AD8452-EVALZ [ADI]
Precision Integrated Analog Front End, Controller;
| 型号： | AD8452-EVALZ |
| 厂家： | 
ADI |
| 描述： | Precision Integrated Analog Front End, Controller |
| 文件： | 总35页 (文件大小：743K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Precision Integrated Analog Front End, Controller,
and PWM for Battery Test and Formation Systems
Data Sheet
AD8452
FEATURES
GENERAL DESCRIPTION
CC and CV battery test and formation modes with
The AD8452 combines a precision analog front-end controller
transparent and automatic switchover, for systems of
20 Ah or less
Precise measurement of voltage and current
Independent feedback control blocks
Highly accurate, factory trimmed instrumentation and
differential amplifiers
In-amp for current sense gain: 66 V/V
Difference amplifier for voltage sense gain: 0.4 V/V
Stable over temperature: offset voltage drift <0.6 μV/°C
(maximum)
and switch mode power supply (SMPS), pulse-width modulator
(PWM) driver into a single silicon platform for high volume
battery testing and formation manufacturing. A precision
instrumentation amplifier (in-amp) measures the battery charge/
discharge current to better than ±±.ꢀ1 accuracy, while an equally
accurate difference amplifier measures the battery voltage.
Internal laser trimmed resistor networks establish the in-amp
and difference amplifier gains (66 V/V and ±.4 V/V, respectively),
and stabilize the AD8452 performance across the rated
operating temperature range.
Gain drift: <3 ppm/°C (maximum)
Desired battery cycling current and voltage levels are established
by applying precise control voltages to the ISET and VSET
inputs. Actual charge and discharge current levels are sensed
(usually by a high power, highly accurate shunt resistor) whose
value is carefully selected according to system parameters.
Switching between constant current (CC) and constant voltage
(CV) loop integration is instantaneous, automatic, and completely
transparent to the observer. A logic high at the MODE input
selects the charge or discharge mode (high for charge, low for
discharge).
Current sense CMRR: 120 dB minimum
Popular SMPS control for charge/discharge
High PWM linearity with internal ramp voltage
50 kHz to 300 kHz user controlled switching frequency
Synchronization output or input with adjustable phase shift
Programmable soft start
APPLICATIONS
Battery formation and testing
High efficiency battery test systems with recycle capability
Battery conditioning (charging and discharging) systems
The AD8452 simplifies designs by providing excellent
performance, functionality, and overall reliability in a space
saving 48-lead, 7 mm × 7 mm × ꢀ.4 mm LQFP package rated
for operation at temperatures from −4±°C to +85°C.
FUNCTIONAL BLOCK DIAGRAM
LOOP
COMP (×4)
SYSTEM CONTROL
VCL
+DCBUS
VIN
SYNC
SCFG
CC FILTER
AMPLIFIER
VCL
DH
MODE
MOSFET
DRIVER
VBAT
IBAT
DL
SELECT
DIFF IN-AMP
AMP
SS
PWM
×1
CV FILTER
AMPLIFIER
CLVT
DT
ISREFH/
ISREFL
BVREFH/
BVREFL
FREQ
DMAX
VREF
0.4×
BV
66×
AD8452
FAULT
DGND
ISV
Figure 1.
Rev. 0
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AD8452* PRODUCT PAGE QUICK LINKS
Last Content Update: 11/03/2017
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DESIGN RESOURCES
• AD8452 Material Declaration
• PCN-PDN Information
• Quality And Reliability
• Symbols and Footprints
EVALUATION KITS
• AD8452 Evaluation Board
DOCUMENTATION
Data Sheet
DISCUSSIONS
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• AD8452: Precision Integrated Analog Front End,
Controller, and PWM for Battery Test and Formation
Systems Data Sheet
SAMPLE AND BUY
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User Guides
• UG-1180: Universal Evaluation Board for the AD8452
• UG-1181: AD8452 System Demo Evaluation Board
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AD8452
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Shutdown..................................................................................... 24
Undervoltage Lockout (UVLO) ............................................... 24
Soft Start ...................................................................................... 24
PWM Drive Signals.................................................................... 25
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Analog Front-End and Controller Specifications .................... 3
Pulse-Width Modulator Specifications ..................................... 5
Digital Interface Specifications................................................... 6
Power Supply................................................................................. 7
Temperature Range Specifications............................................. 7
Absolute Maximum Ratings............................................................ 8
Thermal Resistance ...................................................................... 8
ESD Caution.................................................................................. 8
Pin Configuration and Function Descriptions............................. 9
Typical Performance Characteristics ........................................... 11
In-Amp Characteristics ............................................................. 11
Difference Amplifier Characteristics....................................... 12
Peak Current Protection and Diode Emulation
(Synchronous)............................................................................. 25
Frequency and Phase Control .................................................. 26
Maximum Duty Cycle ............................................................... 26
Fault Input................................................................................... 27
Thermal Shutdown (TSD) ........................................................ 27
Applications Information.............................................................. 28
Analog Controller ...................................................................... 28
Functional Description.............................................................. 28
Power Supply Connections ....................................................... 29
Current Sense In-Amp Connections....................................... 29
Voltage Sense Differential Amplifier Connections................ 29
Battery Current and Voltage Control Inputs
(ISET and VSET)........................................................................ 29
Loop Filter Amplifiers ............................................................... 30
Selecting Charge or Discharge Options .................................. 30
Select RCL and RCLVT for the Peak Current Limit .................. 30
CC and CV Loop Filter Amplifiers and VSET Buffer (except
where Noted)............................................................................... 13
Reference Characteristics .......................................................... 15
Pulse-Width Modulator............................................................. 16
Theory of Operation ...................................................................... 18
Introduction................................................................................ 18
Instrumentation Amplifier (In-Amp) ..................................... 19
Difference Amplifier .................................................................. 20
CC and CV Loop Filter Amplifiers.......................................... 20
Charge and Discharge Control................................................. 23
Input and Output Supply Pins .................................................. 23
Setting the Operating Frequency and Programming the
Synchonization Pin .................................................................... 31
Programming the Maximum Duty Cycle ............................... 32
Selecting CSS ................................................................................ 33
Additional Information ............................................................. 33
Outline Dimensions....................................................................... 34
Ordering Guide .......................................................................... 34
REVISION HISTORY
10/2017—Revision 0: Initial Version
Rev. 0 | Page 2 of 34
Data Sheet
AD8452
SPECIFICATIONS
AVCC = 15 V, AVEE = −15 V, VIN = 24 V, and TA = 25°C, unless otherwise noted.
ANALOG FRONT-END AND CONTROLLER SPECIFICATIONS
Table 1.
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
CURRENT SENSE INSTRUMENTATION
AMPLIFIER
Gain
66
V/V
%
ppm/°C
µV
µV/°C
nA
Gain Error
Gain Drift
Offset Voltage Referred to Input (RTI)
Offset Voltage Drift
Input Bias Current
VISMEA = 10 V
TA = TMIN to TMAX
ISREFH pin and ISREFL pin grounded
TA = TMIN to TMAX
0.1
3
+100
+0.6
30
−100
−0.6
−0.1
15
Input Common-Mode Voltage Range
Differential Input Impedance
Common-Mode Input Impedance
Output Voltage Swing
Reference Input Voltage Range
Reference Bias Current
Output Voltage Level Shift
Maximum
VISVP − VISVN = 0 V
AVEE + 2.3
AVCC − 2.4
V
150
150
GΩ
GΩ
V
V
µA
RL = 10 kΩ
ISREFH pin and ISREFL pin tied together
VISVP = VISVN = 0 V
ISREFL pin grounded
ISREFH pin connected to VREF pin
VISMEA/VISREFH
AVEE + 1.5
AVEE + 1.5
AVCC − 1.2
AVCC − 1.5
5
11
4.4
12.5
5
40
14
5.6
mV
mV/V
mA
Scale Factor
Short-Circuit Current
Common-Mode Rejection Ratio (CMRR) ΔVCM = 20 V
120
122
dB
µV/V/°C
dB
kHz
V/µs
Temperature Coefficient
Power Supply Rejection Ratio (PSRR)
Small Signal −3 dB Bandwidth
Slew Rate
TA = TMIN to TMAX
ΔVS = 10 V
0.01
140
675
5
ΔVISMEA = 10 V
VOLTAGE SENSE DIFFERENCE AMPLIFIER
Gain
0.4
V/V
%
ppm/°C
µV
µV/°C
V
Gain Error
Gain Drift
VIN = 10 V
TA = TMIN to TMAX
0.1
3
+250
+2
+17
+40
Offset Voltage Referred to Output (RTO) BVREFH pin and BVREFL pin grounded
−250
−2
−17
−40
Offset Voltage Drift
Differential Input Voltage Range
Input Common-Mode Voltage Range
Differential Input Impedance
Input Common-Mode Impedance
Output Voltage Swing
Reference Input Voltage Range
Output Voltage Level Shift
Maximum
Scale Factor
Short-Circuit Current
CMRR
Temperature Coefficient
PSRR
Small Signal −3 dB Bandwidth
Slew Rate
TA = TMIN to TMAX
VBVN = 0 V, VBVREFL = 0 V
VBVMEA = 0 V
−0.1
400
140
kΩ
kΩ
V
RL = 10 kΩ
AVEE + 1.5
AVEE + 1.5
AVCC − 1.2
AVCC − 1.5
BVREFH pin and BVREFL pin connected
BVREFL pin grounded
BVREFH pin connected to VREF pin
VBVMEA/VBVREFH
V
11.0
4.4
12.5
5
40
14.0
5.6
mV
mV/V
mA
dB
µV/V/°C
dB
ΔVCM = 10 V, RTO
TA = TMIN to TMAX
ΔVS = 10 V, RTO
90
0.05
114
123
3.0
0.9
MHz
V/µs
ΔVBVMEA = 10 V
Rev. 0 | Page 3 of 34
AD8452
Data Sheet
Parameter
Test Conditions/Comments
TA = TMIN to TMAX
Min
Typ
Max
Unit
CC AND CV LOOP FILTER AMPLIFIERS
Offset Voltage
Offset Voltage Drift
Input Bias Current
150
1
+5
µV
µV/°C
nA
−1
−5
+0.02
Input Common-Mode Voltage Range
Output Voltage Swing
Source Short-Circuit Current
Sink Short-Circuit Current
PSRR
Small Signal Gain Bandwidth Product
Slew Rate
CC to CV Transition Time
VSET VOLTAGE BUFFER
Nominal Gain
AVEE + 1.5
AVEE + 1.5
AVCC − 1.8
5
V
V
VVINT voltage range
1
mA
mA
dB
MHz
V/μs
µs
40
122
3
1
1.8
ΔVS = 10 V
113
ΔVVINT = 10 V
1
V/V
µV
Offset Voltage
150
Offset Voltage Drift
Input Bias Current
TA = TMIN to TMAX
−1
−5
+0.06
+1
+5
µV/°C
nA
Input/Output Voltage Range
Short-Circuit Current
PSRR
Small Signal −3 dB Bandwidth
Slew Rate
AVEE + 1.5
AVCC − 1.8
V
mA
dB
MHz
V/μs
40
122
4
ΔVS = 10 V
113
ΔVVSETBF = 10 V
With respect to AGND
1
VOLTAGE REFERENCE
Nominal Output Voltage
Output Voltage Error
Temperature Drift
Line Regulation
Load Regulation
2.5
V
%
1
16
10
TA = TMIN to TMAX
ΔVS = 10 V
ΔIVREF = 1 mA (source only)
ppm/°C
ppm/V
ppm/mA
mA
300
Source Short-Circuit Current
15
Rev. 0 | Page 4 of 34
Data Sheet
AD8452
PULSE-WIDTH MODULATOR SPECIFICATIONS
Table 2.
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
SOFT START (SS)
SS Pin Current
VSS = 0 V
4
5
6
0.65
µA
V
V
SS Threshold Rising
SS Threshold Falling
End of Soft Start
PWM CONTROL
Frequency
Switching enable threshold
Switching disable threshold
Asynchronous to synchronous threshold
0.52
0.5
4.5
0.4
4.4
4.6
V
Frequency Range
Oscillator Frequency
FREQ Pin Voltage
RFREQ = 33.2 kΩ to 200 kΩ
RFREQ = 100 kΩ
RFREQ = 100 kΩ
50
90
1.1
300
110
1.4
kHz
kHz
V
100
1.255
SYNC Output (Internal Frequency
Control)
VSCFG ≥ 4.53 V or SCFG pin floating
Internal SYNC Range
SYNC Output Clock Duty Cycle
SYNC Sink Pull Down Resistance
SYNC Input (External Frequency Control)
External SYNC Range
SYNC Internal Pull-Down Resistor
Maximum SYNC Pin Voltage
SYNC Threshold Rising
SYNC Threshold Falling
SCFG
For SYNC output
50
40
300
60
20
kHz
%
Ω
VSCFG = VVREG, RFREQ = 100 kΩ
VSCFG = 5 V, ISYNC = 10 mA
VSCFG < 4.25 V
50
10
For SYNC input clock
50
0.5
300
1.5
kHz
MΩ
V
V
V
1
For external sync operation
5
1.2
1.05
1.5
0.7
SCFG High Threshold
Rising
Falling
SYNC set to input
SYNC set to output
4.53
4.47
4.7
V
V
4.25
SCFG Low Threshold
Rising
Falling
Programmable phase shift above threshold
No phase shift
RFREQ = 100 kΩ, VSCFG = DGND
0.55
0.5
11
0.65
12
V
V
µA
0.4
10
SCFG Pin Current
DMAX
Maximum Internal Duty Cycle
DMAX Setting Current
DMAX and SCFG Current Matching1
DT
VDMAX, VSS, and VSCFG = 5 V
VDMAX = 0 V, RFREQ = 100 kΩ
97
11
%
µA
%
10
12
10
DT Pin Current
RFREQ = 100 kΩ, VDT = DGND
See Figure 28
20
21
24
3.5
µA
V
Maximum DT Programming Voltage
CURRENT LIMIT (CL)
CLVT
CLVT Pin Current
CLP, CLN
Minimum CLVT pin voltage = 50 mV
VCLP = VCLN
16
27
µA
Common-Mode Range
Input Resistance
0
24
8
36
V
kΩ
mV
30
50
Current Limit Threshold Offset
CLFLG
Max CLFLG Voltage
CFLG Pull-Down Resistance
Current Limit
VCLP = VCLN, RCLVT = 2.49 kΩ
Open-drain, active low output
Open-drain output
5.5
V
8
Ω
RFREQ = 100 kΩ, 16 consecutive clock pulses
Overload Time
Cool Down Time
160
160
μs
μs
Rev. 0 | Page 5 of 34
AD8452
Data Sheet
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
ZERO CROSSING DETECTION (ZCD)
ZCD Threshold Offset
(VCLP + VCLN)/2, for common-mode voltage
(CMV) = 0 V to 8 V
0
mV
VREG
Low Dropout (LDO) Regulator Output
Voltage
Load Regulation
VIN = 6 V to 60 V, no external load
VIN = 6 V, IOUT = 0 mA to 5 mA
4.9
4.9
5
5
5.1
5.1
V
V
PWM DRIVE LOGIC SIGNALS (DH/DL)
DL Drive Voltage
No load
VREG
VREG
1.4
1.4
1
V
DH Drive Voltage
No load
IDL = 10 mA
IDL = 10 mA
V
Ω
Ω
MΩ
DL and DH Sink Resistance
DL and DH Source Resistance
DL and DH Pull-Down Resistor
THERMAL SHUTDOWN (TSD)
TSD Threshold
2.6
2.6
1.5
0.5
Rising
Falling
150
125
°C
°C
1 The DMAX and SCFG current matching specification is calculated by taking the absolute value of the difference between the measured ISCFG and IDMAX currents, dividing
them by the 11 µA typical value, and multiplying this result by 100. DMAX and SCFG current matching (%) = (ISCFG – IDMAX/11 µA) × 100
DIGITAL INTERFACE SPECIFICATIONS
Table 3.
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
DIGITAL INTERFACE, MODE INPUT
MODE Threshold Rising
MODE Threshold Falling
MODE Switching Time
PRECISION ENABLE LOGIC (EN)
Maximum EN Pin Voltage
EN Threshold Rising
EN Threshold Falling
EN Pin Current
MODE pin
1.2
1.0
400
1.4
V
V
ns
0.7
60
1.4
V
V
V
µA
1.26
1.2
0.25
1.1
0.7
VEN = 5 V, internal pull-down
Active low input
2
FAULT
Maximum FAULT Pin Voltage
FAULT Threshold Rising
FAULT Threshold Falling
FAULT Pin Current
60
V
1.2
1.0
0.5
1.5
V
V
VFAULT = 5 V, internal 8.5 MΩ pull-
down resistor
2
µA
Rev. 0 | Page 6 of 34
Data Sheet
AD8452
POWER SUPPLY
Table 4.
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
ANALOG POWER SUPPLY
Operating Voltage Range
AVCC
10
−26
10
36
0
36
V
V
V
AVEE
Analog Supply Range
Quiescent Current
AVCC
AVCC − AVEE
4.7
4.4
6.5
6.0
mA
mA
AVEE
PWM POWER SUPPLY (VIN)
VIN Voltage Range
VIN Supply Current
6
60
3.0
V
mA
RFREQ = 100 kΩ, VSS = 0 V, SYNC = open
circuit (OC), FAULT = low, EN = high
2.2
UVLO Threshold Rising
UVLO Threshold Falling
VIN rising
VIN falling
5.75
5.34
6
V
V
5.1
TEMPERATURE RANGE SPECIFICATIONS
Table 5.
Parameter
Min
Typ
Max
Unit
TEMPERATURE RANGE
For Specified Performance
Operational
−40
−55
+85
+125
°C
°C
Rev. 0 | Page 7 of 34
AD8452
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Stresses at or above those listed under Absolute Maximum
Table 6.
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Parameter
Rating
Analog Supply Voltage (AVCC − AVEE)
PWM Supply Voltage (VIN – DGND)
Internal Regulator Voltage (VREG − DGND)
Voltage
36 V
−0.3 V to +61 V
5.5 V
Input Pins (ISVP, ISVN, BVP, and BVN)
AVEE + 40 V
AVCC − 40 V
THERMAL RESISTANCE
Analog Controller and Front-End Pins
(ISREFH, ISREFL, BVREFL, BVREFH, VREF,
VSET, VVP0, BVMEA, VVE0, VVE1, VINT,
IVE0, IVE1, ISMEA, ISET)
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
PWM Pins
SYNC, MODE
DH, DL, SS, DMAX, SCFG, DT, FREQ, CLVT
−0.3 V to +5.5 V
−0.3 V to
VREG + 0.3 V
−0.3 V to +61 V
−0.3 V to +61 V
Table 7. Thermal Resistance
2
Package Type
ST-481
θJA
Unit
81
°C/W
Current Limit Sense Pins (CLP, CLN)
FAULT Pin and EN Pin
1 Dissipation ≤ 0.3, TA = 25°C.
2 θJA is the natural convection junction to ambient thermal resistance
measured in a one cubic foot sealed enclosure.
Maximum Digital Supply Voltage
Positive Analog Supply (VREG − AVCC)
Negative Analog Supply (VREG − AVEE)
Maximum Digital Ground
0.3 V
−0.3 V
ESD CAUTION
Positive Analog Supply (DGND − AVCC)
Negative Analog Supply (DGND − AVEE)
Maximum Analog Ground
0.3 V
−0.3 V
Positive Analog Supply (AGND − AVCC)
Negative Analog Supply (AGND − AVEE)
0.3 V
−0.3 V
Analog Ground with Respect to the Digital
Ground (AGND − DGND)
Maximum
0.3 V
Minimum
−0.3 V
Storage Temperature Range
−65°C to +150°C
Rev. 0 | Page 8 of 34
Data Sheet
AD8452
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
48 47 46 45 44 43 42 41 40 39 38 37
1
36
35
34
33
32
31
30
29
28
27
26
25
ISREFH
FREQ
DMAX
SS
2
3
ISREFL
ISREFLS
ISVP
4
DT
5
ISVN
DGND
DH
AD8452
6
BVP
TOP VIEW
7
BVPS
DL
(Not to Scale)
8
BVN
VIN
9
VREG
SCFG
SYNC
CLFLG
BVNS
10
11
12
BVREFL
BVREFLS
BVREFH
13 14 15 16 17 18 19 20 21 22 23 24
Figure 2. Pin Configuration
Table 8. Pin Function Descriptions
Pin No.
Mnemonic
Type1
Description
1
ISREFH
Input
Reference Input for the Current Sense Amplifier. Connect this pin to the VREF pin to shift the
current-sense instrumentation amplifier output by 12.5 mV. Otherwise, connect this pin to the
ISREFL pin.
2
3
4
ISREFL
ISREFLS
ISVP
Input
Test
Input
Reference Input for the Current Sense Amplifier. The default connection is to ground.
Kelvin Sense Pin for the ISREFL Pin.
Current Sense Instrumentation Amplifier Positive (Noninverting) Input. Connect this pin to the
high side of the current sense shunt.
5
ISVN
Input
Current Sense Instrumentation Amplifier Negative (Inverting) Inputs. Connect this pin to the low
side of the current sense shunt.
6
7
8
9
BVP
BVPS
BVN
BVNS
BVREFL
Input
Test
Input
Test
Battery Voltage Difference Amplifier Positive (Noninverting) Input.
Kelvin Sense Pin for the Battery Voltage Difference Amplifier Input, B V P.
Battery Voltage Difference Amplifier Negative (Inverting) Input.
Kelvin Sense Pin for the Battery Voltage Difference Amplifier Input, BVN.
Reference Input for the Voltage Sense Difference Amplifier. The default connection for this pin is
to ground.
10
Input
11
12
BVREFLS
BVREFH
Test
Input
Kelvin Sense Pin for the BVREFL Pin.
Reference Input for the Difference Amplifier. Connect to the VREF pin to level shift VBVMEA by
approximately 12.5 mV. Otherwise, connect this pin to the BVREFL pin.
13, 21
14
15
16
17
18
19
20, 41
22
AVEE
VSET
N/A
Input
Input
Output
Output
Input
Input
Output
Logic input
Analog Negative Supply Pins.
Scaled CV Loop Control Input for Battery Charge or Discharge Cycle.
Noninverting CV Loop Filter Amplifier Input for Discharge Mode.
Scaled Battery Voltage, Difference Amplifier Output.
Buffered VSET Voltage.
Inverting Input of the CV Loop Filter Amplifier When in Discharge Mode.
Inverting Input of the CV Loop Filter Amplifier When in Charge Mode.
Aggregated Result of the Battery Voltage and Current Sense Integration.
VVP0
BVMEA
VSETB
VVE0
VVE1
VINT
MODE
Logic Level Input to Select between Charge and Discharge Modes. Bring this pin low for discharge
mode, and bring this pin high for charge mode.
23
24
EN
Logic input
Logic input
Logic Level Enable Input. Drive EN logic low to shut down the device. Drive EN logic high to turn
on the device.
External Fault Comparator Connection. When not connected, this pin is pulled up using a 10 kΩ
resistor to the VREG pin. The DH and DL drivers are disabled when FAULT is low, and are enabled
when FAULT is high.
FAULT
Rev. 0 | Page 9 of 34
AD8452
Data Sheet
Pin No.
Mnemonic
Type1
Description
25
CLFLG
SYNC
SCFG
VREG
Output
Current-Limit Flag. CLFLG goes low and stays low when the AD8452 is in current limit mode.
Connect a 10 kΩ (minimum) resistor to the VREG pin.
C lock Synchronization Pin. Synchronizes the clock (switching frequency) when multiple channels
are phase interleaved. Connect a 10 kΩ (minimum) resistor to the VREG pin.
26
27
28
Input/
output
Input/
output
Synchronization Configuration Pin. See Table 10.
Output
Internal LDO 5 V Regulator Output and Internal Bias Supply. Connect a bypass capacitor of 1 µF or
greater from this pin to ground.
29
30
VIN
DL
Input
Output
Supply Voltage to the PWM Section. VIN is typically the same as the output switch supply voltage.
Logic Drive Output for the External Low-Side Metal-Oxide Semiconductor Field-Effect Transistor
(MOSFET) Driver.
31
32
33
DH
DGND
DT
Output
N/A
Output
Logic Drive Output for the External High-Side MOSFET Driver.
Digital and PWM Ground.
Dead Time Programming Pin. Connect an external resistor between this pin and ground to set the
dead time. Do not leave this pin floating.
34
35
SS
Output
Input
Soft Start Control Pin. A capacitor connected from the SS pin to ground sets the soft start ramp
time. See the Selecting CSS section.
Maximum Duty Cycle Input. Connect an external resistor to ground to set the maximum duty
cycle. If the 97% internal maximum duty cycle is sufficient for the application, tie this pin to VREG.
If DMAX is left floating, this pin is internally pulled up to VREG.
DMAX
36
37
FREQ
CLVT
N/A
Frequency Set Pin. Connect an external resistor between this pin and ground to set the frequency
between 50 kHz and 300 kHz. When the AD8452 is synchronized to an external clock (slave mode), set
the slave frequency to 90% of the master frequency by multiplying the master RFREQ value by 1.11.
Current-Limit Voltage Threshold. With user selected resistor value, CLVT establishes a threshold
voltage for the current limit comparator. See the Select RCL and RCLVT for the Peak Current Limit
section.
Input
38
39
40, 46
42
43
CLP
CLN
Input
Input
N/A
Input
Input
Output
Input
Current-Limit/Diode Emulation Amplifier Positive Sense Pin.
Current-Limit/Diode Emulation Amplifier Negative Sense Pin.
Analog Positive Supply Pins.
Inverting Input of the CC Loop Filter Amplifier When in Charge Mode.
Inverting Input of the CC Loop Filter Amplifier When in Discharge Mode.
Current Sense Instrumentation Amplifier Output.
AVCC
IVE1
IVE0
ISMEA
ISET
44
45
Scaled CC Voltage Loop Control Input for Battery Charge or Discharge Cycles. ISET is typically the
same for charge and discharge cycle.
47
48
AGND
VREF
N/A
Output
Analog Ground.
2.5 V Reference. Bypass this pin with a high quality 10 nF NP0 ceramic capacitor in series with a
10 Ω (maximum) resistor.
1 N/A means not applicable.
Rev. 0 | Page 10 of 34
Data Sheet
AD8452
TYPICAL PERFORMANCE CHARACTERISTICS
AVCC = 15 V, AVEE = −15 V, VIN = 24 V, TA = 25°C, and RL = ∞, unless otherwise noted.
IN-AMP CHARACTERISTICS
60
–60
40
–70
–80
20
–90
0
–100
–110
–120
–130
–140
–20
–40
–60
–80
–100
10
100
1k
10k
100k
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80 90
TEMPERATURE (°C)
FREQUENCY (Hz)
Figure 6. CMRR vs. Frequency
Figure 3. Gain Error vs. Temperature
–50
–60
17.0
16.5
16.0
15.5
15.0
14.5
14.0
+PSRR
–PSRR
–70
–80
–90
–100
–110
–120
–130
–140
–150
–160
−15
−10
−5
0
5
10
15
10
100
1k
10k
100k
INPUT COMMON-MODE VOLTAGE (V)
FREQUENCY (Hz)
Figure 7. PSRR vs. Frequency
Figure 4. Input Bias Current vs. Input Common-Mode Voltage
40
30
20
10
0
19
ISVP
ISVN
18
17
16
15
14
13
12
100
1k
10k
100k
1M
10M
–40 –30 –20 –10
0
10 20 30 40 50 60 70 80 90
TEMPERATURE (°C)
FREQUENCY (Hz)
Figure 8. Gain vs. Frequency
Figure 5. Input Bias Current vs. Temperature
Rev. 0 | Page 11 of 34
AD8452
Data Sheet
DIFFERENCE AMPLIFIER CHARACTERISTICS
–120
ISVP
ISVN
–10
–20
+PSRR
–PSRR
–140
–160
–180
–200
–220
–240
–260
–30
–40
–50
–60
–70
–80
90
–100
–110
–120
–130
–140
10
100
1k
10k
100k
–40 –30 –20 –10
0
10 20 30 40 50 60 70 80 90
TEMPERATURE (°C)
FREQUENCY (Hz)
Figure 9. Gain Error vs. Temperature
Figure 11. PSRR vs. Frequency
–50
–60
0
–10
–20
–30
–40
–70
–80
–90
–100
–110
–120
–130
10
100
1k
10k
100k
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 10. CMRR vs. Frequency
Figure 12. Gain vs. Frequency
Rev. 0 | Page 12 of 34
Data Sheet
AD8452
CC AND CV LOOP FILTER AMPLIFIERS AND VSET BUFFER (EXCEPT WHERE NOTED)
150
400
200
100
0
50
–200
0
–400
–50
–600
–100
–800
–150
–15
–1000
–15
–10
–5
0
5
10
15
–10
–5
0
5
10
15
INPUT COMMON-MODE VOLTAGE (V)
INPUT COMMON-MODE VOLTAGE (V)
Figure 13. Input Offset Voltage vs. Input Common-Mode Voltage
Figure 15. Input Bias Current vs. Input Common-Mode Voltage
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.30
0.25
0.20
0.15
0.10
0.05
0
–0.05
–40 –30 –20 –10
0
10 20 30 40 50 60 70 80 90
TEMPERATURE (°C)
–40 –30 –20 –10
0
10 20 30 40 50 60 70 80 90
TEMPERATURE (°C)
Figure 14. Input Bias Current vs. Temperature
Figure 16. Output Source Current vs. Temperature
Rev. 0 | Page 13 of 34
AD8452
Data Sheet
–20
–30
1.5
1.0
+PSRR
–PSRR
ISET (V)
VINT (V)
–40
–50
–60
0.5
–70
–80
0
–90
–100
–110
–120
–130
–140
–0.5
–1.0
–1.5
–150
10
100
1k
10k
100k
0
5
10
15
20
25
30
35
40
45
50
FREQUENCY (Hz)
TIME (µs)
Figure 17. PSRR vs. Frequency
Figure 19. CC to CV Transition
120
100
80
–45.0
–67.5
PHASE
GAIN
–90.0
60
–112.5
–135.0
–157.5
–180.0
–202.5
–225.0
40
20
0
–20
–40
10
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
Figure 18. Open-Loop Gain and Phase vs. Frequency for CC and CV Loop
Amplifiers
Rev. 0 | Page 14 of 34
Data Sheet
AD8452
REFERENCE CHARACTERISTICS
2.498
300
250
200
150
100
T = +85°C
T = +25°C
T = –40°C
2.500
2.496
2.494
2.492
2.490
0
1
2
3
4
5
6
7
8
9
10
–55
–35
–15
5
25
45
65
85
105
125
OUTPUT CURRENT—SOURCING (mA)
TEMPERATURE (°C)
Figure 20. Sourcing Regulation for Three Values of Temperature
Figure 21. Source Load Regulation vs. Temperature
Rev. 0 | Page 15 of 34
AD8452
Data Sheet
PULSE-WIDTH MODULATOR
5.10
V
V
V
= 6V
= 24V
= 60V
IN
IN
IN
5.08
5.06
5.04
5.02
5.00
4.98
4.96
4.94
4.92
4.90
EN
SS
1
2
C
= 0.1µF
SS
MODE = 0V
DH
DL
3
4
B
CH1 5.00V 1MΩ BW 20.0M
5.00V 1MΩ
5.00V
1MΩ
20.0M CH1
20.0M 20ms/DIV
2.3V
–40 –30 –20 –10
0
10 20 30 40 50 60 70 80 90
TEMPERATURE (°C)
CH2
CH4
W
B
B
W
CH3 5.00V
W 20.0M
1MΩ
Figure 22. SS Pin Current vs. Temperature
Figure 25. Shows Reversal of DH Pin and DL Pin Timing at Startup
(0 V to 5 V at EN Pin) When AD8452 Is in Discharge Mode
210
190
170
150
130
110
90
EN
1
2
SYNC
DH
DL
70
4
50
30
50
B
CH1 5.00V 1MΩBW 20.0M
5.00V 1MΩ
5.00V MΩ
1
20.0M CH1
20.0M 20µs/DIV
3.1V
CH2
CH4
W
W
100
150
200
250
300
B
CH3 5.00V MΩBW 20.0M
1
fSET (kHz)
Figure 23. Timing, Referred to Startup (0 V to 5 V at EN Pin), As Observed
at Three Logic Output Pins When AD8452 Is in Charge Mode
Figure 26. RFREQ (MASTER) vs. Switching Frequency (fSET
)
500
450
400
350
300
250
200
150
100
50
EN
1
C
= 0.1µF
SS
MODE = 5V
SS
DH
2
3
4
DL
0
B
B
CH1 5.00V 1MΩ BW 20.0M
2.00V 1MΩ
5.00V
20.0M CH1
20.0M 20ms/DIV
2.3V
0
1.5
3.0
4.5
6.0
7.5
9.0
CH2
CH4
W
W
B
CH3 5.00V
W 20.0M
1MΩ
1MΩ
PHASE DELAY (µs)
Figure 27. RSCFG (Calculated) vs. Phase Time Delay (tDELAY
)
Figure 24. Soft Start Ramp Timing at SS Pin, Referred to Startup (0 V to 5 V
at the EN Pin) As Observed at Logic Level Outputs, DH and DL,
When AD8452 Is in Charge Mode
Rev. 0 | Page 16 of 34
Data Sheet
AD8452
175
150
125
100
75
2.30
2.25
T = −40°C
T = +25°C
T = +85°C
2.20
2.15
2.10
2.05
2.00
1.95
50
25
0
0
100
200
300
400
500
600
700
6
15
24
33
42
51
60
DEAD TIME (ns)
INPUT VOLTAGE (V)
Figure 28. DT Pin Resistance (RDT) vs. Dead Time (tDEAD
)
Figure 31. Quiescent Current vs. Input Voltage (VIN) at Various
Temperatures, EN Pin Low
5.9
5.000
4.998
4.996
4.994
4.992
4.990
4.988
4.986
4.984
UVLO THRESHOLD RISING
UVLO THRESHOLD FALLING
T = −40°C
T = +25°C
T = +85°C
5.8
5.7
5.6
5.5
5.4
5.3
5.2
6
15
24
33
42
51
60
–40 –30 –20 –10
0
10 20 30 40 50 60 70 80 90
TEMPERATURE (°C)
INPUT VOLTAGE (V)
Figure 29. VREG vs. Input Voltage (VIN) at Various Temperatures and No Load
Figure 32. Input Voltage (VIN) UVLO Threshold vs. Temperature
1.26
V
V
RISING
FALLING
EN
EN
1.25
1.24
1.23
1.22
1.21
1.20
1.19
1.18
–40 –30 –20 –10
0
10 20 30 40 50 60 70 80 90
TEMPERATURE (°C)
Figure 30. EN Pin Threshold Voltage (VEN) vs. Temperature
Rev. 0 | Page 17 of 34
AD8452
Data Sheet
THEORY OF OPERATION
of current into or out of the battery until the voltage reaches a
target value. At this point, a set constant voltage is applied
across the battery terminals, reducing the charge current until
reaching zero.
INTRODUCTION
Lithium ion (Li-Ion) batteries require an elaborate and time
consuming postproduction process known as forming. Battery
formation consists of a series of charge/discharge cycles that
require precise current and voltage control and monitoring. The
AD8452 provides not only the stringent current and voltage
accuracy requirements, but also a highly accurate PWM, with
logic level DH and DL outputs ready for a half-H bridge configured
switch mode power output converter—all in a highly compact
7 mm × 7 mm package.
The AD8452 features a complete PWM including on-board
user adjustable features such as clock frequency, duty cycle,
clock phasing, current limiting, soft start timing, and
multichannel synchronization.
Figure 33 is the block diagram of the AD8452, illustrating the
distinct sections of the AD8452, including the in-amp and
difference amplifier measurement blocks, loop filter amplifiers,
and PWM.
The analog front end of the AD8452 includes a precision current
sense in-amp with gain of 66× 0.1% and a precision voltage
sense difference amplifier with a gain of 0.4 × 0.1% for battery
voltage.
Figure 34 is a block diagram of the AD8452 integrated within a
battery formation and test system. The AD8452 is usable over a
wide range of current and voltage applications simply by
judicious selection of a current sense shunt, selected according
to system requirements.
As shown in Figure 38, the AD8452 provides constant CC/CV
charging technologies, with transparent internal switching
between the two. Typical systems induce predetermined levels
SYNC
48
2.5V
VREF
47
46
45
44
43
D
42
41
40
39
38
37
SYNC DETECT
CL
AVCC
AVCC
CURRENT LIMIT
AND DIODE
1MΩ
MODE'
CLFLG
C
EMULATION
V
= 1.252V
1
100kΩ
36
35
34
33
FREQ
ISREFH
ISREFL
ISREFLS
ISVP
FREQ
DMAX
OSCILLATOR
CONFIG
DETECT
2
20µA
DMAX
AVEE
500Ω
CC LOOP
FILTER
VREG
BATTERY
CURRENT
SENSE IA
G = 66
3
SS
20µA
AMPLIFIER
SS
DT
ISCFG
11µA
I
DMAX
10µA
MODE_B
+/–
AVCC
1.1mA
11µA
DMAX
VCTRL
4
SCFG
5
SOFT START
AMPLIFIER
32
31
1.64pF
ISVN
4V
DGND
DH
COMP
BATTERY
VOLTAGE
SENSE DA
G = 0.4
1×
6
SS
DRIVE
LOGIC
BVP
CL
200kΩ
1MΩ
AVEE
7
30
29
28
27
26
25
BVPS
DL
1MΩ
SS
8
CV LOOP
FILTER
AMPLIFIER
BVN
VIN
80kΩ
UVLO
TSD
200kΩ
9
BVNS
5µA
VREG
VREG
SCFG
SYNC
CLFLG
79.7kΩ
300Ω
10
11
MODE_B
BVREFL
BVREFLS
BVREFH
SCFG
SYNC
SS DISCHARGE
VREG = 5V
AVEE
BAND
GAP
C
D
MODE_B
MODE_B
12 60kΩ
V
= 1.252V
BG
CLFLG
D
C
0.3µA
1×
17
8.5MΩ
13
14
15
16
18
19
20
21
22
23
24
Figure 33. AD8452 Detailed Block Diagram
Rev. 0 | Page 18 of 34
Data Sheet
AD8452
SET
1.1mA
CONSTANT CURRENT
BATTERY
VREG
LOOP FILTER AMPLIFIER
CURRENT
ISET
SELECT
IBAT
POLARITY
BUCK
VCTRL
BOOST
PWM
1×
DC TO DC
POWER CONVERSION
VINT
BUFFER
CONSTANT VOLTAGE
LOOP FILTER AMPLIFIER
D
C
MODE
SWITCHES
(3)
D
C
AVEE
AD8452
CONTROLLER
1×
D
C
VINT
C = CHARGE
CLP
CLN
CURRENT
LIMIT AND
DIODE
D = DISCHARGE
SET
BATTERY
VOLTAGE
EMULATION
ISVP
ISVN
CURRENT
SENSE
SHUNT
IN-AMP
DISCHARGE
BATTERY
CURRENT
(IBAT)
COMPENSATION MATRIX
ISMEA
CHARGE
BVP
BVN
BVMEA
DIFF AMP
BATTERY
Figure 34. Signal Path of a Li-Ion Battery Formation and Test System Using the AD8452
Reversing Polarity When Charging and Discharging
INSTRUMENTATION AMPLIFIER (IN-AMP)
Figure 34 shows that during the charge cycle, the power converter
drives current into the battery, generating a positive voltage
across the current sense shunt. During the discharge cycle,
however, the power converter drains current from the battery,
generating a negative voltage across the shunt resistor. In other
words, the battery current reverses polarity when the battery
discharges.
Figure 35 is a block diagram of the AD8452 in-amp used to
monitor battery current when connected to a low ohmic value
shunt. The architecture of the in-amp is the classic 3-op-amp
topology, similar to the Analog Devices, Inc., industry-standard
AD8221 or AD620, and is configured for a fixed gain of 66 V/V.
This architecture, combined with ADI exclusive precision laser
trimming, provides the highest achievable CMRR and optimizes
error free (gain error better than 0.1%) high-side battery
current sensing. For more information about instrumentation
amplifiers, see A Designer's Guide to Instrumentation Amplifiers.
OPTIONAL CONNECTION FOR VOS OF 12.5mV
When in the constant current discharge mode control loop, this
reversal of the in-amp output voltage drives the integrator to the
negative rail unless the polarity of the target current is reversed.
To solve this problem, the AD8452 in-amp includes a double
pole, double throw switch preceding its inputs that implements
an input polarity inversion, thus correcting the sign of the
output voltage (see Figure 33). This multiplexer is controlled via
the MODE pin. When the MODE pin is logic high (charge
mode), the in-amp gain is noninverting, and when the MODE
pin is logic low (discharge mode), the in-amp gain is inverting.
The polarity control of the current sense voltage to the input of
the in-amp enables the integrator output voltage (VINT) to
always swing positive, regardless of the polarity of the battery
current.
2.5V
VREF
ISVP
+ CURRENT
SHUNT
+/–
19.5kΩ
10kΩ
100kΩ
500Ω
ISREFH
ISREFL
10kΩ
CHARGE/
ISMEA
DISCHARGE
POLARITY
INVERTER
305Ω
10kΩ
G = 2
SUBTRACTOR
10kΩ
20kΩ
ISVN
+/–
– CURRENT
SHUNT
INSTRUMENTATION AMPLIFIER
G = 66
Figure 35. Simplified Block Diagram of the Precision 3-Op-Amp In-Amp
Rev. 0 | Page 19 of 34
AD8452
Data Sheet
In-Amp Offset Option
The resistors that form the difference amplifier gain network
are laser trimmed to a matching level better than 0.1%. This
level of matching minimizes the gain error and gain error drift
of the difference amplifier while maximizing the CMRR of the
difference amplifier. This matching also allows the controller to
set a stable target voltage for the battery over temperature while
rejecting the ground bounce in the battery negative terminal.
As shown in Figure 35, the in-amp reference node is connected
to the ISREFL pin and ISREFH pin via an internal resistor divider.
This resistor divider can be used to introduce a temperature
insensitive offset to the output of the in-amp such that it always
reads a voltage higher than zero for a zero differential input.
Because the output voltage of the in-amp is always positive, a
unipolar analog-to-digital converter (ADC) can digitize it.
Like the in-amp, the difference amplifier can also level shift its
output voltage via an internal resistor divider that is tied to the
difference amplifier reference node. This resistor divider is
connected to the BVREFH pin and BVREFL pin.
When the ISREFH pin is tied to the VREF pin with the ISREFL
pin grounded, the voltage at the ISMEA pin is increased by an
offset voltage, VOS, of 12.5 mV, guaranteeing that the output of
the in-amp is always positive for zero differential inputs. Other
voltage shifts can be realized by tying the ISREFH pin to an
external voltage source. The gain from the ISREFH pin to the
ISMEA pin is 5 mV/V. For zero offset, connect the ISREFL pin
and ISREFH pin to ground.
When the BVREFH pin is tied to the VREF pin with the BVREFL
pin grounded, the voltage at the BVMEA pin is increased by
12.5 mV, guaranteeing that the output of the difference amplifier is
always positive for zero differential inputs. Other voltage offsets
are realized by tying the BVREFH pin to an external voltage
source. The gain from the BVREFH pin to the BVMEA pin is
5 mV/V. For zero offset, tie the BVREFL pin and the BVREFH pin
to ground.
Battery Reversal and Overvoltage Protection
The AD8452 in-amp can be configured for high-side or low-side
current sensing. If the in-amp is configured for high-side
current sensing (see Figure 34) and the battery is connected
backward, the in-amp inputs may be held at a voltage that is below
the negative power rail (AVEE), depending on the battery voltage.
CC AND CV LOOP FILTER AMPLIFIERS
The CC and CV loop filter amplifiers are high precision, low
noise specialty amplifiers with very low offset voltage and very
low input bias current. These amplifiers serve two purposes:
To prevent damage to the in-amp under these conditions, the
in-amp inputs include overvoltage protection circuitry that
allows them to be held at voltages of up to 55 V from the
opposite power rail. In other words, the safe voltage span for the
in-amp inputs extends from AVCC − 55 V to AVEE + 55 V.
•
Using external components, the amplifiers implement active
loop filters that set the dynamics (transfer function) of the
CC and CV loops.
•
The amplifiers perform a seamless transition from CC to
CV mode after the battery reaches its target voltage.
DIFFERENCE AMPLIFIER
Figure 36 is a block diagram of the difference amplifier used to
monitor the battery voltage. The architecture of the difference
amplifier is a subtractor amplifier with a fixed gain of 0.4 V/V.
This gain value allows the difference amplifier to funnel the
voltage of a 5 V battery to a level that can be read by a 5 V ADC
with a 4.096 V reference.
Figure 37 is a functional block diagram of the AD8452 CC and
CV feedback loops for charge mode (the MODE pin is logic high).
For illustrative purposes, the external networks connected to
the loop amplifiers are simple RC networks configured to form
single-pole inverting integrators. This type of configuration
exhibits very high dc precision when the feedback loop is
closed, due to the high loop gain when the feedback loop is in
place. The outputs of the CC and CV loop filter amplifiers are
internally connected to the VINT pins via an analog NOR
circuit (minimum output selector circuit), such that they can only
pull the VINT node down. In other words, the loop amplifier that
requires the lowest voltage at the VINT pins is in control of the
node. Thus, only one loop, CC or CV, can be in control of the
system charging control loop at any given time. When the loop
is inactive (open, such as when the EN pin is low), the voltage at
the VINT pins must be railed at AVCC.
CONNECT
FOR VOS
OF 12.5mV
AD8452 DIFFAMP
VREF
BVP
200kΩ
79.7kΩ
60kΩ
300Ω
BVREFH
+ BATTERY
TERMINAL
BVREFL
BVN
200kΩ
80kΩ
BVMEA
– BATTERY
TERMINAL
Figure 36. Difference Amplifier Simplified Block Diagram
Rev. 0 | Page 20 of 34
Data Sheet
AD8452
I
AC
HVAC/12V DC
INVERTER/CONVERTER
I
BAT
R1
C1
VISET
ISET
½ BRIDGE AND LPF
GH
GL
CC LOOP
AMPLIFIER
ISMEA
IVE1
VINT
ISVP
IA
+
VCTRL/
COMP
½ BRIDGE DRIVER
–
+
SHUNT
R
66×
DH
DL
S
ISVN
BVP
–
MIN
DH
PWM
DL
OUTPUT
SELECT
DA
+
+
–
VSET
0.4×
–
BAT
BUFFER
1×
BVN
CV LOOP
AMPLIFIER
VSETB
VINT
MODE
BVMEA
VSET
VVE1
5V
VVSET
R2
C2
Figure 37. Functional Block Diagram of the CC and CV Loops in Charge Mode (MODE Pin High)
The VISET voltage source and VVSET voltage source set the
target constant current and the target constant voltage,
respectively. When the CC and CV feedback loops are in a
steady state, the charging current is set at
Concepts of Constant Current (CC) and Constant
Voltage (CV)
Batteries can be charged in constant current or constant voltage
modes. Figure 38 shows a typical CC/CV multiphase charge
profile for a Li-Ion battery. In the first stage of the charging
process, the battery is charged with a CC of 1 A. When the battery
voltage reaches a target voltage of 4.2 V, the charging process
transitions such that the battery is charged with a CV of 4.2 V.
VISET
IBAT
=
G
IA ×RS
where:
BAT is the steady state charging current.
I
1.25
1.00
0.75
0.50
0.25
0
5
4
3
2
1
1A CC
TRANSITION
FROM 1A CC
TO 4.2V CV
GIA is the in-amp gain.
RS is the value of the shunt resistor.
CHARGE
BEGINS
VOLTAGE
RISES TO VSET
The target voltage is set at
VVSET
GDA
VBAT
=
VOLTAGE
RISES TO
VSET
CHARGE
TERMINATES
where:
V
G
BAT is the steady state battery voltage.
DA is the difference amplifier gain.
CURRENT (A)
VOLTAGE (V)
Because the offset voltage of the loop amplifiers is in series with
the target voltage sources, VISET and VVSET, the high precision of
these amplifiers minimizes this source of error.
0
1
2
3
4
5
TIME (Hours)
Charging Lithium-Ion (Li-Ion) Cells
Figure 38. Representative Li-Ion Battery Charge Profile Showing
Seamless CC to CV Transition
Charging Li-Ion cells is a demonstrably more difficult process
than charging most other batteries employing recyclable
technologies. The voltage margin of error between optimum
storage capacity and damage caused by overcharge is around
1%. Thus, Li-Ion cells are more critical to over/undercharging
than any other type battery style, rechargeable or not.
The following sequence of events describes how the AD8452
implements a typical CC/CV charging profile required for a
Li-Ion battery. The scenario assumes a newly manufactured,
unformed, never before charged battery, and the charge and
discharge voltage and current levels along with appropriate time
intervals have already been established empirically.
Li-Ion batteries also exhibit the highest energy density per unit
of weight and volume than any other style. Such high levels of
energy density make them the first choice for portable applications,
large and small, from cell phones to high capacity energy storage
banks. Realizing their greatest potential requires careful attention
to their charge characterization signature.
Energy levels (CC, CV, and time intervals are just a small percent of
the battery final ratings). For this example, assume a 3.2 V 10 Ah
battery is charging at IBAT = 2 A and VBAT = 4.2 V. The process
begins with ISET = 66 mV and VSET = 1.68 V, configured for
charge mode. Following the target VSET and ISET, the system is
enabled by applying a logic high to the EN pin.
Rev. 0 | Page 21 of 34
AD8452
Data Sheet
1. At turn on, the default start-up voltages at the ISMEA pin
and BVMEA pin are both zero, and both integrators (loop
amplifiers) begin to ramp, increasing the voltage at the
VINT node. (The voltage at the VINT pin always rises
following an enable regardless of mode setting).
7. Because the loop amplifiers can only pull the VINT node
down due to the analog NOR circuit, the CV loop takes
control of the charging feedback loop, and the CC loop is
disabled.
The analog OR (minimum output selector) circuit that couples
the outputs of the loop amplifiers is optimized to minimize the
transition time from CC to CV control. Any delay in the transition
causes the CC loop to remain in control of the charge feedback
loop after the battery voltage reaches its target value. Therefore,
the battery voltage continues to rise beyond VBAT until the
control loop transitions; that is, the battery voltage overshoots
its target voltage. When the CV loop takes control of the charge
feedback loop, it reduces the battery voltage to the target voltage.
A large overshoot in the battery voltage due to transition delays
can damage the battery; thus, it is crucial to minimize delays by
implementing a fast CC to CV transition.
2. As the voltage at the VINT node increases, the output
current IBAT from the power converter starts to rise.
3. When the IBAT current reaches the target CC steady state
value IBAT, the battery voltage is considerably less than the
target steady state value, VBAT. Therefore, the CV loop
amplifier forces its output voltage high enough to disconnect
itself from VINT. The CC loop prevails, maintaining the
target charge current until the target VBAT is achieved and
the CC loop stops integrating.
4. Due to the analog OR circuit, the loop amplifiers can only
pull the VINT node down. The CC loop takes control of
the charging feedback loop, and the CV loop is disabled.
5. As the charging process continues, the battery voltage
increases until it reaches the steady state value, VBAT, and
the voltage at the BVMEA pin reaches the target voltage, VVSET
6. The CV loop tries to pull the VINT node down to reduce
the charging current (IBAT) and prevent the battery voltage
from rising any further. At the same time, the CC loop tries
to keep the VINT node at its current voltage to keep the
Figure 39 is the functional block diagram of the AD8452 CC
and CV feedback loops for discharge mode (MODE logic pin is
low). In discharge mode, the feedback loops operate in a similar
manner as in charge mode. The only difference is in the CV
loop amplifier, which operates as a noninverting integrator in
discharge mode. For illustration purposes, the external networks
connected to the loop amplifiers are simple RC networks
configured to form single-pole integrators.
.
battery current at IBAT
.
AC I
AC
INVERTER
12V DC
I
BAT
R1
VISET
HALF BRIDGE
AND LPF
GH
GL
ISMEA
CC LOOP
AMPLIFIER
VINT
ISET
IVE0
ISVP
ISVN
IA
+
HALF BRIDGE
DRIVER
–
+
66×
SHUNT
R
S
DH
DL
–
DH
PWM
DL
MIN
OUTPUT
SELECT
BVP
BVN
DA
0.4×
VSET
BUFFER
+
–
BAT
+
–
+
–
1×
CV LOOP
AMPLIFIER
VINT
MODE
BVMEA
VSET VSETB VVP0
VVE0
R2
VVSET
5V
R2
C2
Figure 39. Functional Block Diagram of the CC and CV Loops in Discharge Mode (MODE Pin Low)
Rev. 0 | Page 22 of 34
Data Sheet
AD8452
Compensation
When the AD8452 operates in charge mode, the PWM operates
in a buck configuration. In discharge mode, the configuration
changes to boost. See Figure 40 and Figure 41 for the AD8452
DH and DL behavior in each mode. On the rising edge of EN, the
state of the MODE pin is latched, preventing the mode of operation
from being changed while the device is enabled. To change between
charge and discharge modes of operation, shut down or disable the
AD8452, adjust the MODE pin to change the operating mode, and
reenable the system.
In battery formation and test systems, the CC and CV feedback
loops have significantly different open-loop gain and crossover
frequencies; therefore, each loop requires its own frequency
compensation. The active filter architecture of the AD8452 CC
and CV loops allows the frequency response of each loop to be
set independently via external components. Moreover, due to
the internal switches in the CC and CV amplifiers, the frequency
response of the loops in charge mode does not affect the
frequency response of the loops in discharge mode.
The operating mode can be changed when the EN pin is driven
low, the
pin is driven low, or the AD8452 is disabled via
FAULT
Unlike simpler controllers that use passive networks to ground for
frequency compensation, the AD8452 allows the use of feedback
networks for its CC and CV loop filter amplifiers. These networks
enable the implementation of both proportional differentiator (PD)
Type II and proportional integrator differentiator (PID) Type III
compensators. Note that in charge mode, both the CC and CV
loops implement inverting compensators, whereas in discharge
mode, the CC loop implements an inverting compensator, and
the CV loop implements a noninverting compensator. As a result,
the CV loop in discharge mode includes an additional amplifier,
the VSET buffer, to buffer the VSET node from the feedback
network VINT buffer.
a TSD event or UVLO condition. On the rising edge of the
FAULT
control signal, the state of the MODE pin is latched, preventing
the mode of operation from being changed while the device is
enabled.
DH AND DL IN CHARGE MODE
INTERNAL RAMP
(4V p-p)
4.5V
2.5V (TYP)
0.5V
0V
VREG
(5V TYP)
PIN DH
0V
VREG
CHARGE AND DISCHARGE CONTROL
Conditions to Charge and Discharge a Battery
(5V TYP)
PIN DL
0V
Battery charging and discharging requires separate paradigms in
terms of the analog requirements and the PWM configurations.
These paradigms are based on manufacturer provided information,
most importantly the C rating where C is simply the battery
capacity expressed in ampere hours. For example, if the battery is
C rated as 10 Ah, and the charge rate is specified as 0.2 C, the
charge current is 2 A for a duration of 5 hours.
Figure 40. DH and DL Output Waveforms for Charge Mode
DH AND DL IN DISCHARGE MODE
INTERNAL RAMP
(4V p-p)
4.5V
2.5V (TYP)
0.5V
0V
VREG
(5V TYP)
To charge, the applied voltage must be greater than the voltage of
the battery under charge and the current must not exceed the
manufacturers specification, usually expressed as a fraction of the
full C rating. When discharging, the opposite conditions apply;
the discharge voltage must be less than the unloaded battery
voltage, and the current flows out of the battery, reversing the
polarity of the shunt voltage.
PIN DH
0V
VREG
(5V TYP)
PIN DL
0V
Figure 41. DH and DL Output Waveforms for Discharge Mode
INPUT AND OUTPUT SUPPLY PINS
The AD8452 has five power supply input pins, a pair each of the
internally connected AVCC pin and AVEE pin for the analog
section and Input VIN for the PWM section. The maximum
supply voltage for the VIN pin is 60 V; if operating with an
input voltage greater than 50 V, see Figure 42 for recommended
additional input filtering.
Multiple charge/discharge sequences can last for days at a time
before the battery achieves its optimum storage capacity, and
the charge/discharge currents and voltages must be accurately
monitored.
MODE Pin
The MODE pin is a logic level input that selects charge with a
AD8452
logic high (VMODE > 2 V) or discharge with a logic low (VMODE
<
VIN
SUPPLY > 50V
4.7µF
R
0.8 V). All the analog and PWM circuitry for charging and
C
discharging of the battery is configured and is latched in when
the EN pin goes high.
Figure 42. Recommended Filter Configuration for
Input Voltages Greater Than 50 V
The MODE pin controls the polarity of the internal analog loop
and the DH/DL sequence. In charge mode, DH precedes DL; in
discharge mode, DL precedes DH.
Rev. 0 | Page 23 of 34
AD8452
Data Sheet
5V
For optimum protection from switching and other ambient
noise, all of these supply pins must be bypassed to ground with
high quality ceramic capacitors (X7R or better), located as near
as possible to the device.
DH
DH BEGINS
5V
DL
DL FOLLOWS
VREG is an internal 5 V supply that powers the control circuitry
including all the current sources for user selected PWM features. It
is active as long as VIN is above the internal UVLO (5.75 V
typical). VREG may be used as a pull-up voltage for the MODE,
5V
4.5V
FAULT
SYNC, DMAX, and
pins and any other external pull-ups as
SYNCHRONOUS OPERATION
ENABLED AT ~90% RAMP
long as the additional current does not exceed 5 mA. Bypass the
VREG pin to ground with a 1 μF ceramic capacitor.
SS
0.52V
0V
PWM SWITCHING
ENABLED AT ~10% RAMP
SHUTDOWN
BEGIN
RAMP
The EN input turns the AD8452 PWM section on or off and
can operate from voltages up to 60 V. When the EN voltage is less
than 1.2 V (typical), the PWM shuts down, and DL and DH are
driven low. When the PWM shuts down, the VIN supply current is
15 μA (typical). When the EN voltage is greater than 1.26 V
(typical), the PWM is enabled.
5V
EN
EN GOES HIGH
0V
Figure 43. DH and DL Sequence in Charge Mode
5V
DH
In addition to the EN pin, the PWM is disabled via a fault
condition flagged by an TSD, an undervoltage lockout (UVLO)
DL FOLLOWS
FAULT
condition on VIN, or an external fault condition via the
pin.
5V
DL
DH BEGINS
When changing the operating mode, it is necessary to disable
the AD8452 by setting the EN pin low.
UNDERVOLTAGE LOCKOUT (UVLO)
5V
4.5V
The UVLO function prevents the PWM from turning on until
voltage VIN ≥ 5.75 V (typical). The UVLO enable state has
~410 mV of hysteresis to prevent the PWM from turning on
and off repeatedly if the supply voltage to the VIN pin ramps
slowly. The UVLO disables the PWM when VIN drops below
5.34 V (typical).
SYNCHRONOUS OPERATION
ENABLED AT ~90% RAMP
SS
0.52V
0V
PWM SWITCHING
ENABLED AT ~10% RAMP
BEGIN
RAMP
5V
SOFT START
EN
EN GO ES HIGH
The AD8452 has a programmable soft start that prevents output
voltage overshoot during startup. When the EN pin goes high,
an internal 5 ꢀA current source connected to the SS pin begins
charging the external capacitor, CSS, that is connected to VREG
(5 V), creating a linear voltage ramp (VSS) that controls several
time sensitive PWM control functions.
0V
Figure 44. DH and DL Sequence in Discharge Mode
In conjunction with the MODE pin, the VSS ramp also
establishes when the DH and DL, logic outputs and thus the
output FET switches, become active. In charge mode (Mode
high), the pulse sequence at the DH pin precedes that at the DL
pin. Conversely, in discharge mode, the sequence is reversed
and the DL pin precedes the DH pin.
When VSS < 0.52 V (typical), the DH and DL logic outputs are
both low. When VSS exceeds 0.52 V (typical), nonsynchronous
switching is enabled, either the DH pin or the DL pin logic
output become active, and the PWM duty cycle gradually
increases. When VSS > 4.5 V (typical), synchronous switching
is enabled (see Figure 43 and Figure 44).
The duty cycle of the DH and DL drive pins increase in
proportion to the ramp level, reducing the output voltage
overshoot during startup (see the Selecting CSS section).
Rev. 0 | Page 24 of 34
Data Sheet
AD8452
REPEATED CURRENT
LIMIT VIOLATION
DETECTED FOR UP
TO 16 COUNTS
NORMAL
SOFT START
SEQUENCE
PIN DH AND PIN DL GO LOW
FOR 16 COUNTS
UPPER SWITCH
GATE DRIVE (DH)
I
CURRENT-LIMIT
COOL DOWN
RESET
RCL
CURRENT LIMIT
THRESHOLD
PIN SS GOES LOW
AND NORMAL SOFT START
(SS) BEGINS
(V
)
CLVT
t
SOFT START
(PIN SS)
0V
5V
CURRENT
LIMIT FLAG
(PIN CLFLG)
0V
Figure 45. Recovery from a Peak Current-Limit Event
PWM DRIVE SIGNALS
PEAK CURRENT PROTECTION AND DIODE
EMULATION (SYNCHRONOUS)
Peak Current-Limit Detection
The AD8452 has two 5 V logic level output drive signals, DH
and DL, that are compatible with MOSFET drivers such as the
ADuM3223 or ADuM7223. The DH and DL drive signals
synchronously turn on and off the high-side and low-side
switches driven from the external driver. The AD8452 provides
a resistor programmable dead time to prevent the DH pin and
DL pin from transitioning at the same time, as shown in Figure 46.
Connect a resistor from the DT pin to ground to program the
dead time.
The AD8452 provides an adjustable peak current limit for fast
response to overcurrent conditions. When the peak current limit is
reached, the main switching FET is turned off, limiting the peak
current for the switching cycle and the CLFLG pin is driven low.
When the peak inductor current exceeds the programmed
current limit for more than 16 consecutive clock cycles, a peak
current overload condition occurs. If the current overload
condition exists for less than 16 consecutive cycles, the counter
is reset to zero and the peak current overload condition is
avoided. During the peak current-limit condition, the
SS capacitor is discharged to ground, and the drive signals (DL
and DH) are disabled for the next 16 clock cycles to allow the
FETs to cool down (current overload mode). When the 16 clock
cycles expire, the AD8452 restarts with a new soft start cycle.
Figure 45 shows the sequence for a peak current-limit event.
DH
DL
t
DEAD
t
DEAD
Figure 46. Dead Time (tDEAD) Between DH and DL Transitions
When driving capacitive loads with the DH and DL pins, a 20 Ω
resistor must be placed in series with the capacitive load to reduce
ground noise and ensure signal integrity.
As shown in Figure 47, the inductor current, IRCL ,is sensed by a low
value resistor, RCL (for example, 5 mΩ), placed between the output
inductor and capacitor. The IRCL current is bidirectional,
depending on whether the AD8452 is in charge or discharge
mode. The MODE pin automatically controls the polarity of the
voltage sampled across RCL to set the peak current-limit detection.
Because the average output voltage at the junction of the low-pass
filter inductor and capacitor is equal to the battery potential, the
common-mode voltage is rejected, leaving only the desired
differential result.
Rev. 0 | Page 25 of 34
AD8452
Data Sheet
+DCBUS
FREQUENCY AND PHASE CONTROL
The FREQ, SYNC, and SCFG pins determine the source,
frequency, and synchronization of the clock signal that operates
the PWM control of the AD8452.
I
RCL
RSH
VBAT
RCL
Internal Frequency Control
The AD8452 frequency can be programmed with an external
resistor connected between FREQ and ground. The frequency
range can be set from a minimum of 50 kHz to a maximum of
300 kHz. If the SCFG pin is tied to VREG, forcing VSCFG ≥ 4.53 V
(typical), or if the SCFG pin is left floating, the SYNC pin is
configured as an output, and the AD8452 operates at the
frequency set by RFREQ, which outputs from the SYNC pin through
the open-drain device. The output clock of the SYNC pin operates
with a 50% (typical) duty cycle. In this configuration, the SYNC
pin can synchronize other switching regulators in the system to
the AD8452. When the SYNC pin is configured as an output, an
external pull-up resistor is needed from the SYNC pin to an
external supply. The VREG pin of the AD8452 can be used as
the external supply rail for the pull-up resistor.
VRCL
CLP
CLN
PEAK CURRENT LIMITING
AND DIODE EMULATION
+ –
MODE
VREG
(CLP – CLN)
CUR LIM
VREG
DH
DL
I
= 20µA
CLVT
DUTY CYCLE DH
SYNC OFF
DUTY CYCLE DL
V
1mV
AD8452
CLVT
V
CLVT
External Frequency Control
R
CLVT
When VSCFG ≤ 0.5 V (typical), the SYNC pin is configured as an
input, the AD8452 synchronizes to the external clock applied to
the SYNC pin, and the AD8452 operates as a slave device. This
synchronization allows the AD8452 to operate at the same
switching frequency with the same phase as other switching
regulators or devices in the system. When operating the AD8452
with an external clock, select RFREQ to provide a frequency that
approximates but is not equal to the external clock frequency,
which is further explained in the Applications Information
section.
Figure 47. Peak Current Limiting and Diode Emulation Block Diagram
The threshold voltage for the peak current comparator is user
adjustable by connecting a resistor from the current-limit voltage
threshold (CLVT pin) to ground. The AD8452 generates this
voltage from a 20 μA current source (see the Select RCL and RCLVT
for the Peak Current Limit section).
Diode Emulation/Synchronous Mode Operation
The RCL current sense resistor is also used to detect and control
current reversal. When the voltage across RCL drops to
−5 mV ≤ VRCL ≤ +5 mV (for charge and discharge modes) during
the synchronous FET switching cycle, the synchronous FET is
turned off to stop the flow of reverse current.
Operating Frequency Phase Shift
When the voltage applied to the SCFG pin is 0.65 V < VSCFG
<
4.25 V, the SYNC pin is configured as an input, and the AD8452
synchronizes to a phase shifted version of the external clock
applied to the SYNC pin. To adjust the phase shift, place a resistor
(RSCFG) from SCFG to ground. The phase shift can be used to
reduce the input supply ripple for systems containing multiple
switching power supplies.
Information on how to set the current limit and the current sense
resistor RCL is available in the Applications Information section.
DH AND DL WITH INDUCTOR CURRENT
WHILE IN CHARGE MODE
MAXIMUM DUTY CYCLE
DH
DL
Referring to Figure 52, the maximum duty cycle of the AD8452
can be externally programmed for any value between 0% and 97%
by installing a resistor from the DMAX pin to ground. The
maximum duty cycle defaults to 97% if the DMAX pin is left
floating or connected to 5 V (the VREG pin).
2.5A
2.5A p-p
INDUCTOR
CURRENT
0A
DIODE
EMULATION
BEGINS
Figure 48. Diode Emulation in Charge Mode, Low Charge Current Required
Rev. 0 | Page 26 of 34
Data Sheet
AD8452
FAULT INPUT
THERMAL SHUTDOWN (TSD)
FAULT
The AD8452 has a TSD protection circuit. The TSD triggers and
disables switching when the junction temperature reaches
150°C (typical). While in TSD, the DL and DH signals are driven
low, the CSS capacitor discharges to ground, and VREG remains
high. Normal operation resumes when the junction temperature
decreases to 135°C (typical).
The AD8452
pin is a logic level input intended to be
driven by an external fault detector. The external fault signal
stops PWM operation of the system to avoid damage to the
application and components. When a voltage of less than 1.0 V
(typical) is applied to the
driving the DL and DH PWM drive signals low. The soft start
capacitor (CSS) is discharged through a switch until a voltage
FAULT
pin, the AD8452 is disabled,
FAULT
≥1.2 V is applied to the
FAULT
pin, and the AD8452 resumes
pin sustains voltages as high as 60 V.
switching. The
Rev. 0 | Page 27 of 34
AD8452
Data Sheet
APPLICATIONS INFORMATION
The AD8452 includes the following blocks (see Figure 33 and
the Theory of Operation section for more information):
ANALOG CONTROLLER
This section describes how to use the AD8452 in the context of
a battery formation and test system and includes design
examples.
•
•
•
A fixed gain in-amp that senses low-side or high-side
battery current.
A fixed gain difference amplifier that measures the
terminal voltage of the battery.
Two loop filter error amplifiers that receive the battery target
current and voltage and establish the dynamics of the CC and
CV feedback loops.
FUNCTIONAL DESCRIPTION
The AD8452 is a precision analog front end and controller for
battery formation and test systems. Such systems are differentiated
from typical battery charger or battery management systems by
the high level of voltage and current measurement precision
required to optimize Li-Ion batteries for capacity and energy
density. Figure 49 shows the analog signal path of a simplified
switching battery formation and test system using the AD8452
controller.
•
•
A minimum output selector circuit that combines the outputs
of the loop filter error amplifiers to perform automatic CC
to CV switching.
A PWM with high- and low-side half bridge logic level
outputs suitable for driving a MOSFET gate driver.
A 2.5 V reference whose output node is the VREF pin.
A logic input pin (MODE) that switches the controller
configuration between charge mode (high) and discharge
mode (low).
The AD8452 is suitable for systems that test and form Li-Ion
and the legacy NiCad and NiMH electrolyte batteries. The
output is a digital format (PWM), designed to drive a switching
power output stage.
•
•
AVCC
SET
BATTERY
CURRENT
CONSTANT CURRENT
LOOP FILTER AMPLIFIER
1.1mA
OUTPUT
SWITCHES
VREG
ISET
SELECT
IBAT
BUCK
BOOST
PWM
LPF
RCL
VCTRL
POLARITY
1×
LEVEL
SHIFTER
VINT
BUFFER
CONSTANT VOLTAGE
LOOP FILTER AMPLIFIER
DC TO DC
POWER CONVERSION
D
C
MODE
SWITCHES
(3)
D
C
AVEE
VINT
AD8452
CONTROLLER
1×
D
C
C = CHARGE
D = DISCHARGE
SET
ISVP
BATTERY
VOLTAGE
CURRENT
LIMIT AND
DIODE
EMULATION
ISVN
C
D
C
D
D
C
D
C
D
CLP
CURRENT
SENSE
PGIA
CLN
D
SHUNT
BATTERY
CURRENT
(IBAT)
ISMEA
BVP
BVMEA
PGDA
BVN
BATTERY
COMPENSATION
MATRIX
Figure 49. Complete Signal Path of a Battery Test or Formation System Suitable for Li-Ion Batteries
Rev. 0 | Page 28 of 34
Data Sheet
AD8452
Optional Low-Pass Filter
POWER SUPPLY CONNECTIONS
Due to the extremely high impedance of the instrumentation
amplifier used for a current shunt amplifier, power stage
switching noise can become an issue if the input circuitry is in
close proximity to the power stage components. This issue is
mitigated by shielding the input leads with ground potential
shielding designed into the PCB artwork and keeping the input
leads close together between the current sense shunt and the
input pins.
The AD8452 requires three analog power supplies (AVCC, VIN,
and AVEE). Two separate ground pins, AGND and DGND,
provide options for isolating analog and digital ground paths in
high noise environments. In most applications, however, these
two pins can be connected to a common ground.
AVCC and AVEE power all the analog blocks, including the
in-amp, difference amplifier, and op amps. VIN powers an internal
5 V LDO regulated supply (VREG) that powers the mode logic
and PWM.
Connecting an external differential low-pass filter between the
current sensor and the in-amp inputs is also an effective method to
reduce the injection of switching noise into the in-amp (see
The rated absolute maximum value for AVCC − AVEE is 36 V,
and the minimum operating AVCC and AVEE voltages are +10 V
and −26 V, respectively. Due to the high PSRR of the AD8452
analog circuitry, the AVCC pin can be connected directly to the
high current power bus (the input voltage of the power converter)
without risking injection of supply noise to the controller outputs.
Figure 50).
ISVP
10kΩ
I
BAT
20kΩ
10kΩ
305Ω
10kΩ
A commonly used power supply combination is +12 V for
AVCC and −5 V for AVEE. The 12 V rail for AVCC provides
enough headroom to the in-amp such that it can be connected
in a high-side current sensing configuration. The −5 V AVEE
rail allows the difference amplifier output to become negative if
the battery under test (BUT) is accidentally connected in
reverse. The condition can be detected by monitoring BVMEA
for reverse voltage.
IMEAS
4-TERMINAL
SHUNT
OPT
LPF
BATTERY
UNTER TEST
–
+
10kΩ
20kΩ
ISVN
It is good practice to connect decoupling capacitors to all the
supply pins. A 1 µF ceramic capacitor in parallel with a 0.1 µF
capacitor is recommended.
Figure 50. 4-Terminal Shunt Resistor Connected to the Current Sense In-Amp
VOLTAGE SENSE DIFFERENTIAL AMPLIFIER
CONNECTIONS
CURRENT SENSE IN-AMP CONNECTIONS
For a description of the difference amplifier, see the Theory of
Operation section, Figure 33, and Figure 36. The gain of the
difference amplifier is fixed at 0.4×. For AD8452 applications in
large installations, the best practice is to connect each battery
with a dedicated pair of conductors to avoid accuracy issues.
This recommendation applies whether using wiring harnesses
or a distributed PCB approach (mother/ daughter boards) to the
system design.
For a description of the instrumentation amplifier, see the
Theory of Operation section, Figure 33, and Figure 35. The
in-amp fixed gain is 66 V/V.
Current Sensors
Two common options for current sensors are isolated current
sensing transducers and shunt resistors. Isolated current sensing
transducers are galvanically isolated from the power converter
and are affected less by the high frequency noise generated by
switch mode power supplies. Shunt resistors are far less
expensive, easier to deploy and generally more popular.
BATTERY CURRENT AND VOLTAGE CONTROL
INPUTS (ISET AND VSET)
The voltages at the ISET pin and the VSET pin set the target
battery current and voltage (CC mode and CV mode) and
require highly accurate and stable voltages to drive them. For a
locally controlled system, a low noise LDO regulator such as the
ADP7102ARDZ-5.0 is appropriate. For large scale computer
controlled systems, a digital-to-analog converter (DAC) such as
the dual channel, 16-bit AD5689RBRUZ is suitable for these
purposes. In either event, the source output voltage and the in-amp
and difference amplifier reference pins (ISREFH/ISREFL and
BVREFH/BVREFL, respectively) must use the same ground
reference. For example, if the in-amp reference pins are connected
to AGND, the voltage source connected to ISET must also be
referenced to AGND. In the same way, if the difference amplifier
If a shunt resistor sensor is used, a 4-terminal, low resistance shunt
resistor is recommended. Two of the four terminals conduct the
battery current, whereas the other two terminals conduct virtually
no current. The terminals that conduct no current are sense
terminals that are used to measure the voltage drop across the
resistor (and, therefore, the current flowing through it) using an
amplifier such as the in-amp of the AD8452. To interface the
in-amp with the current sensor, connect the sense terminals of
the sensor to the ISVP pin and ISVN pin of the AD8452 (see
Figure 50).
Rev. 0 | Page 29 of 34
AD8452
Data Sheet
reference pins are connected to AGND, the voltage source
connected to VSET must also be referenced to AGND.
SELECTING CHARGE OR DISCHARGE OPTIONS
To operate the AD8452 in discharge mode (including energy
recycling) mode, apply a voltage less than 1.05 V (typical) to the
MODE pin. To operate the AD8452 in charge mode, drive the
MODE pin high, greater than 1.20 V (typical). The state of the
MODE pin can change when the AD8452 is shut down via the EN
In constant current mode, when the CC feedback loop is in a
steady state, the ISET input sets the battery current as follows:
VISET
IA × RS
VISET
66 × RS
IBAT
=
=
G
FAULT
pin or via an external fault condition signaled on the
pin, a TSD event, or an UVLO condition.
where:
GIA is the in-amp gain.
RS is the value of the current sense resistor.
SELECT RCL AND RCLVT FOR THE PEAK CURRENT
LIMIT
Note that the system accuracy is highly dependent on the physical
properties of the shunt as well as the in-amp GIA and VISET values.
When selecting a shunt, be sure to consider temperature
performance as well as basic precision.
Figure 47 is the block diagram for peak current limit and diode
emulation. Note that the current-limit sense resistor is floating
between the output filter inductor and capacitor.
The current generated by a fault condition defines the peak current.
In turn, the peak current equals the sum of the average current
(rated battery charging or discharging current) and the peak
incremental inductor current:
In constant voltage mode, when the CV feedback loop is in a
steady state, the VSET input sets the battery voltage according
to the equation:
VVSET
GDA
VVSET
0.4
IPK = IAVG + IMAX
VBAT
=
=
where:
where GDA is the difference amplifier gain.
IAVG is the battery charge/discharge current.
I
LMAX is the the inductor saturation current.
Therefore, the accuracy and temperature stability of the formation
and test system are not only dependent on the accuracy and
stability of the AD8452 but also on the accuracy external
components.
Typically, the peak current level is set to the sum of the average
current and the value of the inductor saturation current.
Use the following equation to calculate the minimum current-limit
sense resistor value:
LOOP FILTER AMPLIFIERS
The AD8452 has two loop filter amplifiers, also known as error
amplifiers (see Figure 49). One amplifier is for constant current
control (CC loop filter amplifier), and the other amplifier is for
constant voltage control (CV loop filter amplifier). The outputs
of these amplifiers are combined using a minimum output
selector circuit to perform automatic CC to CV switching.
50 mV
R
CL MIN (Ω) =
(2)
IPK (A)
where:
PK is the desired peak current limit in A.
CL MIN is the minimum current limit sense resistor value in Ω.
50 mV is the minimum IR drop across RCL for sufficient noise
immunity during operation.
I
R
Table 9 lists the inputs of the loop filter amplifiers for charge
mode and discharge mode.
Select the next higher standard resistor value for RCL.
Table 9. Integrator Input Connections
Next, the value for RCLVT is calculated using the following
equation:
Reference Feedback
Feedback Loop Function
Input
Terminal
Control the Current While Discharging
a Battery
Control the Current While Charging
a Battery
Control the Voltage While Discharging
a Battery
Control the Voltage While Charging
a Battery
ISET
IVE0
IPK
ICLVT
×
RCL
R
CLVT (Ω) =
(3)
ISET
IVE1
where:
CLVT is the current-limit threshold voltage resistor value in Ω.
PK is the desired peak current limit in A.
CL is the current-limit sense resistor value in Ω.
CLVT is the CLVT pin current (21 µA typical)
VSET
VSET
VVE0
VVE1
R
I
R
I
The CC and CV amplifiers in charge mode and the CC amplifier in
discharge mode are inverting integrators, whereas the CV amplifier
in discharge mode is a noninverting integrator. Therefore, the
CV amplifier in discharge mode uses an extra amplifier, the VSET
buffer, to buffer the VSET input pin (see Figure 33). In addition,
the CV amplifier in discharge mode uses the VVP0 pin to couple
the signal from the BVMEA pin to the integrator.
The AD8452 is designed so that the peak current limit is the
same in both the buck mode and the boost mode of operation. A
1% or better tolerance for the RCL and RS resistors is recommended.
Rev. 0 | Page 30 of 34
Data Sheet
AD8452
master clock period. The slave device can synchronize to a
master clock frequency running from 2% to 20% higher than
the slave clock frequency. Setting RFREQ (SLAVE) to 1.11× larger than
SETTING THE OPERATING FREQUENCY AND
PROGRAMMING THE SYNCHONIZATION PIN
Operating modes of the AD8452 clock rely on the state of the
FREQ pin and one of three possible voltage options applied to
the SCFG pin. See Table 10 for a summary of synchronization
options.
RFREQ (MASTER) runs the synchronization loop in approximately the
center of the adjustment range.
Programming the External Clock Phase Shift
If a phase shift is not required for slave devices, connect the
SCFG pin of each slave device to ground. For devices that
require a phase shifted version of the synchronization clock that
is applied to the SYNC pin of the slave devices, connect a
resistor (RSCFG) from SCFG to ground to program the desired
phase shift. To determine the RSCFG value for a desired phase
shift (φSHIFT), start by calculating the frequency of the slave clock
(fSLAVE).
When the voltage at the SCFG pin exceeds 4.53 V (or the pin is
floating and internally connected to VREG), the AD8452 operates
at the frequency set by RFREQ. The SYNC pin is configured as an
output, displaying a clock signal at the programmed frequency. In
this state, the clock voltage at the SYNC pin can be used as a
master clock for synchronized applications.
If VSCFG is ≤0.5 V, the SYNC pin is configured as an input, and
the AD8452 operates as a slave device. As a slave device, the
AD8452 synchronizes to the external clock applied to the SYNC
104
(6)
f
SLAVE (kHz) =
RFREQ (SLAVE)
pin. If the voltage applied to the SCFG pin is 0.65 V < VSCFG
<
4.25 V, and a resistor is connected between SCFG and ground,
the SYNC pin is configured as an input, and the AD8452
synchronizes to a phase shifted version of the external clock
applied to the SYNC pin.
Next, calculate the period of the slave clock.
1
×103
(7)
tSLAVE (µs) =
fSLAVE (kHz)
Whether operating the AD8452 as a master or as a slave device,
carefully select RFREQ using the equations in the following sections.
where:
SL AVE is the period of the slave clock in µs.
SL AVE is the frequency of the slave clock in kHz.
t
f
Select RFREQ for Standalone or Master Clock
Next, determine the phase time delay (tDELAY) for the desired
phase shift (φSHIFT) using the following equation:
Whether master or slave, the clock frequency can be selected
graphically or by applying Equation 4.
ϕSHIFT ×tSLAVE μs
( )
Figure 26 shows the relationship between the RFREQ (MASTER) value
and the programmed switching frequency. Simply identify the
desired clock frequency on Axis fSET, and read the
(8)
(9)
tSLAVE (µs) =
360
where:
DELAY is the phase time delay in µs.
φSHIFT is the desired phase shift.
Lastly, use the following equation to calculate tDELAY
SCFG (kΩ) = 0.45 × RFREQ (SLAVE) (kΩ) + 50 × tDELAY (µs)
where:
SCFG is the corresponding resistor for the desired phase shift in
corresponding resistor value on Axis RFREQ (MASTER)
.
t
To calculate the RFREQ (MASTER) value for a desired master clock
synchronization frequency, use the following equation:
:
104
SET (kHz)
R
(4)
RFREQ (MASTER) kΩ =
( )
f
R
where RFREQ (MASTER) is the resistor in kΩ to set the frequency for
the master device, and fSET is the switching frequency in kHz.
kHz. See Figure 27 for the RSCFG vs. tDELAY graph.
When using the phase shift feature, connect a capacitor of 47 pF
Selecting RFREQ for a Slave Device
or greater in parallel with RSCFG
.
To configure the AD8452 as a slave device, drive VSCFG < 4.53 V,
and the device operates at the frequency of an external clock
applied to the SYNC pin. To ensure proper synchronization,
select RFREQ to set the frequency to a value slightly slower than
that of the master clock by using the following equation:
Alternatively, the SCFG pin can be controlled with a voltage source
but if an independent voltage source is used, ensure VSCFG ≤ VREG
under all conditions. When the AD8452 is disabled via UVLO,
VREG = 0 V, and the voltage source must be adjusted accordingly
to ensure VSCFG ≤ VREG.
R
FREQ (SLAVE) = 1.11 × RFREQ (MASTER)
(5)
where RFREQ (SLAVE) is the resistor value that appropriately scales
the frequency for the slave device, 1.11 is the RFREQ slave to
master ratio for synchronization and RFREQ (MASTER) is the resistor
value of the master clock applied to the SYNC pin.
The frequency of the slave device is set to a frequency slightly
lower than that of the master device to allow the digital
synchronization loop of the AD8452 to synchronize to the
Rev. 0 | Page 31 of 34
AD8452
Data Sheet
Table 10. Summary of Synchronization Options of the AD8452
SYNC Pin Input/Output State
and Delay Options
DC Control Bias Applied to the SCFG
Pin (V)
Input/
Output
Delay
Master/Slave Sync
Slave
0 to 0.50
0.65 to 4.25
4.53 to 5
Input
No delay
Input
0 μs to 7.5 μs delay (see Figure 27)
No delay
Slave
Output
Master
Figure 51 shows the internal voltage ramp of the AD8452. The
voltage ramp is a well controlled 4 V p-p.
PROGRAMMING THE MAXIMUM DUTY CYCLE
The AD8452 is designed with a 97% (typical) maximum
internal duty cycle. By connecting a resistor from DMAX to
ground, the maximum duty cycle can be programmed at any
value from 0% to 97% by using the following equation:
T
4.5V
4V p-p
21.5×VFREQ ×RDMAX
(13)
DMAX
(%
)
=
− 10.5
RFREQ
0.5V
0V
where:
0.03T
D
V
MAX is the programmed maximum duty cycle.
FREQ = 1.252 V (typical).
0.97T
Figure 51. Internal Voltage Ramp
Programming the Dead Time
R
DMAX is the value of the resistance used to program the
maximum duty cycle.
FREQ is the frequency set resistor used in the application.
R
To adjust the dead time on the synchronous DH and DL
outputs, connect a resistor (RDT) from DT to DGND and bypass
with a 47 pF capacitor. Select RDT for a given dead time using
Figure 28 or calculate RDT using the following equations. To
create a single equation for RDT, combine the equations for VDT
and RDT.
The DMAX current source is equivalent to the programmed
current of the FREQ pin:
VFREQ
RFREQ
(14)
IDMAX = IFREQ
=
where IDMAX = IFREQ, the current programmed on the
FREQ pin.
IDT ×(tDEAD (ns) −10.00)
450
VDT (V) =
(10)
(11)
T
= +25°C
A
3.76
400
350
300
250
200
150
100
50
MAXIMUM
VDT
RESISTOR VALUE
(APPROX 400kΩ)
RDT
=
IDT
where:
DT is the DT pin programming voltage.
DT is the 20 µA (typical) internal current source.
DEAD is the desired dead time in ns.
DT is the resistor value in kΩ for the desired dead time.
To calculate RDT for a given tDEAD, the resulting equation used is
MAXIMUM
DUTY CYCLE
97%
V
I
t
R
t
DEAD (ns) −10.00
0
RDT (kΩ) =
(12)
0
20
40
60
80
100
3.76
DUTY CYCLE (%)
Figure 52. RDMAX vs. Duty Cycle, RFREQ = 100 kΩ, VINT = 5 V
The default maximum duty cycle of the AD8452 is 97%
(typical) even if the value of RDMAX indicates a larger percentage.
If a 97% internal maximum duty cycle is sufficient for the
application, the DMAX pin may be pulled to VREG or left
floating.
The CDMAX capacitor connected from the DMAX pin to the
ground plane must be 47 pF or greater.
Rev. 0 | Page 32 of 34
Data Sheet
AD8452
SELECTING CSS
ADDITIONAL INFORMATION
There are instances where it is useful to adjust the soft start
delay to fit specific applications, for example, to accommodate
charge or discharge battery characteristics, and the state of
charge. The soft start delay is user adjustable by selecting the
value of Capacitor CSS.
The following reference materials provide additional insight
and practical information that supplement the data sheet
material contained herein:
AN-1319 Application Note, Compensator Design for a
Battery Charge/Discharge Unit Using the AD8450 or the
AD8451.
When the EN pin goes high, and with a capacitor connected to
the SS pin, a 5 μA current source, ISS, becomes active and begins
charging CSS, initiating a timing ramp determined by the
following equation:
AD8452-EVALZ (UG-1180), Universal Evaluation Board for
the AD8452. The AD8452-EVALZ has an embedded
AD8452 with reference and test loops and is designed for
product evaluation and experimenters.
I = C dV/dt
AD8452 System Demo User Guide (UG-1181), AD8452
Battery Testing and Formation Evaluation Board. This user
guide features plug and play complete on one channel and
a working system, including PC control.
In the limit, dV = 5 V and, because the applied current is 5 ꢀA,
CSS can be calculated for any desired time by transposing the
terms of the equation. Therefore,
CSS = I(dt/dV)
For a 1 sec delay, CSS = 5 e – 6(1/5) or 1 ꢀF, a 0.5 sec delay
requires 0.5 ꢀF, and so on.
Rev. 0 | Page 33 of 34
AD8452
Data Sheet
OUTLINE DIMENSIONS
9.20
9.00 SQ
8.80
0.75
0.60
0.45
1.60
MAX
37
48
36
1
PIN 1
7.20
TOP VIEW
(PINS DOWN)
7.00 SQ
6.80
1.45
1.40
1.35
0.20
0.09
7°
3.5°
0°
25
12
0.15
0.05
13
24
SEATING
PLANE
0.08
0.27
0.22
0.17
VIEW A
0.50
BSC
LEAD PITCH
COPLANARITY
VIEW A
ROTATED 90° CCW
COMPLIANT TO JEDEC STANDARDS MS-026-BBC
Figure 53. 48-Lead Low Profile Quad Flat Package [LQFP]
(ST-48)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
AD8452ASTZ
AD8452ASTZ-RL
AD8452-EVALZ
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
Package Option
48-Lead Low Profile Quad Flat Package [LQFP]
48-Lead Low Profile Quad Flat Package [LQFP]
Evaluation Board
ST-48
ST-48
1 Z = RoHS Compliant Part.
©2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D16187-0-10/17(0)
Rev. 0 | Page 34 of 34
相关型号：
AD8452ASTZ
Precision Integrated Analog Front End, Controller, and PWM for Battery Test and Formation Systems
ADI
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