ADMV7310BCEZ [ADI]
E-Band Upconverter SiP, 71 GHz to 76 GHz;型号: | ADMV7310BCEZ |
厂家: | ADI |
描述: | E-Band Upconverter SiP, 71 GHz to 76 GHz |
文件: | 总29页 (文件大小:437K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
E-Band Upconverter SiP,
71 GHz to 76 GHz
ADMV7310
Data Sheet
FEATURES
GENERAL DESCRIPTION
Maximum conversion gain: 35 dB typical
Gain tuning range: 40 dB minimum
The ADMV7310 is a fully integrated system in package (SiP),
in phase/quadrature (I/Q) upconverter that operates between
an intermediate frequency (IF) input range of dc to 2 GHz and a
radio frequency (RF) output range of 71 GHz to 76 GHz. The
device uses an image rejection mixer that is driven by a 6× local
oscillator (LO) multiplier. The mixer RF output is followed by a
variable gain amplifier (VGA) and a power amplifier (PA),
providing a conversion gain of 35 dB typical. Differential I and
Q mixer inputs are provided and can be driven with differential
I and Q baseband waveforms for direct conversion applications.
Alternatively, the inputs can be driven using an external 90° hybrid
and two external 180° hybrids for single-ended applications.
PSAT: 26 dBm typical for a gain = 23.5 dB and 19.5 dB
OIP3: 31 dBm typical for a gain = 23.5 dB and POUT
16.5 dBm per tone
OP1dB: 25 dBm typical for a gain = 23.5 dB and 19.5 dB
Built-in power detector
Built-in envelope detector for LO nulling
Fully integrated, surface-mount, 50-terminal, 16.00 mm ×
14.00 mm LGA_CAV package
=
APPLICATIONS
E-band communication systems
High capacity wireless backhauls
Test and measurement
The ADMV7310 comes in a fully integrated, surface-mount,
50-terminal, 16.00 mm × 14.00 mm, chip array small outline no
lead cavity (LGA_CAV) package. The ADMV7310 operates
over the −40°C to +85°C temperature range.
Aerospace and defense
FUNCTIONAL BLOCK DIAGRAM
1
2
3
4
5
6
7
8
GND
IF_IP
×6
IF_IN
IF_QN
IF_QP
ADMV7310
GND
PORT 1
RFOUT
VGA_VG12
GND
VGA
PA
VGA_VD12
ENV_DET
VGA_CTL12
GND
9
10
11
12
Figure 1.
Rev. A
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Technical Support
©2019 Analog Devices, Inc. All rights reserved.
www.analog.com
ADMV7310
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Theory of Operation ...................................................................... 23
Mixer and LO Path..................................................................... 23
Envelope Detector, VGA, and Power Detector ...................... 23
Power Amplifier and Power Detector ..................................... 23
Applications Information.............................................................. 25
Power-Up Bias Sequence........................................................... 25
Power-Down Bias Sequence ..................................................... 25
LO Nulling................................................................................... 25
Gain Tuning Procedure ............................................................. 26
Layout .......................................................................................... 27
Typical Application Circuit........................................................... 28
Outline Dimensions....................................................................... 29
Ordering Guide .......................................................................... 29
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 5
Thermal Resistance ...................................................................... 5
ESD Caution.................................................................................. 5
Pin Configuration and Function Descriptions............................. 6
Interface Schematics..................................................................... 8
Typical Performance Characteristics ............................................. 9
Detector Performance................................................................ 19
Return Loss Performance.......................................................... 21
Spurious Performance................................................................ 22
REVISION HISTORY
10/2019—Revision A: Initial Version
Rev. A | Page 2 of 29
Data Sheet
ADMV7310
SPECIFICATIONS
TA = −40°C to +85°C, IF = 1 GHz, LO power = 4 dBm, VD_AMP = +4 V, VGA_CTL12 = −5 V, VG_MIXER = −1 V, VD_MULT = +1.5 V,
VGA_VD12 = VGA_VD345 = VGA_VD6 = +4 V, and PA_VD1 = PA_VD2 = +4 V, unless otherwise noted. Measurements performed as
upconverter with lower sideband selected and an external 90° hybrid followed by two external 180° hybrids at the IF ports.
Table 1.
Parameter
Test Conditions/Comments
Min Typ Max Unit
OPERATING CONDITIONS
Frequency Range
Output RF
71
76
12.7
2
GHz
GHz
GHz
dBm
dBm
LO
Input IF
11.8
DC
0
LO Drive Level Range
Input Signal Level
PERFORMANCE
Maximum Conversion Gain
Gain Tuning Range
Gain Flatness
4
−4
8
Total baseband power
−20 dBm input
24.5 35
40
44.5
dB
dB
dB
dBc
3
20
Sideband Rejection
Output Power for 1 dB Compression (OP1dB)
−4 dBm input
15
Gain = 23.5 dB
Gain = 19.5 dB
Gain = 10.5 dB
Gain = 3.5 dB
21.5 25
21.5 25
16.5 20
dBm
dBm
dBm
dBm
9.5
13
Saturated Output Power (PSAT
Noise Figure (NF)
)
Gain = 23.5 dB
Gain = 19.5 dB
Gain = 10.5 dB
Gain = 3.5 dB
23
23
26
26
dBm
dBm
dBm
dBm
17.5 23
10.5 16
Gain = 23.5 dB
Gain = 19.5 dB
Gain = 10.5 dB
Gain = 3.5 dB
26
26
29
31
dB
dB
dB
dB
6× LO to RF Rejection
RF port uncalibrated
Gain = 23.5 dB
Gain = 19.5 dB
Gain = 10.5 dB
Gain = 3.5 dB
5
5
5
5
18
18
18
18
dBc
dBc
dBc
dBc
Output Third-Order Intercept (OIP3)
Gain = 23.5 dB, output power (POUT) =
16.5 dBm per tone
27
31
dBm
Gain = 19.5 dB, POUT = 12.5 dBm per tone
Gain = 10.5 dB, POUT = 3.5 dBm per tone
Gain = 3.5 dB, POUT = −3.5 dBm per tone
26
22
16
29
25
20
6
dBm
dBm
dBm
dB
Output Waveguide Port Return Loss
Baseband Input Return Loss
LO Port Return Loss
10
10
dB
dB
Rev. A | Page 3 of 29
ADMV7310
Data Sheet
Parameter
Test Conditions/Comments
Min Typ Max Unit
Minimum Power Amplifier Detector Sensitivity
−5 dBm ≤ POUT ≤ 0 dBm
0 dBm ≤ POUT ≤ 23 dBm
0.5
2
mV/dB
mV/dB
Power Amplifier Detector Voltage
Minimum (DET2_REF − DET2_OUT)
Maximum (DET2_REF − DET2_OUT)
DET2_REF
−5 dBm ≤ POUT ≤ 0 dBm
0 dBm ≤ POUT ≤ 23 dBm
−5 dBm ≤ POUT ≤ 23 dBm
−5 dBm ≤ POUT ≤ 23 dBm
3
600
0.9
mV
mV
V
0
−1
2.5
2.5
DET2_OUT
V
Envelope Detector
Minimum AC Detected Signal
3 dB Bandwidth
Load resistance (RLOAD) = 200 Ω
−4 dBm ≤ input power (PIN) ≤ 9.5 dBm
45
750
24
mV p-p
MHz
dBc
Ω
Second Harmonic
DIFFERENTIAL BASEBAND INPUT PORT IMPEDANCE
LO INPUT PORT IMPEDANCE
POWER SUPPLY
100
50
Ω
DC Power Dissipation
5
4
W
V
V
V
V
V
mA
mA
mA
mA
PA (PA_VD1 and PA_VD2) Drain Voltage
PA (PA_VG1 and PA_VG2) Gate Voltage
VGA (VGA_VG12, VGA_VG345, and VGA_VG6) Gate Voltage
Multiplier Drain Voltage (VD_MULT)
VGA Voltage Control (VGA_CTL12)
PA (IPA_VD1 and IPA_VD2) Drain Current
VGA (IVGA_VD12, IVGA_VD345, and IVGA_VD6) Drain Current
3.88
−2
−2
4.12
+0.2
+0.2
1.55
0
1.46 1.5
−5
800
250
175
80
Amplifier Drain (VD_AMP) Current (IVD_AMP
Multiplier Drain (VD_MULT) Current (IVD_MULT
)
)
Rev. A | Page 4 of 29
Data Sheet
ADMV7310
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Parameter
Rating
VD_AMP
VD_MULT
4.5 V
3 V
VGA_VD12, VGA_VD345, and VGA_VD6
PA_VD1 and PA_VD2
VG_AMP
4.5 V
4.5 V
θJC is the junction to case (or die to package) thermal resistance.
Table 3. Thermal Resistance1
−3 V to +0.2 V
−3 V to +0.2 V
−3 V to +0.2 V
−3 V to +0.2 V
−6 V to 0 V
10 dBm
Package Type
θJC
Unit
VG_MULT
VGA_VG12, VGA_VG345, and VGA_VG6
PA_VG1 and PA_VG2
VGA_CTL12
CE-50-2
15
°C/W
1 Thermal impedance simulated values are based on a JEDEC 2S2P test board
with 16 mm × 14 mm thermal vias. Refer to JEDEC standard JESD51-2 for
additional information.
LO Drive
Baseband Input (IF_IP, IF_IN, IF_QP, and
IF_QN)
4 dBm
ESD CAUTION
IF Source and Sink Current
3 mA
Nominal Junction Temperature (TA = 85°C) 160°C
Maximum Junction Temperature
(to Maintain 1 Million Hours Mean Time
to Failure (MTTF))
190°C
Maximum Junction Temperature
(to Maintain 3 Million MTTF)
175°C
Operating Temperature Range
Storage Temperature Range
Maximum Peak Reflow Temperature
(Moisture Sensitivity Level 3 (MSL3))
−40°C to +85°C
−55°C to +150°C
260°C
Thermal Humidity Bias (THB)
Thermal Humidity Storage (THS)
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
Field Induced Charged Device Model
(FICDM)
JESD22-A1011, 2, 3
JESD22-A1011, 3
200 V
300 V
1 Samples subject to preconditioning (per J-STD-020 Level 3) prior to the start
of the stress test. Level 3 preconditioning consists of the following: bake for
24 hours at 125°C, unbiased soak for 192 hours at 30°C and 60% relative
humidity (RH), and reflow of three passes through an oven with a peak
temperature of 260°C.
2 Results valid for 600 mW of nominal dc power dissipation for all active
devices. Analog Devices, Inc., recommends that users perform their own THB
test for all other bias conditions.
3 Valid for package vent hole solder sealed or unsealed during test.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. A | Page 5 of 29
ADMV7310
Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
GND
IF_IP
3
IF_IN
4
IF_QN
5
IF_QP
ADMV7310
6
GND
PORT 1
RFOUT
TOP VIEW
7
VGA_VG12
GND
(Not to Scale)
8
9
VGA_VD12
ENV_DET
VGA_CTL12
GND
10
11
12
NOTES
1. EXPOSED PADS. THE EXPOSED GROUND PADS MUST BE CONNECTED
TO RF AND DC GROUND.
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic
Description
1, 6, 8, 12 to 15, 18, 23, 25, 27, 30 to 34, 36,
38, 39, 41, 43, 45, 47, 50
GND
Ground Connections. These pins must be connected to RF and dc ground.
2
3
4
5
IF_IP
Positive IF In Phase Input. This pin is dc-coupled. When operation to dc is not
required, block this pin externally using a series capacitor with a value
chosen to pass the necessary frequency range. For operation to dc, this pin
must not source or sink more than 3 mA of current or device malfunction
and device failure may result.
Negative IF In Phase Input. This pin is dc-coupled. When operation to dc is
not required, block this pin externally using a series capacitor with a value
chosen to pass the necessary frequency range. For operation to dc, this pin
must not source or sink more than 3 mA of current or device malfunction
and device failure may result.
Negative IF Quadrature Input. This pin is dc-coupled. When operation to dc is
not required, block this pin externally using a series capacitor with a value
chosen to pass the necessary frequency range. For operation to dc, this pin
must not source or sink more than 3 mA of current or device malfunction
and device failure may result.
Positive IF Quadrature Input. This pin is dc-coupled. When operation to dc is
not required, block this pin externally using a series capacitor with a value
chosen to pass the necessary frequency range. For operation to dc, this pin
must not source or sink more than 3 mA of current or device malfunction
and device failure may result.
IF_IN
IF_QN
IF_QP
7
VGA_VG12
VGA_VD12
ENV_DET
Gate Control for the First and Second Stage Variable Gain Amplifier. See
Figure 86 for the recommended external components.
Drain Voltage for the First and Second Stage Variable Gain Amplifier. See
Figure 86 for the recommended external components.
9
10
Envelope Detector. See Figure 86 for the recommended external components.
Rev. A | Page 6 of 29
Data Sheet
ADMV7310
Pin No.
Mnemonic
Description
11
VGA_CTL12
Gain Control Voltage for the First and Second Stage Variable Gain Amplifier.
See Figure 86 for the recommended external components.
16
17
19
20
21
VGA_VG345
VGA_VD345
VGA_VG6
Gate Control for the Third, Fourth, and Fifth Stage Variable Gain Amplifier.
See Figure 86 for the recommended external components.
Drain Voltage for the Third, Fourth, and Fifth Stage Variable Gain Amplifier.
See Figure 86 for the recommended external components.
Gate Control for the Sixth Stage Variable Gain Amplifier. See Figure 86 for the
recommended external components.
Drain Voltage for the Sixth Stage Variable Gain Amplifier. See Figure 86 for
the recommended external components.
VGA_VD6
DET1_REF
Reference Voltage for the VGA Power Detector. DET1_REF is the dc bias of
the diode biased through an external resistor used for the temperature
compensation of DET1_OUT.
22
DET1_OUT
Detector Voltage for the VGA Power Detector. DET1_OUT is the dc voltage
representing the RF output power rectified by the diode, which is biased
through an external resistor.
24
26
28
PA_VG1
PA_VG2
DET2_REF
Gate Voltage for the First Power Amplifier. See Figure 86 for the
recommended external components.
Gate Voltage for the Second Power Amplifier. See Figure 86 for the
recommended external components.
Reference Voltage for the PA Power Detector. DET2_REF is the dc bias of the
diode biased through an external resistor used for the temperature
compensation of DET2_OUT.
29
DET2_OUT
Detector Voltage for the VGA Power Detector. DET2_OUT is the dc voltage
representing the RF output power rectified by the diode, which is biased
through an external resistor.
35
37
PA_VD2
PA_VD1
Drain Voltage for the Second Power Amplifier. See Figure 86 for the
recommended external components.
Drain Voltage for the First Power Amplifier. See Figure 86 for the
recommended external components.
40
42
LOIN
VG_MULT
LO Input. This pin is dc-coupled and matched to 50 Ω.
Gate Voltage for the LO Multiplier. See Figure 86 for the recommended
external components.
44
VD_MULT
VG_AMP
VD_AMP
VG_MIXER
RFOUT
Drain Voltage for the LO Multiplier. See Figure 86 for the recommended
external components.
Gate Voltage for the LO Amplifier. See Figure 86 for the recommended
external components.
Drain Voltage for the LO Amplifier. See Figure 86 for the recommended
external components.
Gate Voltage for the Field Effect Transistor (FET) Mixer. See Figure 86 for the
recommended external components.
46
48
49
PORT 1
WR-12 Waveguide Port. This port is ac-coupled and matched to the waveguide
output impedance.
EPAD
Exposed Pads. The exposed ground pads must be connected to RF and dc
ground.
Rev. A | Page 7 of 29
ADMV7310
Data Sheet
INTERFACE SCHEMATICS
DET1_REF
DET2_REF
DET1_OUT
DET2_OUT
GND
Figure 3. GND Interface Schematic
Figure 9. DET1_REF, DET2_REF, DET1_OUT, and DET2_OUT Interface
Schematic
IF_IP, IF_IN
IF_QN, IF_QP
VG_MIXER
PA_VG1,
PA_VG2
Figure 4. IF_IP, IF_IN, IF_QN, IF_QP, and VG_MIXER Interface Schematic
Figure 10. PA_VG1, PA_VG2 Interface Schematic
PA_VD1
PA_VD2
VGA_VG12
VGA_VG345
VGA_VG6
Figure 5. VGA_VG12, VGA_VG345, and VGA_VG6 Interface Schematic
Figure 11. PA_VD1, PA_VD2 Interface Schematic
VGA_VD12
VGA_VD345
VGA_VD6
LOIN
Figure 6. VGA_VD12, VGA_VD345, and VGA_VD6 Interface Schematic
Figure 12. LOIN Interface Schematic
VD_AMP,
VD_MULT
VG_AMP,
VG_MULT
ENV_DET
Figure 7. ENV_DET Interface Schematic
Figure 13. VD_AMP, VD_MULT, VG_AMP, and VG_MULT Interface
Schematic
VGA_CTL12
RFOUT
Figure 8. VGA_CTL12 Interface Schematic
Figure 14. RFOUT Interface Schematic
Rev. A | Page 8 of 29
Data Sheet
ADMV7310
TYPICAL PERFORMANCE CHARACTERISTICS
TA = 25°C, IF = 1 GHz, IF input power = −4 dBm combined, LO power = +4 dBm, gain adjusted per Applications Information section,
and lower sideband selected, unless otherwise noted.
44
42
40
38
36
34
32
30
28
26
24
44
42
40
38
36
34
32
30
28
26
24
0dBm
2dBm
4dBm
6dBm
8dBm
+85°C
+25°C
–40°C
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 15. Maximum Conversion Gain vs. RF Frequency over Temperature,
IF Input Power = −20 dBm
Figure 18. Maximum Conversion Gain vs. RF Frequency over LO Power,
IF Input Power = −20 dBm
40
38
36
34
32
30
28
40
38
36
34
32
30
28
2dBm
26
26
4dBm
6dBm
8dBm
+85°C
+25°C
–40°C
24
22
20
24
22
20
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 16. Output IP3 vs. RF Frequency over Temperature, Gain = 23.5 dB
Figure 19. Output IP3 vs. RF Frequency over LO Power, Gain = 23.5 dB
40
35
30
25
20
40
35
30
25
20
15
10
2dBm
4dBm
6dBm
8dBm
+85°C
+25°C
–40°C
15
10
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 17. Sideband Rejection vs. RF Frequency over Temperature,
Gain = 23.5 dB
Figure 20. Sideband Rejection vs. RF Frequency over LO Power,
Gain = 23.5 dB
Rev. A | Page 9 of 29
ADMV7310
Data Sheet
32
28
24
20
16
12
8
32
28
24
20
16
12
8
2dBm
4dBm
6dBm
8dBm
+85°C
+25°C
–40°C
4
4
0
0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 24. 6× LO Rejection vs. RF Frequency over LO Power,
Gain = 23.5 dB
Figure 21. 6× LO Rejection vs. RF Frequency over Temperature,
Gain = 23.5 dB
36
30
29
28
27
26
25
24
34
32
30
28
26
24
22
20
18
16
23.5dB
19.5dB
10.5dB
3.5dB
23
+85°C
+25°C
–40°C
22
21
20
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 25. Output IP3 vs. RF Frequency at Various Gains
Figure 22. Output P1dB vs. RF Frequency over Temperature,
Gain = 23.5 dB
40
30
29
28
27
26
25
24
23
22
21
20
35
30
25
20
15
10
23.5dB
19.5dB
10.5dB
3.5dB
+85°C
+25°C
–40°C
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 23. PSAT vs. RF Frequency over Temperature, Gain = 23.5 dB
Figure 26. Sideband Rejection vs. RF Frequency at Various Gains
Rev. A | Page 10 of 29
Data Sheet
ADMV7310
40
35
30
25
20
15
10
5
32
28
24
20
16
12
8
MAXIMUM GAIN
VGA_CTL12 = –1V, VGA_VD345 + VGA_VD6 = 30mA
VGA_CTL12 = –1V, VGA_VD345 + VGA_VD6 = 30mA,
PA_VD1 = 80mA, PA_VD2 = 80mA
23.5dB
19.5dB
10.5dB
3.5dB
0
–5
–10
–15
–20
VGA_CTL12 = –1V
VGA_CTL12 = –1V, VGA_VD345 + VGA_VD6 = 30mA,
PA_VD1 = 80mA
4
0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 30. Conversion Gain vs. RF Frequency at Various Gain Tuning Modes
Figure 27. 6× LO to RF Rejection vs. RF Frequency at Various Gains
30
28
26
24
22
40
38
36
34
32
30
20
18
16
14
12
10
23.5dB
19.5dB
10.5dB
3.5dB
28
71.0GHz
26
73.5GHz
76.0GHz
24
22
20
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
–5.0
–4.5
–4.0
–3.5
–3.0
–2.5
–2.0
–1.5
–1.0
RF FREQUENCY (GHz)
VGA CONTROL VOLTAGE (V)
Figure 31. Conversion Gain vs. VGA Control Voltage at Various RF
Frequencies
Figure 28. Output P1dB vs. RF Frequency at Various Gains
10
30
28
26
24
22
20
18
16
14
12
10
71.0GHz
8
73.5GHz
76.0GHz
6
4
2
0
23.5dB
19.5dB
10.5dB
3.5dB
–2
–4
500
550
600
650
700
750
800
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
PA CURRENT (mA)
RF FREQUENCY (GHz)
Figure 32. Conversion Gain vs. PA Current at Various RF Frequencies,
VGA_CTL12 = −1 V, VGA_VD12 = 75 mA, VGA_VD345 = 75 mA, VGA_VD6 =
75 mA
Figure 29. PSAT vs. RF Frequency at Various Gains
Rev. A | Page 11 of 29
ADMV7310
Data Sheet
30
25
20
15
10
5
850
800
750
700
650
600
550
500
450
71.0GHz
73.5GHz
76.0GHz
71GHz
73.5GHz
76GHz
0
70
90
110
130
150
170
190
210
230
250
–0.80 –0.75 –0.70 –0.65 –0.60 –0.55 –0.50 –0.45 –0.40
VGA DRAIN CURRENT (mA)
VGA_VG345 + VGA_VG6 VOLTAGE (V)
Figure 33. Conversion Gain vs. VGA Current at Various RF Frequencies,
VGA_CTL12 = −1 V
Figure 35. PA Drain Current vs. VGA_VG345 + VGA_VG6 Voltage at Various
Frequencies
250
71.0GHz
73.5GHz
76.0GHz
230
210
190
170
150
130
110
90
70
50
–0.80 –0.75 –0.70 –0.65 –0.60 –0.55 –0.50 –0.45 –0.40
VGA_VG345 + VGA_VG6 VOLTAGE (V)
Figure 34. VGA Drain Current vs. VGA_VG345 + VGA_VG6 Voltage at Various
Frequencies
Rev. A | Page 12 of 29
Data Sheet
ADMV7310
TA = 25°C, IF = 0.1 GHz, IF input power = −4 dBm combined, LO power = 4 dBm, gain adjusted per Applications Information section,
and lower sideband selected, unless otherwise noted.
44
42
40
38
36
34
32
30
28
26
24
40
35
30
25
20
15
10
5
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 39. 6× LO Rejection vs. RF Frequency over Temperature,
Gain = 23.5 dB
Figure 36. Maximum Conversion Gain vs. RF Frequency over Temperature, IF
Input Power = −20 dBm
30
29
28
27
26
25
24
40
38
36
34
32
30
28
23
26
+85°C
+85°C
22
21
20
+25°C
–40°C
24
22
20
+25°C
–40°C
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 37. Output IP3 vs. RF Frequency over Temperature, Gain = 23.5 dB
Figure 40. Output P1dB vs. RF Frequency over Temperature,
Gain = 23.5 dB
40
35
30
25
20
15
30
29
28
27
26
25
24
23
22
21
20
10
5
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 38. Sideband Rejection vs. RF Frequency over Temperature,
Gain = 23.5 dB
Figure 41. PSAT vs. RF Frequency over Temperature, Gain = 23.5 dB
Rev. A | Page 13 of 29
ADMV7310
Data Sheet
36
34
32
30
28
26
24
22
20
18
16
30
28
26
24
22
20
18
16
14
12
10
23.5dB
19.5dB
10.5dB
3.5dB
23.5dB
19.5dB
10.5dB
3.5dB
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 42. Output IP3 vs. RF Frequency at Various Gains
Figure 45. Output P1dB vs. RF Frequency at Various Gains
40
30
28
26
24
22
20
18
16
14
12
10
35
30
25
20
15
10
23.5dB
19.5dB
10.5dB
3.5dB
23.5dB
19.5dB
10.5dB
3.5dB
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 46. PSAT vs. RF Frequency at Various Gains
Figure 43. Sideband Rejection vs. RF Frequency at Various Gains
32
38
24
20
16
12
23.5dB
19.5dB
10.5dB
3.5dB
8
4
0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
Figure 44. 6× LO to RF Rejection vs. RF Frequency at Various Gains
Rev. A | Page 14 of 29
Data Sheet
ADMV7310
TA = 25°C, IF = 0.5 GHz, IF input power = −4 dBm combined, LO power = 4 dBm, gain adjusted per Applications Information section,
and lower sideband selected, unless otherwise noted.
44
42
40
38
36
34
32
30
28
26
24
40
35
30
25
20
15
10
5
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 47. Maximum Conversion Gain vs. RF Frequency over Temperature,
IF Input Power = −20 dBm
Figure 50. 6× LO Rejection vs. RF Frequency over Temperature,
Gain = 23.5 dB
40
38
36
34
32
30
28
30
28
26
24
22
20
18
26
16
+85°C
+85°C
24
22
20
+25°C
–40°C
14
12
10
+25°C
–40°C
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 48. Output IP3 vs. RF Frequency over Temperature, Gain = 23.5 dB
Figure 51. Output P1dB vs. RF Frequency over Temperature,
Gain = 23.5 dB
42
38
34
30
26
22
30
29
28
27
26
25
24
23
22
21
20
18
14
10
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 49. Sideband Rejection vs. RF Frequency over Temperature,
Gain = 23.5 dB
Figure 52. PSAT vs. RF Frequency over Temperature, Gain = 23.5 dB
Rev. A | Page 15 of 29
ADMV7310
Data Sheet
36
34
32
30
28
26
24
22
20
18
16
30
28
26
24
22
20
18
16
14
12
10
23.5dB
19.5dB
10.5dB
3.5dB
23.5dB
19.5dB
10.5dB
3.5dB
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 53. Output IP3 vs. RF Frequency at Various Gains
Figure 56. Output P1dB vs. RF Frequency at Various Gains
42
30
28
26
24
22
20
18
16
14
12
10
38
34
30
26
22
18
14
10
23.5dB
19.5dB
10.5dB
3.5dB
23.5dB
19.5dB
10.5dB
3.5dB
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 54. Sideband Rejection vs. RF Frequency at Various Gains
Figure 57. PSAT vs. RF Frequency at Various Gains
32
28
24
20
16
12
23.5dB
19.5dB
10.5dB
3.5dB
8
4
0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
Figure 55. 6× LO to RF Rejection vs. RF Frequency at Various Gains
Rev. A | Page 16 of 29
Data Sheet
ADMV7310
TA = 25°C, IF = 2 GHz, IF input power = −4 dBm combined, LO power = 4 dBm, gain adjusted per Applications Information section, and
lower sideband selected, unless otherwise noted.
44
42
40
38
36
34
32
30
28
26
24
32
28
24
20
16
12
8
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
4
0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 58. Maximum Conversion Gain vs. RF Frequency over Temperature,
IF Input Power = −20 dBm
Figure 61. 6× LO Rejection vs. RF Frequency over Temperature,
Gain = 23.5 dB
40
38
36
34
32
30
28
30
29
28
27
26
25
24
26
23
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
24
22
20
22
21
20
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 59. Output IP3 vs. RF Frequency over Temperature, Gain = 23.5 dB
Figure 62. Output P1dB vs. RF Frequency over Temperature,
Gain = 23.5 dB
40
35
30
25
20
15
30
29
28
27
26
25
24
23
22
21
20
10
5
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 63. PSAT vs. RF Frequency over Temperature, Gain = 23.5 dB
Figure 60. Sideband Rejection vs. RF Frequency over Temperature,
Gain = 23.5 dB
Rev. A | Page 17 of 29
ADMV7310
Data Sheet
36
34
32
30
28
26
24
22
20
18
16
30
28
26
24
22
20
18
16
14
12
10
23.5dB
19.5dB
10.5dB
3.5dB
23.5dB
19.5dB
10.5dB
3.5dB
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 64. Output IP3 vs. RF Frequency at Various Gains
Figure 67. Output P1dB vs. RF Frequency at Various Gains
42
30
28
26
24
22
20
18
16
14
12
10
38
34
30
26
22
18
14
10
23.5dB
19.5dB
10.5dB
3.5dB
23.5dB
19.5dB
10.5dB
3.5dB
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 68. PSAT vs. RF Frequency at Various Gains
Figure 65. Sideband Rejection vs. RF Frequency at Various Gains
32
28
24
20
16
12
23.5dB
19.5dB
10.5dB
3.5dB
8
4
0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
Figure 66. 6× LO to RF Rejection vs. RF Frequency at Various Gains
Rev. A | Page 18 of 29
Data Sheet
ADMV7310
DETECTOR PERFORMANCE
0.40
1
10MHz
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
100MHz
240MHz
490MHz
740MHz
990MHz
0.1
0.01
0.001
+85°C
+25°C
–40°C
–10
–8
–6
–4
–2
0
2
4
6
–5
0
5
10
15
20
25
TOTAL INPUT POWER (dBm)
OUTPUT POWER (dBm)
Figure 69. Envelope Detector Output Voltage vs. Total Input Power at Various
Input Tone Spacings, RF = 71 GHz
Figure 72. PA Detector Output Voltage (DET2_REF − DET2_OUT) vs. Output
Power over Temperatures, RF = 71 GHz
0.40
1
10MHz
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
100MHz
240MHz
490MHz
740MHz
990MHz
0.1
0.01
+85°C
+25°C
–40°C
0.001
–10
–8
–6
–4
–2
0
2
4
6
–5
0
5
10
15
20
25
TOTAL INPUT POWER (dBm)
OUTPUT POWER (dBm)
Figure 70. Envelope Detector Output Voltage vs. Total Input Power at Various
Input Tone Spacings, RF = 73.5 GHz
Figure 73. PA Detector Output Voltage (DET2_REF − DET2_OUT) vs. Output
Power over Temperatures, RF = 73.5 GHz
0.35
1
10MHz
100MHz
240MHz
490MHz
740MHz
990MHz
0.30
0.25
0.20
0.15
0.10
0.05
0
0.1
0.01
+85°C
+25°C
–40°C
0.001
–5
–10
–8
–6
–4
–2
0
2
4
6
0
5
10
15
20
25
TOTAL INPUT POWER (dBm)
OUTPUT POWER (dBm)
Figure 71. Envelope Detector Output Voltage vs. Total Input Power at Various
Input Tone Spacings, RF = 76 GHz
Figure 74. PA Detector Output Voltage (DET2_REF − DET2_OUT) vs. Output
Power over Temperatures, RF = 76 GHz
Rev. A | Page 19 of 29
ADMV7310
Data Sheet
1000
100
10
1000
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
100
10
1
1
0.1
0.1
–5
0
5
10
15
20
25
–5
0
5
10
15
20
25
OUTPUT POWER (dBm)
OUTPUT POWER (dBm)
Figure 75. PA Detector Sensitivity vs. Output Power over Temperature,
RF = 71 GHz
Figure 77. PA Detector Sensitivity vs. Output Power over Temperature,
RF = 76 GHz
1000
+85°C
+25°C
–40°C
100
10
1
0.1
-5
0
5
10
15
20
25
OUTPUT POWER (dBm)
Figure 76. PA Detector Sensitivity vs. Output Power over Temperature,
RF = 73.5 GHz
Rev. A | Page 20 of 29
Data Sheet
ADMV7310
RETURN LOSS PERFORMANCE
0
0
–2
+85°C
+85°C
+25°C
–40°C
+25°C
–40°C
–2
–4
–6
–4
–6
–8
–8
–10
–12
–14
–16
–18
–20
–10
–12
–14
–16
–18
–20
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
11.8
12.0
12.2
12.4
12.6
12.8
LO FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 80. IF Return Loss vs. IF Frequency over Temperature
Figure 78. LO Return Loss vs. LO Frequency over Temperature
0
+85°C
+25°C
–40°C
–2
–4
–6
–8
–10
–12
–14
–16
–18
–20
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
RF FREQUENCY (GHz)
Figure 79. RF Return Loss vs. RF Frequency over Temperature
Rev. A | Page 21 of 29
ADMV7310
Data Sheet
SPURIOUS PERFORMANCE
TA = 25°C, IF = 1 GHz, IF input power = −4 dBm, and LO power = 4 dBm, unless otherwise noted. Mixer spurious products are measured
in dBc from the RF output power for 60 GHz to 90 GHz due to the waveguide bandwidth. Spur values are (M × IF) + (N × LO). N/A means not
applicable.
M × N Spurious Outputs, RF = 71 GHz, LO = 12 GHz
N × LO
5
6
7
N/A
−79
−72
−47
−41
0
−73
−72
−71
−68
−67
−71
−72
−68
−69
−66
−67
−5
−4
−3
−2
−1
0
N/A
N/A
N/A
N/A
−73
<−80
<−80
<−80
<−80
<−80
−18
−23
−49
−62
−78
−77
M × IF
+1
+2
+3
+4
+5
M × N Spurious Outputs, RF = 73.5 GHz, LO = 12.417 GHz
N × LO
5
6
7
N/A
<−80
−79
−56
−46
0
−72
−71
−70
−71
−69
−68
−66
−68
−68
N/A
N/A
−5
−4
−3
−2
−1
0
N/A
N/A
<−80
−75
−74
−20
−27
−58
−74
−73
−73
M × IF
<−80
<−80
<−80
<−80
<−80
+1
+2
+3
+4
+5
M × N Spurious Outputs, RF = 76 GHz, LO = 12.833 GHz
N × LO
5
6
7
N/A
<−80
−69
−56
−40
0
−71
−69
−69
−69
−67
−65
N/A
N/A
N/A
N/A
N/A
−5
−4
−3
−2
−1
0
<−80
<−80
<−80
−73
−68
−13
−26
−59
−73
−71
−70
M × IF
−80
+1
+2
+3
+4
+5
<−80
<−80
<−80
<−80
Rev. A | Page 22 of 29
Data Sheet
ADMV7310
THEORY OF OPERATION
The ADMV7310 is a fully integrated SiP, I/Q upconverter that is
made up of three functional blocks: a mixer and LO path, an
envelope detector, a VGA, and a power detector, and a power
amplifier and power detector.
The preamp is followed by the first voltage variable attenuator in
the signal path. Then, a second stage amplifier provides additional
gain and isolation before driving the second variable attenuator
block. Three cascaded gain stages follow the second variable
attenuator.
MIXER AND LO PATH
At the output of the second stage, another coupler taps off a
small portion of the output signal. The coupled signal is
presented to an on-chip diode detector for external monitoring
of the output power. A matched reference diode, Detector 1
(DET1), is included to help correct for detector temperature
dependencies. A typical application circuit for the power
detector is shown in Figure 83.
The first functional block is a gallium arsenide (GaAs) I/Q
upconverter driven by a 6× LO multiplier. The 6× multiplier
allows the use of a lower frequency range LO input signal between
11.8 GHz and 12.7 GHz. The 6× multiplier is implemented using
a cascade of 3× and 2× multipliers. LO buffer amplifiers are
included on chip to allow a typical LO drive level of 4 dBm for
typical performance. The LO path feeds a quadrature splitter
followed by on-chip baluns that drive the I and Q mixer cores.
The mixer cores comprise of singly balanced passive mixers.
The RF outputs of the I and Q mixers are then summed through
an on-chip Wilkinson power combiner, which is then fed into
the second functional block.
See the Applications Information section for further details on
biasing the different blocks. The output of the VGA then feeds
into the third functional block of the ADMV7310.
POWER AMPLIFIER AND POWER DETECTOR
The third block is a power amplifier that uses four cascaded
gain stages to form the amplifier (see Figure 82). At the output
of the last stage, a coupler taps off a small portion of the output
signal. The coupled signal is presented to an on-chip diode
detector for external monitoring of the output power. A matched
reference diode, Detector 2 (DET2), is included to help correct
for detector temperature dependencies.
ENVELOPE DETECTOR, VGA, AND POWER
DETECTOR
The second functional block is a VGA (see Figure 81). The
VGA utilizes multiple gain stages and staggered voltage variable
attenuation stages to form a low noise, high linearity variable
gain amplifier. The first stage of the VGA is a low noise preamp.
A portion of the signal is coupled away and further amplified
before driving an on-chip envelope detector. The envelope
detector provides an output that is proportional to the peak
envelope power of the incoming signal.
INPUT
OUTPUT
ENVELOPE
DETECTOR
DET1_REF DET1_OUT
ENV_DET VGA_CTL12
Figure 81. Variable Gain Amplifier Circuit Architecture
INPUT
OUTPUT
DET2_REF DET2_OUT
Figure 82. Power Amplifier Circuit Architecture
Rev. A | Page 23 of 29
ADMV7310
Data Sheet
DET1_REF DET1_OUT
OR OR
DET2_REF DET2_OUT
A typical application circuit for the power detector is shown in
Figure 83. See the Applications Information section for further
details on biasing the different blocks.
+4V
100kΩ 100kΩ
+4V
10kΩ
10kΩ
V
= DET2_REF – DET2_OUT
OUT
10kΩ
10kΩ
OR
DET1_REF– DET1_OUT
–4V
SUGGESTED INTERFACE CIRCUIT
Figure 83. Typical Application Circuit for Power Detector
Rev. A | Page 24 of 29
Data Sheet
ADMV7310
APPLICATIONS INFORMATION
POWER-UP BIAS SEQUENCE
LO NULLING
The ADMV7310 functional blocks use active multiple amplifier
and multiplier stages that all use depletion mode pseudomorphic
high electron mobility transistors (pHEMTs). To ensure
transistor damage does not occur, use the following power-up
bias sequence and do not apply RF power to the device on the
LO or IF ports before powering up the device:
LO nulling is required to achieve optimal overall RF
performance, especially for LO to RF rejection. This nulling is
achieved by applying dc voltages (VDC) between −0.2 V and
0.2 V to the IF_IN, IF_IP, IF_QN, and IF_QP ports to suppress
the 6× LO signal at the RFOUT port across the RF frequency
band by approximately 40 dBc. To suppress the 6× LO signal at
the RFOUT port, use the following nulling sequence:
1. Apply −2 V bias to VG_MULT, VG_AMP, VGA_VG12,
VGA_VG345, VGA_VG6, PA_VG1, and PA_VG2.
2. Apply −1 V bias to VG_MIXER.
3. Apply between −5 V (minimum attenuation) and −1 V
(maximum attenuation) bias to VGA_CTL12.
4. Apply −1.5 V bias to VD_MULT.
5. Apply a 4 V bias to VD_AMP, VGA_VD12, VGA_VD345,
VGA_VD6, PA_VD1, PA_VD2, DET1_REF_BIAS,
DET1_OUT_BIAS, DET2_REF_BIAS, and
1. Adjust IF_IN VDC between −0.2 V and +0.2 V. Monitor the
6× LO leakage on the RFOUT port. When the desired or
maximum level of suppression is achieved, proceed to
Step 2.
2. Adjust IF_IP VDC between −0.2 V and +0.2 V. Monitor the
6× LO leakage on the RFOUT port. When the desired or
maximum level of suppression is achieved, proceed to
Step 3.
DET2_OUT_BIAS (see Figure 86).
6. Adjust VG_AMP between −2 V and 0 V to achieve a total
3. Adjust IF_QN VDC input between −0.2 V and +0.2 V.
Monitor the 6× LO leakage on the RFOUT port. When the
desired or maximum level of suppression is achieved,
proceed to Step 4.
4. Adjust IF_QP VDC between −0.2 V and +0.2 V. Monitor the
6× LO leakage on the RFOUT port. When the desired or
maximum level of suppression is achieved, proceed to
Step 5.
I
VD_AMP current of 175 mA.
7. Adjust VGA_VG12 between −2 V and 0 V to achieve a
total IVGA_VD12 current of 50 mA.
8. Adjust VGA_VG345 and VGA_VG6 between −2 V and 0 V
to achieve a total IVGA_VD345 and IVGA_VD6 current of 200 mA.
9. Adjust PA_VG1 between −2 V and 0 V to achieve a total
I
PA_VD1 current of 400 mA.
10. Adjust PA_VG2 between −2 V and 0 V to achieve a total
PA_VD2 current of 400 mA.
5. If the desired level of the 6× LO signal on the RFOUT port
is still not achieved, further tune each dc voltage to the
IF_IN, IF_IP, IF_QN, and IF_QP ports by repeating Step 1
through Step 4. The resolution of the voltage changed on
the dc voltage of the inputs must be in the millivolt.
6. To ensure that the mixer core is not damaged during the
LO nulling, limit each current to IF_IN, IF_IP, IF_QN, and
IF_QP to 3 mA.
7. LO nulling must be conducted with any change in input
LO frequency, temperature change, or when Gain Tuning
Order 1 is conducted. The level of suppression changes as
those conditions vary.
I
11. Apply a LO input signal on the LO port and adjust
VG_MULT between −2 V and 0 V to achieve a total
I
VD_MULT current of 80 mA.
POWER-DOWN BIAS SEQUENCE
To power-down the ADMV7310, take the following steps:
1. Apply a 0 V bias to VD_MULT, VD_AMP, VGA_VD12,
VGA_VD345, VGA_VD6, PA_VD1, PA_VD2,
DET1_REF_BIAS, DET1_OUT_BIAS, DET2_REF_BIAS,
and DET2_OUT_BIAS supply voltage per application
circuit.
2. Apply a 0 V bias to VGA_CTL12.
3. Apply a 0 V bias to VG_MIXER.
4. Apply a 0 V bias to VG_MULT, VG_AMP, VGA_VG12,
VGA_VG345, VGA_VG6, PA_VG1, and PA_VG2.
Rev. A | Page 25 of 29
ADMV7310
Data Sheet
current consumption. The third mechanism is to lower the
PA_VD1 current consumption via PA_VG1 from the nominal
PA_VG1 voltage to achieve the nominal IPA_VD1 + IPA_VD2 current
GAIN TUNING PROCEDURE
I
The ADMV7310 features three different mechanisms to control
the total gain of the transmitter. The first mechanism is the
variable gain control of the variable gain control amplifier of the
transmitter. The variable gain control is controlled by the
VGA_CTL12 pin. The voltage control range to achieve maximum
and minimum gain from the VGA is −5 V to −1 V. The second
mechanism for further gain control is to lower the IVGA_VD345 and
consumption.
See Table 5 for additional details as to which gain control
mechanism to use per the desired gain control range required.
The settings detailed in Table 5 are guidelines for a gain control
approach and may need adjustment depending on application
requirements over temperature and frequency.
I
VGA_VD6 current consumption via the VGA_VG345 and
VGA_VG6 pins from the nominal VGA_VG345 + VGA_VG6
voltage to achieve the nominal IVGA_VD12 + IVGA_VD345 + IVGA_VD6
Follow the gain tuning order to control the gain to achieve the
correct gain level for optimal performance.
Table 5. Recommended Gain Settings
Gain
Tuning
Order
Gain
Reduction
Range (dB)
Recommended
Gain Tuning
Voltage Range (V)
Gain Tuning
Description of Gain Tuning Procedure
1
0 to 10
VGA_CTL12
−5 to −1
To achieve maximum gain, set VGA_CTL12 to −5 V. To achieve a gain
reduction between 0 dB and 10 dB, adjust VGA_CTL12 between −5 V
and −1 V (−1 V is the typical minimum gain for the VGA). For both of
these conditions, follow the bias procedure in the Theory of Operation
section to bias the ADMV7310 to the normal operating currents.
2
10 to 25
VGA_VG345 + −2 to 0
VGA_VG6
To achieve greater than 10 dB to 25 dB gain reduction, adjust VGA_CTL12
between −5 V and −1 V. If further gain reduction is required to achieve
25 dB gain reduction after conducting Gain Tuning Order 1, lower
IVGA_VD345 + IVGA_VD6 by adjusting VGA_VG345 + VGA_VG6 between −2 V
and 0 V to achieve the correct gain level. The total current consumption of
I
VGA_VD345 + IVGA_VD6 while adjusting the VGA_VG345 + VGA_VG6 to drop
to 25 mA (nominal IVGA_VD345 + IVGA_VD6 is 200 mA).
3
25 to 40
PA_VG1
−2 to 0
To achieve greater than 25 dB to 40 dB gain reduction, adjust VGA_CTL12
to −1 V and adjust the total current consumption of IVGA_VD345 + IVGA_VD6
between 200 mA and 25 mA per Gain Tuning Order 2. If further gain
reduction is needed to achieve 40 dB gain reduction after conducting
Gain Tuning Order 2, lower IPA_VD1 by adjusting PA_VG1 between −2 V
and 0 V to achieve the correct gain level. The total current consumption
of IPA_VD1 while adjusting PA_VG1 must not drop below 80 mA (nominal
I
PA_VD1 is 400 mA).
Rev. A | Page 26 of 29
Data Sheet
ADMV7310
Figure 84 illustrates the recommended mechanical layout on the
interface plate used to interface to the WR-12 waveguide
opening of the ADMV7310. The recommended PCB land
pattern footprint is shown in Figure 85.
LAYOUT
Solder the exposed pad on the underside of the ADMV7310 to a
low thermal and electrical impedance ground plane. This pad
is typically soldered to an exposed opening in the solder mask.
Connect these ground vias to all other ground layers to
maximize heat dissipation from the device package.
(Ø0.563)
4× R0.016
2× Ø0.0595±0.0005 THRU
MARKED A
2× Ø0.067±0.003 THRU
MARKED B
0.981
2× 0.899
A
B
A
NOTE: 7
PRESS FIT ALIGNMENT PINS (QTY 2)
TO HEIGHT SHOWN THIS SIDE
0.761
0.639
2× 0.501
0.419
B
0.061 (1.55)
0.122 (3.10)
0.000
0.000
DETAIL A
PART LIST
ITEM QTY VENDOR
STOCK NUMBER
VARIOUS
DESCRIPTION
PIN, ALIGNMENT, FLANGE, 0.0615 DIA
1
2
VARIOUS
NOTES:
1. REMOVE BURRS AND BREAK SHARP EDGES.
2. ALL INTERNAL RADII ARE 0.090 UNLESS OTHERWISE NOTED.
3. SURFACE FINISH 32 RMS UNLESS OTHERWISE SPECIFIED.
4. DIMENSIONS APPLY AFTER PLATING.
5. MATERIAL: ALUMINUM 6061-T6 PER QQ-A-250/11.
6. FINISH: NONE.
7. INSTALL DOWEL PINS.
8. USE ELECTRONIC DATA FOR ALL GEOMETRY THAT IS NOT DIMENSIONED.
Figure 84. Recommended Standard WR-12 Footprint
PCB SOLDERMASK KEEPOUT
0.124
(3.15)
0.012
(0.30)
0.041
(1.05)
PCB METAL FOOTPRINT
0.546
(13.88)
0.225
(5.73)
0.016
(0.40)
0.079
(2.00)
0.185
(4.70)
0.031
(0.80)
0.124
(3.15)
0.280
(7.10)
0.061
(1.55)
0.102
(2.60)
0.186
(4.73)
0.085
(2.15)
0.559
(14.20)
0.372
(9.45)
0.110
(2.80)
0.173
(4.40)
0.022
(0.55)
SEE
DETAIL A
PCB SOLDER PASTE MASK
0.061
(1.55)
0.014
(0.36)
0.120
(3.05)
R0.010
(R.25)
0.208
(5.29)
0.037
(0.95)
0.319
(8.10)
0.122
(3.10)
0.185
(4.70)
0.132
(3.35)
DETAIL A
WAVEGUIDE
0.124
(3.14)
0.044
(1.11)
NOTES
1. WAVEGUIDE OPENING TO BE FULLY EDGE PLATED.
2. FILL AREA UNDER DEVICE WITH AN ARRAY OF
0.049
(1.24)
0.014
(0.35)
0.010 INCH VIAS (FILLED, RECOMMENDED 0.025 INCH PITCH).
Figure 85. PCB Land Pattern Footprint
Rev. A | Page 27 of 29
ADMV7310
Data Sheet
TYPICAL APPLICATION CIRCUIT
Figure 86 shows the typical application circuit.
4.7µF 4.7µF 4.7µF 4.7µF 4.7µF
4.7µF 4.7µF
+
+
+
+
+
+
+
LOIN
180°
COUPLER
IN
90°
COUPLER
IFI_IN
IFIN
1
2
IF_IP
IF_IN
180°
COUPLER
IFQ_IN
3
IF_QN
IF_QP
IN
4
5
RFOUT
6
ADMV7310
VGA_VG12
TOP VIEW
7
(Not to Scale)
8
VGA_VD12
9
ENV_DET
10
11
12
VGA_CTL12
+
+
+
4.7µF
4.7µF
4.7µF
1MF
150Ω
3.48kΩ
+
+
+
4.7µF
+
+
+
4.7µF
4.7µF 4.7µF
4.7µF
4.7µF
Figure 86. Typical Application Circuit
Rev. A | Page 28 of 29
Data Sheet
ADMV7310
OUTLINE DIMENSIONS
16.15
16.00
15.85
2.75
BSC
9.74
PIN 1
0.38
0.38
3.15
INDICATOR
15.24
BSC
9.00
0.40 × 0.45°
32
50
1
2.80
BSC
1.05
EXPOSED
PAD
14.15
14.00
13.85
EXPOSED
PAD
EXPOSED
PAD
EXPOSED
PAD
PORT 1
(See Detail A)
8.40
EXPOSED
PAD
EXPOSED
PAD
EXPOSED
PAD
13.24
BSC
0.80
BSC
EXPOSED
PAD
EXPOSED
PAD
EXPOSED
PAD
VENT HOLE
Ø 0.125
7.00
BSC
EXPOSED
PAD
12
13
1.80
31
1.70
1.55
BOTTOM VIEW
0.36
TOP VIEW
0.25 BSC
0.48
0.42
0.36
1.93 BSC
0.30
0.24
2.93
MAX
SIDE VIEW
2.54 REF
3.15 BSC
0.46 BSC
FOR PROPER CONNECTION OF
THE EXPOSED PADS, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
1.55 BSC
0.320
0.290
0.260
SEATING
PLANE
SECTION OF THIS DATA SHEET.
4.70
BSC
3.10
BSC
DETAIL A
Figure 87. 50-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV]
16.00 mm × 14.00 mm Body and 2.93 mm Package Height
(CE-50-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
Package Description
Package Option
ADMV7310BCEZ
ADMV7310-EVALZ
−40°C to +85°C
50-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV]
Evaluation Board
CE-50-2
1 Z = RoHS Compliant Part.
©2019 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D20977-0-10/19(A)
Rev. A | Page 29 of 29
相关型号:
©2020 ICPDF网 联系我们和版权申明