, PBGA160, PLASTIC, MO-025AE, BGA-160, Digital Signal Processor
ADI
ADSP-BF532SBBCZ400
16-BIT, 40 MHz, OTHER DSP, PBGA160, ROHS COMPLIANT, MO-205AE, CSBGA-160
ROCHESTER
ADSP-BF532SBBZ400
16-BIT, 40 MHz, OTHER DSP, PBGA169, ROHS COMPLIANT, PLASTIC, MO-034AAG-2, BGA-169
ROCHESTER
©2020 ICPDF网 联系我们和版权申明