ADL5545 [ADI]
30 MHz to 6 GHz RF/IF Gain Block; 30 MHz至6 GHz的RF / IF增益模块
| 型号： | ADL5545 |
| 厂家： | 
ADI |
| 描述： | 30 MHz to 6 GHz RF/IF Gain Block |
| 文件： | 总20页 (文件大小：414K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
30 MHz to 6 GHz
RF/IF Gain Block
ADL5545
Data Sheet
FEATURES
FUNCTIONAL BLOCK DIAGRAM
GND
Fixed gain of 24.1 dB
(2)
Broadband operation from 30 MHz to 6 GHz
Input/output internally matched to 50 Ω
Integrated bias control circuit
ADL5545
BIAS
2
OIP3 of 36.4 dBm at 900 MHz
P1dB of 18.1 dBm at 900 MHz
Noise figure of 2.9 dB at 900 MHz
Single 5 V power supply
1
3
RFIN
GND RFOUT
Figure 1.
Low quiescent current of 56 mA
Wide operating temperature range of −40°C to +105°C
Thermally efficient SOT-89 package
ESD rating of 1.5 kV (Class 1C)
GENERAL DESCRIPTION
The ADL5545 is a single-ended RF/IF gain block amplifier
that provides broadband operation from 30 MHz to 6 GHz.
The ADL5545 provides over 36 dBm of OIP3 using only 56 mA
from a 5 V supply.
The ADL5545 is fabricated on an InGaP HBT process and has
a high ESD rating of 1.5 kV (Class 1C). The ADL5545 is also
fully specified for operation across the wide temperature range of
−40°C to +105°C. A fully populated RoHS-compliant evaluation
board is available.
The ADL5545 provides a gain of 24 dB, which is stable over
frequency, temperature, power supply, and from device to device.
The amplifier is offered in the industry-standard SOT-89 package
and is internally matched to 50 Ω at the input and output, making
the ADL5545 very easy to implement in a wide variety of applica-
tions. The only external components required are the input/output
ac coupling capacitors, power supply decoupling capacitors, and
dc bias inductor.
Rev. 0
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rightsof third parties that may result fromits use. Specifications subject to change without notice. No
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Tel: 781.329.4700
Technical Support
©2013 Analog Devices, Inc. All rights reserved.
www.analog.com
ADL5545
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
100 MHz to 500 MHz Frequency Band .................................. 10
4 GHz to 6 GHz Frequency Band ............................................ 11
General......................................................................................... 12
Applications Information .............................................................. 14
Basic Connections...................................................................... 14
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Typical Scattering Parameters (S-Parameters) ......................... 5
Absolute Maximum Ratings............................................................ 7
Thermal Resistance ...................................................................... 7
ESD Caution.................................................................................. 7
Pin Configuration and Function Descriptions............................. 8
Typical Performance Characteristics ............................................. 9
500 MHz to 4 GHz Frequency Band.......................................... 9
Soldering Information and Recommended
PCB Land Pattern....................................................................... 15
Operation Down to 30 MHz..................................................... 16
W-CDMA ACPR Performance ................................................ 16
Evaluation Board ............................................................................ 17
Outline Dimensions....................................................................... 18
Ordering Guide .......................................................................... 18
REVISION HISTORY
4/13—Revision 0: Initial Version
Rev. 0 | Page 2 of 20
Data Sheet
ADL5545
SPECIFICATIONS
VPOS = 5 V and TA = 25°C, unless otherwise noted.
Table 1.
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
OVERALL FUNCTION
Frequency Range
FREQUENCY = 30 MHz
Gain
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure
30
6000
MHz
22.6
12.0
30.3
3.8
dB
dBm
dBm
dB
Δf = 1 MHz, output power (POUT) = −3 dBm per tone
FREQUENCY = 140 MHz
Gain
24.8
dB
vs. Frequency
10 MHz
0.03
dB
vs. Temperature
vs. Supply
−40°C ≤ TA ≤ +85°C
4.75 V to 5.25 V
0.6
0.30
dB
dB
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure
14.6
31.5
3.1
dBm
dBm
dB
Δf = 1 MHz, output power (POUT) = −3 dBm per tone
FREQUENCY = 350 MHz
Gain
24.6
dB
vs. Frequency
10 MHz
0.01
dB
vs. Temperature
vs. Supply
−40°C ≤ TA ≤ +85°C
4.75 V to 5.25 V
0.6
0.30
dB
dB
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure
16.1
32.6
3.3
dBm
dBm
dB
Δf = 1 MHz, output power (POUT) = −3 dBm per tone
FREQUENCY = 700 MHz
Gain
23.7
23.4
21.5
24.4
0.05
0.5
0.13
17.9
38.8
3.0
25.1
24.8
22.9
dB
dB
dB
dB
dBm
dBm
dB
vs. Frequency
vs. Temperature
vs. Supply
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure
50 MHz
−40°C ≤ TA ≤ +85°C
4.75 V to 5.25 V
Δf = 1 MHz, output power (POUT) = −3 dBm per tone
FREQUENCY = 900 MHz
Gain
24.1
0.07
0.5
0.13
18.1
36.4
2.9
dB
dB
dB
dB
dBm
dBm
dB
vs. Frequency
vs. Temperature
vs. Supply
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure
50 MHz
−40°C ≤ TA ≤ +85°C
4.75 V to 5.25 V
Δf = 1 MHz, output power (POUT) = −3 dBm per tone
FREQUENCY = 1900 MHz
Gain
22.2
dB
vs. Frequency
50 MHz
0.11
dB
vs. Temperature
vs. Supply
−40°C ≤ TA ≤ +85°C
4.75 V to 5.25 V
0.7
0.17
dB
dB
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure
16.6
35.2
3.4
dBm
dBm
dB
Δf = 1 MHz, output power (POUT) = −3 dBm per tone
Rev. 0 | Page 3 of 20
ADL5545
Data Sheet
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
FREQUENCY = 2140 MHz
Gain
21.1
21.8
0.09
0.7
0.17
16.2
35.7
3.5
22.4
21.7
20.4
19.4
dB
dB
dB
dB
dBm
dBm
dB
vs. Frequency
vs. Temperature
vs. Supply
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure
50 MHz
−40°C ≤ TA ≤ +85°C
4.75 V to 5.25 V
Δf = 1 MHz, output power (POUT) = −3 dBm per tone
FREQUENCY = 2600 MHz
Gain
20.1
19.0
17.8
20.9
0.09
0.7
0.16
15.7
34.6
3.6
dB
dB
dB
dB
dBm
dBm
dB
vs. Frequency
vs. Temperature
vs. Supply
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure
50 MHz
−40°C ≤ TA ≤ +85°C
4.75 V to 5.25 V
Δf = 1 MHz, output power (POUT) = −3 dBm per tone
FREQUENCY = 3500 MHz
Gain
19.7
0.10
0.8
0.17
14.5
33.7
4.0
dB
dB
dB
dB
dBm
dBm
dB
vs. Frequency
vs. Temperature
vs. Supply
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure
50 MHz
−40°C ≤ TA ≤ +85°C
4.75 V to 5.25 V
Δf = 1 MHz, output power (POUT) = −3 dBm per tone
FREQUENCY = 4000 MHz
Gain
18.6
dB
vs. Frequency
50 MHz
0.14
dB
vs. Temperature
vs. Supply
−40°C ≤ TA ≤ +85°C
4.75 V to 5.25 V
1.0
0.19
dB
dB
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure
13.1
29.0
4.6
dBm
dBm
dB
Δf = 1 MHz, output power (POUT) = −3 dBm per tone
FREQUENCY = 5000 MHz
Gain
16.8
dB
vs. Frequency
50 MHz
0.05
dB
vs. Temperature
vs. Supply
−40°C ≤ TA ≤ +85°C
4.75 V to 5.25 V
1.2
0.20
dB
dB
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure
9.9
31.8
4.8
dBm
dBm
dB
Δf = 1 MHz, output power (POUT) = −3 dBm per tone
FREQUENCY = 5800 MHz
Gain
15.9
dB
vs. Frequency
50 MHz
0.20
dB
vs. Temperature
vs. Supply
−40°C ≤ TA ≤ +85°C
4.75 V to 5.25 V
1.3
0.20
dB
dB
Output 1 dB Compression Point
Output Third-Order Intercept
Noise Figure
9.4
28.4
5.2
dBm
dBm
dB
Δf = 1 MHz, output power (POUT) = −3 dBm per tone
VPOS
POWER INTERFACE
Supply Voltage
Supply Current
vs. Temperature
Power Dissipation
4.75
5
5.25
70
V
56
−6
280
mA
mA
mW
−40°C ≤ TA ≤ +85°C
VPOS = 5 V
Rev. 0 | Page 4 of 20
Data Sheet
ADL5545
TYPICAL SCATTERING PARAMETERS (S-PARAMETERS)
VPOS = 5 V and TA = 25°C. The effects of the test fixture have been deembedded up to the pins of the device.
Table 2.
S11
S21
S12
S22
Frequency
(MHz)
Magnitude (dB) Angle (°) Magnitude (dB) Angle (°) Magnitude (dB) Angle (°) Magnitude (dB) Angle (°)
30
50
100
200
300
400
500
600
0.262848
0.16114
−47.6295 14.45259
−55.2231 15.15086
177.5351 0.045367
175.6394 0.045744
173.6613 0.045475
168.5803 0.044902
163.4185 0.044363
157.8149 0.043939
152.0089 0.043468
146.3219 0.043343
140.6962 0.043126
135.1523 0.043134
129.5742 0.042992
124.1535 0.043208
118.6387 0.043095
113.3993 0.043512
108.0531 0.043553
102.9911 0.043723
97.78215 0.04388
92.56152 0.044204
87.51542 0.044342
82.68712 0.044789
77.73154 0.045028
72.88006 0.045414
67.92418 0.045764
63.00376 0.046097
58.39029 0.046511
53.61962 0.046875
48.88951 0.047094
44.30914 0.04742
39.79969 0.04771
35.26209 0.047939
30.79007 0.048142
26.20347 0.048485
21.74989 0.048594
17.30951 0.048847
12.84427 0.049022
8.513198 0.049204
4.094389 0.0494
11.15995 0.133274
5.819622 0.089972
0.757324 0.064358
−3.04168 0.054958
−5.34172 0.061241
−102.531
−123.652
−143.775
−149.301
−149.444
−152.411
−156.801
−161.395
−165.732
−170.208
−174.57
−176.858
178.3385
178.9569
175.9297
175.6884
174.9498
174.9185
175.8795
−179.561
−177.054
−171.248
−165.568
−159.324
−152.405
−146.315
−141.232
−137.023
−133.92
0.093068
0.068146
0.072583
0.077593
0.090466
0.088983
0.092819
0.095784
0.102604
0.09546
−77.639
−108.37
−127.99
15.78907
16.02686
16.07148
−139.813 15.98431
−156.112 16.05625
−163.801 15.87255
−165.254 15.53395
−171.948 15.36561
−179.011 15.24074
−179.149 14.88376
174.7787 14.70169
179.0039 14.34868
176.2059 14.27985
179.6522 14.03556
−178.753 13.78558
−174.192 13.71874
−170.745 13.57927
−7.0452
0.068816
−8.71529 0.078388
−9.99294 0.082927
−11.4604 0.091705
−12.7678 0.095819
−14.1595 0.105012
700
800
900
1000
1100
1200
1300
1400
1500
1600
1700
1800
1900
2000
2100
2200
2300
2400
2500
2600
2700
2800
2900
3000
3100
3200
3300
3400
3500
3600
3700
3800
3900
4000
4100
4200
4300
4400
4500
−15.412
0.10382
0.103295
0.093216
0.098569
0.102425
0.101141
0.104256
0.107955
0.116255
0.120964
0.134422
0.144804
0.152409
0.172904
0.182797
0.194182
0.214678
0.224862
0.237618
0.254998
0.259741
0.268457
0.279771
0.280296
0.289458
0.295282
0.299935
0.308557
0.322587
0.331813
0.349624
0.364557
0.373416
0.387883
0.393838
0.397031
−16.7459 0.111433
−18.1192 0.109622
−19.5857 0.11369
−21.2064 0.11632
−22.6683 0.116498
−24.4303 0.117977
−25.9244 0.117231
−27.8402 0.119281
−29.4276 0.119431
−31.4216 0.122578
−33.3004 0.125497
−35.0534 0.127437
−37.1505 0.133391
−39.1307 0.138487
−41.1358 0.142416
−43.3517 0.149636
−45.3525 0.152783
−47.5024 0.156654
−49.8763 0.161272
−51.8757 0.163889
−54.1577 0.167361
−56.5108 0.17422
−58.6503 0.180631
−160.02
13.29429
−156.118 13.17331
−148.939 12.91149
−145.439 12.80398
−141.698 12.59211
−137.298 12.25861
−136.054 12.16048
−134.876 11.93425
−133.689 11.59419
−133.954 11.45006
−134.459 11.20878
−135.366 10.94307
−136.415 10.818
−132.6
−133.403
−134.121
−137.318
−140.652
−143.308
−147.598
−151.432
−154.16
−157.585
−160.673
−163.74
−167.215
−170.404
−173.285
−175.814
−177.48
−138.409 10.55454
−140.41
−142.8
10.33472
10.20153
−145.933 10.00319
−149.389 9.830752
−61.003
0.191885
−63.3968 0.201435
−65.7102 0.210887
−68.2673 0.220513
−70.7703 0.230421
−73.2644 0.239419
−75.9969 0.250879
−78.5494 0.263277
−81.1499 0.277221
−83.8987 0.293719
−86.5744 0.310153
−89.3666 0.326031
−152.81
−156.47
9.708636
9.552554
−0.51683 0.049578
−4.89998 0.049752
−9.27746 0.049957
−13.8743 0.050078
−159.819 9.356577
−163.085 9.236345
−166.445 9.030995
−169.126 8.880835
−172.227 8.75356
−175.007 8.52107
−177.914 8.396822
178.8178 8.269613
−18.073
0.050214
−22.5061 0.050314
−26.9943 0.050299
−31.2568 0.050336
−35.6516 0.050379
−39.9908 0.050311
−178.445
Rev. 0 | Page 5 of 20
ADL5545
Data Sheet
S11
S21
S12
S22
Frequency
(MHz)
Magnitude (dB) Angle (°) Magnitude (dB) Angle (°) Magnitude (dB) Angle (°) Magnitude (dB) Angle (°)
4600
4700
4800
4900
5000
5100
5200
5300
5400
5500
5600
5700
5800
5900
6000
0.403438
0.401499
0.402691
0.406951
0.406358
0.411878
0.419117
0.424908
0.436811
0.448229
0.458741
0.476482
0.493574
0.510235
0.529772
175.5599 8.049058
171.8158 7.964614
−44.1889 0.050324
−48.7045 0.050239
−53.0729 0.050117
−57.4387 0.049987
−61.8963 0.049721
−66.1646 0.049487
−70.4926 0.049173
−74.8425 0.048744
−79.1925 0.048313
−83.5489 0.047742
−92.3473 0.340214
−95.0828 0.350676
−98.0907 0.356655
−101.172 0.357806
−103.942 0.354643
−107.027 0.348613
−110.061 0.341386
−112.912 0.335864
−116.144 0.334212
−119.197 0.337723
−122.079 0.346452
−125.265 0.359399
−128.278 0.372718
−131.302 0.385573
−134.468 0.395866
−178.955
−178.928
−179.069
−179.375
−179.768
178.5262
175.9255
172.3498
167.6101
162.7581
158.0309
153.2462
149.2789
145.8469
142.478
167.514
7.806924
163.0433 7.595136
157.9584 7.49582
152.676
7.317407
147.3732 7.122278
141.8343 6.989999
136.4786 6.79254
131.1618 6.608538
125.8601 6.460463
121.0845 6.279033
−87.804
0.047224
−92.0021 0.046819
−96.2338 0.046407
−100.445 0.046071
116.483
6.126505
112.0889 6.015478
108.3059 5.87094
−104.55
0.045766
Rev. 0 | Page 6 of 20
Data Sheet
ADL5545
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 3.
Table 4 lists the junction-to-air thermal resistance (θJA) and the
junction-to-case thermal resistance (θJC) for the ADL5545.
Parameter
Rating
6.5 V
18 dBm
400 mW
Supply Voltage, VPOS
Input Power (50 Ω Impedance)
Internal Power Dissipation
(Pad Soldered to Ground)
Table 4. Thermal Resistance
1
2
Package Type
θJA
θJC
Unit
3-Lead SOT-89 (RK-3)
53
15
°C/W
Maximum Junction Temperature
Operating Temperature Range
Storage Temperature Range
150°C
−40°C to +105°C
−65°C to +150°C
1 Measured on the ADL5545 evaluation board. For more information about
board layout, see the Soldering Information and Recommended PCB Land
Pattern section.
2 Based on simulation with a standard JEDEC board per JESD51.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. 0 | Page 7 of 20
ADL5545
Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
RFIN
1
2
3
ADL5545
TOP VIEW
GND
(2)
GND
(Not to Scale)
RFOUT
NOTES
1. THE EXPOSED PAD ENCOMPASSES PIN 2 AND THE
TAB AT THE TOP SIDE OF THE PACKAGE. SOLDER
THE EXPOSED PAD TO A LOW IMPEDANCE GROUND
PLANE FOR ELECTRICAL GROUNDING AND
THERMAL TRANSFER.
Figure 2. Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
2
3
RFIN
GND
RFOUT
RF Input. This pin requires a dc blocking capacitor.
Ground. Connect this pin to a low impedance ground plane.
RF Output and Supply Voltage. DC bias is provided to this pin through an inductor that is connected to
the external power supply. The RF path requires a dc blocking capacitor.
EPAD
Exposed Pad. The exposed pad encompasses Pin 2 and the tab at the top side of the package. Solder the
exposed pad to a low impedance ground plane for electrical grounding and thermal transfer.
Rev. 0 | Page 8 of 20
Data Sheet
ADL5545
TYPICAL PERFORMANCE CHARACTERISTICS
500 MHz TO 4 GHz FREQUENCY BAND
40
45
40
35
30
25
20
700MHz
35
900MHz
OIP3
30
2140MHz
25
GAIN
P1dB
20
15
2600MHz
1900MHz
10
4000MHz
3500MHz
5
0
NOISE FIGURE
2.0
0.5
1.0
1.5
2.5
3.0
3.5
4.0
–5.0
–2.5
0
2.5
5.0
FREQUENCY (GHz)
P
PER TONE (dBm)
OUT
Figure 3. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency
Figure 6. OIP3 vs. Output Power (POUT) and Frequency
25
0
–5
–40°C
+85°C
24
23
22
21
20
19
18
17
16
15
+25°C
–10
–15
–20
–25
–30
–35
S11
S22
+105°C
S12
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 4. Gain vs. Frequency and Temperature
Figure 7. Input Return Loss (S11), Output Return Loss (S22),
and Reverse Isolation (S12) vs. Frequency
40
35
30
25
20
15
10
40
6.0
+25°C
–40°C
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
35
30
25
20
15
10
+85°C
+105°C
+85°C
+105°C
+25°C
+25°C
+105°C
+85°C
–40°C
–40°C
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 5. P1dB and OIP3 vs. Frequency and Temperature
Figure 8. Noise Figure vs. Frequency and Temperature
Rev. 0 | Page 9 of 20
ADL5545
Data Sheet
100 MHz TO 500 MHz FREQUENCY BAND
40
45
40
35
30
25
20
35
OIP3
30
GAIN
25
140MHz
350MHz
20
P1dB
15
10
5
NOISE FIGURE
0
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
–5.0
–2.5
0
2.5
5.0
FREQUENCY (GHz)
P
PER TONE (dBm)
OUT
Figure 9. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency,
Low Frequency Configuration
Figure 12. OIP3 vs. Output Power (POUT) and Frequency,
Low Frequency Configuration
26.0
0
–5
25.5
25.0
24.5
24.0
23.5
23.0
22.5
22.0
+25°C
–40°C
+85°C
–10
–15
–20
–25
–30
–35
S11
S22
+105°C
S12
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 10. Gain vs. Frequency and Temperature,
Low Frequency Configuration
Figure 13. Input Return Loss (S11), Output Return Loss (S22), and Reverse
Isolation (S12) vs. Frequency, Low Frequency Configuration
40
35
30
25
20
15
10
40
6.0
5.5
5.0
+85°C
+25°C
–40°C
35
30
25
20
15
10
4.5
+105°C
+85°C
+105°C
4.0
3.5
+25°C
+25°C
+85°C
3.0
–40°C
2.5
–40°C
0.45 0.50
+105°C
2.0
0.10
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 11. P1dB and OIP3 vs. Frequency and Temperature,
Low Frequency Configuration
Figure 14. Noise Figure vs. Frequency and Temperature,
Low Frequency Configuration
Rev. 0 | Page 10 of 20
Data Sheet
ADL5545
4 GHz TO 6 GHz FREQUENCY BAND
40
40
35
30
25
20
15
35
OIP3
30
25
5800MHz
5000MHz
20
GAIN
15
P1dB
10
NOISE FIGURE
5
0
4.0
4.2
4.4
4.6
4.8
5.0
5.2
5.4
5.6
5.8
6.0
–5.0
–2.5
0
2.5
5.0
FREQUENCY (GHz)
P
PER TONE (dBm)
OUT
Figure 18. OIP3 vs. Output Power (POUT) and Frequency,
High Frequency Configuration
Figure 15. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency,
High Frequency Configuration
20
0
–5
19
–40°C
S11
S22
18
+25°C
–10
–15
–20
–25
–30
–35
17
16
15
+85°C
+105°C
14
S12
13
12
4.0
4.2
4.4
4.6
4.8
5.0
5.2
5.4
5.6
5.8
6.0
4.0
4.2
4.4
4.6
4.8
5.0
5.2
5.4
5.6
5.8
6.0
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 16. Gain vs. Frequency and Temperature,
High Frequency Configuration
Figure 19. Input Return Loss (S11), Output Return Loss (S22), and Reverse
Isolation (S12) vs. Frequency, High Frequency Configuration
40
35
30
25
20
15
10
5
40
7.0
6.5
6.0
+25°C
35
30
25
20
15
10
5
+85°C
+105°C
–40°C
+105°C
5.5
5.0
4.5
4.0
+85°C
+25°C
+25°C
–40°C
–40°C
+85°C
4.4
3.5
3.0
+105°C
0
4.0
0
6.0
4.2
4.6
4.8
5.0
5.2
5.4
5.6
5.8
4.0
4.2
4.4
4.6
4.8
5.0
5.2
5.4
5.6
5.8
6.0
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 20. Noise Figure vs. Frequency and Temperature,
High Frequency Configuration
Figure 17. P1dB and OIP3 vs. Frequency and Temperature,
High Frequency Configuration
Rev. 0 | Page 11 of 20
ADL5545
Data Sheet
GENERAL
63
61
59
57
55
53
51
49
47
45
70
68
66
64
62
60
58
56
54
52
50
5.25V
5.00V
4.75V
5.25V
5.00V
4.75V
–40 –30 –20 –10
0
10 20 30 40 50 60 70 80 90 100 110
TEMPERATURE (°C)
1
3
5
7
9
11
(dBm)
13
15
17
19
P
OUT
Figure 21. Supply Current vs. Temperature
Figure 24. Supply Current vs. POUT at 900 MHz
40
35
30
25
20
15
10
5
25
20
15
10
5
0
0
23.6 23.7 23.8 23.9 24.0 24.1 24.2 24.3 24.4
GAIN (dB)
31
32
33
34
35
36
37
38
39
40
41
OIP3 (dBm)
Figure 22. Gain Distribution at 900 MHz
Figure 25. OIP3 Distribution at 900 MHz, POUT = −3 dBm per Tone
30
25
20
15
10
5
80
70
60
50
40
30
20
10
0
0
17.6 17.7 17.8 17.9 18.0 18.1 18.2 18.3 18.4 18.5 18.6 18.7
P1dB (dBm)
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.4
NOISE FIGURE (dB)
Figure 23. P1dB Distribution at 900 MHz
Figure 26. Noise Figure Distribution at 900 MHz
Rev. 0 | Page 12 of 20
Data Sheet
ADL5545
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
H2
H3
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
FREQUENCY (GHz)
Figure 27. Single-Tone Harmonics vs. Frequency, POUT = 0 dBm
Rev. 0 | Page 13 of 20
ADL5545
Data Sheet
APPLICATIONS INFORMATION
40
35
30
25
20
15
10
5
BASIC CONNECTIONS
OIP3, DEFAULT SETUP CONFIGURATION
OIP3, LOW FREQUENCY CONFIGURATION
GAIN, DEFAULT SETUP CONFIGURATION
GAIN, LOW FREQUENCY CONFIGURATION
Figure 28 shows the basic connections for operating the
ADL5545. The device supports operation from 30 MHz to 6 GHz.
However, for optimal performance at lower and higher frequency
bands, the board configuration must be adjusted. Table 6 lists
the recommended board configuration to operate the device at
various frequency bands.
V
GND
POS
P1dB, DEFAULT SETUP CONFIGURATION
P1dB, LOW FREQUENCY CONFIGURATION
NOISE FIGURE, DEFAULT SETUP CONFIGURATION
C6
10µF
C5
NOISE FIGURE, LOW FREQUENCY CONFIGURATION
(2)
0
0.10
1nF
C4
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
ADL5545
FREQUENCY (GHz)
100pF
Figure 29. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency,
100 MHz to 500 MHz, Comparison of Performance
with the Optimized Settings and the Default Configuration
1
2
3
L1
C2
RFIN
RFOUT
C1
C7
C8
0
S11, DEFAULT SETUP CONFIGURATION
S11, LOW FREQUENCY CONFIGURATION
S22, DEFAULT SETUP CONFIGURATION
Figure 28. Basic Connections
S22, LOW FREQUENCY CONFIGURATION
–5
S12, DEFAULT SETUP CONFIGURATION
S12, LOW FREQUENCY CONFIGURATION
A 5 V dc bias is supplied to the amplifier through the bias
inductor connected to RFOUT (Pin 3). The bias voltage must
be decoupled using 100 pF, 1 nF, and 10 μF power supply
decoupling capacitors. The typical current consumption for
the ADL5545 is 56 mA.
–10
–15
–20
–25
–30
–35
At low and high frequencies, the device exhibits improved
performance with the suggested setup configuration listed in
Table 6. Figure 29 to Figure 32 provide a comparison of the
performance of the device at the 100 MHz to 500 MHz and
4 GHz to 6 GHz bands when driven with the optimal setup
configuration and the default setup configuration.
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
FREQUENCY (GHz)
Figure 30. Return Loss and Reverse Isolation, 100 MHz to 500 MHz,
Comparison of Performance with the Optimized Settings
and the Default Configuration
Table 6. Recommended Components for Basic Connections
High Frequency Matching
AC Coupling Capacitors (0402)
DC Bias Inductor (0603HP)
Capacitors (0402)
Frequency Band
C1
C2
L1
C7
C8
100 MHz to 500 MHz
500 MHz to 4 GHz (default)
4 GHz to 6 GHz
100 nF
100 pF
100 pF
100 nF
100 pF
100 pF
1000 nH
100 nH
12 nH
Do not install
Do not install
0.1 pF
Do not install
Do not install
0.1 pF
Rev. 0 | Page 14 of 20
Data Sheet
ADL5545
40
35
30
25
20
15
10
5
SOLDERING INFORMATION AND RECOMMENDED
PCB LAND PATTERN
OIP3, DEFAULT SETUP CONFIGURATION
OIP3, HIGH FREQUENCY CONFIGURATION
Figure 33 shows the recommended land pattern for the
ADL5545. To minimize thermal impedance, the exposed pad
on the underside of the SOT-89 package is soldered to a ground
plane, along with Pin 2. If multiple ground layers exist, stitch
the layers together using vias.
GAIN, DEFAULT SETUP CONFIGURATION
GAIN, HIGH FREQUENCY CONFIGURATION
1.80mm
P1dB, DEFAULT SETUP CONFIGURATION
P1dB, HIGH FREQUENCY CONFIGURATION
NOISE FIGURE, DEFAULT SETUP CONFIGURATION
NOISE FIGURE, HIGH FREQUENCY CONFIGURATION
0
4.0
4.2
4.4
4.6
4.8
5.0
5.2
5.4
5.6
5.8
6.0
3.48mm
FREQUENCY (GHz)
Figure 31. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency,
4 GHz to 6 GHz, Comparison of Performance
with the Optimized Settings and the Default Configuration
0.20mm
5.56mm
0
0.86mm
0.62mm
–5
–10
1.27mm
–15
–20
–25
–30
–35
1.50mm
3.00mm
S11, DEFAULT SETUP CONFIGURATION
S11, HIGH FREQUENCY CONFIGURATION
S22, DEFAULT SETUP CONFIGURATION
S22, HIGH FREQUENCY CONFIGURATION
S12, DEFAULT SETUP CONFIGURATION
S12, HIGH FREQUENCY CONFIGURATION
Figure 33. Recommended Land Pattern
The land pattern on the ADL5545 evaluation board provides a
measured thermal resistance (θJA) of 53°C/W. To measure θJA,
the temperature at the top of the SOT-89 package is found with
an IR temperature gun. Thermal simulation suggests a junction
temperature 10°C higher than the top-of-package temperature.
With additional measurements of the ambient temperature and
I/O power, θJA can be determined.
4.0
4.2
4.4
4.6
4.8
5.0
5.2
5.4
5.6
5.8
6.0
FREQUENCY (GHz)
Figure 32. Return Loss and Reverse Isolation, 4 GHz to 6 GHz,
Comparison of Performance with the Optimized Settings
and the Default Configuration
Rev. 0 | Page 15 of 20
ADL5545
Data Sheet
32
31
30
29
28
27
26
OPERATION DOWN TO 30 MHz
To operate the ADL5545 at frequencies below 100 MHz, a feed-
back network must be implemented between the input and output
ports of the device to ensure stability. Figure 34 shows a sample
configuration used to evaluate the device at frequencies below
100 MHz. Figure 35 to Figure 37 demonstrate the performance
of the device in this configuration.
–40°C
+25°C
+85°C
+105°C
V
GND
POS
C6
10µF
C5
(2)
1nF
C4
–7
–5
–3
PER TONE (dBm)
–1
1
ADL5545
P
OUT
100pF
Figure 37. OIP3 vs. POUT at 30 MHz
1
2
3
L1
1000nH
RFIN
RFOUT
W-CDMA ACPR PERFORMANCE
C1
C2
Figure 38 shows a plot of the adjacent channel power ratio
(ACPR) vs. POUT for the ADL5545. The signal type used is a
single wideband code division multiple access (W-CDMA)
carrier (Test Model 1-64) at 2140 MHz. This signal is generated
by a very low ACPR source. ACPR is measured at the output by
a high dynamic range spectrum analyzer that incorporates an
instrument noise-correction function.
100nF
100nF
R
F
C
F
10nF
1500Ω
Figure 34. Setup for Low Frequency Operation Down to 30 MHz
40
35
OIP3
0
30
–10
–20
–30
–40
–50
–60
–70
–80
25
GAIN
20
15
P1dB
10
5
NOISE FIGURE
0
30
40
50
60
70
80
90
100
FREQUENCY (MHz)
Figure 35. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency,
30 MHz to 100 MHz
–20
–15
–10
P
–5
(dBm)
0
5
OUT
0
Figure 38. ACPR vs. POUT, Single W-CDMA Carrier (Test Model 1-64)
at 2140 MHz
–5
The ADL5545 achieves an ACPR of −79 dBc at an output power
level of −4 dBm, at which point device noise and not distortion
begins to dominate the power in the adjacent channels. At an
output power level of 0 dBm, ACPR is still very low at −69 dBc.
–10
S11
S22
–15
–20
–25
–30
–35
S12
30
40
50
60
70
80
90
100
FREQUENCY (MHz)
Figure 36. Return Loss and Reverse Isolation, 30 MHz to 100 MHz
Rev. 0 | Page 16 of 20
Data Sheet
ADL5545
EVALUATION BOARD
V
GND
SUP
Figure 39 shows the ADL5545 evaluation board layout.
Figure 40 shows the schematic for the evaluation board.
The board is powered by a single 5 V supply. Table 7 lists
the components used on the evaluation board. Power can
be applied to the board through clip-on leads (VSUP, GND).
C6
10µF
C5
(2)
1nF
C4
ADL5545
100pF
1
2
3
L1
100nH
RFIN
RFOUT
C1
100pF
C2
100pF
Figure 40. Evaluation Board Schematic
Figure 39. Evaluation Board Layout (Top)
Table 7. Evaluation Board Configuration Options
Component
Function
Default Value
100 pF, 0402
100 nH, 0603 (Coilcraft 0603HP or equivalent)
C1, C2
L1
AC coupling capacitors
DC bias inductor
VSUP and GND
C4, C5, C6
Clip-on terminals for power supply
Power supply decoupling capacitors
C4: 100 pF, 0603
C5: 1 nF, 0603
C6: 10 μF, 1206
Rev. 0 | Page 17 of 20
ADL5545
Data Sheet
OUTLINE DIMENSIONS
*
1.75
1.55
(2)
2
4.25
3.94
2.60
2.30
1
3
1.20
1.50 TYP
0.75
3.00 TYP
2.29
2.14
4.60
4.40
1.60
1.40
0.44
0.35
END VIEW
*
0
0.36
.56
*
0.52
0.32
*
COMPLIANT TO JEDEC STANDARDS TO-243 WITH THE
EXCEPTION OF DIMENSIONS INDICATED BY AN ASTERISK.
Figure 41. 3-Lead Small Outline Transistor Package [SOT-89]
(RK-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
Package Description
3-Lead SOT-89, 7“ Tape and Reel
Evaluation Board
Package Option
RK-3
ADL5545ARKZ-R7
ADL5545-EVALZ
−40°C to +105°C
−40°C to +105°C
1 Z = RoHS Compliant Part.
Rev. 0 | Page 18 of 20
Data Sheet
NOTES
ADL5545
Rev. 0 | Page 19 of 20
ADL5545
NOTES
Data Sheet
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D11385-0-4/13(0)
Rev. 0 | Page 20 of 20
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