ADIS16IMU2/PCBZ [ADI]
Compact, Precision Six Degrees of Freedom Inertial Sensor;
| 型号： | ADIS16IMU2/PCBZ |
| 厂家： | 
ADI |
| 描述： | Compact, Precision Six Degrees of Freedom Inertial Sensor |
| 文件： | 总23页 (文件大小：590K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Compact, Precision Six Degrees of
Freedom Inertial Sensor
ADIS16446
Data Sheet
FEATURES
GENERAL DESCRIPTION
Triaxial digital gyroscope with digital range scaling
2ꢀ0°/sec, ꢀ00°/sec, 1000°/sec settings
Axis to axis misalignment: 0.0ꢀ°
Triaxial digital accelerometer dynamic range: 18 g minimum
Autonomous operation and data collection
No external configuration commands required
20ꢀ ms typical power-on start-up time
Factory calibrated sensitivity, bias, and axial alignment
Calibration temperature range: −40°C to +8ꢀ°C
SPI-compatible
Optional burst read sequence for fast data transfer
Embedded temperature sensor
The ADIS16446 iSensor® device is a complete inertial system
that includes a triaxial gyroscope, a triaxial accelerometer, and a
temperature sensor. Each sensor in the ADIS16446 combines
industry-leading iMEMS® technology with signal conditioning
that optimizes dynamic performance. The factory calibration
characterizes each sensor for sensitivity, bias, and alignment.
As a result, each sensor has its own dynamic compensation
formulas that provide accurate sensor measurements.
The ADIS16446 provides a simple, cost-effective method for
integrating accurate multiaxis inertial sensing into industrial
systems, especially when compared with the complexity and
investment associated with discrete designs. All necessary motion
testing and calibration are part of the production process at the
factory, greatly reducing system integration time. Tight orthogonal
alignment simplifies inertial frame alignment in navigation systems.
The serial peripheral interface (SPI) and register structures
provide a simple interface for data collection and configuration
control.
Programmable operation and control
Automatic and manual bias correction controls
Bartlett window FIR length, number of taps
Digital I/O: data ready, alarm indicator, general-purpose
Alarms for condition monitoring
Optional external sync input clock up to 1.1 kHz
Single command self test
Power supply voltage range: 3.1ꢀ V to 3.4ꢀ V
2000 g mechanical shock survivability
Operating temperature range: −40°C to +10ꢀ°C
The ADIS16446 has a compatible pinout for systems that currently
use other Analog Devices, Inc., inertial measurement unit (IMU)
products, such as the ADIS16334, ADIS16485, or ADIS16448.
The ADIS16446 is a 20-lead module that is 24.15 mm ×
37.70 mm × 10.80 mm and has a standard connector interface.
APPLICATIONS
Platform stabilization and control
Navigation
Robotics
FUNCTIONAL BLOCK DIAGRAM
DIO1 DIO2 DIO3 DIO4/CLKIN RST
VDD
POWER
MANAGEMENT
SELF TEST
I/O
ALARMS
GND
TRIAXIAL
GYROSCOPE
OUTPUT
DATA
CS
TRIAXIAL
REGISTERS
ACCELEROMETER
SCLK
DIN
CALIBRATION
CONTROLLLER
AND
SPI
FILTERS
TEMPERATURE
VDD
USER
CONTROL
REGISTERS
DOUT
CLOCK
ADIS16446
Figure 1.
Rev. 0
Document Feedback
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Technical Support
©2021 Analog Devices, Inc. All rights reserved.
www.analog.com
ADIS16446
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Product Identification................................................................ 14
Self-Test Function ...................................................................... 14
Status and Error Flags................................................................ 15
Input and Output Configuration.................................................. 16
Data Ready Indicator................................................................. 16
General-Purpose Input and Output ........................................ 16
Digital Processing Configuration................................................. 17
Gyroscopes and Accelerometers .............................................. 17
Input Clock Configuration ....................................................... 17
Calibration....................................................................................... 18
Gyroscopes.................................................................................. 18
Accelerometers ........................................................................... 18
Alarms.............................................................................................. 20
Static Alarm Use......................................................................... 20
Dynamic Alarm Use .................................................................. 20
Alarm Reporting ........................................................................ 20
Applications Information.............................................................. 21
Mounting Tips ............................................................................ 21
Power Supply Considerations................................................... 21
Evaluation Tools ......................................................................... 21
X-Ray Sensitivity ........................................................................ 22
Outline Dimensions....................................................................... 23
Ordering Guide .......................................................................... 23
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Timing Specifications .................................................................. 5
Absolute Maximum Ratings............................................................ 6
Thermal Resistance...................................................................... 6
ESD Caution.................................................................................. 6
Pin Configuration and Function Descriptions............................. 7
Typical Performance Characteristics ............................................. 8
Theory of Operation ........................................................................ 9
Device Operation ......................................................................... 9
Reading Sensor Data.................................................................. 10
Device Configuration ................................................................ 10
User Registers.................................................................................. 11
Output Data Registers.................................................................... 12
Gyroscopes .................................................................................. 12
Accelerometers............................................................................ 12
Internal Temperature ................................................................. 13
System Functions............................................................................ 14
Global Commands ..................................................................... 14
REVISION HISTORY
2/2021—Revision 0: Initial Version
Rev. 0 | Page 2 of 23
Data Sheet
ADIS16446
SPECIFICATIONS
TA = 25°C, VDD = 3.3 V, angular rate = 0°/sec, and dynamic range = 1000°/sec 1 g, unless otherwise noted.
Table 1.
Parameter
Test Conditions/Comments
Min
1000
Typ
1200
0.04
0.02
0.01
Max
Unit
GYROSCOPES
Dynamic Range
Initial Sensitivity
°/sec
1000°/sec, see Table 12
500°/sec, see Table 12
250°/sec, see Table 12
−40°C ≤ TA ≤ +85°C
°/sec/LSB
°/sec/LSB
°/sec/LSB
%
Repeatability1
1
Sensitivity Temperature Coefficient
Misalignment
−40°C ≤ TA ≤ +85°C
Axis to axis
40
0.05
0.5
0.1
0.5
14.5
0.66
0.005
0.015
0.2
0.27
0.0135
330
ppm/°C
Degrees
Degrees
% of FS
°/sec
Axis to frame (package)
Best fit straight line
−40°C ≤ TA ≤ +85°C, 1 σ
1 σ, SMPL_PRD = 0x0001
1 σ, SMPL_PRD = 0x0001
−40°C ≤ TA ≤ +85°C
Any axis, 1 σ
−40°C ≤ TA ≤ +85°C
1000°/sec range, no filtering
f = 25 Hz, 1000°/sec range, no filtering
Nonlinearity
Bias Repeatability1, 2
In-Run Bias Stability
Angular Random Walk
Bias Temperature Coefficient
Linear Acceleration Effect on Bias
Bias Supply Sensitivity
Output Noise
°/hr
°/√hr
°/sec/°C
°/sec/g
°/sec/V
°/sec rms
°/sec/√Hz rms
Hz
Rate Noise Density
−3 dB Bandwidth
Sensor Resonant Frequency
ACCELEROMETERS
Dynamic Range
17.5
kHz
Each axis
18
g
Sensitivity
See Table 16 for data format
−40°C ≤ TA ≤ +85°C
−40°C ≤ TA ≤ +85°C
Axis to axis
Axis to frame (package)
Best fit straight line
−40°C ≤ TA ≤ +85°C, 1 σ
1 σ, SMPL_PRD = 0x0001
1 σ, SMPL_PRD = 0x0001
−40°C ≤ TA ≤ +85°C
−40°C ≤ TA ≤ +85°C
No filtering
0.833
mg/LSB
%
Repeatability1
1
Sensitivity Temperature Coefficient
Misalignment
40
0.2
0.5
0.2
20
0.25
0.11
0.15
5
ppm/°C
Degrees
Degrees
% of FS
mg
Nonlinearity
Bias Repeatability1, 2, 3
In-Run Bias Stability
Velocity Random Walk
Bias Temperature Coefficient
Bias Supply Sensitivity
Output Noise
mg
m/sec/√hr
mg/°C
mg/V
mg rms
mg/√Hz rms
Hz
5.1
Noise Density
−3 dB Bandwidth
Sensor Resonant Frequency
TEMPERATURE
No filtering
0.23
330
5.5
kHz
Sensitivity
Factory Calibration Temperature Range
See Table 17
0.07386
°C/LSB
°C
−40
+85
Rev. 0 | Page 3 of 23
ADIS16446
Data Sheet
Parameter
LOGIC INPUTS4
Test Conditions/Comments
Min
Typ
Max
Unit
Input High Voltage, VIH
Input Low Voltage, VIL
Logic 1 Input Current, IIH
Logic 0 Input Current, IIL
2.0
V
V
µA
0.8
10
VIH = 3.3 V
VIL = 0 V
0.2
All Pins Except
40
1
60
µA
mA
pF
RST
Pin
RST
Input Capacitance, CIN
DIGITAL OUTPUTS4
10
Output High Voltage, VOH
Output Low Voltage, VOL
FLASH MEMORY
Source current (ISOURCE) = 1.6 mA
Sink current (ISINK) = 1.6 mA
Endurance5
2.4
V
V
0.4
10,000
20
Cycles
Years
Data Retention6
TJ = 85°C
FUNCTIONAL TIMES7
Time until new data is available
Power-On Start-Up Time
Reset Recovery Time8
Flash Memory Back-Up Time
Flash Memory Test Time
Automatic Self-Test Time
CONVERSION RATE
205
90
75
20
45
ms
ms
ms
ms
ms
SMPL_PRD = 0x0001
SMPL_PRD = 0x0001
xGYRO_OUT and xACCL_OUT
Clock Accuracy
819.2
SPS
%
3
Optional External Sync Input Clock9
POWER SUPPLY VOLTAGE RANGE
Power Supply Current
0.8
1.1
kHz
V
mA
VDD
3.15
3.3
76
3.45
104
1 The repeatability specifications represent analytical projections, which are based off of the following drift contributions and conditions: temperature hysteresis (−40°C
to +85°C), electronics drift (high temperature operating life test: 85°C, 500 hours), drift from temperature cycling (JESD22, Method A104-C, Method N, 500 cycles,
−40°C to +85°C), rate random walk (10 year projection), and broadband noise.
2 Bias repeatability describes a long-term behavior, over a variety of conditions. Short-term repeatability is related to the in-run bias stability and noise density
specifications.
3 X-ray exposure may degrade this performance metric.
4 The digital I/O signals are driven by an internal 3.3 V supply, and the inputs are 5 V tolerant.
5 Endurance is qualified as per JEDEC Standard 22, Method A117, and measured at −40°C, +25°C, +85°C, and +125°C.
6 The data retention lifetime equivalent is at TJ of 85°C as per JEDEC Standard 22, Method A117. Data retention lifetime decreases with junction temperature.
7 These times do not include thermal settling and internal filter response times (330 Hz bandwidth), which may affect overall accuracy.
8
RST
The
line must be held low for at least 10 µs to assure a proper reset and recovery sequence.
9 The sync input clock functions below the specified minimum value but at reduced performance levels.
Rev. 0 | Page 4 of 23
Data Sheet
ADIS16446
TIMING SPECIFICATIONS
TA = 25°C and VDD = 3.3 V, unless otherwise noted.
Table 2.
Normal Mode
Burst Read
Parameter
fSCLK
tSTALL
tREADRATE
tCS
Description
Serial clock
Stall period between data
Read rate
Chip select to SCLK edge
Min1 Typ Max Min1 Typ Max Unit
0.01
20
2.0
0.01
N/A2
1.0
MHz
μs
40
μs
48.8
48.8
ns
tDAV
tDSU
tDHD
tSCLKR, tSCLKF
tDR, tDF
tSFS
DOUT valid after SCLK edge
DIN setup time before SCLK rising edge
DIN hold time after SCLK rising edge
SCLK rise and fall times, not shown in the Timing Diagrams section
DOUT rise and fall times, not shown in the Timing Diagrams section
100
100
ns
ns
ns
ns
ns
ns
μs
μs
μs
μs
24.4
48.8
24.4
48.8
5
5
12.5
12.5
5
5
12.5
12.5
high after SCLK edge
5
5
CS
t1
tSTDR
tNV
Input sync positive pulse width
Input sync to data ready valid transition
Data invalid time
25
25
600
210
600
210
t3
Input sync period
910
910
1 Guaranteed by design and characterization but not tested in production.
2 When using the burst read function, the stall period is not applicable.
Timing Diagrams
CS
tCS
tSFS
1
2
3
4
5
6
15
16
SCLK
DOUT
tDAV
MSB
DB14
tDSU
DB13
A5
DB12
DB11
A3
DB10
A2
DB2
DB1
D1
LSB
LSB
tDHD
DIN
R/W
A6
A4
D2
Figure 2. SPI Timing and Sequence
tREADRATE
tSTALL
CS
SCLK
Figure 3. Stall Time and Data Rate
3
STDR
1
CLOCK
DATA
READY
NV
Figure 4. Input Clock Timing Diagram
Rev. 0 | Page 5 of 23
ADIS16446
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 3.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Parameter
Rating
Mechanical Shock Survivability
Any Axis, Unpowered, 0.5 ms, ½ Sine
Any Axis, Powered, 0.5 ms, ½ Sine
VDD to GND
Digital Input Voltage to GND
Digital Output Voltage to GND
Temperature
2000 g
2000 g
−0.3 V to +3.45 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
θJA is the junction to ambient thermal resistance, and θJC is the
junction to case thermal resistance.
Table 4. Thermal Resistance
Package Type
θJA (°C/W)
θJC (°C/W)
Mass (grams)
Operating Range
Storage Range1, 2
−40°C to +105°C
−65°C to +125°C
20-Lead ML-20-3
36.5
16.9
15
1 Extended exposure to temperatures outside the specified temperature
range of −40°C to +105°C can adversely affect the accuracy of factory
calibration. For best accuracy, store the device within the specified
operating range of −40°C to +105°C.
ESD CAUTION
2 Although the device is capable of withstanding short-term exposure to
150°C, long-term exposure threatens internal mechanical integrity.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. 0 | Page 6 of 23
Data Sheet
ADIS16446
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
ADIS16446
TOP VIEW
(Not to Scale)
19 17 15 13 11
9
7
8
5
6
3
4
1
2
20 18 16 14 12 10
PIN 1
PIN 20
NOTES
1. THIS REPRESENTATION DISPLAYS THE TOP VIEW WHEN THE
CONNECTOR IS VISIBLE AND FACING UP.
2. MATING CONNECTOR: SAMTEC CLM-110-02 OR EQUIVALENT.
3. DNC = DO NOT CONNECT.
Figure 6. Pin Locations
Figure 5. Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
1
Mnemonic Type
Description
Configurable Digital Input and Output.
DIO3
Input/output
2
3
4
5
DIO4/CLKIN Input/output
Configurable Digital Input and Output or Sync Clock Input.
SPI Serial Clock.
SPI Data Output. DOUT clocks the output on the SCLK falling edge.
SPI Data Input. DIN clocks the input on the SCLK rising edge.
SPI Chip Select.
SCLK
DOUT
DIN
Input
Output
Input
6
CS
Input
7
8
DIO1
RST
Input/output
Input
Configurable Digital Input and Output.
Reset.
9
DIO2
VDD
Input/output
Supply
Configurable Digital Input and Output.
Power Supply. It is recommended to place a 10 µF capacitor between the VDD pins and
the GND pins.
10, 11, 12
13, 14, 15
GND
Supply
Power Ground.
16, 17, 18, 19, 20 DNC
Not applicable Do Not Connect. Do not connect to the DNC pins.
Rev. 0 | Page 7 of 23
ADIS16446
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
10
1000
AVERAGE
AVERAGE
1
100
+δ
+δ
0.1
10
–δ
–δ
0.01
0.01
1
0.01
0.1
1
10
100
1000
0.1
1
10
100
1000
TAU (Seconds)
TAU (Seconds)
Figure 7. Gyroscope Root Allan Variance
Figure 8. Accelerometer Root Allan Variance
Rev. 0 | Page 8 of 23
Data Sheet
ADIS16446
THEORY OF OPERATION
The ADIS16446 is an autonomous system that requires no
user initialization. When the device has a valid power supply,
it initializes itself and starts sampling, processing, and loading
sensor data into the output registers at a sample rate of 819.2 SPS.
DIO1 pulses high after each sample cycle concludes. The SPI
enables simple integration with many embedded processor
platforms, as shown in Figure 9 (electrical connection) and
Table 6 (pin functions). Note that the use of 33 Ω series
resistors placed near the transmitters on the SPI lines shown
in Figure 9 can provide additional signal integrity but are
not required in most applications.
The ADIS16446 SPI supports full duplex serial communication
(simultaneous transmit and receive) and uses the bit sequence
shown in Figure 10. Table 7 provides a list of the most common
settings used to initialize the serial port of a processor for the
ADIS16446 SPI.
Table 7. Generic Master Processor SPI Settings
Processor Setting
Description
Master
The ADIS16446 operates as a slave
SCLK Rate ≤ 2 MHz1 Maximum serial clock rate
SPI Mode 3
CPOL = 1 (polarity), and CPHA = 1 (phase)
I/O LINES ARE COMPATIBLE WITH
3.3V LOGIC LINES
MSB First Mode
16-Bit Mode
Bit sequence
Shift register and data length
VDD
+3.3V
11
SYSTEM
1 For burst read, SCLK rate ≤ 1 MHz.
PROCESSOR
SPI MASTER
6
3
5
4
7
CS
SS
ADIS16446
SCLK
DIN
DEVICE OPERATION
SCLK
MOSI
During normal operation, the ADIS16446 generates a data
ready pulse every time a new sample is available. In the default
configuration, the 819.2 SPS sample clock that generates the
data ready pulse is internally generated, although the user has
the option of synchronizing the data sampling to an external
clock. The ADIS16446 registers are updated when the data
ready signal is inactive. Therefore, the user must not attempt to
read the ADIS16446 registers during this time.
DOUT
MISO
IRQ
DIO1
(USER-CONFIGURABLE.
FACTORY DEFAULT IS DIO1)
13
14
Figure 9. Electrical Connection Diagram
Table 6. Generic Master Processor Pin Names and Functions
Pin Name
Function
Slave select
When performing operations such as part configuration, reset,
self test, or flash memory update, the best way to know if the
operation is complete is by monitoring the data ready pulse
because the data ready pulse automatically resumes after the
desired operation completes. Note that excessive SPI transactions
(such as polling a status register) during a self test or flash
memory update delay completion of the task. See the Data
Ready Indicator section for further information on the data
ready indicator.
SS
SCLK
MOSI
MISO
IRQ
Serial clock
Master output, slave input
Master input, slave output
Interrupt request
CS
SCLK
DIN
R/W A6
A5
R/W A6
D15 D14 D13 D12 D11 D10
NOTES
A5
A4
A3
A2
A1
D9
A0 DC7 DC6 DC5 DC4 DC3 DC2 DC1 DC0
D8 D7 D6 D5 D4 D3 D2 D1 D0
DOUT
D15 D14 D13
1. THE DOUT BIT PATTERN REFLECTS THE ENTIRE CONTENTS OF THE REGISTER IDENTIFIED BY [A6:A0]
IN THE PREVIOUS 16-BIT DIN SEQUENCE WHEN R/W = 0.
2. IF R/W = 1 DURING THE PREVIOUS SEQUENCE, DOUT IS NOT DEFINED.
Figure 10. SPI Communication Bit Sequence
Rev. 0 | Page 9 of 23
ADIS16446
Data Sheet
SPI Read Test Sequence
READING SENSOR DATA
Figure 14 provides a test pattern for testing SPI communication. In
this pattern, write 0x5600 to the DIN line in a repeating pattern
The ADIS16446 provides two different options for acquiring
sensor data: the single register and the burst register. A single
register read requires two 16-bit SPI cycles. The first cycle
requests the contents of the register using the bit assignments in
Figure 10. Bit DC7 to Bit DC0 are don’t cares for a read, and then
the output register contents follow on DOUT during the second
sequence. Figure 11 includes three single register reads in
succession. In this example, the process starts with DIN =
0x0400 to request the contents of XGYRO_OUT, then follows
with 0x0600 to request YGYRO_OUT, and 0x0800 to request
ZGYRO_OUT. Full duplex operation enables processors to
use the same 16-bit SPI cycle to read data from DOUT while
requesting the next set of data on DIN. Figure 12 provides an
example of the four SPI signals when reading XGYRO_OUT in
a repeating pattern.
CS
CS
and raise in between each repeating 16-bit sequence. must
remain high for at least the tSTALL time listed in Table 2 in between
each 16-bit sequence. Starting with the second 16-bit sequence,
DOUT produces the contents of the PROD_ID register (see
Table 22), 0x403E.
CS
SCLK
DIN = 0101 0110 0000 0000 = 0x5600
DIN
DOUT HIGH-Z
HIGH-Z
DOUT = 0100 0000 001111110 = 0x403E = 16446 DECIMAL
Figure 14. SPI Test Read Pattern DIN = 0x5600, DOUT = 0x403E
DEVICE CONFIGURATION
The control registers in Table 8 provide users with a variety of
configuration options. The SPI provides access to these registers,
one byte at a time, using the bit assignments in Figure 10. Each
register has 16 bits, where Bits[7:0] represent the lower address,
and Bits[15:8] represent the upper address. Figure 15 provides an
example of writing 0x04 to Address 0x36 (SMPL_PRD, Bits[15:8],
using DIN = 0xB704. This example reduces the sample rate by a
factor of eight (see Table 28).
DIN
0x0400
0x0600
0x0800
DOUT
XGYRO_OUT
YGYRO_OUT
ZGYRO_OUT
Figure 11. SPI Read Example
CS
SCLK
DIN
DIN = 0000 0100 0000 0000 = 0x0400
CS
SCLK
DIN
DOUT
DOUT = 1111 10011101 1010 = 0xF9DA = –1574 LSBs ≥ –62.96°/sec
Figure 12. Example SPI Read, Second 16-Bit Sequence
DIN = 1011 0110 0000 0100 = 0xB604, WRITES 0x04 TO ADDRESS 0x36.
Burst Read Function
Figure 15. Example SPI Write Sequence
Dual Memory Structure
The burst read function provides a way to read all of the data
in one continuous stream of bits (no stall time). As shown in
Figure 13, start this mode by setting DIN = 0x3E00 while
Writing configuration data to a control register updates its SRAM
contents, which are volatile. After optimizing each relevant control
register setting in a system, set GLOB_CMD, Bit 3 = 1 (DIN =
0xBE08) to backup these settings in the nonvolatile flash memory.
The flash backup process requires a valid power supply level for
the entire process time, 75 ms. Table 8 provides a user register
memory map that includes a flash backup column. A yes in this
column indicates that a register has a mirror location in flash and,
when backed up properly, it automatically restores itself during
startup or after a reset. Figure 16 provides a diagram of the dual
memory structure used to manage operation and store critical
user settings.
CS
keeping
low for 8 additional 16-bit read cycles. These
8 cycles produce the following sequence of output registers
on DOUT: DIAG_STAT, XGYRO_OUT, YGYRO_OUT,
ZGYRO_OUT, XACCL_OUT, YACCL_OUT, ZACCL_OUT,
and TEMP_OUT. Note that Figure 13 shows the first, second,
and final bytes of the burst sequence only.
1
2
3
9
CS
SCLK
DIN
GLOB_CMD
MANUAL
FLASH
BACKUP
DOUT
DIAG_STAT
XGYRO_OUT
TEMP_OUT
Figure 13. Burst Read Sequence
NONVOLATILE
FLASH MEMORY
VOLATILE
SRAM
(NO SPI ACCESS)
SPI ACCESS
START-UP
RESET
Figure 16. SRAM and Flash Memory Diagram
Rev. 0 | Page 10 of 23
Data Sheet
ADIS16446
USER REGISTERS
Table 8. User Register Memory Map1
Name
FLASH_CNT
Reserved
R/W Flash Backup Address2
Default
N/A
N/A
Function
Flash memory write count
N/A
Bit Assignments
See Table 26
N/A
R
Yes
0x00
N/A N/A
0x02
XGYRO_OUT
YGYRO_OUT
ZGYRO_OUT
XACCL_OUT
YACCL_OUT
ZACCL_OUT
Reserved
TEMP_OUT
XGYRO_OFF
YGYRO_OFF
ZGYRO_OFF
XACCL_OFF
YACCL_OFF
ZACCL_OFF
Reserved
GPIO_CTRL
MSC_CTRL
SMPL_PRD
SENS_AVG
Reserved
DIAG_STAT
GLOB_CMD
ALM_MAG1
ALM_MAG2
ALM_SMPL1
ALM_SMPL2
ALM_CTRL
Reserved
R
R
R
R
R
R
No
No
No
No
No
No
0x04
0x06
0x08
0x0A
0x0C
0x0E
0x10 to 0x17
0x18
0x1A
0x1C
0x1E
0x20
0x22
0x24
0x26 to 0x31
0x32
0x34
0x36
0x38
0x3A to 0x3B
0x3C
0x3E
0x40
0x42
0x44
0x46
0x48
0x4A to 0x51
0x52
0x54
0x56
0x58
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
X-axis gyroscope output
Y-axis gyroscope output
Z-axis gyroscope output
X-axis accelerometer output
Y-axis accelerometer output
Z-axis accelerometer output
Reserved
See Table 9
See Table 10
See Table 11
See Table 13
See Table 14
See Table 15
N/A
See Table 17
See Table 30
See Table 31
See Table 32
See Table 33
See Table 34
See Table 35
N/A
See Table 27
See Table 24
See Table 28
See Table 29
N/A
See Table 25
See Table 19
See Table 36
See Table 37
See Table 38
See Table 39
See Table 40
N/A
N/A No
No
R
Temperature output
R/W Yes
R/W Yes
R/W Yes
R/W Yes
R/W Yes
R/W Yes
N/A No
R/W No
R/W Yes
R/W Yes
R/W Yes
N/A N/A
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
N/A
0x0000
0x0006
0x0001
0x0402
N/A
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
N/A
X-axis gyroscope bias offset factor
Y-axis gyroscope bias offset factor
Z-axis gyroscope bias offset factor
X-axis acceleration bias offset factor
Y-axis acceleration bias offset factor
Z-axis acceleration bias offset factor
Reserved
Auxiliary digital input/output control
Miscellaneous control
Internal sample period (rate) control
Dynamic range and digital filter control
Reserved
System status
System command
Alarm 1 amplitude threshold
Alarm 2 amplitude threshold
Alarm 1 sample size
R
W
No
N/A
R/W Yes
R/W Yes
R/W Yes
R/W Yes
R/W Yes
N/A N/A
R
R
R
R
Alarm 2 sample size
Alarm control
Reserved
Lot identification number
Lot identification number
LOT_ID1
LOT_ID2
PROD_ID
SERIAL_NUM
Yes
Yes
Yes
Yes
N/A
N/A
0x403E
N/A
See Table 20
See Table 21
Product identifier (0x403E equals 16446 decimal) See Table 22
Lot specific serial number See Table 23
1 N/A means not applicable.
2 Each register contains two bytes. The address of the lower byte is displayed. The address of the upper byte is equal to the address of the lower byte plus 1.
Rev. 0 | Page 11 of 23
ADIS16446
Data Sheet
OUTPUT DATA REGISTERS
Each sensor in the ADIS16446 has a dedicated output register
in the user register map (see Table 8). Figure 17 provides arrows
that describe the direction or rotation (gX, gY, gZ) and acceleration
(aX, aY, aZ) that produce a positive response in its output data.
ACCELEROMETERS
XACCL_OUT (see Table 13) contains x-axis accelerometer data
(aX in Figure 17), YACCL_OUT (see Table 14) contains y-axis
accelerometer data (aY in Figure 17), and ZACCL_OUT (see
Table 15) contains z-axis accelerometer data (aZ in Figure 17).
Table 16 illustrates the accelerometer data format with numerical
examples.
GYROSCOPES
XGYRO_OUT (see Table 9) contains x-axis gyroscope data (gX
in Figure 17), YGYRO_OUT (see Table 10) contains y-axis gyro-
scope data (gY in Figure 17), and ZGYRO_OUT (see Table 11)
contains z-axis gyroscope data (gZ in Figure 17). Table 12
illustrates the gyroscope data format with numerical examples.
Table 13. XACCL_OUT (Base Address = 0x0A), Read Only
Bits
Description
[15:0]
X-axis acceleration data, twos complement format,
Table 9. XGYRO_OUT (Base Address = 0x04), Read Only
1200 LSB/g, 0 g = 0x0000
Bits
Description
Table 14. YACCL_OUT (Base Address = 0x0C), Read Only
[15:0] X-axis gyroscope data, twos complement format,
25 LSB/°/sec (SENS_AVG, Bits[15:8] = 0x04), 0°/sec = 0x0000
Bits
Description
[15:0]
Y-axis acceleration data, twos complement format,
1200 LSB/g, 0 g = 0x0000
Table 10. YGYRO_OUT (Base Address = 0x06), Read Only
Bits
Description
Table 15. ZACCL_OUT (Base Address = 0x0E), Read Only
[15:0] Y-axis gyroscope data, twos complement format,
25 LSB/°/sec (SENS_AVG, Bits[15:8] = 0x04), 0°/sec = 0x0000
Bits
Description
[15:0]
Z-axis acceleration data, twos complement format,
1200 LSB/g, 0 g = 0x0000
Table 11. ZGYRO_OUT (Base Address = 0x08), Read Only
Bits
Description
Table 16. Acceleration, Twos Complement Format
[15:0] Z-axis gyroscope data, twos complement format,
25 LSB/°/sec (SENS_AVG, Bits[15:8] = 0x04), 0°/sec = 0x0000
Acceleration (g)
Decimal Hex
Binary
+18
+21,600 0x5460 0101 0100 0101 0000
Table 12. Rotation Rate, Twos Complement Format1
Rotation
+2 ÷ 1200
+1 ÷ 1200
0
−1 ÷ 1200
−2 ÷ 1200
−18
+2
+1
0
0x0002 0000 0000 0000 0010
0x0001 0000 0000 0000 0001
0x0000 0000 0000 0000 0000
Rate (°/sec)
+1000
Decimal
+25,000
+2
+1
0
−1
−2
−25,000
Hex
Binary
0x61A8
0x0002
0x0001
0x0000
0xFFFF
0xFFFE
0x9E58
0110 0001 1010 1000
0000 0000 0000 0010
0000 0000 0000 0001
0000 0000 0000 0000
1111 1111 1111 1111
1111 1111 1111 1110
1001 1110 0101 1000
−1
−2
0xFFFF
0xFFFE
1111 1111 1111 1111
1111 1111 1111 1110
+2 ÷ 25
+1 ÷ 25
0
−1 ÷ 25
−2 ÷ 25
−1000
−21,600 0xABA0 1010 1011 1010 0000
1 SENS_AVG, Bits[15:8] = 0x04, see Table 29.
Z-AXIS
aZ
gZ
X-AXIS
Y-AXIS
aY
aX
gX
gY
Figure 17. Inertial Sensor Direction Reference
Rev. 0 | Page 12 of 23
Data Sheet
ADIS16446
Table 18. Temperature, Twos Complement Format
INTERNAL TEMPERATURE
Temperature (°C)
+105
+85
+31.14772
+31.07386
+31
Decimal
+1002
+731
+2
Hex
3EA
2DB
2
Binary
The internal temperature measurement data loads into the
TEMP_OUT register (see Table 17). Table 18 illustrates the
temperature data format. Note that this temperature represents
an internal temperature reading and does not precisely represent
external conditions. The intended use of TEMP_OUT is to
monitor relative changes in temperature.
0011 1110 1010
0010 1101 1011
0000 0000 0010
0000 0000 0001
0000 0000 0000
1111 1111 1111
1111 1111 1110
1100 0011 1110
+1
0
0
0
+30.92614
+30.85228
−40
−1
−2
−962
FFF
FFE
C3E
Table 17. TEMP_OUT (Base Address = 0x18), Read Only
Bits
Description
[15:12]
[11:0]
Not used
Twos complement, 0.07386°C/LSB, 31°C = 0x000
Rev. 0 | Page 13 of 23
ADIS16446
Data Sheet
SYSTEM FUNCTIONS
Table 21. LOT_ID2 (Base Address = 0x54), Read Only
GLOBAL COMMANDS
Bits
Description
The GLOB_CMD register in Table 19 provides trigger bits
for software reset, flash memory management, and calibration
control. Start each of these functions by writing a 1 to the assigned
bit in the GLOB_CMD register. After completing the task, the
bit automatically returns to 0. For example, set GLOB_CMD, Bit 7
= 1 (DIN = 0xBE80) to initiate a software reset. Set GLOB_CMD,
Bit 3 = 1 (DIN = 0xBE08) to back up the user register contents
in the nonvolatile flash. This sequence includes loading the
control registers with the data in their respective flash memory
locations prior to producing new data.
[15:0]
Lot identification, binary code
Table 22. PROD_ID (Base Address = 0x56), Read Only
Bits
[15:0]
Description (Default = 0x403E)
Product identification = 0x403E. Note that 0x403E
equals 16,446 decimal.
Table 23. SERIAL_NUM (Base Address = 0x58), Read Only
Bits
[15:12]
[11:0]
Description
Reserved
Serial number, 1 to 4094 (0xFFE)
Table 19. GLOB_CMD (Base Address = 0x3E), Write Only
SELF-TEST FUNCTION
Bits
Description (Default = 0x0000)
The MSC_CTRL register in Table 24 provides a self test function
for the gyroscopes and accelerometers. This function allows the
user to verify the mechanical integrity of each MEMS sensor.
When enabled, the self test function applies an electrostatic force
to each internal sensor element which causes them to move. The
movement in each element simulates its response to actual rotation
and/or acceleration and generates a predictable electrical response
in the sensor outputs. Set MSC_CTRL, Bit 10 = 1 (DIN = 0xB504)
to activate the internal self test routine, which compares the
response to an expected range of responses and reports a pass
or fail response to DIAG_STAT, Bit 5. If this is high, review
DIAG_STAT, Bits[15:10] to identify the failing sensor.
[15:8]
Not used
7
Software reset
[6:4]
Not used
3
2
1
0
Flash update
Not used
Factory calibration restore
Gyroscope bias correction
Flash Update
When using the user calibration registers to optimize system
level accuracy, set GLOB_CMD, Bit 3 = 1 (DIN = 0xBE04) to save
these settings in the nonvolatile flash memory. Be sure to consider
the endurance rating of the flash memory when determining how
often to update the user correction factors in the flash memory.
Table 24. MSC_CTRL (Base Address = 0x34), Read/Write
Bits
[15:12]
11
Description (Default = 0x0006)
Not used, always set to 0000
Checksum memory test (cleared upon completion)1
1 = enabled, 0 = disabled
Restoring Factory Calibration
Set GLOB_CMD, Bit 1 = 1 (DIN = 0xBE02) to execute the
factory calibration restore function, which resets the gyroscope
and accelerometer offset registers to 0x0000 and all sensor data to
0. Restoring the factory calibration automatically updates the
flash memory and restarts sampling and processing data. See
Table 19 for information on GLOB_CMD.
10
Internal self test (cleared upon completion)1
1 = enabled, 0 = disabled
[9:7]
6
Not used. Always set to 000
Point of percussion, see Figure 21
1 = enabled, 0 = disabled
PRODUCT IDENTIFICATION
[5:3]
2
Not used, always set to 000
Data ready enable
1 = enabled, 0 = disabled
The PROD_ID register in Table 22 contains the binary equivalent
of 16,446. This register provides a product specific variable for
systems that must track this in their system software. The
LOT_ID1 and LOT_ID2 registers in Table 20 and Table 21
combine to provide a unique, 32-bit lot identification code.
The SERIAL_NUM register in Table 23 contains a binary
number that represents the serial number on the device label.
The assigned serial numbers in SERIAL_NUM are lot specific.
1
0
Data ready polarity
1 = active high when data is valid
0 = active low when data is valid
Data ready line select
1 = DIO2, 0 = DIO1
1 Bit 11 and Bit 10 are automatically reset to 0 after finishing their respective tests.
Table 20. LOT_ID1 (Base Address = 0x52), Read Only
Bits
Description
[15:0]
Lot identification, binary code
Rev. 0 | Page 14 of 23
Data Sheet
ADIS16446
STATUS AND ERROR FLAGS
Memory Management
The DIAG_STAT register in Table 25 provides error flags for
a number of functions. Each flag uses 1 to indicate an error
condition and 0 to indicate a normal condition. Reading this
register provides access to the status of each flag and resets
all of the bits to 0 for monitoring future operation. If the error
condition remains, the error flag returns to 1 at the conclusion
of the next sample cycle. The SPI communication error flag in
DIAG_STAT, Bit 3 indicates that the number of SCLKs in a SPI
sequence did not equal a multiple of 16 SCLKs.
The FLASH_CNT register in Table 26 provides a 16-bit counter
that helps track the number of write cycles to the nonvolatile flash
memory. The flash updates every time a manual flash update
occurs. A manual flash update is initiated by GLOB_CMD, Bit 3
and is performed at the completion of the GLOB_CMD, Bits[1:0]
functions (see Table 19).
Table 26. FLASH_CNT (Base Address = 0x00), Read Only
Bits
Description
[15:0]
Binary counter
Table 25. DIAG_STAT (Base Address = 0x3C), Read Only
Checksum Test
Bits
15
Description (Default = 0x0000)
Z-axis accelerometer self test failure
1 = fail, 0 = pass
Set MSC_CTRL, Bit 11 = 1 (DIN = 0xB508) to perform a
checksum test of the internal program memory. This function
takes a summation of the internal program memory and
compares it with the original summation value for the same
locations (from factory configuration). If the sum matches the
correct value, DIAG_STAT, Bit 6 is equal to 0. If it does not
match, DIAG_STAT, Bit 6 is equal to 1. Make sure that the
power supply is within specification for the entire 20 ms that
this function takes to complete.
14
13
12
11
10
9
Y-axis accelerometer self test failure
1 = fail, 0 = pass
X-axis accelerometer self test failure
1 = fail, 0 = pass
Z-axis gyroscope self test failure
0 = pass
Y-axis gyroscope self test failure
1 = fail, 0 = pass
X-axis gyroscope self test failure
1 = fail, 0 = pass
Alarm 2 status
1 = active, 0 = inactive
Alarm 1 status
8
1 = active, 0 = inactive
Unused
7
6
Flash test, checksum flag
1 = fail, 0 = pass
5
4
3
2
Self test diagnostic error flag
1 = fail, 0 = pass
Sensor overrange
1 = overrange, 0 = normal
SPI communication failure
1 = fail, 0 = pass
Flash update failure
1 = fail, 0 = pass
1
0
Unused
Unused
Rev. 0 | Page 15 of 23
ADIS16446
Data Sheet
INPUT AND OUTPUT CONFIGURATION
DATA READY INDICATOR
Table 27. GPIO_CTRL (Base Address = 0x32), Read/Write
Bits
[15:12]
11
Description (Default = 0x0000)
Not used
The data ready indicator provides a signal that indicates
when the registers are updating so that system processors can
avoid data collision, which is a condition when the internal
register updates happen at the same time that an external
processor requests it. The data ready signal has valid and
invalid states. Using the transition from invalid to valid to
trigger an interrupt service routine provides the most time for
data acquisition (before the next register update). See Figure 4
and Table 2 for specific timing information. MSC_CTRL,
Bits[2:0] (see Table 24) provide control bits for enabling this
function, selecting the polarity of the valid state and I/O line
assignment (DIO1 and DIO2). The factory default setting of
MSC_CTRL, Bits[2:0] = 110 (DIN = 0xB406) establishes DIO1
as a data ready output line and assigns the valid state with a
logic high (1). Set MSC_CTRL, Bits[2:0] = 100 (DIN = 0xB404) to
change the polarity of the data ready signal on DIO1 for
interrupt inputs that require negative logic inputs for
activation.
General-Purpose I/O Line 4 (DIO4) data level
General-Purpose I/O Line 3 (DIO3) data level
General-Purpose I/O Line 2 (DIO2) data level
General-Purpose I/O Line 1 (DIO1) data level
Not used
10
9
8
[7:4]
3
General-Purpose I/O Line 4 (DIO4) direction control
1 = output, 0 = input
2
1
0
General-Purpose I/O Line 3 (DIO3) direction control
1 = output, 0 = input
General-Purpose I/O Line 2 (DIO2) direction control
1 = output, 0 = input
General-Purpose I/O Line 1 (DIO1) direction control
1 = output, 0 = input
Example Input and Output Configuration
For example, set GPIO_CTRL, Bits[3:0] = 0100 (DIN = 0xB204)
to set DIO3 as an output signal pin and DIO1, DIO2, and
DIO4 as input signal pins. Set the output on DIO3 to 1 by
setting GPIO_CTRL, Bit 10 = 1 (DIN = 0xB304). Then, read
GPIO_CTRL, Bits[7:0] (DIN = 0x3200) and mask off
GPIO_CTRL, Bits[9:8] and GPIO_CTRL, Bit 11 to monitor
the digital signal levels on DIO4, DIO2, and DIO1.
GENERAL-PURPOSE INPUT AND OUTPUT
DIO1, DIO2, DIO3, and DIO4 are configurable, general-purpose
input and output lines that serve multiple purposes. The data
ready controls in MSC_CTRL, Bits[2:0] have the highest
priority for configuring DIO1 and DIO2. The alarm indicator
controls in ALM_CTRL, Bits[2:0] have the second highest priority
for configuring DIO1 and DIO2. The external clock control
associated with SMPL_PRD, Bit 0 has the highest priority for
DIO4 configuration (see Table 28). GPIO_CTRL in Table 27 has
the lowest priority for configuring DIO1, DIO2, and DIO4, and
has absolute control over DIO3.
Rev. 0 | Page 16 of 23
Data Sheet
ADIS16446
DIGITAL PROCESSING CONFIGURATION
(SMPL_PRD, Bits[15:8] = 0x00), this value reduces the sensor
GYROSCOPES AND ACCELEROMETERS
bandwidth to approximately 16 Hz.
Figure 19 details the all signal processing components for the
gyroscopes and accelerometers. The internal sampling system
produces new data in the xGYRO_OUT and xACCL_OUT
output data registers at a rate of 819.2 SPS. The SMPL_PRD
register in Table 28 provides two functional controls that affect
sampling and register update rates. SMPL_PRD, Bits[12:8]
provide a control for reducing the update rate, using an averaging
filter with a decimated output. These bits provide a binomial
control that divides the data rate by a factor of 2 every time this
number increases by 1. For example, set SMPL_PRD, Bits[15:8] =
0x04 (DIN = 0xB704) to set the decimation factor to 16, which
reduces the update rate to 51.2 SPS and the bandwidth to
~25 Hz. The SMPL_PRD, Bits[12:8], setting affects the update
rate for the TEMP_OUT register (see Table 17) as well.
0
–20
–40
–60
–80
–100
N = 2
N = 4
–120
N = 16
N = 64
–140
0.001
0.01
0.1
1
FREQUENCY (f/fS)
Figure 18. Bartlett Window, FIR Filter Frequency Response
(Phase Delay = N Samples)
Dynamic Range
Table 28. SMPL_PRD (Base Address = 0x36), Read/Write
Bits
[15:13]
[12:8]
[7:1]
0
Description (Default = 0x0001)
Not used
The SENS_AVG, Bits[10:8] provide three dynamic range
settings for the gyroscopes. The lower dynamic range settings
( 250°/sec and 500°/sec) limit the minimum filter tap sizes to
maintain resolution. For example, set SENS_AVG, Bits[10:8] =
010 (DIN = 0xB902) for a measurement range of 500°/sec.
Because this setting can influence the filter settings, program
SENS_AVG, Bits[10:8] before programming SENS_AVG, Bits[2:0]
if more filtering is required.
D, decimation rate setting, binomial, see Figure 19
Not used
Clock
1 = internal sampling clock, 819.2 SPS
0 = external sampling clock
INPUT CLOCK CONFIGURATION
SMPL_PRD, Bit 0 (see Table 28) provides a control for
synchronizing the internal sampling to an external clock source.
Set SMPL_PRD, Bit 0 = 0 (DIN = 0xB600) and GPIO_CTRL,
Bit 3 = 0 (DIN = 0xB200) to enable the external clock. See Table 2
and Figure 4 for timing information.
Table 29. SENS_AVG (Base Address = 0x38), Read/Write
Bits
[15:11]
[10:8]
Description (Default = 0x0402)
Not used
Measurement range (sensitivity) selection
100 = 1000°/sec (default condition)
010 = 500°/sec, filter taps ≥ 4 (Bits[2:0] ≥ 0x02)
001 = 250°/sec, filter taps ≥ 16 (Bits[2:0] ≥ 0x04)
Not used
Digital Filtering
The SENS_AVG register in Table 29 provides user controls for
the low-pass filter. This filter contains two cascaded averaging
filters that provide a Bartlett window, FIR filter response (see
Figure 18). For example, set SENS_AVG, Bits[2:0] = 100 (DIN =
0xB804) to set each stage to 16 taps. When used with the
default sample rate of 819.2 SPS and zero decimation
[7:3]
[2:0]
Filter Size Variable B
Number of taps in each stage; NB = 2B
See Figure 18 for filter response
AVERAGE/
BARTLETT WINDOW
FIR FILTER
DECIMATION
FILTER
÷N
D
N
N
N
D
B
B
LOW-PASS
1
1
1
MEMS
ADC
x(n)
n = 1
x(n)
n = 1
x(n)
n = 1
FILTER
SENSOR
N
N
N
D
B
B
330Hz
B = SENS_AVG, BITS[2:0]
B
D = SMPL_PRD, BITS[12:8]
D
N
N
= 2
N
N
= 2
GYROSCOPES
B
B
D
D
CLOCK
= NUMBER OF TAPS
(PER STAGE)
= NUMBER OF TAPS
LOW-PASS, TWO-POLE (404Hz, 757Hz)
819.2SPS
ACCELEROMETERS
LOW-PASS, SINGLE-POLE (330Hz)
EXTERNAL CLOCK ENABLED
BY SMPL_PRD, BIT 0
Figure 19. Sampling and Frequency Response Block Diagram
Rev. 0 | Page 17 of 23
ADIS16446
Data Sheet
CALIBRATION
Gyroscope Bias Correction Factors
The mechanical structure and assembly process of the ADIS16446
provide excellent position and alignment stability for each sensor,
even after subjected to temperature cycles, shock, vibration, and
other environmental conditions. The factory calibration includes a
dynamic characterization of each gyroscope and accelerometer over
temperature and generates sensor specific correction formulas.
When the bias estimate is complete, multiply the estimate by
−1 to change its polarity, convert it into digital format for the
offset correction registers (see Table 30, Table 31, and Table 32),
and write the correction factors to the correction registers. For
example, lower the x-axis bias by 10 LSB (0.1°/sec) by setting
XGYRO_OFF = 0xFFF6 (DIN = 0x9BFF, 0x9AF6).
GYROSCOPES
Single Command Bias Correction
The XGYRO_OFF (see Table 30), YGYRO_OFF (see Table 31),
and ZGYRO_OFF (see Table 32) registers provide an user
programmable bias adjustment function for the x-, y-, and z-axis
gyroscopes, respectively. Figure 20 illustrates that the registers
contain bias correction factors that adjust to the sensor data
immediately before the data loads into the output register.
GLOB_CMD, Bit 0 (see Table 19) loads the xGYRO_OFF registers
with the values that are the opposite of the values that are in
xGYRO_OUT at the time of initiation. Use this command,
together with the decimation filter (SMPL_PRD, Bits[12:8], see
Table 28), to automatically average the gyroscope data and
improve the accuracy of this function, as follows:
FACTORY
xGYRO_OUT
xACCL_OUT
MEMS
SENSOR
1. Set SENS_AVG, Bits[10:8] = 001 (DIN = 0xB901) to
optimize the xGYRO_OUT sensitivity to 0.01°/sec/LSB.
2. Set SMPL_PRD, Bits[12:8] = 10000 (DIN = 0xB710) to set
the decimation rate to 65,536 (216), which provides an
averaging time of 80 seconds (65,536 ÷ 819.2 SPS).
3. Wait for 80 seconds while keeping the device motionless.
4. Set GLOB_CMD, Bit 0 = 1 (DIN = 0xBE01).
5. The ADI16446 automatically updates the flash memory
upon completion of the bias update. The user must wait
the time specified in Table 1 for the flash memory back-up
time, or until the data ready signal starts to toggle again,
whichever is longer.
CALIBRATION
AND
ADC
FILTERING
xGYRO_OFF
xACCL_OFF
Figure 20. User Calibration, Gyroscopes, and Accelerometers
Gyroscope Bias Error Estimation
Any system level calibration function must start with an estimate
of the bias errors, which typically comes from a sample of
gyroscope output data, when the device is not in motion. The
sample size of data depends on the accuracy goals. Figure 7
provides a trade-off relationship between the averaging time
and the expected accuracy of a bias measurement. Vibration,
thermal gradients, and power supply instability can influence
the accuracy of this process.
ACCELEROMETERS
The XACCL_OFF (see Table 33), YACCL_OFF (see Table 34),
and ZACCL_OFF (see Table 35) registers provide user
programmable bias adjustment function for the x-, y-, and z-axis
accelerometers, respectively. These registers adjust the accelerometer
data in the same manner as xGYRO_OFF in Figure 20.
Table 30. XGYRO_OFF (Base Address = 0x1A), Read/Write
Bits
Description (Default = 0x0000)
[15:0]
X-axis, gyroscope offset correction factor,
twos complement, 0.01°/sec/LSB, 0°/sec = 0x0000
Table 33. XACCL_OFF (Base Address = 0x20), Read/Write
Bits
[15:0]
Description (Default = 0x0000)
X-axis, accelerometer offset correction factor,
twos complement, 1/1200 g/LSB, 0 g = 0x0000
Table 31. YGYRO_OFF (Base Address = 0x1C), Read/Write
Bits
Description (Default = 0x0000)
[15:0]
Y-axis, gyroscope offset correction factor,
twos complement, 0.01°/sec/LSB, 0°/sec = 0x0000
Table 34. YACCL_OFF (Base Address = 0x22), Read/Write
Bits
[15:14]
[13:0]
Description (Default = 0x0000)
Not used
Table 32. ZGYRO_OFF (Base Address = 0x1E), Read/Write
Bits
Description (Default = 0x0000)
Y-axis, accelerometer offset correction factor,
twos complement, 1/1200 g/LSB, 0 g = 0x0000
[15:0]
Z-axis, gyroscope offset correction factor,
twos complement, 0.01°/sec/LSB, 0°/sec = 0x0000
Table 35. ZACCL_OFF (Base Address = 0x24), Read/Write
Bits
Description (Default = 0x0000)
[15:14]
[13:0]
Not used
Z-axis, accelerometer offset correction factor,
twos complement, 1/1200 g/LSB, 0 g = 0x0000
Rev. 0 | Page 18 of 23
Data Sheet
ADIS16446
Accelerometer Bias Error Estimation
Point of Percussion Alignment
Under static conditions, orient each accelerometer in positions
where the response to gravity is predictable. A common approach
to this is to measure the response of each accelerometer when
each is oriented in the peak response position, that is, where
1 g is the ideal measurement position. Next, average the +1 g
and −1 g accelerometer measurements together to estimate the
residual bias error. Note that using more points in the rotation
can improve the accuracy of the response.
Set MSC_CTRL, Bit 6 = 1 (DIN = 0xB446) to enable this feature
and maintain the factory default settings for DIO1. This feature
performs a point of percussion translation to the point identified
in Figure 21. See Table 24 for more information on MSC_CTRL.
Accelerometer Bias Correction Factors
When the bias estimate is complete, multiply the estimate by
−1 to change its polarity, convert it to the digital format for the
offset correction registers (see Table 33, Table 34 or Table 35)
and write the correction factors to the correction registers. For
example, lower the x-axis bias by 12 LSB (10 mg) by setting
XACCL_OFF = 0xFFF4 (DIN = 0xA1FF, 0xA0F4).
ORIGIN ALIGNMENT
REFERENCE POINT
SEE MSC_CTRL, BIT 6.
Figure 21. Point of Percussion Physical Reference
Rev. 0 | Page 19 of 23
ADIS16446
Data Sheet
ALARMS
Alarm 1 and Alarm 2 provide two independent alarms with
programmable levels, polarity, and data sources.
Table 40. ALM_CTRL (Base Address = 0x48), Read/Write
Bits
[15:12]
Description (Default = 0x0000)
Alarm 2 data source selection
0000 = disable
STATIC ALARM USE
The static alarms setting compares the data source selection
(ALM_CTRL, Bits[15:8]) with the values in the ALM_MAGx
registers listed in Table 36 and Table 37, using ALM_MAGx,
Bits 15, to determine the trigger polarity. The data format in
these registers matches the format of the data selection in
ALM_CTRL, Bits[15:8]. See Table 41, Alarm 1, for a static
alarm configuration example.
0001 = XGYRO_OUT
0010 = YGYRO_OUT
0011 = ZGYRO_OUT
0100 = XACCL_OUT
0101 = YACCL_OUT
0110 = ZACCL_OUT
0111 = unused
1001 = unused
1010 = unused
Table 36. ALM_MAG1 (Base Address = 0x40), Read/Write
Bits
Description (Default = 0x0000)
1011 = unused
1100 = TEMP_OUT
[15:0]
Threshold setting, matches the format of the
ALM_CTRL, Bits[11:8] output register selection
[11:8]
Alarm 1 data source selection (same as Alarm 2)
Alarm 2, dynamic or static (1 = dynamic, 0 = static)
Alarm 1, dynamic or static (1 = dynamic, 0 = static)
Alarm 2, polarity (1 = greater than ALM_MAG2)
Alarm 1, polarity (1 = greater than ALM_MAG1)
Data source filtering (1 = filtered, 0 = unfiltered)
Alarm indicator (1 = enabled, 0 = disabled)
Alarm indicator active polarity (1 = high, 0 = low)
Alarm output line select (1 = DIO2, 0 = DIO1)
Table 37. ALM_MAG2 (Base Address = 0x42), Read/Write
7
6
5
4
3
2
1
0
Bits
Description (Default = 0x0000)
[15:0]
Threshold setting, matches the format of the
ALM_CTRL, Bits[15:12] output register selection
DYNAMIC ALARM USE
The dynamic alarm setting monitors the data selection for a
rate of change comparison. The rate of change comparison is
represented by the magnitude in the ALM_MAGx registers
over the time represented by the number of samples setting in
the ALM_SMPLx registers (see Table 38 and Table 39). See
Table 41, Alarm 2, for a dynamic alarm configuration example.
Alarm Example
Table 41 offers an example that configures Alarm 1 to trigger
when filtered ZACCL_OUT data drops below 0.7 g and Alarm 2
to trigger when filtered ZGYRO_OUT data changes by more
than 50°/sec over a 100 ms period, or 500°/sec2. The filter
setting helps reduce false triggers from noise and refines the
accuracy of the trigger points. The ALM_SMPL2 setting of
82 samples provides a comparison period that is approximately
equal to 100 ms for an internal sample rate of 819.2 SPS.
Table 38. ALM_SMPL1 (Base Address = 0x44), Read/Write
Bits
Description (Default = 0x0000)
[15:8]
[7:0]
Not used
Binary, number of samples (both 0x00 and 0x01 = 1)
Table 39. ALM_SMPL2 (Base Address = 0x46), Read/Write
Bits
Description (Default = 0x0000)
Table 41. Alarm Configuration Example
[15:8]
[7:0]
Not used
DIN
0xC936, 0xC8AF ALM_CTRL = 0x36AF
Alarm 2: dynamic, Δ-ZGYRO_OUT (Δ-time,
Description
Binary, number of samples (both 0x00 and 0x01 = 1)
ALARM REPORTING
ALM_SMPL2) > ALM_MAG2
Bits[9:8] of DIAG_STAT provide error flags that indicate an
alarm condition. Bits[2:0] of ALM_CTRL provide controls for a
hardware indicator using DIO1 or DIO2.
Alarm 1: static, ZACCL_OUT < ALM_MAG1,
filtered data DIO2 output indicator, positive
polarity
0xC313, 0xC288 ALM_MAG2 = 0x04E2 = 1,250 LSB = 50°/sec
0xC10A, 0xC0F0 ALM_MAG1 = 0x0348 = 840 LSB = +0.7 g
0xC652
ALM_SMPL2, Bits[7:0] = 0x52 = 82 samples,
82 samples ÷ 819.2 SPS = ~100 ms
Rev. 0 | Page 20 of 23
Data Sheet
ADIS16446
APPLICATIONS INFORMATION
MOUNTING TIPS
EVALUATION TOOLS
Breakout Board, ADIS16IMU2/PCBZ
The mounting and installation process can influence gyroscope
bias repeatability and other key parametric behaviors. To
preserve the best performance, use the following guidelines
when developing an attachment approach for the ADIS16446:
The ADIS1644X/FLEX and ADIS16IMU2/PCBZ accessories
(sold separately) provide access to the ADIS16446 through larger
connectors that support standard 1 mm ribbon cabling and a
simplified method for connecting to an embedded processor
platform. These accessories also provide an easy way to connect
the ADIS16446 to either the EVAL-ADIS-FX3 or to the older
EVAL-ADIS2 evaluation system. Figure 23 provides a mechanical
design example for using these two components with the
ADIS16446 IMU in a system.
•
•
•
Focus mounting force at the machine screw locations.
Avoid direct force application on the substrate.
Avoid placing mounting pressure on the package lid,
except for the edges that border the exposed side of the
substrate.
•
•
Use a consistent mounting torque of 28 inch ounces on the
mounting hardware.
Avoid placing translational forces on the electrical
connector.
Figure 22 provides the pin assignments for J1 on the
ADIS16IMU2/PCBZ breakout board.
J1
RST
CS
1
3
2
4
SCLK
DOUT
DIN
For additional mounting ideas and tips, refer to the AN-1305
Application Note.
DNC
GND
GND
VDD
DIO1
DIO3
5
6
POWER SUPPLY CONSIDERATIONS
7
8
GND
9
10
12
14
16
VDD
The power supply must be within 3.15 V and 3.45 V for normal
operation and optimal performance. During start up, the internal
power conversion system starts drawing current when VDD
reaches 1.6 V. The internal processor begins initializing when
VDD is equal to 2.35 V. After the processor starts, VDD must
reach 2.7 V within 128 ms. Also, make sure that the power
supply drops below 1.6 V to shut the device down. Using an
optional 10 µF external capacitor between VDD and GND is
recommended for the filtering of power supply noise.
11
13
15
VDD
DIO2
DIO4/CLKIN
Figure 22. J1Pin Assignments for the ADIS16IMU2/PCBZ
The C1 and C2 locations on the ADIS16IMU2/PCBZ provide
users with the pads to install 10 µF of capacitance across VDD
and GND, which Figure 9 recommends for best performance.
15mm TO
45mm
23.75mm
33.40mm
J1
J2
15
1
16
2
2
1
15.05mm
20.15mm
10.07mm
30.10mm
24
23
ADIS16446BMLZ
ADIS1644X/FLEX
(FLEXIBILE CONNECTOR/CABLE)
ADIS16IMU2/PCBZ
(INTERFACE BOARD)
NOTES
1. USE FOUR M2 MACHINE SCREWS TO ATTACH THE ADIS16446.
2. USE FOUR M3 MACHINE SCREWS TO ATTACH THE INTERFACE PCB.
3. EITHER A SAMTEC FFSD-08-D-12.00-01-N OR FFSD-08-D-24.00-01-N CABLE ASSEMBLY CAN
BE USED TO CONNECT THE ADIS16IMU2 TO THE EVAL-ADIS2Z EVALUATION BOARD.
Figure 23. Physical Diagram for ADIS16446 Accessories
Rev. 0 | Page 21 of 23
ADIS16446
Data Sheet
with support for .NET (MATLAB®, LabVIEW®, Python™, etc.)
Refer to the EVAL-ADIS-FX3 Evaluation System Wiki Guide for
more information on connecting the ADIS16446 to the EVAL-
ADIS-FX3 system.
PC-Based Evaluation, EVAL-ADIS-FX3 and EVAL-ADIS2
In addition to supporting quick prototype connections between
the ADIS16446 and an embedded processing system, J1 on the
ADIS16IMU2/PCBZ breakout board also connects directly to J1
on both the EVAL-ADIS-FX3 and the older EVAL-ADIS2
evaluation system.
Alternatively, the EVAL-ADIS2 provides a simple, functional
test platform that allows users to configure and collect data
from the ADIS16446 IMUs. It is used in conjunction with the
IMU Evaluation Software for the EVAL-ADISX Platforms.
EVAL-ADIS-FX3 is a new and completely open source evaluation
platform for Windows-based systems. The FX3 application
programming interface (API) manages all the complex USB
transactions and implements all the necessary tools to begin
capturing high speed, high performance data in custom
applications. This .NET-compatible API, written in VB.NET
and C#, includes data streaming features tailored to reliably
capturing inertial sensor data at the maximum data rate. The
API is also fully documented, open sourced and is licensed under
the MIT license. The API also includes a wrapper library that
allows users to use the same API in any development environment
X-RAY SENSITIVITY
Exposure to high dose rate x-rays, such as those in production
systems that inspect solder joints in electronic assemblies, may
affect accelerometer bias errors. For optimal performance,
avoid exposing the ADIS16446 to this type of inspection.
Rev. 0 | Page 22 of 23
Data Sheet
ADIS16446
OUTLINE DIMENSIONS
24.53
24.15
23.77
2.60
Ø 2.40
2.20
20.150
BSC
2.00 BSC
(4 PLCS)
2.00
BSC
4.70
4.50
4.30
30.10
BSC
33.40
BSC
38.08
37.70
37.32
1.00
BSC
7.89
7.63
7.37
0.66
BSC
TOP VIEW
12.50 BSC
19.55 BSC
2.30 BSC
(2 PLCS)
2.30 BSC
(2 PLCS)
2.96
2.70
2.44
7.57
BSC
1.00 BSC
PITCH
2.84 BSC
(Pin Height)
11.10
10.80
10.50
10.23
BSC
5.18 BSC
(PCB to Connector)
END VIEW
Figure 24. 20-Lead Module with Connector Interface [MODULE]
(ML-20-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
Package Description
Package Option
ADIS164446BMLZ
ADIS16IMU2/PCBZ
EVAL-ADIS-FX3Z
EVAL-ADIS2Z
−40°C to +105°C
20-Lead Module with Connector Interface [MODULE]
ADIS16IMU2/PCBZ Breakout Board
EVAL-ADIS-FX3 Evaluation System
EVAL-ADIS2 Previous Generation Evaluation System
ADIS1644X/FLEX Cable for ADIS1644X IMUs
ML-20-3
ADIS1644X/FLEX
1 Z = RoHS Compliant Part.
©2021 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D25519-2/21(0)
Rev. 0 | Page 23 of 23
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