ADL5606 [ADI]
1800 MHz to 2700 MHz; 1800 MHz至2700 MHz的
| 型号： | ADL5606 |
| 厂家： | 
ADI |
| 描述： | 1800 MHz to 2700 MHz |
| 文件： | 总20页 (文件大小：441K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1800 MHz to 2700 MHz,
1 W RF Driver Amplifier
ADL5606
FUNCTIONAL BLOCK DIAGRAM
FEATURES
Operation from 1800 MHz to 2700 MHz
Gain of 24.3 dB at 2140 MHz
OIP3 of 45.5 dBm at 2140 MHz
P1dB of 30.8 dBm at 2140 MHz
Noise figure of 4.7 dB at 2140 MHz
Power supply: 5 V
Power supply current: 362 mA typical
Internal active biasing
12 RFOUT
11 RFOUT
10 RFOUT
RFIN
DISABLE
VCC
1
2
3
4
PWDN
VBIAS
VBIAS
9
RFOUT
ADL5606
Fast power-up/power-down function
Compact 4 mm × 4 mm, 16-lead LFCSP
ESD rating of 1 kV (Class 1C)
Pin-compatible with the ADL5605 (700 MHz to 1000 MHz)
Figure 1.
APPLICATIONS
Wireless infrastructure
Automated test equipment
ISM/AMR applications
0
–10
–20
–30
–40
–50
–60
–70
–80
GENERAL DESCRIPTION
The ADL5606 is a broadband, two-stage, 1 W RF driver
amplifier that operates over a frequency range of 1800 MHz
to 2700 MHz. The device can be used in a wide variety of
wired and wireless applications, including ISM, MC-GSM,
W-CDMA, TD-SCDMA, and LTE.
The ADL5606 operates on a 5 V supply voltage and a supply
current of 362 mA. The driver also incorporates a fast power-
up/power-down function for TDD applications, applications
that require a power saving mode, and applications that
intermittently transmit data.
2140 MHz
The ADL5606 is fabricated on a GaAs HBT process and is
packaged in a compact 4 mm × 4 mm, 16-lead LFCSP that
uses an exposed paddle for excellent thermal impedance. The
ADL5606 operates from −40°C to +85°C. A fully populated
evaluation board tuned to 2140 MHz is also available.
0
2
4
6
8
10
12
14
16
18
20
22
P
(dBm)
OUT
Figure 2. ACPR vs. Output Power, 3GPP, TM1-64, at 2140 MHz
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2011 Analog Devices, Inc. All rights reserved.
ADL5606
TABLE OF CONTENTS
Features .............................................................................................. 1
2140 MHz Frequency Tuning Band............................................9
2630 MHz Frequency Tuning Band......................................... 10
General......................................................................................... 11
Applications Information.............................................................. 13
Basic Layout Connections......................................................... 13
ADL5606 Matching.................................................................... 14
ACPR and EVM ......................................................................... 15
Thermal Considerations............................................................ 15
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Typical Scattering Parameters..................................................... 4
Absolute Maximum Ratings............................................................ 6
Thermal Resistance ...................................................................... 6
ESD Caution.................................................................................. 6
Pin Configuration and Function Descriptions............................. 7
Typical Performance Characteristics ............................................. 8
1960 MHz Frequency Tuning Band........................................... 8
Soldering Information and Recommended PCB Land
Pattern.......................................................................................... 15
Evaluation Board ............................................................................ 16
Outline Dimensions....................................................................... 18
Ordering Guide .......................................................................... 18
REVISION HISTORY
7/11—Revision 0: Initial Version
Rev. 0 | Page 2 of 20
ADL5606
SPECIFICATIONS
VCC1 = 5 V and TA = 25°C, unless otherwise noted.1
Table 1.
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
OVERALL FUNCTION
Frequency Range
FREQUENCY = 1960 MHz 30 MHz
Gain
1800
2700
MHz
24.7
0.ꢀ
dB
dB
vs. Frequency
30 MHz
vs. Temperature
vs. Supply
−40°C ≤ TA ≤ +8ꢀ°C
4.7ꢀ V to ꢀ.2ꢀ V
0.9
0.0ꢀ
dB
dB
Output 1 dB Compression Point (P1dB)
vs. Frequency
vs. Temperature
30.2
+0.2/−0.6
0.ꢀ
dBm
dB
dB
30 MHz
−40°C ≤ TA ≤ +8ꢀ°C
4.7ꢀ V to ꢀ.2ꢀ V
vs. Supply
0.ꢀ
dB
Adjacent Channel Power Ratio (ACPR)
Output Third-Order Intercept (OIP3)
vs. Frequency
vs. Temperature
vs. Supply
POUT = 18 dBm, one-carrier W-CDMA, 64 DPCH
∆f = 1 MHz, POUT = 14 dBm per tone
30 MHz
−40°C ≤ TA ≤ +8ꢀ°C
4.7ꢀ V to ꢀ.2ꢀ V
ꢀ2
4ꢀ.6
+0.8/−0.2
+0.0/−2.2
0.ꢀ
dBc
dBm
dB
dB
dB
Noise Figure
ꢀ.1
dB
FREQUENCY = 2140 MHz 30 MHz
Gain
24.3
dB
vs. Frequency
vs. Temperature
vs. Supply
30 MHz
−40°C ≤ TA ≤ +8ꢀ°C
4.7ꢀ V to ꢀ.2ꢀ V
+0.4/−0.1
0.9
0.06
dB
dB
dB
Output 1 dB Compression Point (P1dB)
vs. Frequency
30.8
0.ꢀ
dBm
dB
30 MHz
vs. Temperature
vs. Supply
−40°C ≤ TA ≤ +8ꢀ°C
4.7ꢀ V to ꢀ.2ꢀ V
0.8
0.4
dB
dB
Adjacent Channel Power Ratio (ACPR)
Output Third-Order Intercept (OIP3)
vs. Frequency
vs. Temperature
vs. Supply
POUT = 18 dBm, one-carrier W-CDMA, 64 DPCH
∆f = 1 MHz, POUT = 14 dBm per tone
30 MHz
−40°C ≤ TA ≤ +8ꢀ°C
4.7ꢀ V to ꢀ.2ꢀ V
ꢀ1
4ꢀ.ꢀ
+2.3/−0.8
+0.0/−2.ꢀ
+0.6/−0.3
4.7
dBc
dBm
dB
dB
dB
Noise Figure
dB
FREQUENCY = 2630 MHz 60 MHz
Gain
20.6
dB
vs. Frequency
vs. Temperature
vs. Supply
60 MHz
−40°C ≤ TA ≤ +8ꢀ°C
4.7ꢀ V to ꢀ.2ꢀ V
+0.7/−1.8
1.0
0.09
dB
dB
dB
Output 1 dB Compression Point (P1dB)
vs. Frequency
vs. Temperature
28.9
dBm
dB
dB
60 MHz
−40°C ≤ TA ≤ +8ꢀ°C
4.7ꢀ V to ꢀ.2ꢀ V
+0.ꢀ/−1.7
+1.2/−2.0
0.2
vs. Supply
dB
Output Third-Order Intercept (OIP3)
vs. Frequency
∆f = 1 MHz, POUT = 14 dBm per tone
60 MHz
43.2
3.0
dBm
dB
vs. Temperature
vs. Supply
−40°C ≤ TA ≤ +8ꢀ°C
4.7ꢀ V to ꢀ.2ꢀ V
+0.3/−4.0
1.9
dB
dB
Noise Figure
ꢀ.1
dB
Rev. 0 | Page 3 of 20
ADL5606
Parameter
Test Conditions/Comments
DISABLE pin
VDISABLE decreasing
VDISABLE increasing
VDISABLE = ꢀ V
Min
Typ
Max
Unit
POWER-DOWN INTERFACE
Logic Level to Enable
Logic Level to Disable
DISABLE Pin Current
VCC1 Pin Current1
Enable Time
0
ꢀ
1.4
4.2
7ꢀ
20
1.1
V
V
mA
mA
ns
ns
1.4
VDISABLE = ꢀ V
10% of control pulse to 90% of RFOUT
10% of control pulse to 90% of RFOUT
RFOUT pin
Disable Time
POWER INTERFACE
Supply Voltage
Supply Current
4.7ꢀ
ꢀ
362
+0/−2ꢀ
ꢀ.2ꢀ
390
V
mA
mA
vs. Temperature
−40°C ≤ TA ≤ +8ꢀ°C
1 VCC1 is the supply to the DUT through the RFOUT pins.
TYPICAL SCATTERING PARAMETERS
VCC1 = 5 V and TA = 25°C; the effects of the test fixture have been de-embedded up to the pins of the device.1
Table 2.
S11
S21
S12
S22
Magnitude (dB) Angle (°)
Frequency
(MHz)
Magnitude (dB) Angle (°)
Magnitude (dB) Angle (°)
Magnitude (dB) Angle (°)
1000
10ꢀ0
1100
11ꢀ0
1200
12ꢀ0
1300
13ꢀ0
1400
14ꢀ0
1ꢀ00
1ꢀꢀ0
1600
16ꢀ0
1700
17ꢀ0
1800
18ꢀ0
1900
19ꢀ0
2000
20ꢀ0
2100
21ꢀ0
2200
22ꢀ0
2300
23ꢀ0
2400
24ꢀ0
2ꢀ00
2ꢀꢀ0
−ꢀ.94
−7.09
−7.74
−7.94
−7.82
−7.46
−7.06
−6.70
−6.38
−6.08
−ꢀ.76
−ꢀ.47
−ꢀ.24
−ꢀ.02
−4.76
−4.ꢀ8
−4.42
−4.2ꢀ
−4.11
−3.97
−3.82
−3.72
−3.61
−3.ꢀ0
−3.42
−3.36
−3.28
−3.23
−3.23
−3.19
−3.1ꢀ
−3.17
1.63
−24.39
−48.66
−69.86
2ꢀ.77
2ꢀ.28
24.68
23.97
23.32
22.71
22.14
21.64
21.16
20.7ꢀ
20.33
19.98
19.67
19.36
19.07
18.79
18.ꢀ2
18.28
18.01
17.78
17.ꢀ6
17.34
17.13
16.90
16.68
16.47
16.27
16.02
1ꢀ.79
1ꢀ.ꢀ8
1ꢀ.37
1ꢀ.1ꢀ
42.78
2ꢀ.40
10.90
−1.40
−64.90
−63.13
−ꢀ8.63
−ꢀ8.ꢀ7
−ꢀ9.ꢀ8
−ꢀꢀ.02
−ꢀ2.ꢀ0
−ꢀ4.0ꢀ
−ꢀ3.01
−ꢀ1.79
−ꢀ3.89
−ꢀ3.41
−ꢀ3.37
−ꢀ1.3ꢀ
−ꢀ0.6ꢀ
−ꢀ0.70
−ꢀ1.02
−ꢀ0.ꢀ9
−ꢀ0.81
−ꢀ0.ꢀ2
−ꢀ2.43
−49.77
−ꢀ0.3ꢀ
−49.72
−ꢀ0.21
−47.ꢀ9
−47.62
−48.93
−49.37
−48.09
−47.72
−47.40
91.ꢀ6
114.08
108.ꢀ3
98.3ꢀ
114.37
106.02
102.74
91.4ꢀ
111.40
83.98
111.28
117.99
76.10
87.47
92.39
83.18
92.ꢀ2
93.13
82.49
90.ꢀ7
7ꢀ.32
80.61
81.31
83.3ꢀ
87.74
82.9ꢀ
88.2ꢀ
79.29
83.ꢀ0
7ꢀ.23
78.72
76.72
−1.68
−1.63
−1.ꢀ4
−1.ꢀ3
−1.ꢀ3
−1.46
−1.4ꢀ
−1.43
−1.39
−1.3ꢀ
−1.38
−1.3ꢀ
−1.34
−1.30
−1.26
−1.24
−1.23
−1.23
−1.21
−1.18
−1.19
−1.17
−1.16
−1.16
−1.16
−1.17
−1.14
−1.16
−1.18
−1.18
−1.16
−1.18
179.86
179.29
178.87
178.32
177.9ꢀ
177.27
176.60
176.34
17ꢀ.90
17ꢀ.36
174.93
174.ꢀ1
174.16
173.84
173.3ꢀ
173.01
172.ꢀ9
172.28
171.7ꢀ
171.61
171.19
170.99
170.70
170.44
170.09
169.84
169.46
169.27
169.01
168.72
168.34
168.1ꢀ
−87.28
−12.01
−21.44
−29.87
−37.10
−44.03
−ꢀ0.61
−ꢀ6.84
−62.62
−68.33
−73.72
−79.01
−83.92
−88.97
−93.94
−98.66
−103.29
−107.86
−112.42
−116.91
−121.14
−12ꢀ.ꢀ9
−129.80
−134.1ꢀ
−138.14
−142.3ꢀ
−146.40
−1ꢀ0.40
−1ꢀ4.46
−100.72
−111.67
−120.ꢀ1
−126.9ꢀ
−133.47
−138.12
−142.70
−146.61
−1ꢀ0.10
−1ꢀ3.11
−1ꢀꢀ.89
−1ꢀ8.41
−160.7ꢀ
−162.84
−164.79
−166.ꢀ6
−168.ꢀ8
−170.3ꢀ
−172.01
−173.71
−17ꢀ.63
−177.44
−179.0ꢀ
179.33
177.86
176.27
174.60
Rev. 0 | Page 4 of 20
ADL5606
S11
S21
S12
S22
Magnitude (dB) Angle (°)
Frequency
(MHz)
Magnitude (dB) Angle (°)
Magnitude (dB) Angle (°)
Magnitude (dB) Angle (°)
2600
26ꢀ0
2700
27ꢀ0
2800
28ꢀ0
2900
29ꢀ0
3000
30ꢀ0
3100
31ꢀ0
3200
32ꢀ0
3300
33ꢀ0
3400
34ꢀ0
3ꢀ00
3ꢀꢀ0
3600
36ꢀ0
3700
37ꢀ0
3800
38ꢀ0
3900
39ꢀ0
4000
−3.14
−3.14
−3.12
−3.14
−3.16
−3.1ꢀ
−3.1ꢀ
−3.1ꢀ
−3.14
−3.13
−3.08
−3.01
−3.08
−3.06
−3.0ꢀ
−3.03
−2.94
−2.9ꢀ
−2.8ꢀ
−2.83
−2.79
−2.74
−2.78
−2.80
−2.87
−3.03
−3.24
−3.63
−4.24
172.86
171.24
169.74
167.93
166.21
164.6ꢀ
162.67
160.86
1ꢀ9.03
1ꢀ7.22
1ꢀꢀ.39
1ꢀ2.90
1ꢀ0.72
149.2ꢀ
147.28
14ꢀ.ꢀ3
143.76
141.94
140.04
138.ꢀ8
136.47
134.67
132.80
130.8ꢀ
128.8ꢀ
126.98
12ꢀ.26
123.34
122.71
14.92
14.70
14.48
14.24
13.98
13.78
13.ꢀ3
13.27
13.04
12.79
12.ꢀ7
12.32
12.04
11.78
11.ꢀ3
11.20
10.9ꢀ
10.6ꢀ
10.39
10.10
9.83
−1ꢀ8.40
−162.27
−166.06
−169.97
−173.76
−177.32
178.93
17ꢀ.30
171.76
168.32
16ꢀ.01
161.32
1ꢀ7.39
1ꢀ3.80
1ꢀ0.ꢀ9
147.ꢀ7
144.00
141.12
137.78
134.68
131.38
128.32
12ꢀ.07
121.74
119.06
11ꢀ.71
113.11
110.08
108.11
−46.ꢀ1
−47.66
−47.77
−4ꢀ.3ꢀ
−4ꢀ.43
−46.3ꢀ
−46.92
−4ꢀ.88
−4ꢀ.94
−4ꢀ.60
−44.06
−4ꢀ.ꢀ4
−46.ꢀ1
−43.87
−44.31
−44.17
−43.67
−44.6ꢀ
−44.ꢀ2
−44.22
−43.79
−42.04
−43.97
−42.96
−43.01
−41.84
−41.ꢀ0
−42.1ꢀ
−41.81
77.12
73.90
71.80
73.70
76.0ꢀ
71.78
73.31
70.64
66.79
73.37
61.32
ꢀ8.34
60.72
61.02
68.64
62.82
64.76
72.ꢀ8
ꢀ3.43
63.44
46.ꢀ6
ꢀ0.76
ꢀ7.92
49.24
ꢀ1.0ꢀ
4ꢀ.82
36.66
39.82
41.17
−1.20
−1.20
−1.22
−1.22
−1.24
−1.2ꢀ
−1.26
−1.30
−1.29
−1.33
−1.3ꢀ
−1.36
−1.36
−1.3ꢀ
−1.36
−1.39
−1.39
−1.39
−1.38
−1.3ꢀ
−1.36
−1.31
−1.33
−1.30
−1.30
−1.24
−1.26
−1.20
−1.21
167.77
167.47
167.16
166.68
166.34
166.2ꢀ
16ꢀ.90
16ꢀ.ꢀ8
16ꢀ.3ꢀ
16ꢀ.06
164.76
164.32
163.6ꢀ
163.38
162.94
162.61
162.08
161.92
161.39
161.11
160.74
160.48
160.24
1ꢀ9.79
1ꢀ9.68
1ꢀ9.28
1ꢀ9.17
1ꢀ9.1ꢀ
1ꢀ9.19
9.ꢀꢀ
9.2ꢀ
8.94
8.63
8.30
7.90
7.ꢀ9
7.1ꢀ
1 VCC1 is the supply to the DUT through the RFOUT pins.
Rev. 0 | Page ꢀ of 20
ADL5606
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 3.
Table 4 lists the junction-to-air thermal resistance (θJA) and the
junction-to-paddle thermal resistance (θJC) for the ADL5606.
For more information, see the Thermal Considerations section.
Parameter
Rating
Supply Voltage, VCC11
6.ꢀ V
18 dBm
Input Power (ꢀ0 Ω Impedance)
Internal Power Dissipation (Paddle Soldered) 3.ꢀ W
Table 4. Thermal Resistance
Package Type
Maximum Junction Temperature
Lead Temperature (Soldering 60 sec)
Operating Temperature Range
Storage Temperature Range
1ꢀ0°C
240°C
−40°C to +8ꢀ°C
−6ꢀ°C to +1ꢀ0°C
θJA
θJC
Unit
16-Lead LFCSP (CP-16-10)
ꢀ2.9
12.9
°C/W
1 VCC1 is the supply to the DUT through the RFOUT pins.
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. 0 | Page 6 of 20
ADL5606
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
PIN 1
INDICATOR
12 RFOUT
11 RFOUT
10 RFOUT
RFIN
DISABLE
VCC
1
2
3
4
ADL5606
TOP VIEW
(Not to Scale)
VBIAS
9 RFOUT
NOTES
1. THE EXPOSED PADDLE SHOULD BE SOLDERED
TO A LOW IMPEDANCE ELECTRICAL AND THERMAL
GROUND PLANE.
2. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN.
Figure 3. Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
2
RFIN
DISABLE
RF Input. Requires a dc blocking capacitor.
Connect this pin to ꢀ V to disable the part. In the disabled state, the part draws approximately 4 mA
of current from the power supply and 1.4 mA from the DISABLE pin.
3
VCC
Under normal operation, this pin is connected to the power supply and draws a combined 362 mA
of current. When this pin is grounded along with the VBIAS pin, the device is disabled and draws
approximately 1.4 mA from the DISABLE pin.
4
VBIAS
NC
Applying ꢀ V to this pin enables the bias circuit. When this pin is grounded, the device is disabled.
No Connect. Do not connect to this pin.
ꢀ, 6, 7, 8, 13,
14, 1ꢀ, 16
9, 10, 11, 12
RFOUT
EP
RF Output. DC bias is provided to this pin through an inductor that is connected to the ꢀ V power
supply. The RF path requires a dc blocking capacitor.
The exposed paddle should be soldered to a low impedance electrical and thermal ground plane.
Rev. 0 | Page 7 of 20
ADL5606
TYPICAL PERFORMANCE CHARACTERISTICS
1960 MHZ FREQUENCY TUNING BAND
50
48
46
44
42
40
38
36
34
32
30
50
46
44
42
40
38
36
34
32
30
OIP3 (dBm)
45
+25°C
+85°C
40
35
P1dB (dBm)
GAIN (dB)
30
25
–40°C
20
15
10
+25°C
–40°C
+85°C
NF (dB)
5
28
26
0
1930
1940
1950
1960
1970
1980
1990
1930
1940
1950
1960
1970
1980
1990
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 4. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency
(OIP3 at POUT = 14 dBm per Tone)
Figure 7. P1dB and OIP3 vs. Frequency and Temperature
(OIP3 at POUT = 14 dBm per Tone)
26.5
48
1930MHz
1960MHz
1990MHz
26.0
25.5
25.0
24.5
24.0
23.5
23.0
22.5
47
46
45
44
43
42
41
40
–40°C
+25°C
+85°C
1930
1940
1950
1960
1970
1980
1990
–5
0
5
10
15
20
FREQUENCY (MHz)
P
PER TONE (dBm)
OUT
Figure 8. OIP3 vs. POUT and Frequency
Figure 5. Gain vs. Frequency and Temperature
0
–10
–20
–30
–40
–50
–60
7
6
5
4
S22
S11
+85°C
+25°C
–40°C
S12
3
1930
1930
1940
1950
1960
1970
1980
1990
1940
1950
1960
1970
1980
1990
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 6. Input Return Loss (S11), Output Return Loss (S22),
and Reverse Isolation (S12) vs. Frequency
Figure 9. Noise Figure vs. Frequency and Temperature
Rev. 0 | Page 8 of 20
ADL5606
2140 MHZ FREQUENCY TUNING BAND
50
48
46
44
42
40
38
36
34
32
46
44
42
40
38
36
34
32
30
60
+25°C
50
OIP3 (dBm)
–40°C
+85°C
40
P1dB (dBm)
GAIN (dB)
30
–40°C
20
+25°C
10
NF (dB)
+85°C
2160
28
26
30
2170
0
2110
2120
2130
2140
2150
2160
2170
2110
2120
2130
2140
2150
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 10. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency
(OIP3 at POUT = 14 dBm per Tone)
Figure 13. P1dB and OIP3 vs. Frequency and Temperature
(OIP3 at POUT = 14 dBm per Tone)
28
50
48
2110MHz
2140MHz
2170MHz
27
26
25
24
23
22
21
20
46
44
42
40
38
36
34
32
30
–40°C
+25°C
+85°C
2110
2120
2130
2140
2150
2160
2170
–5
0
5
10
15
20
FREQUENCY (MHz)
P
PER TONE (dBm)
OUT
Figure 14. OIP3 vs. POUT and Frequency
Figure 11. Gain vs. Frequency and Temperature
0
–10
–20
–30
–40
–50
–60
7
6
5
4
S22
S11
+85°C
+25°C
–40°C
S12
3
2110
2110
2120
2130
2140
2150
2160
2170
2120
2130
2140
2150
2160
2170
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 12. Input Return Loss (S11), Output Return Loss (S22),
and Reverse Isolation (S12) vs. Frequency
Figure 15. Noise Figure vs. Frequency and Temperature
Rev. 0 | Page 9 of 20
ADL5606
2630 MHZ FREQUENCY TUNING BAND
60
52
49
46
43
40
37
34
31
28
25
22
54
51
48
45
42
39
36
33
30
27
24
50
–40°C
OIP3 (dBm)
40
+25°C
+85°C
P1dB (dBm)
30
GAIN (dB)
–40°C
20
+25°C
2590
10
NF (dB)
+85°C
0
2570
2570
2610
2630
2650
2670
2690
2590
2610
2630
2650
2690
2670
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 16. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency
(OIP3 at POUT = 14 dBm per Tone)
Figure 19. P1dB and OIP3 vs. Frequency and Temperature
(OIP3 at POUT = 14 dBm per Tone)
23.0
49
22.5
22.0
21.5
21.0
20.5
20.0
19.5
19.0
18.5
18.0
17.5
17.0
47
45
43
41
39
37
35
–40°C
+25°C
+85°C
2570MHz
2630MHz
2690MHz
2570
2590
2610
2630
2650
2690
–5
0
5
10
15
20
2670
FREQUENCY (MHz)
P
PER TONE (dBm)
OUT
Figure 17. Gain vs. Frequency and Temperature
Figure 20. OIP3 vs. POUT and Frequency
0
–10
–20
–30
–40
–50
–60
7
6
5
4
S22
S11
+85°C
+25°C
–40°C
S12
3
2570
2590
2610
2630
2650
2690
2570
2590
2610
2630
2650
2670
2690
2670
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 21. Noise Figure vs. Frequency and Temperature
Figure 18. Input Return Loss (S11), Output Return Loss (S22),
and Reverse Isolation (S12) vs. Frequency
Rev. 0 | Page 10 of 20
ADL5606
GENERAL
35
30
25
20
15
10
5
30
25
20
15
10
5
0
0
43.0 43.5 44.0 44.5 45.0 45.5 46.0 46.5 47.0 47.5
4.66 4.68 4.70 4.72 4.74 4.76 4.78 4.80 4.82
OIP3 (dBm)
NOISE FIGURE (dB)
Figure 22. OIP3 Distribution at 2140 MHz, 14 dBm per Tone
Figure 25. Noise Figure Distribution at 2140 MHz
35
30
25
20
15
10
5
0
–10
–20
–30
–40
–50
–60
–70
–80
2140MHz
1960MHz
0
29.8 30.0 30.2 30.4 30.6 30.8 31.0 31.2 31.4 31.6
0
2
4
6
8
10
12
14
16
18
20
22
P1dB (dBm)
P
(dBm)
OUT
Figure 26. ACPR vs. POUT, 3GPP, TM1-64, at 1960 MHz and 2140 MHz
Figure 23. P1dB Distribution at 2140 MHz
3.5
3.0
35
30
25
20
15
10
5
1960MHz
2140MHz
2.5
2.0
1.5
1.0
0.5
0
0
–10
–5
0
5
10
15
20
25
23.4 23.6 23.8 24.0 24.2 24.4 24.6 24.8 25.0
GAIN (dB)
P
(dBm)
OUT
Figure 24. Gain Distribution at 2140 MHz
Figure 27. EVM vs. POUT, 3GPP, TM1-64, at 1960 MHz and 2140 MHz
Rev. 0 | Page 11 of 20
ADL5606
375
5.25V
370
5V
365
360
355
350
345
4.75V
3
2
340
–40
CH2 1V Ω
M20ns 10GS/s
CH2 2.5V
IT 4ps/pt
–20
0
20
40
60
80
CH3 1V Ω
A
TEMPERATURE (°C)
Figure 28. Supply Current vs. Temperature and Supply Voltage at 2140 MHz
Figure 30. Turn-On Time, 10% of Control Pulse to 90% of RFOUT
3
2
CH2 1V Ω
M20ns 10GS/s
CH2 2.5V
IT 4ps/pt
CH3 1V Ω
A
Figure 29. Turn-Off Time, 10% of Control Pulse to 90% of RFOUT
Rev. 0 | Page 12 of 20
ADL5606
APPLICATIONS INFORMATION
For complete information about component values and spacing
for the different frequency tuning bands, see the ADL5606
Matching section.
BASIC LAYOUT CONNECTIONS
The basic connections for operating the ADL5606 are shown
in Figure 31. The RF matching components correspond to the
2140 MHz frequency tuning band.
RF Output Interface
Pin 9 to Pin 12 are the RF output pins. The RF output requires
only one shunt capacitor and a microstrip line used as an inductor
to match to 50 Ω. For complete information about component
values and spacing for the different frequency tuning bands, see
the ADL5606 Matching section.
Power Supply
The voltage supply for the ADL5606, which ranges from 4.75 V
to 5.25 V, should be connected to the VCC1 test pin. The dc bias
to the output stage is supplied through L1 and is connected to
the RFOUT pin. Three decoupling capacitors (C7, C8, and C9)
are used to prevent RF signals from propagating on the dc lines.
The VBIAS and VCC pins can be directly connected to the main
supply voltage. Additional decoupling capacitors (C5, C6, and
C11) are required on the VCC pin.
Power-Down
The ADL5606 can be disabled by connecting the DISABLE pin
to 5 V. When disabled, the ADL5606 draws approximately 4 mA
of current from the power supply and 1.4 mA from the DISABLE
pin. Decoupling Capacitor C3 is recommended to prevent the
propagation of RF signals. To completely shut down the device,
connect the VCC pin, the VBIAS pin, and the VCC1 test pin to
ground. In this state, the part draws approximately 1.4 mA from
the DISABLE pin.
RF Input Interface
Pin 1 is the RF input pin for the ADL5606. The RF input is easily
matched with one capacitor, in a series or shunt configuration,
and a microstrip line used as an inductor. For the 1960 MHz and
2140 MHz frequency tuning bands, a shunt capacitor is used to
match the input to 50 Ω; for the 2630 MHz frequency tuning
band, a series capacitor is used.
16
15
14
13
C1
20pF
RFIN
NC NC NC NC
1
12
11
RFIN
RFOUT
C
C
OUT
3.9pF
C2
20pF
IN
1.3pF
RFOUT
DISABLE
VCC
RFOUT
ADL5606
2
3
4
RFOUT 10
C3
10pF
DISABLE
VCC
L1
VBIAS
RFOUT
9
18nH
NC NC NC NC
C7
100pF
5
6
7
8
C11
10µF
C6
0.01µF
C5
100pF
C8
0.01µF
C9
10µF
VCC1
Figure 31. Basic Connections
Rev. 0 | Page 13 of 20
ADL5606
Table 6. Recommended Components for Basic Connections
ADL5606 MATCHING
Frequency (MHz)
1930 to 1990
2110 to 2170
2ꢀ70 to 2690
CIN (pF)
COUT (pF)
The RF input and output of the ADL5606 can be easily matched
to 50 Ω with at most one external component and the micro-
strip line used as an inductor. Table 6 lists the required matching
component values. Capacitors CIN and COUT are Murata GRM155
series (0402 size).
2.0
1.3
2.0
3.6
3.9
3.3
For all frequency tuning bands, the placement of CIN and COUT
is critical. Table 7 lists the recommended component spacing
for the various frequency tuning bands. The component spacing
is referenced from the center of the component to the edge of
the package.
Table 7. Matching Component Spacing
Frequency (MHz)
1930 to 1990
2110 to 2170
2ꢀ70 to 2690
λ1 (mils)
λ2 (mils)
197
138
394
268
382
83
Figure 32 to Figure 34 show the matching networks.
16
15
14
13
C1
NC
NC
NC
NC
RFIN
RFIN
RFIN
20pF
1
2
RFIN
RFOUT 12
λ
1
C
IN
2pF
C
RFOUT
RFOUT
RFOUT
11
DISABLE
OUT
3.6pF
RFOUT
RFOUT
RFOUT
λ
2
ADL5606
C2
20pF
10
9
L1
18nH
Figure 32. ADL5606 Match Parameters, 1960 MHz Frequency Tuning Band
16
15
14
13
C1
20pF
NC
NC
NC
NC
1
2
RFIN
RFOUT 12
λ
1
C
IN
1.3pF
C
RFOUT
RFOUT
RFOUT
11
DISABLE
OUT
3.9pF
λ
2
ADL5606
C2
20pF
10
9
L1
18nH
Figure 33. ADL5606 Match Parameters, 2140 MHz Frequency Tuning Band
16
15
14
13
C1
20pF
NC
NC
NC
NC
1
2
RFIN
RFOUT 12
λ
1
C
IN
2pF
C
RFOUT
RFOUT
RFOUT
11
DISABLE
OUT
3.3pF
λ
2
ADL5606
C2
20pF
10
9
L1
18nH
Figure 34. ADL5606 Match Parameters, 2630 MHz Frequency Tuning Band
Rev. 0 | Page 14 of 20
ADL5606
For optimal performance, it is recommended that the thermal
vias be filled with a conductive paste of the equivalent thermal
conductivity specified earlier in this section; alternatively, an
external heat sink can be used to dissipate heat quickly without
affecting the die junction temperature. It is also recommended
that the ground pattern be extended above and below the device
to improve thermal efficiency (see Figure 35).
ACPR AND EVM
All adjacent channel power ratio (ACPR) and error vector
magnitude (EVM) measurements were made using a single
W-CDMA carrier and Test Model 1-64.
The signal is generated by a very low ACPR source and is meas-
ured at the output by a high dynamic range spectrum analyzer.
For ACPR measurements, the filter setting was chosen for low
ACPR; for EVM measurements, the low EVM setting was selected.
The spectrum analyzer incorporates an instrument noise correc-
tion function, and highly linear amplifiers were used to boost
the power levels for ACPR measurements.
SOLDERING INFORMATION AND RECOMMENDED
PCB LAND PATTERN
Figure 35 shows the recommended land pattern for the ADL5606.
To minimize thermal impedance, the exposed paddle on the
4 mm × 4 mm LFCSP is soldered to a ground plane along with
Pin 5 to Pin 8 and Pin 13 to Pin 16. To improve thermal dissi-
pation, 25 thermal vias are arranged in a 5 × 5 array under the
exposed paddle. Areas above and below the paddle are tied with
regular vias. If multiple ground layers exist, they should be tied
together using vias. For more information about land pattern
design and layout, see the AN-772 Application Note, A Design
and Manufacturing Guide for the Lead Frame Chip Scale Package
(LFCSP).
Figure 26 shows ACPR vs. POUT at 1960 MHz and 2140 MHz.
For power levels up to 18 dBm, an ACPR of 50 dBc or better
can be achieved at 1960 MHz and 2140 MHz.
Figure 27 shows EVM vs. POUT at 1960 MHz and 2140 MHz.
The EVM measured is 0.5% for power levels up to 18 dBm at
1960 MHz and 2140 MHz. The baseline composite EVM for
the signal source was approximately 0.5%. When operated in
the linear region, there is little or no contribution to EVM by
the amplifier.
THERMAL CONSIDERATIONS
The ADL5606 is packaged in a thermally efficient 4 mm ×
4 mm, 16-lead LFCSP. The thermal resistance from junction
to air (θJA) is 52.9°C/W. The thermal resistance for the product
was extracted assuming a standard 4-layer JEDEC board with
25 copper plated thermal vias. The thermal vias are filled with
conductive copper paste (AE3030 with thermal conductivity of
7.8 W/mK and thermal expansion α1 of 4 × 10−5/°C and α2 of
8.6 × 10−5/°C). The thermal resistance from junction to case (θJC)
is 12.9°C/W, where the case is the exposed pad of the lead frame
package.
16
13
RFIN
RFOUT
16 MIL VIA PAD
WITH 8 MIL VIA
5
8
For the best thermal performance, it is recommended that as
many thermal vias as possible be added under the exposed pad
of the LFCSP. The thermal resistance values assume a minimum
of 25 thermal vias arranged in a 5 × 5 array with a via diameter
of 8 mils, via pad of 16 mils, and a pitch of 20 mils. The vias are
plated with copper, and the drill hole is filled with a conductive
copper paste.
Figure 35. Recommended Land Pattern
Rev. 0 | Page 1ꢀ of 20
ADL5606
EVALUATION BOARD
The schematic of the ADL5606 evaluation board is shown in
Figure 36. The evaluation board uses 25 mils wide, 50 ꢀ traces
and is made from IS410 material with a 20 mils gap to ground.
The evaluation board is tuned for operation at 2140 MHz. The
inputs and outputs should be ac-coupled with appropriately
sized capacitors; therefore, for low frequency applications, the
value of C1 and C2 may need to be increased. DC bias is
provided to the output stage via an inductor (L1) connected
to the RFOUT pin. A bias voltage of 5 V is recommended.
The evaluation board has a short, non-50 ꢀ line on its output to
accommodate the four output pins and to allow for easier low
inductance output matching. The pads for Pin 9 to Pin 12 are
included on this microstrip line and are included in all matches.
The evaluation board uses numbers as identifiers to aid in the
placement of matching components at both the RF input and
RF output of the device. Figure 37 and Figure 38 show images
of the board layout.
16
15
14
13
C1
RFIN
20pF
NC NC NC NC
1
12
11
RFIN
RFOUT
RFOUT
ADL5606
C
C
1.3pF
OUT
3.9pF
C2
20pF
IN
RFOUT
DISABLE
VCC
2
3
4
RFOUT 10
C10
OPEN
C4
C3
DISABLE
L1
OPEN 10pF
VBIAS
RFOUT
9
18nH
R4
OPEN
NC NC NC NC
C7
100pF
5
6
7
8
C11
10µF
C6
0.01µF
C5
100pF
VCC3
C8
0.01µF
R1
0Ω
VCC2
C14
OPEN
C13
OPEN
C12
OPEN
R5
OPEN
C9
10µF
R2
0Ω
VCC1
Figure 36. Evaluation Board, 2140 MHz Frequency Tuning Band
Table 8. Evaluation Board Configuration Options, 2140 MHz Frequency Tuning Band
Component
Function/Notes
Default Value
C1, C2
Input/output dc blocking capacitors.
C1, C2 = 20 pF
C3, C4, Cꢀ, C6, C7, Power supply decoupling capacitors. Power supply decoupling capacitors are required to
C3 = 10 pF
C8, C9, C10, C11,
C12, C13, C14
filter out the high frequency noise on the power supply. The smallest capacitor should be the Cꢀ, C7 = 100 pF
closest to the ADLꢀ606. The main bias that goes through RFOUT is the most sensitive to noise C6, C8 = 0.01 μF
because the bias is connected directly to the RF output. For the 1960 MHz and 2140 MHz
frequency tuning bands, Capacitors C12, C13, and C14 are open; for the 2630 MHz frequency
tuning band, it is recommended that the bypassing capacitors be added as follows:
C12 = 100 pF, C13 = 0.01 μF, and C14 = 10 μF.
C9, C11 = 10 μF
C4, C10, C12, C13,
C14 = open
CIN
Input matching capacitor. To match the ADLꢀ606 at the 2140 MHz frequency tuning band,
Shunt Capacitor CIN is required at a distance of 268 mils. If space is at a premium, an inductor
can take the place of the microstrip line.
CIN = 1.3 pF HQ
COUT
Output matching capacitor. COUT is set at a specific distance from the device so that the micro- COUT = 3.9 pF HQ
strip line can act as inductance for the matching network (see Table 7). If space is at a premium,
an inductor can take the place of the microstrip line. A short length of low impedance line on
the output is embedded in the match.
L1
The main bias for the ADLꢀ606 comes through L1 to the output stage. L1 should be high
impedance for the frequency of operation while providing low resistance for the dc current.
The evaluation board uses a Coilcraft® 0603HP-18NX_LU inductor; this 18 nH inductor provides
some of the match at 2140 MHz.
L1 = 18 nH
R1, R2, R4, Rꢀ
To provide bias to all stages through just one supply, set R1 and R2 to 0 Ω, and leave R4 and
Rꢀ open. To provide separate bias to stages, set R1 and R2 to open and R4 and Rꢀ to 0 Ω.
R1, R2 = 0 Ω
R4, Rꢀ = open
Exposed Paddle
The paddle should be connected to both thermal and electrical ground.
Rev. 0 | Page 16 of 20
ADL5606
Figure 37. Evaluation Board Layout, Top
Figure 38. Evaluation Board Layout, Bottom
Rev. 0 | Page 17 of 20
ADL5606
OUTLINE DIMENSIONS
4.00
BSC SQ
0.60 MAX
0.60 MAX
0.65 BSC
PIN 1
INDICATOR
13
16
1
12
9
PIN 1
INDICATOR
2.50
2.35 SQ
2.20
TOP
VIEW
EXPOSED
3.75
BSC SQ
PAD
(BOTTOM VIEW)
0.50
0.40
0.30
4
8
5
0.25 MIN
0.80 MAX
0.65 TYP
12° MAX
1.95 BSC
0.05 MAX
0.02 NOM
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
1.00
0.85
0.80
0.35
0.30
0.25
0.20 REF
COPLANARITY
0.08
SECTION OF THIS DATA SHEET.
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
Figure 39. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-10)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
−40°C to +8ꢀ°C
Package Description
Package Option
ADLꢀ606ACPZ-R7
ADLꢀ606-EVALZ
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Evaluation Board
CP-16-10
1 Z = RoHS Compliant Part.
Rev. 0 | Page 18 of 20
ADL5606
NOTES
Rev. 0 | Page 19 of 20
ADL5606
NOTES
©2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09968-0-7/11(0)
Rev. 0 | Page 20 of 20
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