AD9259BCPZ-50 [ADI]
Quad, 14-bit, 50 MSPS Serial LVDS 1.8 V A/D Converter; 四通道,14位, 50 MSPS串行LVDS 1.8 VA / D转换器型号: | AD9259BCPZ-50 |
厂家: | ADI |
描述: | Quad, 14-bit, 50 MSPS Serial LVDS 1.8 V A/D Converter |
文件: | 总52页 (文件大小:1809K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Quad, 14-bit, 50 MSPS
Serial LVDS 1.8 V A/D Converter
AD9259
FUNCTIONAL BLOCK DIAGRAM
FEATURES
AVDD
PDWN
AD9259
T/H
Four ADCs integrated into 1 package
98 mW ADC power per channel at 50 MSPS
SNR = 73 dB (to Nyquist)
DRVDD
DRGND
14
VIN + A
VIN – A
SERIAL
LVDS
D + A
D – A
PIPELINE
ADC
ENOB = 12 bits
SFDR = 84 dBc (to Nyquist)
Excellent linearity
DNL = 0.5 LSB (typical)
INL = 1.5 LSB (typical)
Serial LVDS (ANSI-644, default)
Low power reduced signal option, IEEE 1596.3 similar
Data and frame clock outputs
315 MHz full power analog bandwidth
2 V p-p input voltage range
14
14
VIN + B
VIN – B
PIPELINE
ADC
SERIAL
LVDS
D + B
D – B
T/H
T/H
T/H
VIN + C
VIN – C
SERIAL
LVDS
D + C
D – C
PIPELINE
ADC
14
VIN + D
VIN – D
SERIAL
LVDS
D + D
D – D
PIPELINE
ADC
VREF
FCO+
FCO–
SENSE
+
0.5V
–
DATA RATE
REFT
REFB
REF
SELECT
MULTIPLIER
1.8 V supply operation
Serial port control
SERIAL PORT
INTERFACE
DCO+
DCO–
Full-chip and individual-channel power-down modes
Flexible bit orientation
Built-in and custom digital test pattern generation
Programmable clock and data alignment
Programmable output resolution
Standby mode
SCLK/DTP
RBIASAGND CSB SDIO/ODM
CLK+ CLK–
Figure 1.
capturing data on the output and a frame clock (FCO) for
signaling a new output byte are provided. Individual channel
power-down is supported and typically consumes 2 mW when
all channels are disabled.
APPLICATIONS
Medical imaging and nondestructive ultrasound
Portable ultrasound and digital beam forming systems
Quadrature radio receivers
Diversity radio receivers
Tape drives
Optical networking
The ADC contains several features designed to maximize
flexibility and minimize system cost, such as programmable
clock and data alignment and programmable digital test pattern
generation. The available digital test patterns include built-in
deterministic and pseudorandom patterns, along with custom user-
defined test patterns entered via the serial port interface (SPI®).
Test equipment
The AD9259 is available in a Pb-free, 48-lead LFCSP package. It is
specified over the industrial temperature range of −40°C to +85°C.
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The AD9259 is a quad, 14-bit, 50 MSPS analog-to-digital
converter (ADC) with an on-chip sample-and-hold circuit that
is designed for low cost, low power, small size, and ease of use.
The product operates at a conversion rate of up to 50 MSPS and
is optimized for outstanding dynamic performance and low
power in applications where a small package size is critical.
1. Small Footprint. Four ADCs are contained in a small, space-
saving package; low power of 98 mW/channel at 50 MSPS.
2. Ease of Use. A data clock output (DCO) operates up to
350 MHz and supports double data rate operation (DDR).
3. User Flexibility. Serial port interface (SPI) control offers a wide
range of flexible features to meet specific system requirements.
The ADC requires a single 1.8 V power supply and LVPECL-/
CMOS-/LVDS-compatible sample rate clock for full performance
operation. No external reference or driver components are
required for many applications.
4. Pin-Compatible Family. This includes the AD9287 (8-bit),
AD9219 (10-bit), and AD9228 (12-bit).
The ADC automatically multiplies the sample rate clock for the
appropriate LVDS serial data rate. A data clock (DCO) for
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2006 Analog Devices, Inc. All rights reserved.
AD9259
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
AC Specifications.......................................................................... 4
Digital Specifications ................................................................... 5
Switching Specifications .............................................................. 6
Timing Diagrams.............................................................................. 7
Absolute Maximum Ratings............................................................ 9
Thermal Impedance..................................................................... 9
ESD Caution.................................................................................. 9
Pin Configuration and Function Descriptions........................... 10
Equivalent Circuits......................................................................... 12
Typical Performance Characteristics ........................................... 14
Theory of Operation ...................................................................... 18
Analog Input Considerations ................................................... 18
Clock Input Considerations...................................................... 20
Serial Port Interface (SPI).............................................................. 28
Hardware Interface..................................................................... 28
Memory Map .................................................................................. 30
Reading the Memory Map Table.............................................. 30
Reserved Locations .................................................................... 30
Default Values............................................................................. 30
Logic Levels................................................................................. 30
Evaluation Board ............................................................................ 34
Power Supplies............................................................................ 34
Input Signals................................................................................ 34
Output Signals ............................................................................ 34
Default Operation and Jumper Selection Settings................. 35
Alternative Analog Input Drive Configuration...................... 36
Outline Dimensions....................................................................... 50
Ordering Guide .......................................................................... 50
REVISION HISTORY
6/06—Revision 0: Initial Version
Rev. 0 | Page 2 of 52
AD9259
SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −0.5 dBFS, unless otherwise noted.
Table 1.
AD9259-50
Typ
Parameter1
Temperature
Min
Max
Unit
RESOLUTION
14
Bits
ACCURACY
No Missing Codes
Offset Error
Offset Matching
Gain Error
Full
Full
Full
Full
Full
Full
Full
Guaranteed
±1
±2
±0.5
±0.3
±±
mV
±±
mV
±2
% FS
% FS
LSB
LSB
Gain Matching
±0.ꢀ
±1.0
±3.5
Differential Nonlinearity (DNL)
Integral Nonlinearity (INL)
TEMPERATURE DRIFT
Offset Error
Gain Error
Reference Voltage (1 V Mode)
REFERENCE
±0.5
±1.5
Full
Full
Full
±2
±1ꢀ
±21
ppm/°C
ppm/°C
ppm/°C
Output Voltage Error (VREF = 1 V)
Load Regulation @ 1.0 mA (VREF = 1 V)
Input Resistance
Full
Full
Full
±5
3
6
±30
mV
mV
kΩ
ANALOG INPUTS
Differential Input Voltage Range (VREF = 1 V)
Common-Mode Voltage
Differential Input Capacitance
Analog Bandwidth, Full Power
POWER SUPPLY
Full
Full
Full
Full
2
V p-p
V
pF
AVDD/2
ꢀ
315
MHz
AVDD
DRVDD
IAVDD
IDRVDD
Full
Full
Full
Full
Full
Full
Full
Full
Full
1.ꢀ
1.ꢀ
1.±
1.±
1±5
32.5
392
2
1.9
1.9
192.5
34.ꢀ
409
4
V
V
mA
mA
mW
mW
mW
dB
Total Power Dissipation (Including Output Drivers)
Power-Down Dissipation
Standby Dissipation2
CROSSTALK
ꢀ2
−100
−100
CROSSTALK (Overrange Condition)3
dB
1 See the AN-±35 Application Note, “Understanding High Speed ADC Testing and Evaluation,” for a complete set of definitions and how these tests were completed.
2 Can be controlled via SPI.
3 Overrange condition is specific with 6 dB of the full-scale input range.
Rev. 0 | Page 3 of 52
AD9259
AC SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −0.5 dBFS, unless otherwise noted.
Table 2.
AD9259-50
Parameter1
Temperature
Full
Full
Min
Typ
ꢀ3.5
ꢀ3.0
ꢀ2.±
ꢀ2.ꢀ
ꢀ2.2
ꢀ2.0
12.0
11.9
11.9
±4
Max
Unit
dB
SIGNAL-TO-NOISE RATIO (SNR)
fIN = 2.4 MHz
fIN = 19.ꢀ MHz
fIN = ꢀ0 MHz
fIN = 2.4 MHz
fIN = 19.ꢀ MHz
fIN = ꢀ0 MHz
fIN = 2.4 MHz
fIN = 19.ꢀ MHz
fIN = ꢀ0 MHz
fIN = 2.4 MHz
fIN = 19.ꢀ MHz
fIN = ꢀ0 MHz
fIN = 2.4 MHz
fIN = 19.ꢀ MHz
fIN = ꢀ0 MHz
fIN = 2.4 MHz
fIN = 19.ꢀ MHz
fIN = ꢀ0 MHz
ꢀ1.0
dB
dB
Full
SIGNAL-TO-NOISE AND DISTORTION RATIO (SINAD)
EFFECTIVE NUMBER OF BITS (ENOB)
Full
Full
Full
dB
dB
dB
ꢀ0.2
11.6
ꢀ3
Full
Full
Full
Bits
Bits
Bits
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
WORST HARMONIC (Second or Third)
Full
Full
Full
±4
ꢀ±
Full
Full
Full
−±±
−±4
−ꢀ±
−90
−90
−±±
±0.0
−ꢀ3
−±0
WORST OTHER (Excluding Second or Third)
Full
Full
Full
TWO-TONE INTERMODULATION DISTORTION (IMD)—
AIN1 AND AIN2 = −ꢀ.0 dBFS
fIN1 = 15 MHz,
fIN2 = 16 MHz
25°C
fIN1 = ꢀ0 MHz,
fIN2 = ꢀ1 MHz
25°C
±0.0
dBc
1 See the AN-±35 Application Note, “Understanding High Speed ADC Testing and Evaluation,” for a complete set of definitions and how these tests were completed.
Rev. 0 | Page 4 of 52
AD9259
DIGITAL SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −0.5 dBFS, unless otherwise noted.
Table 3.
AD9259-50
Parameter1
Temperature
Min
Typ
Max
Unit
CLOCK INPUTS (CLK+, CLK−)
Logic Compliance
CMOS/LVDS/LVPECL
Differential Input Voltage2
Input Common-Mode Voltage
Input Resistance (Differential)
Input Capacitance
Full
Full
25°C
25°C
250
mV p-p
V
kΩ
pF
1.2
20
1.5
LOGIC INPUTS (PDWN, SCLK/DTP)
Logic 1 Voltage
Logic 0 Voltage
Input Resistance
Input Capacitance
Full
Full
25°C
25°C
1.2
1.2
3.6
0.3
V
V
kΩ
pF
30
0.5
LOGIC INPUT (CSB)
Logic 1 Voltage
Full
3.6
V
Logic 0 Voltage
Full
0.3
V
Input Resistance
Input Capacitance
25°C
25°C
ꢀ0
0.5
kΩ
pF
LOGIC INPUT (SDIO/ODM)
Logic 1 Voltage
Logic 0 Voltage
Full
Full
1.2
0
DRVDD + 0.3
0.3
V
V
Input Resistance
Input Capacitance
25°C
25°C
30
2
kΩ
pF
LOGIC OUTPUT (SDIO/ODM)
Logic 1 Voltage (IOH = 50 μA)
Logic 0 Voltage (IOL = 50 μA)
DIGITAL OUTPUTS (D+, D−), (ANSI-644)1
Logic Compliance
Full
Full
1.ꢀ9
V
V
0.05
LVDS
Differential Output Voltage (VOD
)
Full
Full
24ꢀ
1.125
454
1.3ꢀ5
mV
V
Output Offset Voltage (VOS
)
Output Coding (Default)
Offset binary
DIGITAL OUTPUTS (D+, D−),
(Low Power, Reduced Signal Option)1
Logic Compliance
LVDS
Differential Output Voltage (VOD
)
Full
Full
150
1.10
250
1.30
mV
V
Output Offset Voltage (VOS
)
Output Coding (Default)
Offset binary
1 See the AN-±35 Application Note, “Understanding High Speed ADC Testing and Evaluation,” for a complete set of definitions and how these tests were completed.
2 This is specified for LVDS and LVPECL only.
Rev. 0 | Page 5 of 52
AD9259
SWITCHING SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −0.5 dBFS, unless otherwise noted.
Table 4.
AD9259-50
Typ
Parameter1
CLOCK2
Temp
Min
Max
Unit
Maximum Clock Rate
Minimum Clock Rate
Clock Pulse Width High (tEH)
Clock Pulse Width Low (tEL)
OUTPUT PARAMETERS2
Full
Full
Full
Full
50
MSPS
MSPS
ns
10
10
10
ns
Propagation Delay (tPD
)
Full
Full
Full
Full
Full
2.0
2.0
2.ꢀ
3.5
3.5
ns
ps
ps
ns
ns
Rise Time (tR) (20% to ±0%)
Fall Time (tF) (20% to ±0%)
FCO Propagation Delay (tFCO
300
300
2.ꢀ
)
)
3
DCO Propagation Delay (tCPD
tFCO +
(tSAMPLE/2±)
(tSAMPLE/2±)
(tSAMPLE/2±)
±50
3
DCO to Data Delay (tDATA
)
Full
Full
Full
(tSAMPLE/2±) − 300
(tSAMPLE/2±) − 300
(tSAMPLE/2±) + 300
(tSAMPLE/2±) + 300
±150
ps
ps
ps
3
DCO to FCO Delay (tFRAME
)
Data to Data Skew
(tDATA-MAX − tDATA-MIN
)
Wake-Up Time (Standby)
Wake-Up Time (Power Down)
Pipeline Latency
25°C
25°C
Full
600
3ꢀ5
10
ns
μs
CLK
cycles
APERTURE
Aperture Delay (tA)
Aperture Uncertainty (Jitter)
Out-of-Range Recovery Time
25°C
25°C
25°C
500
<1
2
ps
ps rms
CLK
cycles
1 See the AN-±35 Application Note, “Understanding High Speed ADC Testing and Evaluation,” for a complete set of definitions and how these tests were completed.
2 Can be adjusted via the SPI interface.
3 tSAMPLE/2± is based on the number of bits multiplied by 2; delays are based on half duty cycles.
Rev. 0 | Page 6 of 52
AD9259
TIMING DIAGRAMS
N – 1
AIN
tA
N
tEH
tEL
CLK–
CLK+
tCPD
DCO–
DCO+
tFRAME
tFCO
FCO–
FCO+
tPD
tDATA
D8
D–
MSB
D12
D11
D10
D9
D7
D6
D5
D4
D3
D2
D1
D0
MSB
N – 9
D12
N – 9
N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10
D+
Figure 2. 14-Bit Data Serial Stream (Default)
N – 1
AIN
tA
N
tEH
tEL
CLK–
CLK+
tCPD
DCO–
DCO+
tFRAME
tFCO
FCO–
FCO+
tPD
tDATA
D6
D–
D+
MSB
D10
D9
D8
D7
D5
D4
D3
D2
D1
D0
MSB
D10
N – 9
N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 9
Figure 3. 12-Bit Data Serial Stream
Rev. 0 | Page ꢀ of 52
AD9259
N – 1
AIN
tA
N
tEH
tEL
CLK–
CLK+
tCPD
DCO–
DCO+
tFRAME
tFCO
FCO–
FCO+
tPD
tDATA
D4
D–
D+
LSB
D0
D1
D2
D3
D5
D6
D7
D8
D9
D10
D11
D12
LSB
N – 9
D0
N – 9
N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10 N – 10
Figure 4. 14-Bit Data Serial Stream, LSB First
Rev. 0 | Page ± of 52
AD9259
ABSOLUTE MAXIMUM RATINGS
Table 5.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
With
Respect To
Parameter
ELECTRICAL
AVDD
DRVDD
AGND
AVDD
Digital Outputs
(D+, D−, DCO+,
DCO−, FCO+, FCO−)
CLK+, CLK−
VIN+, VIN−
SDIO/ODM
PDWN, SCLK/DTP, CSB
REFT, REFB, RBIAS
VREF, SENSE
Rating
AGND
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−2.0 V to +2.0 V
−0.3 V to +2.0 V
DRGND
DRGND
DRVDD
DRGND
THERMAL IMPEDANCE
Table 6.
Air Flow Velocity (m/s)
1
θJA
θJB
θJC
AGND
AGND
AGND
AGND
AGND
AGND
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
0.0
1.0
2.5
24°C/W
21°C/W
19°C/W
12.6°C/W
1.2°C/W
1 θJA for a 4-layer PCB with solid ground plane (simulated). Exposed pad
soldered to PCB.
ENVIRONMENTAL
Operating Temperature
Range (Ambient)
Maximum Junction
Temperature
−40°C to +±5°C
150°C
Lead Temperature
(Soldering, 10 sec)
300°C
Storage Temperature
Range (Ambient)
−65°C to +150°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 9 of 52
AD9259
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
PIN 1
INDICATOR
AVDD
AVDD
VIN – D
VIN + D
AVDD
AVDD
CLK–
1
2
36
35
34
33
32
31
30
29
28
27
26
25
AVDD
AVDD
3
VIN – A
VIN + A
AVDD
EXPOSED PADDLE, PIN 0
(BOTTOM OF PACKAGE)
4
5
6
PDWN
AD9259
TOP VIEW
7
CSB
8
CLK+
SDIO/ODM
SCLK/DTP
AVDD
9
AVDD
AVDD
DRGND
DRVDD
10
11
12
DRGND
DRVDD
Figure 5. 48-Lead LFCSP Top View
Table 7. Pin Function Descriptions
Pin No.
Name
Description
0
AGND
AVDD
Analog Ground (Exposed Paddle)
1.± V Analog Supply
1, 2, 5, 6, 9, 10, 2ꢀ, 32,
35, 36, 39, 45, 46
11, 26
12, 25
3
4
ꢀ
DRGND
DRVDD
VIN − D
VIN + D
CLK−
Digital Output Driver Ground
1.± V Digital Output Driver Supply
ADC D Analog Input—Complement
ADC D Analog Input—True
Input Clock—Complement
Input Clock—True
±
CLK+
13
14
15
16
1ꢀ
1±
19
20
21
22
23
24
2±
29
30
31
33
34
D − D
D + D
D − C
D + C
D − B
D + B
D − A
D + A
FCO−
ADC D Complement Digital Output
ADC D True Digital Output
ADC C Complement Digital Output
ADC C True Digital Output
ADC B Complement Digital Output
ADC B True Digital Output
ADC A Complement Digital Output
ADC A True Digital Output
Frame Clock Output—Complement
Frame Clock Output—True
Data Clock Output—Complement
Data Clock Output—True
Serial Clock/Digital Test Pattern
Serial Data Input-Output/Output Driver Mode
CSB
Power-Down
ADC A Analog Input—True
ADC A Analog Input—Complement
FCO+
DCO−
DCO+
SCLK/DTP
SDIO/ODM
CSB
PDWN
VIN + A
VIN − A
Rev. 0 | Page 10 of 52
AD9259
Pin No.
3ꢀ
3±
40
41
42
43
44
4ꢀ
Name
VIN − B
VIN + B
RBIAS
SENSE
VREF
REFB
REFT
VIN + C
VIN − C
Description
ADC B Analog Input—Complement
ADC B Analog Input—True
External Resistor Sets the Internal ADC Core Bias Current
Reference Mode Selection
Voltage Reference Input/Output
Differential Reference (Negative)
Differential Reference (Positive)
ADC C Analog Input—True
4±
ADC C Analog Input—Complement
Rev. 0 | Page 11 of 52
AD9259
EQUIVALENT CIRCUITS
DRVDD
V
V
D–
D+
VIN
V
V
DRGND
Figure 9. Equivalent Digital Output Circuit
Figure 6. Equivalent Analog Input Circuit
10Ω
CLK
10kΩ
10kΩ
1.25V
1kΩ
SCLK/PDWN
10Ω
CLK
30kΩ
Figure 7. Equivalent Clock Input Circuit
Figure 10. Equivalent SCLK/PDWN Input Circuit
100Ω
RBIAS
350Ω
SDIO/ODM
30kΩ
Figure 11. Equivalent RBIAS Circuit
Figure 8. Equivalent SDIO/ODM Input Circuit
Rev. 0 | Page 12 of 52
AD9259
AVDD
70kΩ
1kΩ
CSB
VREF
6kΩ
Figure 12. Equivalent CSB Input Circuit
Figure 14. Equivalent VREF Circuit
1kΩ
SENSE
Figure 13. Equivalent SENSE Circuit
Rev. 0 | Page 13 of 52
AD9259
TYPICAL PERFORMANCE CHARACTERISTICS
0
0
–20
AIN = –0.5dBFS
SNR = 67.31dB
ENOB = 10.89 BITS
SFDR = 77.38dBc
AIN = –0.5dBFS
SNR = 73.8dB
ENOB = 11.88 BITS
SFDR = 83.4dBc
–20
–40
–40
–60
–80
–60
–80
–100
–120
–100
–120
0
5
10
15
20
25
0
5
10
15
20
25
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 15. Single-Tone 32k FFT with fIN = 2.3 MHz, fSAMPLE = 50 MSPS
Figure 18. Single-Tone 32k FFT with fIN = 170 MHz, fSAMPLE = 50 MSPS
0
0
AIN = –0.5dBFS
SNR = 66.87dB
ENOB = 10.82 BITS
AIN = –0.5dBFS
SNR = 72.94dB
ENOB = 11.57 BITS
–20
–20
SFDR = 78.60dBc
SFDR = 74.97dBc
–40
–40
–60
–80
–60
–80
–100
–120
–100
–120
0
5
10
15
20
25
0
5
10
15
20
25
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 16. Single-Tone 32k FFT with fIN = 70 MHz, fSAMPLE = 50 MSPS
Figure 19. Single-Tone 32k FFT with fIN = 190 MHz, fSAMPLE = 50 MSPS
0
0
AIN = –0.5dBFS
SNR = 71.96dB
AIN = –0.5dBFS
SNR = 65.62dB
ENOB = 10.61 BITS
SFDR = 68.11dBc
ENOB = 11.41 BITS
–20
–40
–20
SFDR = 76.68dBc
–40
–60
–60
–80
–80
–100
–120
–100
–120
0
5
10
15
20
25
0
5
10
15
20
25
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 17. Single-Tone 32k FFT with fIN = 120 MHz, fSAMPLE = 50 MSPS
Figure 20. Single-Tone 32k FFT with fIN = 250 MHz, fSAMPLE = 50 MSPS
Rev. 0 | Page 14 of 52
AD9259
100
90
90
85
80
fIN = 35MHz
fSAMPLE = 50MSPS
2V p-p, SFDR
80
70
2V p-p, SFDR
60
50
40
75
70
65
60
2V p-p, SNR
2V p-p, SNR
30
20
10
0
80dB
REFERENCE
–60
–50
–40
–30
–20
–10
0
10
15
20
25
30
35
40
45
50
ANALOG INPUT LEVEL (dBFS)
ENCODE (MSPS)
Figure 24. SNR/SFDR vs. Analog Input Level, fIN = 35 MHz, fSAMPLE = 50 MSPS
Figure 21. SNR/SFDR vs. fSAMPLE, fIN = 10.3 MHz, fSAMPLE = 50 MSPS
0
90
AIN1 AND AIN2 = –7dBFS
SFDR = 87.76dBc
IMD2 = 90.18dBc
–20
85
IMD3 = 87.27dBc
–40
2V p-p, SFDR
80
75
–60
–80
70
2V p-p, SNR
–100
–120
65
60
0
5
10
15
20
25
10
15
20
25
30
35
40
45
50
FREQUENCY (MHz)
ENCODE (MSPS)
Figure 25. Two-Tone 32k FFT with fIN1 = 15 MHz and
fIN2 = 16 MHz, fSAMPLE = 50 MSPS
Figure 22. SNR/SFDR vs. fSAMPLE, fIN = 35 MHz, fSAMPLE = 50 MSPS
0
–20
100
AIN1 AND AIN2 = –7dBFS
SFDR = 80.37dBc
IMD2 = 79.75dBc
fIN = 10.3MHz
90
fSAMPLE = 50MSPS
IMD3 = 84.50dBc
80
70
60
2V p-p, SFDR
–40
–60
50
40
2V p-p, SNR
–80
30
20
10
0
80dB
REFERENCE
–100
–120
0
5
10
15
20
25
–60
–50
–40
–30
–20
–10
0
FREQUENCY (MHz)
ANALOG INPUT LEVEL (dBFS)
Figure 26. Two-Tone 32k FFT with fIN1 = 70 MHz and
fIN2 = 71 MHz, fSAMPLE = 50 MSPS
Figure 23. SNR/SFDR vs. Analog Input Level, fIN = 10.3 MHz, fSAMPLE = 50 MSPS
Rev. 0 | Page 15 of 52
AD9259
90
85
80
75
70
65
60
55
0.5
0.4
2V p-p, SFDR (dBc)
0.3
0.2
0.1
2V p-p, SNR (dB)
0
–0.1
–0.2
–0.3
–0.4
–0.5
50
1
10
100
1000
0
2000 4000 6000 8000 10000 12000 14000 16000
CODE
ANALOG INPUT FREQUENCY (MHz)
Figure 27. SNR/SFDR vs. fIN, fSAMPLE = 50 MSPS
Figure 30. DNL, fIN = 2.4 MHz, fSAMPLE = 50 MSPS
90
85
80
75
70
65
–30
–35
–40
–45
–50
–55
–60
–65
–70
2V p-p, SFDR
2V p-p, SINAD
60
–40
–20
0
20
40
60
80
0
5
10
15
20
25
30
35
TEMPERATURE (°C)
FREQUENCY (MHz)
Figure 28. SINAD/SFDR vs. Temperature, fIN = 10.3 MHz, fSAMPLE = 50 MSPS
Figure 31. CMRR vs. Frequency, fSAMPLE = 50 MSPS
1.2
1.0
0.8
0.6
0.4
0.2
0
2.0
1.5
1.006 LSB rms
1.0
0.5
0
–0.5
–1.0
–1.5
–2.0
N – 3
N – 2
N – 1
N
N + 1
N + 2
N + 3
0
2000 4000
6000
8000 10000 12000 14000 16000
CODE
CODE
Figure 29. INL, fIN = 2.4 MHz, fSAMPLE = 50 MSPS
Figure 32. Input-Referred Noise Histogram, fSAMPLE = 50 MSPS
Rev. 0 | Page 16 of 52
AD9259
0
–20
0
–1
–2
–3
–4
–5
–6
–7
NPR = 63.89dB
NOTCH = 18.0MHz
NOTCH WIDTH = 3.0MHz
–3dB CUTOFF = 315MHz
–40
–60
–80
–8
–100
–120
–9
–10
0
5
10
15
20
25
0
50
100 150 200 250 300 350 400 450 500
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 33. Noise Power Ratio (NPR), fSAMPLE = 50 MSPS
Figure 34. Full Power Bandwidth vs. Frequency, fSAMPLE = 50 MSPS
Rev. 0 | Page 1ꢀ of 52
AD9259
THEORY OF OPERATION
low-Q inductors or ferrite beads is required when driving the
converter front end at high IF frequencies. Either a shunt capacitor
or two single-ended capacitors can be placed on the inputs to
provide a matching passive network. This ultimately creates a
low-pass filter at the input to limit any unwanted broadband
noise. See the AN-742 Application Note, the AN-827 Application
Note, and the Analog Dialogue article “Transformer-Coupled
Front-End for Wideband A/D Converters” for more information
on this subject. In general, the precise values depend on the
application.
The AD9259 architecture consists of a pipelined ADC that is
divided into three sections: a 4-bit first stage followed by eight
1.5-bit stages and a final 3-bit flash. Each stage provides
sufficient overlap to correct for flash errors in the preceding
stages. The quantized outputs from each stage are combined
into a final 14-bit result in the digital correction logic. The
pipelined architecture permits the first stage to operate on a
new input sample while the remaining stages operate on preceding
samples. Sampling occurs on the rising edge of the clock.
Each stage of the pipeline, excluding the last, consists of a low
resolution flash ADC connected to a switched-capacitor DAC
and interstage residue amplifier (MDAC). The residue amplifier
magnifies the difference between the reconstructed DAC output
and the flash input for the next stage in the pipeline. One bit of
redundancy is used in each stage to facilitate digital correction
of flash errors. The last stage simply consists of a flash ADC.
The analog inputs of the AD9259 are not internally dc-biased.
In ac-coupled applications, the user must provide this bias
externally. Setting the device so that VCM = AVDD/2 is recom-
mended for optimum performance, but the device can function
over a wider range with reasonable performance, as shown in
Figure 36 and Figure 37.
90
fIN = 2.3MHz
The output staging block aligns the data, carries out the error
correction, and passes the data to the output buffers. The data is
then serialized and aligned to the frame and output clock.
fSAMPLE = 50MSPS
SFDR (dBc)
85
80
75
70
65
60
55
50
ANALOG INPUT CONSIDERATIONS
The analog input to the AD9259 is a differential switched-capacitor
circuit designed for processing differential input signals. The input
can support a wide common-mode range and maintain excellent
performance. An input common-mode voltage of midsupply
minimizes signal-dependent errors and provides optimum
performance.
SNR (dB)
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
ANALOG INPUT COMMON-MODE VOLTAGE (V)
H
Figure 36. SNR/SFDR vs. Common-Mode Voltage,
fIN = 2.3 MHz, fSAMPLE = 50 MSPS
C
PAR
H
H
VIN+
VIN–
90
85
80
75
70
65
60
55
50
C
C
SAMPLE
fIN = 30MHz
S
S
S
S
SFDR (dBc)
fSAMPLE = 50MSPS
SAMPLE
C
PAR
H
SNR (dB)
Figure 35. Switched-Capacitor Input Circuit
The clock signal alternately switches the input circuit between
sample mode and hold mode (see Figure 35). When the input
circuit is switched into sample mode, the signal source must be
capable of charging the sample capacitors and settling within
one-half of a clock cycle. A small resistor in series with each
input can help reduce the peak transient current injected from
the output stage of the driving source. In addition, low-Q inductors
or ferrite beads can be placed on each leg of the input to reduce
the high differential capacitance seen at the analog inputs, thus
realizing the maximum bandwidth of the ADC. Such use of
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
ANALOG INPUT COMMON-MODE VOLTAGE (V)
Figure 37. SNR/SFDR vs. Common-Mode Voltage,
f
IN = 30 MHz, fSAMPLE = 50 MSPS
Rev. 0 | Page 1± of 52
AD9259
ADT1–1WT
1:1 Z RATIO
For best dynamic performance, the source impedances driving
VIN+ and VIN− should be matched such that common-mode
settling errors are symmetrical. These errors are reduced by the
common-mode rejection of the ADC. An internal reference
buffer creates the positive and negative reference voltages, REFT
and REFB, respectively, that define the span of the ADC core.
The output common-mode of the reference buffer is set to
midsupply, and the REFT and REFB voltages and span are
defined as
C
R
VIN+
VIN–
ADC
1
2Vp-p
49.9ꢀ
C
R
DIFF
AD9259
AVDD
1kꢀ
AGND
C
1kꢀ
0.1μF
1
C
IS OPTIONAL.
DIFF
Figure 38. Differential Transformer Coupled Configuration
for Baseband Applications
REFT = 1/2 (AVDD + VREF)
REFB = 1/2 (AVDD − VREF)
Span = 2 × (REFT − REFB) = 2 × VREF
ADT1–1WT
1:1 Z RATIO
2Vp-p
16nH
16nH 0.1μF
33ꢀ
VIN+
65ꢀ
ADC
It can be seen from these equations that the REFT and REFB
voltages are symmetrical about the midsupply voltage and, by
definition, the input span is twice the value of the VREF voltage.
499ꢀ
16nH
2.2pF
1kꢀ
AD9259
33ꢀ
VIN–
AVDD
1kꢀ
Maximum SNR performance is always achieved by setting the
ADC to the largest span in a differential configuration. In the
case of the AD9259, the largest input span available is 2 V p-p.
0.1μF
1kꢀ
Figure 39. Differential Transformer Coupled Configuration for IF Applications
Differential Input Configurations
Single-Ended Input Configuration
There are several ways in which to drive the AD9259 either
actively or passively. In either case, the optimum performance is
achieved by driving the analog input differentially. One example
is by using the AD8332 differential driver. It provides excellent
performance and a flexible interface to the ADC (see Figure 41)
for baseband applications. This configuration is common for
medical ultrasound systems.
A single-ended input may provide adequate performance in
cost-sensitive applications. In this configuration, SFDR and
distortion performance degrade due to the large input common-
mode swing. If the application requires a single-ended input
configuration, ensure that the source impedances on each input
are well matched in order to achieve the best possible performance.
A full-scale input of 2 V p-p can still be applied to the ADC’s VIN+
pin while the VIN− pin is terminated. Figure 40 details a typical
single-ended input configuration.
However, the noise performance of most amplifiers is not
adequate to achieve the true performance of the AD9259. For
applications where SNR is a key parameter, differential transfor-
mer coupling is the recommended input configuration. Two
examples are shown in Figure 38 and Figure 39.
AVDD
C
R
VIN+
0.1µF
AVDD
1kꢀ
2V p-p
49.9ꢀ
ADC
AD9259
1
In any configuration, the value of the shunt capacitor, C, is
dependent on the input frequency and may need to be reduced
or removed.
C
DIFF
1kꢀ
25ꢀ
R
C
VIN–
0.1µF
1kꢀ
1
C
IS OPTIONAL.
DIFF
Figure 40. Single-Ended Input Configuration
0.1μF
LOP
VIP
0.1μF
187ꢀ
374ꢀ
R
R
VOH
VOL
0.1μF 120nH
INH
VIN+
1V p-p
AD8332
1.0kꢀ
1.0kꢀ
22pF
ADC
AD9259
LNA
VGA
C
LMD
VIN–
VREF
0.1μF
187ꢀ
0.1μF
0.1μF
10μF
LON
VIN
274ꢀ
18nF
0.1μF
Figure 41. Differential Input Configuration Using the AD8332
Rev. 0 | Page 19 of 52
AD9259
CLOCK INPUT CONSIDERATIONS
In some applications, it is acceptable to drive the sample clock
inputs with a single-ended CMOS signal. In such applications,
CLK+ should be directly driven from a CMOS gate, and the
CLK− pin should be bypassed to ground with a 0.1 μF capacitor
in parallel with a 39 kΩ resistor (see Figure 45). Although the
CLK+ input circuit supply is AVDD (1.8 V), this input is
designed to withstand input voltages up to 3.3 V, making the
selection of the drive logic voltage very flexible.
For optimum performance, the AD9259 sample clock inputs
(CLK+ and CLK−) should be clocked with a differential signal.
This signal is typically ac-coupled into the CLK+ and CLK− pins
via a transformer or capacitors. These pins are biased internally
and require no additional bias.
Figure 42 shows one preferred method for clocking the AD9259.
The low jitter clock source is converted from single-ended to
differential using an RF transformer. The back-to-back Schottky
diodes across the secondary transformer limit clock excursions
into the AD9259 to approximately 0.8 V p-p differential. This
helps prevent the large voltage swings of the clock from feeding
through to other portions of the AD9259 and preserves the fast
rise and fall times of the signal, which are critical to low jitter
performance.
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515
0.1µF
CLOCK
CLK
INPUT
OPTIONAL
100ꢀ
0.1µF
1
50ꢀ
CLK+
CMOS DRIVER
CLK
ADC
AD9259
0.1µF
CLK–
0.1µF
39kꢀ
1
50ꢀ RESISTOR IS OPTIONAL.
MIN-CIRCUITS
ADT1–1WT, 1:1Z
Figure 45. Single-Ended 1.8 V CMOS Sample Clock
0.1µF
0.1µF
XFMR
CLOCK
INPUT
CLK+
AD9510/AD9511/
AD9512/AD9513/
100ꢀ
ADC
AD9259
CLK–
50ꢀ
0.1µF
AD9514/AD9515
0.1µF
CLOCK
INPUT
CLK
SCHOTTKY
DIODES:
HSM2812
OPTIONAL
100ꢀ
0.1µF
0.1µF
1
50ꢀ
CLK+
CMOS DRIVER
CLK
ADC
Figure 42. Transformer Coupled Differential Clock
AD9259
0.1µF
0.1µF
CLK–
If a low jitter clock is available, another option is to ac-couple a
differential PECL signal to the sample clock input pins as shown
in Figure 43. The AD9510/AD9511/AD9512/AD9513/AD9514/
AD9515 family of clock drivers offers excellent jitter performance.
1
50ꢀ RESISTOR IS OPTIONAL.
Figure 46. Single-Ended 3.3 V CMOS Sample Clock
Clock Duty Cycle Considerations
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515
Typical high speed ADCs use both clock edges to generate a
variety of internal timing signals. As a result, these ADCs may
be sensitive to clock duty cycle. Commonly, a 5% tolerance is
required on the clock duty cycle to maintain dynamic performance
characteristics. The AD9259 contains a duty cycle stabilizer (DCS)
that retimes the nonsampling edge, providing an internal clock
signal with a nominal 50% duty cycle. This allows a wide range
of clock input duty cycles without affecting the performance of
the AD9259. When the DCS is on, noise and distortion perfor-
mance are nearly flat for a wide range of duty cycles. However,
some applications may require the DCS function to be off. If so,
keep in mind that the dynamic range performance can be affected
when operated in this mode. See the Memory Map section for
more details on using this feature.
0.1µF
0.1µF
CLOCK
INPUT
CLK
CLK+
ADC
AD9259
100ꢀ
PECL DRIVER
CLK
0.1µF
0.1µF
CLOCK
INPUT
CLK–
1
1
240ꢀ
240ꢀ
50ꢀ
50ꢀ
1
50ꢀ RESISTORS ARE OPTIONAL.
Figure 43. Differential PECL Sample Clock
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515
0.1µF
0.1µF
CLOCK
INPUT
CLK+
CLK
ADC
AD9259
100ꢀ
LVDS DRIVER
CLK
0.1µF
0.1µF
CLOCK
INPUT
CLK–
1
50ꢀ*
50ꢀ
The duty cycle stabilizer uses a delay-locked loop (DLL) to
create the nonsampling edge. As a result, any changes to the
sampling frequency require approximately 10 clock cycles
to allow the DLL to acquire and lock to the new rate.
1
50ꢀ RESISTORS ARE OPTIONAL
Figure 44. Differential LVDS Sample Clock
Rev. 0 | Page 20 of 52
AD9259
Clock Jitter Considerations
Power Dissipation and Power-Down Mode
High speed, high resolution ADCs are sensitive to the quality of the
clock input. The degradation in SNR at a given input frequency
(fA) due only to aperture jitter (tJ) can be calculated by
As shown in Figure 48, the power dissipated by the AD9259 is
proportional to its sample rate. The digital power dissipation
does not vary much because it is determined primarily by the
DRVDD supply and bias current of the LVDS output drivers.
SNR degradation = 20 × log 10 [1/2 × π × fA × tJ]
200
180
160
140
120
100
80
500
450
400
350
300
250
In this equation, the rms aperture jitter represents the root mean
square of all jitter sources, including the clock input, analog input
signal, and ADC aperture jitter specifications. IF undersampling
applications are particularly sensitive to jitter (see Figure 47).
AVDD CURRENT
The clock input should be treated as an analog signal in cases
where aperture jitter may affect the dynamic range of the AD9259.
Power supplies for clock drivers should be separated from the
ADC output driver supplies to avoid modulating the clock signal
with digital noise. Low jitter, crystal-controlled oscillators make
the best clock sources. If the clock is generated from another
type of source (by gating, dividing, or other methods), it should
be retimed by the original clock at the last step.
TOTAL POWER
60
40
DRVDD CURRENT
20
0
10
15
20
25
30
35
40
45
50
ENCODE (MSPS)
Refer to the AN-501 Application Note and the AN-756
Application Note for more in-depth information about jitter
performance as it relates to ADCs (visit www.analog.com).
Figure 48. Supply Current vs. fSAMPLE for fIN = 10.3 MHz, fSAMPLE = 50 MSPS
130
RMS CLOCK JITTER REQUIREMENT
120
110
16 BITS
100
90
80
70
60
50
40
30
14 BITS
12 BITS
10 BITS
0.125ps
0.25ps
0.5ps
1.0ps
2.0ps
1
10
100
1000
ANALOG INPUT FREQUENCY (MHz)
Figure 47. Ideal SNR vs. Input Frequency and Jitter
Rev. 0 | Page 21 of 52
AD9259
By asserting the PDWN pin high, the AD9259 is placed in
power-down mode. In this state, the ADC typically dissipates
2 mW. During power-down, the LVDS output drivers are placed in
a high impedance state. The AD9259 returns to normal operating
mode when the PDWN pin is pulled low. This pin is both 1.8 V
and 3.3 V tolerant.
100 Ω termination resistor placed as close to the receiver as
possible. No far-end receiver termination and poor differential
trace routing may result in timing errors. It is recommended
that the trace length is no longer than 24 inches and that the
differential output traces are kept close together and at equal
lengths. An example of the FCO and data stream with proper
trace length and position can be found in Figure 49.
In power-down mode, low power dissipation is achieved by
shutting down the reference, reference buffer, PLL, and biasing
networks. The decoupling capacitors on REFT and REFB are
discharged when entering power-down mode and must be
recharged when returning to normal operation. As a result, the
wake-up time is related to the time spent in the power-down
mode; shorter cycles result in proportionally shorter wake-up
times. With the recommended 0.1 ꢀF and 2.2 ꢀF decoupling
capacitors on REFT and REFB, it takes approximately 1 sec to
fully discharge the reference buffer decoupling capacitors and
375 ꢀs to restore full operation.
There are a number of other power-down options available
when using the SPI port interface. The user can individually
power down each channel or put the entire device into standby
mode. This allows the user to keep the internal PLL powered
when fast wake-up times (~600 ns) are required. See the
Memory Map section for more details on using these features.
2.5ns/DIV
CH1 500mV/DIV = DCO
CH2 500mV/DIV = DATA
CH3 500mV/DIV = FCO
Figure 49. LVDS Output Timing Example in ANSI Mode (Default)
An example of the LVDS output using the ANSI standard (default)
data eye and a time interval error (TIE) jitter histogram with
trace lengths less than 24 inches on regular FR-4 material is
shown in Figure 50. Figure 51 shows an example of when the
trace lengths exceed 24 inches on regular FR-4 material. Notice
that the TIE jitter histogram reflects the decrease of the data eye
opening as the edge deviates from the ideal position. It is up to
the user to determine if the waveforms meet the timing budget
of the design when the trace lengths exceed 24 inches. Additional
SPI options allow the user to further increase the internal ter-
mination (increasing the current) of all four outputs in order to
drive longer trace lengths (see Figure 52). Even though this
produces sharper rise and fall times on the data edges and is less
prone to bit errors, the power dissipation of the DRVDD supply
increases when this option is used. Also notice in Figure 52 that
the histogram has improved. See the Memory Map section for
more details.
Digital Outputs and Timing
The AD9259 differential outputs conform to the ANSI-644 LVDS
standard on default power-up. This can be changed to a low power,
reduced signal option similar to the IEEE 1596.3 standard using
the SDIO/ODM pin or via the SPI. This LVDS standard can further
reduce the overall power dissipation of the device by approximately
17 mW. See the SDIO/ODM Pin section or Table 15 in the
Memory Map section for more information. The LVDS driver
current is derived on-chip and sets the output current at each
output equal
to a nominal 3.5 mA. A 100 Ω differential termination resistor
placed at the LVDS receiver inputs results in a nominal 350 mV
swing at the receiver.
The AD9259 LVDS outputs facilitate interfacing with LVDS
receivers in custom ASICs and FPGAs that have LVDS capability
for superior switching performance in noisy environments.
Single point-to-point net topologies are recommended with a
Rev. 0 | Page 22 of 52
AD9259
EYE: ALL BITS
EYE: ALL BITS
ULS: 9599/15599
ULS: 10000/15600
400
200
500
0
0
–200
–400
–500
–1.0ns
–0.5ns
0ns
0.5ns
1.0ns
–1.0ns
–0.5ns
0ns
0.5ns
1.0ns
100
100
50
0
50
0
–150ps –100ps
–50ps
–0ps
50ps
100ps
150ps
–100ps
–0ps
100ps
Figure 50. Data Eye for LVDS Outputs in ANSI Mode with Trace Lengths Less
than 24 Inches on Standard FR-4
Figure 52. Data Eye for LVDS Outputs in ANSI Mode with 100 Ω Termination
on and Trace Lengths Greater than 24 Inches on Standard FR-4
The format of the output data is offset binary by default. An
example of the output coding format can be found in Table 8.
If it is desired to change the output data format to twos
complement, see the Memory Map section.
EYE: ALL BITS
ULS: 9600/15600
200
Table 8. Digital Output Coding
0
(VIN+) − (VIN−), Input
Span = 2 V p-p (V)
Digital Output Offset Binary
(D11 ... D0)
Code
163±3 +1.00
11 1111 1111 1111
10 0000 0000 0000
01 1111 1111 1111
00 0000 0000 0000
±192
±191
0
0.00
−0.000122
−1.00
–200
100
–1.0ns
–0.5ns
0ns
0.5ns
1.0ns
Data from each ADC is serialized and provided on a separate
channel. The data rate for each serial stream is equal to 14 bits
times the sample clock rate, with a maximum of 700 Mbps
(14 bits × 50 MSPS = 700 Mbps). The lowest typical conversion
rate is 10 MSPS. However, if lower sample rates are required for
a specific application, the PLL can be set up for encode rates
lower than 10 MSPS via the SPI. This allows encode rates as low
as 5 MSPS. See the Memory Map section to enable this feature.
50
0
–150ps –100ps
–50ps
–0ps
50ps
100ps
150ps
Figure 51. Data Eye for LVDS Outputs in ANSI Mode with Trace Lengths
Greater than 24 Inches on Standard FR-4
Rev. 0 | Page 23 of 52
AD9259
Two output clocks are provided to assist in capturing data from
the AD9259. The DCO is used to clock the output data and is
equal to seven times the sampling clock (CLK) rate. Data is
clocked out of the AD9259 and must be captured on the rising
and falling edges of the DCO that supports double data rate
(DDR) capturing. The frame clock out (FCO) is used to signal
the start of a new output byte and is equal to the sampling clock
rate. See the timing diagram shown in Figure 2 for more
information.
Table 9. Flex Output Test Modes
Subject
to Data
Format
Output Test
Mode Bit
Sequence
Pattern Name
Off (default)
Digital Output Word 1
Digital Output Word 2
Select
0000
N/A
N/A
N/A
0001
Midscale short
1000 0000 (±-bit)
Same
Yes
10 0000 0000 (10-bit)
1000 0000 0000 (12-bit)
10 0000 0000 0000 (14-bit)
0010
0011
0100
+Full-scale short
−Full-scale short
Checker board
1111 1111 (±-bit)
Same
Same
Yes
Yes
No
11 1111 1111 (10-bit)
1111 1111 1111 (12-bit)
11 1111 1111 1111 (14-bit)
0000 0000 (±-bit)
00 0000 0000 (10-bit)
0000 0000 0000 (12-bit)
00 0000 0000 0000 (14-bit)
1010 1010 (±-bit)
0101 0101 (±-bit)
10 1010 1010 (10-bit)
1010 1010 1010 (12-bit)
10 1010 1010 1010 (14-bit)
N/A
N/A
01 0101 0101 (10-bit)
0101 0101 0101 (12-bit)
01 0101 0101 0101 (14-bit)
N/A
N/A
0101
0110
0111
PN sequence long1
PN sequence short1
One/zero word toggle
Yes
Yes
No
1111 1111 (±-bit)
0000 0000 (±-bit)
11 1111 1111 (10-bit)
1111 1111 1111 (12-bit)
11 1111 1111 1111 (14-bit)
00 0000 0000 (10-bit)
0000 0000 0000 (12-bit)
00 0000 0000 0000 (14-bit)
1000
1001
User input
One/zero bit toggle
Register 0x19 to Register 0x1A
1010 1010 (±-bit)
Register 0x1B to Register 0x1C
N/A
No
No
10 1010 1010 (10-bit)
1010 1010 1010 (12-bit)
10 1010 1010 1010 (14-bit)
1010
1011
1100
1× sync
0000 1111 (±-bit)
N/A
N/A
N/A
No
No
No
00 0001 1111 (10-bit)
0000 0011 1111 (12-bit)
00 0000 0111 1111 (14-bit)
One bit high
Mixed frequency
1000 0000 (±-bit)
10 0000 0000 (10-bit)
1000 0000 0000 (12-bit)
10 0000 0000 0000 (14-bit)
1010 0011 (±-bit)
10 0110 0011 (10-bit)
1010 0011 0011 (12-bit)
10 1000 0110 0111 (14-bit)
1 PN, or pseudorandom number, sequence is determined by the number of bits in the shift register. The long sequence is 23 bits and the short sequence is
9 bits. How the sequence is generated and utilized is described in the ITU O.150 standard. In general, the polynomial, X23 + X1± + 1 (long) and X9 + X5 + 1
(short), defines the pseudorandom sequence.
Rev. 0 | Page 24 of 52
AD9259
Table 10. Output Driver Mode Pin Settings
When using the serial port interface (SPI), the DCO phase can
be adjusted in 60° increments relative to the data edge. This
enables the user to refine system timing margins if required.
The default DCO timing, as shown in Figure 2, is 90° relative to
the output data edge.
Resulting
Resulting
Selected ODM ODM Voltage
Normal
operation
Output Standard FCO and DCO
10 kΩ to AGND ANSI-644
ANSI-644
(default)
(default)
ODM
AVDD
Low power,
reduced signal
option
Low power,
reduced
signal
An 8-, 10-, and 12-bit serial stream can also be initiated from
the SPI. This allows the user to implement and test compatibility
to lower resolution systems. When changing the resolution to
an 8-, 10-, or 12-bit serial stream, the data stream is shortened.
See Figure 3 for a 12-bit example.
option
SCLK/DTP Pin
This pin is for applications that do not require SPI mode operation.
The serial clock/digital test pattern (SCLK/DTP) pin can enable
a single digital test pattern if this pin and the CSB pin are held
high during device power-up. When the DTP is tied to AVDD,
all the ADC channel outputs shift out the following pattern: 10
0000 0000 0000. The FCO and DCO outputs still work as usual
while all channels shift out the repeatable test pattern. This pattern
allows the user to perform timing alignment adjustments among
the FCO, DCO, and output data. For normal operation, this pin
should be tied to AGND through a 10 kΩ resistor. This pin is
both 1.8 V and 3.3 V tolerant.
When using the SPI, all of the data outputs can also be inverted
from their nominal state. This is not to be confused with
inverting the serial stream to an LSB-first mode. In default
mode, as shown in Figure 2, the MSB is represented first in the
data output serial stream. However, this can be inverted so that
the LSB is represented first in the data output serial stream (see
Figure 4).
There are 12 digital output test pattern options available that
can be initiated through the SPI. This is a useful feature when
validating receiver capture and timing. Refer to Table 9 for the
output bit sequencing options available. Some test patterns have
two serial sequential words and can be alternated in various
ways, depending on the test pattern chosen. It should be noted
that some patterns may not adhere to the data format select
option. In addition, customer user patterns can be assigned in
the 0x19, 0x1A, 0x1B, and 0x1C register addresses. All test mode
options can support 8- to 14-bit word lengths in order to verify
data capture to the receiver.
Table 11. Digital Test Pattern Pin Settings
Resulting
Resulting
Selected DTP DTP Voltage
Normal
operation
DTP
D+ and D−
FCO and DCO
10 kΩ to AGND Normal
Normal operation
operation
AVDD
10 0000 0000
0000
Normal operation
Additional and custom test patterns can also be observed when
commanded from the SPI port. Consult the Memory Map
section to choose from the different options available.
Please consult the Memory Map section for information on how
to change these additional digital output timing features through
the serial port interface or SPI.
CSB Pin
The chip select bar (CSB) pin should be tied to AVDD for
applications that do not require SPI mode operation. By tying
CSB high, all SCLK and SDIO information is ignored. This pin
is both 1.8 V and 3.3 V tolerant.
SDIO/ODM Pin
This pin is for applications that do not require SPI mode operation.
The SDIO/ODM pin can enable a low power, reduced signal option
similar to the IEEE 1596.3 reduced range link output standard if
this pin and the CSB pin are tied to AVDD during device power-
up. This option should only be used when the digital output trace
lengths are less than 2 inches in length to the LVDS receiver. The
FCO, DCO, and outputs function normally, but the LVDS signal
swing of all channels is reduced from 350 mV p-p to 200 mV p-p.
This output mode allows the user to further lower the power on
the DRVDD supply. For applications where this pin is not used,
it should be tied low. In this case, the device pin can be left open,
and the 30 kΩ internal pull-down resistor pulls this pin low. This
pin is only 1.8 V tolerant. If applications require this pin to be
driven from a 3.3 V logic level, insert a 1 kΩ resistor in series
with this pin to limit the current.
RBIAS Pin
To set the internal core bias current of the ADC, place a resistor
(nominally equal to 10.0 kΩ) to ground at the RBIAS pin. The
resistor current is derived on-chip and sets the ADC’s AVDD
current to a nominal 185 mA at 50 MSPS. Therefore, it is
imperative that at least a 1% tolerance on this resistor be used to
achieve consistent performance. If SFDR performance is not as
critical as power, simply adjust the ADC core current to achieve
a lower power. Figure 53 and Figure 54 show the relationship
between the dynamic range and power as the RBIAS resistance
is changed. Nominally, a 10.0 kΩ value is used, as indicated by
the dashed line.
Rev. 0 | Page 25 of 52
AD9259
85
80
Internal Reference Operation
83
81
79
77
A comparator within the AD9259 detects the potential at the
SENSE pin and configures the reference. If SENSE is grounded,
the reference amplifier switch is connected to the internal
resistor divider (see Figure 55), setting VREF to 1 V.
SFDR
SNR
75
70
65
75
73
71
69
67
The REFT and REFB pins establish their input span of the ADC
core from the reference configuration. The analog input full-
scale range of the ADC equals twice the voltage at the reference
pin for either an internal or an external reference configuration.
60
55
If the reference of the AD9259 is used to drive multiple
converters to improve gain matching, the loading of the refer-
ence by the other converters must be considered. Figure 57
depicts how the internal reference voltage is affected by loading.
65
2
6
10
14
18
22
RESISTANCE (kꢀ)
Figure 53. SFDR vs. RBIAS
600
500
400
300
200
100
VIN+
VIN–
REFT
0.1µF
+
ADC
CORE
0.1µF
2.2µF
REFB
0.1µF
V
REF
1µF
0.1µF
0.5V
SELECT
LOGIC
SENSE
0
2
6
10
14
18
22
RESISTANCE (kꢀ)
Figure 54. IAVDD vs. RBIAS
Figure 55. Internal Reference Configuration
Voltage Reference
VIN+
VIN–
A stable and accurate 0.5 V voltage reference is built into the
AD9259. This is gained up by a factor of 2 internally, setting
REFT
V
REF to 1.0 V, which results in a full-scale differential input span
0.1µF
0.1µF
REFB
+
ADC
CORE
2.2µF
of 2 V p-p. The VREF is set internally by default; however, the
VREF pin can be driven externally with a 1.0 V reference to
achieve more accuracy.
EXTERNAL
REFERENCE
0.1µF
V
REF
1
1
When applying the decoupling capacitors to the VREF, REFT,
and REFB pins, use ceramic low ESR capacitors. These capacitors
should be close to the ADC pins and on the same layer of the
PCB as the AD9259. The recommended capacitor values and
configurations for the AD9259 reference pin can be found in
Figure 55.
1µF
0.1µF
0.5V
SELECT
LOGIC
AVDD
SENSE
Table 12. Reference Settings
1
OPTIONAL.
Resulting
Selected
Mode
SENSE
Voltage
Resulting
VREF (V)
Differential
Span (V p-p)
Figure 56. External Reference Operation
External
AVDD
N/A
2 × external
reference
Reference
Internal,
2 V p-p FSR
AGND to 0.2 V
1.0
2.0
Rev. 0 | Page 26 of 52
AD9259
0.20
0.15
0.10
0.05
0
External Reference Operation
The use of an external reference may be necessary to enhance
the gain accuracy of the ADC or improve thermal drift charac-
teristics. Figure 58 shows the typical drift characteristics of the
internal reference in 1 V mode.
When the SENSE pin is tied to AVDD, the internal reference is
disabled, allowing the use of an external reference. The external
reference is loaded with an equivalent 6 kΩ load. An internal
reference buffer generates the positive and negative full-scale
references, REFT and REFB, for the ADC core. Therefore, the
external reference must be limited to a nominal of 1.0 V.
–0.05
–0.10
–0.15
–0.20
–40
–20
0
20
40
60
80
5
TEMPERATURE (°C)
Figure 58. Typical VREF Drift
0
–5
–10
–15
–20
–25
–30
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
CURRENT LOAD (mA)
Figure 57. VREF Accuracy vs. Load
Rev. 0 | Page 2ꢀ of 52
AD9259
SERIAL PORT INTERFACE (SPI)
The AD9259 serial port interface allows the user to configure
the converter for specific functions or operations through a
structured register space provided inside the ADC. This gives
the user added flexibility and customization depending on the
application. Addresses are accessed via the serial port and can
be written to or read from via the port. Memory is organized
into bytes that can be further divided down into fields, as doc-
umented in the Memory Map section. Detailed operational
information can be found in the Analog Devices user manual
Interfacing to High Speed ADCs via SPI.
In addition to the operation modes, the SPI port can be
configured to operate in different manners. For applications
that do not require a control port, the CSB line can be tied and
held high. This places the remainder of the SPI pins in their
secondary mode as defined in the Serial Port Interface (SPI)
section. CSB can also be tied low to enable 2-wire mode. When
CSB is tied low, SCLK and SDIO are the only pins required for
communication. Although the device is synchronized during
power-up, caution must be exercised when using this mode to
ensure that the serial port remains synchronized with the CSB
line. When operating in 2-wire mode, it is recommended to use
a 1-, 2-, or 3-byte transfer exclusively. Without an active CSB
line, streaming mode can be entered but not exited.
There are three pins that define the serial port interface, or SPI,
to this particular ADC. They are the SCLK, SDIO, and CSB
pins. The SCLK (serial clock) is used to synchronize the read
and write data presented to the ADC. The SDIO (serial data
input/output) is a dual-purpose pin that allows data to be sent
to and read from the internal ADC memory map registers. The
CSB (chip select bar) is an active low control that enables or
disables the read and write cycles (see Table 13).
In addition to word length, the instruction phase determines if
the serial frame is a read or write operation, allowing the serial
port to be used to both program the chip and read the contents
of the on-chip memory. If the instruction is a readback operation,
performing a readback causes the serial data input/output (SDIO)
pin to change direction from an input to an output at the
appropriate point in the serial frame.
Table 13. Serial Port Pins
Pin
SCLK
Function
Data can be sent in MSB- or LSB-first mode. MSB-first mode
is the default at power-up and can be changed by adjusting the
configuration register. For more information about this and
other features, see the user manual Interfacing to High Speed
ADCs via SPI.
Serial Clock. The serial shift clock in. SCLK is used to
synchronize serial interface reads and writes.
Serial Data Input/Output. A dual-purpose pin. The
typical role for this pin is an input or output, depending
on the instruction sent and the relative position in the
timing frame.
SDIO
CSB
Chip Select Bar (Active Low). This control gates the read
and write cycles.
HARDWARE INTERFACE
The pins described in Table 13 compose the physical interface
between the user’s programming device and the serial port of
the AD9259. The SCLK and CSB pins function as inputs when
using the SPI interface. The SDIO pin is bidirectional, functioning
as an input during write phases and as an output during readback.
The falling edge of the CSB in conjunction with the rising edge
of the SCLK determines the start of the framing sequence. During
an instruction phase, a 16-bit instruction is transmitted, followed
by one or more data bytes, which is determined by Bit Fields
W0 and W1. An example of the serial timing and its definitions
can be found in Figure 59 and Table 14. In normal operation,
CSB is used to signal to the device that SPI commands are to be
received and processed. When CSB is brought low, the device
processes SCLK and SDIO to process instructions. Normally,
CSB remains low until the communication cycle is complete.
However, if connected to a slow device, CSB can be brought
high between bytes, allowing older microcontrollers enough
time to transfer data into shift registers. CSB can be stalled
when transferring one, two, or three bytes of data. When W0
and W1 are set to 11, the device enters streaming mode and
continues to process data, either reading or writing, until the
CSB is taken high to end the communication cycle. This allows
complete memory transfers without having to provide additional
instructions. Regardless of the mode, if CSB is taken high in the
middle of any byte transfer, the SPI state machine is reset and
the device waits for a new instruction.
This interface is flexible enough to be controlled by either serial
PROMS or PIC mirocontrollers. This provides the user an
alternative method, other than a full SPI controller, to program
the ADC (see the AN-812 Application Note).
If the user chooses not to use the SPI interface, these pins serve
a dual function and are associated with secondary functions
when the CSB is strapped to AVDD during device power-up.
See the Theory of Operation section for details on which pin-
strappable functions are supported on the SPI pins.
For users who simply wish to operate the DUT without using
SPI, remove any connections from the CSB, SCLK/DTP, and
SDIO/OMD pins. By disconnecting these pins from the control
bus, the DUT can operate in its most basic operation. Each of
these pins has an internal termination and will float to its
respective level.
Rev. 0 | Page 2± of 52
AD9259
tDS
tHI
tCLK
tH
tS
tDH
tLO
CSB
SCLK DON’T CARE
SDIO DON’T CARE
DON’T CARE
DON’T CARE
R/W
W1
W0
A12
A11
A10
A9
A8
A7
D5
D4
D3
D2
D1
D0
Figure 59. Serial Timing Details
Table 14. Serial Timing Definitions
Parameter
Timing (minimum, ns)
Description
tDS
tDH
tCLK
tS
5
2
40
5
Setup time between the data and the rising edge of SCLK
Hold time between the data and the rising edge of SCLK
Period of the clock
Setup time between CSB and SCLK
tH
2
Hold time between CSB and SCLK
tHI
tLO
16
16
Minimum period that SCLK should be in a logic high state
Minimum period that SCLK should be in a logic low state
Rev. 0 | Page 29 of 52
AD9259
MEMORY MAP
READING THE MEMORY MAP TABLE
RESERVED LOCATIONS
Each row in the memory map table has eight address locations.
The memory map is roughly divided into three sections: chip
configuration register map (Address 0x00 to Address 0x02), device
index and transfer register map (Address 0x05 and Address 0xFF),
and program register map (Address 0x08 to Address 0x25).
Undefined memory locations should not be written to except
when writing the default values suggested in this data sheet.
Addresses that have values marked as 0 should be considered
reserved and have a 0 written into their registers during power-up.
DEFAULT VALUES
The left-hand column of the memory map indicates the register
address number in hexadecimal. The default value of this address is
shown in hexadecimal in the right-hand column. The Bit 7 (MSB)
column is the start of the default hexadecimal value given. For
example, Hexadecimal Address 0x09, Clock, has a hexadecimal
default value of 0x01. This means Bit 7 = 0, Bit 6 = 0, Bit 5 = 0,
Bit 4 = 0, Bit 3 = 0, Bit 2 = 0, Bit 1 = 0, and Bit 0 = 1, or 0000 0001
in binary. This setting is the default for the duty cycle stabilizer in
the on condition. By writing a 0 to Bit 6 at this address, the duty
cycle stabilizer turns off. For more information on this and other
functions, consult the user manual Interfacing to High Speed
ADCs via SPI.
Coming out of reset, critical registers are preloaded with default
values. These values are indicated in Table 15, where an X refers
to an undefined feature.
LOGIC LEVELS
An explanation of various registers follows: “Bit is set” is
synonymous with “bit is set to Logic 1” or “writing Logic 1 for
the bit.” Similarly, “clear a bit” is synonymous with “bit is set to
Logic 0” or “writing Logic 0 for the bit.”
Rev. 0 | Page 30 of 52
AD9259
Table 15. Memory Map Register
Default
Value
(Hex)
Addr.
(Hex)
Bit 7
Bit 0
(LSB)
Default Notes/
Comments
Parameter Name (MSB)
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Chip Configuration Registers
00
chip_port_config
0
LSB first
1 = on
Soft
reset
1
1
Soft
reset
LSB first
1 = on
0
0x1±
The nibbles
should be
0 = off
(default)
1 = on
0 = off
(default)
1 = on
0 = off
(default)
0 = off
(default)
mirrored so that
LSB- or MSB-first
mode registers
correctly
regardless of
shift mode.
01
02
chip_id
±-bit Chip ID Bits ꢀ:0
(AD9259 = 0x04), (default)
0x04
Default is unique
chip ID. This is a
read-only
Read
only
register.
chip_grade
X
Child ID 6:4
X
X
X
X
Read
only
Child ID used to
differentiate
graded devices.
(identify device variants of Chip ID)
100 = 50 MSPS
Device Index and Transfer Registers
05
device_index_A
X
X
Clock
Channel
DCO
1 = on
0 = off
Clock
Channel
FCO
1 = on
0 = off
Data
Channel
D
Data
Channel
C
Data
Channel
B
Data
Channel
A
0x0F
Bits are set to
determine which
on-chip device
receives the next
write command.
1 = on
1 = on
1 = on
1 = on
(default) (default) (default) (default)
(default) (default) 0 = off
0 = off
0 = off
0 = off
FF
device_update
X
X
X
X
X
X
X
SW
0x00
Synchronously
transfers data
from the master
shift register to
the slave.
transfer
1 = on
0 = off
(default)
ADC Functions
0±
modes
X
X
X
X
X
X
X
X
X
X
Internal power-down mode
000 = chip run (default)
001 = full power-down
010 = standby
0x00
0x01
Determines
various generic
modes of chip
operation.
011 = reset
09
clock
X
X
Duty
Turns the
cycle
internal duty
cycle stabilizer
on and off.
stabilizer
1 = on
(default)
0 = off
0D
test_io
User test mode
00 = off (default)
01 = on, single alternate 1 = on
10 = on, single once
11 = on, alternate once
Reset PN Reset
long gen PN short
0x00
When set, the
test data is
placed on the
output pins in
place of normal
data.
Output test mode—see Table 9 in the
Digital Outputs and Timing section
0000 = off (default)
0001 = midscale short
0010 = +FS short
gen
0 = off
1 = on
(default) 0 = off
(default)
0011 = −FS short
0100 = checker board output
0101 = PN 23 sequence
0110 = PN 9
0111 = one/zero word toggle
1000 = user input
1001 = one/zero bit toggle
1010 = 1× sync
1011 = one bit high
1100 = mixed bit frequency
(format determined by output_mode)
Rev. 0 | Page 31 of 52
AD9259
Default
Value
(Hex)
Addr.
(Hex)
Bit 7
Parameter Name (MSB)
output_mode X
Bit 0
(LSB)
Default Notes/
Comments
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
14
0 = LVDS
ANSI
(default)
1 = LVDS
low
X
X
X
Output
invert
1 = on
0 = off
(default)
00 = offset binary
(default)
0x00
Configures the
outputs and the
format of the
data.
01 = twos
complement
power,
(IEEE
1596.3
similar)
15
output_adjust
X
X
Output driver
termination
00 = none (default)
01 = 200 Ω
10 = 100 Ω
11 = 100 Ω
X
X
X
X
0x00
Determines
LVDS or other
output properties.
Primarily func-
tions to set the
LVDS span and
common-mode
levels in place of
an external
resistor.
16
output_phase
X
X
X
X
0011 = output clock phase adjust
(0000 through 1010)
0x03
On devices that
utilize global
clock divide,
determines
which phase of
the divider
output is used to
supply the
output clock.
Internal latching
is unaffected.
(Default: 1±0° relative to DATA edge)
0000 = 0° relative to DATA edge
0001 = 60° relative to DATA edge
0010 = 120° relative to DATA edge
0011 = 1±0° relative to DATA edge
0100 = 240° relative to DATA edge
0101 = 300° relative to DATA edge
0110 = 360° relative to DATA edge
0111 = 420° relative to DATA edge
1000 = 4±0° relative to DATA edge
1001 = 540° relative to DATA edge
1010 = 600° relative to DATA edge
1011 to 1111 = 660° relative to DATA edge
19
1A
1B
1C
21
user_patt1_lsb
user_patt1_msb
user_patt2_lsb
user_patt2_msb
serial_control
Bꢀ
B6
B14
B6
B5
B13
B5
B4
B12
B4
B3
B2
B1
B9
B1
B9
B0
B±
B0
B±
0x00
0x00
0x00
0x00
0x00
User-defined
pattern, 1 LSB.
B15
Bꢀ
B11
B3
B10
B2
User-defined
pattern, 1 MSB.
User-defined
pattern, 2 LSB.
B15
B14
X
B13
X
B12
X
B11
B10
User-defined
pattern, 2 MSB.
LSB first
1 = on
0 = off
<10
MSPS,
low
encode
rate
000 = 14 bits (default, normal bit
stream)
001 = ± bits
010 = 10 bits
011 = 12 bits
Serial stream
control. Default
causes MSB first
and the native
bit stream
(default)
mode
1 = on
0 = off
(default)
100 = 14 bits
(global).
22
serial_ch_stat
X
X
X
X
X
X
Channel
output
reset
Channel
power-
down
0x00
Used to power
down individual
sections of a
1 = on
0 = off
1 = on
0 = off
converter (local).
(default) (default)
Rev. 0 | Page 32 of 52
AD9259
Power and Ground Recommendations
Exposed Paddle Thermal Heat Slug Recommendations
When connecting power to the AD9259, it is recommended
that two separate 1.8 V supplies be used: one for analog (AVDD)
and one for digital (DRVDD). If only one supply is available, it
should be routed to the AVDD first and then tapped off and
isolated with a ferrite bead or a filter choke preceded by
decoupling capacitors for the DRVDD. The user can employ
several different decoupling capacitors to cover both high and
low frequencies. These should be located close to the point of
entry at the PC board level and close to the parts with minimal
trace length.
It is required that the exposed paddle on the underside of the
ADC is connected to analog ground (AGND) to achieve the
best electrical and thermal performance of the AD9259. An
exposed continuous copper plane on the PCB should mate to
the AD9259 exposed paddle, Pin 0. The copper plane should
have several vias to achieve the lowest possible resistive thermal
path for heat dissipation to flow through the bottom of the PCB.
These vias should be solder filled or plugged.
To maximize the coverage and adhesion between the ADC and
PCB, partition the continuous copper plane by overlaying a
silkscreen on the PCB into several uniform sections. This provides
several tie points between the two during the reflow process.
Using one continuous plane with no partitions only guarantees
one tie point between the ADC and PCB. See Figure 60 for a
PCB layout example. For detailed information on packaging
and the PCB layout of chip scale packages, see the AN-772
Application Note, “A Design and Manufacturing Guide for the
Lead Frame Chip Scale Package (LFCSP),” at www.analog.com.
A single PC board ground plane should be sufficient when
using the AD9259. With proper decoupling and smart parti-
tioning of the PC board’s analog, digital, and clock sections,
optimum performance is easily achieved.
SILKSCREEN PARTITION
PIN 1 INDICATOR
Figure 60. Typical PCB Layout
Rev. 0 | Page 33 of 52
AD9259
EVALUATION BOARD
each section. At least one 1.8 V supply is needed with a 1 A current
capability for AVDD_DUT and DRVDD_DUT; however, it is
recommended that separate supplies be used for both analog
and digital. To operate the evaluation board using the VGA
option, a separate 5.0 V analog supply is needed. The 5.0 V
supply, or AVDD_5 V, should have a 1 A current capability. To
operate the evaluation board using the SPI and alternate clock
options, a separate 3.3 V analog supply is needed in addition to
the other supplies. The 3.3 V supply, or AVDD_3.3 V, should
have a 1 A current capability as well.
The AD9259 evaluation board provides all of the support cir-
cuitry required to operate the ADC in its various modes and
configurations. The converter can be driven differentially through a
transformer (default) or through the AD8332 driver. The ADC
can also be driven in a single-ended fashion. Separate power pins
are provided to isolate the DUT from the AD8332 drive circuitry.
Each input configuration can be selected by proper connection
of various jumpers (see Figure 63 to Figure 67). Figure 61 shows
the typical bench characterization setup used to evaluate the ac
performance of the AD9259. It is critical that the signal sources
used for the analog input and clock have very low phase noise
(<1 ps rms jitter) to realize the optimum performance of the
converter. Proper filtering of the analog input signal to remove
harmonics and lower the integrated or broadband noise at the
input is also necessary to achieve the specified noise performance.
INPUT SIGNALS
When connecting the clock and analog source, use clean signal
generators with low phase noise, such as Rohde & Schwarz SMHU
or HP8644 signal generators or the equivalent. Use a 1 m, shielded,
RG-58, 50 Ω coaxial cable for making connections to the evalu-
ation board. Enter the desired frequency and amplitude from the
ADC specifications tables. Typically, most ADI evaluation boards
can accept ~2.8 V p-p or 13 dBm sine wave input for the clock.
When connecting the analog input source, it is recommended
to use a multipole, narrow-band, band-pass filter with 50 Ω
terminations. ADI uses TTE, Allen Avionics, and K&L types of
band-pass filters. The filter should be connected directly to the
evaluation board if possible.
See Figure 63 to Figure 71 for the complete schematics and
layout diagrams that demonstrate the routing and grounding
techniques that should be applied at the system level.
POWER SUPPLIES
This evaluation board comes with a wall-mountable switching
power supply that provides a 6 V, 2 A maximum output. Simply
connect the supply to the rated 100 V ac to 240 V ac wall outlet
at 47 Hz to 63 Hz. The other end is a 2.1 mm inner diameter
jack that connects to the PCB at P503. Once on the PC board,
the 6 V supply is fused and conditioned before connecting to
three low dropout linear regulators that supply the proper bias
to each of the various sections on the board.
OUTPUT SIGNALS
The default setup uses the HSC-ADC-FPGA high speed
deserialization board to deserialize the digital output data and
convert it to parallel CMOS. These two channels interface
directly with the ADI standard dual-channel FIFO data capture
board (HSC-ADC-EVALA-DC). Two of the four channels can
then be evaluated at the same time. For more information on
channel settings on these boards and their optional settings,
visit www.analog.com/FIFO.
When operating the evaluation board in a nondefault condition,
L504 to L507 can be removed to disconnect the switching
power supply. This enables the user to bias each section of the
board individually. Use P501 to connect a different supply for
WALL OUTLET
100V TO 240V AC
47Hz TO 63Hz
6V DC
2A MAX
5.0V
1.8V
1.8V
3.3V
3.3V
1.5V
3.3V
–
+
–
+
–
+
–
+
–
+
–
+
–
+
SWITCHING
POWER
SUPPLY
PC
RUNNING
ADC
ANALYZER
AND SPI
USER
ROHDE & SCHWARZ,
HSC-ADC-FPGA
HIGH SPEED
DESERIALIZATION
HSC-ADC-EVALA-DC
FIFO DATA
SMHU,
2V p-p SIGNAL
SYNTHESIZER
BAND-PASS
FILTER
XFMR
INPUT
CAPTURE
BOARD
AD9259
EVALUATION BOARD
BOARD
CHA TO CHD
14-BIT
SOFTWARE
2 CH
USB
CONNECTION
ROHDE & SCHWARZ,
SMHU,
14-BIT
PARALLEL
CMOS
CLK
SERIAL
LVDS
2V p-p SIGNAL
SYNTHESIZER
SPI
SPI
SPI
SPI
Figure 61. Evaluation Board Connection
Rev. 0 | Page 34 of 52
AD9259
50 Ω terminated and ac-coupled to handle single-ended
DEFAULT OPERATION AND JUMPER SELECTION
SETTINGS
sine wave types of inputs. The transformer converts the
single-ended input to a differential signal that is clipped
before entering the ADC clock inputs.
The following is a list of the default and optional settings or
modes allowed on the AD9259 Rev. A evaluation board.
A differential LVPECL clock can also be used to clock the
ADC input using the AD9515 (U202). Simply populate
R225 and R227 with 0 Ω resistors and remove R217 and
R218 to disconnect the default clock path inputs. In addition,
populate C207 and C208 with a 0.1 μF capacitor and remove
C210 and C211 to disconnect the default cloth path outputs.
The AD9515 has many pin-strappable options that are set
to a default working condition. Consult the AD9515 data
sheet for more information about these and other options.
•
•
POWER: Connect the switching power supply that is
supplied in the evaluation kit between a rated 100 V ac
to 240 V ac wall outlet at 47 Hz to 63 Hz and P503.
AIN: The evaluation board is set up for a transformer-
coupled analog input with optimum 50 Ω impedance
matching out to 200 MHz (see Figure 62). For more
bandwidth response, the differential capacitor across the
analog inputs can be changed or removed. The common
mode of the analog inputs is developed from the center
tap of the transformer or AVDD_DUT/2.
If using an oscillator, two oscillator footprint options are
also available (OSC201) to check the ADC performance.
J205 gives the user flexibility in using the enable pin, which
is common on most oscillators.
0
–2
–3dB CUTOFF = 200MHz
–4
–6
•
•
PDWN: To enable the power-down feature, simply short
J201 to the on position (AVDD) on the PDWN pin.
SCLK/DTP: To enable the digital test pattern
on the digital outputs of the ADC, use J204. If J204 is tied to
AVDD during device power-up, Test Pattern 10 0000 0000
0000 will be enabled. See the SCLK/DTP Pin section for
details.
–8
–10
–12
–14
–16
•
SDIO/ODM: To enable the low power, reduced signal option
similar to the IEEE 1595.3 reduced range link LVDS output
standard, use J203. If J203 is tied to AVDD during device
power-up, it enables the LVDS outputs in a low power,
reduced signal option from the default ANSI standard.
This option changes the signal swing from 350 mV p-p to
200 mV p-p, which reduces the power of the DRVDD supply.
See the SDIO/ODM Pin section for more details.
0
50
100 150 200 250 300 350 400 450 500
FREQUENCY (MHz)
Figure 62. Evaluation Board Full Power Bandwidth
•
VREF: VREF is set to 1.0 V by tying the SENSE pin to
ground, R237. This causes the ADC to operate in 2.0 V p-p
full-scale range. A separate external reference option using
the ADR510 or ADR520 is also included on the evaluation
board. Simply populate R231 and R235 and remove C214.
Proper use of the VREF options is noted in the Voltage
Reference section.
•
•
CSB: To enable the SPI information on the SDIO and
SCLK pins that is to be processed, simply tie J202 low in
the always enable mode. To ignore the SDIO and SCLK
information, tie J202 to AVDD.
•
•
RBIAS: RBIAS has a default setting of 10 kΩ (R201) to
ground and is used to set the ADC core bias current. To
further lower the core power (excluding the LVDS driver
supply), simply change the resistor setting. However, per-
formance of the ADC will degrade depending on the resistor
chosen. See the RBIAS Pin section for more information.
Non-SPI Mode: For users who wish to operate the DUT
without using SPI, simply remove the J202, J203, and J204
jumpers. This disconnects the CSB, SCLK/DTP, and SDIO/
OMD pins from the control bus, allowing the DUT to operate
in its simplest mode. Each of these pins has internal termi-
nation and will float to its respective level.
CLOCK: The default clock input circuitry is derived from a
simple transformer-coupled circuit using a high bandwidth
1:1 impedance ratio transformer (T201) that adds a very
low amount of jitter to the clock path. The clock input is
•
D+, D−: If an alternative data capture method to the setup
described in Figure 61 is used, optional receiver terminations,
R206 to R211, can be installed next to the high speed back-
plane connector.
Rev. 0 | Page 35 of 52
AD9259
ALTERNATIVE ANALOG INPUT DRIVE
CONFIGURATION
•
•
•
Remove R102, R115, R128, R141, T101, T102, T103, and
T104 in the default analog input path.
The following is a brief description of the alternative analog
input drive configuration using the AD8332 dual VGA. If this
particular drive option is in use, some components may need to
be populated, in which case all the necessary components are
listed in Table 16. For more details on the AD8332 dual VGA,
including how it works and its optional pin settings, consult the
AD8332 data sheet.
Populate R101, R114, R127, and R140 with 0 Ω resistors in
the analog input path.
Populate R106, R107, R119, R120, R132, R133, R144, and
R145 with 10 kΩ resistors to provide an input common-
mode level to the analog input.
•
Populate R105, R113, R118, R124, R131, R137, R151, and
R160 with 0 Ω resistors in the analog input path.
To configure the analog input to drive the VGA instead of the
default transformer option, the following components need to
be removed and/or changed.
Currently, L301 to L308 and L401 to L408 are populated with 0 Ω
resistors to allow signal connection. This area allows the user to
design a filter if additional requirements are necessary.
Rev. 0 | Page 36 of 52
AD9259
AVDD_DUT
R105
DNP
R152
DNP
CH_A
C101
FB102 R108
R104
0ꢀ
P102
DNP
T101
0.1µF
10ꢀ 33ꢀ
VGA INPUT CONNECTION
INH1
1
6
VIN_A
AIN
R106
DNP
CHANNEL A
P101
R101
DNP
R161
2
3
5
4
R109
1kꢀ
C103
C104
2.2pF
CM1
CM1
499ꢀ
DNP
AIN
R107
DNP
R113
DNP
FB101
10ꢀ
R103
0ꢀ
C102
0.1µF
R102
64.9ꢀ
VIN_A
CH_A
CM1
FB103 R110
C105
DNP
R156
DNP
10ꢀ
33ꢀ
E101
AVDD_DUT
C106
DNP
R111
1kꢀ
C107
0.1µF
R112
1kꢀ
AVDD_DUT
AVDD_DUT
R118
DNP
VGA INPUT CONNECTION
INH2
R153
DNP
CH_B
CHANNEL B
P103
FB105 R121
R114
DNP
T102
10ꢀ 33ꢀ
1
6
AIN
VIN_B
FB104
10ꢀ
R119
DNP
R115
64.9ꢀ
C108
0.1µF
R162
2
3
5
4
R123
1kꢀ
P104
DNP
C110
C111
2.2pF
CM2
CM2
499ꢀ
DNP
R120
DNP
R124
DNP
R116
0ꢀ
AIN
C109
0.1µF
E102
VIN_B
CH_B
CM2
R117
0ꢀ
FB106 R122
C112
DNP
R157
DNP
10ꢀ
33ꢀ
AVDD_DUT
C113
DNP
R125
1kꢀ
C114
0.1µF
R126
1kꢀ
AVDD_DUT
AVDD_DUT
R131
DNP
R154
DNP
CH_C
C115
FB108 R134
P106
DNP
R130
0ꢀ
T103
0.1µF
10ꢀ 33ꢀ
VGA INPUT CONNECTION
INH3
1
6
VIN_C
AIN
R132
DNP
CHANNEL C
P105
R127
DNP
R163
2
3
5
4
R135
1kꢀ
C117
C118
2.2pF
CM3
CM3
499ꢀ
DNP
AIN
R133
DNP
R137
DNP
FB107
10ꢀ
R129
0ꢀ
C116
0.1µF
R128
64.9ꢀ
VIN_C
CH_C
CM3
FB109 R136
C119
DNP
R158
DNP
10ꢀ
33ꢀ
E103
AVDD_DUT
C120
DNP
R138
1kꢀ
C121
0.1µF
R139
1kꢀ
AVDD_DUT
AVDD_DUT
R151
DNP
VGA INPUT CONNECTION
INH4
R155
DNP
CH_D
CHANNEL D
P107
FB111 R146
R140
DNP
T104
10ꢀ 33ꢀ
1
6
AIN
VIN_D
FB110
R144
DNP
R141
64.9ꢀ
C122
10ꢀ
0.1µF
R164
499ꢀ
2
3
5
4
R148
1kꢀ
C124
DNP
C125
CM4
P108
CM4
2.2pF
DNP
R145
DNP
R160
DNP
R143
0ꢀ
AIN
C123
0.1µF
R142
VIN_D
CH_D
CM4
0ꢀ
FB112 R147
C126
DNP
R159
DNP
10ꢀ
33ꢀ
E104
AVDD_DUT
C127
DNP
R149
1kꢀ
C128
0.1µF
R150
1kꢀ
AVDD_DUT
DNP: DO NOT POPULATE
Figure 63. Evaluation Board Schematic, DUT Analog Inputs
Rev. 0 | Page 3ꢀ of 52
AD9259
AVDD_DUT
CW
S 0
S 1
S 2
S 3
S 4
S 5
S 6
S 7
S 8
2 5
1 6
1 5
1 4
1 3
1 2
1 1
1 0
2
2
2
2
1
2
ꢀ k 1 0
3 3
3 1
1
2 0 R 5
3
D
G N
V S
T E R S
GND
ꢀ 0 k 1 0
2 0 R 4
P N D - ꢀ k 1 0 0
7
R 2 6
9
P N D - ꢀ k 1 0 0
R 2 6
ꢀ 0 k 1 0
2 0 R 3
S 9
8
6
0
S 1
3 2
7
F E V R
6
B – V I N
+ B N V I
B _ V I N
B _ N V I
3 7
3 8
3 9
4 0
D C O
D C O
+ O D C
2 4
– O D C
O + F C
2 3
2 2
2 1
2 0
1 9
1 8
1 7
1 6
1 5
1 4
1 3
D D A V
T
D _ U D D A V
O
O
A
A
B
B
C
C
F C
F C
C H
C H
C H
C H
C H
C H
A S R B I
S E S E N
E F V R
O – F C
T U D S E _ V S E N
4 1
A
A
B
B
C
C
D
D
D +
D –
D +
D –
D +
D –
D +
D –
T U D _ E F V R
4 2
4 3
4 4
4 5
4 6
4 7
4 8
B F R E
T F R E
D D A V
D D A V
1
T
T
D _ U D D A V
D _ U D D A V
+ C N V I
C _ N V I
D
D
C H
C H
C _ V I N
C – V I N
Figure 64. Evaluation Board Schematic, DUT, VREF, Clock Inputs, and Digital Output Interface
Rev. 0 | Page 3± of 52
AD9259
POPULATE L301 TO L308 WITH
0ꢀ RESISTORS OR DESIGN
YOUR OWN FILTER.
R301
DNP
R302
DNP
EXTERNAL VARIABLE GAIN DRIVE
VG
C302
DNP
C301
DNP
VARIABLE GAIN CIRCUIT
L301
0ꢀ
L302 L303
L304
0ꢀ
(0V TO 1.0V DC)
VG
0ꢀ
0ꢀ
GND
CW
AVDD_5V
C303
C304
L307
0ꢀ
L306
0ꢀ
L305 DNP
DNP L308
R320
39kꢀ
R319
10kꢀ
0ꢀ
0ꢀ
R303
DNP
R304
DNP
C305
0.1µF
C306 C307
0.1µF 0.1µF
C308
0.1µF
R306
374ꢀ
R305
374ꢀ
R311
C309
1000pF
10kꢀ
DNP
C310
0.1µF
R307
187ꢀ
R308
187ꢀ
R309
187ꢀ
R310
187ꢀ
R312
10kꢀ
U301
25
R313
10kꢀ
DNP
R314
ENBV
ENBL
HILO
VCM1
VIN1
VIP1
COM1
LOP1
RCLMP
16
26
27
28
29
30
31
32
10kꢀ
VG
GAIN
MODE
VCM2
VIN2
VIP2
COM2
LOP2
15
14
13
12
11
10
9
DNP
AD8332
C311
0.1µF
C313
0.1µF
C312
0.1µF
C314
0.1µF
R316
C320
0.1µF
R317
274ꢀ
C321
0.1µF
274ꢀ
R315 C315
10kꢀ 10µF
C316
0.1µF
C325
0.1µF
C326
10µF
R318
10kꢀ
C317
0.018µF
C322
0.018µF
C318
22pF
C323
22pF
L309
120nH
L310
120nH
C319
0.1µF
C324
0.1µF
DNP: DO NOT POPULATE
INH4
INH3
Figure 65. Evaluation Board Schematic, Optional DUT Analog Input Drive
Rev. 0 | Page 39 of 52
AD9259
A H C _ O S D
ꢀ 0
4 2 R 7
A H C _ I S D
C H K A _ C S L
ꢀ 0
4 2 R 0
ꢀ 0
4 2 R 8
_ C B H 1 A C S
ꢀ 0
4 2 R 6
J401
PICVCC
1
2
PICVCC
GP1
GP0
3
5
4
6
GP1
GP0
MCLR/GP3
7
9
8
10
MCLR/GP3
ꢀ 5 7 k 4 .
R 4 1 8
OPTIONAL
PIC PROGRAMMING HEADER
V m 5 7
H = ± N I P = O L I H
V 0 . V 5 - 5 2 . 2 = P E O S L N I A
V 0 . 1 O T V 0 = P E O S L N I A
V I E T G A E G N
V I E T G S I P O
N P I E D M O
V m 0 5 ± = L O = N I P L I O H
N I P P M A L R C
D D _ 5 V A V
R E . T L I F N W O U R O Y
N G E S D I R O S R O S T E S R I ꢀ 0
T I H W 8 0 L 4 T O 1 0 L 4 T E L A U P O P
C H _ A
F µ 0 1 0 8 .
2 7 4
ꢀ
2 0 C 4
6
R 4 1
2 N L O
8
M M C O
2 H V O
2 L V O
1 7
1 8
1 9
V P S 2
7
5 V D D A _ V
2 H I N
6
C H _ A
C H _ B
N C
2 0
2 D L M
5
1 D L M
4
V P S V
1 L V O
D D _ 5 V A V
2 1
2 2
1 H I N
3
2
1 N L O
1
1 H V O
M M C O
2 3
2 4
V P S 1
5 V D D A _ V
C H _ B
) R E W O E L P B A S I D V 1 = O V 0 ( T
E L B A N N W E O R E D W O P
D D _ 5 V A V
0 V 1 . O T 0 V = E N G R A N A I G O L
0 . V 5 - V 2 5 2 . = E G N R A N I A I G H
N I P O L H I
B
A N A D S L N E H C A N R O F T U I R C C I E V I D A G V L A O I N T O P
Figure 66. Evaluation Board Schematic, Optional DUT Analog Input Drive and SPI Interface (Continued)
Rev. 0 | Page 40 of 52
AD9259
D
G N
D
G N
1
1
D
G N
D
G N
1
1
Figure 67. Evaluation Board Schematic, Power Supply Inputs
Rev. 0 | Page 41 of 52
AD9259
Figure 68. Evaluation Board Layout, Primary Side
Rev. 0 | Page 42 of 52
AD9259
Figure 69. Evaluation Board Layout, Ground Plane
Rev. 0 | Page 43 of 52
AD9259
Figure 70. Evaluation Board Layout, Power Plane
Rev. 0 | Page 44 of 52
AD9259
Figure 71. Evaluation Board Layout, Secondary Side (Mirrored Image)
Rev. 0 | Page 45 of 52
AD9259
Table 16. Evaluation Board Bill of Materials (BOM)
Qnty.
per
Board REFDES
Item
Device
PCB
Capacitor
Pkg.
PCB
402
Value
Mfg.
Mfg. Part Number
1
2
1
ꢀ5
AD9259LFCSP_REVA
PCB
0.1 μF, ceramic,
C101, C102, C10ꢀ,
C10±, C109, C114,
C115, C116, C121,
C122, C123, C12±,
C201, C203, C204,
C205, C206, C210,
C211, C212, C213,
C216, C21ꢀ, C21±,
C219, C220, C221,
C222, C223, C224,
C310, C311, C312,
C313, C314, C316,
C319, C320, C321,
C324, C325, C409,
C410, C412, C414,
C416, C41ꢀ, C419,
C422, C423, C424,
C425, C42ꢀ, C42±,
C429, C503, C505,
C50ꢀ, C509, C516,
C51ꢀ, C51±, C519,
C520, C521, C522,
C523, C524, C525,
C526, C52ꢀ, C52±,
C529, C530, C531
Panasonic
ECJ-0EB1A104K
X5R, 10 V, 10% tol
3
4
C104, C111, C11±,
C125
Capacitor
402
2.2 pF, ceramic,
COG, 0.25 pF tol,
50 V
Murata
GRM1555C1H2R2GZ01B
4
4
1
2
4
4
1
9
C315, C326, C413,
C426
C202
Capacitor
Capacitor
Capacitor
Capacitor
Capacitor
Capacitor
Capacitor
±05
603
402
402
402
1206
603
10 μF, 6.3 V ±10%
ceramic, X5R
2.2 μF, ceramic,
X5R, 6.3 V, 10% tol
1000 pF, ceramic,
XꢀR, 25 V, 10% tol
0.01± μF, ceramic,
XꢀR, 16 V, 10% tol
22 pF, ceramic,
NPO, 5% tol, 50 V
10 μF, tantalum,
16 V, 20% tol
AVX
0±056D106KAT2A
ECJ-1VB0J225K
5
Panasonic
Kemet
AVX
6
C309, C411
C0402C102K3RACTU
0402YC1±3KAT2A
C0402C220J5GACTU
TCA1C106M±R
ꢀ
C31ꢀ, C322, C415,
C420
C31±, C323, C41±,
C421
±
Kemet
Rohm
9
C501
10
C214, C512, C513,
C514, C515, C532,
C533, C534, C535
1 μF, ceramic, X5R, Panasonic
6.3 V, 10% tol
ECJ-1VB0J105K
11
±
C305, C306, C30ꢀ,
C30±, C405, C406,
C40ꢀ, C40±
Capacitor
±05
0.1 μF, ceramic,
XꢀR, 50 V, 10% tol
AVX
0±055C104KAT2A
12
13
14
15
16
4
1
2
1
1
C502, C504, C506,
C50±
CR201
Capacitor
Diode
LED
603
10 μF, ceramic,
X5R, 6.3 V, 20% tol
30 V, 20 mA, dual
Schottky
Green, 4 V, 5 m
candela
Panasonic
ECJ-1VB0J106M
HSMS2±12
LNJ306G±TRA
SK33MSCT
S2A
SOT-23
603
Agilent
Technologies
Panasonic
CR401, CR501
D502
Diode
Diode
DO-214AB 3 A, 30 V, SMC
DO-214AA 2 A, 50 V, SMC
Micro
Commercial Co.
Micro
D501
Commercial Co.
Rev. 0 | Page 46 of 52
AD9259
Qnty.
per
Item
Board REFDES
Device
Pkg.
Value
Mfg.
Mfg. Part Number
1ꢀ
1
F501
Fuse
1210
6.0 V, 2.2 A trip-
current resettable
fuse
Tyco/Raychem NANOSMDC110F-2
1±
19
1
FER501
Choke Coil
2020
603
10 μH, 5 A, 50 V,
190 Ω @ 100 MHz
10 Ω, test freq
100 MHz, 25% tol,
500 mA
Murata
Murata
DLW5BSN191SQ2L
BLM1±BA100SN1
12
FB101, FB102, FB103,
FB104, FB105, FB106,
FB10ꢀ, FB10±, FB109,
FB110, FB111, FB112
Ferrite bead
20
21
22
1
2
1
JP301
Connector
Connector
Connector
2-pin
3-pin
12-pin
100 mil header
jumper, 2-pin
100 mil header
jumper, 3-pin
100 mil header
male, 4 × 3 triple
row straight
Samtec
Samtec
Samtec
TSW-102-0ꢀ-G-S
TSW-103-0ꢀ-G-S
TSW-104-0±-G-T
J205, J402
J201 to J204
23
24
25
26
1
J401
Connector
10-pin
1210
402
100 mil header,
male, 2 × 5 double
row straight
10 μH, bead core
3.2 × 2.5 × 1.6
SMD, 2 A
120 nH, test freq
100 MHz, 5% tol,
150 mA
Samtec
TSW-105-0±-G-D
±
L501, L502, L503, L504, Ferrite bead
L505, L506, L50ꢀ, L50±
Panasonic-ECG EXC-CL3225U1
4
L309, L310, L409, L410 Inductor
Murata
LQG15HNR12J02B
ERJ-6GEY0R00V
16
L301, L302, L303, L304, Resistor
L305, L306, L30ꢀ, L30±,
±05
0 Ω, 1/± W, 5% tol
Panasonic
L401, L402, L403, L404,
L405, L406, L40ꢀ, L40±
2ꢀ
2±
1
5
OSC201
Oscillator
SMT
SMA
Clock oscillator,
50.00 MHz, 3.3 V
Side-mount SMA
for 0.063" board
thickness
CTS REEVES
CB3LV-3C-50M0000-T
142-0ꢀ11-±21
P101, P103, P105,
P10ꢀ, P201
Connector
Johnson
Components
29
1
P202
Connector
HEADER
1469169-1, right
angle 2-pair,
25 mm, header
assembly
Tyco
1469169-1
30
31
1
P503
Connector
Resistor
0.1", PCMT RAPCꢀ22, power
supply connector
Switchcraft
Panasonic
SC1153
15
R201, R205, R214,
R215, R221, R239,
R312, R315, R31±,
R411, R414, R41ꢀ,
R425, R429, R430
402
10 kΩ, 1/16 W,
5% tol
ERJ-2GEJ103X
32
14
R103, R11ꢀ, R129,
R142, R216, R21ꢀ,
R21±, R223, R224,
R23ꢀ, R420, R426,
R42ꢀ, R42±
Resistor
402
0 Ω, 1/16 W,
5% tol
Panasonic
ERJ-2GE0R00X
33
34
4
4
R102, R115, R12±,
R141
R104, R116, R130,
R143
Resistor
Resistor
402
603
64.9 Ω, 1/16 W,
1% tol
0 Ω, 1/10 W,
5% tol
Panasonic
Panasonic
ERJ-2RKF64R9X
ERJ-3GEY0R00V
Rev. 0 | Page 4ꢀ of 52
AD9259
Qnty.
per
Item
Board REFDES
Device
Pkg.
Value
Mfg.
Mfg. Part Number
35
15
R109, R111, R112,
Resistor
402
1 kΩ, 1/16 W,
1% tol
Panasonic
ERJ-2RKF1001X
R123, R125, R126,
R135, R13±, R139,
R14±, R149, R150,
R431, R432, R433
36
±
R10±, R110, R121,
R122, R134, R136,
R146, R14ꢀ
Resistor
402
33 Ω, 1/16 W, 5%
tol
Panasonic
ERJ-2GEJ330X
3ꢀ
3±
39
40
41
42
4
3
1
1
1
2
R161, R162, R163,
R164
R202, R203, R204
Resistor
402
499 Ω, 1/16 W,
1% tol
100 kΩ, 1/16 W,
1% tol
4.02 kΩ, 1/16 W,
1% tol
49.9 Ω, 1/16 W,
0.5% tol
4.99 kΩ, 1/16 W,
5% tol
10 kΩ, Cermet
trimmer
Panasonic
Panasonic
Panasonic
Susumu
ERJ-2RKF4990X
ERJ-2RKF1003X
ERJ-2RKF4021X
RR0510R-49R9-D
ERJ-2RKF4991X
CT-94W-103
Resistor
402
R222
Resistor
402
R213
Resistor
402
R229
Resistor
402
Panasonic
R230, R319
Potentiometer
3-lead
BC
Components
potentiometer,
1± turn top adjust,
10%, 1/2 W
43
44
45
1
1
±
R22±
R320
Resistor
Resistor
Resistor
402
402
402
4ꢀ0 kΩ, 1/16 W,
5% tol
39 kΩ, 1/16 W,
5% tol
1±ꢀ Ω, 1/16 W,
1% tol
Yageo America 9C04021A4ꢀ03JLHF3
Susumu
RR0510P-393-D
ERJ-2RKF1±ꢀ0X
R30ꢀ, R30±, R309,
R310, R40ꢀ, R40±,
R409, R410
Panasonic
46
4ꢀ
4±
4
R305, R306, R405,
R406
R316, R31ꢀ, R415,
R416
R245, R24ꢀ, R249,
R251, R253, R255,
R25ꢀ, R259, R261,
R263, R265
Resistor
Resistor
Resistor
402
402
201
3ꢀ4 Ω, 1/16 W,
1% tol
2ꢀ4 Ω, 1/16 W,
1% tol
Panasonic
Panasonic
Panasonic
ERJ-2RKF3ꢀ40X
ERJ-2RKF2ꢀ40X
ERJ-1GE0R00C
4
11
0 Ω, 1/20 W, 5% tol
49
50
51
52
53
54
55
4
1
1
2
2
1
5
R41±
Resistor
Resistor
Resistor
Resistor
Resistor
Switch
402
4.ꢀ5 kΩ, 1/16 W,
1% tol
261 Ω, 1/16 W,
1% tol
261 Ω, 1/16 W,
1% tol
243 Ω, 1/16 W,
1% tol
100 Ω, 1/16 W,
1% tol
LIGHT TOUCH,
100GE, 5 mm
ADT1-1WT, 1:1
impedance ratio
transformer
Panasonic
Panasonic
Panasonic
Panasonic
Panasonic
Panasonic
Mini-Circuits
ERJ-2RKF4ꢀ51X
ERJ-2RKF2610X
ERJ-3EKF2610V
ERJ-2RKF2430X
ERJ-2RKF1000X
EVQ-PLDA15
R419
402
R501
603
R240, R241
R242, R243
S401
402
402
SMD
CD542
T101, T102, T103, T104, Transformer
T201
ADT1-1WT
56
2
U501, U503
IC
SOT-223
ADP33339AKC-1.±, ADI
1.5 A, 1.± V LDO
regulator
ADP33339AKC-1.±
Rev. 0 | Page 4± of 52
AD9259
Qnty.
per
Item
Board REFDES
Device
Pkg.
Value
Mfg.
Mfg. Part Number
5ꢀ
2
U301, U401
IC
LFCSP,
CP-32
AD±332ACP,
ultralow noise
precision dual
VGA
ADI
AD±332ACP
5±
59
60
1
1
1
U504
U502
U201
IC
IC
IC
SOT-223
SOT-223
LFCSP,
ADP33339AKC-5
ADP33339AKC-3.3 ADI
AD9259-50, quad,
14-bit, 50 MSPS
serial LVDS 1.± V
ADC
ADI
ADP33339AKC-5
ADP33339AKC-3.3
AD9259BCPZ-50
ADI
CP-4±-1
61
1
U203
IC
SOT-23
ADR510AR, 1.0 V,
precision low
ADI
ADR510AR
noise shunt
voltage reference
62
63
64
65
1
1
1
1
U202
U403
U404
U402
IC
IC
IC
IC
LFCSP
CP-32-2
SCꢀ0,
MAA06A
SCꢀ0,
MAA06A
±-SOIC
AD9515
ADI
AD9515BCPZ
NCꢀWZ0ꢀP6X
NCꢀWZ16P6X
PIC12F629-I/SN
NCꢀWZ0ꢀ
NCꢀWZ16
Fairchild
Fairchild
Microchip
Flash prog
mem 1kx14,
RAM size 64 × ±,
20 MHz speed,
PIC12F controller
series
Rev. 0 | Page 49 of 52
AD9259
OUTLINE DIMENSIONS
0.30
0.23
0.18
7.00
BSC SQ
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
37
36
48
1
PIN 1
INDICATOR
EXPOSED
5.25
5.10 SQ
4.95
TOP
VIEW
6.75
BSC SQ
PAD
(BOTTOM VIEW)
0.50
0.40
0.30
25
24
12
13
0.25 MIN
5.50
REF
0.80 MAX
0.65 TYP
1.00
0.85
0.80
12° MAX
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.50 BSC
0.20 REF
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2
Figure 72. 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
7 mm × 7 mm Body, Very Thin Quad
(CP-48-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD9259BCPZ-501
AD9259BCPZRL-501
AD9259-50EB
Temperature Range
−40°C to +±5°C
−40°C to +±5°C
Package Description
4±-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4±-Lead Lead Frame Chip Scale Package [LFCSP_VQ] Tape and Reel
Evaluation Board
Package Option
CP-4±-1
CP-4±-1
1 Z = Pb-free part.
Rev. 0 | Page 50 of 52
AD9259
NOTES
Rev. 0 | Page 51 of 52
AD9259
NOTES
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05965–0–6/06(0)
Rev. 0 | Page 52 of 52
相关型号:
AD9259BCPZRL7-50
IC 4-CH 14-BIT FLASH METHOD ADC, SERIAL ACCESS, QCC48, 7 X 7 MM, ROHS COMPLIANT, MO-220VKKD-2, LFCSP-48, Analog to Digital Converter
ADI
AD9260ASZ
1-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP44, LEAD FREE, MS-022AB, MQFP-44
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